Resin packaging device

Abstract

The invention provides a resin packaging device, which can obtain a resin packaging product with exposed external connection terminals of electronic components by using fewer components and manufacturing processes. A resin sealing device (1A) is provided with a mold (2) that sandwiches an electronic component (10) by means of an upper mold (2A) and a lower mold (2B) each having a cavity recess (3A, 3B), and that has a plurality of rods (5) disposed so as to be capable of advancing and retreating in a plurality of through holes (4) formed in the bottom surface (3A-1) of the cavity recess (3A) of the upper mold (2A). A plurality of rods (5) respectively entering from a plurality of through holes (4) abut against and are pressed against end surfaces (12B) of a plurality of sleeves (12) through clamping, and the end surfaces (12B) of the plurality of sleeves (12) and an end surface (13B) of a heat dissipation component (13) are exposed and molded by filling resin in a state that the heat dissipation component (13) abuts against a bottom surface (3B-1) of a cavity concave part (3B) of a lower mold (2B).

Description

Technical Field

[0001] The present invention relates to a resin encapsulation device for encapsulating electronic components with resin. Background Art

[0002] As a method for molding a large power module composed of a heat sink, an insulating layer, a substrate, a semiconductor power chip, and an external connection terminal (hereinafter referred to as a "vertical terminal") vertically arranged on the substrate, there is a method of providing an outer frame of a resin case around it, and adding a cover made of the same material as the resin case after pouring with liquid resin. Alternatively, there is a method of assembling a device formed by molding a small power module with epoxy resin into the outer frame of the resin case of a large power module, and pouring with liquid resin (for example, refer to Patent Document 1).

[0003] Since the vertical terminal is located on the opposite side of the heat dissipation surface of the substrate and the heat sink, it has the advantage of being long in distance from the ground and ensuring good insulation characteristics. In addition, since various external circuit devices can be stacked and arranged on the upper surface of the large power module, it has the advantage of being able to shorten the distance between the wirings used for connecting to various external circuit devices, which can reduce noise and improve reliability, and further achieve miniaturization (for example, refer to Patent Document 2).

[0004] As an exposure molding method of vertical terminals, for example, there is a method described in Patent Document 3. In this method, pins are vertically arranged on a substrate surface constituting an integrated circuit, and an exposed portion of an accessory into which the pins are inserted and tightly attached before molding and which can be removed after molding is sealed in a mold (package) encapsulated with resin, and the exposed portion is configured as a terminal.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent No. 7224272

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 10-22435

[0009] Patent Document 3: Japanese Utility Model Application Laid-Open No. 3-110847

[0010] When a resin case frame is set around a large power module and liquid resin is cast, resin cases for the outer frame and cover, adhesive materials, gel materials such as silicone, and parts or processes for the injection process are required, which leads to problems such as long curing time and high cost.

[0011] In the method described in Patent Document 3, there is a problem of deformation due to the use of accessories such as rubber or resin. In addition, there is a problem of high cost due to the process of attaching and detaching the accessories. Summary of the invention

[0012] Therefore, an object of the present invention is to provide a resin encapsulation device that can obtain a resin encapsulation product in which the external connection terminals of an electronic component are exposed using a small number of parts and manufacturing steps.

[0013] In the resin encapsulation device of the present invention, the electronic component is resin-encapsulated, and a plurality of sleeves are erected on the end face of one side of the substrate of the electronic component, and the plurality of sleeves have holes for respectively erecting a plurality of external connection terminals approximately vertically, and the electronic component is provided with a heat dissipation component on the end face of the other side of the substrate, and the resin encapsulation device has a mold, and the mold clamps the electronic component through a first mold and a second mold having a mold cavity recess, and has a plurality of pressing components that are respectively freely arranged on a plurality of through holes formed on the bottom surface of the mold cavity recess of the first mold, and the plurality of pressing components that respectively enter from the plurality of through holes are respectively abutted and pressed on the end faces of the plurality of sleeves by clamping, and when the heat dissipation component abuts against the bottom surface of the mold cavity recess of the second mold, the end faces of the plurality of sleeves and the end faces of the heat dissipation component are exposed and formed by filling with resin.

[0014] According to the resin encapsulation device of the present invention, when the electronic component is clamped by the first mold and the second mold, the plurality of pressing parts entering from the plurality of through holes respectively abut and press on the end faces of the plurality of sleeves, and in a state where the heat dissipation component abuts against the bottom surface of the cavity recess of the second mold, the resin is filled to prevent the resin from penetrating between the end faces of the plurality of sleeves and the plurality of pressing parts, so that the end faces of the plurality of sleeves and the end faces of the heat dissipation component can be exposed and molded. Thus, by respectively setting up external connection terminals in the holes of the plurality of sleeves after molding, a resin encapsulated product with exposed external connection terminals can be obtained. In particular, in the resin encapsulation device of the present invention, since the end faces of the plurality of sleeves are respectively pressed by the plurality of pressing parts, the height deviation from the end face of the heat dissipation component to the end faces of the plurality of sleeves can be absorbed, and the resin can be prevented from penetrating into the holes of the sleeves. In addition, it is also possible to absorb excess mold clamping load.

[0015] In addition, instead of the above-mentioned sleeve, the following device can be provided: a plurality of external connection terminals are erected approximately vertically, the plurality of external connection terminals have a step portion at the front end portion, and a pin portion thinner than the step portion is provided at the front end of the step portion. That is, in another resin encapsulation device of the present invention, an electronic component is resin encapsulated, and the electronic component is erected approximately vertically on the end face of one side of a substrate, the plurality of external connection terminals have a step portion at the front end portion, and a pin portion thinner than the step portion is provided at the front end of the step portion, and the electronic component is provided with a heat dissipation component on the end face of the other side of the substrate, and the resin encapsulation device has a mold, and the mold clamps the electronic component through a first mold and a second mold having a mold cavity recess, respectively, and has a plurality of pressing components, and the plurality of pressing components are respectively arranged to be able to move forward and backward freely. On the multiple through holes formed on the bottom surface of the cavity recess of the first mold, there are insertion holes for inserting the pin parts of the multiple external connection terminals respectively, and when the pin parts are respectively inserted into the insertion holes, they respectively abut and press on the step parts of the multiple external connection terminals. By clamping and when the pin parts are respectively inserted into the insertion holes, multiple pressing parts entering from the multiple through holes abut and press on the step parts, and when the heat dissipation part abuts against the bottom surface of the cavity recess of the second mold, by filling resin, the pin parts and step parts of the multiple external connection terminals and the end surface of the heat dissipation part are exposed and molded.

[0016] According to the resin encapsulation device of the present invention, when the electronic component is clamped by the first mold and the second mold, for the plurality of pressing parts that enter from the plurality of through holes, when the pins are respectively inserted into the insertion holes, the plurality of pressing parts respectively abut and press on the step portions of the plurality of external connection terminals, and when the heat sink is abutted against the bottom surface of the cavity recess of the second mold, the resin can be filled to prevent the resin from penetrating between the step portions of the plurality of external connection terminals and the plurality of pressing parts, so that the pin portions and the step portions of the plurality of external connection terminals and the end surface of the heat sink can be exposed and molded. Thus, after molding, it is not necessary to erect the external connection terminals on the holes of the sleeve, and a resin encapsulation product with the external connection terminals exposed can be obtained. In particular, in the resin encapsulation device of the present invention, since the step portions of the plurality of external connection terminals are respectively pressed by the plurality of pressing parts, the deviation in the height from the end surface of the heat sink to the step portions of the plurality of external connection terminals can be absorbed, and the resin can be prevented from penetrating into the insertion hole and covering the pin portions. In addition, it is also possible to absorb the excessive mold clamping load.

[0017] Here, the plurality of pressing members are movable pins arranged to be retractable from the insertion hole, and preferably have movable pins for scraping out the resin immersed in the insertion hole. Thus, when the resin is immersed in the insertion hole, the resin in the insertion hole can be scraped out by the movable pins and automatically cleaned.

[0018] In addition, the resin encapsulation device of the present invention can have an elastic component that allows multiple pressing components to enter and applies force to the multiple pressing components one by one or simultaneously. As a result, the step portion of the sleeve or the external connection terminal can be pressed with appropriate pressure. In addition, when multiple pressing components are applied with one elastic component, even if the spacing between the multiple pressing components is narrowed, the elastic component can be used to press them intensively.

[0019] In addition, preferably, the resin encapsulation device of the present invention has a release film, and the release film is stretched on one or both of the bottom surface of the cavity recess of the first mold or the bottom surface of the cavity recess of the second mold. Thereby, it is possible to further prevent the resin from penetrating into the end surfaces of the plurality of sleeves or the step portions of the plurality of external connection terminals and between the plurality of pressing components or the end surface of the heat dissipation component. In addition, even if excessive pressure is applied to the electronic component by clamping the mold, the excess pressure can be absorbed by the thickness and elasticity of the release film.

[0020] Effects of the Invention

[0021] (1) According to a resin encapsulation device, by respectively setting up external connection terminals in the holes of a plurality of sleeves after molding, a resin encapsulation product in which the external connection terminals of an electronic component are exposed can be obtained using fewer parts and manufacturing processes, wherein the resin encapsulation device performs resin encapsulation on an electronic component, wherein a plurality of sleeves are set up on an end surface on one side of a substrate of the electronic component, the plurality of sleeves have holes for respectively setting up a plurality of external connection terminals substantially vertically, and the electronic component is provided with a heat dissipation component on an end surface on the other side of the substrate, and the resin encapsulation device has a mold, the mold clamps the electronic component through a first mold and a second mold having a cavity recess, and has a plurality of pressing components, the plurality of pressing components are respectively provided to be freely advanced and retreated from a plurality of through holes formed on the bottom surface of the cavity recess of the first mold, the plurality of pressing components respectively enter from the plurality of through holes and respectively abut and press on the end surfaces of the plurality of sleeves, and in a state in which the heat dissipation component abuts against the bottom surface of the cavity recess of the second mold, by filling resin, the end surfaces of the plurality of sleeves and the end surfaces of the heat dissipation component are exposed and molded. In addition, the height deviation from the end face of the heat dissipation component to each end face of the plurality of sleeves can be absorbed, and the resin can be prevented from penetrating into the hole of the sleeve, so that a resin package product with good quality can be obtained. Furthermore, the excessive mold clamping load can also be absorbed, so that the damage of the electronic components can be prevented, and the quality can be improved.

[0022] (2) According to the resin encapsulation device, a resin encapsulated product with exposed external connection terminals can be obtained by using fewer parts and manufacturing processes, and the process of erecting external connection terminals on the holes of the sleeve after molding can be reduced, wherein the resin encapsulation device performs resin encapsulation on an electronic component, wherein the electronic component has a plurality of external connection terminals erected approximately vertically on an end face of one side of a substrate, the plurality of external connection terminals have a step portion at a front end portion, and a pin portion thinner than the step portion at the front end of the step portion, and the electronic component is provided with a heat dissipation component on the end face of the other side of the substrate, and the resin encapsulation device has a mold, and the mold is respectively formed by a first mold having a mold cavity recess and a second mold The tool clamps the electronic component and has a plurality of pressing parts, which are freely arranged from a plurality of through holes formed on the bottom surface of the cavity concave portion of the first mold, and have insertion holes for inserting the pins of the plurality of external connection terminals, and respectively abut and press on the step portions of the plurality of external connection terminals when the pins are respectively inserted into the insertion holes, and the plurality of pressing parts respectively enter from the plurality of through holes and abut and press on the step portions of the plurality of external connection terminals, and, in a state where the heat dissipating component abuts against the bottom surface of the cavity concave portion of the second mold, the respective pins and step portions of the plurality of external connection terminals and the end surface of the heat dissipating component are exposed and molded by filling resin. In addition, the deviation in the height from the end surface of the heat dissipating component to the step portions of the plurality of external connection terminals can be absorbed, and the resin can be prevented from penetrating into the insertion hole and covering the pin portions, so that a resin encapsulated product with good quality can be obtained. Furthermore, the excessive mold clamping load can also be absorbed, so the damage of the electronic component can be prevented, and the quality can be improved.

[0023] (3) The plurality of pressing parts are movable pins that can be moved forward and backward from the insertion hole, and have movable pins that can scrape out the resin that has penetrated into the insertion hole. Thus, when the resin has penetrated into the insertion hole, the resin in the insertion hole can be scraped out and automatically cleaned by the movable pins, thereby reducing the cleaning work of the mold.

[0024] (4) By having a structure with an elastic member, the stepped portion of the sleeve or the external connection terminal can be pressed with appropriate pressure, so that the component will not be damaged by excessive force, wherein the elastic member allows multiple pressing members to enter and applies force to the multiple pressing members one by one or simultaneously. In addition, when multiple pressing members are applied with one elastic member, even if the spacing between the sleeve or the external connection terminal is narrow, the spacing between the multiple pressing members can be narrowed to cope with it.

[0025] (5) By having a release film stretched on one or both of the bottom surface of the cavity recess of the first mold or the bottom surface of the cavity recess of the second mold, it is possible to further prevent the resin from penetrating into the end surfaces of the plurality of sleeves or between the step portions of the plurality of external connection terminals and the plurality of pressing components or the end surface of the heat dissipation component. In addition, even if excessive pressure is applied to the electronic component by clamping the mold, the excessive pressure can be absorbed by the thickness and elasticity of the release film, thereby preventing damage to the electronic component and further improving the quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic configuration diagram showing a main part of a resin sealing device according to a first embodiment of the present invention.

[0027] Figure 2 Yes means Figure 1 A diagram showing the state of the mold after mold closing.

[0028] Figure 3 It is a schematic configuration diagram showing a main part of a resin sealing device according to a second embodiment of the present invention.

[0029] Figure 4 Yes means Figure 3 A diagram showing the state of the mold after mold closing.

[0030] Figure 5 It is a schematic configuration diagram showing a main part of a resin sealing device according to a third embodiment of the present invention.

[0031] Figure 6 Yes means Figure 5 A diagram showing the state of the mold after mold closing.

[0032] Figure 7 It is a schematic configuration diagram showing a main part of a resin sealing device according to a fourth embodiment of the present invention.

[0033] Figure 8 Yes means Figure 7 A diagram showing the state of the mold after mold closing.

[0034] Fig. 9 It is a schematic configuration diagram showing a main part of a resin sealing device according to a fifth embodiment of the present invention.

[0035] Fig.10 Yes means Fig. 9 A diagram showing the state of the mold after mold closing.

[0036] Fig.11 It is a schematic configuration diagram showing a main part of a resin sealing device according to a sixth embodiment of the present invention.

[0037] Fig.12 Yes means Fig.11 A diagram showing the state of the mold after mold closing.

[0038] Fig.13 It is a schematic configuration diagram showing a main part of a resin sealing device according to a seventh embodiment of the present invention.

[0039] Fig.14 Yes means Fig.13 Diagram of the action state of the movable pin. DETAILED DESCRIPTION

[0040] <Implementation Method 1>

[0041] Figure 1 is a schematic structural diagram showing the main parts of the resin sealing device in the first embodiment of the present invention, Figure 2 Yes means Figure 1 A diagram showing the state of the mold after mold closing.

[0042] like Figure 1 As shown, the resin encapsulation device 1A in the first embodiment of the present invention is a device for resin encapsulating an electronic component 10. In the electronic component 10, a plurality of sleeves 12 are erected on the end surface of one side of a substrate 11, and a heat dissipation component 13 is arranged on the end surface of the other side. In addition, a power semiconductor chip (not shown) and the like are arranged on the substrate 11. The sleeve 12 has a hole 12A for erecting a plurality of external connection terminals (not shown) substantially vertically relative to the substrate 11. In addition, as an example of the substrate 11, a metal plate such as a lead frame can be used.

[0043] The resin encapsulation device 1A includes a mold 2 composed of an upper mold 2A as a first mold and a lower mold 2B as a second mold. The electronic component 10 is sandwiched between the upper mold 2A and the lower mold 2B, and resin encapsulation is performed by filling the cavity recesses 3A and 3B with resin.

[0044] A plurality of through holes 4 are formed on the bottom surface 3A-1 of the cavity concave portion 3A of the upper mold 2A. Rods 5 as pressing members are disposed in the plurality of through holes 4 so as to be able to move forward and backward. The outer diameter of the end surface 4A of the rod 5 is substantially the same as the outer diameter of the end surface 12B of the sleeve 12. The rods 5 are urged one by one in the direction of entering the cavity concave portion 3A from the through holes 4 by the spring 6 as an elastic member. The rods 5 are respectively in contact with the end surfaces 12B of the sleeve 12, and the sleeve 12 is pressed in a manner to block the hole 12A of the sleeve 12.

[0045] In the above-mentioned resin packaging device 1A, as Figure 2As shown, when the electronic component 10 is clamped and molded by the upper mold 2A and the lower mold 2B, the following state is achieved: the multiple rods 5 entering from the multiple through holes 4 of the upper mold 2A respectively abut and press the end faces 12B of the multiple sleeves 12, and the end face 13B of the heat dissipation component 13 abuts against the bottom face 3B-1 of the cavity recess 3B of the lower mold 2B.

[0046] By filling the resin in this state, the resin can be prevented from penetrating between the end faces 12B of the plurality of sleeves 12 and the plurality of rods 5, and the end faces 12B of the plurality of sleeves 12 and the end face 13B of the heat dissipation member 13 are exposed and molded, and the hole 12A of the sleeve 12 remains empty. Thus, by erecting external connection terminals (not shown) in the holes 12A of the plurality of sleeves 12 after molding, a resin packaged product with the external connection terminals exposed can be obtained.

[0047] In particular, in the resin encapsulation device 1A, the end faces 12B of the plurality of sleeves 12 are pressed by the plurality of rods 5, respectively, so that the height deviation from the end face 13B of the heat dissipation member 13 to each end face 12B of the plurality of sleeves 12 can be absorbed, and the resin can be prevented from penetrating into the hole 12A of the sleeve 12, so that a resin encapsulation product with good quality can be obtained. In addition, the excessive mold clamping load can also be absorbed by the spring 6, so that the damage of the electronic component can be prevented, and the quality can be improved.

[0048] In addition, in the resin sealing device 1A, the outer diameter of the end face 4A of the rod 5 is substantially the same as the outer diameter of the end face 12B of the sleeve 12, so when the resin is filled into the cavity concave portion 3A, the resin pressure is not applied to the end face 4A of the rod 5. As a result, the rod 5 is not pushed up by the resin pressure to generate a gap between the rod 5 and the sleeve 12, and resin leakage can be prevented.

[0049] <Implementation Method 2>

[0050] Figure 3 2 is a schematic structural diagram showing the main parts of a resin sealing device according to a second embodiment of the present invention. Figure 4 Yes means Figure 3 In addition, the same reference numerals are given to the same components as those described above, and detailed description thereof will be omitted.

[0051] like Figure 3 and Figure 4As shown, in the resin packaging device 1B in the second embodiment of the present invention, in addition to the resin packaging device 1A in the first embodiment, a mold release film 20 is stretched on the upper mold 2A. The mold release film 20 covers at least the bottom surface 3A-1 of the cavity concave portion 3A of the upper mold 2A. By the mold release film 20 being in close contact with the end surface 12B of the sleeve 12, the resin can be further prevented from penetrating into the end surface 12B of the sleeve 12, and the quality can be improved.

[0052] In addition, although not shown, a mold release film may be stretched on the lower mold 2B. In this case, the mold release film covers at least the bottom surface 3B-1 of the cavity concave portion 3B of the lower mold 2B. Since the mold release film 20 is in close contact with the end surface 13B of the heat dissipation component 13, the resin can be further prevented from penetrating into the end surface 13B of the heat dissipation component 13, and the quality can be improved.

[0053] Furthermore, by extending the release film in this manner, even if excessive pressure is applied to the electronic component 10 by the clamping of the mold 2, the thickness and elasticity of the release film can absorb the excessive pressure. Therefore, damage to the electronic component 10 can be prevented, and the quality can be further improved.

[0054] <Implementation Method 3>

[0055] Figure 5 FIG. 2 is a schematic structural diagram showing a main part of a resin sealing device according to a third embodiment of the present invention. Figure 6 Yes means Figure 5 In addition, the same reference numerals are given to the same components as those described above, and detailed description thereof will be omitted.

[0056] like Figure 5 and Figure 6 As shown, in the resin packaging device 1C in the third embodiment of the present invention, the two sleeves 12 are pressed via two rods 5 with respect to one spring 6. Thus, even if the spacing between the sleeves 12 is narrow, it can be handled by shortening the interval between the rods 5. Alternatively, a structure in which the sleeves 12 are pressed respectively via three or more rods 5 with respect to one spring 6 may be adopted.

[0057] <Implementation Method 4>

[0058] Figure 7 1 is a schematic structural diagram showing the main parts of a resin sealing device according to a fourth embodiment of the present invention. Figure 8 Yes means Figure 7 In addition, the same reference numerals are given to the same components as those described above, and detailed description thereof will be omitted.

[0059] like Figure 7 and Figure 8 As shown, in the resin packaging device 1D in the fourth embodiment of the present invention, in addition to the resin packaging device 1C in the third embodiment, a mold release film 20 is stretched on the upper mold 2A. The mold release film 20 covers at least the bottom surface 3A-1 of the cavity concave portion 3A of the upper mold 2A. By the mold release film 20 being in close contact with the end surface 12B of the sleeve 12, the resin can be further prevented from penetrating into the end surface 12B of the sleeve 12, and the quality can be improved.

[0060] In addition, although not shown, a mold release film may be stretched on the lower mold 2B. In this case, the mold release film covers at least the bottom surface 3B-1 of the cavity concave portion 3B of the lower mold 2B. Since the mold release film 20 is in close contact with the end surface 13B of the heat dissipation component 13, the resin can be further prevented from penetrating into the end surface 13B of the heat dissipation component 13, and the quality can be improved.

[0061] <Implementation Method Five>

[0062] Fig. 9 1 is a schematic structural diagram showing the main parts of a resin sealing device according to a fifth embodiment of the present invention. Fig.10 Yes means Fig. 9 In addition, the same reference numerals are given to the same components as those described above, and detailed description thereof will be omitted.

[0063] like Fig. 9 and Fig.10 As shown, in the resin packaging device 1E in the fifth embodiment of the present invention, instead of the plurality of sleeves 12 of the resin packaging device 1A in the first embodiment, a plurality of external connection terminals 50 are respectively provided substantially vertically with respect to the substrate 11. The external connection terminal 50 has a step portion 50A at the front end portion, and has a pin portion 50B thinner than the step portion 50A at the front end of the step portion 50A.

[0064] In addition, instead of the rods 5 in the first embodiment, the plurality of through holes 4 provided in the cavity recess 3A of the upper mold 2A are provided with rods 51 having insertion holes 51A into which the pins 50B of the external connection terminals 50 are respectively inserted. The outer diameter of the end surface 51B of the rod 51 is substantially the same as the outer diameter of the step 50A of the external connection terminal 50. The rods 51 abut against the step 50A of the external connection terminal 50 in a state where the pins 50B are inserted into the insertion holes 51A, and press the external connection terminals 50 in a manner to block the insertion holes 51A.

[0065] In the above-mentioned resin packaging device 1E, as Fig.10As shown, in a state where the electronic component 10 is clamped and molded by the upper mold 2A and the lower mold 2B, the following state is achieved: the pin portions 50B of the plurality of external connection terminals 50 are inserted into the insertion holes 51A of the plurality of rods 51 entering from the plurality of through holes 4 of the upper mold 2A, and in a state where the pin portions 50B are respectively inserted into the insertion holes 51A, the plurality of rods 51 respectively abut and press against the step portions 50A of the plurality of external connection terminals 50, and the heat dissipation component 13 abuts against the bottom surface 3B-1 of the cavity recess 3B of the lower mold 2B.

[0066] By filling the resin in such a state, the resin can be prevented from penetrating between the step portions 50A of the plurality of external connection terminals 50 and the plurality of rods 51, and the pin portions 50B of the plurality of external connection terminals 50, the step portions 50A, and the end surface 13B of the heat sink 13 are exposed and molded. Thus, it is not necessary to erect the external connection terminals in the holes 12A of the sleeve 12 after molding, as in the resin-encapsulated device 1A of the first embodiment, and a resin-encapsulated product in which the external connection terminals 50 are exposed from the beginning can be obtained.

[0067] In particular, in the resin encapsulation device 1E, the step portions 50A of the plurality of external connection terminals 50 are pressed by the plurality of rods 51, respectively, so that the deviation in height from the end surface 13B of the heat dissipation component 13 to the step portions 50A of the plurality of external connection terminals 50 can be absorbed, and the resin can be prevented from penetrating into the insertion hole 51A and covering the pin portion 50B, so that a resin encapsulation product with good quality can be obtained. In addition, the excessive mold clamping load can also be absorbed by the spring 6, so that the damage of the electronic component can be prevented, and the quality can be improved.

[0068] In addition, in the resin sealing device 1E, since the outer diameter of the end face 51B of the rod 51 is substantially the same as the outer diameter of the step portion 50A of the external connection terminal 50, when the resin is filled into the cavity concave portion 3A, the resin pressure is not applied to the end face 51B of the rod 51. Therefore, the resin pressure is not applied to the end face 4A of the rod 5. Therefore, the rod 51 is not pushed up by the resin pressure to generate a gap between the rod 51 and the step portion 50A of the external connection terminal 50, and resin leakage can be prevented.

[0069] <Implementation Method Six>

[0070] Fig.11 1 is a schematic structural diagram showing the main parts of a resin sealing device according to a sixth embodiment of the present invention. Fig.12 Yes means Fig.11 In addition, the same reference numerals are given to the same components as those described above, and detailed description thereof will be omitted.

[0071] like Fig.11 and Fig.12As shown, in the resin packaging device 1F according to the sixth embodiment of the present invention, the two external connection terminals 50 are pressed via two rods 51 with respect to one spring 6. Thus, even if the spacing between the external connection terminals 50 is narrow, it can be handled by shortening the interval between the rods 51. In addition, a structure in which the external connection terminals 50 are pressed respectively via three or more rods 51 with respect to one spring 6 may be adopted.

[0072] <Implementation Method Seven>

[0073] Fig.13 1 is a schematic structural diagram showing the main parts of a resin sealing device according to a seventh embodiment of the present invention. Fig.14 Yes means Fig.13 In addition, the same reference numerals are given to the structural elements common to the above-mentioned structural elements below, and their detailed description is omitted.

[0074] like Fig.13 As shown in FIG. 1 , in a resin sealing device 1G according to a seventh embodiment of the present invention, an insertion hole 51A is provided through which a rod 51 is provided, and a movable pin 52 is provided so as to be able to advance and retreat from the insertion hole 51A. When the movable pin 52 is in a state of retreating into the insertion hole 51A, it is located at a position where it does not interfere with the insertion of the pin portion 50B of the external connection terminal 50. On the other hand, when the movable pin 52 enters the insertion hole 51A, as shown in FIG. Fig.14 As shown in FIG. 5 , the rod 51 enters a position protruding from the end surface 51B of the rod 51 .

[0075] Thus, when resin penetrates into the insertion hole 51A, the resin in the insertion hole 51A can be scraped out and automatically cleaned by moving the movable pin 52 to a position protruding from the end surface 51B of the rod 51 after molding, thereby reducing the cleaning work of the mold 2.

[0076] Industrial Applicability

[0077] The present invention relates to a resin encapsulation device for encapsulating electronic components with resin, and is particularly suitable as a resin encapsulation device for molding a power module using a power semiconductor chip into a resin encapsulated product.

[0078] Reference numerals

[0079] 1A, 1B, 1C, 1D, 1E, 1F, 1G Resin encapsulated device

[0080] 2. Mould

[0081] 2A Upper mold

[0082] 2B Lower mold

[0083] 3A, 3B cavity concave part

[0084] 4 Through holes

[0085] 5

[0086] 6 Spring

[0087] 10 Electronic components

[0088] 11 base plate

[0089] 12 Sleeve

[0090] 13 Heat dissipation components

[0091] 20 Release film

[0092] 50 External connection terminals

[0093] 50A Step

[0094] 50B Pin

[0095] 51 strokes

Claims

1. A resin encapsulation device, wherein the resin encapsulation device encapsulates an electronic component with resin, wherein the electronic component has a plurality of sleeves erected on an end surface of one side of a substrate, the plurality of sleeves having holes for erecting a plurality of external connection terminals substantially vertically, and the electronic component has a heat dissipation component disposed on an end surface of the other side of the substrate, and The resin encapsulation device has a mold, which clamps the electronic component through a first mold and a second mold having a mold cavity recess, and has a plurality of pressing parts that are freely arranged on a plurality of through holes formed on the bottom surface of the mold cavity recess of the first mold. The plurality of pressing parts that respectively enter from the plurality of through holes are respectively abutted and pressed on the end surfaces of the plurality of sleeves by the clamping, and when the heat dissipation component is abutted against the bottom surface of the mold cavity recess of the second mold, the end surfaces of the plurality of sleeves and the end surface of the heat dissipation component are exposed and molded by filling resin.

2. A resin encapsulation device, wherein the resin encapsulation device performs resin encapsulation on an electronic component, wherein the electronic component has a plurality of external connection terminals respectively arranged substantially vertically on an end surface of one side of a substrate, wherein the plurality of external connection terminals have a step portion at a front end portion, and a pin portion thinner than the step portion at a front end of the step portion, and wherein the electronic component is provided with a heat dissipation component on an end surface of the other side of the substrate, and The resin encapsulation device has a mold, which clamps the electronic component through a first mold and a second mold having a mold cavity recess, and has a plurality of pressing parts. The plurality of pressing parts are freely arranged on a plurality of through holes formed on the bottom surface of the mold cavity recess of the first mold, and have insertion holes for inserting the pin parts of the plurality of external connection terminals, and respectively abut and press on the step parts of the plurality of external connection terminals when the pin parts are respectively inserted into the insertion holes. By clamping and in a state where the pin parts are respectively inserted into the insertion holes, the plurality of pressing parts entering from the plurality of through holes abut and press on the step parts, and in a state where the heat dissipation part abuts against the bottom surface of the mold cavity recess of the second mold, the respective pin parts and step parts of the plurality of external connection terminals and the end face of the heat dissipation part are exposed and molded by filling resin. 3 . The resin packaging device according to claim 2 , wherein the plurality of pressing members include movable pins disposed so as to be able to advance and retreat from the insertion hole and configured to scrape out the resin that has penetrated into the insertion hole. 4 . The resin packaging device according to claim 1 , further comprising an elastic member that allows the plurality of pressing members to enter and applies force to the plurality of pressing members one by one or simultaneously.

5. The resin packaging device according to any one of claims 1 to 3, wherein the resin packaging device comprises a release film, the release film being stretched on one or both of the bottom surface of the cavity recess of the first mold or the bottom surface of the cavity recess of the second mold. 6 . The resin packaging device according to claim 4 , further comprising a release film, the release film being stretched over one or both of a bottom surface of the cavity recess of the first mold or a bottom surface of the cavity recess of the second mold.

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