Wire Bonding Chip Gripping Tooling

Abstract

The present invention relates to the technical field of chip tooling, specifically a lead bonding chip clamping tooling, which includes a chip fixture table, a movable fastening piece, a clamping component, a fixed fastening piece, as well as a feeding component and a discharging component. Through the setting of the button, as long as the finger presses the button, the fixture can be opened, and when the button is released, the fixture will clamp the chip package; the production efficiency is improved, and the clamping efficiency can be doubled compared with the traditional hot stage; two layers of heat insulation are adopted at the beginning of the tooling design, and the heat insulation effect is very good; a fixing piece is added to the tail of the tooling, and the tooling can be better fixed to the hot stage or other carrier plates with screw holes; the tooling has strong expandability, and this tooling can not only be used for the chip gold wire bonding process, but also for other processes; through the setting of the feeding component and the discharging component of the present invention, the user only needs to press and release the button once to complete the feeding and discharging work at the same time, which is convenient and fast.

Description

Technical Field

[0001] The invention relates to the technical field of chip tooling, in particular to a wire bonding chip clamping tooling. Background Art

[0002] Chip packaging is divided into manual and fully automatic packaging. Manual chip packaging, as the name implies, requires manual operation for chip bonding and wire bonding. Fully automatic chip packaging requires the use of fully automatic chip mounters and fully automatic wire bonding machines, which have high equipment costs, require programming and debugging for each chip, and also require manual loading and unloading. For microwave / RF products, many packaged products have very small orders of dozens or hundreds each time, and there are no particularly high requirements for the product chip bonding position and the arc length and arc height of the wire bonding. Manual assembly is more flexible and has high switching efficiency.

[0003] However, manual chip packaging, such as the wire bonding process, uses the heating table that comes with the manual bonding machine to fix the chip shell, which has big problems: 1. The hot table that comes with the bonding machine itself has a poor fixing effect on small shells. The chip shakes during the wire bonding process and part of the chip is suspended in the air, causing uneven heating of the chip shell and the chip shell to be skewed. The consistency of the solder joints during bonding deteriorates and the bonding reliability is also reduced to a certain extent.

[0004] In this case, there is an urgent need for a reliable and convenient chip shell clamping tool to clamp and fix the chip, and at the same time have heat conduction and convenient loading and unloading. At the same time, the tooling also needs to have a certain heat insulation function to prevent the high temperature of the heat conducting part of the tooling from scalding the human body during manual loading and unloading. Summary of the invention

[0005] The purpose of the present invention is to provide a wire bonding chip clamping tool to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] Wire bonding chip clamping tooling, including:

[0008] A chip clamp table, wherein a clamping groove and a moving groove connected to the clamping groove are formed on the chip clamp table;

[0009] A movable fastening sheet, the movable fastening sheet passes through the movable slot and is connected to a clamping assembly disposed in the clamping slot;

[0010] A fixed fastening piece is provided on the chip fixture tabletop. Chip fastening pieces are provided on the movable fastening piece and the fixed fastening piece. When the clamping assembly is pushed, the movable fastening piece moves away from the fixed fastening piece along the moving groove. When the clamping assembly is released, the clamping assembly drives the movable fastening piece to move close to the fixed fastening piece along the moving groove, so that the two chip fastening pieces clamp the material placed on the chip fixture tabletop.

[0011] Preferably, a first heat insulation frame is provided on the chip fixture tabletop. The first heat insulation frame wraps the side wall of the chip fixture tabletop, and a second heat insulation frame is provided on the first heat insulation frame.

[0012] Preferably, the first heat insulation frame is provided with a fixing piece, and the second heat insulation frame is provided with a fixing hole aligned with the fixing piece.

[0013] Preferably, a pressing groove is formed on the second heat insulation frame. The clamping assembly includes a button provided at the pressing groove and sequentially passing through the first heat insulation frame and the chip fixture tabletop and then inserted into the clamping groove, a push rod provided on the button and located in the clamping groove, a guide rod provided on the push rod, a spring fastening piece provided on the guide rod, a clamping spring sleeved on the guide rod, and a heat insulation head provided on the button.

[0014] Preferably, a connecting block is provided on the movable fastening piece, and the connecting block is sleeved on the guide rod.

[0015] Preferably, a tensioning screw is provided on the chip fixture tabletop. The tensioning screw abuts against the spring fastening piece. Turning the tensioning screw drives the spring fastening piece to move, squeezing or relaxing the clamping spring.

[0016] Preferably, pressing the heat insulation head causes the guide rod to drive the guide rod to move, so that the movable fastening piece moves away from the fixed fastening piece along the moving groove. Releasing the heat insulation head releases the compressed spring, and two chip fastening pieces are pushed to clamp the material placed on the chip fixture tabletop.

[0017] Preferably, a feeding member is provided on the second heat insulation frame, and a discharging member is provided on the chip fixture tabletop.

[0018] Preferably, the feeding member includes legs provided on the second heat insulation frame, a hopper provided on the legs, a feed pipe provided at the bottom of the hopper, a feeding door provided at the opening of the feed pipe, a switch plate inserted on the feed pipe, a feeding port opened on the switch plate, a push plate provided on the switch plate, a first return spring provided between the hopper and the switch plate, a push rod and a door opening rod provided on the chip fastening piece. The blanking member includes a blanking groove opened on the chip fixture table, a guide groove provided on the chip fixture table and communicating with the blanking groove, a blanking plate provided on the blanking groove, a blanking outer rod provided on the wall of the blanking groove, a blanking pull rod inserted on the blanking outer rod and connected to the blanking plate, a support spring provided in the blanking outer rod, a pull rope with one end connected to the push rod and the other end passing through the chip fixture table and the blanking outer rod and connected to the blanking pull rod, a guide plate provided on the wall of the guide groove, a lower rotating rod provided on the guide plate and inserted into the chip fixture table, a second return spring sleeved on the lower rotating rod, and a sliding plate provided on the push rod and in contact with the lower rotating rod.

[0019] Preferably, when the heat insulation head is pressed, the push rod pushes the feeding port into the feed pipe, so that the material in the hopper enters the feed pipe. At the same time, the push rod pulls the pull rope, so that the pull rope drives the blanking pull rod to move down, driving the blanking plate to turn into the blanking groove. And the sliding plate moves under the drive of the push rod, so that the lower rotating rod moves down along the inclined surface on the sliding plate, causing the guide plate to rotate, so that the materials on the guide plate and the blanking plate fall into the blanking groove. When the heat insulation head is released, the sliding plate returns to its original position under the drive of the push rod, and the lower rotating rod moves up along the inclined surface of the sliding plate, causing the guide plate to return to its original position. And the door opening rod pushes the feeding door open, so that the material in the feed pipe falls on the guide plate, the pull rope is loosened at the same time, and the support spring pushes the blanking plate back to its original position.

[0020] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0021] Through the setting of the button in the present invention, the fixture can be opened as long as the finger presses the button, and the fixture will clamp the chip package when the button is released; the production efficiency is improved, and the clamping efficiency can be doubled compared with the traditional hot stage; two layers of heat insulation are adopted at the beginning of the tooling design, and the heat insulation effect is very good; a fixing piece is added to the tail of the tooling, and the tooling can be better fixed to the hot stage or other carrier plates with screw holes.

[0022] The tooling has strong expandability. This tooling can be used not only in the chip gold wire bonding process, but also in other processes. Through the settings of the feeding component and the discharging component, the user can complete the feeding and discharging work simultaneously with just one action of pressing and releasing the button, which is convenient and fast. Description of the Drawings

[0023] Figure 1 It is a schematic structural diagram of Embodiment 1 of the present invention;

[0024] Figure 2 It is a schematic bottom view structural diagram of Embodiment 1 of the present invention;

[0025] Figure 3 It is a schematic structural diagram of Embodiment 2 of the present invention;

[0026] Figure 4 It is a schematic right view structural diagram of Embodiment 2 of the present invention;

[0027] Figure 5 It is a schematic bottom view structural diagram of Embodiment 2 of the present invention;

[0028] Figure 6 It is a position relationship diagram of the discharging plate and the chip fixture tabletop of Embodiment 2 of the present invention;

[0029] Figure 7 It is a schematic structural diagram of the feeding mechanism of Embodiment 2 of the present invention;

[0030] Figure 8 It is a schematic structural diagram of the chip fixture tabletop of Embodiment 2 of the present invention;

[0031] Figure 9 It is a schematic structural diagram of the discharging component of Embodiment 2 of the present invention;

[0032] Figure 10 It is a schematic bottom view structural diagram of the discharging component of Embodiment 2 of the present invention;

[0033] Figure 11 It is a schematic cross-sectional structural diagram of the discharging outer sleeve rod of Embodiment 2 of the present invention.

[0034] In the figure: 1. Chip fixture tabletop; 2. Clamping groove; 3. Moving groove; 4. Moving fastening piece; 5. Fixed fastening piece; 6. Chip fastening piece; 7. Heat insulation frame one; 8. Heat insulation frame two; 9. Fixed piece; 10. Fixed hole; 11. Pressing groove; 12. Button; 13. Push rod; 14. Guide rod; 15. Spring fastening piece; 16. Slide plate; 17. Clamping spring; 18. Heat insulation head; 19. Connecting block; 20. Tightening screw; 21. Leg; 22. Hopper; 23. Feeding pipe; 24. Feeding door; 25. Switch plate; 26. Feeding port; 27. Pushing plate; 28. First reset spring; 29. Pushing rod; 30. Door opening rod; 31. Discharging groove; 32. Feeding guide groove; 33. Discharging plate; 34. Outer discharging rod; 35. Discharging pull rod; 36. Supporting spring; 37. Pulling rope; 38. Feeding guide plate; 39. Lower rotating rod; 40. Second reset spring. Specific implementation manner

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] Please refer to Figures 1 to 11 , the present invention provides a technical solution:

[0037] Embodiment 1: A lead bonding chip clamping tooling, comprising:

[0038] A chip fixture tabletop 1, on which a clamping groove 2 and a moving groove 3 communicating with the clamping groove 2 are provided. The clamping groove 2 is located at the bottom surface of the chip fixture tabletop 1, and the moving groove 3 communicates the clamping groove 2 with the top surface of the chip.

[0039] A heat insulation frame one 7 is provided on the chip fixture tabletop 1. The heat insulation frame one 7 wraps the side wall of the chip fixture tabletop 1 and is fixedly connected to the chip fixture tabletop 1 by means of setting screws, etc. A heat insulation frame two 8 is provided on the heat insulation frame one 7. The heat insulation frame two 8 wraps the heat insulation frame one 7 and is fixedly connected to the heat insulation frame one 7 by means of setting screws, etc. A pressing groove 11 is provided on the heat insulation frame two 8.

[0040] Move the fastening piece 4. The movable fastening piece 4 passes through the moving groove 3 and is connected to the clamping assembly arranged in the clamping groove 2. The clamping assembly includes a button 12, a push rod 13, a spring fastening piece 15, a guide rod 14, a clamping spring 17 and a heat insulation head 18. The button 12 is arranged at the pressing groove 11, passes through the first heat insulation frame 7 and the chip fixture table 1 in sequence, and then inserts into the clamping groove 2. The button 12 is movably connected to the first heat insulation frame 7 and the chip fixture table 1 respectively. The push rod 13 is arranged on the button 12 and is located in the clamping groove 2. The push rod 13 is fixedly connected to the button 12 by means of setting screws, etc. The guide rod 14 is arranged on the push rod 13. The guide rod 14 is fixedly connected to the push rod 13 by means of setting screws, etc. The spring fastening piece 15 is arranged on the guide rod 14. The spring fastening piece 15 is arranged on the guide rod 14 and is movably connected to the guide rod 14. A connecting block 19 is arranged on the movable fastening piece 4. The connecting block 19 is fixedly connected to the movable fastening piece 4 by means of integral molding, etc. The connecting block 19 passes through the moving groove 3 and is sleeved on the guide rod 14. The connecting block 19 is in contact with the push rod 13. The clamping spring 17 is sleeved on the guide rod 14. One end of the clamping spring 17 is connected to the spring fastening piece 15, and the other end of the clamping spring 17 is connected to the connecting block 19. The heat insulation head 18 is arranged on the button 12. The heat insulation head 18 is fixedly connected to the button 12 by means of setting screws, etc. A tightening screw 20 is arranged on the chip fixture table 1. The tightening screw 20 is in contact with the spring fastening piece 15. Turning the tightening screw 20 drives the spring fastening piece 15 to move, squeezing or relaxing the clamping spring 17.

[0041] Fix the fastening piece 5. The fixed fastening piece 5 is arranged on the chip fixture table 1. The fixed fastening piece 5 is fixedly connected to the chip fixture table 1 by means of setting screws, etc. Chip fastening pieces 6 are arranged on the movable fastening piece 4 and the fixed fastening piece 5. One chip fastening piece 6 is fixedly connected to the movable fastening piece 4 by means of setting screws, and the other chip fastening piece 6 is fixedly connected to the fixed fastening piece 5 by means of setting screws. Press the heat insulation head 18 to drive the guide rod 14 to move, so that the movable fastening piece 4 moves away from the fixed fastening piece 5 along the moving groove 3. Release the heat insulation head 18 to release the compressed spring, and push the two chip fastening pieces 6 to clamp the material placed on the chip fixture table 1.

[0042] The first heat insulation frame 7 is provided with a fixing piece 9. The second heat insulation frame 8 is provided with a fixing hole 10 aligned with the fixing piece 9. Set a screw on the fixing piece 9 through the fixing hole 10 to fix the tooling on a working platform such as a hot stage.

[0043] Embodiment 2: The difference between Embodiment 2 and Embodiment 1 is that: a feeding member is arranged on the second heat insulation frame 8, and a discharging member is arranged on the chip fixture table 1.

[0044] The feeding member includes legs 21, a hopper 22, a material guiding pipe 23, a feeding door 24, a switch plate 25, a feeding port 26, a pushing plate 27, a first reset spring 28 and an opening rod 30. The blanking member includes a blanking chute 31, a material guiding chute 32, a blanking plate 33, an outer blanking rod 34, a blanking pull rod 35, a supporting spring 36, a pulling rope 37, a material guiding plate 38, a lower rotating rod 39, a second reset spring 40 and a sliding plate 16. The legs 21 are arranged on the second heat insulation frame 8, and the legs 21 are fixedly connected to the second heat insulation frame 8 by means of screws or the like. The hopper 22 is arranged on the legs 21, and the hopper 22 is fixedly connected to the legs 21 by means of screws or the like. The material guiding pipe 23 is arranged at the bottom of the hopper 22, and the material guiding pipe 23 is fixedly connected to the hopper 22 by means of gluing or the like. The feeding door 24 is arranged at the opening of the material guiding pipe 23, and the feeding door 24 is rotatably connected to the material guiding pipe 23 by means of a rotating shaft or a hinge or the like. One side of the feeding door 24 protrudes from the material guiding pipe 23, and magnets that attract each other can be arranged at the joint of the material guiding pipe 23 and the feeding door 24 so that the feeding door 24 can fit the material guiding pipe 23. The switch plate 25 is inserted into the material guiding pipe 23, and the switch plate 25 is movably connected to the material guiding pipe 23. The feeding port 26 is opened on the switch plate 25. The pushing plate 27 is arranged on the switch plate 25, and the pushing plate 27 is fixedly connected to the switch plate 25 by means of integral molding or the like. The first reset spring 28 is arranged between the hopper 22 and the switch plate 25. One end of the first reset spring 28 is fixedly connected to the outer wall of the hopper 22, and the other end of the first reset spring 28 is fixedly connected to the switch plate 25. The pushing rod 29 and the opening rod 30 are arranged on the chip fastening piece 6 located at the moving fastening piece 4, and the pushing rod 29 and the opening rod 30 are respectively fixedly connected to the chip fastening piece 6 by means of screws or the like.

[0045] The blanking chute 31 is opened on the chip fixture table 1. The blanking chute 31 penetrates through the chip fixture table 1. The material guiding chute 32 is arranged on the chip fixture table 1 and communicated with the blanking chute 31. The blanking plate 33 is arranged at the opening of the blanking chute 31. The blanking plate 33 is rotatably connected to the side wall of the blanking chute 31 by means of arranging a rotating shaft, etc. The blanking outer sleeve rod 34 is arranged on the wall of the blanking chute 31. The blanking outer sleeve rod 34 is rotatably connected to the side wall of the blanking chute 31 by means of arranging a rotating shaft, etc. The blanking pull rod 35 is inserted into the blanking outer sleeve rod 34 and connected to the blanking plate 33. The blanking pull rod 35 is rotatably connected to the bottom wall of the blanking plate 33 by means of arranging a rotating shaft, etc. The blanking pull rod 35 is movably connected to the blanking outer sleeve rod 34. The support spring 36 is arranged inside the blanking outer sleeve rod 34. One end of the pull rope 37 is connected to the push rod 13, passes through the chip fixture table 1 and the blanking outer sleeve rod 34, and then is connected to the blanking pull rod 35. One end of the pull rope 37 is fixedly connected to the push rod 13 by means of arranging a metal ring, etc. The other end of the pull rope 37 is fixedly connected to the blanking pull rod 35 by means of arranging a metal ring, etc. The material guiding plate 38 is arranged on the side wall of the material guiding chute 32. The material guiding plate 38 is rotatably connected to the side wall of the material guiding chute 32 by means of arranging a rotating shaft, etc. The lower rotating rod 39 is arranged on the material guiding plate 38 and inserted into the chip fixture table 1. The lower rotating rod 39 is rotatably connected to the material guiding plate 38 by means of arranging a rotating shaft, etc. The lower rotating rod 39 is movably connected to the chip fixture table 1. The second reset spring 40 is sleeved on the lower rotating rod 39. One end of the second reset spring 40 is fixedly connected to the protrusion on the lower rotating rod 39. The other end of the second reset spring 40 is fixedly connected to the chip fixture table 1. The sliding plate 16 is arranged on the push rod 13 and contacts the lower rotating rod 39. The sliding plate 16 is fixedly connected to the push rod 13 by means of arranging screws, etc. The bottom surface of the lower rotating rod 39 is placed on the sliding plate 16.

[0046] Working principle: When in use, screws are set on the fixing piece 9 through the fixing holes 10 to fix the tooling on a working platform such as a hot stage. Press the heat insulation head 18 to drive the guide rod 14 to move, so that the moving fastening piece 4 moves away from the fixed fastening piece 5 along the moving groove 3. Release the heat insulation head 18 to release the compressed spring, and the spring pushes the two chip fastening pieces 6 to clamp the material placed on the chip fixture table 1. When the heat insulation head 18 is pressed, the push rod 29 pushes the feeding port 26 into the feeding pipe, so that the material in the hopper 22 enters the feeding pipe. At the same time, the push rod 13 pulls the pulling rope 37, so that the pulling rope 37 drives the blanking pull rod 35 to move downward, driving the blanking plate 33 to turn into the blanking groove 31. The sliding plate 16 moves driven by the push rod 13, so that the lower rotating rod 39 moves downward along the inclined surface on the sliding plate 16, causing the guide plate 38 to rotate, and the materials on the guide plate 38 and the blanking plate 33 fall into the blanking groove 31. When the heat insulation head 18 is released, the sliding plate 16 returns to its original position driven by the push rod 13, and the lower rotating rod 39 moves upward along the inclined surface of the sliding plate 16, causing the guide plate 38 to return to its original position. And the door opening rod 30 pushes the feeding door 24 to open, so that the material in the feeding pipe falls on the guide plate 38. The pulling rope 37 is also released at the same time, and the supporting spring 36 pushes the blanking plate 33 back to its original position.

[0047] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wire bonding chip clamping tool, characterized in that: include: A chip clamp table, wherein a clamping groove and a moving groove connected to the clamping groove are formed on the chip clamp table; A movable fastening sheet, the movable fastening sheet passes through the movable slot and is connected to a clamping assembly disposed in the clamping slot; A fixed fastening sheet, the fixed fastening sheet is arranged on the chip fixture table, the mobile fastening sheet and the fixed fastening sheet are provided with chip fastening sheets, when the clamping assembly is pushed, the mobile fastening sheet moves away from the fixed fastening sheet along the moving groove, and the clamping assembly is released, so that the clamping assembly drives the mobile fastening sheet along the moving groove to approach the fixed fastening sheet, so that the two chip fastening sheets clamp the material placed on the chip fixture table; A heat insulation frame 1 is arranged on the chip fixture table, the heat insulation frame 1 wraps the side wall of the chip fixture table, and a heat insulation frame 2 is arranged on the heat insulation frame 1; The second heat insulation frame is provided with a pressing groove, and the clamping assembly includes a button arranged at the pressing groove and inserted into the clamping groove after passing through the first heat insulation frame and the chip clamp table in sequence, a push rod arranged on the button and located in the clamping groove, a guide rod arranged on the push rod, a spring fastening sheet arranged on the guide rod, a clamping spring sleeved on the guide rod, and a heat insulation head arranged on the button; The second heat insulation frame is provided with a feeding component, and the chip fixture table is provided with a unloading component; The feeding component includes a support leg arranged on the second insulation frame, a hopper arranged on the support leg, a guide pipe arranged at the bottom of the hopper, a feeding door arranged at the opening of the guide pipe, a switch plate inserted on the guide pipe, a feeding port opened on the switch plate, a push plate arranged on the switch plate, a return spring 1 arranged between the hopper and the switch plate, a push rod and a door opening rod arranged on the chip fastening plate, and the unloading component includes a unloading trough opened on the chip fixture table, a guide trough arranged on the chip fixture table and connected to the unloading trough, A material unloading plate is arranged on the material unloading trough, a material unloading outer sleeve rod is arranged on the wall of the material unloading trough, a material unloading pull rod is inserted on the material unloading outer sleeve rod and connected to the material unloading plate, a supporting spring is arranged in the material unloading outer sleeve rod, a pull rope with one end connected to the push rod and the other end connected to the material unloading pull rod after passing through the chip clamp table and the material unloading outer sleeve rod, a material guide plate is arranged on the wall of the material guide trough, a lower rotating rod is arranged on the material guide plate and inserted in the chip clamp table, two return springs are sleeved on the lower rotating rod, and a slide plate is arranged on the push rod and in contact with the lower rotating rod.

2. The wire bonding chip clamping tool according to claim 1, characterized in that: The first heat insulation frame is provided with a fixing sheet, and the second heat insulation frame is provided with a fixing hole aligned with the fixing sheet.

3. The wire bonding chip clamping tool according to claim 2, characterized in that: The movable fastening plate is provided with a connecting block, and the connecting block is sleeved on the guide rod.

4. The wire bonding chip clamping tool according to claim 3, characterized in that: The chip clamp table is provided with a tightening screw, which is in contact with the spring fastening sheet. Turning the tightening screw drives the spring fastening sheet to move, thereby squeezing or loosening the clamping spring.

5. The wire bonding chip clamping tool according to claim 4, characterized in that: Pressing the insulation head causes the guide rod to move, so that the movable fastening plate moves away from the fixed fastening plate along the movable groove; loosening the insulation head releases the compressed spring, and pushes the two chip fastening plates to clamp the material placed on the chip fixture table.

6. The wire bonding chip clamping tool according to claim 5, characterized in that: When the insulation head is pressed, the push rod pushes the feed port into the feed pipe, so that the material in the hopper enters the feed pipe, and at the same time, the push rod pulls the pull rope, so that the pull rope drives the unloading pull rod to move downward, and drives the unloading plate to turn into the unloading chute, and the slide plate moves under the drive of the push rod, so that the lower rotating rod moves downward along the inclined surface on the slide plate, and the guide plate rotates, so that the material on the guide plate and the unloading plate falls into the unloading chute. When the insulation head is released, the slide plate returns to its original position under the drive of the push rod, and the lower rotating rod moves up along the inclined surface of the slide plate, so that the guide plate returns to its original position, and the door opening rod pushes the feed door to open, so that the material in the feed pipe falls on the guide plate, and the pull rope is released at the same time, and the support spring pushes the unloading plate back to its original position.

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