An automated apparatus for wafer dicing

Abstract

The application relates to the technical field of wafer cutting, in particular to an automatic equipment for wafer cutting, which comprises a wafer cutting machine body, a cutting mechanism installed in the wafer cutting machine body, a suction disc mechanism installed in the wafer cutting machine body and a placing table, the placing table is used for supporting and positioning the wafer during cutting, one side of the wafer cutting machine body is provided with a supporting shell, and the supporting shell is provided with a moving mechanism; the automatic equipment for wafer cutting is provided with the supporting shell on the wafer cutting machine body and outside the placing table, and is provided with the moving mechanism on the supporting shell; meanwhile, the blowing and sucking mechanism is arranged on the moving mechanism, so that when the wafer is located directly above the placing table, the impurity particles on the lower surface of the wafer and the upper surface of the placing table can be detected and removed in advance, so that the wafer can be placed flat on the placing table, and the wafer can be prevented from being broken due to unevenness during subsequent cutting.

Description

Technical Field

[0001] This invention relates to the field of wafer dicing technology, specifically to an automated device for wafer dicing. Background Technology

[0002] There are many methods for wafer dicing (cutting). Among them, mechanical dicing (blade cutting) is the most traditional method. Blade cutting is a process that uses diamond blades to cut the wafer. It is a purely physical cutting method to split the wafer. Generally, wafers with a thickness of 100um or more are suitable for this dicing method. The diamond blade moves along the cutting path when rotating at high speed, completely cutting through the wafer. At the same time, a coolant is used to cool the blade and the wafer, reducing heat damage and removing the debris generated during cutting.

[0003] Currently, existing wafer dicing processes involve using suction cups to pick up wafers and place them onto a placement stage inside the dicing machine. However, during transportation and handling, environmental impurities can easily adhere to the wafer surface, especially the lower surface, causing unevenness when the wafer is placed on the placement stage. This can further lead to wafer breakage during dicing. To address this, we propose an automated wafer dicing device. Summary of the Invention

[0004] The purpose of this invention is to provide an automated device for wafer dicing to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automated equipment for wafer dicing, comprising a dicing machine body, a dicing mechanism installed inside the dicing machine body, a suction cup mechanism installed inside the dicing machine body, and a placement stage, wherein the placement stage is used for supporting and positioning the wafer during dicing, a support shell is installed on one side inside the dicing machine body, and a moving mechanism is installed on the support shell, wherein the moving mechanism is located outside the placement stage;

[0006] The moving mechanism is connected to a blow-suction mechanism. When the wafer is above the placement stage, the blow-suction mechanism is used to detect and remove impurity particles on the upper surface of the placement stage and the lower surface of the wafer. After the wafer is placed on the upper surface of the placement stage, the blow-suction mechanism detects and removes impurity particles on the upper surface of the wafer. After the wafer is cut, the blow-suction mechanism sucks up the coolant on the surface of the wafer.

[0007] The moving mechanism includes a moving lead screw, a waterproof motor, a moving block, and a support block. The moving lead screw is rotatably connected inside the support shell. The waterproof motor is installed on one side of the support shell and is used to drive the moving lead screw. The moving block is threaded onto the outside of the moving lead screw and slides through one side of the opening in the support shell. The support block is located outside the support shell and is fixedly installed on the moving block. The side of the support block away from the support shell has a U-shaped opening, and one end of the blowing and suction mechanism is installed at the U-shaped opening.

[0008] The blowing and suction mechanism includes a rotating shell, a first rotating shaft, a second rotating shaft, a rotating component, a guiding mechanism, a first guiding block, a second guiding block, a synchronous connecting component, and a blowing and suction component. The rotating shell passes through the U-shaped opening, and one end of the first rotating shaft and the second rotating shaft are respectively fixedly connected to the rotating shell.

[0009] The first rotating shaft is rotatably connected to the top of the U-shaped opening, the second rotating shaft passes through the bottom of the support block and is rotatably connected to the support block, the rotating component is installed at the bottom of the support block and is used to drive the second rotating shaft;

[0010] The guiding mechanism is installed on one side of the rotating shell, and the guiding mechanism guides the first guide block and the second guide block respectively;

[0011] Synchronous connectors are installed on the sides of the first guide block and the second guide block that are far apart from each other. The first guide block and the second guide block are respectively connected to the guiding mechanism through the synchronous connectors on them. The blow-suction component is installed on the upper surface of the first guide block and the second guide block. The blow-suction component blows and suctions the wafer and the placement stage respectively. Through the provided blow-suction mechanism, the impurity particles are blown away, and the debris and coolant are extracted.

[0012] The guiding mechanism includes a slide rod, a fixed plate, a guide screw, a bidirectional threaded rod, a guide motor, and a drive motor. One end of the slide rod is fixedly connected to one end of the outer side of the rotating shell, and the other end of the slide rod is fixedly connected to the fixed plate. The guide screw and the bidirectional threaded rod are located outside the slide rod, and their ends are rotatably connected to the rotating shell and the fixed plate, respectively. The guide motor is located inside the rotating shell and drives the guide screw. The drive motor is located inside the rotating shell and drives the bidirectional threaded rod. The first guide block and the second guide block are slidably sleeved on the outside of the slide rod, the guide screw, and the bidirectional threaded rod, respectively. The first guide block and the second guide block are threadedly connected to the guide screw or the bidirectional threaded rod through synchronous connecting parts. The guiding mechanism provides a supporting connection for the first guide block and the second guide block.

[0013] The synchronous connector includes a first semi-threaded sleeve, a second semi-threaded sleeve, a first cross rod, a second cross rod, and a bidirectional cylinder. There are two of each of the first and second semi-threaded sleeves. The two first semi-threaded sleeves are sleeved on the outside of the bidirectional threaded rod, and the two second semi-threaded sleeves are sleeved on the outside of the guide screw. The first cross rod and the second cross rod are distributed intersectingly, and the second cross rod is provided with a moving opening for the first cross rod to pass through, and the first cross rod slides through the moving opening.

[0014] The two ends of the first cross rod are fixedly connected to the upper first semi-threaded sleeve and the lower second semi-threaded sleeve, respectively. The two ends of the second cross rod are fixedly connected to the lower first semi-threaded sleeve and the upper second semi-threaded sleeve, respectively. The two ends of the bidirectional cylinder are fixedly connected to the first cross rod and the second cross rod, respectively. The bidirectional cylinder is fixedly installed on the first guide block or the second guide block. Through the provided synchronous connecting piece, the function of connecting the first guide block and the second guide block to the guide screw or the bidirectional threaded rod is realized.

[0015] The first guide block has a protrusion, and the second guide block has a groove at the position corresponding to the protrusion, so that the first guide block and the second guide block cooperate.

[0016] The blow-suction component includes a first blow-suction tube, a second blow-suction tube, a straight tube, a U-shaped tube, a support component, a positioning plate, a telescopic tube, a transfer tube, a suction component, a blower, and a detection component. When the wafer is located directly above the placement stage, the first blow-suction tube and the second blow-suction tube are located between the wafer and the placement stage. Both the first blow-suction tube and the second blow-suction tube are provided with blow-suction ports.

[0017] One end of the straight tube is connected to the first blow-suction tube, the support is located on the first guide block and is used to support the straight tube, one end of the U-shaped tube is connected to the second blow-suction tube, and two positioning plates are provided. The two positioning plates are fixedly installed on the second guide block and are used to support the U-shaped tube.

[0018] The telescopic tube is provided in two parts. One end of the two telescopic tubes is connected to a straight tube and a U-shaped tube, respectively. One end of the straight tube is rotatably connected to the telescopic tube. A fixing frame is fixedly connected to the outside of the telescopic tube near the straight tube end, and the fixing frame is connected to the support. The ends of the two telescopic tubes located outside the dicing machine body are connected to the transfer tube. Solenoid valves are installed at both ends of the bottom of the transfer tube, and the two ends of the bottom of the transfer tube are connected to the suction component and the blower, respectively.

[0019] The detection element is provided in two parts. One detection element is located on the support element, and the other detection element is located at the bottom of the second guide block. Through the provided blowing and suction elements, it can achieve the function of blowing and suctioning impurity particles.

[0020] The support component includes a middle plate, a support shaft, a swing plate, a swing motor, a protective shell, a connecting gear, an arc plate, a toothed block, and a side plate. The middle plate is fixedly installed on the top of the first guide block. The support shaft passes through the middle plate and is rotatably connected to the middle plate. The swing motor is fixedly installed on the middle plate and is used to drive the support shaft. The protective shell is installed on the middle plate and is used to protect the swing motor.

[0021] The other end of the support shaft is fixedly connected to the swing plate, the straight tube passes through the other end of the swing plate and is rotatably connected to the swing plate, one end of the fixed frame is fixedly connected to the straight tube, the connecting gear is fixedly sleeved on the outside of the straight tube, one end of the arc plate is fixedly connected to the side plate and the side plate is fixedly installed on the first guide block, multiple tooth blocks are provided, and the multiple tooth blocks are evenly distributed on the inner ring of the arc plate, and the connecting gear meshes with the tooth blocks;

[0022] One of the detection components is mounted on the side plate, and through the provided support, it supports the straight tube and the first blow-suction tube.

[0023] The detection device includes a light scattering sensor. The light scattering sensor located at the first guide block is fixedly installed on the side plate, and the light scattering sensor located at the second guide block is fixedly installed at the bottom of the second guide block. Through the detection device, the function of detecting impurity particles on the lower surface of the wafer and the upper surface of the placement stage can be realized.

[0024] The suction component includes a negative pressure pump and a liquid collection shell. The liquid collection shell is installed on the outside of the dicing machine body. The output end of the negative pressure pump is connected to the liquid collection shell, and the input end of the negative pressure pump is connected to one end of the bottom of the transfer pipe. Through the suction component, the first and second blow-suction pipes are used to suction debris and coolant from the wafer surface.

[0025] This invention has at least the following beneficial effects:

[0026] 1. When the present invention is used, a support shell is provided inside the dicing machine body and outside the placement stage, and a moving mechanism is provided on the support shell. At the same time, a blowing and suction mechanism is provided on the moving mechanism. This allows the impurity particles on the lower surface of the wafer and the upper surface of the placement stage to be detected and removed in advance when the wafer is directly above the placement stage. This ensures that the wafer can be placed flat on the placement stage and prevents the wafer from breaking due to unevenness during subsequent dicing.

[0027] 2. The blowing and suction mechanism in this invention can remove impurity particles from the upper surface of the wafer after the wafer is placed on the placement stage, thereby improving the wafer cutting accuracy.

[0028] 3. The blowing and suction mechanism in this invention can suck up the coolant and debris on the wafer surface after wafer dicing. At the same time, it can reduce the movement of impurities relative to the wafer surface, further improve the wafer dicing accuracy, and facilitate the subsequent drying process of the wafer inside the dicing machine body. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 This is a schematic diagram of the placement platform structure of the present invention;

[0031] Figure 3 This is a schematic diagram of the supporting shell structure of the present invention;

[0032] Figure 4 This is a schematic diagram of the first and second blow-suction tubes of the present invention;

[0033] Figure 5 This is a schematic diagram of the moving block structure of the present invention;

[0034] Figure 6 This is a schematic diagram of the support block structure of the present invention;

[0035] Figure 7 This is a schematic diagram of the rotating shell structure of the present invention;

[0036] Figure 8 This is a schematic diagram of the fixing plate structure of the present invention;

[0037] Figure 9 This is a schematic diagram of the rotating shell structure of the present invention;

[0038] Figure 10 This is a schematic diagram of the first guide block structure of the present invention;

[0039] Figure 11 This is a schematic diagram of the U-shaped tube structure of the present invention;

[0040] Figure 12 This is a schematic diagram of the swing plate structure of the present invention.

[0041] In the diagram: 1. Dicing machine body; 11. Cutting mechanism; 12. Suction cup mechanism; 13. Placement stage; 2. Support shell; 3. Moving mechanism; 31. Moving screw; 32. Waterproof motor; 33. Moving block; 34. Support block; 341. U-shaped opening; 4. Blowing and suction mechanism; 41. Rotating shell; 42. First rotating shaft; 43. Second rotating shaft; 44. Rotating component; 441. Bottom shell; 442. Rotary motor; 443. First rotating gear; 444. Second rotating gear; 45. Guide mechanism; 451. Slide rod; 452. Fixing plate; 453. Guide screw; 454. Bidirectional threaded rod; 455. Guide motor; 456. Drive motor; 46. First guide block; 461. Protrusion; 47. 5. Second guide block; 6. Synchronous connector; 7. First semi-threaded sleeve; 8. Second semi-threaded sleeve; 9. First cross rod; 10. Second cross rod; 11. Two-way cylinder; 12. Blowing and suction component; 13. First blowing and suction pipe; 14. Second blowing and suction pipe; 15. Straight pipe; 16. U-shaped pipe; 27. Support component; 18. Intermediate plate; 19. Support shaft; 20. Swing plate; 20. Swing motor; 21. Protective shell; 22. Connecting gear; 33. Arc plate; 44. Tooth block; 55. Side plate; 66. Positioning plate; 77. Telescopic pipe; 88. Transfer pipe; 99. Suction component; 100. Negative pressure pump; 11. Liquid collection shell; 12. Blower; 13. Detection component; 14. Light scattering sensor. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Example 1

[0044] Please see Figures 1 to 3 An automated device for wafer dicing includes a dicing machine body 1, a dicing mechanism 11 installed inside the dicing machine body 1, a suction cup mechanism 12 installed inside the dicing machine body 1, and a placement stage 13. The placement stage 13 is used to support and position the wafer during dicing. In this invention, the dicing mechanism 11, the suction cup mechanism 12, and the placement stage 13 are all existing mechanisms, so they will not be described in detail. The placement stage 13 is used to place the wafer and fix it. The bottom of the placement stage 13 is a mating mechanism that allows the placement stage 13 and the dicing mechanism 11 to cooperate with each other for precise dicing of the wafer. A support shell 2 is installed on one side inside the dicing machine body 1, and a moving mechanism 3 is installed on the support shell 2. The moving mechanism 3 is located outside the placement stage 13.

[0045] Please see Figure 6 The moving mechanism 3 is connected to the blowing and suction mechanism 4. When the wafer is above the placement stage 13, the blowing and suction mechanism 4 is used to detect and remove impurity particles on the upper surface of the placement stage 13 and the lower surface of the wafer. After the wafer is on the upper surface of the placement stage 13, the blowing and suction mechanism 4 detects and removes impurity particles on the upper surface of the wafer. After the wafer is cut, the blowing and suction mechanism 4 sucks up the coolant on the surface of the wafer.

[0046] The moving mechanism 3 includes a moving screw 31, a waterproof motor 32, a moving block 33, and a support block 34. The moving screw 31 is rotatably connected inside the support shell 2. The waterproof motor 32 is installed on one side of the support shell 2 and is used to drive the moving screw 31. The moving block 33 is threaded onto the outside of the moving screw 31 and slides through one side of the opening of the support shell 2. The support block 34 is located on the outside of the support shell 2 and is fixedly installed on the moving block 33. A U-shaped opening 341 is provided on the side of the support block 34 away from the support shell 2, and one end of the blowing and suction mechanism 4 is installed at the U-shaped opening 341.

[0047] Specific implementation process: When the movable block 33 is driven, the waterproof motor 32 runs, causing the movable lead screw 31 to rotate. While the movable lead screw 31 rotates, it provides driving force to the movable block 33. At this time, under the limiting action of the support shell 2, the movable block 33 moves horizontally relative to the support shell 2, thereby realizing the function of adjusting the position of the movable block 33 relative to the support shell 2.

[0048] Please see Figures 3 to 12 The blowing and suction mechanism 4 includes a rotating shell 41, a first rotating shaft 42, a second rotating shaft 43, a rotating component 44, a guiding mechanism 45, a first guiding block 46, a second guiding block 47, a synchronous connecting component 5, and a blowing and suction component 6. The rotating shell 41 passes through the U-shaped opening 341, and one end of the first rotating shaft 42 and the second rotating shaft 43 are respectively fixedly connected to the rotating shell 41.

[0049] The first rotating shaft 42 is rotatably connected to the top of the U-shaped opening 341, the second rotating shaft 43 passes through the bottom of the support block 34 and is rotatably connected to the support block 34, the rotating component 44 is installed at the bottom of the support block 34 and is used to drive the second rotating shaft 43;

[0050] The guide mechanism 45 is installed on one side of the rotating shell 41, and the guide mechanism 45 guides the first guide block 46 and the second guide block 47 respectively. The first guide block 46 is provided with a protrusion 461, and the second guide block 47 is provided with a groove corresponding to the position of the protrusion 461.

[0051] Synchronous connectors 5 are installed on the sides of the first guide block 46 and the second guide block 47 that are far apart from each other. The first guide block 46 and the second guide block 47 are respectively connected to the guide mechanism 45 through the synchronous connectors 5 on them. The blow-suction component 6 is installed on the upper surface of the first guide block 46 and the second guide block 47, and the blow-suction component 6 blows and suctions the wafer and the placement stage 13 respectively.

[0052] The guiding mechanism 45 includes a slide rod 451, a fixed plate 452, a guide screw 453, a bidirectional threaded rod 454, a guiding motor 455, and a drive motor 456. One end of the slide rod 451 is fixedly connected to one end of the outer side of the rotating shell 41, and the other end of the slide rod 451 is fixedly connected to the fixed plate 452. The guide screw 453 and the bidirectional threaded rod 454 are located on the outer side of the slide rod 451, and their two ends are rotatably connected to the rotating shell 41 and the fixed plate 452, respectively. 455 is located inside the rotating shell 41, and the guide motor 455 is used to drive the guide screw 453. The drive motor 456 is located inside the rotating shell 41, and the drive motor 456 is used to drive the bidirectional threaded rod 454. The first guide block 46 and the second guide block 47 are respectively slidably sleeved on the outside of the slide rod 451, the guide screw 453 and the bidirectional threaded rod 454, and the first guide block 46 and the second guide block 47 are respectively threadedly connected to the guide screw 453 or the bidirectional threaded rod 454 through the synchronous connector 5.

[0053] Please see Figure 12 The synchronous connector 5 includes a first half-threaded sleeve 51, a second half-threaded sleeve 52, a first cross rod 53, a second cross rod 54, and a bidirectional cylinder 55. There are two first half-threaded sleeves 51 and two second half-threaded sleeves 52. The two first half-threaded sleeves 51 are sleeved on the outside of the bidirectional threaded rod 454, and the two second half-threaded sleeves 52 are sleeved on the outside of the guide screw 453. The first cross rod 53 and the second cross rod 54 are distributed crosswise, and the second cross rod 54 is provided with a moving opening for the first cross rod 53 to pass through, and the first cross rod 53 slides through the moving opening.

[0054] The two ends of the first cross rod 53 are fixedly connected to the upper first semi-threaded sleeve 51 and the lower second semi-threaded sleeve 52, respectively. The two ends of the second cross rod 54 are fixedly connected to the lower first semi-threaded sleeve 51 and the upper second semi-threaded sleeve 52, respectively. The two ends of the bidirectional cylinder 55 are fixedly connected to the first cross rod 53 and the second cross rod 54, respectively. The bidirectional cylinder 55 is fixedly installed on the first guide block 46 or the second guide block 47.

[0055] Specifically, by setting a first cross rod 53 and a second cross rod 54, and simultaneously positioning two first half-threaded sleeves 51 and two second half-threaded sleeves 52 outside the guide screw 453 and the bidirectional threaded rod 454 respectively, and then operating the bidirectional cylinder 55, one end of the first cross rod 53 and the second cross rod 54 moves in opposite directions, while the other end of the first cross rod 53 and the second cross rod 54 moves in directions away from each other. In this case, the first state is: the two first half-threaded sleeves 51 are threadedly engaged with the outside of the bidirectional threaded rod 454, and the two second half-threaded sleeves 52 are away from the outside of the guide screw 453, and the two second half-threaded sleeves 52 do not contact the threads on the outside of the guide screw 453; the second state is: the two first half-threaded sleeves 51 are threaded away from the outside of the bidirectional threaded rod 454, and the two first half-threaded sleeves 51 do not contact the threads on the outside of the bidirectional threaded rod 454, while the two second half-threaded sleeves 52 are threadedly engaged with the outside of the guide screw 453.

[0056] Please see Figures 3 to 12 The blow-suction component 6 includes a first blow-suction pipe 61, a second blow-suction pipe 62, a straight pipe 63, a U-shaped pipe 64, a support component 65, a positioning plate 66, a telescopic pipe 67, a transfer pipe 68, a suction component 7, a blower 8, and a detection component 9. When the wafer is located directly above the placement stage 13, the first blow-suction pipe 61 and the second blow-suction pipe 62 are located between the wafer and the placement stage 13. Both the first blow-suction pipe 61 and the second blow-suction pipe 62 are provided with blow-suction ports.

[0057] One end of the straight tube 63 is connected to the first blow-suction tube 61. The support member 65 is located on the first guide block 46 and is used to support the straight tube 63. One end of the U-shaped tube 64 is connected to the second blow-suction tube 62. Two positioning plates 66 are provided. The two positioning plates 66 are fixedly installed on the second guide block 47 and are used to support the U-shaped tube 64.

[0058] Two telescopic tubes 67 are provided. One end of each telescopic tube 67 is connected to a straight tube 63 and a U-shaped tube 64, respectively. One end of the straight tube 63 is rotatably connected to the telescopic tube 67. A fixing frame is fixedly connected to the outer side of the telescopic tube 67 near the straight tube 63. The fixing frame is connected to the support 65. The end of the telescopic tube 67 located on the outer side of the dicing machine body 1 is connected to the transfer tube 68. Solenoid valves are installed at both ends of the bottom of the transfer tube 68, and the two ends of the bottom of the transfer tube 68 are connected to the suction component 7 and the blower 8, respectively.

[0059] There are two detection elements 9. One detection element 9 is located on the support 65. The other detection element 9 is located at the bottom of the second guide block 47.

[0060] The support member 65 includes an intermediate plate 651, a support shaft 652, a swing plate 653, a swing motor 654, a protective shell 655, a connecting gear 656, an arc plate 657, a toothed block 658, and a side plate 659. The intermediate plate 651 is fixedly installed on the top of the first guide block 46. The support shaft 652 passes through the intermediate plate 651 and is rotatably connected to the intermediate plate 651. The swing motor 654 is fixedly installed on the intermediate plate 651 and is used to drive the support shaft 652. The protective shell 655 is installed on the intermediate plate 651 and is used to protect the swing motor 654.

[0061] The other end of the support shaft 652 is fixedly connected to the swing plate 653. The straight tube 63 passes through the other end of the swing plate 653 and is rotatably connected to the swing plate 653. One end of the fixed frame is fixedly connected to the straight tube 63. The connecting gear 656 is fixedly sleeved on the outside of the straight tube 63. One end of the arc plate 657 is fixedly connected to the side plate 659 and the side plate 659 is fixedly installed on the first guide block 46. There are multiple tooth blocks 658. The multiple tooth blocks 658 are evenly distributed on the inner ring of the arc plate 657. The connecting gear 656 meshes with the tooth blocks 658.

[0062] One of the testing components 9 is installed on the side plate 659.

[0063] Please see Figure 4 The detection component 9 includes a light scattering sensor 91. The light scattering sensor 91 located at the first guide block 46 is fixedly installed on the side plate 659, and the light scattering sensor 91 located at the second guide block 47 is fixedly installed at the bottom of the second guide block 47.

[0064] The suction unit 7 includes a negative pressure pump 71 and a liquid collection shell 72. The liquid collection shell 72 is installed on the outside of the dicing machine body 1. The output end of the negative pressure pump 71 is connected to the liquid collection shell 72, and the input end of the negative pressure pump 71 is connected to one end of the bottom of the transfer pipe 68. With the setting of the suction unit 7, when the impurities on the lower surface of the next wafer are blown away, the blower runs first to blow away the coolant inside the straight pipe 63, U-shaped pipe 64, telescopic pipe 67, and transfer pipe 68, so as to avoid the influence of the coolant when removing impurities on the lower surface of the wafer and the upper surface of the placement stage 13.

[0065] Specific implementation process: First, when the wafer moves to directly above the placement stage 13, while maintaining a certain distance between the wafer and the placement stage 13 (preferably 10cm in this embodiment), the moving block 33 moves to the rightmost end of the support shell 2. At this time, the rotating component 44 operates, keeping the rotating shell 41 and the moving block 33 parallel to each other. At this time, the sliding rod 451 at one end of the rotating shell 41 and the moving block 33 are perpendicular to each other. At this time, the first suction pipe 61 is located above the second suction pipe 62, with the suction port of the first suction pipe 61 tilted upwards, and the suction port of the second suction pipe 62 tilted downwards, with both suction ports facing the inside of the dicing machine body 1. At this time, the output end of the bidirectional cylinder 55 located on the first guide block 46 and the second guide block 47 extends out, and the two second semi-threaded sleeves 52 at the first guide block 46 and the second guide block 47 are threaded onto the outside of the guide screw 453. At this time, the guide motor 455 operates, thereby causing the guide screw to... 453 rotates, and when the guide screw 453 rotates, it provides driving force to the two semi-threaded sleeves at the first guide block 46 and the second guide block 47 respectively. Due to the limiting action of the slide rod 451, the first guide block 46 and the second guide block 47 move along the outside of the placement stage 13. At this time, the blower 8 runs, and the solenoid valve at the blower 8 opens. The airflow is then introduced into the straight pipe 63 and the U-shaped pipe 64 through the transfer pipe 68 and the telescopic pipe 67 respectively. Finally, the airflow is blown out through the blow-in ports at the first blow-in pipe 61 and the second blow-in pipe 62 respectively, thereby achieving the function of blowing away particulate impurities on the lower surface of the wafer and the upper surface of the placement stage 13. At the same time as blowing away, the light scattering sensor 91 detects whether there are particulate impurities on the lower surface of the wafer and the upper surface of the placement stage 13. If there are, the first blow-in pipe 61 and the second blow-in pipe 62 reciprocate to achieve the function of fully blowing away particulate impurities on the lower surface of the wafer and the upper surface of the placement stage 13.

[0066] Subsequently, after impurities are blown away from the lower surface of the wafer and the upper surface of the placement stage 13, the wafer is stably placed on the upper surface of the placement stage 13, which simultaneously fixes the wafer. The first suction pipe 61 and the second suction pipe 62, driven by the guide screw 453, move to a position close to the support shell 2. Then, the swing motor 654 operates, causing the swing plate 653 to rotate. Simultaneously, as the swing plate 653 rotates, the straight pipe 63 drives the first suction pipe 61 along the arc-shaped plate 65. 7 rotates, and due to the meshing action of the connecting gear 656 and the tooth block 658, the connecting gear 656 drives the straight tube 63 to rotate, that is, one end of the straight tube 63 rotates synchronously relative to the telescopic tube 67. While the straight tube 63 rotates, the first blowing and suction tube 61 further rotates until the swing plate 653 rotates 90°. Then, the direction of the blowing and suction port of the first blowing and suction tube 61 and the direction of the blowing and suction port of the second blowing and suction tube 62 are mirror images of each other. Subsequently, through the moving mechanism... 3. Operation: The moving block 33 drives the support block 34 to move along the other end of the support shell 2 until it reaches the Y-axis of the support shell 2. Then, the rotating part 44 operates, causing the rotating shell 41 to rotate. At this time, the first suction pipe 61 and the second suction pipe 62 are located on both sides of the Y-axis of the support shell 2, and the first suction pipe 61 and the second suction pipe 62 are located on both sides of the Y-axis of the placement stage 13. The output ends of the two bidirectional cylinders 55 retract, so that the two sets of first semi-threaded sleeves 51 are threadedly connected to the bidirectional threaded rod 454 respectively. The drive motor 456 operates, so that the bidirectional threaded rod 454 rotates. When the bidirectional threaded rod 454 rotates, it provides the two sets of first semi-threaded sleeves 51 with opposite driving force, so that the first guide block 46 and the second guide block 47 move in opposite directions. At the same time, the blower 8 operates, so that the particles on the upper surface of the wafer are blown away through the first suction pipe 61 and the second suction pipe 62.

[0067] Finally, after the wafer is diced, the negative pressure pump 71 is activated, which generates negative pressure at the suction ports of the first suction pipe 61 and the second suction pipe 62, thereby sucking up the debris and coolant on the upper surface of the wafer. The first suction pipe 61 and the second suction pipe 62 move in opposite directions, thereby sucking up the debris and coolant and blowing the coolant and debris away to the collection tank inside the dicing machine body 1, which facilitates the subsequent wafer drying process.

[0068] Example 2

[0069] Please see Figure 8Example 2 provides a further explanation of the rotating component 44 in Example 1. Specifically, the rotating component 44 includes a bottom shell 441, a rotating motor 442, a first rotating gear 443, and a second rotating gear 444. The bottom shell 441 is fixedly installed at the bottom of the support block 34. The rotating motor 442 is fixedly installed inside the bottom shell 441. The output end of the rotating motor 442 is fixedly connected to the first rotating gear 443, and the first rotating gear 443 is meshed with the second rotating gear 444. The second rotating gear 444 is fixedly sleeved on the outside of the second rotating shaft 43.

[0070] The rotating motor 442 operates, causing the first rotating gear 443 to drive the second rotating gear 444 to rotate. As the second rotating gear 444 rotates, the second rotating shaft 43 further drives the rotating shell 41 to rotate. The rotating shell 41 then rotates 90° forward or 90° backward relative to the U-shaped opening 341 via the first rotating shaft 42 and the second rotating shaft 43.

[0071] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0072] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic device for wafer cutting, comprising a dicer body (1), a cutting mechanism (11) installed inside the dicer body (1), a chuck mechanism (12) installed inside the dicer body (1) and a placement table (13) for supporting and positioning the wafer during cutting, characterized in that: One side of the wafer cutting machine body (1) is internally provided with a supporting shell (2), and the supporting shell (2) is provided with a moving mechanism (3); the moving mechanism (3) is located outside the placing table (13); ​ The moving mechanism (3) is connected with a blowing and sucking mechanism (4); when the wafer is located above the placing table (13), the blowing and sucking mechanism (4) is used for detecting and removing the impurity particles on the upper surface of the placing table (13) and the lower surface of the wafer; after the wafer is located on the upper surface of the placing table (13), the blowing and sucking mechanism (4) is used for detecting and removing the impurity particles on the upper surface of the wafer; and after the wafer is cut, the blowing and sucking mechanism (4) is used for sucking the cooling liquid on the surface of the wafer; The blowing and sucking mechanism (4) comprises a rotating shell (41), a first rotating shaft (42), a second rotating shaft (43), a rotating piece (44), a guide mechanism (45), a first guide block (46), a second guide block (47), a synchronous connecting piece (5) and a blowing and sucking piece (6); the rotating shell (41) penetrates through the U-shaped opening (341); one end of the first rotating shaft (42) and the second rotating shaft (43) is fixedly connected with the rotating shell (41); the first rotating shaft (42) is rotatably connected with the top of the U-shaped opening (341); the second rotating shaft (43) penetrates through the bottom of the supporting block (34) and is rotatably connected with the supporting block (34); the rotating piece (44) is installed at the bottom of the supporting block (34) and is used for driving the second rotating shaft (43); the guide mechanism (45) is installed on one side of the rotating shell (41) and guides the first guide block (46) and the second guide block (47); the first guide block (46) and the second guide block (47) are both provided with the synchronous connecting piece (5) on the side away from each other; the first guide block (46) and the second guide block (47) are connected with the guide mechanism (45) through the synchronous connecting piece (5) thereon; and the blowing and sucking piece (6) is installed on the upper surfaces of the first guide block (46) and the second guide block (47) and blows and sucks the wafer and the placing table (13). The blowing and sucking piece (6) comprises a first blowing and sucking pipe (61), a second blowing and sucking pipe (62), a straight pipe (63), a U-shaped pipe (64), a supporting piece (65), a positioning plate (66), an extension pipe (67), a transfer pipe (68), a sucking piece (7), a blower (8) and a detection piece (9), the first blowing and sucking pipe (61) and the second blowing and sucking pipe (62) are located between the wafer and the placing table (13) when the wafer is located directly above the placing table (13), and the first blowing and sucking pipe (61) and the second blowing and sucking pipe (62) are each provided with a blowing and sucking opening; one end of the straight pipe (63) is communicated with the first blowing and sucking pipe (61), the supporting piece (65) is located on the first guide block (46), and the supporting piece (65) is used for supporting the straight pipe (63), one end of the U-shaped pipe (64) is communicated with the second blowing and sucking pipe (62), the positioning plate (66) is provided with two, the two positioning plates (66) are fixedly installed on the second guide block (47), and the two positioning plates (66) are used for supporting the U-shaped pipe (64); the extension pipe (67) is provided with two, one end of each of the two extension pipes (67) is communicated with the straight pipe (63) and the U-shaped pipe (64) respectively, one end of the straight pipe (63) is rotationally connected with the extension pipe (67), the extension pipe (67) is fixedly connected with a fixing frame on the outer side of one end of the straight pipe (63), the fixing frame is connected with the supporting piece (65), and one end of each of the two extension pipes (67) located on the outer side of the wafer slicing machine body (1) is communicated with the transfer pipe (68), the two ends of the bottom of the transfer pipe (68) are respectively provided with electromagnetic valves, and the two ends of the bottom of the transfer pipe (68) are respectively connected with the sucking piece (7) and the blower (8); the detection piece (9) is provided with two, one detection piece (9) is located on the supporting piece (65), and the other detection piece (9) is located at the bottom of the second guide block (47).

2. The automated apparatus for wafer dicing of claim 1, wherein: The moving mechanism (3) comprises a moving lead screw (31), a waterproof motor (32), a moving block (33) and a supporting block (34), the moving lead screw (31) is rotationally connected in the inside of the supporting shell (2), the waterproof motor (32) is installed on one side of the supporting shell (2), and the waterproof motor (32) is used for driving the moving lead screw (31), the moving block (33) is threadedly sleeved on the outside of the moving lead screw (31), the moving block (33) slides through one side of the opening of the supporting shell (2), the supporting block (34) is located on the outside of the supporting shell (2), and the supporting block (34) is fixedly installed on the moving block (33), and the supporting block (34) is provided with a U-shaped opening (341) on the side away from the supporting shell (2), and one end of the blowing and sucking mechanism (4) is installed at the U-shaped opening (341).

3. The automated apparatus for wafer dicing of claim 1, wherein: The guide mechanism (45) comprises a sliding rod (451), a fixed plate (452), a guide screw rod (453), a bidirectional threaded rod (454), a guide motor (455) and a driving motor (456), one end of the sliding rod (451) is fixedly connected with one end outside the rotating shell (41), the other end of the sliding rod (451) is fixedly connected with the fixed plate (452), the guide screw rod (453) and the bidirectional threaded rod (454) are located outside the sliding rod (451) respectively, and both ends of the guide screw rod (453) and the bidirectional threaded rod (454) are rotatably connected with the rotating shell (41) and the fixed plate (452) respectively, the guide motor (455) is located inside the rotating shell (41), and the guide motor (455) is used for driving the guide screw rod (453), the driving motor (456) is located inside the rotating shell (41), and the driving motor (456) is used for driving the bidirectional threaded rod (454), the first guide block (46) and the second guide block (47) are slidably sleeved outside the sliding rod (451), the guide screw rod (453) and the bidirectional threaded rod (454) respectively, and the first guide block (46) and the second guide block (47) are threadedly connected with the guide screw rod (453) or the bidirectional threaded rod (454) through the synchronous connecting piece (5) respectively.

4. The automated apparatus for wafer dicing of claim 1, wherein: The synchronous connecting piece (5) comprises a first half-thread sleeve (51), a second half-thread sleeve (52), a first cross rod (53), a second cross rod (54) and a bidirectional air cylinder (55), the first half-thread sleeve (51) and the second half-thread sleeve (52) are both provided with two, the two first half-thread sleeves (51) are sleeved outside the bidirectional threaded rod (454), the two second half-thread sleeves (52) are sleeved outside the guide screw rod (453), the first cross rod (53) and the second cross rod (54) are cross-distributed, and the second cross rod (54) is provided with a moving opening for the first cross rod (53) to pass through, and the first cross rod (53) is slidably penetrated through the moving opening; both ends of the first cross rod (53) are fixedly connected with the first half-thread sleeve (51) at the upper end and the second half-thread sleeve (52) at the lower end respectively, both ends of the second cross rod (54) are fixedly connected with the first half-thread sleeve (51) at the lower end and the second half-thread sleeve (52) at the upper end respectively, both ends of the bidirectional air cylinder (55) are fixedly connected with the first cross rod (53) and the second cross rod (54) respectively, and the bidirectional air cylinder (55) is fixedly installed on the first guide block (46) or the second guide block (47).

5. The automated apparatus for wafer dicing of claim 4, wherein: The first guide block (46) is provided with a protrusion (461), and the second guide block (47) is provided with a groove corresponding to the position of the protrusion (461).

6. The automated apparatus for wafer dicing of claim 1, wherein: The support (65) comprises an intermediate plate (651), a support shaft (652), an oscillating plate (653), an oscillating motor (654), a protective shell (655), a connecting gear (656), an arc plate (657), a tooth block (658) and a side plate (659), the intermediate plate (651) is fixedly installed at the top of the first guide block (46), the support shaft (652) penetrates the intermediate plate (651), and the support shaft (652) is rotationally connected with the intermediate plate (651), the oscillating motor (654) is fixedly installed on the intermediate plate (651), and the oscillating motor (654) is used for driving the support shaft (652), the protective shell (655) is installed on the intermediate plate (651), and the protective shell (655) is used for protecting the oscillating motor (654); The other end of the support shaft (652) is fixedly connected with the oscillating plate (653), the straight pipe (63) penetrates the other end of the oscillating plate (653), and the straight pipe (63) is rotationally connected with the oscillating plate (653), one end of the fixing frame is fixedly connected with the straight pipe (63), the connecting gear (656) is fixedly sleeved outside the straight pipe (63), one end of the arc plate (657) is fixedly connected with the side plate (659), and the side plate (659) is fixedly installed on the first guide block (46), a plurality of tooth blocks (658) are arranged, and the plurality of tooth blocks (658) are equidistantly distributed on the inner circle of the arc plate (657), and the connecting gear (656) is meshedly connected with the tooth blocks (658). One of the detection members (9) is installed on the side plate (659).

7. The automated apparatus for wafer dicing of claim 6, wherein: The detection member (9) comprises a light scattering sensor (91), the light scattering sensor (91) located at the first guide block (46) is fixedly installed on the side plate (659), and the light scattering sensor (91) located at the second guide block (47) is fixedly installed at the bottom of the second guide block (47).

8. The automated apparatus for wafer dicing of claim 1, wherein: The suction member (7) comprises a negative pressure pump (71) and a liquid collecting shell (72), the liquid collecting shell (72) is installed outside the wafer dicing machine body (1), the output end of the negative pressure pump (71) is in communication with the liquid collecting shell (72), and the input end of the negative pressure pump (71) is in communication with one end of the transfer pipe (68) at the bottom.

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