High-airtightness COB light source structure and manufacturing method thereof

Abstract

The invention discloses a high-air-tightness COB light source structure which comprises a substrate, a circle of box dam rubber ring is arranged on the upper surface of the substrate, a die bonding groove is defined by the box dam rubber ring, a plurality of LED chips are arranged in the die bonding groove of the substrate, and the die bonding groove of the substrate is filled with fluorescent powder glue so that the LED chips can be wrapped by the fluorescent powder glue. The upper surface of the fluorescent powder glue is covered with an isolation glue layer, the joint between the isolation glue layer and the box dam rubber ring is provided with a circle of covering rubber ring, and the manufacturing method comprises the following steps: arranging a plurality of LED chips in a light source area on the upper surface of the substrate; a circle of box dam rubber ring surrounding the light source area is arranged on the upper surface of the substrate, and heating and pre-curing are conducted; the solid crystal groove is filled with fluorescent powder glue, and heating and pre-curing are carried out; spraying isolation glue on the upper surface of the fluorescent powder glue and the top of the box dam rubber ring, heating and curing to form an isolation glue layer, and enabling the isolation glue layer to cover the whole upper surface of the fluorescent powder glue and the top of the box dam rubber ring; and a covering rubber ring is arranged at a connecting gap between the isolation rubber layer and the box dam rubber ring, and heating and pre-curing are carried out.

Description

Technical Field

[0001] The present invention specifically relates to a high-airtightness COB light source structure and a method for manufacturing the high-airtightness COB light source structure. Background Art

[0002] With the rapid development of LED technology and its wide application in the field of lighting, the performance requirements for LED light sources are also increasing. Especially for high-power LED light sources, a large amount of heat is generated during operation, which puts higher requirements on the thermal management of LED light sources. In addition, in order to ensure the service life and stability of LED light sources, improving the airtightness of the light source has become one of the research focuses.

[0003] The traditional COB chip on board light source structure has high light output efficiency and customized design capabilities, especially in dual-tone lighting, full spectrum and other applications. However, the COB light source area is large and the chip density is high. In high-power and high-density applications, due to the high concentration of phosphors, especially the warm white light source has a higher phosphor density, and the energy conversion efficiency of phosphors, especially long-wavelength red phosphors, is low, resulting in a large proportion of light energy being converted into heat energy and dissipated, resulting in a large amount of heat dissipation. At the same time, considering the reliability of the use of the lead wire of the positive package, the current COB light source mainly uses silicone with a lower hardness for sealing, and uses potting glue to protect the chip and lead wire. This method is prone to poor airtightness, and external moisture and pollutants may invade the interior of the light source, which is easily affected by impurities such as water vapor, sulfur, and chlorine in the environment and deteriorates, thereby affecting the life of the COB packaged LED light source. Due to its design limitations, it is difficult to achieve good airtightness and heat dissipation at the same time.

[0004] The present invention is just produced based on the above-mentioned shortcomings. Summary of the invention

[0005] The purpose of the present invention is to overcome the deficiencies of the prior art and to provide a high-airtightness COB light source structure and a method for manufacturing a high-airtightness COB light source structure, both of which are for improving the sealing performance while ensuring the heat dissipation function of the product.

[0006] The present invention is achieved through the following technical solutions:

[0007] The present invention provides a high-airtightness COB light source structure, comprising a substrate, wherein a circle of dam rubber ring 2 is provided on the upper surface of the substrate, the dam rubber ring 2 forms a crystal fixing groove, a plurality of LED chips are provided in the crystal fixing groove of the substrate, the crystal fixing groove of the substrate is filled with fluorescent powder glue so that the fluorescent powder glue wraps the LED chip, the upper surface of the fluorescent powder glue is covered with a layer of isolation glue layer, and a circle of covering rubber ring is provided at the connection between the isolation glue layer and the dam rubber ring 2.

[0008] In the high airtightness COB light source structure as described above, the covering rubber ring and the upper surface of the isolation rubber layer form a packaging groove, and the packaging groove is filled with packaging glue.

[0009] In the highly airtight COB light source structure as described above, the packaging glue is low-refractive index silicone or high-refractive index packaging silicone resin.

[0010] In the highly airtight COB light source structure as described above, some LED chips are electrically connected by welding gold wires, and some LED chips and substrates are also electrically connected by welding gold wires. The top of the dam rubber ring 2 is higher than the top of the gold wire, and the phosphor glue covers the gold wire.

[0011] In the high airtight COB light source structure as described above, the phosphor glue is made of organic silica gel.

[0012] The present invention also provides a method for manufacturing a high-airtight COB light source structure, which is used to process and prepare the above-mentioned high-airtight COB light source structure, comprising the following steps:

[0013] S1. Arrange a plurality of LED chips in the light source area on the upper surface of the substrate;

[0014] S2, a dam rubber ring 2 is arranged on the upper surface of the substrate to surround the light source area, and is heated for pre-curing to form a crystal-fixing groove in the light source area;

[0015] S3, filling the crystal bonding groove with phosphor glue, and heating for pre-curing;

[0016] S4, spraying isolation glue on the upper surface of the phosphor glue and the top of the dam rubber ring 2, heating and curing to form an isolation glue layer, so that the isolation glue layer covers the entire upper surface of the phosphor glue and the top of the dam rubber ring 2;

[0017] S5, a circle of covering rubber ring is arranged at the connection gap between the isolation rubber layer and the dam rubber ring 2, and heated for pre-curing.

[0018] In the method for manufacturing a high airtight COB light source structure as described above, the covering rubber ring and the upper surface of the isolation rubber layer form a packaging groove, and the packaging groove is filled with packaging glue. After step S5, the following steps are also included:

[0019] S6. Fill the packaging groove with packaging glue and heat it until it is completely cured.

[0020] In the method for manufacturing a high-airtightness COB light source structure as described above, the LED chip adopts a face-up chip, some LED chips are electrically connected by welding gold wires, and some LED chips are electrically connected to the substrate by welding gold wires. In step S2, the height of the dam rubber ring 2 is higher than the height of the highest point of the gold wire, and in step S3, the gold wire is covered by the fluorescent powder glue; or, the LED chip adopts a flip chip, in step S2, the height of the dam rubber ring 2 is at least 150um higher than the height of the LED chip, and in step S3, the upper surface of the fluorescent powder glue is at least 100um higher than the height of the LED chip.

[0021] According to the method for manufacturing a high-airtightness COB light source structure as described above, in step S2, the heating temperature range is 90-150°C, and the heating curing time is 10-30 minutes, so that the dam rubber ring 2 is in a shape-stable and uncured state. In step S3, the heating temperature range is 90-120°C, and the heating curing time is 10-30 minutes, so that the phosphor glue is fixed. In step S4, the curing temperature range is 90-120°C, and the curing time is 5-10 minutes, so that the isolation glue layer is cured. In step S5, the heating temperature range is 90-150°C, and the heating curing time is 10-30 minutes, so that the cover rubber ring is in a shape-stable and uncured state. In step S6, the heating temperature range is 90-150°C, and the heating curing time is greater than or equal to 1 hour, so that the dam rubber ring, the phosphor glue, the isolation glue layer, the cover rubber ring and the packaging glue are fully cured.

[0022] In the method for manufacturing a high-airtight COB light source structure as described above, in step S3, phosphor glue is applied to the die-bonding groove until the phosphor glue fills the die-bonding groove, and a centrifugal powder sedimentation process is used to make the phosphor particles in the phosphor glue sink to the bottom of the phosphor glue.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] The high-airtightness COB light source structure and the manufacturing method thereof of the present invention, the produced COB light source packaging structure is formed by connecting a dam rubber ring, a phosphor glue, an isolation rubber layer, a covering rubber ring, and a packaging glue multi-layer structure, the covering rubber ring can completely cover the top and side of the isolation rubber layer, the dam rubber ring and the covering rubber ring have large widths, and have good isolation properties for side water vapor, the isolation rubber layer can protect the top and part of the side of the dam rubber ring, the isolation rubber layer is arranged between the upper and lower dams of the dam rubber ring and the covering rubber ring, to prevent penetration at the interface of the packaging glue, the phosphor glue and the dam rubber ring, and the packaging glue plays a role in protecting the isolation rubber layer again The invention can play the role of protecting the connection position between the dam rubber ring and the covering rubber ring, thereby greatly improving the waterproof sealing performance; introducing a very thin, highly waterproof, sulfur-chlorine-proof isolation rubber layer, because the middle layer is relatively thin, the interface stress is small, and it is not easy to have failure problems such as delamination; in terms of the manufacturing method, the present invention adopts the method of first slightly curing part of the glue structure, and pre-forming different glues at a temperature of more than 100°C for more than 20 minutes. This glue is not fully cross-linked, but has no fluidity. There are available chemical bonds on the surface for the subsequent glue to achieve stable connection, which is conducive to the one-time curing after the subsequent multi-layer colloid is set. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a high airtight COB light source structure according to the first embodiment of the present invention;

[0026] Figure 2 It is a cross-sectional schematic diagram of the high airtightness COB light source structure of the present invention;

[0027] Figure 3 It is a schematic diagram of the structure of the substrate, the dam rubber ring and the LED chip of the present invention;

[0028] Figure 4 Schematic diagram of a top view of a substrate, a dam rubber ring and an LED chip of the present invention;

[0029] Figure 5 yes Figure 2 A local enlarged view of point A;

[0030] Figure 6 It is a structural schematic diagram of a high airtight COB light source structure according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0031] The invention will be further described below in conjunction with the accompanying drawings:

[0032] The directions described in the specification of the present invention, such as "up", "down", "left", "right", "front", "back", etc., are based on the directions of the drawings and are intended to facilitate the description of the relationship between the various components. They do not indicate the unique or absolute positional relationship between the various components. They are only one of the implementation methods of the invention and are not a limitation on its implementation method.

[0033] Embodiment 1

[0034] This embodiment provides a highly airtight COB light source structure, such as Figure 1 and Figure 2 As shown, it includes a substrate 1, the upper surface of the substrate 1 is provided with a circle of dam rubber ring 2, the dam rubber ring 2 surrounds a solid crystal groove 20, the substrate 1 is provided with a plurality of LED chips 7 in the solid crystal groove 20, the substrate 1 is filled with fluorescent powder glue 3 in the solid crystal groove 20 so that the fluorescent powder glue 3 wraps the LED chip 7, the upper surface of the fluorescent powder glue 3 is covered with a layer of isolation glue layer 4, and a circle of covering rubber ring 5 is provided at the connection between the isolation glue layer 4 and the dam rubber ring 2.

[0035] Preferably, the cover rubber ring 5 and the upper surface of the isolation rubber layer 4 form a packaging groove 50, and the packaging groove 50 is filled with packaging glue 6 to further ensure the sealing of the isolation glue. Among them, the packaging glue 6 can be made of low-refractive index silicone or high-refractive index packaging silicone resin. Low-refractive index silicone usually refers to a silicon-based elastomer material with a low refractive index (generally lower than 1.5). Such materials are used in many fields due to their good transparency, flexibility and temperature resistance, such as polydimethylsiloxane (PDMS): PDMS, modified silicone, etc.; high-refractive index silicone resin refers to those organic silicon compounds with a high refractive index (usually higher than 1.5). Such materials are very popular in the manufacture of optical components due to their unique optical properties, such as phenyl silicone oil, phenyl silicone resin, hybrid silicone resin, fluorine-containing silicone resin, etc. The materials used here are just some of the optional options and are not a limitation to this solution.

[0036] The upper surface of the substrate 1 is formed into a circle of dam rubber ring 2 by dispensing or coating process, and the dam rubber ring 2 surrounds a light source area, that is, the dam rubber ring 2 and the upper surface of the substrate 1 surround the above-mentioned crystal fixing groove 20, and the isolation rubber layer 4 is waterproof glue, which is made by spraying. The spraying of waterproof glue can protect the top and part of the side of the dam rubber ring 2, and the covering rubber ring 5 can completely cover the top and side of the isolation rubber layer 4. In addition, the packaging glue 6 can protect the isolation rubber layer 4 to avoid being damaged due to exposure to the surface. In addition, if Figure 5As shown, when the phosphor glue 3 is made but not cured, the powder is sunk to the bottom by centrifugal powder sedimentation process. Then the powder sedimentation process ensures that the heating element chip and the phosphor are sunk to the bottom, so that the phosphor glue 3 is divided into a lower phosphor layer 31 and an upper fusion glue layer 32, so that the phosphor glue layer has good heat dissipation performance. The centrifugal powder sedimentation process refers to the process of using the centrifugal force generated by the high-speed rotation of the centrifuge to evenly distribute and settle the phosphor particles in the glue. This process helps to eliminate the agglomeration of phosphor particles and ensure that the phosphor is more evenly distributed in the glue, thereby improving the optical performance of the LED light source.

[0037] The LED chip 7 can be a normal chip or a flip chip. A normal LED chip means that the chip electrode is located at the top of the chip, and the chip electrode is connected to the pad on the substrate through a gold wire (or silver wire). This installation method is the most commonly used LED chip installation method in the early days; a flip LED chip means that the chip electrode is located at the bottom of the chip, the chip is directly flipped on the substrate, and the metal bumps (such as solder balls) are used to electrically connect and physically fix the pad on the substrate. This installation method has been widely used and developed in recent years.

[0038] As mentioned above, when the LED chip 7 is a normal chip, some of the LED chips 7 are electrically connected by welding gold wires 8, that is, each LED chip 7 is connected in series, and the LED chips 7 at the head and tail ends of the series are also electrically connected to the substrate 1 by welding gold wires 8, so that multiple series can be formed, wherein the gold wires are also metal leads. At this time, the top of the dam rubber ring 2 is higher than the top of the gold wire 8, and the phosphor glue 3 covers the gold wire 8. Ensure that the gold wire is not exposed, thereby avoiding the problem of unstable stress and easy breakage of the gold wire in different colloid layers. The arrangement of the LED chips 7 is as shown in Figure 3 and Figure 4 shown.

[0039] As a preferred solution, in this embodiment, the phosphor glue 3 is made of organic silica gel, which has the advantages of temperature resistance, weather resistance, insulation, flexibility, etc., thereby improving the thermal reliability of the light source.

[0040] The method for manufacturing the above-mentioned high airtightness COB light source structure includes the following steps:

[0041] S1. Arrange a plurality of LED chips 7 in the light source area on the upper surface of the substrate 1. The substrate may be a copper substrate, an aluminum substrate or a ceramic substrate. The LED chip may be a front mounted chip or a flip-chip. If it is a front mounted chip, generally no circuit layer is provided in the light source area of ​​the substrate, and the front mounted chips are connected by gold wire bonding wires. If it is a flip-chip, a circuit layer needs to be provided on the surface of the substrate. The circuit layer is generally isolated by an insulating or reflective layer except for the chip pad to reduce the absorption of the light by the circuit layer surface.

[0042] S2, a dam rubber ring 2 is arranged on the upper surface of the substrate 1 to surround the light source area, and is heated and pre-cured to form a crystal-fixing groove 20 in the light source area. The dam rubber ring 2 is generally composed of organic silicone rubber, organic silicone resin, organic polymer or organic silicone oil, etc., and has a very high reflectivity in the visible light band, and has a good bonding effect with the COB substrate and the phosphor glue 3, the packaging glue 6, etc., and has a good ability to prevent water vapor and sulfur and chlorine impurities;

[0043] S3, filling the crystal bonding groove 20 with phosphor glue 3, and heating for pre-curing. Here, the phosphor glue 3 is a mixture of organic silica gel and phosphor. If it is a two-color or multi-color phosphor glue 3, it is necessary to adjust different color temperatures by multiple steps such as dispensing, brushing, and powder spraying. The phosphor silica gel requires the surface to be flat or slightly concave, not convex, and the phosphor glue 3 must completely cover the chip. If the chip adopts a flip chip, the height of the phosphor glue is higher than the flip chip, and the height difference is not less than 100um, so as to ensure that the phosphor glue 3 can completely cover all light-emitting surfaces of the chip. If the chip adopts a normal chip, the gold wire needs to be covered;

[0044] S4, spraying isolation glue on the upper surface of the phosphor glue 3 and the top of the dam rubber ring 2, heating and curing to form an isolation glue layer 4, so that the isolation glue layer 4 covers the entire upper surface of the phosphor glue 3 and the top of the dam rubber ring 2, where the isolation glue is an organic resin and organic polymer with good waterproof and sulfur-chlorine resistance, and the spray glue is blocked by a template, and the template exposes the light source area to ensure that the sprayed isolation glue can completely cover the phosphor glue and the connection between the phosphor glue and the dam rubber ring 2, and the isolation glue must cover the highest point of the first dam glue and cover an outward coverage range of not less than 0.1mm, and the thickness of the isolation glue is not more than 50um;

[0045] S5, a circle of covering rubber ring 5 is arranged at the connection gap between the isolation rubber layer 4 and the surrounding dam rubber ring 2, and heated for pre-curing.

[0046] S6, filling the packaging groove 50 with packaging glue 6, and heating until it is completely cured. Here, step S6 is added for better waterproof protection performance, and step S6 may not be required.

[0047] As mentioned above, when the LED chip 7 adopts a front chip, some LED chips 7 are electrically connected by welding gold wires 8, and some LED chips 7 are electrically connected to the substrate 1 by welding gold wires 8. In step S2, the height of the dam rubber ring 2 is higher than the height of the highest point of the gold wire 8, and in step S3, the phosphor glue 3 covers the gold wire 8; or, when the LED chip 7 adopts a flip chip, in step S2, the height of the dam rubber ring 2 is at least 150um higher than the height of the LED chip 7, and in step S3, the upper surface of the phosphor glue 3 is at least 100um higher than the height of the LED chip 7. There are requirements for the height of the dam rubber ring 2. For the packaging of the front chip, the height of the first dam rubber ring 2 is required to be higher than the highest point of the gold wire, and for the flip chip, the height of the first dam rubber ring 2 is required to be at least 150um higher than the height of the chip, so as to ensure that the phosphor glue surrounded by the dam rubber ring 2 can cover all five light-emitting surfaces of the chip well. In addition, the width of the dam rubber ring 2 is not less than 0.8 mm. Only a wider first dam rubber ring 2 can have a good effect on the setting of the subsequent structure. The preferred width is greater than 1 mm. The wider dam rubber ring 2 can better block the impurities and water vapor that penetrate laterally. At the same time, the wider dam has a greater tolerance rate to ensure that the subsequent isolation glue can completely cover the connection between the phosphor glue and the dam rubber ring 2, thereby ensuring the coverage of the isolation glue by the second dam.

[0048] In more detail, this embodiment adopts the following control method to improve product quality:

[0049] In step S2, the heating temperature range is 90-150°C, and the heating curing time is 10-30 minutes, so that the dam rubber ring 2 is in a shape-stable and uncured state. Pre-curing requires that the dam glue does not flow and is not viscous, and reaches a basically stable state in shape, but is not completely cured, and the cross-linking reaction of the organic polymer is not complete. One is to facilitate the complete connection between the dam rubber ring 2 and the covering rubber ring 5, and the other is also conducive to accelerating production efficiency.

[0050] In step S3, the heating temperature range is 90-120°C, and the heating curing time is 10-30 minutes, so that the phosphor glue 3 is fixed. After pre-curing, the glue does not flow and is not viscous, which is also basically formed. First, it ensures that the subsequent multiple layers of glue are not layered, and secondly, it ensures that the phosphor particles do not move, so as to ensure the light consistency of the product.

[0051] In step S4, rapid curing is then performed at a curing temperature range of 90-120°C and a curing time of 5-10 minutes to cure the isolation adhesive layer 4. Here, the isolation adhesive and the phosphor adhesive system are different and cannot be cured for a long time.

[0052] In step S5, the heating temperature range is 90-150°C, and the heating curing time is 10-30 minutes, so that the cover rubber ring 5 is in a shape-stable, uncured state. In step S6, the heating temperature range is 90-150°C, and the heating curing time is greater than or equal to 1 hour, so that the dam rubber ring 2, the phosphor glue 3, the isolation glue layer 4, the cover rubber ring 5 and the packaging glue 6 are fully cured. Of course, if step S6 is cancelled in order to save the process, then in step S5, the heat curing time can be extended to greater than or equal to 1 hour.

[0053] In step S3, the phosphor glue 3 is dotted into the crystal bonding groove 20 until the phosphor glue 3 fills the crystal bonding groove 20, and a centrifugal powder sedimentation process is used to make the phosphor particles in the phosphor glue 3 sink to the bottom of the phosphor glue 3. The centrifugal powder sedimentation process refers to the process of using the centrifugal force generated by the high-speed rotation of the centrifuge to evenly distribute and settle the phosphor particles in the glue.

[0054] This solution has the following advantages: First, the silicone commonly used in traditional COB light source packaging LEDs has good temperature resistance and is relatively soft, but it is breathable, which is not conducive to maintaining the service life of chips and packaging devices. Therefore, a structure with silicone in the front and silicone resin in the back appears, because silicone resin has relatively better air tightness, but silicone resin and silicone have different molecular structures. After baking and molding, there will be a certain interface between the two. The two thicker colloids are easy to delaminate under the high temperature during operation, resulting in failure. Therefore, this solution introduces a thin highly waterproof and sulfur-chlorine-proof isolation adhesive layer with a thickness of no more than 50um. In this way, the multi-layer structure with different molecular structures is not prone to failure problems such as delamination because the middle layer is relatively thin and the interface stress is relatively small. Secondly, due to the large width of the dam rubber ring, it has good isolation to the side water vapor. The isolation adhesive layer is arranged between the dam rubber ring and the upper and lower dams of the cover rubber ring. It is a structure that completely covers the phosphor glue to improve the sealing. Otherwise, it is easy to penetrate at the interface of the packaging glue, the phosphor glue and the dam rubber ring. Therefore, it is necessary to use the dam glue in combination with the isolation glue for effective sealing. Generally, the dam rubber ring, the cover rubber ring and the phosphor glue need to be baked at about 150°C for more than 1 hour or even longer to completely complete the molecular cross-linking reaction. However, if the entire colloid is completely cross-linked, there will be no available chemical bonds on the surface for the subsequent glue to achieve stable connection. Therefore, we considered the characteristics of the glue and preformed different glues at a temperature of more than 10 minutes and above 100°C. This glue is not fully cross-linked, but has no fluidity. It can not only be used for process operation, but also facilitates the one-time curing after the subsequent multi-layer colloid is set.

[0055] Embodiment 2:

[0056] This embodiment provides a highly airtight COB light source structure, such as Figure 6As shown, the difference from the first embodiment is that this embodiment is a preferred implementation mode. Figure 5 As shown, in terms of structure, a groove 21 is formed on the top of the dam rubber ring 2 , the edge of the isolation rubber layer 4 extends into the groove 21 , and the bottom of the covering rubber ring 5 is embedded in the groove 21 .

[0057] In this embodiment, if Figure 6 As shown, before step S4, a groove 21 is first opened on the top of the dam rubber ring 2, wherein the method for opening the groove 21 can be by cutting, that is, using a tool to groove the top of the dam rubber ring 2, or by pressing grooves, that is, using an annular grooving mold, the shape of the grooving mold matches the shape of the dam rubber ring 2, and the groove pressing mold presses the groove 21 downward on the dam rubber ring 2; in step S4, isolation glue is sprayed on the upper surface of the phosphor glue 3 and the top of the dam rubber ring 2, so that the glue at the edge of the area where the isolation glue is sprayed flows into the groove 21, and after heating and curing to form an isolation glue layer 4, the edge of the isolation glue layer 4 extends into the groove 21; in step S5, glue is dispensed with the groove 21 at the top of the dam rubber ring 2 as the center, so that the glue dots are connected into a circle to cover the rubber ring 5. After curing, the above structure can form a stable and sealed structure that allows the edges of the isolation rubber layer 4 and the dam rubber ring 2, the edges of the isolation rubber layer 4 and the covering rubber ring 5, and the dam rubber ring 2 and the covering rubber ring 5 to interlock with each other, and there will be no problem of loose sealing at the joints during long-term use.

[0058] The above is only an embodiment of the present invention, and the common knowledge such as the known specific structure and characteristics in the scheme is not described in detail here. It should be pointed out that for those skilled in the art, several deformations and improvements can be made without departing from the structure of the present invention, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A highly airtight COB light source structure, characterized in that: The invention comprises a substrate (1), wherein the upper surface of the substrate (1) is provided with a circle of dam rubber ring (2), wherein the dam rubber ring (2) surrounds a crystal fixing groove (20), wherein the substrate (1) is provided with a plurality of LED chips (7) in the crystal fixing groove (20), wherein the substrate (1) is filled with fluorescent powder glue (3) in the crystal fixing groove (20) so that the fluorescent powder glue (3) wraps the LED chips (7), wherein the upper surface of the fluorescent powder glue (3) is covered with a layer of isolation glue layer (4), and a circle of covering rubber ring (5) is provided at the connection between the isolation glue layer (4) and the dam rubber ring (2).

2. The high airtight COB light source structure according to claim 1, characterized in that: The covering rubber ring (5) and the upper surface of the isolation rubber layer (4) form a packaging groove (50), and the packaging groove (50) is filled with packaging glue (6).

3. The high airtight COB light source structure according to claim 2, characterized in that: The packaging glue (6) is made of low-refractive-index silica gel or high-refractive-index packaging silicone resin.

4. The high airtight COB light source structure according to claim 1, characterized in that: Some LED chips (7) are electrically connected to each other by welding gold wires (8), and some LED chips (7) and substrates (1) are also electrically connected by welding gold wires (8). The top of the dam rubber ring (2) is higher than the top of the gold wire (8), and the phosphor glue (3) covers the gold wire (8).

5. The high airtight COB light source structure according to claim 1, characterized in that: The fluorescent powder glue (3) is made of organic silica gel.

6. A method for manufacturing a high-airtight COB light source structure, used to manufacture the high-airtight COB light source structure according to claim 1, characterized in that: The following steps are involved: S1, arranging a plurality of LED chips (7) in a light source area on the upper surface of a substrate (1); S2, a dam rubber ring (2) surrounding the light source area is arranged on the upper surface of the substrate (1), and pre-cured by heating to form a crystal fixing groove (20) in the light source area; S3, filling the phosphor glue (3) in the crystal bonding groove (20), and heating for pre-curing; S4, spraying an isolation glue on the upper surface of the phosphor glue (3) and the top of the dam rubber ring (2), heating and curing to form an isolation glue layer (4), so that the isolation glue layer (4) covers the entire upper surface of the phosphor glue (3) and the top of the dam rubber ring (2); S5. A circle of covering rubber ring (5) is arranged at the connection gap between the isolation rubber layer (4) and the dam rubber ring (2), and heated for pre-curing.

7. The method for manufacturing a high airtight COB light source structure according to claim 6, characterized in that: The covering rubber ring (5) and the upper surface of the isolation rubber layer (4) form a packaging groove (50), and the packaging groove (50) is filled with packaging glue (6). After step S5, the following steps are also included: S6, filling the packaging groove (50) with packaging glue (6), and heating until it is completely cured.

8. The method for manufacturing a high airtight COB light source structure according to claim 6, characterized in that: The LED chip (7) is a front-mounted chip, some of the LED chips (7) are electrically connected to each other by welding gold wires (8), and some of the LED chips (7) and the substrate (1) are also electrically connected by welding gold wires (8). In step S2, the height of the dam rubber ring (2) is higher than the height of the highest point of the gold wire (8), and in step S3, the phosphor glue (3) covers the gold wire (8); Alternatively, the LED chip (7) is a flip chip, and in step S2, the height of the dam rubber ring (2) is at least 150 um higher than the height of the LED chip (7), and in step S3, the upper surface of the phosphor glue (3) is at least 100 um higher than the height of the LED chip (7).

9. The method for manufacturing a high airtight COB light source structure according to claim 7, characterized in that: In step S2, the heating temperature range is 90-150° C., and the heating curing time is 10-30 minutes, so that the dam rubber ring (2) is in a shape-stable and uncured state. In step S3, the heating temperature range is 90-120° C., and the heating curing time is 10-30 minutes, so that the phosphor glue (3) is fixed. In step S4, the curing temperature range is 90-120° C., and the curing time is 5-10 minutes, so that the isolation glue layer (4) is cured. In step S5, the heating temperature range is 90-150° C., and the heating curing time is 10-30 minutes, so that the cover rubber ring (5) is in a shape-stable and uncured state. In step S6, the heating temperature range is 90-150° C., and the heating curing time is greater than or equal to 1 hour, so that the dam rubber ring (2), the phosphor glue (3), the isolation glue layer (4), the cover rubber ring (5) and the packaging glue (6) are fully cured.

10. The method for manufacturing a high airtight COB light source structure according to claim 7, characterized in that: In step S3, the phosphor glue (3) is dotted into the crystal-fixing groove (20) until the phosphor glue (3) fills the crystal-fixing groove (20), and a centrifugal powder sedimentation process is used to make the phosphor particles in the phosphor glue (3) sink to the bottom of the phosphor glue (3).

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