Integrated photodiode manufacturing method, photodiode and photoelectric keyboard

Abstract

The invention discloses an integrated photodiode manufacturing method, a photodiode and a photoelectric keyboard, and the method comprises the steps: providing a parallel support which is provided with a plurality of pins; an infrared light chip and a visible light chip are fixedly mounted on the parallel bracket; electrodes of the infrared light chip and the visible light chip are respectively connected to the corresponding pins to form mutually independent electrical loops; packaging glue and / or fluorescent glue are / is adopted to package the infrared light chip and the visible light chip to form the photodiode, the packaging glue is transparent or semitransparent glue, and the fluorescent glue is a photoluminescence fluorescent material matched with the visible light chip in color; and baking and curing the packaged photodiode to form the infrared light and visible light integrated photodiode. According to the method, the photodiode capable of emitting infrared light and visible light at the same time can be manufactured. When the integrated photodiode is applied, the use amount of components can be reduced, and the cost is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of photodiode manufacturing and packaging, and in particular to an integrated photodiode manufacturing method, a photodiode and a photoelectric keyboard. Background Art

[0002] With the continuous development of science and technology, photodiodes, as a new generation of light sources, have penetrated into people's work and life. They are not only widely used in the field of scientific research, but also play an important role in daily life and industrial production. Among them, the application of photoelectric keyboards is an important field, which requires photodiodes to have the functions of decoration, lighting and light signal transmission. However, the existing light-emitting diodes and infrared light diodes are separately packaged and have only a single photoelectric characteristic. In this way, in the application of photoelectric keyboards, if the functions of photoelectric lighting and light signal transmission are required, two different photoelectric components need to be used.

[0003] This not only affects the design of the circuit, but also increases the difficulty of designing small-size circuit boards, and also increases the cost of product application. First, the use of two different optoelectronic components makes the circuit design more complicated. Each component requires its own specific drive and control circuit, which requires more complex layout and design in a limited space, and puts higher requirements on the designer's technology and innovation ability. Moreover, the current, voltage, power consumption and other parameters of different components need to be considered in the circuit design to ensure the stable and safe operation of the entire system. Secondly, the use of two different optoelectronic components will increase the cost of product application. Each component requires an independent manufacturing and procurement process, which increases the cost of raw materials and production. Moreover, because more components are used, more time and manpower will be spent in the assembly, debugging and maintenance process, which will also increase the total cost of the product.

[0004] Therefore, how to simplify circuit design and reduce product application costs while maintaining the photodiode's decoration, lighting, and optical signal transmission functions has become an important issue at present. Summary of the invention

[0005] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the purpose of the present invention is to provide an integrated photodiode manufacturing method, a photodiode and an optoelectronic keyboard.

[0006] To achieve the above objectives, in a first aspect, a method for manufacturing an integrated photodiode according to an embodiment of the present invention includes: Providing a parallel bracket, wherein the parallel bracket has a plurality of pins; The infrared light chip and the visible light chip are fixedly mounted on the parallel bracket; Connecting the electrodes of the infrared light chip and the visible light chip to the corresponding pins respectively to form independent electrical circuits; The infrared light chip and the visible light chip are packaged to form a photodiode using packaging glue and / or fluorescent glue, wherein the packaging glue is transparent or translucent glue, and the fluorescent glue is a photoluminescent fluorescent material that matches the color of the visible light chip; The packaged photodiode is baked and cured to form a photodiode integrating infrared light and visible light.

[0007] According to one embodiment of the present invention, the step of fixing the infrared light chip and the visible light chip on the parallel bracket includes: Apply fixing glue at the predetermined position of the parallel bracket or pin; Placing the infrared light chip and the visible light chip at corresponding predetermined positions respectively and contacting them with the fixing glue to form a pre-assembled component; The pre-assembled component is baked and cured, so that the infrared light chip and the visible light chip are fixed on the parallel bracket or the pin after the fixing glue is cured.

[0008] According to an embodiment of the present invention, the pre-assembled part is baked at a temperature of 150 to 180° C. for 60 to 80 minutes.

[0009] According to an embodiment of the present invention, the photodiode is a light-emitting structure integrating infrared light and monochromatic light, or the photodiode is a light-emitting structure integrating infrared light and red, green, blue and colorful light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is specifically as follows: the infrared light chip and the visible light chip are both packaged by spot coating with transparent or translucent glue.

[0010] According to one embodiment of the present invention, the photodiode is a light-emitting structure integrating infrared light and white light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is as follows: the infrared light chip is packaged by spot coating with transparent or translucent glue, and the visible light chip is packaged by spot coating with white light fluorescent glue.

[0011] According to one embodiment of the present invention, the photodiode is a light-emitting structure integrating infrared light and composite color light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is as follows: the infrared light chip is packaged by spot coating with transparent or translucent glue, and the visible light chip is packaged by spot coating with composite color fluorescent glue.

[0012] According to one embodiment of the present invention, the photodiode is a light-emitting structure integrating infrared light and white light or composite color light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is specifically as follows: the infrared light chip and the visible light chip are both packaged with white light fluorescent glue or composite color light fluorescent glue.

[0013] According to an embodiment of the present invention, the step of baking and curing the packaged photodiode is specifically as follows: The packaged photodiode is subjected to a first-stage baking, wherein the baking temperature of the first stage is 60 to 100° C. and the baking time is 60 to 80 minutes; The packaged photodiode is baked in the second stage, wherein the baking temperature of the second stage is 140-160° C. and the baking time is 60-80 minutes.

[0014] In a second aspect, an embodiment of the present invention provides an integrated photodiode manufactured using the above method.

[0015] In a third aspect, an embodiment of the present invention provides a photoelectric keyboard, including LED key modules, each of which has an integrated photodiode as described above.

[0016] According to the integrated photodiode manufacturing method, photodiode and optoelectronic keyboard provided by the embodiments of the present invention, the method integrates and fixes the infrared light chip and the visible light chip on a parallel bracket, and uses packaging glue and / or fluorescent glue to spot-coat and package after welding the wires, and then bakes and cures them to manufacture a photodiode that can emit infrared light and visible light at the same time. When the integrated photodiode is used in an optoelectronic keyboard, it can realize the functions of photoelectric lighting and optical signal transmission at the same time, which can effectively reduce the amount of components used, reduce the design size of the circuit board, reduce the difficulty of the process in the finished product application, save production costs, and realize mass production. In addition, the integrated photodiode of the present invention has low power consumption, good stability, safety, environmental protection, energy saving, and is harmless to the human body.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 is a flow chart of an embodiment of a method for manufacturing an integrated photodiode of the present invention; Figure 2 is a three-dimensional diagram of an embodiment of an integrated photodiode of the present invention; Figure 3 FIG. 1 is a top view of an integrated photodiode according to an embodiment of the present invention.

[0020] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. Implementation

[0021] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the present invention are within the scope of protection of the present invention.

[0022] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “circumferential”, “radial”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0026] The integrated photodiode manufacturing method, the photodiode and the photoelectric keyboard according to the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0027] Reference Figures 1 to 3 As shown, the integrated photodiode manufacturing method provided in an embodiment of the present invention includes the following steps: S101 , providing a parallel bracket 10 , wherein the parallel bracket 10 has a plurality of pins 20 .

[0028] The parallel bracket 10 can be made of plastic material, which has sufficient stability and mechanical strength. The shape and size of the parallel bracket 10 can be designed and manufactured according to specific application requirements.

[0029] Exemplarily, the parallel bracket 10 is formed as a rectangular bracket, and a packaging cavity P10 is provided in the middle of the rectangular bracket. A plurality of pins 20 are formed on the rectangular bracket by injection molding, etc., and one end of the pin 20 extends into the packaging cavity P10, and its position should match the electrode position of the infrared light chip and the visible light chip in the subsequent steps, so that a correct electrical circuit can be formed when the electrodes are connected. The other end of the pin 20 is located outside the rectangular bracket, so as to be conveniently connected to the application circuit in a specific application.

[0030] It should be noted that in step S101, the number of pins 20 can vary according to specific design requirements and application needs, mainly depending on the functions and characteristics of the photodiode. For example, in a photodiode that integrates an infrared light chip and a visible light chip, there are usually four pins 20, two of which are used to connect to the positive electrode and negative electrode of the infrared light chip, and the other two pins 20 are used to connect to the positive electrode and negative electrode of the visible light chip. In this way, it is ensured that the infrared light and the visible light have independent electrical circuits to control and drive them separately.

[0031] S102 , fixing the infrared light chip 30 a and the visible light chip 30 b on the parallel bracket 10 .

[0032] Specifically, it is necessary to prepare in advance the infrared light chip 30a and the visible light chip 30b. The infrared light chip 30a is used to emit infrared light, and the visible light chip 30b is used to emit visible light. For example, the common visible light chip 30b can be a blue light chip, a red light chip, a green light chip, and the like. Then select a suitable position on the parallel bracket 10 to fix and install the infrared light chip 30a and the visible light chip 30b, for example, by pasting or other appropriate fixing methods. Preferably, the chip is mounted on the pin 20 in the packaging cavity P10 to ensure that the chip and the pin 20 are reliably fixed. This installation method allows the electrode of the chip to be reliably electrically connected to the pin 20 in subsequent steps.

[0033] S103 , respectively connecting the electrodes of the infrared light chip 30 a and the visible light chip 30 b to the corresponding pins 20 to form independent electrical circuits.

[0034] Each pin 20 can be connected to the electrodes of the corresponding infrared light chip 30a and visible light chip 30b. By connecting the pins 20 to the electrodes, the infrared light chip 30a and the visible light chip 30b can be electrically connected to form independent electrical circuits. When current passes through these electrodes, the photodiode will emit infrared light and visible light.

[0035] Specifically, first, materials for connecting electrodes need to be prepared. Common electrode connection materials include metal wires (such as gold wires or copper wires), etc. On the infrared light chip 30a and the visible light chip 30b, determine the positions of the electrodes, which should match the positions of the pins 20 on the parallel bracket 10. Next, use gold wire or other suitable wire materials to extend the electrodes to the positions of the pins 20 on the parallel bracket 10 and weld them to ensure good connection between the electrodes of the chip and the pins 20 to achieve signal transmission. Finally, after completing the electrode connection, necessary electrical tests can be performed to ensure that the electrical circuits of the infrared light chip 30a and the visible light chip 30b are correctly connected.

[0036] S104, using packaging glue and / or fluorescent glue to package the infrared light chip 30a and the visible light chip 30b to form a photodiode, the packaging glue is transparent or translucent glue, and the fluorescent glue is a photoluminescent fluorescent material that matches the color of the visible light chip 30b.

[0037] In step S104, the packaging material is usually a material with good insulation and protection properties, such as epoxy resin or silica gel, which is transparent or translucent. These materials can provide physical protection for the photodiode and prevent external factors such as dust and moisture from affecting the chip. In addition, the packaging material can also be photoluminescent fluorescent glue. Fluorescent materials are a special class of materials that can absorb incident light and emit light with a longer wavelength in a short time. This phenomenon is called the fluorescence effect. The fluorescence effect of fluorescent materials is achieved through excitation and recombination processes. When the fluorescent material is excited by incident light with higher energy, the electrons in the material will jump to a higher energy level. This excited state is unstable, so the electrons will quickly return to a lower energy level and release energy. This energy is emitted in the form of photons to produce fluorescent light. The fluorescent color of the fluorescent material is determined by its molecular structure and chemical composition. By adjusting the chemical composition and molecular structure of the material, fluorescent emission of different colors can be achieved. For example, fluorescent materials can emit various colors in the visible light range, such as blue, green, red, etc.

[0038] It should be noted that the use of packaging glue or fluorescent glue in this step mainly depends on the integrated functional requirements of the photodiode. Different light-emitting requirements use corresponding packaging glue or fluorescent glue to package the infrared light chip 30a and the visible light chip 30b. In addition, in this step, the packaging glue or fluorescent glue can be applied on the chip after the electrodes are connected by using the packaging spot coating process.

[0039] S105 , baking and curing the packaged photodiode to form a photodiode integrating infrared light and visible light.

[0040] This step is intended to reinforce the packaging glue and the fluorescent glue to ensure that they can be firmly bonded to the infrared light chip 30a and the visible light chip 30b, thereby improving the structural stability and durability of the photodiode.

[0041] The baking curing is carried out by placing the packaged photodiode in a specific baking device. The baking device usually provides controllable temperature and time parameters to ensure that the encapsulation glue and the phosphor glue can reach the appropriate degree of curing.

[0042] During the baking process, the photodiode is exposed to a certain temperature, which helps the encapsulation glue and the fluorescent glue to cure quickly. Through curing, the encapsulation glue can firmly bond the optoelectronic components, protect them from the external environment, and provide mechanical support. The fluorescent glue will also cure to enhance the visible light emission effect. The temperature and time parameters of the baking process need to be adjusted according to the specific encapsulation glue and fluorescent glue materials to ensure the curing effect.

[0043] After completing this step, the photodiode has completed the baking and curing process, and the package is complete, and the product has a stable package and cured glue layer. After the package is completed, the necessary package tests can be carried out to verify the package quality and performance of the photodiode. Through these tests, it can be ensured that the packaged photodiode meets the specification requirements and has reliable performance, can emit infrared and visible light at the same time, and has high structural strength and durability.

[0044] According to the integrated photodiode manufacturing method provided by the embodiment of the present invention, the method integrates and fixes the infrared light chip 30a and the visible light chip 30b on the parallel bracket 10, and uses packaging glue and / or fluorescent glue to spot-coat and package after welding the wires, and then bakes and cures them to manufacture a photodiode that can emit infrared light and visible light at the same time. When the integrated photodiode is used in an optoelectronic keyboard, it can realize the functions of photoelectric lighting and optical signal transmission at the same time, which can effectively reduce the amount of components used, reduce the design size of the circuit board, reduce the difficulty of the process in the finished product application, save production costs, and realize mass production. In addition, the integrated photodiode of the present invention has low power consumption, good stability, safety, environmental protection, energy saving, and is harmless to the human body.

[0045] In one embodiment of the present invention, the above step S102 of fixing and mounting the infrared light chip 30a and the visible light chip 30b on the parallel bracket 10 includes: Fixing glue is applied at predetermined positions of the parallel bracket 10 or the pin 20 .

[0046] The infrared light chip 30a and the visible light chip 30b are placed at corresponding predetermined positions and contacted with the fixing glue to form a pre-assembled component.

[0047] The pre-assembled components are baked and cured, so that the fixing glue is cured to fix the infrared light chip 30 a and the visible light chip 30 b on the parallel bracket 10 or the pin 20 .

[0048] That is to say, the first step is to apply a fixing glue at a predetermined position. Apply a layer of fixing glue at a predetermined position on the parallel bracket 10. The predetermined position points are determined in advance, and the infrared light chip 30a and the visible light chip 30b will be placed at these positions. For example, the chip is fixed on the pin 20 of the package cavity P10. Since the position of the pin 20 is fixed, the position of the chip is also fixed, and each chip can select a position where the pin 20 is located. The fixing glue is usually a strong adhesive, which is used to firmly bond and fix the chip to the bracket.

[0049] The second step is to place the infrared light chip 30a and the visible light chip 30b. The infrared light chip 30a and the visible light chip 30b are placed at predetermined positions respectively and contacted with the positions coated with fixing glue. The infrared light chip 30a and the visible light chip 30b are optoelectronic components of two different wavelength ranges, respectively, for emitting infrared light and visible light. They are placed at different positions on the bracket to ensure that the pins 20 can be correctly connected in subsequent steps and form independent electrical circuits. After the infrared light chip 30a and the visible light chip 30b are in contact with the fixing glue, a combination called a pre-assembled part is formed. The viscosity of the fixing glue enables the optical chip to be firmly attached to the parallel bracket 10.

[0050] The third step is baking and curing. The pre-assembled parts are baked and cured to solidify the fixing glue and firmly fix the infrared light chip 30a and the visible light chip 30b on the parallel bracket 10. During the curing process, the pre-assembled parts are placed in a specific baking device and baked according to the temperature and time parameters provided by the device. The temperature and time parameters during the baking process will vary depending on the fixing glue material used to ensure the curing effect.

[0051] Preferably, the pre-assembled parts are baked at a temperature of 150 to 180° C. for 60 to 80 minutes.

[0052] Through these steps, the infrared light chip 30a and the visible light chip 30b can be fixed in the packaging cavity P10 of the parallel bracket 10, and the baking and curing process ensures the firmness of the fixing glue, so that the optical chip can stably reside on the parallel bracket 10. The above-mentioned baking temperature and baking time are used, and these parameters are used to cure the fixing glue to ensure that the infrared light chip 30a and the visible light chip 30b can be firmly attached to the parallel bracket 10. Among them, 150~180℃ provides sufficient heat to promote the curing reaction of the fixing glue. The baking time is 60~80 minutes, which is long enough to ensure that the fixing glue is fully cured. The length of the baking time may also be fine-tuned according to the specific fixing glue material and manufacturing process.

[0053] As described above, in the packaging step, whether to use packaging glue or fluorescent glue depends mainly on the integrated functional requirements of the photodiode. Different luminescence requirements require corresponding packaging glue or fluorescent glue to package the infrared light chip 30a and the visible light chip 30b. The following is an explanation through several different examples.

[0054] First example: the photodiode is a light-emitting structure integrating infrared light and monochromatic light.

[0055] Correspondingly, packaging glue and / or fluorescent glue are used to package the infrared light chip 30a and the visible light chip 30b to form a photodiode. Specifically, the infrared light chip 30a and the visible light chip 30b are both packaged by applying transparent or translucent glue.

[0056] Specifically, in this example, the infrared light chip 30a and the visible light chip 30b are both packaged by using transparent or translucent glue. This means that in the packaging process of the infrared light chip 30a and the visible light chip 30b, a transparent or translucent packaging glue is used. This packaging glue can be epoxy resin, silicone or other suitable materials.

[0057] During the packaging process, the infrared light chip 30a and the visible light chip 30b are placed at predetermined positions, and transparent or translucent packaging glue is applied to these chips. These glue dots will play a role in fixing and protecting the chips. When the packaging glue is cured, the infrared light chip 30a and the visible light chip 30b are firmly fixed on the parallel bracket 10 or the pin 20, forming an integrated photodiode.

[0058] In addition, in this example, the photodiode may include an infrared light chip 30a and a blue light chip. The infrared light chip 30a is used to emit infrared light and is kept stable under the protection of transparent or translucent glue. The visible light chip 30b is a blue light chip used to emit monochromatic light, such as blue light. The two chips are packaged separately and fixed using transparent or translucent glue during the packaging process.

[0059] Through this integration method, the photodiode can emit infrared light and blue light at the same time, and has stable performance under the protection of the encapsulation glue.

[0060] Second example: the photodiode is a light-emitting structure that integrates infrared light and red, green, and blue colored light.

[0061] Correspondingly, the infrared light chip 30a and the visible light chip 30b are packaged to form a photodiode using packaging glue and / or fluorescent glue. Specifically, the infrared light chip 30a and the visible light chip 30b are both packaged with transparent or translucent glue. In this example, the photodiode can include an infrared light chip 30a, a red light chip, a green light chip and a blue light chip.

[0062] In this example, the infrared light chip 30a and the visible light chip 30b are still all packaged by using transparent or semi-transparent glue for dot coating. The packaging glue can be epoxy resin, silicone or other suitable materials.

[0063] Similar to the first example above, during the packaging process, the infrared light chip 30a, the red light chip, the green light chip and the blue light chip are placed at predetermined positions, and transparent or translucent packaging glue is applied to these positions. Preferably, the transparent or translucent glue can be directly filled into the packaging cavity P10 of the parallel bracket 10 for packaging. When the packaging glue is cured, the infrared light chip 30a and the visible light chip 30b are firmly fixed on the parallel bracket 10 or the pin 20 to form an integrated photodiode.

[0064] In addition, in this example, the photodiode may include an infrared light chip 30a, a red light chip, a green light chip, and a blue light chip. The infrared light chip 30a is used to emit infrared light, while the red light, green light, and blue light chips are used to emit red, green, and blue colored lights, respectively. These chips are packaged separately and fixed using transparent or translucent glue during the packaging process.

[0065] Through this integration method, the photodiode can emit infrared light and red, green and blue colored light at the same time, and has stable performance under the protection of the encapsulation glue.

[0066] The third example: the photodiode is a light-emitting structure that integrates infrared light and white light.

[0067] Correspondingly, the infrared light chip 30a and the visible light chip 30b are packaged to form a photodiode using packaging glue and / or fluorescent glue: the infrared light chip 30a is packaged with transparent or translucent glue, and the visible light chip 30b is packaged with white light fluorescent glue. In this example, the photodiode can include an infrared light chip 30a and a blue light chip.

[0068] In this example, on the one hand, the infrared light chip 30a is packaged by spot coating using transparent or translucent glue. This packaging glue can be epoxy resin, silicone or other suitable materials. The infrared light chip 30a is placed at a predetermined position, and a transparent or translucent packaging glue is spot coated on the position to fix and protect the chip. On the other hand, the visible light chip 30b is packaged by spot coating using white light fluorescent glue. White light fluorescent glue is a special fluorescent glue that has the ability to emit white light. During the packaging process, the visible light chip 30b is placed at a predetermined position, and white light fluorescent glue is spot coated on the position. This fluorescent glue will protect the visible light chip 30b and provide a white light luminous effect.

[0069] In addition, in this example, the photodiode may include an infrared light chip 30a and a blue light chip. The infrared light chip 30a is used to emit infrared light and remains stable under the protection of transparent or translucent glue. The blue light chip is used to emit blue light and presents a white light effect under the protection of white light fluorescent glue. The two chips are packaged separately and fixed using transparent or translucent glue and white light fluorescent glue during the packaging process.

[0070] Through this integration method, the photodiode can emit infrared light and white light at the same time, and has stable performance under the protection of the encapsulation glue.

[0071] In the fourth example, the photodiode is a light-emitting structure that integrates infrared light and composite color light.

[0072] Correspondingly, the infrared light chip 30a and the visible light chip 30b are packaged to form a photodiode using packaging glue and / or fluorescent glue. Specifically, the infrared light chip 30a is packaged with transparent or translucent glue, and the visible light chip 30b is packaged with composite color fluorescent glue. In this example, the photodiode can include an infrared light chip 30a and a blue light chip.

[0073] In this example, on the one hand, the infrared light chip 30a is packaged by spot coating using transparent or translucent glue. This packaging glue can be epoxy resin, silicone or other suitable materials. The infrared light chip 30a is placed at a predetermined position, and a transparent or translucent packaging glue is spot coated on the position to fix and protect the chip. On the other hand, the visible light chip 30b is packaged by spot coating using a composite color light fluorescent glue. The composite color light fluorescent glue is a special fluorescent glue that can emit light in multiple colors. During the packaging process, the visible light chip 30b is placed at a predetermined position, and a composite color light fluorescent glue is spot coated on the position. This fluorescent glue will protect the visible light chip 30b and provide a colorful light emission effect.

[0074] In addition, in this example, the photodiode includes an infrared light chip 30a and a blue light chip. The infrared light chip 30a is used to emit infrared light and remains stable under the protection of transparent or translucent glue. The blue light chip is used to emit blue light and presents a colorful light effect under the protection of the composite color light fluorescent glue. The two chips are packaged separately and fixed using transparent or translucent glue and composite color light fluorescent glue during the packaging process.

[0075] Different from the aforementioned second example, in this example, a visible light chip 30b is combined with a composite color light fluorescent glue to achieve the composite color light effect.

[0076] Through this integration method, the photodiode can emit infrared light and composite color light at the same time, and has stable performance under the protection of the encapsulation glue.

[0077] In the fifth example, the photodiode is a light-emitting structure that integrates infrared light and white light or composite color light.

[0078] Correspondingly, the infrared light chip 30a and the visible light chip 30b are packaged to form a photodiode using packaging glue and / or fluorescent glue. Specifically, the infrared light chip 30a and the visible light chip 30b are both packaged with white light fluorescent glue or composite color light fluorescent glue. In this example, the photodiode includes an infrared light chip 30a and a blue light chip.

[0079] In this example, both the infrared light chip 30a and the visible light chip 30b are dot-coated and packaged with white light fluorescent glue or composite color light fluorescent glue. White light fluorescent glue can emit white light, and composite color light fluorescent glue can emit composite color light effects. During the packaging process, the infrared light chip 30a and the visible light chip 30b are respectively placed at predetermined positions, and white light fluorescent glue or composite color light fluorescent glue is dotted at the corresponding positions. These fluorescent glues will protect the chips and provide white light or composite color light emission effects.

[0080] In addition, in this example, the photodiode includes an infrared light chip 30a and a blue light chip. The infrared light chip 30a is used to emit infrared light, and the blue light chip is used to emit blue light. The two chips are packaged separately, and white light fluorescent glue or composite color light fluorescent glue is used to fix and realize the luminous effect during the packaging process.

[0081] Different from the third and fourth examples, in this example, all chips are packaged with white fluorescent glue or composite color fluorescent glue. In the third and fourth examples, the infrared chip 30a is packaged with packaging glue, and the visible light chip 30b is packaged with fluorescent glue.

[0082] Through this integration method, the photodiode can emit infrared light, white light or composite color light at the same time, and has stable performance under the protection of the encapsulation glue.

[0083] In some embodiments of the present invention, the above step S105 of baking and curing the packaged photodiode is specifically as follows: The packaged photodiode is baked in the first stage, and the baking temperature of the first stage is 60-100°C and the baking time is 60-80 minutes. This temperature range is selected to gradually solidify and dry the encapsulation glue and fluorescent glue. Through this baking process, the solvent or volatile components in the encapsulation glue and fluorescent glue will gradually evaporate, making the colloidal material more solid and tightly bonded to the photodiode chip.

[0084] The packaged photodiode is baked in the second stage, with the baking temperature of the second stage being 140-160°C and the baking time being 60-80 minutes. The higher temperature helps to further solidify and reinforce the encapsulation glue and fluorescent glue to ensure its adhesion and stability with the photodiode chip. This baking process also helps to improve the heat resistance and weather resistance of the encapsulation glue and fluorescent glue to adapt to various working environments and conditions.

[0085] Through these two stages of baking and curing, the encapsulation glue and fluorescent glue of the packaged photodiode can achieve the required curing and stabilization effect, ensuring that the photodiode has good performance, reliability and durability during use.

[0086] The embodiment of the present invention also provides an integrated photodiode, which is manufactured by the above method. The integrated photodiode can realize the functions of decoration, lighting and light signal transmission, and has a wide range of applications.

[0087] An embodiment of the present invention provides an optical keyboard, including an LED key module, each of which has an integrated photodiode as described above. Exemplarily, the optical keyboard can switch on and off infrared light or visible light through a switch.

[0088] According to the photoelectric keyboard provided by the embodiment of the present invention, an integrated photodiode is used to realize the functions of photoelectric lighting and optical signal transmission, which can effectively reduce the amount of components used, reduce the design size of the circuit board, reduce the difficulty of the process in the finished product application, save production costs, and realize mass production. In addition, the integrated photodiode of the present invention has low power consumption, good stability, safety, environmental protection, energy saving, and is harmless to the human body.

[0089] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0090] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for manufacturing an integrated photodiode, characterized in that: include: Providing a parallel bracket, wherein the parallel bracket has a plurality of pins; The infrared light chip and the visible light chip are fixedly mounted on the parallel bracket; Connecting the electrodes of the infrared light chip and the visible light chip to the corresponding pins respectively to form independent electrical circuits; The infrared light chip and the visible light chip are packaged to form a photodiode using packaging glue and / or fluorescent glue, wherein the packaging glue is transparent or translucent glue, and the fluorescent glue is a photoluminescent fluorescent material that matches the color of the visible light chip; The packaged photodiode is baked and cured to form a photodiode integrating infrared light and visible light.

2. The method for manufacturing an integrated photodiode according to claim 1, characterized in that: The method of fixing the infrared light chip and the visible light chip on the parallel bracket comprises: Apply fixing glue at the predetermined position of the parallel bracket or pin; Placing the infrared light chip and the visible light chip at corresponding predetermined positions respectively and contacting them with the fixing glue to form a pre-assembled component; The pre-assembled component is baked and cured, so that the infrared light chip and the visible light chip are fixed on the parallel bracket or the pin after the fixing glue is cured.

3. The method for manufacturing an integrated photodiode according to claim 2, characterized in that: The pre-assembled part is baked at a temperature of 150 to 180° C. for 60 to 80 minutes.

4. The method for manufacturing an integrated photodiode according to claim 1, characterized in that: The photodiode is a light-emitting structure integrating infrared light and monochromatic light, or the photodiode is a light-emitting structure integrating infrared light and red, green, blue and colorful light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is specifically as follows: the infrared light chip and the visible light chip are both packaged by spot coating with transparent or translucent glue.

5. The method for manufacturing an integrated photodiode according to claim 1, characterized in that: The photodiode is a light-emitting structure integrating infrared light and white light; The use of packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is specifically as follows: the infrared light chip is packaged by spot coating with transparent or translucent glue, and the visible light chip is packaged by spot coating with white light fluorescent glue.

6. The method for manufacturing an integrated photodiode according to claim 1, characterized in that: The photodiode is a light-emitting structure integrating infrared light and composite color light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is as follows: the infrared light chip is packaged by spot coating with transparent or translucent glue, and the visible light chip is packaged by spot coating with composite color fluorescent glue.

7. The method for manufacturing an integrated photodiode according to claim 1, characterized in that: The photodiode is a light-emitting structure integrating infrared light and white light or composite color light; The method of using packaging glue and / or fluorescent glue to package the infrared light chip and the visible light chip to form a photodiode is specifically as follows: the infrared light chip and the visible light chip are both packaged with white light fluorescent glue or composite color light fluorescent glue.

8. The method for manufacturing an integrated photodiode according to claim 1, characterized in that: The specific steps of baking and curing the packaged photodiode are as follows: The packaged photodiode is subjected to a first-stage baking, wherein the baking temperature of the first stage is 60 to 100° C. and the baking time is 60 to 80 minutes; The packaged photodiode is baked in the second stage, wherein the baking temperature of the second stage is 140-160° C. and the baking time is 60-80 minutes.

9. An integrated photodiode, characterized in that: The method is as claimed in any one of claims 1 to 8.

10. An optical keyboard, characterized in that: It comprises LED key modules, each of which has an integrated photodiode as claimed in claim 9.

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