Electrical connection device

Abstract

[Problem] To improve the electrical contact of a probe with respect to an electrode terminal of an object to be inspected, the flatness of a substrate on which a plurality of probes are mounted can be adjusted. [Solution] This electrical connection device is provided with: a wiring board that is electrically connected to an inspection device side; a probe substrate provided on the lower surface side of the wiring substrate, the probe substrate having one or a plurality of probe mounting parts on which a plurality of probes electrically contacting the corresponding electrode terminals are mounted for each electrode terminal of an object to be inspected having one or a plurality of electrode terminals; and a cover member, which is a member for adjusting the flatness of the probe substrate, and which has at least one or a plurality of flatness adjustment mechanisms provided corresponding to each of the probe mounting portions of the probe substrate.

Description

Technical Field

[0001] The present invention relates to an electrical connection device, and can be suitably used, for example, in an electrical connection device used in a power-on test of a semiconductor integrated circuit. Background Art

[0002] In the electrical inspection of the semiconductor integrated circuit (the object to be inspected) on the semiconductor wafer, an inspection device (tester) is used in which a probe card having a plurality of probes (electrical contacts) is mounted on a test head. Then, the electrode terminals of the semiconductor integrated circuit are brought into electrical contact with the probes, and the tester supplies an electrical signal to the semiconductor integrated circuit via the probes, or the semiconductor integrated circuit outputs to the tester side via the probes, thereby conducting an electrical inspection of the semiconductor integrated circuit.

[0003] There are various types of probe cards, and one of them is the probe card described in Patent Document 1. Fig. 9 Here, for the sake of convenience, the probe card is used. Fig. 9 The structure of a conventional probe card 100 will be described.

[0004] Fig. 9 The probe card 100 includes a wiring substrate 11 and a multilayer wiring substrate 12 having a plurality of probes on the lower side of the wiring substrate 11, and the wiring substrate 11 and the multilayer wiring substrate 12 are bonded by a large number of bonding members (solder balls) 31. In addition, a reinforcing member 13 and a cover member 94 are provided on the upper surface of the wiring substrate 11 of the probe card 100, and a block member 95 is provided at a position corresponding to the probe pad area 121 of the multilayer wiring substrate 12 in order to support the load of the probes. Prior art literature Patent Literature

[0005] Patent Document 1: International Publication No. 2019 / 021749 Summary of the invention Problem that the invention aims to solve

[0006] However, when the multilayer wiring substrate 12 and the wiring substrate 11 are joined by the joining member 31, warping may occur on the multilayer wiring substrate 12 due to heating. In addition, the multilayer wiring substrate 12 may be joined to the wiring substrate 11 in an inclined state. In such a case, since the height of the probe mounted on the probe pad area of ​​the multilayer wiring substrate 12 varies, the probe may not be properly contacted with the electrode terminal.

[0007] Therefore, in order to improve the electrical contact between the probes and the electrode terminals of the test object, an electrical connection device capable of adjusting the flatness of a substrate (eg, a multilayer wiring substrate) on which a plurality of probes are mounted is required. Technical means of solving problems

[0008] In order to solve the above-mentioned problems, the electrical connection device of the present invention is characterized in that it comprises: (1) a wiring substrate, which is electrically connected to the inspection device side; (2) a probe substrate, which is arranged on the lower surface side of the wiring substrate, and the probe substrate has one or more probe mounting parts, and the probe mounting parts are equipped with a plurality of probes that are electrically in contact with the corresponding electrode terminals for each electrode terminal of the inspected object having one or more electrode terminals; (3) a cover member, which is a member for adjusting the flatness of the probe substrate, and has at least one or more flatness adjustment mechanisms arranged corresponding to each probe mounting part of the probe substrate. Effects of the Invention

[0009] According to the present invention, in order to improve the electrical contact between the probes and the electrode terminals of the inspection object, it is possible to adjust the flatness of the substrate on which the plurality of probes are mounted. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a diagram schematically showing the main structure of the electrical connecting device according to the embodiment. Figure 2 It is a top view of the electrical connection device according to the embodiment. Figure 3 It is a bottom view of the electrical connecting device according to the embodiment. Figure 4 It is a structural diagram showing the structure of a multilayer wiring substrate provided on the lower surface of the wiring substrate according to the embodiment. Figure 5 It is a figure which shows the arrangement|positioning of the pressing head 22 on the wiring board which concerns on embodiment. Figure 6 It is a structural diagram showing the upper surface of the cover member according to the embodiment. Figure 7 This is a perspective structural diagram when the indenter according to the embodiment is viewed from the bottom. FIG. 8 is a diagram that visualizes the results of measuring the flatness of a multilayer wiring board in the embodiment. Fig. 9 It is a diagram schematically showing the structure of a conventional electrical connecting device. Fig.10 It is a structural diagram (part 1) showing the structure of the indenter according to a modified embodiment. Fig.11 This is a structural diagram (part 2) showing the structure of the indenter according to a modified embodiment. DETAILED DESCRIPTION

[0011] (A) Implementation Method Hereinafter, embodiments of the electrical connecting device according to the present invention will be described in detail with reference to the accompanying drawings.

[0012] In this embodiment, a plurality of semiconductor integrated circuits formed on a semiconductor wafer are used as the objects to be inspected, and the electrical connection device of the present invention is applied to a probe card used in an inspection device for inspecting electrical characteristics of such objects to be inspected.

[0013] "Flatness" generally refers to the size of the deviation from the geometrically correct plane of a planar shape. That is, flatness is a numerical value indicating the smoothness (uniformity) of a plane, and is a value indicating the degree to which a surface should be correctly flat. For example, the value of the upper and lower distances between the plane containing the most convex part of a planar shape and the plane containing the most concave part can be used as flatness. For example, in the present disclosure, "flatness" includes not only the overall flatness of the probe substrate, but also the flatness of a portion of the probe substrate where multiple probes are arranged (e.g., the probe area).

[0014] (A-1) Configuration of Embodiment Figure 1 It is a diagram schematically showing the main structure of the electrical connecting device according to the embodiment. Figure 2 is a top view of the electrical connection device, Figure 3 It is a bottom view of the electrical connection device.

[0015] exist Figure 1 to Figure 3 In the embodiment, the electrical connection device 10 includes a wiring substrate 11 , a multilayer wiring substrate 12 , a reinforcing member 13 , and a cover member 14 having a flatness adjustment mechanism 20 .

[0016] The electrical connection device 10 is provided in a test head of an inspection device when performing electrical inspection on a plurality of inspection objects 43 formed on a semiconductor wafer. The multilayer wiring substrate 12 of the electrical connection device 10 has a plurality of electrical contacts (probes). When performing electrical inspection, each probe of the electrical connection device 10 is brought into electrical contact with a corresponding electrode terminal of the inspection object 43, and the inspection device performs electrical inspection on the inspection object 43.

[0017] The object to be inspected 43 is placed on the upper surface of the chuck 42 holding the wafer and is held by the chuck 42. The chuck 42 is connected to, for example, an inspection stage 41 of a multi-axis stage, and the position of the object to be inspected 43 held on the chuck 42 can be adjusted by driving the inspection stage 41.

[0018] [Multilayer wiring board 12] The multilayer wiring substrate 12 is a probe substrate on which a plurality of electric contacts (probes) are mounted.

[0019] The multilayer wiring substrate 12 is bonded to the central portion of the lower surface of the wiring substrate 11 by a large number of bonding members 31 such as solder balls. The multilayer wiring substrate 12 is a substantially square substrate formed of an electrical insulating material such as a polyimide resin. In order to enable fine wiring, the multilayer wiring substrate 12 can use, for example, a substrate using a resin as an MLO (Multi-Layer Organic) base material.

[0020] A probe pad area 121 capable of mounting a plurality of probes is formed on the lower surface of the multilayer wiring substrate 12, and a plurality of wiring paths are formed inside the multilayer wiring substrate 12. The wiring paths of the multilayer wiring substrate 12 connect the probes of the probe pad area 121 and the connection terminals provided on the multilayer wiring substrate 12 and connected to the wiring substrate 11.

[0021] The probe pad area 121 can be used to install a plurality of probes for each target device (DUT: Device Under Test) as the object to be inspected 43. Figure 3 In the example, a case where six probe pad areas 121 are formed on a multilayer wiring substrate 12 is illustrated. Among them, there are six DUTs as the test objects 43, and in order to make multiple probes electrically contact each DUT, each probe pad area 121 is configured to be located at the position of the corresponding DUT. In this way, the probe pad area 121 is configured at the position of the corresponding DUT, and the multiple probes of each probe pad area 121 are configured to be able to electrically contact the corresponding DUT. In addition, the probe pad area 121 is also called a probe board.

[0022] In addition, Figure 3 In the example, the multilayer wiring substrate 12 has six probe pad regions 121, but the number of probe pad regions 121 is not limited thereto. Since the probe pad region 121 is provided for each DUT, the number of probe pad regions 121 provided is the same as that of the DUTs.

[0023] [Wiring board 11] The wiring substrate 11 is a substrate for transmitting and receiving electric signals and connected to a test head of a tester. There are a plurality of electrodes on the upper surface of the wiring substrate 11, and the test head is connected via the electrodes on the upper surface of the wiring substrate 11. A wiring pattern is formed on the lower surface of the wiring substrate 11, and the wiring pattern is connected to the multilayer wiring substrate 12. Furthermore, a wiring path is formed inside the wiring substrate 11 to connect the terminals on the upper surface of the wiring substrate 11 and the terminals on the lower surface of the wiring substrate 11. Therefore, the wiring substrate 11 has a structure that enables the terminals on the upper surface to be electrically connected to the terminals on the lower surface via the internal wiring path.

[0024] In order to suppress deformation of the wiring substrate 11 , a reinforcing member 13 and a cover member 14 having a flatness adjustment mechanism 20 are arranged on the upper surface of the wiring substrate 11 .

[0025] In order to assemble the reinforcing member 13 on the wiring substrate 11, the wiring substrate 11 and the reinforcing member 13 are provided with through holes 531 and 532 such as screw holes that engage with the fixing member 53, respectively. During assembly, the through holes 531 of the wiring substrate 11 and the through holes 532 of the reinforcing member 13 are aligned, and the fixing members 53 such as screws are inserted into the through holes 531 and 532 and coupled, thereby enabling fixing.

[0026] [Reinforcement member 13] The reinforcing member 13 is a member attached to the upper surface side of the wiring substrate 11 in order to suppress deformation such as deflection of the wiring substrate 11. The reinforcing member 13 is also called a stiffener.

[0027] The reinforcing member 13 is a member having a thickness in the Z direction. The reinforcing member 13 may take various shapes, but in this embodiment, for example, Figure 3 As shown, the reinforcing member 13 has an annular portion and a plurality of radial portions extending radially from the center of the annular portion toward the annular portion. Further, the plurality of radial portions have four inner radial portions extending radially from the center of the annular portion toward the annular portion and eight outer radial portions extending radially from the annular portion to the outside.

[0028] In addition, since the cover member 14 described later is provided at the central portion of the reinforcing member 13, a square frame connected to the square cover member 14 is provided. Figure 3 Shape shown.

[0029] [Cover member 14] The cover member 14 is a member mounted on the upper side of the reinforcing member 13. The cover member 14 is a member detachable from the reinforcing member 13.

[0030] In addition, the cover member 14 has a flatness adjustment mechanism 20, which adjusts the flatness of the multilayer wiring board 12 located on the lower surface of the wiring board 11. In addition, the cover member 14 also has a function of supporting the load when the probe provided on the multilayer wiring board 12 contacts (when the probe contacts the electrode terminal of the inspection object 43).

[0031] like Figure 2 As shown, cover member 14 is a square plate-like member disposed in the center of wiring substrate 11. The size of square cover member 14 is slightly larger than the size of multilayer wiring substrate 12 on the lower surface of wiring substrate 11. In addition, the shape of cover member 14 is not limited to a square.

[0032] In order to assemble the cover member 14 to the reinforcement member 13, the reinforcement member 13 and the cover member 14 respectively have a through hole 511 such as a threaded hole and a through hole 512. During assembly, the through hole 511 of the reinforcement member 13 can be aligned with the position of the cover member 14 and the through hole 512, and a fixing member 51 such as a screw can be inserted into the through hole 511 and the through hole 512 for fixing.

[0033] [Flatness adjustment mechanism 20] The flatness adjustment mechanism 20 of the cover member 14 is used to adjust the flatness of the multilayer wiring substrate 12 on the lower surface of the wiring substrate 11 .

[0034] In the prior art, when the multilayer wiring substrate 12 is mounted on the lower surface of the wiring substrate 11, a large number of bonding members 31 such as solder balls are arranged at the central portion of the lower surface of the wiring substrate 11, and the multilayer wiring substrate 12 is placed on these large number of bonding members 31 to be bonded thereto. When the multilayer wiring substrate 12 is bonded by the bonding members 31 such as solder balls, heat is applied, so warping sometimes occurs on the multilayer wiring substrate 12. In addition, depending on the multilayer wiring substrate 12, the substrate sometimes warps even before bonding.

[0035] After being bonded to the wiring substrate 11, if the multilayer wiring substrate 12 with warped substrate and poor flatness is used for inspection, the tip positions of the plurality of electrical contacts (probes) may deviate (i.e., the heights of the probes may deviate), and the contact of the probes with respect to the electrode terminals of the inspected object 43 may be poor. This may also affect the accuracy of the electrical inspection of the inspected object 43.

[0036] Therefore, in the present embodiment, the cover member 14 is provided with a flatness adjustment mechanism 20 for adjusting the flatness of the multilayer wiring substrate 12 .

[0037] After the multilayer wiring substrate 12 is bonded to the lower surface of the wiring substrate 11, the flatness adjustment mechanism 20 applies a concentrated load to the multilayer wiring substrate 12 through the wiring substrate 11 to correct the warping. As a result, the warping of the wiring substrate 11 and the multilayer wiring substrate 12 can be suppressed, and the deviation of the tip positions of the plurality of probes can be suppressed. As a result, the contact of the probes with respect to the electrode terminals of the object to be inspected 43 can be improved, and the electrical inspection of the object to be inspected 43 can also be made high-precision.

[0038] The flatness adjustment mechanism 20 of the cover member 14 includes: one or more pressing heads 22 for applying a load to the multilayer wiring substrate 12 via the wiring substrate 11 ; and an adjustment member 21 for adjusting the load of each of the one or more pressing heads 22 .

[0039] The pressing head 22 is a contact member placed on the upper surface of the wiring substrate 11. The pressing head 22 is a member that receives the load adjustment by the adjusting member 21 and applies a load to the wiring substrate 11 and the multilayer wiring substrate 12. That is, the adjusting member 21 adjusts the pressing amount of the pressing head 22 according to the degree of warping of the wiring substrate 11 and the multilayer wiring substrate 12, and the pressing head 22 applies a load corresponding to the pressing amount adjusted by the adjusting member 21 to the wiring substrate 11 and the multilayer wiring substrate 12. By changing the magnitude of the load, the substrates of the wiring substrate 11 and the multilayer wiring substrate 12 are deformed, and the warping is corrected.

[0040] The position where the pressing head 22 is provided is preferably a position where the planarity of the wiring substrate 11 and the multilayer wiring substrate 12 is improved and / or a position where the contact property between the probe and the DUT can be improved.

[0041] For example, the pressure head 22 is arranged at a position corresponding to the position of the center portion of the multilayer wiring substrate 12 (for example, the center of gravity position) and at a position corresponding to the position of the center portion of each probe pad area 121. As in the former, by arranging the pressure head 22 at a position corresponding to the center portion of the multilayer wiring substrate 12, the multilayer wiring substrate 12 to be balanced can be supported at the center portion. In addition, as in the latter, by arranging the pressure head 22 at a position corresponding to the position of the probe pad area 121 (in other words, the pressure head 22 is provided on each DUT of the test object 43), the pressure head 22 can apply a load to the corresponding probe pad area 121, so that the control of the flatness can be stabilized and the contact of the probe to the DUT can be improved.

[0042] For example, Figure 2 and Figure 3 As shown, when the object under test 43 has 6 DUTs and the multilayer wiring substrate 12 has 6 probe pad areas 121, one indenter 22 arranged in the central portion of the multilayer wiring substrate 12 and six indenters 22 arranged at respective positions for the 6 probe pad areas 121 are combined, and a total of 7 indenters 22 are set.

[0043] The indenter 22 has various shapes (types) such as a flat cylindrical indenter, a flat prism indenter, a spherical indenter, and a conical indenter, but any indenter can be used as long as it can apply a load to the multilayer wiring substrate 12 via the wiring substrate 11. In this embodiment, the indenter 22 is provided in order to apply a substantially uniform load on the surface of the probe pad region 121. In addition, the material of the indenter 22 is not particularly limited.

[0044] The adjustment member 21 adjusts the amount of pressure of the corresponding pressing head 22. The adjustment member 21 is provided for each pressing head 22. The adjustment member 21 fixes the upper part of the pressing head 22 and adjusts the amount of pressure of the pressing head 22 in the up and down direction. For example, a clamping screw or a screw can be used. For example, when a clamping screw or a screw is used as the adjustment member 21, it is possible to adjust how much pressure load can be applied to the pressing head 22 with how much rotation amount.

[0045] [Positioning of the Press Head 22 in the Flatness Adjustment Mechanism 20] Next, the positioning of the pressing head 22 in the flatness adjustment mechanism 20 of the cover member 14 will be described.

[0046] Figure 4 1 is a structural diagram showing the structure of the multilayer wiring substrate 12 on the lower surface of the wiring substrate 11 . Figure 5 1 is a diagram showing the arrangement of the pressing head 22 on the wiring substrate 11 . Figure 6 It is a diagram showing the structure of the upper surface of the cover member 14 according to the embodiment.

[0047] Here, it is assumed that the device under test 43 has 6 DUTs. Figure 4 As shown, the multilayer wiring board 12 has six probe pad regions 121 (121a to 121f). When referring to a specific probe pad region 121, the probe pad region 121 is represented as a probe pad region 121a or the like.

[0048] The pressure head 22 is used as Figure 7 Flat prismatic indenter shown. Figure 7 This is a perspective view of the configuration when the indenter 22 is viewed from the bottom. In addition, regarding the indenter 22, when a specific indenter 22 is shown, it is shown as an indenter 22a or the like.

[0049] exist Figure 7 In FIG. 2 , the pressing head 22 ( 22 a to 22 g ) includes a pressure receiving portion 222 that receives the pressing pressure from the adjustment member 21 and a flat prism-shaped contact portion 221 that applies a load to the wiring substrate 11 and the multilayer wiring substrate 12 .

[0050] The shape of the contact portion 221 contacting the wiring substrate 11 is the same as that of the probe pad area 121, and the size of the contact portion 221 is also the same as that of the probe pad area 121. Thus, a load can be reliably applied to the probe pad area 121, and as a result, the contactability of the probe to the electrode terminal of the object under test 43 can be improved.

[0051] Furthermore, when the pressing head 22 applies a load to the wiring substrate 11 and the multilayer wiring substrate 12 , the tip of the contact portion 221 of the pressing head 22 is flattened to disperse the load in order to avoid damage to the wiring substrate 11 and the multilayer wiring substrate 12 .

[0052] An example of the arrangement of the pressure head 22 will be described. In this example, Figure 5 As shown, one of the seven pressing heads 22g is arranged at a position corresponding to the position of the center portion (i.e., the position of the center of gravity) of the multilayer wiring substrate 12 to maintain balance. In addition, the remaining six pressing heads 22a to 22f are arranged at positions corresponding to the positions of the center portions of the six probe pad areas 121a to 121f of the multilayer wiring substrate 12, respectively.

[0053] like Figure 6 As shown, the cover member 14 has an adjustment hole 211 such as a screw hole for receiving the adjustment member 21 and two positioning holes 23 for each of the pressing heads 22 ( 22 a to 22 g ).

[0054] In order to align the positions of the respective pressing heads 22, the positions of the respective positioning holes 23 of the cover member 14 and the corresponding positioning holes 24 of the pressing heads 22 are aligned, and fixing members such as screws are inserted into the positioning holes 23 of the cover member 14 and the positioning holes 23 of the pressing heads 22. In this way, the positions of the respective pressing heads 22 are aligned. In addition, as long as the positioning of the pressing heads 22 can be performed, the number of the positioning holes 24 and the positioning holes 23 is not limited to two, and may be one or more than three.

[0055] When adjusting the magnitude of the load applied by the pressing head 22 , the adjusting member 21 is inserted into the adjusting hole 211 of the cover member 14 .

[0056] Here, regarding the positioning of the pressing head 22, in order to enable the contact portion 221 of the pressing head 22 to apply a target load to the wiring substrate 11 and the multilayer wiring substrate 12, the top end portion (lower end portion) of the adjustment member 21 is abutted against the central portion of the pressure-bearing portion 222 of the pressing head 22 (i.e., a position equivalent to the center position of the contact portion 221).

[0057] [Flatness Adjustment Method Using Flatness Adjustment Mechanism 20] Next, a method of adjusting the flatness using the flatness adjustment mechanism 20 of the cover member 14 will be described.

[0058] Here, it is assumed that the multilayer wiring substrate 12 is bonded to the lower surface of the wiring substrate 11 by using a large number of bonding members 31 such as solder balls. A plurality of probes are mounted on each probe pad area 121 of the multilayer wiring substrate 12, and in a state where necessary electronic components are provided on the wiring substrate 11, it is assumed that the reinforcing member 13 is mounted on the upper side of the wiring substrate 11. Then, the flatness adjustment mechanism 20 is aligned, and the cover member 14 is mounted on the reinforcing member 13.

[0059] In this state, the flatness of the multilayer wiring substrate 12 bonded to the wiring substrate 11 is measured, and while judging whether the measured flatness value is below the target value, the flatness is adjusted using the flatness adjustment mechanism 20. In addition, the flatness measurement method is to measure the flatness of the multilayer wiring substrate 12 using an existing flatness measurement machine.

[0060] More specifically, for example, in the multilayer wiring board 12, the flatness values ​​of a plurality of arbitrary points in the substrate area of ​​a certain probe pad area 121 are measured, and the pad average value of the flatness value is calculated. Furthermore, the flatness is measured on the entire substrate of the multilayer wiring board 12, and the value with the largest deviation is taken as the maximum value. Then, adjustment is performed so that the difference between the maximum value and the area average value becomes less than the target value.

[0061] FIG. 8 is a diagram visualizing the results of measuring the flatness of the multilayer wiring board 12 . Fig. 8A : represents the flatness of the multilayer wiring substrate 12 before adjustment by the flatness adjustment mechanism 20, Figure 8B The flatness of the multilayer wiring board 12 after adjustment is shown.

[0062] exist Fig. 8A If the overall flatness of the multilayer wiring substrate 12 before adjustment is observed, it can be seen that the differential value near the right end (the differential value between the above-mentioned maximum value and the regional average value) is greater than the differential value from the center to the left.

[0063] Therefore, in order to correct the warping of the entire multilayer wiring board 12, for example, Figure 8B As shown, the flatness adjustment mechanism 20 is provided and used with respect to the probe pad areas 121c and 121f existing on the left side of the multilayer wiring substrate 12. That is, in order to increase the load of the pressing heads 22c and 22f on the probe pad areas 121c and 121f, the pushing amount of the respective adjustment members 21 of the pressing heads 22c and 22f is adjusted to be larger.

[0064] Thus, the pressure heads 22c and 22f apply a large load to the left side of the multilayer wiring substrate 12, thereby deforming the multilayer wiring substrate 12, suppressing the warping of the entire substrate, and reducing the flatness value of the entire substrate (see Figure 8B ).

[0065] In addition, comparison Fig. 8A The difference in height of the probes provided on the multilayer wiring substrate 12 before adjustment (the deviation in the height of the probes) and Figure 8B The difference in the height of the probes set on the multilayer wiring substrate 12 after adjustment can be confirmed. Figure 8B The difference ratio of the adjusted probe height Fig. 8A The difference in probe height before adjustment becomes smaller.

[0066] (A-2) Effects of Implementation As described above, according to this embodiment, since the cover member 14 has the flatness adjustment mechanism 20 capable of applying a plurality of concentrated loads to the multilayer wiring substrate 12 , the flatness value of the multilayer wiring substrate 12 can be adjusted.

[0067] As a result, the positions of the tips of the plurality of probes provided on the multilayer wiring board 12 can be aligned, so that the contact property with the terminal (DUT) of the device under test 43 can be improved, thereby improving the inspection accuracy.

[0068] According to this embodiment, the cover member 14 is detachable from the reinforcing member 13 . Therefore, as long as the cover member 14 having the flatness adjustment mechanism 20 can be mounted, it can be installed on the reinforcing member 13 having various shapes.

[0069] (B) Other Implementation Methods Although various modified examples of the present invention have been described in the above-mentioned first embodiment, the present invention is also applicable to the following modified embodiments.

[0070] (B-1) In the first embodiment described above, the shape of the contact portion 221 of the indenter 22 corresponds to the shape of the corresponding probe pad region 121. However, the shape of the contact portion 221 of the indenter 22 is not limited thereto.

[0071] For example, a plurality of electronic components 6 such as capacitors are generally provided on the upper surface of the wiring substrate 11. Therefore, the electronic component 6 may be present at a position corresponding to the probe pad area 121 on the upper surface of the wiring substrate 11 where the pressure head 22 is arranged. In this way, the pressure head 22 and the electronic component 6 may collide with each other. Therefore, the pressure head 22 can be made to avoid the collision with the electronic component 6 on the wiring substrate 11, so that the pressure head 22 can apply a load to the wiring substrate 11 and the probe pad area 121 of the multilayer wiring substrate 12.

[0072] For example, Fig.10 As shown in (B), in order to avoid the collision with the electronic component 6, a recess (collision avoidance portion) 2211 may be provided in the central portion of the contact portion 221 of the pressure head 22. Fig.10 As shown in (A), the contact portion 221 of the pressure head 22 can avoid the interference with the electronic component 6, and the load can still be applied to the wiring substrate 11 and the multilayer wiring substrate 12. In this case, the flatness of the wiring substrate 11 (the probe pad area where a plurality of probes are arranged) can still be adjusted.

[0073] In addition, as another variation, Fig.11As shown in (B), a recess (collision avoidance portion) 2212 may be provided in a partial region of the contact surface of the contact portion 221 of the pressure head 22 (in this example, a region including the end of the square contact surface of the contact portion 221). In this case, the same effect can be obtained.

[0074] in addition, Fig.10 (B) and Fig.11 (B) illustrates the case where the recesses (interference avoiding portions) 2211 and 2212 are quadrangular prism-shaped recesses, but the shape is not limited as long as it can avoid interference with the electronic component 6, and may be, for example, cylindrical, polygonal, or the like.

[0075] In addition, Fig.10 (B) and Fig.11 In the example (B), a case where one recess 2211 and 2212 is provided on the contact portion 221 of the press head 22 is illustrated, but two or more recesses may be provided. Furthermore, the recesses 2211 and 2212 do not need to be provided on all press heads 22, and the recesses 2211 and 2212 may be provided only on a portion of the press heads 22 that contacts the electronic component 6.

[0076] (B-2) In the first embodiment described above, the cover member 14 is provided on the reinforcing member 13. However, the configuration of the cover member 14 is not limited thereto. For example, the cover member 14 may be provided on the upper surface of the multilayer wiring substrate 12 as long as it can adjust the flatness of the multilayer wiring substrate 12 as the probe substrate (or the flatness of each probe pad region 121 of the multilayer wiring substrate 12). Explanation of symbols

[0077] 10…electrical connecting device, 11…wiring substrate, 12…multilayer wiring substrate, 13…reinforcing member, 14…cover member, 20…flatness adjusting mechanism, 21…adjusting member, 22 (22a~22g)…pressing head, 211…adjusting hole, 221…contact portion, 2211 and 2212…recesses (interference avoiding portion), 222…pressure bearing portion, 23…positioning hole, 24…positioning hole, 31…joining member, 41…inspection stage, 42…chuck, 43…object to be inspected, 51…fixing member, 53…fixing member, 100…probe card, 121 (121a~121f)…probe pad area, 511…through hole, 512…through hole, 531…through hole, 532…through hole.

Claims

1. An electrical connection device, characterized in that: have: a wiring substrate electrically connected to the inspection device side; A probe substrate provided on the lower surface side of the wiring substrate, the probe substrate having one or more probe mounting portions, the probe mounting portion carrying a plurality of probes electrically contacting the corresponding electrode terminal for each electrode terminal of the object to be inspected having one or more electrode terminals; as well as The cover member is a member for adjusting the flatness of the probe substrate, and has at least one or more flatness adjustment mechanisms provided corresponding to the respective probe mounting portions of the probe substrate.

2. The electrical connection device according to claim 1, characterized in that: Each of the flatness adjustment mechanisms has: a contact member placed on an upper surface of the wiring substrate and applying a load to the probe substrate via the wiring substrate; as well as An adjustment member adjusts a load applied by the contact member to the probe substrate.

3. The electrical connection device according to claim 2, characterized in that: The adjustment member adjusts a load of the contact member by adjusting a pressure applied to the contact member on the wiring substrate.

4. The electrical connection device according to claim 2, characterized in that: The contact member has a contact portion that contacts the wiring substrate, and a pressure receiving portion that transmits pressure from the adjustment member to the contact portion. The contact portion has a shape corresponding to that of the probe mounting portion.

5. The electrical connection device according to claim 2, characterized in that: The contact member has a contact portion that contacts the wiring substrate, and a pressure receiving portion that transmits pressure from the adjustment member to the contact portion. The contact portion has an interference avoiding portion for avoiding interference with an electronic component on the wiring substrate.

6. The electrical connection device according to claim 1, characterized in that: A reinforcing member is provided on the upper surface side of the wiring substrate, A space is provided at a central portion of the reinforcing member on the wiring substrate, and the cover member having one or more of the flatness adjustment mechanisms is provided at the central portion of the reinforcing member.

7. The electrical connection device according to claim 1, characterized in that: The cover member having the flatness adjustment mechanism is detachable relative to the reinforcing member.

8. The electrical connection device according to claim 1, characterized in that: The cover member is provided with the flatness adjustment mechanism of each of the probe mounting parts at a position corresponding to each of the probe mounting parts, and is provided with the flatness adjustment mechanism at a position corresponding to the center of gravity position of the probe substrate.

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