Equipment operation data management method based on sapphire slice production

Abstract

The invention discloses an equipment operation data management method based on sapphire slice production, and belongs to the field of data management. Implicit features related to slice quality are comprehensively analyzed based on slice equipment operation data and sapphire production data, and the slice quality is accurately estimated; according to the sapphire slicing device, the situation that the sapphire is damaged in the cutting process due to the fact that the slicing device is not matched with the sapphire is avoided, safety in the cutting process is improved, and the problem that in the prior art, during cutting, due to the fact that operation aging conditions of sapphire slicing devices are different and sapphire defects are different is solved. The problem that the sapphire slicing quality is seriously influenced due to the fact that the sapphire is damaged in the cutting process because the operation data of the sapphire slicing equipment is often not matched with the sapphire data in the prior art is solved.

Description

Technical Field

[0001] The present application belongs to the field of data management, and more specifically, is a method for managing equipment operation data based on sapphire slice production. Background Art

[0002] Sapphire slicing equipment is a mechanical equipment specially used for cutting sapphire materials. The main function of sapphire slicing equipment is to cut sapphire raw materials into sheet products of a certain thickness and size. It usually includes cutting mechanism, feeding mechanism, control system and other parts, which can realize fast, accurate and efficient cutting operation. The main features of sapphire slicing equipment include high precision, high efficiency and high stability. It adopts advanced cutting technology and control system, which can realize high-precision cutting while maintaining high production efficiency and stable equipment performance. However, when cutting in the prior art, due to different operating aging conditions of sapphire slicing equipment and different defects of sapphire, the operating data of sapphire slicing equipment often does not match the sapphire data, which leads to the breakage of sapphire during the cutting process, seriously affecting the sapphire slicing quality; For example, a Chinese patent application with the publication number CN112396206A discloses a method and system for integrated management of the cutting and use of plates, which obtains the product attributes of the products to be produced and the attributes of the stock plates, combines the products to be produced with the same plate attributes into a set of plates, forms a matching relationship between the plates to be cut and the products to be produced according to the different sizes of the stock plates, calculates the plate utilization rate for each matching relationship, forms a utilization rate ranking table, combines the optimal set of plates for the products to be produced according to the utilization rate ranking table, calculates the number of rolls of the plates required for cutting according to the obtained set of plates, and then obtains the optimal cutting plan; the invention constructs a comprehensive plate management system based on the plates, coordinates procurement, cutting, production, surplus materials, and idle materials; optimizes the cutting of plates according to the production plan to improve the plate utilization rate; the patent has the problems raised by the background technology; In order to solve the problems raised by the background technology, the present application designs a method for managing equipment operation data based on sapphire slice production. Summary of the invention

[0003] In response to the shortcomings of the prior art, the present application proposes an equipment operation data management method based on sapphire slicing production. Based on the slicing equipment operation data and sapphire production data, the present application conducts a comprehensive analysis of the implicit characteristics related to the slicing quality, accurately estimates the slicing quality, avoids the sapphire breakage during the cutting process caused by the mismatch between the slicing equipment and the sapphire, and improves the safety of the cutting process.

[0004] To achieve the above objectives, the present application provides the following technical solutions: In the first aspect, the present application provides a method for managing equipment operation data based on sapphire slice production, which includes the following specific steps: S1. Acquire sapphire production data and image data, and simultaneously acquire slicing equipment operation data; S2, importing the acquired slicing device operation data into a slicing device operation evaluation model to perform slicing device operation evaluation; S3, importing the acquired sapphire production data and image data into a sapphire production anomaly assessment model to perform sapphire production anomaly assessment; S4. Predicting abnormality in the slicing process based on the slicing equipment operation evaluation results and the sapphire production abnormality evaluation results; S5. Select appropriate slicing equipment to perform slicing process operations based on the slicing process abnormality prediction results.

[0005] As a preferred technical solution for the equipment operation data management method based on sapphire slicing production, the specific content of obtaining sapphire production data and image data and simultaneously obtaining slicing equipment operation data is: S11, obtaining a three-dimensional image of sapphire production through an image acquisition terminal, and obtaining sapphire defect position data and defect specification data; S12, collecting cutting data of the cutting device at the beginning of cutting through the cutting data collection terminal, wherein the cutting data includes cutting speed data, swing data of the blade during the cutting process, and cutting pressure data; S13, storing the collected data in a storage component.

[0006] As a preferred technical solution for the equipment operation data management method based on sapphire slicing production, the step of importing the acquired slicing equipment operation data into the slicing equipment operation evaluation model to perform slicing equipment operation evaluation includes the following specific steps: S21, obtaining cutting speed data, blade swing data and cutting pressure data during cutting; S22, importing the obtained knife edge swing data during the cutting process into a knife edge swing abnormality coefficient calculation formula to calculate the knife edge swing abnormality coefficient, wherein the knife edge swing abnormality coefficient calculation formula is: , T is the test time, Lt is the blade swing amplitude at time t, Lm is the maximum value of the blade swing amplitude safety range, vm is the average cutting speed, vt is the cutting speed at time t, dt is the time integral, Td is the blade swing abnormality coefficient. In this formula, the blade swing abnormality at different cutting speeds is comprehensively analyzed; S23, obtaining cutting speed data and cutting pressure data, and importing them into a cutting operation abnormality coefficient calculation formula to calculate the cutting operation abnormality coefficient, wherein the cutting operation abnormality coefficient calculation formula is: , where a is the cutting speed ratio, vz is the average cutting speed, st is the cutting pressure at time t, and sz is the average cutting pressure; S24, obtaining the calculated blade swing abnormality coefficient and cutting operation abnormality coefficient, and substituting them into the slicing equipment operation evaluation value calculation formula to calculate the slicing equipment operation evaluation value, wherein the slicing equipment operation evaluation value calculation formula is: ; It should be noted here that this step is used to conduct a comprehensive analysis of the abnormal operation of the cutting equipment.

[0007] As a preferred technical solution of the equipment operation data management method based on sapphire slice production, the method of importing the acquired sapphire production data and image data into the sapphire production anomaly assessment model to perform sapphire production anomaly assessment includes the following specific steps: S31, obtaining sapphire defect position data and defect specification data, wherein the defect specification data includes defect length and defect maximum width data; S32, importing the acquired sapphire defect position data and defect specification data into the production anomaly assessment value calculation formula to calculate the production anomaly assessment value of the sapphire, wherein the production anomaly assessment value calculation formula is: , where N is the number of defects, Di is the length of the i-th defect, Ki is the maximum width of the i-th defect, Mc is the surface area of ​​sapphire, xc is the centripetal value, b is the centripetal ratio, and mc is the defect concentration; It should be noted here that the possibility of breakage during the sapphire cutting process is comprehensively considered through the size and location data of the defects.

[0008] As a preferred technical solution for the equipment operation data management method based on sapphire slicing production, the slicing process abnormality prediction based on the slicing equipment operation evaluation result and the sapphire production abnormality evaluation result includes the following specific contents: S41, obtaining the calculated production abnormality evaluation value and slicing equipment operation evaluation value, and importing the production abnormality evaluation value and the slicing equipment operation evaluation value into the slicing process abnormality value calculation formula to calculate the slicing process abnormality value, wherein the slicing process abnormality value calculation formula is: ; S42. Compare the calculated slicing process abnormality value with the set slicing process abnormality threshold. If the calculated slicing process abnormality value is greater than or equal to the set slicing process abnormality threshold, it means that the sapphire slice is at risk of damage and the slicing equipment needs to be replaced. If the calculated slicing process abnormality value is less than the set slicing process abnormality threshold, it means that the sapphire slice is not at risk of damage and the slicing equipment does not need to be replaced.

[0009] In a second aspect, the present application provides an electronic device, comprising: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the above-mentioned equipment operation data management method based on sapphire slice production by calling the computer program stored in the memory.

[0010] In a third aspect, the present application provides a computer-readable storage medium storing instructions, which, when executed on a computer, enables the computer to execute the equipment operation data management method based on sapphire slice production as described above.

[0011] Compared with the prior art, the beneficial effects of the present application are as follows: the present application imports the acquired slicing equipment operation data into the slicing equipment operation evaluation model to carry out slicing equipment operation evaluation, imports the acquired sapphire production data and image data into the sapphire production anomaly evaluation model to carry out sapphire production anomaly evaluation, and predicts slicing process anomalies based on the slicing equipment operation evaluation results and the sapphire production anomaly evaluation results. The present application comprehensively analyzes the implicit features related to slicing quality based on the sapphire equipment operation data and the sapphire production data, accurately predicts the slicing quality, avoids damage to the sapphire during the cutting process caused by the mismatch between the slicing equipment and the sapphire, and improves the safety during the cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings; Figure 1 This is a schematic diagram of the overall process of the equipment operation data management method based on sapphire slice production of this application; Figure 2 This is a schematic diagram of step S2 of the equipment operation data management method based on sapphire slice production of the present application; Figure 3 This is a schematic diagram of step S4 of the equipment operation data management method based on sapphire slice production of the present application; Figure 4 A schematic diagram of an electronic device of the present application. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present application and its application or use.

[0014] Here, we extend the technical problem in the background technology: it is a common problem that sapphire is damaged during the cutting process. There are many reasons that may cause sapphire to be damaged during the cutting process. First, the quality, sharpness and improper selection of the cutting tool may lead to excessive cutting force or inaccurate cutting, thereby causing cracks. Secondly, unreasonable settings of parameters such as cutting speed, feed speed and cutting depth may also cause sapphire to be damaged due to excessive stress during the cutting process. In addition, the vibration and instability of the equipment may also affect the cutting quality and cause sapphire to be damaged. Therefore, it is necessary to match the slicing equipment with the sapphire, but the existing technology does not provide a suitable solution. In order to solve the technical problems raised in the background technology, the present application provides a preferred embodiment: Figure 1-Figure 3 As shown, this embodiment provides a method for managing equipment operation data based on sapphire slice production, which includes the following specific steps: S1. Acquire sapphire production data and image data, and simultaneously acquire slicing equipment operation data; In one specific embodiment, the specific contents of obtaining sapphire production data and image data and simultaneously obtaining slicer equipment operation data are: S11. Obtain a three-dimensional image of sapphire production through an image acquisition terminal, and obtain the sapphire defect position data and defect specification data. To obtain the three-dimensional image of sapphire production through an image acquisition terminal, a three-dimensional image acquisition system based on a single camera can be used. The system sends and receives instructions by developing a corresponding program in the host computer, and uses GemView software to provide a human-computer interaction interface, so that the system operator can interact with the mouse and keyboard device. In the process of obtaining the three-dimensional image, the operator needs to input and set the rotation parameters, and click the start three-dimensional acquisition button. The program will generate a related instruction set in the background and send it to the three-dimensional image acquisition experimental platform. The camera transmits the real-time information of the object on the center tray of the equipment back to the GemView software. The software collects information and synthesizes a three-dimensional photo sequence according to the set parallax angle. In addition, a three-dimensional data acquisition method based on multi-station scanning, such as a target method, a rear-view orientation method, and a data acquisition method based on automatic point cloud stitching, can also be used to obtain the internal defect position data and defect specification data of sapphire through a transmission microscope; S12, collecting cutting data of the cutting device at the beginning of cutting through the cutting data collection terminal, wherein the cutting data includes cutting speed data, swing data of the blade during cutting, and cutting pressure data. It should be noted in this embodiment that the cutting data here is obtained through sensors installed on the cutting device, for example, the cutting speed can be obtained through a speed sensor, and the swing data of the blade and the cutting pressure data can be obtained through a displacement sensor and a pressure sensor respectively; S13, storing the collected data in a storage component; S2, importing the acquired slicing device operation data into a slicing device operation evaluation model to perform slicing device operation evaluation; In one specific embodiment, importing the acquired slicing device operation data into a slicing device operation evaluation model to perform slicing device operation evaluation includes the following specific steps: S21, obtaining cutting speed data, blade swing data and cutting pressure data during cutting; S22, importing the obtained blade swing data during the cutting process into a blade swing abnormality coefficient calculation formula to calculate the blade swing abnormality coefficient, wherein the blade swing abnormality coefficient calculation formula can be any formula that comprehensively analyzes the blade swing abnormality at different cutting speeds, wherein the blade swing abnormality coefficient calculation formula is preferably: , T is the test time, Lt is the blade swing amplitude at time t, Lm is the maximum value of the blade swing amplitude safety range, vm is the average cutting speed, vt is the cutting speed at time t, dt is the time integral, Td is the blade swing abnormality coefficient, where, in this formula, the blade swing abnormality at different cutting speeds is comprehensively analyzed. It should be noted that the test time here is set according to the experimental needs, which can be 1 minute or 20 seconds; S23, obtaining cutting speed data and cutting pressure data, and importing them into a cutting operation abnormality coefficient calculation formula to calculate the cutting operation abnormality coefficient, wherein the cutting operation abnormality coefficient calculation formula can be any formula that analyzes the fluctuation size abnormality of the cutting speed data and the cutting pressure data within a set period, which can be a variance or standard deviation formula, etc., wherein the cutting operation abnormality coefficient calculation formula is preferably: , where a is the cutting speed ratio, vz is the average cutting speed, st is the cutting pressure at time t, and sz is the average cutting pressure. This formula is used to analyze the abnormal fluctuations of the cutting speed data and the cutting pressure data within the set period. The smaller the fluctuations of the cutting speed and the cutting pressure, the more beneficial it is to the cutting quality. S24, obtaining the calculated blade swing abnormality coefficient and cutting operation abnormality coefficient, and substituting them into the slicing equipment operation evaluation value calculation formula to calculate the slicing equipment operation evaluation value, wherein the slicing equipment operation evaluation value calculation formula is: ; S3, importing the acquired sapphire production data and image data into a sapphire production anomaly assessment model to perform sapphire production anomaly assessment; In one specific embodiment, importing the acquired sapphire production data and image data into a sapphire production anomaly assessment model to perform sapphire production anomaly assessment includes the following specific steps: S31, obtaining sapphire defect position data and defect specification data, wherein the defect specification data includes defect length and defect maximum width data; S32, importing the acquired sapphire defect position data and defect specification data into the production anomaly assessment value calculation formula to calculate the production anomaly assessment value of the sapphire, wherein the production anomaly assessment value calculation formula is: , where N is the number of defects, Di is the length of the i-th defect, Ki is the maximum width of the i-th defect, Mc is the surface area of ​​sapphire, xc is the centripetal value, which is calculated as follows: the average distance from the defect to the center of the sapphire divided by the average diameter of the sapphire, which means that the closer the defect is to the center of the sapphire, the greater the defect impact, and the greater the weight, b is the centripetal ratio, mc is the defect aggregation, which is calculated as follows: the average distance between defects divided by the average diameter of the sapphire, which means that the more the defects are aggregated, the greater the defect impact, and the greater the weight, and the average diameter mentioned here is the diameter of the circumscribed sphere of the sapphire image, just for the convenience of calculation settings; It should be noted here that the possibility of breakage during sapphire cutting is comprehensively considered through the size and location data of defects; S4. Predicting abnormality in the slicing process based on the slicing equipment operation evaluation results and the sapphire production abnormality evaluation results; In one specific embodiment, the prediction of slicing process anomaly based on the slicing equipment operation evaluation result and the sapphire production anomaly evaluation result includes the following specific contents: S41, obtaining the calculated production anomaly evaluation value and the slicing equipment operation evaluation value, and importing the production anomaly evaluation value and the slicing equipment operation evaluation value into the slicing process anomaly value calculation formula to calculate the slicing process anomaly value, wherein the slicing process anomaly value calculation formula is: ; S42, comparing the calculated slicing process abnormal value with the set slicing process abnormal threshold, if the calculated slicing process abnormal value is greater than or equal to the set slicing process abnormal threshold, it means that the sapphire slice has a risk of damage, and the slicing equipment needs to be replaced; if the calculated slicing process abnormal value is less than the set slicing process abnormal threshold, it means that the sapphire slice has no risk of damage, and the sapphire slice does not need to be replaced. It should be noted that the risk of damage here does not mean that damage will occur during cutting, but that the probability of damage during cutting is high; S5. Select a suitable slicing device to perform the slicing process operation based on the slicing process abnormality prediction result. The specific content is to select a suitable slicing device, that is, a slicing device whose calculated slicing process abnormality value is greater than or equal to the set slicing process abnormality threshold. At this time, the slicing device can be repaired or replaced with a slicing device with excellent performance.

[0015] It should be particularly noted in the present embodiment that the setting parameters such as the cutting speed ratio coefficient, the centripetal ratio coefficient and the slicing process abnormality threshold in the present embodiment are set by technical personnel in this field according to experiments, and the preferred experimental method is: obtaining at least 200 sets of sapphire production data and image data, and slicing equipment operation data, substituting the acquired data into the slicing process abnormality value calculation formula to calculate the slicing process abnormality value, obtaining the actual slicing process slicing breakage situation and the slicing process abnormality value, importing the actual slicing process slicing breakage situation and the slicing process abnormality value into the fitting software, and outputting the values ​​of the setting parameters such as the cutting speed ratio coefficient, the centripetal ratio coefficient and the slicing process abnormality threshold that meet the highest damage judgment accuracy.

[0016] According to the above implementation content, this embodiment has the following technical advantages or strengths compared with the prior art: the acquired slicing equipment operation data is imported into the slicing equipment operation evaluation model to perform slicing equipment operation evaluation, the acquired sapphire production data and image data are imported into the sapphire production anomaly evaluation model to perform sapphire production anomaly evaluation, and slicing process anomaly prediction is performed based on the slicing equipment operation evaluation results and the sapphire production anomaly evaluation results. This application conducts a comprehensive analysis of the implicit characteristics related to slicing quality based on the sapphire equipment operation data and the sapphire production data, accurately predicts the slicing quality, avoids damage to the sapphire during the cutting process caused by the mismatch between the slicing equipment and the sapphire, and improves the safety of the cutting process.

[0017] The present embodiment may also provide a sapphire slicing production-based equipment operation data management system, which is implemented based on the above-mentioned sapphire slicing production-based equipment operation data management method, and specifically includes at least a data acquisition module, a slicing equipment operation evaluation module, a production abnormality evaluation module and a slicing process abnormality prediction module; wherein the data acquisition module is used to acquire sapphire production data and image data, and simultaneously acquire sapphire slicing equipment operation data; the slicing equipment operation evaluation module is used to import the acquired sapphire slicing equipment operation data into a sapphire equipment operation evaluation model to perform sapphire equipment operation evaluation; the production abnormality evaluation module is used to import the acquired sapphire production data and image data into a sapphire production abnormality evaluation model to perform sapphire production abnormality evaluation; the slicing process abnormality prediction module performs slicing process abnormality prediction based on the slicing equipment operation evaluation result and the sapphire production abnormality evaluation result, and selects a suitable slicing equipment to perform slicing process operation based on the slicing process abnormality prediction result; In some embodiments, it may also include a control unit for controlling the operation of the data acquisition module, the slicing equipment operation evaluation module, the production abnormality evaluation module and the slicing process abnormality prediction module, and the control unit may also have a PLC control function to control the slicing equipment to perform slicing process operations; The specific steps for each unit module in the equipment operation data management system based on sapphire slice production of the present application to realize the corresponding functions can be referred to the steps in the embodiment of the equipment operation data management method based on sapphire slice production above, and will not be repeated here.

[0018] This embodiment also provides an electronic device, such as Figure 4 As shown, it includes: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the above-mentioned equipment operation data management method based on sapphire slice production by calling the computer program stored in the memory.

[0019] The memory can be used to store instructions, programs, codes, code sets or instruction sets. The memory 310 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function, and instructions for implementing the device operation data management method based on sapphire slice production provided in the above embodiment, etc.; the data storage area may store data involved in the device operation data management method based on sapphire slice production provided in the above embodiment, etc.

[0020] The processor may include one or more processing cores. The processor executes various functions and processes data of the present application by running or executing instructions, programs, code sets or instruction sets stored in the memory, calling data stored in the memory. The processor may be at least one of an application-specific integrated circuit (ASIC), a digital signal processor (DSP), a digital signal processing device (DSPD), a programmable logic device (PLD), a field programmable gate array (FPGA), a central processing unit (CPU), a controller, a microcontroller and a microprocessor. It is understandable that for different devices, the electronic device used to implement the above-mentioned processor function may also be other, and the embodiments of the present application are not specifically limited.

[0021] A communication bus may also be included, and the communication bus may include a path to transmit information between the above components. The communication bus may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The communication bus may be divided into an address bus, a data bus, a control bus, etc.

[0022] This embodiment also provides a computer-readable storage medium having a rewritable computer program stored thereon; When the computer program is executed on a computer device, the computer device is enabled to execute the above-mentioned device operation data management method based on sapphire slice production.

[0023] For example, the computer readable storage medium can be a read-only memory, a random access memory, a read-only CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.

[0024] The above embodiments can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented by software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When a computer instruction or computer program is loaded or executed on a computer, a process or function according to an embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network or other programmable device. Computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, computer instructions can be transmitted from one website site, computer, server or data center to another website site, computer, server or data center through a wired network or / and a wireless network. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state hard disk.

[0025] The terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus.

[0026] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of application involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the aforementioned application concept. For example, the above features are replaced with (but not limited to) technical features with similar functions applied in the present application.

Claims

1. A method for managing equipment operation data based on sapphire slice production, characterized in that: It includes the following specific steps: Acquire sapphire production data and image data, and also acquire slicing equipment operation data; Importing the acquired slicing equipment operation data into a slicing equipment operation evaluation model to perform slicing equipment operation evaluation; Importing the acquired sapphire production data and image data into a sapphire production anomaly assessment model to conduct sapphire production anomaly assessment; Predict slicing process anomalies based on slicing equipment operation evaluation results and sapphire production anomaly evaluation results; Based on the abnormal prediction results of the slicing process, appropriate slicing equipment is selected to perform the slicing process operation.

2. The equipment operation data management method based on sapphire slice production according to claim 1, characterized in that: The step of importing the acquired slicing device operation data into the slicing device operation evaluation model to perform slicing device operation evaluation includes the following specific steps: Obtain cutting speed data, blade swing data and cutting pressure data during cutting; The obtained knife edge swing data during the cutting process is imported into the knife edge swing abnormality coefficient calculation formula to calculate the knife edge swing abnormality coefficient, wherein the knife edge swing abnormality coefficient calculation formula is: , T is the test time, Lt is the blade swing amplitude at time t, Lm is the maximum value of the blade swing amplitude safety range, vm is the average cutting speed, vt is the cutting speed at time t, dt is the time integral, and Td is the blade swing abnormality coefficient; Obtain cutting speed data and cutting pressure data, and import them into a cutting operation abnormality coefficient calculation formula to calculate the cutting operation abnormality coefficient; Obtain the calculated blade swing abnormality coefficient and cutting operation abnormality coefficient and substitute them into the slicer equipment operation evaluation value calculation formula to calculate the slicer equipment operation evaluation value, wherein the slicer equipment operation evaluation value calculation formula is: , where Tl is the cutting operation abnormality coefficient.

3. The equipment operation data management method based on sapphire slice production according to claim 2, characterized in that: The calculation formula of the cutting operation abnormality coefficient is: , where a is the cutting speed coefficient, vz is the average cutting speed, st is the cutting pressure at time t, and sz is the average cutting pressure.

4. The equipment operation data management method based on sapphire slice production according to claim 1, characterized in that: The step of importing the acquired sapphire production data and image data into the sapphire production anomaly assessment model to perform sapphire production anomaly assessment includes the following specific steps: Acquire sapphire defect position data and defect specification data, wherein the defect specification data includes defect length and defect maximum width data; The acquired sapphire defect position data and defect specification data are imported into the production anomaly assessment value calculation formula to calculate the production anomaly assessment value of the sapphire, wherein the production anomaly assessment value calculation formula is: , where N is the number of defects, Di is the length of the i-th defect, Ki is the maximum width of the i-th defect, Mc is the surface area of ​​sapphire, xc is the centripetal value, b is the centripetal ratio, and mc is the defect concentration.

5. The equipment operation data management method based on sapphire slice production according to claim 4, characterized in that: The calculation formula of the centripetal value is: the average distance from the defect to the center of the sapphire divided by the average diameter of the sapphire, and the calculation formula of the defect concentration is: the average distance between defects divided by the average diameter of the sapphire.

6. The equipment operation data management method based on sapphire slice production according to claim 5, characterized in that: The slicing process anomaly prediction based on the slicing equipment operation evaluation result and the sapphire production anomaly evaluation result includes the following specific contents: obtaining the calculated production anomaly evaluation value and the slicing equipment operation evaluation value, and importing the production anomaly evaluation value and the slicing equipment operation evaluation value into the slicing process anomaly value calculation formula to calculate the slicing process anomaly value, wherein the slicing process anomaly value calculation formula is: ; Compare the calculated slicing process abnormality value with the set slicing process abnormality threshold. If the calculated slicing process abnormality value is greater than or equal to the set slicing process abnormality threshold, it means that the sapphire slice is at risk of breakage and the slicing equipment needs to be replaced. If the calculated slicing process abnormality value is less than the set slicing process abnormality threshold, it means that the sapphire slice is not at risk of breakage and the slicing equipment does not need to be replaced.

7. The equipment operation data management method based on sapphire slice production according to claim 1, characterized in that: The specific contents of obtaining sapphire production data and image data and simultaneously obtaining slicer equipment operation data are as follows: Acquire 3D images of sapphire production through image acquisition terminals, and obtain sapphire defect location data and defect specification data; The cutting data of the cutting device at the beginning of cutting is collected through the cutting data collection terminal, wherein the cutting data includes cutting speed data, swing data of the blade during cutting and cutting pressure data; the collected data is stored in the storage component.

8. An electronic device comprising: A processor and a memory, wherein the memory stores a computer program that can be called by the processor; It is characterized in that the processor executes the equipment operation data management method based on sapphire slice production as described in any one of claims 1 to 7 by calling the computer program stored in the memory.

9. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the equipment operation data management method based on sapphire slice production as described in any one of claims 1 to 7.

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