Printing glass adapter plate RDL and metalized TGV integrated manufacturing method

Abstract

The invention relates to the field of three-dimensional packaging, and discloses a printing glass adapter plate RDL and metalized TGV integrated manufacturing method, which adopts a single-plate electrode electric field to drive a multi-nozzle spray deposition micro-nano 3D printing technology, and performs 3D printing according to optimized printing process parameters and a set printing path. And carrying out high-efficiency defect-free metallization on the high-aspect-ratio glass through hole and printing a conductive mask pattern on the metal layer on the surface of the glass adapter plate. The seed layer which is rapidly formed and precisely electroplated through etching is adopted, and efficient and low-cost batch manufacturing of the glass adapter plate RDL is achieved.

Description

Technical Field

[0001] The present application belongs to the field of three-dimensional packaging, and relates to glass transfer plates and micro-nano additive manufacturing, and in particular to an integrated manufacturing method of a glass transfer plate RDL (Redistribution Layer) and a metallized TGV (Through Glass Via) based on a single flat electrode electric field driven jet micro-nano 3D printed glass transfer plate. Background Art

[0002] With the advent of the 5G era, the packaging technology of electronic devices is being driven from traditional 2D packaging to 2.5D or even 3D, which puts higher requirements on the performance of electronic devices. Three-dimensional (3D) integrated circuits and interconnected stacked 2.5-dimensional (2.5D) integrated circuits are considered by the industry to be one of the most promising technologies to overcome the limitations of Moore's Law and exceed Moore's Law due to their advantages such as low power consumption, good performance and high functional density.

[0003] Driven by the demand for high computing power and high bandwidth, the substrate of integrated circuits obviously needs to develop towards higher density, larger size, and higher performance. In particular, the huge demand for application scenarios such as artificial intelligence and high-performance computing has promoted the rapid development of related technologies such as core particles and advanced packaging. The interconnection between more core particles and larger chips have greatly increased the requirements for high-performance and large-scale interconnection. However, the density and large-size reliability of the current substrate cannot meet the needs of such applications.

[0004] Glass transfer plates are an optimal solution to the above problems. They can significantly increase the vertical interconnection density and, thanks to their excellent flatness, thermal and mechanical stability, can achieve thinner, higher density and more reliable substrates. Through TGV technology, glass transfer plates can achieve more dense vertical interconnection through holes.

[0005] Compared with silicon adapters and organic adapters, glass adapters have the following outstanding advantages:

[0006] 1) High flatness and low roughness: The glass transfer plate has high surface flatness and low roughness, providing an ideal platform for the manufacture of micro-sized semiconductor devices. The spacing between the openings of the glass transfer plate is less than 100 microns, far exceeding that of the organic panel, which greatly increases the interconnection density between chips.

[0007] 2) Thermal stability and low coefficient of thermal expansion (CTE): The glass adapter plate has strong thermal stability and can maintain stable performance in high temperature environments. Its thermal expansion coefficient is close to that of silicon, which helps to reduce stress problems caused by thermal mismatch during the packaging process and effectively solves the problem of stacking distortion of the substrate.

[0008] 3) High dielectric constant and low dielectric loss: Glass material is an insulating material with a dielectric constant of only about 1 / 3 of that of silicon material, and a loss factor 2 to 3 orders of magnitude lower than that of silicon material, which greatly reduces substrate loss and parasitic effects, and can effectively improve the integrity of the transmission signal.

[0009] 4) Chemical stability and corrosion resistance: The glass transfer board has excellent chemical stability and can effectively resist environmental corrosion such as moisture, acid and alkali, ensuring the long-term stability of the components in the package.

[0010] 5) High transparency and optical properties: For packaging applications that require transparent windows or involve optical communications, the high transparency and excellent optical properties (such as adjustable refractive index) of glass adapter plates have unique advantages.

[0011] 6) Environmental protection and long-term reliability: Glass transfer plates usually do not contain organic volatiles and are more environmentally friendly. Their stable physical and chemical properties give the packaged products excellent long-term reliability.

[0012] 7) Low cost: The production cost of glass adapter plates is lower due to the easy availability of large-size ultra-thin panel glass and the lack of the need to deposit an insulating layer.

[0013] The interconnection formed by the metallized TGV and RDL (redistribution layer) of the glass adapter can realize direct transmission and signal coupling between layers to improve transmission efficiency. Through-Glass-Via (TGV) interconnection technology has the advantages of excellent high-frequency electrical characteristics, low cost, simple process flow, strong mechanical stability, etc. It has broad application prospects in the fields of RF devices, micro-electromechanical system (MEMS) packaging, optoelectronic system integration, etc.

[0014] TGV microporous metallization is one of the most important process steps in the manufacture of glass adapter plates. Currently, TGV metallization based on electroplated copper still has the following problems and challenges:

[0015] (1) Filling defects make it difficult to achieve defect-free high-quality metal filling. (2) Filling efficiency is low, especially for larger micropores and micropores with high aspect ratios. (3) Poor bonding strength. (4) There is internal stress.

[0016] Moreover, in order to realize the high-precision and high-density glass transfer board RDL manufacturing, the current manufacturing process still has obvious shortcomings. For example, the use of laser ablation technology can realize high-density circuit production, but it will produce thermal effects on the edges of the ablation, the formed lines are irregular (poor edge roughness), and the efficiency is low and the cost is high, making it difficult to achieve large-scale production. The femtosecond laser can realize the manufacturing of line widths and spacings below 20μm, but it will cause problems with the surface flatness of the grooves obtained by ablation. Screen printing is difficult to realize the manufacturing of high-density circuits with a line width of 50μm and a spacing of 50μm due to its low precision; the 20μm line width and 20μm spacing lines printed by inkjet printing can realize the manufacturing of high-density flexible circuit boards, but the line edge roughness is poor; although aerosol jetting can realize the manufacturing of high-precision flexible circuits with a line width of 10μm, the line edge roughness is poor, there are more satellite droplets, and it is difficult to realize the manufacturing of high-density flexible circuit boards. And because the glass transfer board RDL adhesion, electrical performance consistency and other issues have yet to be solved, the yield problem is still a challenge facing the industry.

[0017] Therefore, the various existing technologies are still unable to simultaneously meet the requirements of defect-free high aspect ratio glass through hole metallization of glass transfer plates; high-precision, high-density, excellent impact resistance, stability and reliability RDL manufacturing; effective and reliable connection between metallized TGV and RDL with controllable size and shape of connection points, etc., and new technologies and solutions are urgently needed to be developed.

[0018] The above information disclosed in the background technology is only used to increase the understanding of the background technology of the present application, and therefore, it may include information that does not constitute the prior art known to ordinary technicians in the field. Summary of the invention

[0019] In order to overcome the limitations and shortcomings of the above-mentioned prior art in achieving (1) defect-free high aspect ratio glass through hole metallization of glass transfer plate; (2) RDL manufacturing with high precision, high density, excellent impact resistance, stability, reliability and strong adhesion to the glass transfer plate; (3) effective and reliable connection between metallized TGV and RDL with controllable size and shape of connection points; (4) green, low-cost, high-efficiency, high-yield and batch manufacturing of glass transfer plate, the present application discloses a method for integrated manufacturing of glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing.

[0020] The single-plate electrode electric field-driven multi-nozzle jet deposition micro-nano 3D printing technology is used to perform efficient and defect-free metallization of high-aspect-ratio glass through holes and printing of conductive mask patterns on the metal layer on the surface of the glass transfer plate according to the optimized printing process parameters and the set printing path. The seed layer of precision electroplating is formed by wet etching to achieve efficient and low-cost batch manufacturing of glass transfer plate RDL.

[0021] In addition, the present application adopts an array of multi-nozzles, which can realize efficient filling of multiple micropores in parallel and efficient printing of mask patterns on the metal layers on the surfaces of multiple glass adapter plates.

[0022] The method disclosed in the present invention can achieve defect-free metallization of high aspect ratio glass through holes, and has the outstanding advantages of low production cost, high efficiency, short process, good flexibility and strong adaptability; it can also achieve high-resolution and high-efficiency printing of glass transfer board RDL, and has the outstanding advantages of high production efficiency, high precision and good consistency.

[0023] In order to achieve the above invention objectives, this application adopts the following technical solutions:

[0024] A method for integrated manufacturing of a printed glass transfer plate RDL and a metallized TGV, comprising the following steps:

[0025] Step 1: pre-treating the glass substrate, cleaning the glass substrate to remove surface impurities, and drying the cleaned glass substrate;

[0026] Step 2: Micro-hole forming: using TGV hole forming technology, punch holes on the pre-treated glass substrate according to the design requirements. After the punching is completed, the glass substrate is cleaned and dried;

[0027] Step 3: Microporous 3D printing metal filling, specifically:

[0028] (1) placing the punched glass substrate on a fixture and clamping it;

[0029] (2) placing the fixture on the workbench of a single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device;

[0030] (3) Using the CCD machine vision positioning module of the micro-nano 3D printing device, the printing nozzle is moved to the marking point of the glass substrate;

[0031] (4) evacuating the printing chamber, specifically: evacuating the entire printing chamber to a set vacuum degree to ensure that there is no residual air in the micropores;

[0032] (5) starting from the bottom of the micropores, continuously spray-deposit the filling metal material according to the set printing process parameters, printing mode and printing path to achieve complete filling of the micropores without defects;

[0033] (6) After the first micropore or the first group of micropores are filled, the operation of (5) is repeated to complete the printing of all micropores according to the pre-designed printing path;

[0034] (7) The print head returns to the initial printing position, and the vacuum environment in the printing chamber is broken;

[0035] Step 4: Filling metal for conductivity, specifically: placing the glass substrate after the microporous metal filling in a vacuum sintering furnace, setting the sintering time, temperature and sintering curve for sintering; carrying out filling effect evaluation, if the filling effect meets the requirements, the glass substrate through-hole filling is completed; if not, repeating steps 3 and 4 to fill the filled micropores twice or multiple times, and finally achieving the expected filling effect;

[0036] Step 5: Printing a mask on the surface of the metallized through-holes, using a multi-nozzle single-plate electrode electric field driven melt jet deposition micro-nano 3D printing technology to print masks on the surfaces of all metallized through-holes on one side of the glass substrate, and then printing masks on the surfaces of all metallized through-holes on the other side of the substrate; the mask does not completely cover the through-holes, and printing of masks of different sizes and shapes can be achieved by adjusting the printing parameters;

[0037] Step 6: Metallizing the surface of the glass substrate; pre-treating the surface of the glass substrate, and depositing a metal film of uniform thickness on both the upper and lower surfaces of the pre-treated glass substrate;

[0038] Step 7: Print a conductive pattern to manufacture a mask; use a multi-nozzle single-plate electrode electric field-driven melt jet deposition micro-nano 3D printing technology to print the corresponding required mask pattern on one side of a glass substrate with a metal coating on the surface, and then print the corresponding required mask pattern on the other side; by adjusting the printing parameters, printing of mask patterns of different line types and sizes can be achieved.

[0039] Step 8: etching the metal layer on the surface of the glass substrate, using the pattern printed in step 7 as a mask, etching the surface metal layer using an etching process, and transferring and copying the mask pattern to the surface metal layer;

[0040] Step 9: removing the mask; soaking the mask with a stripper to remove the mask; then cleaning and drying the glass substrate after etching the surface metal layer to obtain a double-sided metal layer conductive pattern;

[0041] Step 10: depositing a metal layer; using the conductive pattern of the surface metal layer as a seed layer, continuing to deposit metal material;

[0042] Step 11: Post-processing: After the metal material is deposited, the product of step 10 is cleaned to remove the residual plating solution and excess impurities, and dried to obtain a metallized TGV and double-sided RDL integrated glass adapter board.

[0043] In some embodiments of the present application, the micropore forming in step 2 includes but is not limited to the following technologies: laser etching, laser induced denaturation, sandblasting, mechanical drilling, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive glass, laser induced deep etching, focused discharge pore formation, etc.

[0044] In some embodiments of the present application, the micropore forming in step 2 is performed by laser induced denaturation.

[0045] In some embodiments of the present application, the step 3 micro-nano 3D printing includes electric field driven jet deposition micro-nano 3D printing technology and equipment.

[0046] In some embodiments of the present application, the step 3 micro-nano 3D printing is a single flat electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing technology and equipment.

[0047] In some embodiments of the present application, the metal ink of the printing material in step 3 includes but is not limited to the following materials: high solid content nanometal (gold, silver, copper) conductive paste, nanometal particle size 10nm-1μm, solid content 85-98wt.%.

[0048] In some embodiments of the present application, the printing process parameters of step 3 are: printing voltage 300-2000V; printing speed 0.1-20mm / s; printing air pressure 0.1-300kPa: printing nozzle size: 1-100μm.

[0049] In some embodiments of the present application, the printing mode of step 3 includes but is not limited to the following modes: spiral lifting printing mode; stacking lifting printing mode; Z-direction vertical lifting printing mode.

[0050] In some embodiments of the present application, for micropores below 20 μm, a Z-direction vertical lifting printing mode is adopted.

[0051] In some embodiments of the present application, for circular micropores or irregular shaped holes with a size greater than 20 μm, a spiral or stacked lifting printing mode is adopted.

[0052] In some embodiments of the present application, the step 3 printing device includes a plurality of printing heads (array heads), and the nozzles of the printing heads are all at the same height (Z direction); the spacing between the nozzles is consistent with the spacing between the glass substrates in the fixture.

[0053] In some embodiments of the present application, the fixture in step 3 can place a plurality of glass substrates in a linear array, and the number of glass substrates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

[0054] In some embodiments of the present application, the printing path of step 3: when setting the printing path, the array nozzle should be taken as a unit, and the glass substrate on the fixture should be divided into several unit printing areas. After filling each unit area of ​​the glass substrate, move to the next unit printing area, and complete the filling of all glass substrates in sequence; the filling of the micropores is planned based on the corresponding relationship between a single nozzle and a single glass substrate.

[0055] In some embodiments of the present application, the sintering temperature of step 4 is 50-300° C., and the sintering time is 20 minutes to 100 minutes.

[0056] In some embodiments of the present application, the mask in step 5 covers 10%-90% of the surface area of ​​the metallized through hole.

[0057] In some embodiments of the present application, the metal coating on the surface of the glass substrate in step 6 includes but is not limited to the following highly conductive metal materials: copper, silver, nickel, and gold.

[0058] In some embodiments of the present application, the metal coating process in step 6 includes but is not limited to the following technologies: physical vapor deposition, magnetron sputtering, chemical plating, and electroplating.

[0059] In some embodiments of the present application, the thickness of the coating metal film in step 6 is 10 nm-10 μm.

[0060] In some embodiments of the present application, the molten micro-nano 3D printing in step 7 includes but is not limited to the following technologies and equipment: single flat electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing technology and equipment, electric field driven jet deposition micro-nano 3D printing technology and equipment. Single flat electrode electric field driven multi-nozzle molten jet deposition micro-nano 3D printing technology and equipment are preferred.

[0061] In some embodiments of the present application, the mask printing material of step 7 includes but is not limited to the following materials: polycaprolactone (PCL), polylactic acid (PLA), and photosensitive resin.

[0062] In some embodiments of the present application, the printing process parameters of step 7 are: printing voltage 100-5000V; printing speed 0.01-500mm / s; printing air pressure 0.01-1000kPa; printing nozzle size 1-1000μm; distance between the printing nozzle and the glass substrate 1-1000μm.

[0063] In some embodiments of the present application, the step 7 printing device includes a plurality of printing heads (array nozzles) and a barrel, and the nozzles of the printing heads are at the same height (Z direction); the spacing between the nozzles is consistent with the spacing between the glass substrates in the fixture.

[0064] In some embodiments of the present application, the mask printing nozzle and the barrel of step 7 have normal temperature and heating functions, and can adapt to various printing mask materials. The heating temperature of the printing nozzle and the barrel is 0-350°C.

[0065] In some embodiments of the present application, the fixture in step 7 may place a plurality of glass substrates in a linear array, and the number of glass substrates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

[0066] In some embodiments of the present application, the mask pattern printing path planning in step 7 is as follows: the conductive patterns on the upper and lower surfaces of the glass transfer plate are designed according to requirements, the corresponding codes are generated by data processing software and imported into the printing equipment, and different printing process parameters are used to realize the printing of different line widths and heights of the mask pattern.

[0067] In some embodiments of the present application, step 7 can control the amount of printing material according to the set process parameters and procedures, adjust the coverage of the mask pattern circuit terminal above the metallized TGV, and thus adjust the size of the connection point between the metallized TGV and the surface conductive pattern, so that the connection between the surface conductive pattern and the metallized TGV is more reliable.

[0068] In some embodiments of the present application, the line width of the printing mask in step 7 is 1-500 μm.

[0069] In some embodiments of the present application, the printing path of step 7: when setting the printing path, the array nozzle should be taken as a unit, and the glass substrate on the fixture should be divided into a number of unit printing areas. After printing the mask pattern of each unit area, move to the next unit printing area, and complete the mask pattern printing of all glass substrates in sequence; the mask pattern printing is planned based on the correspondence between a single nozzle and a single glass substrate.

[0070] In some embodiments of the present application, the etching process of step 8 includes but is not limited to dry etching processes such as physical etching, chemical etching, and physicochemical etching, and wet etching processes such as dissolution etching and oxidation-reduction etching.

[0071] In some embodiments of the present application, the metal layer deposition technology in step 10 includes but is not limited to precision electroplating and chemical plating processes; the deposited metals include but are not limited to copper, silver, nickel, and gold.

[0072] Compared with the prior art, this application has at least the following beneficial effects:

[0073] (1) The integrated manufacturing method of glass interposer RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application is a disruptive glass interposer manufacturing technology. It has very broad application prospects in the fields of radio frequency devices, micro-electromechanical system (MEMS) packaging, optoelectronic system integration, etc.

[0074] (2) The present application provides an integrated manufacturing method for glass adapter plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing, which uses high solid content micro-nano silver paste (or nano conductive silver paste) as the metal filling material for glass through-holes, and has good conductivity after sintering. It is combined with single flat electrode electric field driven jet deposition micro-nano 3D printing to achieve defect-free metal filling of high aspect ratio glass through-holes, especially in ultra-large high aspect ratio glass through-holes and small aperture glass through-holes. Theoretically, there is no limit. As long as the length and inner diameter of the manufactured printing needle meet the printing requirements, the present application can achieve microporous metal filling with a high aspect ratio of more than 50:1. It solves the problem of defect-free metal filling of ultra-large high aspect ratio glass through-holes that cannot be achieved by the prior art.

[0075] (3) The integrated manufacturing method of RDL and metallized TGV based on electric field driven jet micro-nano 3D printing of glass transfer board provided in this application has unique advantages in realizing the metallization of glass through holes with different diameters and high aspect ratios, the metallization of special-shaped holes and the manufacturing of highly complex RDL conductive patterns on the same glass transfer board.

[0076] (4) The integrated manufacturing method of glass adapter plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in the present application can adjust the coverage of the mask circuit terminal above the metallized TGV according to needs, thereby adjusting the size and shape of the connection point between the metallized TGV and the surface conductive pattern, making the connection between the surface conductive pattern and the metallized TGV more reliable.

[0077] (5) The integrated manufacturing method of glass adapter plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application can realize high-precision glass through-hole filling and mask printing. The error compensation of the printing nozzle is realized by relying on the X-direction vision module and the Y-direction vision module; the precise positioning of the glass substrate and the fixture is realized by relying on the Z-direction vision positioning module installed at the nozzle.

[0078] (6) The integrated manufacturing method of glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application can use different printing modes according to the size of the micro-holes to be filled: spiral lifting printing mode and vertical lifting printing mode, which can achieve defect-free and rapid filling of micro-holes with large aperture differences on the same glass transfer plate. It can be used for both high aspect ratio through holes and high aspect ratio blind holes.

[0079] (7) The present application provides an integrated manufacturing method for glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing, wherein the solid content of the glass through hole filled with metal ink is 85-93wt.%. The solid content is very high, and the sintering has good conductivity. In particular, due to the high solid content, the shrinkage rate after sintering is small, and there are no defects such as pores, and the residual stress is small.

[0080] (8) The integrated manufacturing method of glass transfer board RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application can realize key steps such as through-hole metallization and glass transfer board surface circuit structure production through electric field driven jet deposition micro-nano 3D printing technology. The same printing equipment can be used to achieve through-hole filling and surface circuit structure printing by simply replacing the print head. It requires less equipment, has high production flexibility, and has the advantages of less production investment and highly integrated production.

[0081] (9) The integrated manufacturing method of glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application, combined with the use of array multi-nozzles and fixtures to place multiple glass transfer plates, can achieve parallel efficient filling of micropores and efficient printing of high-resolution masks, with high production efficiency, simple process, short process flow and short manufacturing time.

[0082] (10) The present application provides an integrated manufacturing method for glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing. The conductive pattern of the metal layer on the surface of the glass transfer plate is obtained by etching. By continuing to deposit the metal layer (conductive metals such as copper, nickel, and silver), the conductive pattern produced has high resolution, which can realize fine conductive circuits while having high electrical performance.

[0083] (11) The present application provides an integrated manufacturing method for glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing, in which key steps such as glass through hole metallization and mask manufacturing with conductive patterns are all manufactured by additive manufacturing, thus avoiding the generation of large amounts of waste materials and waste liquids. Compared with other methods for glass through hole metallization and mask manufacturing with conductive patterns, this method reduces costs and is more environmentally friendly.

[0084] (12) The present application provides an integrated manufacturing method for the glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing. The metal material and the glass have good adhesion strength, especially when the metal slurry containing glass powder is used. The metal filled in the glass through hole can be integrated with the glass transfer plate, and due to the precision electroplating layer, the RDL and the glass transfer plate have strong adhesion. It has excellent impact resistance, stability and reliability, and can be used in extreme environments such as high vibration, high and low temperature. For example, in the fields of space, aerospace, hypersonic missiles, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0085] The drawings in the specification, which constitute a part of the present application, are used to provide further understanding of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute improper limitations on the present application.

[0086] Figure 1 A schematic diagram of the integrated manufacturing method of glass transfer plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application.

[0087] Figure 2 Schematic diagram of the glass substrate clamp provided in this application.

[0088] Figure 3 Schematic diagram of the micro-nano 3D printing working device provided in this application based on a single flat electrode electric field driven multi-nozzle jet deposition.

[0089] Figure 4 A schematic diagram of the path for the nozzle provided in this application to perform metallization filling (printing mode) on a through-glass hole.

[0090] Figure 5 Schematic diagram of the glass transfer plate RDL manufacturing process flow provided in this application.

[0091] Figure 6 Schematic diagram of the integrated manufacturing results of the glass adapter plate RDL and metallized TGV based on electric field driven jet micro-nano 3D printing provided in this application. DETAILED DESCRIPTION

[0092] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings and specific implementation methods. However, those skilled in the art will understand that the embodiments described below are part of the embodiments of the present application, rather than all of the embodiments, and are only used to illustrate the present application and should not be regarded as limiting the scope of the present application.

[0093] It should be noted that the following detailed descriptions are illustrative and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0094] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "back", "inside", "outside", etc. indicate directions or positional relationships based on the directions or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on this application. Unless otherwise specified, the above-mentioned directional description can be flexibly set in the process of actual application under the condition that the relative positional relationship shown in the accompanying drawings is met.

[0095] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0096] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "connected" should be understood in a broad sense, such as fixed connection, detachable connection, and integral connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the electrical connection between two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0097] In the present application, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the process, article or device including the element.

[0098] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0099] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. If the specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. If the manufacturer of the reagents or instruments is not specified, they are all conventional products that can be purchased commercially.

[0100] In some embodiments of the present application, the present application provides a method for integrated manufacturing of a glass transfer plate RDL and a metallized TGV based on electric field driven jet micro-nano 3D printing. Figure 1 shown.

[0101] Step 1: Glass substrate pretreatment.

[0102] Step 2: Micropore forming.

[0103] Step 3: Metal filling of micropores by 3D printing. (1) Place the punched glass substrates one by one on the fixture (the maximum number of glass substrates placed is an integer multiple of the number of nozzles) and clamp them; (2) Place the fixture on the workbench of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing device to move the print nozzle to the marked point of the glass substrate; (4) Vacuum the printing chamber. Perform vacuum treatment on the entire printing chamber. Reach the set vacuum degree to ensure that there is no residual air in the micropores; (5) According to the set printing process parameters (printing voltage, back pressure, printing speed, etc.), printing mode and printing path, start from the bottom of the micropores, continuously spray and deposit the filling metal material to achieve complete filling of the micropores without defects; (6) After completing the filling of the first (first group) micropores, repeat the operation of (5) and complete the printing of all micropores according to the pre-designed printing path; (7) The print nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken.

[0104] Step 4: Fill metal for conductivity.

[0105] Step 5: Metallization of the glass substrate surface: The surface of the glass substrate is pretreated, and a metal film with uniform thickness is deposited on both surfaces of the pretreated glass substrate.

[0106] Step 6: Printing a conductive pattern to make a mask. The multi-nozzle single-plate electrode electric field-driven melt jet deposition micro-nano 3D printing technology is used to print the corresponding required mask pattern on one side of the glass substrate with a metal coating on the surface, and then print the corresponding required mask pattern on the other side.

[0107] Step 7: Etching the metal layer on the surface of the glass substrate. Using the pattern printed in step 7 as a mask, an etching process is used to etch the surface metal layer, and the mask pattern is transferred and copied to the surface metal layer.

[0108] Step 8: Remove the mask.

[0109] Step 9: Deposit a metal layer. The surface metal layer is used as a seed layer, and metal materials are continuously deposited thereon.

[0110] Step 10: Post-processing: After the metal material is deposited, the product of step 9 is cleaned to remove the residual plating solution and excess impurities, and then dried to obtain a metallized TGV and double-sided RDL integrated glass transfer board.

[0111] In some embodiments of the present application, between step 4: filling metal for conductivity and step 5: glass substrate surface metallization, a step of printing a mask on the surface of the metallized through hole is also included.

[0112] In some embodiments of the present application, a method for integrated manufacturing of a glass transfer plate RDL and a metallized TGV based on electric field driven jetting micro-nano 3D printing includes the following contents:

[0113] The glass substrate size is 40×40×0.3 mm, the diameter of the microhole to be filled is 100 μm, the depth of the through hole is 300 μm (aspect ratio 3:1), and the through holes are distributed in a 9×9 array with a pitch of 250 μm.

[0114] Step 1: pre-treating the glass substrate, cleaning the glass substrate with acetone, alcohol and deionized water in ultrasonic wave for 5-15 minutes, and heating and drying the cleaned glass substrate.

[0115] Step 2: Micropore forming: Using laser-induced degeneration pore forming technology, the pre-treated glass substrate is punched according to the design requirements. After the drilling is completed, the glass substrate is cleaned and dried.

[0116] Step 3: Micropore 3D printing metal filling. (1) Place the punched glass substrates one by one on the fixture and clamp them firmly. Figure 2 (2) placing the fixture on the workbench of a multi-nozzle single-plate electrode electric field driven jet deposition micro-nano 3D printing device, as shown in FIG. Figure 3 As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing equipment, move the print head to the mark point of the glass substrate; (4) Evacuate the printing chamber. Evacuate the entire printing chamber. Set the vacuum degree to -20kPa to ensure that there is no residual air in the micropores; (5) Set the printing process parameters (printing voltage 1500V, back pressure 300kPa, printing speed 0.5mm / s), and the filling path adopts a spiral lifting method, as shown Figure 4As shown in (b), the pitch is 40 μm, the spiral diameter is 40 μm, and the nozzle diameter is 30 μm; starting from the bottom of the micropore, the filling metal material is continuously sprayed and deposited, and the micropores of a single glass substrate are completely filled without defects in one filling; (6) After the first glass substrate (the first unit area) is filled, the operation of (5) is repeated to complete the printing and filling of the micropores of all unit areas of the glass substrate according to the pre-designed printing path; (7) The print head returns to the initial printing position; and the vacuum environment of the printing forming chamber is broken.

[0117] Step 4: Filling metal for conductivity. The metal material filled in this embodiment is low-temperature sintering type silver paste. The glass substrate after the microporous metal filling is placed in a vacuum sintering furnace, and the heating condition is set to 150° C. for 40 minutes to complete the conductive treatment of the filled metal.

[0118] Step 5: Print a mask on the surface of the metallized through hole, covering 50% of the surface area of ​​the metallized through hole.

[0119] Steps 6-10 Figure 5 shown.

[0120] Step 6: Copper coating on the surface of the glass substrate. The surface of the glass substrate is pretreated, and a layer of uniform titanium metal film with a thickness of 100nm is first deposited on both surfaces of the pretreated glass substrate using magnetron sputtering technology (to improve the bonding strength between the glass substrate and the copper seed layer), and then a layer of uniform copper metal film with a thickness of 1μm is deposited.

[0121] Step 7: Print the conductive pattern using molten polycaprolactone (PCL) as a mask. (1) Place the copper-clad glass substrates one by one on the fixture and clamp them firmly. Figure 2 (2) placing the fixture on the workbench of a multi-nozzle single-plate electrode electric field driven melt jet deposition micro-nano 3D printing device, as shown in FIG. Figure 3As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing device, the print head is moved to the marking point of the glass substrate; (4) The printing chamber is evacuated. The entire printing chamber is evacuated. The vacuum degree is set to -20 kPa; (5) the printing process parameters are set (printing voltage 1800 V; printing speed 50 mm / s; printing air pressure 20 kPa; printing nozzle size 50 μm; the distance between the printing nozzle and the glass substrate is 10 μm, the heating temperature of the barrel is 90°C, and the heating temperature of the nozzle is 90°C), and the molten PCL with a molecular weight of 80,000 is used as the forming material of the mask pattern. The mask pattern is printed according to the set path, and the printed mask line width is 3-5 μm; (6) after completing the printing of the required mask pattern on one side of the copper-clad glass substrate, repeat the operation of (5) and complete the printing of the mask pattern on one side of all the glass substrates on the fixture according to the pre-designed printing path; (7) all the glass substrates on the fixture are turned over, and the operations of (5) and (6) are repeated according to the path set for the required mask pattern on the other side to complete the printing of the double-sided mask pattern of the glass substrate; (8) the printing nozzle returns to the initial printing position; and the vacuum environment of the printing forming chamber is broken.

[0122] Step 8: Etching of the copper-clad glass substrate on the surface. Using the molten PCL pattern printed in step 7 as a mask, select a reusable acidic ferric chloride solution and heat it to a constant temperature of 50°C to immerse and etch the copper-clad glass substrate on the surface. The etching time is 15s, and then quickly switch to deionized water spray for 10s, followed by nitrogen blow-drying; the copper foil not covered by PCL is completely etched away, leaving a copper conductive layer pattern with precise line width and line type, and a common detitanium solution on the market is selected to immerse and etch the titanium layer at room temperature. The etching time is 5s, and the deionized water spray is quickly switched for 10s, followed by nitrogen blow-drying and placing it in a vacuum drying oven at 135°C for drying. The titanium foil not covered by PCL and copper is completely etched away, leaving a copper-titanium conductive pattern with precise line width and line type.

[0123] Step 9: Remove PCL. Soak in anhydrous ethanol for 5 minutes to remove PCL; then use deionized water to ultrasonically clean and dry the etched copper-clad glass substrate to obtain a double-sided metal layer conductive pattern.

[0124] Step 10: Deposit the Metal Layer

[0125] The conductive pattern of the etched surface metal layer is used as a seed layer, and a layer of nickel is deposited on the seed layer by an electroplating process to form a copper-nickel composite electrode structure. The specific operation process is as follows: the metal conductive pattern obtained in step 9 is connected to the cathode of the precision micro-electroplating equipment, and the nickel metal plate is used as the anode and placed in the electroplating solution; an anode activator is added to the electroplating solution to improve the solubility of the anode, increase the conductivity, and improve the dispersion ability of the solution; an anti-pinhole agent is added to reduce the surface tension of the solution, so that hydrogen bubbles are not easy to stay on the cathode surface, thereby preventing the formation of pinholes.

[0126] The electroplating equipment is turned on. In order to reduce the surface roughness, a current density of 0.1A / m2-2A / m2 is preferably used. The temperature of the electroplating solution is always controlled within the range of 45-55°C by a constant temperature system; a circulating pump is used to flush the solution to stir the plating solution, and the flushing speed is 1m / s-2m / s; and an ultrasonic generator is used to quickly discharge the bubbles attached to the electrode surface during the processing, which also reduces concentration polarization and improves the flow field characteristics.

[0127] Step 11: Post-processing

[0128] After the metal material is deposited, the product of step 10 is ultrasonically cleaned with deionized water to remove the residual plating solution and excess impurities, and then dried with nitrogen to obtain a metallized TGV and double-sided RDL integrated glass adapter board. Figure 6 shown.

[0129] In some embodiments of the present application, a method for integrated manufacturing of a glass transfer plate RDL and a metallized TGV based on electric field driven jetting micro-nano 3D printing includes the following contents:

[0130] The glass substrate size is 20×20×0.2mm, the microholes to be filled are through holes with a diameter of 10μm and a depth of 200μm (aspect ratio of 20:1), and multiple through holes are distributed in an array on the surface of the glass substrate, with one unit distributed equidistantly at 5×5 on the glass substrate.

[0131] Step 1: pre-treating the glass substrate, cleaning the glass substrate with acetone, alcohol and deionized water in ultrasonic wave for 10 minutes, and heating and drying the cleaned glass substrate.

[0132] Step 2: Micropore forming: Using laser-induced degeneration pore forming technology, the pre-treated glass substrate is punched according to the design requirements. After the drilling is completed, the glass substrate is cleaned and dried.

[0133] Step 3: Micropore 3D printing metal filling. (1) Place the punched glass substrates one by one on the fixture and clamp them firmly. Figure 2(2) placing the fixture on the workbench of a multi-nozzle single-plate electrode electric field driven jet deposition micro-nano 3D printing device, as shown in FIG. Figure 3 As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing equipment, move the print head to the mark point of the glass substrate; (4) Evacuate the printing chamber. Evacuate the entire printing chamber. Set the vacuum degree to -20kPa to ensure that there is no residual air in the micropores; (5) Set the printing process parameters (printing voltage 1700V, back pressure 200kPa, printing speed 0.1mm / s), and the filling path adopts a vertical lifting method, as shown Figure 4 As shown in (a), the nozzle diameter is 5 μm; starting from the bottom of the micropore, the filling metal material is continuously sprayed and deposited, and the micropores of a single glass substrate are completely filled without defects in one filling; (6) After the micropores of the first glass substrate (the first unit area) are filled, the operation of (5) is repeated to complete the printing and filling of the micropores of all unit areas of the glass substrate according to the pre-designed printing path; (7) The print head returns to the initial printing position; and the vacuum environment of the printing forming chamber is broken.

[0134] Step 4: Conductive filling metal. The metal material filled in this embodiment is low-temperature sintering silver paste. The glass substrate after the microporous metal filling is placed in a vacuum sintering furnace and the heating condition is set to 150° C. for 50 minutes to complete the conductive treatment of the filled metal.

[0135] Step 5: Print a mask on the surface of the metallized through hole, covering 70% of the surface area of ​​the metallized through hole.

[0136] Steps 6-10 Figure 5 shown.

[0137] Step 6: Copper coating on the surface of the glass substrate. The surface of the glass substrate is pretreated. On both surfaces of the pretreated glass substrate, a layer of titanium metal film with a uniform thickness of 100nm is first deposited using magnetron sputtering technology (to improve the bonding strength between the glass substrate and the copper seed layer), and then a layer of copper metal film with a uniform thickness of 900μm is deposited.

[0138] Step 7: Print the conductive pattern using molten polycaprolactone (PCL) as a mask. (1) Place the copper-clad glass substrates one by one on the fixture and clamp them firmly. Figure 2 (2) placing the fixture on the workbench of a multi-nozzle single-plate electrode electric field driven melt jet deposition micro-nano 3D printing device, as shown in FIG. Figure 3As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing device, the print head is moved to the marking point of the glass substrate; (4) The printing chamber is evacuated. The entire printing chamber is evacuated. The vacuum degree is set to -20 kPa; (5) the printing process parameters are set (printing voltage 2000 V; printing speed 10 mm / s; printing pressure 40 kPa; printing nozzle size 10 μm; the distance between the printing nozzle and the glass substrate is 3 μm, the heating temperature of the barrel is 80°C, and the heating temperature of the nozzle is 80°C), and the molten PCL with a molecular weight of 50,000 is used as the forming material of the mask pattern. The mask pattern is printed according to the set path, and the printed mask line width is 2 μm; (6) after completing the printing of the required mask pattern on one side of the copper-clad glass substrate, repeat the operation of (5) and complete the printing of the mask pattern on one side of all the glass substrates on the fixture according to the pre-designed printing path; (7) all the glass substrates on the fixture are turned over, and the operations of (5) and (6) are repeated according to the path set for the required mask pattern on the other side to complete the printing of the double-sided mask pattern of the glass substrate; (8) the printing nozzle returns to the initial printing position; and the vacuum environment of the printing forming chamber is broken.

[0139] Step 8: Etching of copper-clad glass substrate. Using the molten PCL pattern printed in step 7 as a mask, select a reusable acidic ferric chloride solution and heat it to a constant temperature of 50°C to immerse and etch the glass-clad titanium-clad copper-clad board. The etching time is 15s, and then quickly switch to deionized water spray for 10s, followed by nitrogen blow-drying; the copper foil not covered by PCL is completely etched away, leaving a copper conductive pattern with precise line width and line type and an unetched titanium layer. Use a common detitanium solution on the market to immerse and etch the titanium layer at room temperature. The etching time is 5s, and then quickly switch to deionized water spray for 10s, followed by nitrogen blow-drying and placing it in a vacuum drying oven at 135°C for drying. The titanium foil not covered by PCL and copper is completely etched away, leaving a conductive pattern with precise line width and line type.

[0140] Step 9: Remove PCL. Soak in anhydrous ethanol for 3-5 minutes to remove PCL; then use deionized water to ultrasonically clean and dry the etched copper-clad glass substrate to obtain a double-sided metal layer conductive pattern.

[0141] Step 10: Deposit the Metal Layer

[0142] The etched metal layer conductive pattern is used as a seed layer, and a layer of nickel is deposited on the seed layer by an electroplating process to form a copper-nickel composite electrode structure. The specific operation process is as follows: the metal conductive pattern obtained in step 9 is connected to the cathode of the precision micro-electroplating equipment, and the nickel metal plate is used as the anode and placed in the electroplating solution; an anode activator is added to the electroplating solution to improve the solubility of the anode, increase the conductivity, and improve the dispersion ability of the solution; an anti-pinhole agent is added to reduce the surface tension of the solution, so that hydrogen bubbles are not easy to stay on the cathode surface, thereby preventing the formation of pinholes.

[0143] The electroplating equipment was turned on, and a current density of 2A / m2 was used. The temperature of the electroplating solution was always controlled within the range of 45-55°C by the constant temperature system; a circulating pump was used to stir the plating solution, and the speed of the flushing was 2m / s; and an ultrasonic generator was used to quickly discharge the bubbles attached to the electrode surface during the processing, which also played a role in reducing concentration polarization and improving flow field characteristics.

[0144] Step 11: Post-processing

[0145] After the metal material is deposited, the product of step 10 is ultrasonically cleaned with deionized water to remove the residual plating solution and excess impurities, and then dried with nitrogen to obtain a metallized TGV and double-sided RDL integrated glass adapter board. Figure 6 shown.

[0146] In some embodiments of the present application, a micro-nano 3D printing device is proposed, such as Figure 3 As shown, it includes: an XYZ three-axis motion module 1, an air pressure module 2, a multi-nozzle module 3, a high-voltage power supply 4, a signal generator 5, a frame 6, a printing platform 7, and a nozzle error compensation module 8.

[0147] The XYZ three-axis motion module 1 includes an X-axis motion module 101, a Z-axis motion module 102, and a Y-axis motion module 103. The Z-axis motion module 102 of the XYZ three-axis motion module 1 is connected to the X-axis motion module 101 of the XYZ three-axis motion module, and the X-axis motion module 101 is connected to the Y-axis motion module 103 of the XYZ three-axis motion module; the Y-axis motion module 103 of the XYZ three-axis motion module is fixed on the frame 6.

[0148] The multi-nozzle module 3 includes a CCD machine vision positioning module (Z-direction vision positioning module) 301, a first connecting frame 302, a second connecting frame 303, a back pressure connection unit 304, a laser rangefinder 305, a print needle 306, and a barrel 307. The multi-nozzle module 3 includes 25 (5×5 array distribution) print nozzle modules, and the print nozzle module includes a print needle 306 and a barrel 307. The print needle 306 is placed at the bottom of the nozzle and is perpendicular to the glass substrate. The upper part of the barrel 307 is connected to the back pressure connection unit 304. The back pressure connection unit 304 is connected to the air pressure module 2. The CCD machine vision positioning module 301 is fixed on the first connecting frame 302. The first connecting frame 302 and the laser rangefinder 305 are connected to the Z-direction motion module 102 of the XYZ three-axis motion module. The multi-nozzle module is fixed to the Z-direction motion module 102 of the XYZ three-axis motion module 1 by the second connecting frame 303.

[0149] The printing platform 7 includes a base 701, a flat electrode 702, and a fixture 703. The flat electrode 702 is placed and fixed on the base 701. The positive electrode (or negative electrode) of the high-voltage power supply 4 connected to the signal generator 5 is connected to the flat electrode 702. The fixture 703 (the glass substrate is fixedly clamped on the fixture after the micropores are formed) is in direct contact with the flat electrode 702 and is placed on the flat electrode 702.

[0150] The nozzle error compensation module 8 includes a Y motion direction vision module 801, a connecting frame 802, and an X motion direction vision module 803. The Y motion direction vision module 801 and the X motion direction vision module 803 are fixed on two connecting frames 802, and the connecting frames 802 are fixed on the frame 6.

[0151] The XYZ three-axis motion module 1 adopts a gantry structure. The self-weight X-axis motion module 101 includes precision motion platforms such as a linear motor module and a servo motor module. The stroke of the X-axis motion module 101 is 200mm, the repeatability accuracy is ±0.5μm, the positioning accuracy is ±1μm, and the maximum acceleration is 1g. The Y-axis motion module 103 includes precision motion platforms such as a linear motor module and a servo motor module. The stroke of the Y-axis motion module 103 is 200mm, the repeatability accuracy is ±0.5μm, the positioning accuracy is ±1μm, and the maximum acceleration is 1g. The Z-axis motion module 102 uses a servo motor module. The stroke of the Z-axis motion module 102 is 50mm, the repeatability accuracy is ±0.5μm, and the positioning accuracy is ±3μm.

[0152] The pressure range of the air pressure module 2 is 0 bar to 4 bar, and the pressure adjustment accuracy of the back pressure control module is greater than or equal to 1 kPa.

[0153] The printing needle 306 and the barrel 307 have normal temperature and heating functions, and can adapt to various printing materials. The heating temperature of the printing nozzle and the barrel is 0-350°C.

[0154] The high voltage power supply 4 has the following functions: outputting DC high voltage; outputting AC high voltage; outputting pulse high voltage, and being able to set bias. The bias voltage range is 0-2kV and is continuously adjustable, the DC high voltage is 0-5kV, the output pulse DC voltage is 0-±4kV and is continuously adjustable, the output pulse frequency is 0Hz-3000Hz and is continuously adjustable, and the AC high voltage is 0-±4kV.

[0155] The flat electrode 702 is a copper electrode, and the thickness of the flat electrode 702 is in the range of 15 mm. The flatness of the flat electrode 702 is of tolerance grade 5 accuracy.

[0156] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A method for integrated manufacturing of printed glass transfer plate RDL and metallized TGV, characterized in that: The following steps are involved: Step 1: pretreatment of glass substrate; Step 2: Micro-hole forming: using TGV hole forming technology, punch holes on the pre-treated glass substrate according to the design requirements. After the punching is completed, the glass substrate is cleaned and dried; Step 3: Microporous 3D printing metal filling, specifically: (1) placing the punched glass substrate on a fixture and clamping it; (2) placing the fixture on the workbench of a single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing device; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing device, the printing nozzle is moved to the marking point of the glass substrate; (4) evacuating the printing chamber; (5) starting from the bottom of the micropores, continuously spray-deposit the filling metal material according to the set printing process parameters, printing mode and printing path to achieve complete filling of the micropores without defects; (6) After the first micropore or the first group of micropores are filled, the operation of (5) is repeated to complete the printing of all micropores according to the pre-designed printing path; (7) The print head returns to the initial printing position, and the vacuum environment in the printing chamber is broken; Step 4: Filling metal for conductivity, specifically: placing the glass substrate after the microporous metal filling in a vacuum sintering furnace, setting the sintering time, temperature and sintering curve for sintering; carrying out filling effect evaluation, if the filling effect meets the requirements, the glass substrate through-hole filling is completed; if not, repeating steps 3 and 4 to fill the filled micropores twice or multiple times, and finally achieving the expected filling effect; Step 5: Printing a mask on the surface of the metallized through-hole, using a multi-nozzle single-plate electrode electric field driven melt jet deposition micro-nano 3D printing technology to print a mask on the surface of all metallized through-holes on one side of the glass substrate, and then printing a mask on the surface of all metallized through-holes on the other side of the substrate; The mask does not completely cover the through hole. By adjusting the printing parameters, masks of different sizes and shapes can be printed; Step 6: Metallizing the surface of the glass substrate; depositing a layer of metal film on the upper and lower surfaces of the glass substrate; Step 7: Printing a conductive pattern to manufacture a mask; using a multi-nozzle single-plate electrode electric field driven melt jet deposition micro-nano 3D printing technology to print the corresponding required mask pattern on one side of the glass substrate with a metal coating on the surface, and then print the corresponding required mask pattern on the other side; by adjusting the printing parameters, printing of mask patterns of different line types and sizes can be achieved; Step 8: etching the metal layer on the surface of the glass substrate, using the pattern printed in step 7 as a mask, etching the surface metal layer using an etching process, and transferring and copying the mask pattern to the surface metal layer; Step 9: Remove the mask; The mask is removed by soaking in a stripping agent; Then, the glass substrate after etching the surface metal layer is cleaned and dried to obtain a double-sided metal layer conductive pattern; Step 10: Depositing a metal layer; Using the conductive pattern of the surface metal layer as a seed layer, continuing to deposit metal material; Step 11: Post-processing; After the metal material is deposited, the product of step 10 is processed to obtain a glass transfer board integrating metallized TGV and double-sided RDL.

2. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The micropore forming in step 2 includes: laser etching, laser induced denaturation, sandblasting, mechanical drilling, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive glass, laser induced deep etching, and focused discharge pore forming.

3. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The printing material in step 3 includes: nano-metal conductive paste with high solid content, nano-metal particle size of 10nm-1μm, and solid content of 85-98wt.%.

4. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: Printing process parameters of step 3: printing voltage 300-2000V; Printing speed 0.1-20mm / s; Printing air pressure 0.1-300kPa: Printing nozzle size: 1-100μm.

5. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The printing modes of step 3 include: spiral lifting printing mode, stacking lifting printing mode and Z-direction vertical lifting printing mode; for micropores below 20 μm, the Z-direction vertical lifting printing mode is adopted; for circular micropores or special-shaped holes with a size greater than 20 μm, a spiral or stacking lifting printing mode is adopted.

6. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The printing device in step 3 includes a plurality of printing heads, and the nozzles of the printing heads are all at the same height; the spacing between the nozzles is consistent with the spacing between the glass substrates in the fixture; the fixture in step 3 can place a plurality of glass substrates in a linear array, and the number of glass substrates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

7. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The printing path of step 3: when setting the printing path, the array nozzle should be regarded as a unit, and the glass substrate on the fixture should be divided into several unit printing areas. After filling each unit area of ​​the glass substrate, it moves to the next unit printing area, and all the glass substrates are filled in sequence; the filling of the micropores is planned based on the corresponding relationship between a single nozzle and a single glass substrate.

8. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The sintering temperature of step 4 is 50-300° C., and the sintering time is 20 minutes to 100 minutes; the mask of step 5 covers 10% to 90% of the surface area of ​​the metallized through hole.

9. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: Printing process parameters of step 7: printing voltage 100-5000V; Printing speed 0.01-500mm / s; Printing air pressure 0.01-1000kPa; printing nozzle size 1-1000μm; the distance between the printing nozzle and the glass substrate 1-1000μm; the step 7 printing equipment includes a plurality of printing nozzles and barrels, and the nozzles of the printing nozzles are at the same height; the nozzle spacing is consistent with the glass substrate spacing in the fixture; the mask printing nozzle and barrel of step 7 have normal temperature and heating functions, which can adapt to various printing mask materials, and the heating temperature of the printing nozzle and barrel is 0-350℃.

10. The integrated manufacturing method of printed glass transfer plate RDL and metallized TGV according to claim 1, characterized in that: The fixture in step 7 can place a number of glass substrates in a linear array, and the number of glass substrates in the direction of the array nozzles should be an integer multiple of the number of nozzles; the printing path planning of the mask pattern in step 7: design the conductive patterns on the upper and lower surfaces of the glass adapter plate according to the requirements, use the data processing software to generate the corresponding code and import it into the printing device, and realize the printing of different line widths and heights of the mask pattern through different printing process parameters; the step 7 can control the amount of printing material according to the set process parameters and procedures, adjust the coverage of the mask pattern line terminal above the metallized TGV, thereby adjusting the size of the connection point between the metallized TGV and the surface conductive pattern, so that the connection between the surface conductive pattern and the metallized TGV is more reliable; The printing path of step 7: when setting the printing path, the array nozzle should be regarded as a unit, and the glass substrate on the fixture should be divided into several unit printing areas. After printing the mask pattern of each unit area, move to the next unit printing area, and complete the mask pattern printing of all glass substrates in sequence; the mask pattern printing is planned based on the corresponding relationship between a single nozzle and a single glass substrate.

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