Supergrinding thinning grinding wheel and preparation method thereof

Abstract

The invention discloses an ultra-fine grinding thinning grinding wheel and a preparation method thereof.The grinding wheel comprises a grinding wheel base body and tool bit assemblies, a plurality of reserved grooves are formed in the circumferential direction of the grinding wheel base body at equal intervals, and the tool bit assemblies are arranged in the reserved grooves; the tool bit assembly comprises, by volume fraction, 35%-45% of composite abrasive micro powder, 30%-45% of a ceramic bonding agent, 20%-30% of a double-effect pore forming agent, 1%-3% of a filling agent, 1%-2% of a dispersing agent and a temporary bonding agent accounting for 5% of the total weight. Through design optimization of the grinding wheel formula and the preparation method, the better wafer surface quality can be obtained under the ultra-fine grinding and thinning process, and meanwhile, the stability and the long service life of the grinding wheel in the service process are guaranteed; and a composite abrasive material combination and a double-effect pore-forming agent are matched and optimized, so that the optimized superfine abrasive material combination obtains a high-quality grinding and thinning surface, and meanwhile, the stable and long-acting service life is considered.

Description

Technical Field

[0001] The invention relates to the technical field of grinding processing, in particular to a superfine grinding and thinning grinding wheel and a preparation method thereof. Background Art

[0002] Semiconductor wafers are widely used in high-end precision manufacturing industries such as chips and integrated circuits due to their excellent physical and electrical properties. Wafers are prepared from the initial ingot, separated into slices by diamond wire or laser cutting, and then go through a multi-step wafer thinning process, followed by chemical mechanical polishing, and finally cut into independent chips by a dicing machine; wafer thinning, as a key process in chip manufacturing, plays an important role in improving packaging volume and improving the physical and electrical properties of wafers.

[0003] Deficiencies of existing technology: At present, for the existing fine grinding and thinning grinding wheel products, on the one hand, since ultrafine powders are prone to agglomeration during the mixing process, the material dispersion effect is poor, which causes fluctuations in the material removal ability of the grinding wheel during service, resulting in unsatisfactory thinning surface quality. The wear marks or low-consistency surface texture characteristics that are not fully eliminated in this process will directly affect the processing effects of subsequent CMP chemical mechanical polishing and other processes, thereby greatly reducing the quality and yield of wafer products; on the other hand, compared with coarse-grained abrasives, ultrafine abrasives have relatively worse material removal ability and service life indicators, and need to be matched with suitable binders and auxiliary materials. Summary of the invention

[0004] The object of the present invention is to provide a superfine grinding and thinning grinding wheel and a preparation method thereof, so as to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a superfine grinding and thinning grinding wheel, the grinding wheel comprising a grinding wheel base and a cutter head assembly, the grinding wheel base being circumferentially evenly spaced with a plurality of reserved grooves, the cutter head assembly being arranged in the reserved grooves, the cutter head assembly comprising, by volume fraction, 35% to 45% of composite abrasive micropowder, 30% to 45% of ceramic binder, 20% to 30% of dual-effect pore-forming agent, 1% to 3% of filler, 1% to 2% of dispersant and 5% of temporary binder accounting for the total weight.

[0006] Preferably, the composite abrasive powder includes diamond powder and SiC powder, the preferred particle size range is 15000#~30000#, and the mass fraction of the diamond and SiC powder is 6:1~8:1.

[0007] Preferably, the dual-effect pore-forming agent includes polymethyl methacrylate and Al2O3 hollow spheres, the polymethyl methacrylate is selected to have a particle size D50 parameter of 5~8μm or a D90 parameter of 10~15μm, the Al2O3 hollow spheres are selected to have a particle size D50 parameter of 8~10μm and a D90 parameter of 12~15μm, and the volume fraction of the polymethyl methacrylate and the Al2O3 hollow spheres is 10:1~15:1.

[0008] Preferably, the filler includes zinc oxide and molybdenum disulfide, and the mass fraction of the zinc oxide and the molybdenum disulfide is 1:1~1.5:1; the dispersant includes triethanolamine, polycarboxylic acid, and sodium hexametaphosphate; the temporary binder includes paraffin and white lake essence, and the mass fraction of the paraffin and the white lake essence is 1:1~1.5:1.

[0009] The present invention also provides a method for preparing a superfine grinding and thinning grinding wheel, and the preparation method specifically comprises the following steps: S1, pretreatment of raw materials; S2, mixing and processing raw materials; S3, making and bonding the cutter head assembly.

[0010] Preferably, the step S1 specifically includes the following steps: a1. Weigh and feed 30%~45% ceramic binder and 1%~3% filler, use a three-dimensional mixer to mix the components for 15min~20min until they are uniform, and sieve them using a 120#~180# sieve, and sieve them at least twice; a2. Weigh diamond powder and SiC powder in proportion, use a three-dimensional mixer to mix the components for 15-20 minutes until they are uniform, and sieve them using a 120#-180# sieve. The sieving times should be no less than twice. a3. Disperse the sieved diamond micropowder and SiC micropowder in deionized water, and add ethanol and dispersant successively; a4. Use an electric stirrer to stir the mixture, using a dispersed disc stirring paddle, with a stirring head rotating at a speed of 200-500 r / min and a stirring time of 30-40 min; a5. Place the container containing diamond powder and SiC powder in an ultrasonic vibrator, and further disperse the diamond powder and SiC powder through the ultrasonic vibrator. The vibration frequency is 20 kHz and the ultrasonic vibration time is 30 min to 40 min.

[0011] Preferably, the step S2 specifically includes the following steps: b1. Add the sieved ceramic binder and filler mixture into the diamond powder and SiC powder solution and stir them. Use a dispersed disc stirring paddle with a stirring head rotating at a speed of 400-600 r / min for a stirring time of 40-60 min. b2. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 30 to 40 minutes; b3. Add the dual-effect pore-forming agent and temporary binder into the mixed material body and stir them successively. Use a dispersed disc stirring paddle with a stirring head rotating at a speed of 200-500 r / min for a stirring time of 30-40 min. b4. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 40 to 60 minutes; b5. Pour the treated mixture into a stainless steel tray and spread it flat. Place the mixture at room temperature for 24 hours or in a 60°C high temperature oven for 8 hours for drying. b6. Screening is carried out, the sieve should be 180#~240# sieve, and the screening times should be no less than twice.

[0012] Preferably, the step S3 specifically includes the following steps: c1. Weigh the sieved mixed material according to the weight converted from the designed volume of the mold, and the number of weighed materials should be consistent with the number of cutter head components; c2. Put the weighed mixed material into the cleaned mold cavity in portions, cover it with a pressing plate and press it in a press; c3. Demolding and sand-burying the cutter head assembly, placing it in a muffle furnace and sintering it according to the set heating curve; c4. After the cutter head assembly is sandblasted and the grinding wheel base is cleaned, the cutter head assembly is bonded to the reserved groove using an epoxy resin adhesive, and the cutter head assembly spacing is equal and the side faces are perpendicular to the base surface; c5. After bonding, the grinding wheel is used to grind the end face of the cutter head assembly through a surface grinder until the end face is flat and free of burrs.

[0013] Preferably, in step a3, the mass fraction of deionized water and ethanol is 8-10% of the total amount of diamond micropowder and SiC micropowder, and the dispersant is composed of triethanolamine, polycarboxylic acid and sodium hexametaphosphate, and the volume fraction of triethanolamine, polycarboxylic acid and sodium hexametaphosphate is 2:1:1.

[0014] Preferably, the pressure in the step is set to 5MPa-8MPa, and the temperature and pressure are maintained for 1 minute.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The present invention provides an ultrafine grinding and thinning grinding wheel and a preparation method thereof. By optimizing the design of the grinding wheel formula and the preparation method, a better wafer surface quality can be obtained in the ultrafine grinding and thinning process, and the stability and long service life of the grinding wheel can be guaranteed during the service process. In addition, a composite abrasive combination and a dual-effect pore-forming agent are matched and optimized, so that the selected ultrafine abrasive combination can obtain a high-quality grinding and thinning surface, while taking into account a stable and long-term service life.

[0016] The optimal dispersion and mixing process operation sequence is matched to the material components with different characteristics and functions in the mixing process, and the pretreatment methods of different components before mixing are optimized and designed. By improving the dispersion degree of the material, the agglomeration phenomenon of ultrafine powder in the mixing process is improved, and the thinning quality defect problem caused by performance fluctuations of the grinding wheel during service is effectively improved. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] In the description of the present invention, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like, which indicate orientations or positional relationships, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] In the description of this patent, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "setting" should be understood in a broad sense, for example, it can be fixed connection, setting, or detachable connection, setting, or integrated connection, setting. For ordinary technicians in this field, the specific meanings of the above terms in this patent can be understood according to specific circumstances.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0021] Example 1 The present invention provides a superfine grinding and thinning grinding wheel and a preparation method thereof. The grinding wheel comprises a grinding wheel matrix and a cutter head assembly. The grinding wheel matrix is ​​provided with a plurality of reserved grooves arranged at equal intervals in the circumferential direction. The cutter head assembly is arranged in the reserved groove. The cutter head assembly comprises 35% to 45% of composite abrasive micropowder, 30% to 45% of ceramic binder, 20% to 30% of dual-effect pore-forming agent, 1% to 3% of filler, 1% to 2% of dispersant and 5% of temporary binder by volume. The composite abrasive micropowder comprises diamond micropowder and SiC micropowder, and the preferred particle size range is 15000# to 30000#, and the mass fraction of diamond to SiC micropowder is 6:1 to 8:1. The dual-effect pore-forming agent comprises polymethyl methacrylate and Al2O3 hollow spheres, and the polymethyl methacrylate is selected as a particle size D50 The parameter D50 is 5-8 μm or the parameter D90 is 10-15 μm, the Al2O3 hollow sphere is selected as the particle size D50 parameter 8-10 μm, the parameter D90 is 12-15 μm, the volume fraction of polymethyl methacrylate and Al2O3 hollow sphere is 10:1-15:1, which can achieve uniform pore formation while ensuring the strength of the cutter head assembly, and can also inhibit microcrack defects caused by the exhaust process under high temperature environment; the filler includes zinc oxide and molybdenum disulfide, the mass fraction of zinc oxide and molybdenum disulfide is 1:1-1.5:1, and the compressive strength and wear resistance of the grinding wheel are improved; the dispersant includes triethanolamine, polycarboxylic acid, and sodium hexametaphosphate; the temporary binder includes paraffin and white lake essence, the mass fraction of paraffin and the white lake essence is 1:1-1.5:1, and it is used for stable bonding and molding during the pressing process of the cutter head assembly.

[0022] This preparation method specifically comprises the following steps: S1, pretreatment of raw materials; a1. Weigh and feed 40% ceramic binder and 2% filler. The filler is a mixture of zinc oxide and molybdenum disulfide with a mass fraction of 1:1. Use a three-dimensional mixer to mix the components for 20 minutes until they are uniform, and sieve them. The sieve is 120# sieve and the sieving times are not less than twice. a2. Weigh diamond micropowder and SiC micropowder according to the mass fraction of 8:1, select the total volume fraction of composite abrasive micropowder to be 45%, and the preferred abrasive particle size is 15000#. Use a three-dimensional mixer to mix the components for 15min~20min until they are uniform, and sieve them with a 180# sieve, and sieve them for no less than twice; a3. Disperse the sieved diamond micropowder and SiC micropowder in deionized water, and add ethanol and dispersant successively. The mass fraction of deionized water and ethanol is 10% of the total amount of diamond micropowder and SiC micropowder, and the dispersant is composed of triethanolamine and sodium hexametaphosphate, and the volume fraction of triethanolamine and sodium hexametaphosphate is 2:1; a4. Use an electric stirrer to stir the mixture, using a dispersed disc stirring paddle, with a stirring head rotating at a speed of 300 r / min and a stirring time of 40 min; a5. Place the container containing diamond powder and SiC powder in an ultrasonic vibration machine, and further disperse the diamond powder and SiC powder by the ultrasonic vibration machine, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 40 min; S2, mixing and processing raw materials; b1. Add the sieved ceramic binder and filler mixture into the diamond powder and SiC powder solution and stir them. Use a dispersed disk stirring paddle with a stirring head rotating speed of 500 r / min for 60 min. b2. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 40 min; b3. 20% of the double-effect pore-forming agent and 5% of the temporary binder are successively added into the mixture for stirring. The stirring head rotates at a speed of 300 r / min and the stirring time is 40 min using a dispersed disc stirring paddle. The volume fraction of polymethyl methacrylate and Al2O3 hollow spheres in the double-effect pore-forming agent is 10:1. The temporary binder is a mixture of paraffin wax and white lake essence with a mass fraction of 1.5:1. b4. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 60 min; b5. Pour the treated mixture into a stainless steel tray and spread it flat. Place the mixture at room temperature for 24 hours or in a 60°C high temperature oven for 8 hours for drying. b6. Screening is performed using a 180# screen and the number of screenings is no less than two times; S3, manufacturing and bonding the cutter head assembly; c1. Weigh the sieved mixed material according to the weight converted from the designed volume of the mold, and the number of weighed materials should be consistent with the number of cutter head components; c2. Put the weighed mixed material into the cleaned mold cavity in portions, cover it with a pressing plate and press it in a press. The step pressure is set to 8MPa and keep warm and pressurized for 1 minute; c3. Demolding and sand-burying the cutter head assembly, placing it in a muffle furnace and sintering it according to the set heating curve; c4. After the cutter head assembly is sandblasted and the grinding wheel base is cleaned, the cutter head assembly is bonded to the reserved groove using an epoxy resin adhesive, and the cutter head assembly spacing is equal and the side faces are perpendicular to the base surface; c5. After bonding, the grinding wheel is used to grind the end face of the cutter head assembly through a surface grinder until the end face is flat and burr-free, so as to obtain better grinding service performance.

[0023] The 15000# grinding wheel prepared by this process can achieve a wear ratio of no less than 2:1, can achieve a stable grinding and thinning process without cracking, and the surface roughness after grinding is Ra<8nm.

[0024] Example 2 This preparation method specifically comprises the following steps: S1, pretreatment of raw materials; a1. Weigh and feed 35% ceramic binder and 1% filler. The filler is a mixture of zinc oxide and molybdenum disulfide with a mass fraction of 1.5:1. Use a three-dimensional mixer to mix the components for 20 minutes until they are uniform, and sieve them. The sieve is 180# sieve and the sieving times are not less than twice. a2. Weigh diamond micropowder and SiC micropowder according to the mass fraction of 6:1, select the total volume fraction of composite abrasive micropowder to be 35%, and the preferred abrasive particle size is 30000#. Use a three-dimensional mixer to mix the components for 20 minutes until they are uniform, and sieve them with a 240# sieve, and sieve them for no less than twice; a3. Disperse the sieved diamond micropowder and SiC micropowder in deionized water, add ethanol and dispersant successively, the mass fraction of deionized water and ethanol is 8% of the total amount of diamond micropowder and SiC micropowder; a4. Use an electric stirrer to stir the mixture, using a dispersed disc stirring paddle, with a stirring head rotating at a speed of 300 r / min and a stirring time of 40 min; a5. Place the container containing diamond powder and SiC powder in an ultrasonic vibration machine, and further disperse the diamond powder and SiC powder by the ultrasonic vibration machine, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 40 min; S2, mixing and processing raw materials; b1. Add the sieved ceramic binder and filler mixture into the diamond powder and SiC powder solution and stir them. Use a dispersed disk stirring paddle with a stirring head rotating speed of 500 r / min for 60 min. b2. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 40 min; b3. 20% of the double-effect pore-forming agent and 5% of the temporary binder are successively added into the mixture for stirring. The stirring head rotates at a speed of 300 r / min and the stirring time is 40 min using a dispersed disc stirring paddle. The volume fraction of polymethyl methacrylate and Al2O3 hollow spheres in the double-effect pore-forming agent is 15:1. The temporary binder is a mixture of paraffin wax and white lake essence with a mass fraction of 1:1. b4. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 60 min; b5. Pour the treated mixture into a stainless steel tray and spread it flat. Place the mixture at room temperature for 24 hours or in a 60°C high temperature oven for 8 hours for drying. b6. Screening is performed using a 240# screen and the number of screenings is no less than two times; S3, manufacturing and bonding the cutter head assembly; c1. Weigh the sieved mixed material according to the weight of the material converted from the designed volume of the mold, and the number of weighed materials should be consistent with the number of cutter head components; c2. Put the weighed mixed material into the cleaned mold cavity in portions, cover it with a pressing plate and press it in a press. The step pressure is set to 8MPa and keep warm and pressurized for 1 minute; c3. Demolding and sand-burying the cutter head assembly, placing it in a muffle furnace and sintering it according to the set heating curve; c4. After the cutter head assembly is sandblasted and the grinding wheel base is cleaned, the cutter head assembly is bonded to the reserved groove using an epoxy resin adhesive, and the cutter head assembly spacing is equal and the side faces are perpendicular to the base surface; c5. After bonding, the grinding wheel is used to grind the end face of the cutter head assembly through a surface grinder until the end face is flat and burr-free, so as to obtain better grinding service performance.

[0025] The 30000# grinding wheel prepared by this process can achieve a wear ratio of not less than 1.5:1; the grinding process is stable, and the wear marks of the rough grinding process can be effectively removed. No new visible scratches are generated on the surface, and a uniform and consistent high surface quality is obtained. The surface roughness after grinding is Ra < 6nm.

[0026] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A superfine grinding and thinning grinding wheel, characterized in that: The grinding wheel includes a grinding wheel base and a cutter head assembly. The grinding wheel base is provided with a plurality of reserved grooves arranged at equal intervals in the circumferential direction. The cutter head assembly is arranged in the reserved groove. The cutter head assembly includes 35% to 45% of composite abrasive micropowder, 30% to 45% of ceramic binder, 20% to 30% of dual-effect pore-forming agent, 1% to 3% of filler, 1% to 2% of dispersant and 5% of temporary binder by volume.

2. The superfine grinding and thinning grinding wheel according to claim 1, characterized in that: The composite abrasive powder includes diamond powder and SiC powder, and the preferred particle size range is 15000#~30000#, and the mass fraction of the diamond and the SiC powder is 6:1~8:

1.

3. The superfine grinding and thinning grinding wheel according to claim 1, characterized in that: The dual-effect pore-forming agent includes polymethyl methacrylate and Al2O3 hollow spheres. The polymethyl methacrylate is selected to have a particle size D50 parameter of 5-8 μm or a D90 parameter of 10-15 μm. The Al2O3 hollow spheres are selected to have a particle size D50 parameter of 8-10 μm and a D90 parameter of 12-15 μm. The volume fraction of the polymethyl methacrylate and the Al2O3 hollow spheres is 10:1-15:

1.

4. The superfine grinding and thinning grinding wheel according to claim 1, characterized in that: The filler includes zinc oxide and molybdenum disulfide, and the mass fraction of the zinc oxide and the molybdenum disulfide is 1:1-1.5:1; the dispersant includes triethanolamine, polycarboxylic acid, and sodium hexametaphosphate; the temporary binder includes paraffin and white lake essence, and the mass fraction of the paraffin and the white lake essence is 1:1-1.5:

1.

5. The method for preparing a superfine grinding and thinning grinding wheel according to any one of claims 1 to 4, characterized in that: This preparation method specifically comprises the following steps: S1, pretreatment of raw materials; S2, mixing and processing raw materials; S3, making and bonding the cutter head assembly.

6. The method for preparing a superfine grinding and thinning grinding wheel according to claim 5, characterized in that: The step S1 specifically includes the following steps: a1. Weigh and feed 30%~45% ceramic binder and 1%~3% filler, use a three-dimensional mixer to mix the components for 15min~20min until they are uniform, and sieve them using a 120#~180# sieve, and sieve them at least twice; a2. Weigh diamond powder and SiC powder in proportion, use a three-dimensional mixer to mix the components for 15-20 minutes until they are uniform, and sieve them using a 120#-180# sieve. The sieving times should be no less than twice. a3. Disperse the sieved diamond micropowder and SiC micropowder in deionized water, and add ethanol and dispersant successively; a4. Use an electric stirrer to stir the mixture, using a dispersed disc stirring paddle, with a stirring head rotating at a speed of 200-500 r / min and a stirring time of 30-40 min; a5. Place the container containing diamond powder and SiC powder in an ultrasonic vibrator, and further disperse the diamond powder and SiC powder through the ultrasonic vibrator. The vibration frequency is 20 kHz and the ultrasonic vibration time is 30 min to 40 min.

7. The method for preparing a superfine grinding and thinning grinding wheel according to claim 5, characterized in that: The step S2 specifically includes the following steps: b1. Add the sieved ceramic binder and filler mixture into the diamond powder and SiC powder solution and stir them. Use a dispersed disc stirring paddle with a stirring head rotating at a speed of 400-600 r / min for a stirring time of 40-60 min. b2. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 30 to 40 minutes; b3. Add the dual-effect pore-forming agent and temporary binder into the mixed material body and stir them successively. Use a dispersed disc stirring paddle with a stirring head rotating at a speed of 200-500 r / min for a stirring time of 30-40 min. b4. Place the container containing the mixed material in an ultrasonic vibrator for further dispersion, with a vibration frequency of 20 kHz and an ultrasonic vibration time of 40 to 60 minutes; b5. Pour the treated mixture into a stainless steel tray and spread it flat. Place the mixture at room temperature for 24 hours or in a 60°C high temperature oven for 8 hours for drying. b6. Screening is carried out, the sieve mesh should be 180#~240#, and the screening times should be no less than twice.

8. The method for preparing a superfine grinding and thinning grinding wheel according to claim 5, characterized in that: The step S3 specifically comprises the following steps: c1. Weigh the sieved mixed material according to the weight of the material converted from the designed volume of the mold, and the number of weighed materials should be consistent with the number of cutter head components; c2. Put the weighed mixed material into the cleaned mold cavity in portions, cover it with a pressing plate and press it in a press; c3. Demolding and sand-burying the cutter head assembly, placing it in a muffle furnace and sintering it according to the set heating curve; c4. After the cutter head assembly is sandblasted and the grinding wheel base is cleaned, the cutter head assembly is bonded to the reserved groove using an epoxy resin adhesive, and the cutter head assembly spacing is equal and the side faces are perpendicular to the base surface; c5. After bonding, the grinding wheel is used to grind the end face of the cutter head assembly through a surface grinder until the end face is flat and free of burrs.

9. The method for preparing a superfine grinding and thinning grinding wheel according to claim 6, characterized in that: In the step a3, the mass fraction of deionized water and ethanol is 8-10% of the total amount of diamond micropowder and SiC micropowder, and the dispersant is composed of triethanolamine, polycarboxylic acid and sodium hexametaphosphate, and the volume fraction of triethanolamine, polycarboxylic acid and sodium hexametaphosphate is 2:1:

1.

10. The method for preparing a superfine grinding and thinning grinding wheel according to claim 8, characterized in that: The pressure of the step is set to 5MPa~8MPa, and the temperature and pressure are kept constant for 1 minute.