Conversion device and wafer detection equipment

Abstract

The embodiment of the invention provides a conversion device and wafer detection equipment. The conversion device comprises a transfer part and a conversion mechanism, the transfer part comprises a channel extending in the first direction, a first opening and a second opening, the first opening and the second opening are arranged at an interval in the first direction, the first opening is used for communicating the channel with a first cavity located outside the channel, and the second opening is used for communicating the channel with a vacuum cavity located outside the channel; the switching mechanism comprises a tray assembly, the tray assembly comprises a wafer tray, the wafer tray is connected with the inner wall face of the channel in a sealed mode, and the wafer tray is movably arranged between the first opening and the second opening in the first direction so that a wafer can be conveyed among the first cavity, the vacuum cavity and the wafer tray through the first opening and the second opening. The wafer tray is in sealed connection with the inner wall surface of the channel so as to reduce gas in the first chamber entering the vacuum chamber from the channel through the second opening, and the wafer transfer efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer production technology, and in particular to a conversion device and wafer detection equipment. Background Art

[0002] In the existing wafer production process, the wafer needs to be transferred between the atmospheric environment and the vacuum environment. The transfer process takes a lot of time, resulting in low wafer production and testing efficiency. Therefore, how to improve the efficiency of wafer transfer is an urgent problem to be solved. Summary of the invention

[0003] The embodiments of the present application provide a conversion device and a wafer detection device, which aim to improve the wafer transfer efficiency and improve the vibration problem of the conversion device.

[0004] An embodiment of the first aspect of the present application provides a conversion device, including: a transfer part and a conversion mechanism; the transfer part includes a channel extending along a first direction and a first opening and a second opening opened in the transfer part, the first opening and the second opening are arranged at intervals along the first direction, the first opening is used to connect the channel with a first chamber located outside the channel, and the second opening is used to connect the channel with a vacuum chamber located outside the channel; the conversion mechanism includes a tray assembly, the tray assembly includes a wafer tray, the wafer tray is used to transport wafers, the wafer tray and the inner wall surface of the channel are sealed and connected, and the wafer tray is movably arranged along the first direction between the first opening and the second opening, so that the wafer can be transported between the first chamber, the vacuum chamber and the wafer tray through the first opening and the second opening.

[0005] According to an embodiment of the present application, the transfer part also includes a accommodating cavity, the channel is connected to the accommodating cavity on the side away from the first opening along the first direction, the second opening is used to connect to the vacuum chamber located outside the accommodating cavity, and the wafer tray is movably arranged inside the channel and the accommodating cavity.

[0006] According to an embodiment of the present application, the tray assembly further includes an air extraction pipeline, which is connected to the channel so that the channel can be vacuumed through the air extraction pipeline.

[0007] According to an embodiment of the present application, the exhaust pipeline is connected to a side of the wafer tray away from the first opening along the first direction, the wafer tray is provided with exhaust holes, and the exhaust pipeline is connected to the exhaust holes.

[0008] According to an embodiment of the present application, the conversion mechanism further includes a driving assembly, the driving assembly is connected to a side of the tray assembly away from the first opening, and the driving assembly is used to drive the tray assembly to move along the first direction.

[0009] According to an embodiment of the present application, the air extraction pipeline includes:

[0010] The corrugated section is deformable along a first direction;

[0011] The fixed section is connected to the side of the corrugated section facing the wafer tray and is connected to the wafer tray.

[0012] According to an embodiment of the present application, the driving assembly is connected to the fixed section to drive the wafer tray to move along the first direction through the fixed section.

[0013] According to an embodiment of the present application, the driving assembly includes a first driving part, a second driving part and a connecting rod, the first driving part is movably arranged along the second direction, the second driving part is movably arranged along the first direction, and the second driving part is connected to the fixed section; one end of the connecting rod is rotatably connected to the first driving part, and the other end is rotatably connected to the second driving part, so that when the first driving part moves along the second direction, the second driving part can be driven to move along the first direction through the connecting rod, and the first direction and the second direction are arranged to intersect.

[0014] According to an embodiment of the present application, the first opening and the second opening are respectively arranged on both sides of the transfer portion along the third direction, and the first direction, the second direction and the third direction are arranged to intersect each other.

[0015] According to an embodiment of the present application, the conversion device also includes a mounting plate, which is connected to the transfer part, and the mounting plate is provided with a first slider. A first slide rail extending along a first direction is provided on the outside of the exhaust pipeline, and the first slider is slidably connected to the first slide rail along the first direction.

[0016] According to an embodiment of the present application, the tray assembly further includes a telescopic portion, which is deformably arranged along a first direction, and the telescopic portion is connected between the mounting plate and the wafer tray.

[0017] According to an embodiment of the present application, a sealing ring is provided on the outer peripheral side of the wafer tray, and the wafer tray is sealed and connected to the inner wall surface of the channel through the sealing ring.

[0018] An embodiment of the second aspect of the present application also provides a wafer inspection device, including the conversion device in any one of the embodiments of the first aspect above, and the wafer inspection device also includes a first chamber and a vacuum chamber, the first chamber is connected to the first opening, and the vacuum chamber is connected to the second opening.

[0019] In an embodiment of the present application, when the wafer tray is in the channel, the wafer tray is sealed and connected to the inner wall of the channel, and the wafer tray is movably arranged between the first opening and the second opening along the first direction. When the wafer tray is located between the first opening and the second opening, the wafer tray is sealed and connected to the inner wall of the channel to block the first opening and the second opening. At this time, the wafer in the first chamber can be moved to the wafer tray through the first opening. After the wafer tray is moved, the first opening is closed, and the wafer tray is moved to the second opening, and the wafer is moved to the vacuum chamber through the second opening. In the process of the wafer moving from the first opening to the wafer tray, the wafer tray is sealed and connected to the inner wall of the channel to reduce the gas in the first chamber from the channel through the second opening into the vacuum chamber, thereby ensuring the vacuum environment of the vacuum chamber, reducing the vacuum pumping time, and improving the wafer transfer efficiency. In addition, compared with the conversion device using a vacuum transfer valve, the vibration generated during the movement of the wafer tray in the embodiment of the present application is less than that of the vacuum transfer valve, thereby improving the vibration problem of the conversion device. The wafer tray and the inner wall surface of the channel are sealed and connected, the structure of the entire conversion device is simple, the number of parts is small, the installation and maintenance are convenient, and it is conducive to reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0021] Figure 1 is a structural schematic diagram of a conversion device provided in an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the structure of a conversion device, a first chamber and a vacuum chamber provided in an embodiment of the present application;

[0023] Figure 3 is a schematic structural diagram of another conversion device provided in an embodiment of the present application;

[0024] Figure 4 It is a structural schematic diagram of another conversion device and vacuum chamber provided in an embodiment of the present application;

[0025] Figure 5 is a structural schematic diagram of another conversion device provided in an embodiment of the present application;

[0026] Figure 6 It is a structural schematic diagram of another conversion device provided in an embodiment of the present application.

[0027] Explanation of the reference numerals: 10, first chamber; 20, vacuum chamber; 100, transfer part; 110, channel; 120, first opening; 130, second opening; 140, accommodating chamber; 150, valve; 200, conversion mechanism; 210, tray assembly; 220, wafer tray; 221, sealing ring; 222, exhaust hole; 230, exhaust pipeline; 231, corrugated section; 232, fixed section; 233, first slide rail; 240, telescopic part; 300, drive assembly; 310, first drive part; 311, ball screw; 312, drive motor; 320, second drive part; 330, connecting rod; 400, mounting plate; 410, first slider; 500, support seat; 510, second slide rail; 520, second slider; 521, first support; X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0028] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0029] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0030] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0031] Electron beam testing is a key step in the semiconductor manufacturing process to detect chip performance and defects. When testing wafers, it is necessary to transfer the wafers from storage devices such as wafer boxes to vacuum chambers. Therefore, the environment in which the wafers are located will undergo a transition from atmospheric to vacuum state. In the related technology, vacuum transfer valves are used. During the use of vacuum transfer valves, the opening and closing of the transfer valves will cause inevitable vibrations to the machine, which is not conducive to the stability of the machine environment. In addition, the structure is complex, and the installation and maintenance and parts costs are high. In order to improve production efficiency, reduce vacuum time, reduce vibration, and reduce costs, this application proposes a conversion device.

[0032] like Figure 1 and Figure 2 As shown, the first aspect of the present application provides a conversion device, including: a transfer part 100 and a conversion mechanism 200; the transfer part 100 includes a channel 110 extending along a first direction X and a first opening 120 and a second opening 130 opened in the transfer part 100, the first opening 120 and the second opening 130 are arranged at intervals along the first direction X, the first opening 120 is used to connect the channel 110 with a first chamber 10 located outside the channel 110, and the second opening 130 is used to connect the channel 110 with a first chamber 10 located outside the channel 110, and the second opening 130 is used to connect the channel 110 with a first chamber 10 located outside the channel 110. 10 outside the vacuum chamber 20; the conversion mechanism 200 includes a tray assembly 210, the tray assembly 210 includes a wafer tray 220, the wafer tray 220 is used to transport wafers, the wafer tray 220 is sealed and connected to the inner wall surface of the channel 110, and the wafer tray 220 is movably arranged along the first direction X between the first opening 120 and the second opening 130, so that the wafer can be transported between the first chamber 10, the vacuum chamber 20 and the wafer tray 220 through the first opening 120 and the second opening 130.

[0033] In this embodiment, the first opening 120 and the second opening 130 are spaced apart along the first direction X and are connected through the channel 110. When the wafer tray 220 is in the channel 110, the wafer tray 220 is sealed and connected to the inner wall surface of the channel 110. The wafer tray 220 is movably arranged along the first direction X between the first opening 120 and the second opening 130. When the wafer tray 220 is located between the first opening 120 and the second opening 130, the wafer tray 220 is sealed and connected to the inner wall surface of the channel 110 to block the first opening 120 and the second opening 130. At this time, the wafer in the first chamber 10 can be passed through the first opening 120. The first opening 120 is moved to the wafer tray 220. After the wafer tray 220 is moved, the first opening 120 is closed, and the wafer tray 220 is moved to the second opening 130. The wafer is moved to the vacuum chamber 20 through the second opening 130. In the process of the wafer moving from the first opening 120 to the wafer tray 220, the wafer tray 220 is sealed and connected with the inner wall surface of the channel 110 to reduce the gas in the first chamber 10 from the channel 110 through the second opening 130. Enter the vacuum chamber 20, ensure the vacuum environment of the vacuum chamber 20, reduce the vacuum pumping time, improve the wafer transfer efficiency, and thus improve the wafer detection efficiency. Compared with the conversion device using a vacuum transfer valve, the vibration generated during the movement of the wafer tray 220 in the embodiment of the present application is small, thereby improving the vibration problem of the conversion device. The wafer tray 220 and the inner wall surface of the channel 110 are sealed and connected, the conversion device has a simple structure, a small number of parts, and is easy to install and maintain, which is conducive to reducing costs.

[0034] Alternatively, if Figure 1 As shown, when the wafer tray 220 is located between the first opening 120 and the second opening 130, the bearing surface of the wafer tray 220 is in the space connected to the first opening 120 to bear the wafer. For example, when the first direction X is a vertical direction, the height of the first opening 120 is higher than the second opening 130, and the upper side of the wafer tray is its bearing surface.

[0035] Alternatively, if Figure 1 As shown, the first opening 120 and the second opening 130 are both connected to the channel 110 .

[0036] like Figure 2 and Figure 3 As shown, in some optional embodiments, the transfer portion 100 further includes a accommodating chamber 140, the channel 110 is connected to the accommodating chamber 140 along a first direction X on a side away from the first opening 120, the second opening 130 is used to connect the accommodating chamber 140 with a vacuum chamber located outside the accommodating chamber 140, the second opening 130 is directly connected to the accommodating chamber 140 and connected to the channel 110 through the accommodating chamber 140, and the wafer tray 220 is movably arranged inside the channel 110 and inside the accommodating chamber 140.

[0037] In these optional embodiments, the first opening 120 is provided in the channel 110, and the second opening 130 is provided in the accommodating cavity 140 on the side of the channel 110 away from the first opening 120. When the first direction X is a vertical direction, the second opening 130 is provided at the lower side of the channel 110, and the second opening 130 is connected to the channel 110 through the accommodating cavity 140. When the wafer tray 220 needs to be transferred to the second opening 130, the wafer tray 220 is moved from the channel 110 to the accommodating cavity 140, and can be clamped or adsorbed from the accommodating cavity 140 to the second opening 130 by a robot. In this embodiment, the second opening 130 is provided in the accommodating cavity 140, so that the dimension of the accommodating cavity 140 perpendicular to the first direction X is greater than the dimension of the channel 110 perpendicular to the first direction X, and the accommodating cavity 140 has a larger space, so that it is convenient for the robot to clamp or adsorb the wafer.

[0038] like Figure 4 2 is a schematic diagram of the structure of another conversion device and a vacuum chamber 20 provided in an embodiment of the present application. The vacuum chamber 20 has a first sealing cover at the top along the first direction X. To facilitate the display of the interior of the vacuum chamber, Figure 4 The first sealing cover is not shown. The top of the channel 110 along the first direction X has a second sealing cover, in order to facilitate the display of the interior of the channel 110 and the wafer tray 220, Figure 4 The second sealing cover is not shown in the figure, and is used to ensure that the interior of the channel 110 is a closed space.

[0039] like Figure 4 As shown, in some optional embodiments, the tray assembly 210 further includes an air extraction pipeline 230 , and the air extraction pipeline 230 is connected to the channel 110 , so that the channel 110 can be evacuated through the air extraction pipeline 230 .

[0040] In these optional embodiments, the wafer in the first chamber 10 can be moved to the wafer tray 220 through the first opening 120. After the wafer tray 220 is moved, the first opening 120 is closed and the channel 110 is evacuated through the exhaust pipe 230. Then the wafer tray 220 is moved to the second opening 130. The wafer moves to the vacuum chamber 20 through the second opening 130. In the process of the wafer moving from the first opening 120 to the wafer tray 220, the wafer tray 220 is sealed and connected to the inner wall of the channel 110 to reduce the gas in the first chamber 10 from entering the vacuum chamber 20 through the second opening 130. Before the wafer tray 220 is moved to the second opening 130, the exhaust pipe 230 is used to evacuate the channel 110. The space in the channel 110 is small, thereby reducing the time of evacuation and improving the wafer detection efficiency. After the exhaust pipe 230 evacuates the channel 110, the wafer tray 220 moves to the second opening 130. Since the second opening 130 is connected to the channel 110, the gas in the channel 110 can be further reduced from entering the vacuum chamber 20 through the second opening 130, thereby ensuring the vacuum environment of the vacuum chamber 20. Since the channel 110 has a small space, the vacuum pumping time can be reduced, thereby improving the wafer transfer efficiency and the detection efficiency.

[0041] Alternatively, if Figure 2 As shown, the first opening 120 is provided with a valve 150, and the valve 150 is used to open or close the first opening 120. When the valve 150 is opened, the wafer is transported through the first opening 120. After the transportation is completed, the valve 150 is closed, and the channel 110 and the first chamber 10 are spaced apart from each other, and then the channel 110 is evacuated through the exhaust pipeline 230, thereby reducing the vacuuming time and improving the wafer inspection efficiency.

[0042] like Figure 5 As shown, in some optional embodiments, the exhaust pipe 230 is connected to a side of the wafer tray 220 away from the first opening 120 along the first direction X. For example, when the first direction X is a vertical direction, the exhaust pipe 230 is located at the lower side of the wafer tray 220, so as to reduce the space occupied by the exhaust pipe 230 on the bearing surface of the wafer tray 220. The wafer tray 220 is penetrated by an exhaust hole 222, and the exhaust pipe 230 is connected to the exhaust hole 222.

[0043] In these optional embodiments, the exhaust pipe 230 is connected to the side of the wafer tray 220 that is away from the first opening 120 along the first direction X, and the wafer tray 220 is penetrated by an exhaust hole 222. The exhaust pipe 230 is connected to the side of the wafer tray 220 facing the first opening 120 through the exhaust hole 222. The exhaust pipe 230 vacuums part of the channel 110 on the side of the wafer tray 220 facing the first opening 120 through the exhaust hole 222. After the exhaust pipe 230 vacuums part of the channel 110 on the side of the wafer tray 220 facing the first opening 120, the wafer tray 220 moves to the second opening 130, and the second opening 130 is connected to the channel 110, further reducing the gas in the channel 110 from entering the vacuum chamber 20 through the second opening 130, thereby ensuring the vacuum environment of the vacuum chamber 20.

[0044] like Figure 5 As shown, in some optional embodiments, the conversion mechanism 200 further includes a driving assembly 300 , which is connected to a side of the tray assembly 210 away from the first opening 120 , and is used to drive the tray assembly 210 to move along the first direction X.

[0045] In these optional embodiments, the drive assembly 300 is connected to the side of the tray assembly 210 away from the first opening 120, thereby reducing the influence of the drive assembly 300 on the process of the wafer moving from the first opening 120 to the wafer tray 220. The drive assembly 300 is used to drive the tray assembly 210 to move along the first direction X.

[0046] Alternatively, if Figure 5 As shown, the driving assembly 300 may be connected to a side of the wafer tray 220 away from the first opening 120 along the first direction X to drive the wafer tray 220 to move along the first direction X.

[0047] Alternatively, if Figure 4 and Figure 5 As shown, the driving assembly 300 may be connected to the exhaust pipeline 230 , and drive the wafer tray 220 to move along the first direction X by driving the exhaust pipeline 230 .

[0048] Alternatively, if Figure 4 and Figure 5 As shown, the driving assembly 300 is located outside the transfer portion 100 , and the driving assembly 300 extends into the accommodating cavity 140 to connect with the wafer tray 220 .

[0049] like Figure 4 and Figure 6 As shown, in some optional embodiments, the exhaust pipeline 230 includes: a corrugated section 231 and a fixed section 232, the corrugated section 231 can be deformed along the first direction X, and the fixed section 232 is connected to the side of the corrugated section 231 facing the wafer tray 220 and connected to the wafer tray 220.

[0050] In these optional embodiments, the corrugated section 231 is deformably arranged along the first direction X so that the corrugated section 231 is stretched or compressed along the first direction X, thereby connecting the fixed section 232 to the wafer tray 220 , and the fixed section 232 and the wafer tray 220 are movable along the first direction X.

[0051] like Figure 6 As shown, the corrugated section 231 and the fixed section 232 are hollow structures, so that the gas in the channel 110 can be drawn out through the fixed section 232 and the corrugated section 231 .

[0052] like Figure 5 and Figure 6 As shown, in some optional embodiments, the driving assembly 300 is connected to the fixed section 232 to drive the wafer tray 220 to move along the first direction X through the fixed section 232 .

[0053] In these optional embodiments, the driving assembly 300 drives the fixed section 232 to move along the first direction X, thereby driving the wafer tray 220 to move along the first direction X.

[0054] Alternatively, if Figure 4 As shown, the driving assembly 300 is located outside the transfer part 100, and the fixed section 232 extends from the accommodating cavity 140 to the outside of the transfer part 100. The driving assembly 300 connects the part of the fixed section 232 located outside the transfer part 100, which is beneficial to reduce the volume of the transfer part 100.

[0055] like Figure 4 and Figure 5 As shown, in some optional embodiments, the driving assembly 300 includes a first driving part 310, a second driving part 320 and a connecting rod 330, the first driving part 310 is movably arranged along the second direction Y, the second driving part 320 is movably arranged along the first direction X, and the second driving part 320 is connected to the fixed section 232; one end of the connecting rod 330 is rotatably connected to the first driving part 310; the other end is rotatably connected to the second driving part 320, so that when the first driving part 310 moves along the second direction Y, the second driving part 320 can be driven to move along the first direction X through the connecting rod 330, and the first direction X and the second direction Y are arranged to intersect.

[0056] In these optional embodiments, one end of the connecting rod 330 is rotatably connected to the first driving part 310, and the other end is rotatably connected to the second driving part 320. The first driving part 310 is connected to the second driving part 320 through the connecting rod 330. The first driving part 310 moves along the second direction Y to drive one end of the connecting rod 330 to move along the second direction Y, so that the other end of the connecting rod 330 drives the second driving part 320 to move along the first direction X. The connecting rod 330 deflects relative to the first driving part 310 and the second driving part 320, so that the driving force of the first driving part 310 along the second direction Y can be converted into the driving force of the second driving part 320 along the first direction X. The second driving part 320 is connected to the fixing section 232 to drive the fixing section 232 to drive the wafer tray 220 to move along the first direction X. The first direction X and the second direction Y intersect, thereby reducing the size of the conversion mechanism 200 along the first direction X and reducing the occupied space of the conversion mechanism 200.

[0057] Alternatively, if Figure 4 and Figure 5 As shown, the first driving part 310 includes a driving motor 312 and a ball screw 311. The driving motor 312 drives the screw to rotate, and the ball connected to the screw is movably arranged along the first direction X.

[0058] Alternatively, if Figure 4 and Figure 5 As shown, the conversion device also includes a support base 500 and a second slide rail 510 extending along the second direction Y on the support base 500 . The second slider 520 is slidably connected to the second slide rail 510 along the second direction Y. The second slide rail 510 guides the second slider 520 .

[0059] Alternatively, if Figure 4 and Figure 5 As shown, the slider is connected between the connecting rod 330 and the ball, one end of the connecting rod 330 is rotated to connect the slider, and the ball is connected to the connecting rod 330 through the second slider 520. The slider ensures that the ball and one end of the connecting rod 330 move along the second direction Y to reduce the risk of misalignment.

[0060] Alternatively, if Figure 5 As shown, the second sliding block 520 is provided with a first support 521 , and one end of the connecting rod 330 is rotatably connected to the first support 521 .

[0061] Optionally, the first driving part 310 may be directly connected to one end of the connecting rod 330 , or the first driving part 310 may be connected to one end of the connecting rod 330 via a sliding block.

[0062] Optionally, the first driving part 310 may also be a cylinder, and the cylinder is telescopically arranged along the first direction X.

[0063] Alternatively, if Figure 5 As shown, the second driving portion 320 is sleeved on the outer circumference of the fixing section 232 so that the second driving portion 320 and the fixing section 232 can move synchronously.

[0064] Optionally, the first direction X and the second direction Y are perpendicular to each other.

[0065] Optionally, the first direction X is a vertical direction, and the second direction Y is a horizontal direction.

[0066] like Figure 2 and Figure 4 As shown, in some optional embodiments, the first opening 120 and the second opening 130 are respectively arranged on both sides of the transfer portion 100 along the third direction Z, and the first direction X, the second direction Y and the third direction Z are arranged to intersect each other.

[0067] In these optional embodiments, the first driving unit 310 is movably arranged along the second direction Y, and the first opening 120 and the second opening 130 are arranged on both sides of the transfer unit 100 along the third direction Z, so that the first chamber 10 and the vacuum chamber 20 can be located on both sides of the transfer unit 100 along the third direction Z, reducing the influence of the arrangement of the first driving unit 310 on the positions of the first chamber 10 and the vacuum chamber 20. The first direction X, the second direction Y and the third direction Z are arranged to intersect in pairs, making the layout more compact.

[0068] Optionally, the first direction X, the second direction Y and the third direction Z are perpendicular to each other.

[0069] like Figures 4 to 6 As shown, in some optional embodiments, the conversion device also includes a mounting plate 400, the mounting plate 400 is connected to the transfer part 100, the mounting plate 400 is provided with a first slider 410, and a first slide rail 233 extending along the first direction X is provided on the outer side of the exhaust pipeline 230, and the first slider 410 is slidably connected to the first slide rail 233 along the first direction X.

[0070] In these optional embodiments, the mounting plate 400 is provided with a first slider 410, and a first slide rail 233 extending along the first direction X is provided on the outer side of the exhaust pipe 230. The first slider 410 is slidably connected to the first slide rail 233 along the first direction X, so that the exhaust pipe 230 moves along the first direction X relative to the mounting plate 400. The first slider 410 and the first slide rail 233 are slidably connected along the first direction X to guide the exhaust pipe 230, thereby improving the accuracy of the moving path of the wafer tray 220, and further improving the sealing between the wafer tray 220 and the inner wall of the channel 110.

[0071] Alternatively, if Figures 4 to 6As shown, the mounting plate 400 is located at a side of the second opening 130 away from the first opening 120 along the first direction X, that is, the first slider 410 is located at a side of the second opening 130 away from the first opening 120 along the first direction X, so as to connect to the first slide rail 233 .

[0072] Alternatively, if Figure 6 As shown, the first slide rail 233 is disposed outside the fixed section 232 , thereby reducing the influence of the first slider 410 and the first slide rail 233 on the deformation of the corrugated section 231 .

[0073] like Figures 5 and 6 As shown, in some optional embodiments, the tray assembly 210 further includes a telescopic portion 240 , which is deformable along the first direction X, and the telescopic portion 240 is connected between the mounting plate 400 and the wafer tray 220 .

[0074] In these optional embodiments, the telescopic portion 240 is connected between the mounting plate 400 and the wafer tray 220, and the telescopic portion 240 can be deformed along the first direction X. The telescopic portion 240 further improves the accuracy of the moving path of the wafer tray 220 along the first direction X, ensuring that the wafer tray 220 can move along the first direction X towards or away from the mounting plate 400.

[0075] Alternatively, if Figure 5 As shown, the telescopic portion 240 may be a bellows, which extends along the first direction X and is deformable along the first direction X.

[0076] Alternatively, if Figures 5 and 6 As shown, the telescopic portion 240 is connected between the mounting plate 400 and the wafer tray 220 and is sleeved on the outer circumference of at least a portion of the exhaust pipeline 230 .

[0077] like Figure 5 As shown, in some optional embodiments, a sealing ring 221 is provided on the outer peripheral side of the wafer tray 220 , and the wafer tray 220 is sealedly connected to the inner wall surface of the channel 110 through the sealing ring 221 .

[0078] In these optional embodiments, the wafer tray 220 is sealed to the inner wall surface of the channel 110 via a sealing ring 221. The sealing ring 221 can improve the sealing between the wafer tray 220 and the channel 110 and reduce the gas from entering the second opening 130 through the gap between the wafer tray 220 and the channel 110.

[0079] In the second aspect, the present application proposes a wafer inspection device, including the conversion device in any one of the embodiments of the first aspect above, and the wafer inspection device also includes a first chamber 10 and a vacuum chamber 20, the first chamber 10 is connected to the first opening 120, and the vacuum chamber 20 is connected to the second opening 130.

[0080] In the present embodiment, the first chamber 10 is a non-vacuum chamber 20, the first opening 120 and the second opening 130 are spaced apart along the first direction X and are connected through the channel 110, when the wafer tray 220 is in the channel 110, the wafer tray 220 is sealed and connected to the inner wall surface of the channel 110, the wafer tray 220 is movably arranged along the first direction X between the first opening 120 and the second opening 130, when the wafer tray 220 is located between the first opening 120 and the second opening 130, the wafer tray 220 is sealed and connected to the inner wall surface of the channel 110 to block the first opening 120 and the second opening 130, at this time, the first opening 120 and the second opening 130 can be moved. The wafer in a chamber 10 is moved to the wafer tray 220 through the first opening 120. After the wafer tray 220 is moved, the first opening 120 is closed, and the wafer tray 220 is moved to the second opening 130. The wafer is moved to the vacuum chamber 20 through the second opening 130. In the process of the wafer moving from the first opening 120 to the wafer tray 220, the wafer tray 220 is sealed and connected to the inner wall of the channel 110 to reduce the gas in the first chamber 10 from the channel 110 through the second opening 130 to enter the vacuum chamber 20, thereby ensuring the vacuum environment of the vacuum chamber 20, reducing the vacuum pumping time, and improving the wafer detection efficiency. Compared with the wafer detection equipment using a vacuum transfer valve, the vibration generated during the movement of the wafer tray 220 in the embodiment of the present application is smaller, thereby improving the vibration problem of the wafer detection equipment.

[0081] According to the wafer inspection equipment provided in the embodiments of the present application, since the conversion device provided in the first aspect mentioned above is adopted, all the beneficial effects of the conversion device in any embodiment of the first aspect mentioned above are possessed. For details, please refer to the specific description of the conversion device in the above embodiments, and this embodiment will not be repeated here.

[0082] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A conversion device, characterized in that: include: A transfer portion, comprising a channel extending along a first direction and a first opening and a second opening opened in the transfer portion, wherein the first opening and the second opening are spaced apart along the first direction, the first opening is used to connect the channel with a first chamber located outside the channel, and the second opening is used to connect the channel with a vacuum chamber located outside the channel; The conversion mechanism comprises a tray assembly, wherein the tray assembly comprises a wafer tray, wherein the wafer tray is used to transport wafers, the wafer tray is sealedly connected to the inner wall surface of the passage, and the wafer tray is movably arranged along the first direction between the first opening and the second opening, so that the wafer can be transported between the first chamber, the vacuum chamber and the wafer tray through the first opening and the second opening.

2. The conversion device according to claim 1, characterized in that: The transfer part also includes a accommodating cavity, the channel is connected to the accommodating cavity on the side away from the first opening along the first direction, the second opening is used to connect the accommodating cavity with a vacuum chamber located outside the accommodating cavity, and the wafer tray is movably arranged inside the channel and inside the accommodating cavity.

3. The conversion device according to claim 1, characterized in that: The tray assembly further comprises an air extraction pipeline, which is in communication with the channel so that the channel can be vacuumed through the air extraction pipeline.

4. The conversion device according to claim 3, characterized in that: The exhaust pipeline is connected to a side of the wafer tray away from the first opening along the first direction. The wafer tray is penetrated by an exhaust hole, and the exhaust pipeline is connected to the exhaust hole.

5. The conversion device according to claim 4, characterized in that: The conversion mechanism further includes a driving assembly, wherein the driving assembly is connected to a side of the tray assembly facing away from the first opening, and the driving assembly is used to drive the tray assembly to move along the first direction.

6. The conversion device according to claim 5, characterized in that: The air extraction pipeline comprises: A corrugated section, which is deformable along the first direction; The fixed section is connected to a side of the corrugated section facing the wafer tray and is connected to the wafer tray.

7. The conversion device according to claim 6, characterized in that: The driving assembly is connected to the fixing section to drive the wafer tray to move along the first direction through the fixing section.

8. The conversion device according to claim 7, characterized in that: The driving assembly includes a first driving part, a second driving part and a connecting rod, the first driving part is movably arranged along the second direction, the second driving part is movably arranged along the first direction, and the second driving part is connected to the fixed section; one end of the connecting rod is rotatably connected to the first driving part, and the other end is rotatably connected to the second driving part, so that when the first driving part moves along the second direction, the second driving part can be driven to move along the first direction through the connecting rod, and the first direction and the second direction are arranged to intersect.

9. The conversion device according to claim 8, characterized in that: The first opening and the second opening are respectively arranged on two sides of the transfer portion along the third direction, and the first direction, the second direction and the third direction are arranged to intersect each other.

10. The conversion device according to claim 4, characterized in that: The conversion device also includes a mounting plate, which is connected to the transfer part. The mounting plate is provided with a first slider, and a first slide rail extending along the first direction is provided outside the exhaust pipeline. The first slider is slidably connected to the first slide rail along the first direction.

11. The conversion device according to claim 10, characterized in that: The tray assembly further includes a telescopic portion, which is deformable along the first direction and is connected between the mounting plate and the wafer tray.

12. The conversion device according to claim 1, characterized in that: A sealing ring is provided on the outer peripheral side of the wafer tray, and the wafer tray is sealed and connected to the inner wall surface of the channel through the sealing ring.

13. A wafer inspection device, characterized in that: Including the conversion device according to any one of claims 1 to 12, the wafer detection equipment also includes a first chamber and a vacuum chamber, the first chamber is connected to the first opening, and the vacuum chamber is connected to the second opening.

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