Substrate processing apparatus

Abstract

A linear motor includes: a frame having a horizontal reference plane; and an array of electromagnets connected to the frame to form a drive plane at a predetermined height relative to the reference plane. The array of electromagnets is arranged such that a series of electromagnets in the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets is coupled to an AC power source to energize each electromagnet. At least one reaction pressure plate made of a paramagnetic, diamagnetic or non-magnetic conductive material is disposed in cooperation with the electromagnets in the array of electromagnets such that the electromagnets generate a suspension force and a propulsive force against the reaction pressure plate by excitation of an alternating current, the suspension and propulsion forces controllably suspend and propel the reaction pressure plate along at least one drive line in a controlled attitude relative to the drive plane.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application is a non-provisional application and claims the benefit of U.S. Provisional Patent Application No. 62 / 979,195, filed on February 20, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] Example embodiments relate generally to substrate processing equipment, and more particularly to substrate transporters of substrate processing equipment. Background Art

[0003] Semiconductor automation generally includes a series of building blocks that are required to support the implementation of processes to ultimately achieve a predetermined level of quality and repeatability in semiconductor chip manufacturing. One component of semiconductor automation is a wafer (also called a substrate) handler that transports wafers or substrates between load locks and process modules and / or between process modules (e.g., in the case of a sequential process tool architecture).

[0004] Typically, a wafer handler includes a robotic manipulator with a revolute or prismatic joint and a corresponding linkage-based mechanism driven by an actuator remote from the end effector of the robotic manipulator, which contacts or otherwise interfaces with the wafer. The design of such conventional manipulators typically includes the use of bearings at different parts of the manipulator structure, typically at the mechanical interface between each arm link of the manipulator, in a vacuum environment. When the wafer is handled at high temperatures (such as in excess of 400° C.), there is typically the possibility of lubricant degassing, particle generation, and friction changes during the operation of the bearing in a vacuum environment. The wafer handler is typically mounted to a vacuum cluster tool, and its mechanical travel is also limited by the design of its associated arm link length. Therefore, conventional wafer handlers operating in a vacuum are not suitable for "long" vacuum cluster tools, such as vacuum cluster tools known in the industry as "linear tool configurations".

[0005] In the case of linear tool configurations, "long reach" manipulators with long arm linkage lengths and articulated end effectors are typically employed to transfer wafers between the linear tool's load lock and the processing module. These long reach manipulators typically have mechanical designs with low natural frequencies, an increased number of actuators, undesirable arm linkage deflections, mechanical positioning hysteresis, high sensitivity to thermal expansion, expensive bearings, limited ability to level the end effector to the wafer holding station, and limited motion throughput. Additionally, the linear tool configuration may be scalable in the sense of allowing the end user to extend the length of the linear tool with minimal impact on existing automation. Another desirable feature of a linear tool is the ability to service the linear tool (such as performing scheduled maintenance on a wafer handler) with minimal disruption to the tool's operation.

[0006] As an alternative to the above-mentioned wafer carrier, a magnetic floating wafer conveyor can be used, in which an AC magnetic floating device is provided for floating and conveying a conductive floating body or a paramagnetic or non-magnetic metal material above a row of AC electromagnets. The AC magnetic floating device generally includes a single-phase AC power supply with a first frequency for floating the floating body, a three-phase AC power supply with a second frequency for conveying the floating body, an adder for adding the AC power from the two current sources, and a power supply circuit for supplying the added AC power to the row of AC electromagnets. The floating body can be stopped at a desired position with the help of efficient conveyance.

[0007] same, Figure 33-Figure 36 An example of an inductive repulsion type magnetic levitation mechanism is shown. Figure 33-Figure 36 In FIG. 1 , numeral 01 represents an AC electromagnet, and numeral 02 represents a floating body to be transported. Lightweight and highly conductive materials such as aluminum are suitable for the floating body 02. The object to be transported is usually placed on the floating body 02. Figure 33-Figure 36 In, when Fig.35 When a single-phase alternating current represented by numeral 04 is supplied to the alternating current electromagnet 01, an alternating magnetic field is generated above the electromagnet. Since the floating body exists in the magnetic field, an alternating current called eddy current is generated in the aluminum material forming the floating body.

[0008] The magnetic field generated by the eddy current repels the magnetic field generated by the electromagnet. Fig.33 and Fig.34 The buoyancy force represented by F1 in the figure acts on the floating body through this repulsion. Fig.36 The three-phase AC power indicated by the numerals 05, 06 and 07 shown in FIG. 1 is supplied to Fig.33 and Fig.34 When the three-phase electromagnet 03 is Fig.33 and Fig.34 The moving force represented by F2 acts on the floating body 02, and the floating body 02 is transported. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The foregoing aspects and other features of the disclosed embodiments are explained in the following description in conjunction with the accompanying drawings, in which: Figure 1A is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Figure 1B is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Figure 2 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Figure 3 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Figure 4 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Figure 5 is a schematic plan view of a substrate processing system incorporating aspects of the disclosed embodiments; Figure 6 is an exemplary substrate handler motion of a substrate processing apparatus described herein according to aspects of the disclosed embodiments; Figure 7 is a schematic plan view of a substrate processing system incorporating aspects of the disclosed embodiments; Figure 8 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig. 8A is a schematic perspective view of a portion of a substrate handler according to aspects of the disclosed embodiments; Fig. 9 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig.10 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig. 10A According to aspects of the disclosed embodiments Fig.10 A schematic perspective view of a portion of a substrate handler; Fig.11 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig.11A According to aspects of the disclosed embodiments Fig.11 A schematic perspective view of a portion of a substrate handler; Fig. 12A is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig. 12B According to aspects of the disclosed embodiments Fig. 12A A schematic front view of a substrate processing apparatus; Fig.13A is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig. 13B According to aspects of the disclosed embodiments Fig.13A A schematic front view of a substrate processing apparatus; Fig.14 is a schematic plan view of a substrate processing apparatus incorporating aspects of the disclosed embodiments; Fig.14A According to aspects of the disclosed embodiments Fig.14 A schematic plan view of a portion of a substrate processing apparatus; Fig. 14B is a schematic front view of a substrate transport cart according to aspects of the disclosed embodiments; Fig. 14C According to aspects of the disclosed embodiments Fig. 14B A schematic plan view of a substrate transport cart in FIG. Fig.15A is a front elevation view of a substrate handler according to aspects of the disclosed embodiments; Fig. 15B According to aspects of the disclosed embodiments Fig.15A A schematic side elevation view of a substrate handler of ; Fig. 15C According to aspects of the disclosed embodiments Fig.15A A schematic plan view of a substrate carrier of FIG. Fig.16A is a schematic plan view of a substrate handler according to aspects of the disclosed embodiments; Fig. 16B According to aspects of the disclosed embodiments Fig.16A A schematic side elevation view of a substrate handler of ; Fig. 16C The invention includes aspects according to the disclosed embodiments. Fig.16A A schematic plan view of a portion of a substrate processing apparatus including a substrate handler; Fig.17 is a schematic illustration of an exemplary actuator control system network according to aspects of the disclosed embodiments; Fig.18 is a schematic illustration of a portion of a sensor control system network according to aspects of the disclosed embodiments; Fig.19 is a schematic illustration of an exemplary sensor control system network according to aspects of the disclosed embodiments; Fig. 20 According to aspects of the disclosed embodiments Fig.19 A schematic illustration of a portion of a sensor control system network; Fig.21 is a schematic illustration of exemplary motion control of a substrate handler according to aspects of the disclosed embodiments; Fig.21A is a schematic perspective illustration of substrate handler motion according to aspects of the disclosed embodiments; Fig. 22 is a free body force diagram relative to the maximum allowable acceleration of a conventional substrate transport device; Fig.23 is a free body force diagram illustrating the effect of pitch angle on acceleration of a substrate handler sliding relative to a substrate in accordance with aspects of the disclosed embodiments; Fig.24 is a free body force diagram of a substrate according to aspects of the disclosed embodiments illustrating the effect of pitch angle on substrate sliding in the absence of friction; Fig.24A is an exemplary graph illustrating propulsion acceleration with respect to pitch angle in the absence of friction relative to sliding of a substrate in accordance with aspects of the disclosed embodiment; Fig.25A is a free body force diagram of a substrate according to aspects of the disclosed embodiments illustrating the effect of pitch angle on substrate sliding in the presence of friction; Fig.25B is a free body force diagram of a substrate according to aspects of the disclosed embodiments illustrating the effect of pitch angle on substrate sliding in the presence of friction; Fig.26 is an exemplary graph illustrating acceleration limits with respect to pitch angle relative to sliding of a substrate in the presence of friction according to aspects of the disclosed embodiment; Fig. 27 is a schematic front view of a substrate handler according to aspects of the disclosed embodiment, illustrating pitch control of the substrate handler; Fig.28 is a schematic front view of a substrate handler passing another substrate handler within a transport chamber according to aspects of the disclosed embodiments; Fig.29 is a schematic front view of a substrate handler passing another substrate handler within a transport chamber according to aspects of the disclosed embodiments; Fig.30 is a schematic illustration of a portion of an actuator control system network showing dynamic phase allocation according to aspects of the disclosed embodiments; Fig.31A and Fig.31B The figure shows the tilt control of the platen using a conventional linear drive line system and static phase control. Fig.32A and Fig.32B illustrates tilt control of a portion of a substrate handler utilizing an actuator control system network with dynamic phase allocation and virtual multi-phase actuator units in accordance with aspects of the disclosed embodiments; Fig.32C illustrates electrical phase angle control for independent propulsion and lift control of a substrate handler via an actuator control system network in accordance with aspects of the disclosed embodiments; Fig.33 is a schematic front view of a conventional transport device; Fig.34 yes Fig.33 A schematic plan view of a conventional transport device; Fig.35 It is shown Fig.33 A diagram of the waveform of the floating current in a conventional transport device; Fig.36 It is shown Fig.33 Illustration of three waveforms of alternating current used for transmission in conventional transport devices; Fig.37 is a schematic plan view of a conventional substrate processing apparatus; Fig.38 is a schematic plan view of a conventional substrate processing apparatus; Fig.39 is a schematic illustration of a cluster control architecture according to aspects of the disclosed embodiments; Fig.40A is a schematic illustration of a PVT frame according to aspects of the disclosed embodiment; Fig.40B is a schematic illustration of a PVT-FG frame according to aspects of the disclosed embodiment; Fig.41 is a flowchart of an exemplary method according to aspects of the disclosed embodiments; and Fig.42 is a flow chart of an exemplary method according to aspects of the disclosed embodiments. DETAILED DESCRIPTION

[0010] Figure 1- Fig.14 Exemplary substrate processing apparatuses 100, 100A, 200, 300, 400, 500, 800, 900, 1200, 1300 according to aspects of the disclosed embodiments are illustrated. Although aspects of the disclosed embodiments will be described with reference to the accompanying drawings, it should be understood that aspects of the disclosed embodiments may be embodied in many forms. In addition, any suitable size, shape or type of element or material may be used.

[0011] Based on the problems and limitations of conventional substrate processing apparatus described above, it is desired to have a novel and innovative substrate handler and associated control architecture that is configured to operate in a vacuum environment, is substantially free of bearings and lubricants, implement substrate transfer across scalable distances without affecting the substrate handler design, transports substrates at higher accelerations than the conventional solutions described above (i.e., substantially no new end effector materials are required), and operates multiple substrate handlers in a coordinated manner to avoid collisions and reduce the footprint of the substrate processing apparatus.

[0012] refer to Figure 15A-Figure 15C, the wafer handler 1500 is part of a linear electric (or electric) machine 1599 (as will be described in more detail herein and also referred to as an electromagnetic conveyor substrate transport device) included in the substrate processing apparatus of FIGS. 1-14 . The wafer handler 1500 includes a paramagnetic base plate 1510 (also referred to as a reaction platen) (e.g., made of copper, aluminum, or other suitable diamagnetic or non-magnetic material that can induce eddy currents) that is shaped to enable at least bidirectional linear induction propulsion along the direction of a linear track 1550 formed by at least one linear induction motor stator 1560, and independent rotation of the base plate 1510. The wafer handler 1500 also includes an end effector 1520 that is rigidly attached to the base plate 1510 and is configured to stably hold the substrate for transport in a corresponding chamber of the substrate processing apparatus. As will be described herein, the wafer handler 1500 is controlled by an actuator and sensor control unit so that the configuration of the wafer handler 1500 is independent of the travel distance that the wafer handler 1500 can cover (or extend). As will be described herein, by utilizing a network of actuators 1700 and sensors 2000 physically distributed along at least one length of the substrate processing apparatus, such as along the length of the transport chamber 118 (see Figure 17-20 and Fig.39 1500) to achieve independence of the wafer handler configuration 1500. In aspects of the disclosed embodiments, the actuators 1700 and sensors 2000 are not associated with any particular substrate handler 1500; instead, the same actuators 1700 and sensors 2000 are shared by multiple substrate handlers 1500 and can control multiple substrate handlers 1500 simultaneously, which reduces the cost of ownership of the substrate handlers 1500 because the substrate handlers 1500 can be added to or removed from the substrate processing apparatus without adding additional actuators and sensors. Simultaneous control of multiple substrate handlers 1500 by means of a common actuator 1700 and sensors 2000 is accomplished by a control system (described in more detail below) in accordance with aspects of the disclosed embodiments, the control system being configured to dynamically distribute the excitation phases of each actuator coil unit (also referred to as an electromagnet) of the common actuator 1700 between different excitation phases in a manner that provides force vector continuity for implementing wafer handler motion in three dimensions by means of control of up to six degrees of freedom by the common (group of) actuators 1700. As will be described herein, substrate handlers 1500 that may be simultaneously controlled in roll, pitch, and / or yaw control to allow two or more independently operated substrate handlers 1500 to be moved by moving in a direction generally parallel to the thrust direction of motion (e.g., see Fig.29 )'s rotation axis to tilt each of the substrate handlers 1500 (or at least one of them) to reduce the distance between the substrate handlers 1500.

[0013] As described above, conventional robotic manipulators with articulated linkages require significantly different mechanical designs because the required travel of the manipulator is increased in order to reach a greater number of processing modules, which increases the cost of the robotic manipulator and may shorten the robotic manipulator maintenance intervals. In contrast to conventional substrate handling systems, aspects of the disclosed embodiments are highly scalable compared to existing generally accepted substrate handling solutions (such as those described above), and increase the complexity and reliability issues caused by the increased number of mechanical components.

[0014] Aspects of the disclosed embodiments also achieve significantly higher substrate processing throughput compared to conventional substrate handling solutions. As described herein, aspects of the disclosed embodiments include an innovative motion sensing control architecture that pitches the substrate holding surface of the substrate handler end effector toward the direction of movement to achieve higher accelerations compared to conventional substrate handling solutions while maintaining contact between the wafer and the end effector without slipping.

[0015] As will be described in more detail herein, aspects of the disclosed embodiments provide a magnetically levitated substrate transport device based on linear induction technology that is configured to provide lift, lateral stabilization, and propulsion to a substrate handler. Aspects of the disclosed embodiments also provide a linear induction motor stator that operates in and forms independently controlled linear tracks that are orthogonal or otherwise angled in an orientation between approximately parallel and approximately orthogonal and / or form an arcuate or rotational path over a two-dimensional area. Aspects of the disclosed embodiments provide a coil controller that is configured to generate alternating current of a predetermined frequency and amplitude for each phase of each linear induction motor stator associated with a corresponding linear track 1550. The propulsion force provided by the linear track is controlled so as to rotate the substrate 1510 independently of the linear movement of the substrate along the track, wherein the propulsion force generates a moment load around the axis of rotation of the substrate 1510.

[0016] Aspects of the disclosed embodiments include a control system configured to track the position of the substrate 1510 and control the phase currents of the independent linear rails 1550 so as to control the movement of the substrate 1510 along the independent linear rails 1550 in a desired propulsion direction. The control system according to aspects of the disclosed embodiments also enables the movement of the substrate 1510 in a lifting direction while maintaining the lateral stability of the substrate 1510. The control system is configured to generate propulsion forces with the linear rails 1550 so as to control the roll, pitch, and yaw of the substrate handler 1500, wherein the roll, pitch, and yaw motion of the substrate handler 1500 can be employed to adjust the tilt of the substrate handler 1500 according to the desired acceleration of the substrate handler 1500 in the linear and / or rotational motion directions (e.g., see Fig.21) maximizes substrate production throughput so as to increase the acceleration threshold along the thrust direction of the substrate carrier 1500.

[0017] Aspects of the disclosed embodiments include a sensor processing unit 1850 (see Fig.18 ), which may be part of a sensor and control network, such as (Ethernet for control automation technology, in Fig.18 ECat (exist Fig.18 The sensor processing unit includes general purpose sensor and processing hardware (including non-transitory computer program code or software) configured to interface with a variety of sensor technologies, such as a camera 1810, a CCD array 1811, an accelerometer 1812, a temperature sensor 1813, a proximity or distance sensor 1814, a magnetic sensor 1815, a vibration sensor 1816, or any other suitable sensor.

[0018] refer to Figure 1A , a schematic plan view of a substrate processing apparatus 100 incorporating aspects of the disclosed embodiments is shown. The substrate processing apparatus 100 is connected to an environmental front end module (EFEM) 114 having a plurality of load ports 112, such as Figure 1A . The load port 112 is capable of supporting a plurality of substrate storage tanks 171, such as, for example, conventional FOUP tanks; although any other suitable type may be provided. The EFEM 114 communicates with the processing device via a load lock 116 connected to the processing device, as will be further described below. The EFEM 114 (which may be open to the atmosphere) has a substrate transport device (not shown, but similar in some respects to the linear motor 1599 described herein) capable of transporting substrates from the load port 112 to the load lock 116. The EFEM 114 may further include substrate alignment capabilities, batch handling capabilities, substrate and carrier identification capabilities, or other. In other aspects, the load lock 116 may be directly interfaced with the load port 112, such as where the load lock has batch handling capabilities or where the load lock has the ability to transfer wafers directly from the FOUP to the lock. Some examples of such devices are disclosed in U.S. Patent Nos. 6,071,059, 6,375,403, 6,461,094, 5,588,789, 5,613,821, 5,607,276, 5,644,925, 5,954,472, 6,120,229, and 6,869,263, all of which are incorporated herein by reference in their entirety. In other aspects, other load lock options may be provided.

[0019] Still reference Figure 1A, a processing apparatus 100 that can be used to process semiconductor substrates (e.g., 200 mm, 300 mm, 450 mm, or other suitable sized wafers), panels for flat panel displays, or any other desired type of substrate generally includes a transport chamber 118 (in one aspect, which maintains a sealed atmosphere therein), a processing module 120, and at least one substrate transport device or linear motor 1599. In the illustrated aspect, the substrate transport device 1599 can be integrated with the chamber 118 or coupled to the chamber in any suitable manner, as will be described herein. In this aspect, the processing modules 120 are mounted on both sides of the chamber 118. In other aspects, the processing modules 120 can be mounted on one side of the chamber 118, as shown, for example, in FIG. Figure 2 In. Figure 1A In the aspect shown in , the processing modules 120 are mounted in rows Y1, Y2 or vertical planes relative to each other. In other aspects, the processing modules 120 can be staggered or stacked vertically relative to each other on opposite sides of the transport chamber 118. Also refer to Figure 15A-Figure 15C , the transport device 1599 has a substrate handler 1500 that moves in the chamber 118 to transport substrates between the load lock 116 and the processing chamber 120. In the illustrated aspect, only one substrate handler 1500 is provided; however, in other aspects, more than one substrate handler may be provided. Figure 1A As seen in the transport chamber 118 (which is subjected to a vacuum or inert atmosphere or only a clean environment or a combination thereof in its interior) has a configuration and employs a novel substrate transport device 1599 that allows the processing modules 120 to be mounted to the chamber 118 in a Cartesian arrangement, wherein the processing modules 120 are arranged in substantially parallel vertical planes or rows. This results in a processing device 100 having a more compact footprint than comparable conventional processing devices (such as those described herein). In addition, the transport chamber 118 may be able to have any desired length (i.e., the length is scalable) to add any desired number of processing modules 120 as will be described in more detail below, so as to increase throughput. The transport chamber 118 may also be able to support any desired number of transport devices 1599 therein, and allow the transport devices 1599 to reach any desired processing chamber 120 coupled to the transport chamber 118 without interfering with each other. This actually decouples the throughput of the processing device 100 from the handling capacity of the transport device 1599, and thus the throughput of the processing device 100 becomes processing-limited rather than handling-limited. Thus, by adding processing modules 120 and corresponding handling capabilities on the same platform, throughput can be increased as needed.

[0020] Still reference Figure 1A, in this aspect, the transport chamber 118 has a generally rectangular shape, although in other aspects the chamber may have any other suitable shape. The chamber 118 has an elongated shape (i.e., the length is much longer than the width) and defines a generally linear transport path for the transport device 1599 therein. The chamber 118 has a longitudinal sidewall 118S. The sidewall 118S has a transport opening or port 118O (also referred to as a substrate through opening) formed therethrough. The size of the transport port 118O is large enough to allow substrates to enter and exit the transport chamber 118 through the port (which may be sealed by a valve). As shown in FIG. Figure 1A As can be seen in the figure, in this aspect, the processing modules 120 are mounted on the outside of the side wall 118S, wherein each processing module 120 is aligned with a corresponding transport port 118O in the transport chamber 118. As may be appreciated, each processing module 120 can be sealed on the side 118S of the chamber 118 around the periphery of the corresponding transport orifice to maintain the vacuum in the transport chamber. Each processing module 120 can have a valve that is controlled by any suitable device to close the transport port when necessary. The transport ports 118O can be located in the same horizontal plane. Therefore, the processing modules on the chamber are also aligned in the same horizontal plane. In other aspects, the transport ports 118O can be arranged in different horizontal planes. Figure 1A As seen in FIG. 1 , in this aspect, the load locks 116 are mounted to the chamber side 118S at the two forward most transport ports 118O. This allows the load locks 116 to be adjacent the EFEM 14 in front of the processing device. In other aspects, the load locks 116 can be located at any other transport port 118O on the transport chamber 118, such as, for example, shown in FIG. Figure 2 The hexahedral shape of the transport chamber 118 allows the length of the chamber to be selected as desired so as to accommodate as many rows of processing modules 120 as desired (see, for example, Figure 1B , Figure 3 , Figure 4-Figure 7 , which illustrates other aspects where the transport chamber 118 length can accommodate any number of processing modules 120).

[0021] As mentioned earlier, in Figure 1A In the aspect shown in FIG. 1 , the transport chamber 118 has a substrate transport 1599 having a single substrate handler 1500. The transport 1599 is integrated with the chamber 118 to translate the substrate handler 1500 back and forth between the front 118F and the rear 118R in the chamber 118. The substrate handler 1500 of the substrate transport 1599 has at least one end effector 1520 for holding one or more substrates.

[0022] It should be understood that Figure 1AThe transport device 1599 shown in FIG. 1 is a representative transport device and includes a substrate carrier 1500 magnetically supported from a linear track 1550. The transport device 1599 will be described in more detail below. The transport chamber 118 can form a frame having a horizontal reference plane 1299 (e.g., defining or otherwise corresponding to (e.g., substantially parallel to) the wafer transport plane 1290 - see FIG. Fig. 12B ), the linear rails 1550 can be mounted to the sidewalls 118S or floor of the transport chamber 118 and can extend the length of the chamber 118. This allows the substrate handler 1500 to traverse the length of the chamber 118. As will be described in more detail below, Figure 1A The linear rails 1550 each include an array of electromagnets or actuators 1700, also referred to herein as an actuator network, such as in Fig.14A , Fig. 15B , Fig. 15B , Fig. 16B , Fig. 16C and Fig.17 1500a-1500n) is connected to the transport chamber 118 to form a drive plane 1598 at a predetermined height H relative to the reference plane 1299, the electromagnet array 1700 is arranged so that a series of electromagnets 1700 define at least one drive line within the drive plane 1598, and each of the electromagnets 1700A-1700n (see Fig. 15B ) is coupled to an alternating current (AC) power source 1585, thereby energizing each electromagnet 1700A-1700n, wherein in one aspect, the AC power source is a three-phase AC power source. As described above (see Fig.15A ), the substrate or reaction plate 1510 is formed of a paramagnetic, diamagnetic or non-magnetic conductive material, which is configured to cooperate with the electromagnets 1700A-1700n of the electromagnet array 1700, so that the electromagnets 1700A-1700n are excited by the alternating current from the alternating current power supply 1585 to generate a suspension force FZ and a propulsion force FP on the substrate 1510 (see Fig.21 ), which is in a controlled posture relative to the drive plane 1598 along at least one drive line 177-180 (see, for example, FIG. 1- Figure 8 ) can controllably suspend and propel the substrate 1510.

[0023] Figure 1B Another aspect of a substrate processing apparatus 100A is shown that is substantially similar to apparatus 100. In this aspect, transport chamber 118 has two substrate handlers 1500A, 1500B that are independently operated by an electromagnet array 1700 (e.g., Fig. 16C1700n). The substrate handlers 1500A, 1500B are substantially the same as the substrate handler 1500 in the previous aspect. Both substrate handlers 1500A, 1500B may be supported by a common electromagnet array 1700, as previously described. As will be described herein, by individually controlling each coil element or electromagnet 1700A-1700n (e.g., Fig. 15B ), the substrate 1510 of each substrate handler 1500A, 1500B can be driven by the same at least one linear induction motor stator 1560. Thus, as can be achieved, the at least one linear induction motor stator 1560 can be used to independently move the end effector 1520 of each substrate handler 1500 in linear movement and / or rotation. However, in this aspect, the substrate handlers 1500A, 1500B cannot pass each other in the transport chamber 118 because the transport chamber 118 only includes one drive line 177 (as in the example of FIG. 1 ). Figure 8-Figure 10 1500B). Thus, the process modules 120 are positioned along the length of the transport chamber 118 so that substrates can be transported for processing in the process modules in a sequence that will avoid interference between the substrate handlers 1500A, 1500B. For example, the process module for coating can be located before the heating module, and the cooling module and etching module can be located last.

[0024] However, reference Figure 8-Figure 10 , the transport chamber 118 may have any suitable width to provide two or more substantially parallel drive lines 177, 178 extending along at least a portion of the length of the longitudinal transport chamber 118 such that two substrate handlers 1500A, 1500B pass adjacent to each other (similar to side rails or siding rails). Figure 8-Figure 10 In the aspect illustrated in FIG. 1 , the transport device 1599 has two drive wires 177 , 178 , but in other aspects, any suitable number of generally parallel longitudinally extending drive wires may be provided.

[0025] According to some aspects of the disclosed embodiments, the electromagnet array 1700 (or at least a portion thereof) may also act as a heater for the wafer handler (e.g., to control heating of the reaction platen and / or wafer to a desired predetermined temperature and for a desired predetermined time), such as in cases where it is desired to eliminate water vapor (e.g., gas) or to potentially preheat a wafer / substrate picked up from, for example, a load port on the way to a process module or alternatively to reduce thermal gradients between a wafer at a process module and a wafer handler end effector. The heating of the wafer handler may be accomplished with the reaction platen in transit or with the reaction platen remaining stationary in a predetermined position / location. Still according to some aspects of the disclosed embodiments, the electromagnet array 1700 (or at least a portion thereof) may also act as a heater, such as in cases where it is desired to heat the transport chamber 118 for degassing, such as in the case of, for example, eliminating water vapor. The controlled heating of the transport chamber 118 to a predetermined temperature for a predetermined time may be performed with the reaction platen stationary. Controlled heating of the transport chamber 118 may facilitate thermal scanning with appropriate thermal / infrared sensors of the transport chamber 118, such as to identify the presence and map the location of reaction platens within the transport chamber 118 upon cold start or power down of the transport chamber 118 and drives.

[0026] Reference now Figure 4 and Figure 5 , showing other substrate processing devices 400, 500 according to other aspects of the disclosed embodiments. Figure 4 and Figure 5 As seen in FIG. 1 , in these aspects, the transport chambers 118 , 118A, 118B, 118C are elongated to accommodate the additional processing modules 120 . Figure 4 The apparatus shown in FIG. 1 has twelve (12) processing modules 120 connected to a transport chamber 118 . Figure 5 The processing apparatus 500 in FIG. 5 is illustrated as having two transport chambers 118A, 118B coupled to each other via a bridge chamber 118C, which enables movement of a substrate carrier 1500 between the transport chambers 118A, 118B. Figure 5 Each transport chamber 118A, 118B in the embodiment has 24 process modules 120 connected thereto. The number of process modules 120 shown in these aspects is merely exemplary, and the substrate processing apparatus may have any other number of process modules 120, as previously described. In these aspects, the process modules 120 are arranged along the sides of the respective transport chambers 118A, 118B in a Cartesian arrangement similar to that previously described. However, in these aspects, the number of rows of process modules 120 has been greatly increased (e.g., in Figure 4 of the device in six (6) rows, and in Figure 5 in each device). Figure 4 In the aspect shown in , the EFEM may be removed and the load port 112 may mate directly with the load lock 116 . Figure 4 and Figure 5 The transport chamber of the substrate processing apparatus 400, 500 in the embodiment of the present invention may have a plurality of substrate handlers 1500 to handle substrates between the load lock 116 and the processing chamber 120. The number of substrate handlers 1500 shown is merely exemplary, and more or fewer apparatuses may be used. In these aspects, the substrate transport apparatus 1599 (a portion of which is shown in FIG. Figure 4 and Figure 5 ) is substantially similar to that previously described, including a linear track 1550 and a substrate handler 1500. Figure 4 and Figure 5 In the aspects shown in FIG. 1 , although only a single longitudinal drive line (e.g., drive lines 177, 178, 179) is shown in each chamber 118, 118A, 118B, 118C, it should be understood that in other aspects, multiple drive lines may be arranged in a substantially similar manner. Figure 8-Figure 10 118A, 118B, 118C. As can be realized, like other substrate transport devices 100, 100A, 200, 300, 800, 900, 1200, 1300 described herein, the substrate transport device 400, 500 has a controller 199 for controlling the movement of one or more substrate carriers 1500 of the substrate transport device 1599.

[0027] Still reference Figure 5 In this case, the transport chambers 118A, 118B may directly interface with a tool 300 (eg, a stocker, lithography cell, or other suitable processing tool), with substrates being delivered to and removed from the tool 300 via chamber 118C.

[0028] As from Figure 1B , Figure 3 and Figure 4-Figure 5 It can be realized that the transport chamber 118 can be extended as needed to extend through the entire processing facility P ( Figure 5 , and its example is shown in Figure 7 (in Chinese). Figure 5As seen in, and as will be described in further detail below, a transport chamber (generally referred to as transport chamber 118) can be connected and in communication with various sections or compartments 118P1-118P4 in a processing facility P, such as, for example, storage devices, photolithography tools, metal deposition tools, or any other suitable tool compartments. The compartments interconnected by transport chamber 118 can also be configured as processing compartments or processes 118P1, 118P3. Each compartment has the desired tools (e.g., photolithography, metal deposition, hot soaking, cleaning) to complete a given fabrication process in a semiconductor workpiece. In either case, as previously described, the transport chamber 118 has processing modules 120, which correspond to the various tools in the facility compartments and are communicatively connected thereto to allow semiconductor workpieces to be transferred between the chamber 118 and the processing modules 120. Thus, the transport chamber 118 can include different environmental conditions throughout its length, such as atmosphere, vacuum, ultra-high vacuum (e.g., 10 -5 Thus, a section 118P1 of a chamber in a given process or compartment or a portion of a compartment may, for example, have one environmental condition (e.g., atmosphere), and another section 118P2, 118P3 of the chamber 118 may have a different environmental condition. As previously described, the sections 118P1-118P4 of the chamber 118 having different environments may be in different compartments of the facility, or may all be in one compartment of the facility. Figure 5 The chamber 118 is shown to have four sections 118P-118P4 with different environments for exemplary purposes only. In this regard, the chamber 118 can have as many sections with as many different environments as desired.

[0029] like Figure 5 As seen in FIG. 1 , a substrate handler 1500 in a transport chamber 118 is capable of being transported between sections 118P1-118P4 of the chamber 118 having different environments therein. Figure 5It can be realized that each of the substrate handlers 1500 can move a semiconductor workpiece from a tool in one process or compartment of a processing facility to another tool in a different process or compartment of the processing facility with a different environment by means of a picker. For example, the substrate handler 1500A can pick up a substrate in a processing module 301, which can be an atmospheric module, lithography, etching, or any other desired processing module in the section 118P1 of the transport chamber 118. The substrate handler 1500A can then move along the drive line 177 (or a drive line substantially parallel thereto, where more than one longitudinal drive line is provided) from the section 118P1 of the chamber 118 to the section 118P3 (e.g., where the other substrate handlers 1500 are controllers so as to avoid interfering with the substrate handler 1500A in any suitable manner). In the section 118P3, the substrate handler 1500A can place the substrate in the processing module 302, which can be any desired processing module.

[0030] As from Figure 5 It can be realized that the transport chamber 118 can be modular, where chamber modules are connected as needed to form the chamber 118 (e.g., formed by three chamber sections 118A, 118B, 118C, where each chamber section 118A, 118B, 118C can also include one or more chamber modules, and the chamber modules are coupled to each other in any suitable manner). Figure 1A , the module may include something like Figure 1A The inner wall 118I of the walls 118F, 118R in the chamber 118 can be used to separate the sections 118P1-118P4 of the chamber 118. The inner wall 118I can include a slot valve, or any other suitable valve that allows one section of the chamber 118P1-118P4 to communicate with one or more adjacent sections. The slot valve 118V can be sized to allow one or more substrate handlers 1500 to be transported from one section 118P1-118P4 to another section through the valve 18V. In this way, the substrate handler 1500 can be moved anywhere else in the entire chamber 118. The valve 118V can be closed to isolate the sections 118P1-1184 of the chamber 118 so that different sections can contain different environments, as described above. Further, the inner wall 118I of the chamber module can be positioned to form a load lock (see section 118P4), such as Figure 5 Load lock 118P4 (for example purposes only) Figure 5 Only one is shown in FIG. 1 ) may be located in chamber 118 as desired, and any desired number of substrate handlers 1500 may be held therein.

[0031] exist Figure 5In the aspect shown in , the process in chamber sections 118A and 118B can be the same process, such as etching, wherein the processing device 500 including the tool 300 (such as the stocker) is capable of processing the substrate without any associated material handling overhead associated with transporting the FOUPS from the stocker to the individual processing modules 120 via the automated material handling system and transporting the individual wafers to the corresponding processing modules 120 via the EFEM. Instead, the stocker directly transfers the FOUPS 171 to the load port (three load ports are shown for each chamber section, and more or less load ports can be provided depending on the throughput requirements), where the wafers are moved into the lock in batches and dispatched to their corresponding processing modules according to the desired process and / or required throughput. The chamber sections 118A, 118B or the stocker 300 can further have metrology capabilities, sorting capabilities, material identification capabilities, testing capabilities, inspection capabilities, etc., which are required for effectively processing and testing the substrates.

[0032] exist Figure 5 In aspects of the disclosed embodiments shown in , more or fewer chamber sections 118A and 118B may be provided having different processes, such as etching, CMP, copper deposition, PVD, CVD, etc., wherein the chamber sections 118A, 118B, etc., in combination with a tool 300, such as a lithography cell, are capable of processing substrates without the associated material handling overhead associated with transporting FOUPs from a stocker to individual processing tool compartments and lithography compartments via an automated material handling system and transporting individual wafers to the respective processing tools via an EFEM. Instead, the automation within the lithography cell directly delivers the FOUPS, substrates, or materials to load ports 112 (again, three load ports are shown per chamber section / process type, note that more or fewer load ports may be provided depending on throughput requirements), wherein substrates are dispatched to their respective processes depending on the desired process and / or required throughput. An example of this alternative is shown in Figure 7 In this way, Figure 5 The apparatus in the process substrates at less cost, with less space, less required WIP (compared to conventional processing systems described herein), thus having less inventory and faster turnaround when considering the time to process a single carrier batch (or "hot batch"), and with a higher degree of contamination control, thereby providing significant advantages to the manufacturing facility operator. The chamber sections 118A, 118B (each of which may be referred to as a tool or tool section) or tool or unit 300 may further have metrology capabilities, processing capabilities, sorting capabilities, material identification capabilities, testing capabilities, inspection capabilities, etc., which are required to effectively process and test substrates. As shown in FIG. Figure 5It can be realized that the chamber sections 118A, 118B and the tool 300 can be coupled to share a common control environment (e.g., an inert atmosphere or vacuum). This ensures that the substrate remains in the controlled environment of the tool 300 and the entire substrate processing apparatus 500. This eliminates the need for the substrate to be placed in a controlled environment as in conventional substrate processing apparatuses (such as Fig.37 and Fig.38 Special environmental controls for the FOUP are used, as in those shown in FIG.

[0033] Reference now Figure 7 , showing the incorporation Figure 5 601 of aspects of the disclosed embodiments is shown in FIG. Wafer handler 406 transports substrates or wafers through transport chambers 602, 604, 606, 608, 610, 612, 614, 616, 618, 620, 624, 626 through process steps within fabrication facility 601 similar to wafer handler 1500. Process steps may include epitaxial silicon 630, dielectric deposition 632, photolithography 634, etching 636, ion implantation 638, rapid thermal processing 640, metrology 642, dielectric deposition 644, etching 646, metal deposition 648, electroplating 650, chemical mechanical polishing 652. In other aspects, more or less processes may be involved or mixed; such as etching, metal deposition, heating and cooling operations in the same order. As previously described, the wafer handler 406 may be capable of carrying a single wafer or multiple wafers and may have transfer capabilities, such as in the case where the wafer handler 406 has the ability to pick up a processed wafer and place an unprocessed wafer at the same module. The wafer handler 406 can travel through the isolation valve 654 for direct tool to tool or compartment to compartment transfer or process to process transfer. Depending on the pressure difference or gas type difference on either side of a given valve 654, the valve 654 can be a sealed valve or a simple conduction type valve. In this way, wafers or substrates can be transferred from one processing step to the next with a single handling step or "one touch". Thus, contamination due to handling is minimized. Examples of such pressure or type differences can be, for example, clean air on one side and nitrogen on the other side; or a rough pressure vacuum level on one side and a high vacuum on the other side; or a vacuum on one side and nitrogen on the other side. Similar to Figure 5The load lock 656 of chamber 118P4 in can be used for conversion between one environment and another environment (e.g., between vacuum and nitrogen or argon). In other aspects, other pressures or types can be provided in any number of combinations. Load lock 656 may be able to convert a single wafer carrier or multiple wafer carriers in a manner substantially similar to that described herein, wherein a single drive line or multiple roughly parallel and / or orthogonal drive lines are provided. Alternatively, the substrate can be transferred to the load lock 656 on the shelf (not shown) or other positions where the wafer carrier 406 is not expected to pass through the valve. Additional features 658 such as alignment modules, metering modules, cleaning modules, processing modules (e.g., etching, deposition, polishing, etc.), thermal adjustment modules or others can be incorporated into the lock 656 or transport chamber. A maintenance port 660 can be provided to remove the wafer carrier 406 or wafer from the tool. Wafer or carrier storage 662, 664 can be provided to store and buffer process and / or test wafers. In other aspects, the hoppers 662, 664 may not be provided, such as in the case where the cart is directed directly to the lithography tool. Another example is the case where an indexer or wafer storage module 666 is provided on the tool group. A recirculation unit 668 may be provided to circulate and / or filter air or gas species in any given section (such as the tool section 612). The recirculation unit 668 may have gas purification, particle filters, chemical filters, temperature control, humidity control or other features to regulate the gas species being processed. In a given tool section, more or less circulation and / or filter or conditioning units may be provided. An isolation level 670 may be provided to isolate the wafer carrier 406 and / or wafers from different processes or tool sections that cannot be cross-contaminated. If the wafer carrier 406 can be picked up or placed in a common workspace without orientation changes, a lock or interconnect 672 may be provided to change the orientation or direction of the wafer carrier 406. In other aspects or methods, any suitable combination of process sequences or components may be provided.

[0034] Reference now Figure 6, the controller 199 controls the propulsive force across the substrate 1510 generated by the electromagnet array 1700 so as to impart a controlled yaw moment on the substrate, thereby yawing the substrate 1510 about a yaw axis (e.g., rotation axis 777) that is generally normal to the drive plane 1598 from a first predetermined orientation relative to the frame of the chamber 118 (such as a position where the end effector 1520 is generally aligned with the drive wire 177) to a second different predetermined orientation relative to the frame of the chamber 118 (such as a position where the end effector is extended into the processing module 120). As can be implemented, the yaw of the substrate 1510 can be implemented in conjunction with a propulsive motion of the substrate 1510 (such as where a single drive wire is provided in the chamber 118) or in conjunction with the substrate being in a predetermined position (such as where the substrate 1510 is rotated while remaining generally stationary along the X and Y axes). In one aspect, reference is also made to Fig. 15C , the controller 199 controls the propulsion force (e.g., Fx right 、Fx left ) to impart a torque to the substrate 1510 (illustrated by the movement of the substrate carrier 1500 along the X-axis in FIG. Fig. 15C ), thereby achieving controlled yaw of substrate 1510, thereby achieving at least one of positioning and centering of a substrate (also referred to as a wafer payload or payload) on substrate 1510 relative to a predetermined substrate holding location (such as a load lock, process module, etc.) of the frame of chamber 118. As can be achieved, pitch (rotation about the Y axis) and roll (rotation about the X axis) can be achieved by controller 199 (controlling the lift force Fz across the reaction platen) while achieving yaw motion that offsets dynamic torque coupling and maintains a generally flat yaw of the wafer holder / reaction platen in the wafer transfer plane (see Fig.15A and Fig. 15B )control.

[0035] In the case where a single drive line 177 is provided in each transport chamber (eg Figure 1A , Figure 1B , Figure 2 , Figure 4 and Figure 5 ) or from the drive line 178 closest to the processing module 120A (such as when a plurality of substantially parallel longitudinal drive lines 177, 178 are provided - see Figure 8 ) to a processing module (such as processing module 120A (see Figure 8)), the controller 199 is configured to simultaneously drive the substrate 1510 in two or more of yaw, pitch, roll, and in propulsion (as described herein) to pick up and place a substrate from any suitable substrate holding station (e.g., load lock 116, process module 120, etc.). For example, the controller 199 is configured to energize the actuator 1700 as described herein so that the substrate moves along the drive line 177 and rotates about the substrate rotation axis 777 so that the substrate placement surface 1520A of the substrate handler 1520 enters the process module 120 or other suitable holding station, where the substrate S travels along a generally straight path 790 in a predetermined wafer / substrate transfer plane. Reference Figure 8-Figure 11 In other aspects, where multiple longitudinal drive lines 177, 178 are provided in the transport chamber 118, the substrate 1510 can be rotated so that the substrate handler 1520 is aligned with a desired / predetermined substrate holding station before entering the substrate holding station. For example, the substrate 1510 can be positioned at the intersection between the drive lines 178 and 179A, where the drive line 179 enables extension and retraction of the substrate handler into the substrate holding station 120BH of the processing module 120B (e.g., in a propulsion direction that is substantially orthogonal (or any suitable angle to achieve access to the processing module) to the propulsion direction along the drive lines 177, 178). The substrate 1510 can be rotated about the rotation axis 777 so that the substrate handler 1520 is aligned with the substrate holding station 120BH, and the substrate can be moved along the drive line 179A to move or extend the substrate handler 1520 into the substrate holding station 120BH for picking up / placing a substrate.

[0036] refer to Fig.14 and 14A - Fig. 14CAlthough the substrate handler 1500 has been described as including the end effector 1520, in other aspects, one or more substrate handlers may be configured as a cart 1500C configured to support one or more substrates on a base plate 1510. For example, the base plate 1510 may include one or more substrate supports 1431-1433 configured to stably hold a substrate (e.g., from a bottom or edge gripper) such that the substrate handler 1500, 1500A, 1500B or a substrate transport within, for example, a loading or other substrate holding station may transport substrates to and from the substrate supports 1431-1433. In one aspect, the substrate supports 1431-1433 can be configured to substantially center one or more substrates on the base plate 1510 (i.e., the supports are self-centering supports, are passive supports or can be actuated by a suitable power source (e.g., piezoelectric) energized on a reaction platen) such that the center of the substrate is substantially aligned with the rotation axis 777 of the substrate. In some aspects, one or more of the carts 1500C can include a substrate support rack 1440 for holding two or more substrates in a stack, wherein each rack layer includes a respective substrate support 1431-1433, 1431A-1433A. Reference Fig.14 and Fig.14A , the cart 1500C can provide an interface between the substrate handlers 1500A, 1500B and the load lock 116, wherein a transport device 116R of the load lock (such as a SCARA arm, a linear slide arm) transfers the substrate to the cart 1500C, and the substrate handlers 1500A, 1500B pick up the substrate from the cart, and vice versa. In other aspects where the processing module 120 includes a transport device 120R (such as a SCARA arm, a linear slide arm, etc.), the cart 1500C can be employed to transfer substrates to and from the processing module 120. Although the base plate 1510 of the cart 1500C (and the substrate handlers 1500, 1500A, 1500B) is illustrated as having a circular shape when viewed from the top (see Fig. 14C ), but in other aspects, the substrate 1510 can have any suitable shape (e.g., square, rectangular, circular, etc. when viewed from the top), which is originally connected to the interface of the electromagnet array 1700 to achieve one or more of linear propulsion, lift, yaw, pitch, roll and rotation control of the substrate 1510.

[0037] refer to Fig. 12A , Fig. 12B , Fig.13A , Fig. 13BAlthough the transport chamber 118 has been described above as a longitudinally extending chamber forming part of a linear processing tool, in other aspects, the transport chamber can have a cluster tool configuration. For example, referring to Fig. 12A and Fig. 12B , the transfer chamber 118T1 has a generally square configuration (although in other aspects, the transfer chamber may have any suitable shape, such as a hexagon, an octagon, etc.). In this aspect, the motor 1599R (generally similar to the linear motor 1599) is configured as a side-by-side transport device, which includes at least two side-by-side substrate handlers 1500A, 1500B, which are generally similar to the substrate handler 1500 described herein. In this aspect, the electromagnet array 1700 is configured to move the substrate handlers 1500A, 1500B so that the substrate handlers 1500A, 1500B rotate about a common rotation axis 1277 (such an axis is similar to, for example, the θ axis of a conventional SCARA-type robot) to change the direction of "extension and retraction" of the side-by-side transport device (the terms extension and retraction are used herein for convenience, noting that extension and retraction are achieved by linear propulsion movement of the substrate handlers 1500, 1500A, 1500B along corresponding drive lines). For example, the electromagnet array 1700 has an arrangement that forms drive lines 177, 178, 179, 180. Here, the drive lines 177, 178 are spaced apart from each other and are substantially parallel to each other so as to be substantially aligned with the corresponding transport openings 1180A, 1180F and 1180B, 1180E. The drive lines 179, 180 are substantially orthogonal to the drive lines 177, 178 and are spaced apart from each other and are substantially parallel to each other so as to be substantially aligned with the corresponding transport openings 1180C, 1180H and 1180D, 1180G. The drive lines can be in any suitable pattern (such as arcs or curved segments with constant or varying radii) and orientation, and the following description is for exemplary purposes. Electromagnets 1700A-1700N (shown in Fig. 12A1180H). In this aspect, the electromagnet array 1700 also includes a rotating electromagnet sub-array 1231-1234, which, under the control of the controller 199, together with the electromagnets forming the drive lines 177-180, enables the rotation of the substrate handlers 1500A, 1500B around the common rotation axis 1277. Alternatively, the electromagnets can form a sufficiently dense and large grid without being specifically designated for propulsion or rotation, and can perform the functions based on the position of the substrate 1510 and the control rules of the controller 199. As can be realized, although the substrate handlers 1500A, 1500B can be rotated around the common rotation axis 1277 at the same time, the extension and retraction of the substrate handlers 1500A, 1500B can be independent of the extension and retraction of the other of the substrate handlers 1500A, 1500B. In general, the motions of the substrate handlers 1500A, 1500B are independent of each other, and the complexity of the motions may range from one degree of freedom to six degrees of freedom.

[0038] refer to Fig. 12B In one aspect, the motor 1599R includes a plurality of transport levels 1220A, 1220B stacked one above the other. In this aspect, each level 1220A, 1220B is formed by a respective level support 1221, each level support having a respective reference plane 1299R substantially parallel to the horizontal reference plane 1299 of the transport chamber 118T1 frame. Each level support 1221 includes a substantially similar Fig. 12A The electromagnet array 1700 shown in FIG. 1 is used to linearly drive the side-by-side substrate handlers 1500A, 1500B along drive lines 177-180 and rotate the side-by-side substrate handlers 1500A, 1500B about a common rotation axis 1277 (e.g., with full six degrees of freedom control). Each layer support 1221 is coupled to a common Z-axis drive 1211 that moves the layer support 1221 and the substrate handler 1500A, 1500B thereon in the Z direction so as to align the end effector 1520 of the substrate handler 1500A, 1500B on the respective layer support 1221 with the substrate transport plane 1290 of the transport opening 1180 of the transport chamber 118T1. The Z-axis drive 1211 can be any suitable linear actuator, such as a screw drive, an electromagnetic drive, a pneumatic drive, a hydraulic drive, and the like.

[0039] In another aspect, reference Fig.13A and Fig. 13B, the transfer chamber 118T2 has a generally hexagonal configuration (although in other aspects, the transfer chamber can have any suitable shape as described herein). In this aspect, the motor 1599R (generally similar to Fig. 15C The linear motor 1599 of the embodiment of the present invention is configured as a radial transport device, which includes a substrate carrier 1500 with a double-end / double-sided end effector 1520D, as will be described herein (although in other aspects, a single-end / single-sided end effector may be employed). In this aspect, the electromagnet array 1700 is configured to rotate the substrate carrier 1500 about a rotation axis 1377 (such an axis is similar to, for example, the θ axis of a conventional SCARA-type robot) for changing the direction of "extension and retraction" (the terms extension and retraction are used herein for convenience, noting that extension and retraction are achieved by linear propulsion movement of the substrate carrier 1500 along the corresponding drive lines), and linearly propel the substrate carrier 1500 so as to extend through the transport openings 1180A-1180F. For example, the electromagnet array 1700 has an arrangement of drive lines 177, 178, 179 that form radial offsets, wherein the angle α between adjacent drive lines depends on the number of sides / facets of the transport chamber 118T2 on which the transport openings 1180A-1180F are located. Fig. 12A 1377) to enable at least linear propulsion of the substrate handler 1500 through the transport openings 1180A-1180H and rotation of the substrate handler 1500 about the rotation axis 1377 with full six degrees of freedom control so as to maintain linear transport and rotation in a desired attitude in pitch and roll.

[0040] refer to Fig. 13B In one aspect, the motor 1599R comprises a motor having a configuration substantially similar to that described above with reference to Fig. 12B Multiple transport layers 1320A, 1320B are stacked one above the other in the manner described. For example, each layer 1320A, 1320B is formed by a corresponding layer support 1321, each layer support having a corresponding reference plane 1299R that is substantially parallel to the horizontal reference plane 1299 of the transport chamber 118T1 frame. Each layer support 1321 includes a substantially similar Fig.13AThe electromagnet array 1700 illustrated in FIG. 1 is used to linearly drive (along drive lines 177-179) and rotate (about axis 1377) the substrate handler 1500. Each layer support 1321 is coupled to a common Z-axis drive 1311 (substantially similar to Z-axis drive 1211) that moves the layer support 1321 and the substrate handler 1500 thereon in the Z direction so as to align each of the end effectors 1520D of the substrate handler 1500 on the respective layer support 1321 with the substrate transport plane 1390 of the transport opening 1180 of the transport chamber 118T2.

[0041] refer to Fig. 12B and Fig. 13B , the vertical motion provided by the Z-actuator 1211 can be used to enable the wafer handler 1220A or 1220B to perform wafer transfer operations, such as pick-up from or placement to a wafer processing station. The supports 1221, 1321 can include a single module (layer) to provide additional lifting capacity to the wafer handler 1220A, 1220B to achieve greater vertical travel during wafer transfer operations. For example, in the case of a processing module or load lock with more than one stacked wafer slot, it would be advantageous to enable a vertical lifting device such as the Z-axis actuator 1211, 1311 to reach each of the stacked wafer slots without increasing the applied suspension force provided by the motor 1599R.

[0042] refer to Fig. 12A and Fig. 12B In another aspect, the vertical lift device (or Z-axis actuator) 1211 and layer 1221 have dual (or more) separate and independently operable devices, e.g., one for each wafer handler 1520. This would allow the ability to implement independent vertical strokes for different wafer handlers that can access different slots on at least two independent stations (e.g., process modules, load locks, etc.).

[0043] Reference now Fig.15A , Fig. 15B , Fig. 15C , Fig.16A , Fig. 16B , Fig. 16C, linear motor 1599 will be described in more detail (again, note that motor 1599R is substantially similar to linear motor 1599). Generally speaking, linear motor 1599 includes a structure 1500 without magnets and any moving parts such as bearings, rotating or prismatic joints, metal belts, pulleys, cables or belts. As described above, substrate 1510 is formed of a paramagnetic material, a diamagnetic material, or a non-magnetic conductive material. Substrate 1510 can have any suitable shape and size to cooperate with the electromagnets 1700A-1700n of electromagnet array 1700 to stably transport substrate S in the manner described herein. In one aspect, as Fig. 9 and Figure 11-16C , the substrate 1510 is shown as having a frustoconical shape, wherein the conical side 1510TS of the frustoconical body 1510FR faces the electromagnet array 1700 (although other suitable shapes are also operable). Here, the conical side 1510TS of the frustoconical shape has an angle λ (see Fig. 15B ), the angle λ is between about 50° and about 60° relative to the plane surface of the frustum 1510FR; while in other aspects, the angle λ can be greater than about 60° or less than about 50°. In other aspects, the substrate can have a truncated pyramid shape, such as Figure 8 , Fig. 8A and Fig.10 Here, each side 1510TSP of the frustum 1510FRP has an angle λ (see Fig. 8A ), the angle λ is between about 50° and about 60° relative to the planar surface of the frustum 1510FRP; while in other aspects, the angle λ can be greater than about 60° or less than about 50°. Although the truncated pyramid shape is illustrated as having four sides, in other aspects, the truncated pyramid shape can have any suitable number of sides (such as, for example, six or eight sides), or can be rounded or have curved sides. In other aspects, the substrate 1510 may not have a truncated cone or truncated pyramid shape, and it may include a planar shape with a suitable and asymmetrical profile and size so as to be properly controlled by the electromagnet 1700.

[0044] The end effectors 1520, 1520D can be substantially similar to conventional end effectors; however, as described herein, the end effectors are rigidly coupled to the base plate 1510. As an example, the end effectors can be single-sided / single-end end effectors (see end effector 1520) having a single substrate holding position 1520A, a double-sided / double-end end effector (see end effector 1520D) having two longitudinally spaced substrate holding positions 1520A, 1520B, a side-by-side configuration in which multiple substrate holding positions are arranged side-by-side (e.g., laterally spaced apart) and supported from a common base plate so as to extend through side-by-side substrate transport openings, a stacked configuration in which multiple substrate holding positions are arranged one above the other in a stack and supported from a common base plate so as to extend through vertically aligned substrate transport openings, and in other aspects, the end effectors can have any suitable configuration. The end effectors 1520, 1520D can be made of one or more of a material that can withstand high temperatures, has a low mass density, has low thermal expansion, has low thermal conductivity, and has low outgassing. A suitable material from which the end effector 1520, 1520D may be constructed is aluminum oxide (Al 2 O 3 ), although any suitable material may be used.

[0045] In one aspect, the end effectors 1520, 1520D are coupled to the base plate 1510 by means of substantially rigid and non-articulated struts 1510S so as to position the end effectors 1520, 1520D at a suitable nominal height H2 relative to, for example, a horizontal reference plane 1299. As described herein, the substrate handler 1500 moves in space (with at least three degrees of freedom) using the principles of electrodynamic levitation. Figures 15A-15C , Fig. 16B and Fig. 16C As shown in , the actuation element (eg, actuator 1700 ) includes independently controlled coils or electromagnets 1700A- 1700n (also referred to herein as coil segments) that generate the desired magnetic fields that induce thrust and lift vectors in the substrate 1510 .

[0046] In some aspects, reference Fig.10 , Fig. 10A , Fig.11 and Fig.11A , multiple substrate handlers may be nested relative to one another so as to travel linearly along drive lines 177-180 as a single unit, with the end effectors 1520 of the nested substrate handlers stacked vertically on top of one another. Fig.10 and Fig. 10A , the nested substrate 1510FP (which can be a symmetrical body of revolution, rotationally symmetrical (e.g., a truncated cone), or bisymmetrical (e.g., a truncated pyramid), or its channel-shaped cross-section is shown in Fig. 10A1299) are configured such that one substrate 1510FP can be inserted into another substrate 1510FP to stack the substrates 1510FP in a manner similar to stacking cups one inside another. The substrates 1510FP can be configured such that simultaneous pick and place of substrates is achieved by the stacked end effectors 1520 when the stacked vertical spacing between the end effectors 1520 is approximately the same as the vertical spacing between the stacked substrate holding stations (e.g., when the end effectors 1520 are approximately flush with the horizontal reference plane 1299). In one aspect, the stacking of substrates 1510FP provides independent vertical or Z-axis movement of at least one of the substrates 1510FP (and the corresponding substrate handler 1500A, 1500B of which the substrates are a part) based on the levitation force generated by the electromagnet array 1700. In this example, the uppermost substrate handler 1500B can move independently of the lowermost substrate handler 1500A along the Z-axis; however, when the uppermost substrate handler 1500B is lifted off the lowermost substrate handler 1500A, the lowermost substrate handler 1500A can also move independently of the uppermost substrate handler 1500B along the Z-axis direction. Here, the bi-symmetrical substrates are interlocked, and the rotation of the substrate handlers 1500A, 1500B is related by virtue of the shape of the substrate 1510FP, so that the substrate handlers 1500A, 1500B rotate in unison. The stackable configuration of the substrate 1510FP enables any suitable number of substrate handlers to be stacked one above the other (in this example, two are shown stacked one above the other, but in other aspects, more than two substrate handlers can be stacked one above the other).

[0047] refer to Fig.11 and Fig.11A, the rotationally symmetric substrates 1510FC can be stacked on top of one another, moved in a propulsion direction, and moved relative to one another along the Z-axis in a manner generally similar to that described above with respect to the truncated pyramid substrate 1510FP. However, in this aspect, the rotationally symmetric shapes of the substrates 1510FC do not interlock and enable independent rotation of each substrate handler 1500A, 1500B relative to the other of the substrate handlers 1500A, 1500B about the substrate handler rotation axis. The independent rotation of the truncated cone based substrate handlers 1500A, 1500B enables rapid exchange of substrates from a single substrate holding station, such as where the end effector 1520 of the substrate handler 1500A is aligned with the substrate holding station 120BH to pick up the substrate S1, where the end effector 1520 of the substrate handler 1500B is rotated to a position that does not extend into the substrate holding station 120BH. Once substrate S1 is removed from substrate holding station 120BH by substrate handler 1500A, the position of end effector 1520 of substrate handler can be swapped so that end effector 1520 of substrate handler 1500B is aligned with substrate holding station 120BH for placing substrate S2 at substrate holding station 120BH, while end effector 1520 of substrate handler 1500A is rotated to a position that does not enter substrate holding station 120BH. As can be realized, substrate handlers 1500A, 1500B can be moved along the Z axis to accommodate the stacking height of the end effector relative to the height of substrate holding station 120BH. Although symmetrical substrates (rotated about one or more axes) have been illustrated, in other aspects, one or more substrates can be asymmetrical or lack any axis of symmetry.

[0048] As described herein, linear propulsion is typically provided by two parallel linear rails 1550 (may be a single rail) of independently controlled electromagnets 1700A-1700n. Depending on the size of the substrate 1510, multiple electromagnets 1700A-1700n are spaced apart from each other to control all six degrees of freedom (roll, pitch, yaw and translation in each of the X, Y and Z directions) of the substrate handler in space. For example, Fig. 15B As shown in FIG. 1 , the electromagnets 1700A-1700n may be spaced apart from one another so that two or more electromagnets 1700A-1700n of each parallel linear track 1550 (cooperating to form a motor actuator (primary) 1701 and in conjunction with the substrate (secondary) 1510 to form a motor) are always vertically below the substrate 1510 in the direction of motion of the substrate so as to stably levitate and propel the substrate 1510 (as may be achieved, Fig.15A , Fig. 15BRepresentative configurations of the system are schematically illustrated and are provided as an exemplary representation generally showing the relationship between the substrate 1510 and the electromagnets 1700A-1700n and are not intended to be limiting in any way. The size, number, and spacing (e.g., pitch) of the electromagnets 1700A-1700n on the X-axis and Y-axis can vary, and the size and shape of the substrate 1510 relative to the electromagnets 1700A-1700n can also vary. In one aspect, as Figure 8 As shown in , the electromagnet array 1700 may also include a stabilizing rail 1550S laterally vertically outside the track 1550. The stabilizing rail may be substantially similar to the track 1550 and configured to provide additional stability of the substrate 1510 by generating additional lifting and / or propulsion forces acting on the substrate 1510 (e.g., in addition to the lifting and propulsion forces generated by the electromagnets of the parallel linear track 1550). As a result, the substrate handler 1500 can move along the direction of the track 1550 (i.e., the propulsion direction) while changing the orientation of one or more of roll, pitch, and yaw. According to the principle of magnetic induction, where the electromagnets 1700A-1700n are similar to the "primary" and the substrate 1510 corresponds to the "secondary", current is induced by means of eddy current effects.

[0049] Fig.17 An actuator control system network 1799 is shown, in accordance with aspects of the disclosed embodiments, configured to implement individual control of each electromagnet 1700A-1700n to provide a reference Figures 15A-16CThe desired force components and degrees of freedom described and illustrated. In one aspect, the actuator control system is configured such that the electromagnets 1700A-1700n form motor actuator units (collectively referred to as motor actuators), each motor actuator unit having m electromagnets / coils that cooperate to form a motor (where m is a dynamically selectable number of two or more electromagnets that form one or more of the motor actuator units, as will be further described below). Thus, the actuator control system network 1799 is a scalable motion control system having a cluster architecture having at least a master controller 1760 and distributed local drive controllers 1750A-1750n, as will be described in more detail below. In this aspect, the groups of electromagnets 1700G1-1700Gn are coupled to respective local drive controllers 1750A-1750n, which are configured to control the current on the electromagnets 1700A-1700n within the respective groups of electromagnets 1700G1-1700Gn. The local drive controllers 1750A-1750n may be "slave" controllers in a network connected to a master controller 1760 that are configured to specify desired forces (e.g., thrust and lift) for each individual electromagnet 1700A-1700n to achieve desired movement of the substrate handler 1500 in space. As will be described herein, the electromagnets 1700A-1700n can be physical electromagnets / coils that can be dynamically configured when it comes to the respective "phase" definition of each coil relative to the "phase" definition of the other electromagnets / coils of a given motor actuator unit, so that the position of a given motor actuator unit (formed by the cooperative excitation phase of the motors under propulsion) can be considered to move virtually in unison with the substrate propulsion, even though the physical electromagnets / coils are fixed (e.g., static), as will be further described below. This provides the desired continuity of force vectors for motion control of the substrate handler.

[0050] According to aspects of the disclosed embodiments, and with reference to Fig.18 and Fig.19 , position feedback sensors 2000 are distributed on the frame of the chamber 118. The sensors 2000 are configured to sense the position of the substrate 1510 along the drive plane 1598 and are communicatively coupled to the controller 199 so that the controller 199 records the sensed position of the substrate 1510, wherein the controller 199 is configured to sequentially energize the electromagnets 1700A-1700 of the electromagnet array 1700 corresponding to the sensed position in the manner described herein.

[0051] Fig.18 and Fig.19A sensor control system network 1899 is illustrated, according to aspects of the disclosed embodiments, which is configured to provide position feedback of a substrate handler 1500 in space, for example, relative to a frame of a transport chamber 118. The sensor control system network 1899 can be a scalable sensor control system having a cluster architecture having at least a master controller 1760 and distributed local sensor controllers 1850A-1850n, as will be described in more detail below. In this aspect, a group of sensors 1800G1-1800Gn are coupled to respective local sensor controllers 1850A-1850n (also referred to herein as sensor processing units), which are configured as "slave" controllers in the network connected to the master controller 1760 (or other suitable master controllers in communication with the master controller 1760). Each of the local sensor controllers 1850A-1850n includes a central processing unit 1851 and associated hardware interfaces 1852, which can support different types of sensor technologies, such as those described herein. The local sensor controllers 1850A-1850n may be integrated into a real-time network such as EtherCat and / or a non-real-time network such as Ethernet. The sensors 2000 may be distributed along the propulsion path of the substrate handler (e.g., drive lines 177-180) to detect the position / location of the substrate handler in space, for example relative to the frame of the transport chamber 118.

[0052] Fig. 20 The diagram illustrates a distributed sensor array 2001 including sensors 2000A-2000n relative to a substrate 1510 of a substrate handler 1500 and how the relationship between the characteristic dimensions of the substrate 1510 and the sensors 2000A-2000n affects continuous feedback of the position of the substrate handler 1500. Fig. 20 As can be seen in FIG. 1 , the sensors 2000A-2000n are arranged at a predetermined spacing or sensor pitch Ps, where a sensor spacing Δ is provided between adjacent sensors 2000A-2000n. Each sensor 2000A-2000n has a length Ls that provides a predetermined sensing range, and the substrate 1510 has a length Lb. The relationship between these characteristics that provide continuous feedback is: Ls / 2>Ps-Ls=>Ps<(3 / 2)Ls[2] The length Lb of the substrate 1510 is: Lb = nPs + Ls / 2 (where n = 1, 2, 3, ...) [3] According to aspects of the disclosed embodiments, each sensor 2000A-2000n comprises any suitable device (e.g., see FIG. 10 ) that can measure longitudinal displacement and / or air gap between the substrate 1510 of the substrate handler 1500 and a bottom reference surface (such as the horizontal reference plane 1299). Fig.15A). The master controller 1760 is configured to track the position of the substrate handler 1500 by specifying which local sensor controllers 1850A-1850n should actively report feedback from the appropriate sensors 1700A-1700n. The combination of the actuator control system network 1799 and the sensor control system network 1899 forms a six-degree-of-freedom motion control infrastructure for the substrate handler 1500, such as Figures 15A-16C as shown in .

[0053] refer to Fig.39 , a control system network 3999 having a cluster architecture representing an actuator control system network 1799 and a sensor control system network 1899 will be described. Fig.39 In the example illustrated in , there are three drive lines 177, 179A, 179B, each having a corresponding array of electromagnets, thereby forming a corresponding track 1550A-1550F (although linear, it can be arcuate). For example, drive line 177 is formed by tracks 1550A and 1550B with electromagnets 177ER1-177ERn and 177EL1-177ELn. Drive line 179A is formed by tracks 1550C and 1550D with electromagnets 179AER1-179AERn and 179AEL1-179AELn. Drive line 179B is formed by tracks 1550E and 1550F with electromagnets 179BER1-179BERn and 179BEL1-179BELn. Fig.39 The configuration of the motor illustrated in is exemplary and may have any other suitable configuration.

[0054] exist Fig.39 , the control system network includes a master controller 1760, cluster controllers 3950A-3950C, and local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB. Local controller 1750DL corresponds to drive line 177, local controller 1750DLA corresponds to drive line 179A, and local controller 1750DLB corresponds to drive line 179B. Each of local controllers 1750DL, 1750DLA, 1750DLB is substantially similar to distributed local drive controllers 1750A-1750n, such that each drive line 177, 179A, 179B is as described above with reference to Fig.17The distributed arrangement includes local drive controllers 1750A-1750n for controlling respective groups 1700G1-1700Gn of electromagnets 1700A-1700n. Similarly, local controller 1850DL corresponds to drive line 177, local controller 1850DLA corresponds to drive line 179A, and local controller 1850DLB corresponds to drive line 179B. Each of the local controllers 1850DL, 1850DLA, 1850DLB is substantially similar to the distributed local sensor controllers 1850A-1850n, such that each drive line 177, 179A, 179B is as described above with reference to Fig.18 The distributed arrangement includes local sensor controllers 1850A-1850n for controlling corresponding groups 1800G1-1800Gn of sensors 2000A-2000n.

[0055] In one aspect, if Fig.39 As shown in , each of the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB is connected (e.g., by wireless and / or wired connection) to a corresponding cluster controller 3950A-3950C. For example, each of the local controllers 1750DL, 1850DL of drive line 177 is coupled to cluster controller 3950B, each of the local controllers 1750DLA, 1850DLA of drive line 179A is coupled to cluster controller 3950A, and each of the local controllers 1750DLB, 1850DLB of drive line 179B is coupled to cluster controller 3950C. In other aspects, the local controllers can be directly connected (e.g., by wireless and / or wired connection) to the master controller 1760, such as Fig.17 and Fig.19 In still other aspects, the local controllers can be connected (eg, via wireless and / or wired connections) to both the master controller 1760 and the respective cluster controllers 3950A-3950C to provide redundant basic fail-safe control of the local controllers.

[0056] Each of the cluster controllers 3950A-3950C is connected (e.g., by wireless and / or wired connections) to the master controller 1760. Each of the master controller 1760, the cluster controllers 3950A-3950C, and the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB includes any suitable processor and non-transitory computer program code to implement motion control of the substrate handler 1500 as described herein. The master controller 1760 supervises the overall operation of the control system network 3999, and each of the cluster controllers 3950A-3950C supervises the operation of the corresponding local controller 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB, and utilizes each local controller 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB to drive the electromagnet and / or provide position feedback (of the substrate handler 1500) corresponding to the corresponding drive line 177, 179A, 179B.

[0057] The cluster architecture provides the characteristics of a centralized control network and a distributed control network in the place where it is needed in the network topology. The architecture disclosed herein is advantageous because the cluster can be distributed in the place where it is needed in the network, and each cluster controller 3950A-3950C can provide highly centralized control in the cluster it manages. The network traffic associated with highly centralized control is usually limited in each cluster, and the local controller 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB can be located near the electromagnet or sensor it controls, thereby reducing the problems associated with power supply and signal cable wiring. In addition, the cluster architecture realizes direct control of local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB by the main controller 1760 when needed. In addition, since dense network traffic is usually limited in the cluster, and the cluster can perform high-level control, the architecture can accommodate a large number of clusters. Thus, the architecture provides a high level of scalability and enables efficient distribution of controllers.It should be noted that although a cluster control architecture is described above, the cluster architecture is merely an example of a suitable control architecture, although any suitable control architecture may be employed.

[0058] In another aspect of the disclosed embodiment, Fig.39The local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB shown in FIG. 1 may be directly connected to the master controller 1760. In this aspect, the master controller software is responsible for (e.g., the master controller is configured to control) several aspects of real-time control of the motion of the wafer handler, and the local controllers will be responsible for (e.g., configured to be used for) all low-level feedback and actuation aspects of the control architecture.

[0059] Still reference Fig.39 And also refer to Figures 15A-16C According to aspects of the disclosed embodiments, the processor 3901 of the master controller 1760 is programmed with a dynamic model 3910 of the substrate 1510 with and without a payload thereon (e.g., the dynamic model is stored in any suitable memory 3902 accessible by the processor 3901). The processor 3901 is also programmed with a dynamic model 3911 of the friction force μ between the substrate S and the end effector 1520. The form factor 3912 of the machine electronics relative to the substrate 1510 (e.g., the number of electromagnets, the spacing between the electromagnets, the number of drive wires and their respective orientations, the relationship of propulsion to lift, etc.) may also be stored in the memory 3902 and accessible by the processor 3901.

[0060] The master controller 1760 is programmed or otherwise configured to determine the kinematic movement of the substrate 1510 from the initial substrate handler pose to the final substrate handler pose. The master controller 1760 is also programmed or otherwise configured to determine the kinematics of attitude / yaw control (in three degrees of freedom - pitch, roll, yaw) associated with the determined kinematic movement. In one aspect, the kinematic movement and the kinematics of attitude / yaw are determined, for example, using one or more of the dynamic model 3910, the dynamic model 3911, and the form factor 3912 in conjunction with a predetermined substrate processing recipe (e.g., when and where to transfer the substrate and the processing to be performed on the substrate).

[0061] One method for controlling a machine (such as a motor) as described herein is to calculate a trajectory for each of propulsion (along the X and / or Y axis), lift (along the Z axis), roll, pitch, yaw, etc. Such a trajectory can be conveniently defined by a series of position, velocity, and time values ​​grouped into frames (referred to as PVT frames).

[0062] Fig.40AAn exemplary PVT frame 4005 is shown. The PVT frame 4005 includes position data 4010 (which may include a starting position (X, Y, Z), an ending position (X, Y, Z), and attitude (roll, pitch, yaw), velocity data 4015, and time data 4020. In one aspect, the data is in binary format, grouped together in one or more bytes. In another aspect, each of the position data 4010, velocity data 4015, and time data 4020 occupies four bytes (while in other aspects, each of the position data 4010, velocity data 4015, and time data 4020 occupies more or less than four bytes). The PVT frame 4005 may optionally include header information 4025 and trailer information 4030, both of which may include identification, parity, error correction, or other types of data. The T-frame 4005 may include additional data of varying lengths or amounts between or among the header, position, velocity, time, and trailing data. It should be noted that the PVT frame 4005 is not limited to any particular length. In other aspects, the PVT frame is simplified to a PT frame or just a P frame. Communications from the master controller 1760 to the cluster / local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB may include a collection of different values ​​associated with the desired motion periphery, for example, these values ​​may be the frequency, phase offset, current value, and / or voltage value of the electromagnet / coil under control. The master controller 1760 implements the desired algorithmic conversion, calculates and streams these quantities via the motion network (effectively transmitted to each coil through a hierarchical scheme of cluster and local controllers).

[0063] A feature of aspects of the disclosed embodiment is the use of these series of values ​​as inputs to the dynamic models 3910, 3911 of the controlled motors to calculate the theoretical lifting and thrust forces to be applied by the predetermined electromagnets 1700A-1700n so that the substrate 1510 follows the desired trajectory. A feature of aspects of the disclosed embodiment is also the use of elements of the dynamic models 3910, 3911 to scale the feedback control signals used by the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB for each electromagnet under their control.

[0064] The lift, propulsion, and scaling terms may advantageously take into account nonlinearities and dynamic cross-couplings among the individual drive lines 177, 179A, 179B. The lift, propulsion, and scaling terms may be referred to herein as feedforward terms, and the scaling terms may be referred to as gain terms.

[0065] use Fig.39 (Also refer to Figures 15A-16C) as an example, the master controller 1760 can generate a trajectory for each drive line 177, 179A, 179B along which the substrate handler 1500 will travel according to the commanded position, velocity, and acceleration. Using an inverse kinematic model of one or more of the substrate 1510 and / or the friction force μ, the master controller 1760 can use the trajectory information to generate corresponding feedforward and gain terms. These terms can be grouped with the trajectory information in a frame unique to each drive line 177, 179A, 179B (referred to as a PVT-FG frame). Fig.40B An exemplary PVT-FG frame 4095 is illustrated. Similar to the PVT frame 4005, the PVT-FG frame 4095 includes an optional header 4025, position data 4010, velocity data 4015, time data 4020, and optional trailing information 4030. In addition, the PVT-FG frame 4095 includes at least one feedforward term 4050 and at least one gain term 4060. The data may be in binary format, grouped together in one or more bytes. In one aspect of the PVT-FG frame 4095, the position data 4010, velocity data 4015, time data 4020, feedforward term 4050, and gain term 460 each occupy four bytes (while in other aspects, they may each occupy more or less than four bytes). Similar to the PVT frame 4005, the PVT-FG frame 4095 may include other data of varying lengths or amounts distributed among or between the various items.

[0066] Thus, the PVT-FG frames can (or in other aspects, PVT frames) be distributed over the control system network 3999. The cluster controllers 3950A-3950C receive the data and can interpolate between two consecutive frames to obtain instantaneous position, velocity, feed-forward terms, and gain values, and use this information to implement control of the substrate handler 1500. For example, each cluster controller 3950A-3950C uses the PVT-FG frames (or in some aspects, PVT frames) or other suitable information / commands from the master controller 1760 to generate thrust forces Fx (thrust forces along the X-axis), Fy (thrust forces along the Y-axis), and lift forces Fz (along the Z-axis) to implement one or more of leveling, thrust, and three-degree-of-freedom attitude control (e.g., roll, pitch, yaw) of the substrate handler 1500 and its substrates 1510. In some aspects, the form factor 3912 of the machine electronics may be programmed at the cluster controller 3950A-3950C level, rather than or in addition to being programmed in the master controller 1760, where the form factor is used to establish the lift and propel relationship and generate the lift and propel forces described above in conjunction with data provided by the master controller 1760. In other aspects, the cluster controllers 3950A-3950C and local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB may receive corresponding data from the master controller 1760 and utilize the data to control movement of the electromagnets 1700A-1700n and the substrate handler 1500 along one or more of the drive lines 177, 179A, 179B.

[0067] The cluster controller 3950A-3950C (or alternatively, the local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB) commands the electromagnets 1700A-1700n to modulate, and the commands are sent to and received by the corresponding local controllers 1750DL, 1750DLA, 1750DLB, 1850DL, 1850DLA, 1850DLB to achieve one or more of dynamic phase allocation and creation of virtual multi-phase motor actuator units, as described in more detail herein.

[0068] Fig.21 An exemplary controlled motion of a substrate handler 1500 according to aspects of the disclosed embodiments is illustrated with respect to increased substrate handler throughput when carrying a substrate S. Here, the controller 199 controls the levitation force (e.g., FZ ) generated by the electromagnet array 1700. T , FZ L ) to impart different suspension forces across the substrate 1510 (shown in Fig.21), the different suspension forces enable controlled tilting (e.g., e+ or e-) of the substrate 1510 relative to the drive plane 1598, which is expressed in pitch (shown in Fig. 15B , Fig.21 and Fig. 27 in) and roll (shown in Fig.15A and Fig.29 In one aspect, the controller 199 controls the levitation force (e.g., FZ ) generated by the electromagnet array 1700 of the motor actuator unit (virtually moving). T , FZ L ), thereby achieving a predetermined bias posture BA+ or BA- of the substrate 1510 relative to the driving plane 1598, which is offset from a substrate payload mounting surface (e.g., such as a substrate mounting surface 1520SS ( Fig.23 , Fig.25A , Fig.25B ) or the resting surface defined by the substrate supports of carts 1431-1433 of cart 1500C) imparts a bias reaction force F2 ( Fig.23 ). The controller 199 is configured to determine the acceleration of the substrate 1510 (and its substrate handler) along the drive plane 1598 from at least the position change of the substrate 1510 sensed by the sensor 2000, and in response to the determined acceleration, control the bias posture of the substrate 1510 to provide a predetermined bias posture to offset the payload inertia force generated by the acceleration of the substrate 1510. In other aspects, the controller 199 can apply a predefined acceleration from the commanded trajectory for the bias posture control. Here, the controller 199 controls the excitation of the electromagnets 1700A-1700n of the virtually moving motor actuator units of the electromagnet array 1700 so as to set the bias posture BA+ or BA- to bias the substrate 1510 against the inertial force that tends to displace the substrate S (e.g., see the substrate S) seated on the substrate 1510 (e.g., its end effector 1520 or its substrate supports 1431-1433) relative to the substrate 1510 along the seat between the substrate S and the substrate 1510. Fig.23 , Fig.25A , Fig.25B ).

[0069] As an example of counteracting the inertial force of the payload, Fig.21 Starting on the left hand side of Fig.21The center direction 2122 is depicted at the start of the motion. When the substrate handler begins to move, the control system (e.g., the actuator control system network 1799 and the sensor control system network 1899, which may be part of the controller 199) generates a set of propulsion force vectors FP and lift force vectors FZ to cause the substrate handler 1500 to accelerate in the direction of motion at an increased pitch angle e+ (e.g., the end effector 1520 tilts, for example, in a clockwise direction). To achieve the increased pitch angle e+, a lift force vector FZ is generated such that the rear lift force vector FZ T The value is greater than the front lift force vector FZ L When the substrate handler reaches approximately a midpoint toward the end of the motion (e.g., such as a position where the acceleration of the substrate handler 1500 is substantially zero), the magnitude of the pitch angle e+ decreases, causing the tilt orientation of the end effector 1520 to reverse from a clockwise orientation to zero (e.g., approximately parallel to the horizontal reference plane 1299—the rear lift force vector FZ). T and front lift force vector FZ L At this point in the trajectory, the substrate handler 1500 motion begins a deceleration phase in which the pitch angle e- is reduced, causing the end effector 1520 to pitch toward the offset clockwise orientation. To achieve the reduced pitch angle e-, a lift force vector FZ is generated such that the rear lift force vector FZ T The value is smaller than the front lift force vector FZ L When the substrate handler 1500 reaches its final destination, the pitch angle e- increases to zero, so that the tilted orientation of the end effector 1520 is substantially parallel to the horizontal reference plane 1299, as it was at the beginning of the motion.

[0070] As can be achieved, while the pitch of the end effector is increased or decreased to account for acceleration and deceleration of the substrate handler 1500, there is substantially no slippage of the substrate S relative to the end effector when traveling along a generally straight / linear path (such as along drive lines 177-180). In other aspects, the roll r and / or pitch of the substrate handler 1500 can be increased or decreased to achieve higher rotational accelerations of the substrate handler 1500 (such as about one or more of the axes 777, 1277, 1377 in a manner generally similar to that described above with reference to linear motion (see Fig.21A , the end effector is shown in the figure with the help of Fig.15A The roll control shown in FIG. 1 is in the roll direction of rotation, where the lift force vector FZ left Greater than the lifting force vector FZ right ).

[0071] When compared to conventional substrate transport where the end effector is parallel to the wafer transfer plane throughout the end effector motion, Fig.21 The motion control illustrated in FIG. 1 enables significantly faster substrate motion transport (e.g., achieving higher accelerations with substantially no substrate slippage relative to the end effector). As an example, if during the entire motion Fig.21 If the pitch angle e of the substrate is set to zero (as in conventional substrate transport), the maximum allowable propulsion acceleration is limited to the static friction coefficient (μ) between the substrate S and the contact surface of the end effector 1520. This is illustrated in Fig. 22 , which constitutes a typical use case in conventional substrate transport, where the back side of the substrate S remains in contact with the end effector. Fig. 22 It can be seen from the figure that before the wafer slip occurs, the maximum acceleration imposed on the substrate S is μg. Where “g” is the acceleration due to gravity (about 9.8 m / S 2 ), μ is the friction coefficient, M is the mass of the substrate, W is the weight of the substrate, and N is the normal force.

[0072] Fig.23 The diagram shows a situation in which a substrate S (having a mass m) is carried by a substrate handler 1500 (having a mass M) at a pitch angle e while the substrate handler 1500 is accelerated in the X direction. Fig.23 The force diagram in FIG. 1 illustrates the motion dynamics of the substrate S and the substrate handler 1500. Fig.23 , the substrate handler 1500 is accelerated along the propulsion direction X with an acceleration a. Therefore, the force at the substrate handler is represented by the variable F1. The acceleration a along the X direction affects the reaction (normal) force N on the substrate S in the following manner: once added to the weight W of the substrate, a resultant wafer force F2 is generated. The angle e and the acceleration a can be related in the following manner: The substrate S does not substantially slide relative to the end effector 1520 of the substrate handler 1500. To substantially prevent the wafer from sliding, two situations can be considered for clarity. First, it is assumed that there is no friction between the substrate and the end effector 1520. Fig.24 FIG. 1 shows a free body diagram of a substrate S on an end effector 1520 in the absence of friction μ. Fig.24 As can be seen from the figure, despite the lack of friction μ, the acceleration a can be determined from the pitch angle e, so that the substrate mass m travels along the X direction. This relationship is expressed by the following equation (4): a=g tan e[4] Where g is the acceleration due to gravity (9.8 m / s 2 ). Fig.24A The wafer sliding region is illustrated according to the pitch angle e. It should be noted that if the pitch angle e is substantially zero, the substrate S will slide relative to the end effector 1520 without friction μ. Fig.24A The curve illustrated in represents the desired pitch angle "e" to keep the substrate S moving along the X direction at an acceleration "a" without slipping. Alternatively, Fig.24AThe same curve of can be interpreted as the required acceleration "a" of the substrate handler 1500 to prevent the substrate S from sliding when moving along the X direction at the pitch angle "e". Fig.24A Deviations from the curves illustrated in will cause the substrate S to slide "downhill" or "uphill" relative to the end effector 1520 depending on the acceleration value (where the terms downhill and uphill are used for convenience relative to pitch).

[0073] Fig.25A and Fig.25B The effect of a non-zero static friction coefficient μ on the relationship between acceleration a and pitch angle e is shown. For example, Fig.25A The minimum propulsion acceleration before slippage of the substrate S relative to the end effector 1520 occurs is shown. In this case, the friction force direction points "uphill" to substantially prevent the wafer mass from sliding "downhill" (again with respect to the pitch direction). Here, the "slowest" expected acceleration to prevent the wafer from sliding is calculated as: a min =[-μ+tan e] / [l+μtan e][5] Fig.25B , illustrates the case of the maximum (e.g., fastest) expected propulsion acceleration a prior to the sliding of the substrate S relative to the end effector 1520. In this case, the friction force direction points "downhill" to substantially prevent the wafer mass m from sliding "uphill" (again with respect to the pitch direction). Here, the "fastest" expected acceleration a is calculated as: a max =[μ+tan e] / [1-μtan e][6] Therefore, in the presence of a non-zero static friction coefficient μ, for a given pitch angle, the propulsion acceleration a should be kept within the following range in order to prevent the substrate S from sliding: a min <a<a max [7] Fig.26 An example of the dependence between acceleration a and pitch angle e is provided for a static coefficient μ of about 0.1, which is a typical value for substrate handlers used in high temperature applications. Fig.26 Repeat for μ equal to about 0 Fig.24A The area between the top and bottom curves (μ equals about 0.1) represents a non-slip zone (e.g., an acceleration zone for a given pitch angle where substrate slip relative to the end effector does not substantially occur). Areas outside this zone may have wafer slip in an upward or downward direction relative to the substrate handler inclination (i.e., pitch angle e). Fig.26In the example of FIG. 1 , the maximum acceleration at substantially zero pitch angle is about 0.1 g, which is the fastest acceleration that a conventional substrate handler can achieve for typical high temperature applications. If the pitch angle is set to about 16 degrees of inclination, substrates can be transported at accelerations up to 0.4 g using the same end effector material (as in a conventional substrate handler), which constitutes a substantial throughput improvement over conventional substrate handlers. The pitch angle θ can be set according to a predetermined acceleration to maximize throughput, such as that shown in FIG. Fig.21 middle.

[0074] Fig. 27 Active control of the orientation of the substrate handler 1500 in roll, pitch, and yaw is illustrated with respect to leveling of the substrate handler 1500 relative to a substrate station such as a process module 120. Mechanical deflection poses a challenge to entering and exiting the process module opening 2780 due to the need to optimize process module 120 processing time, and the height H3 of the process module opening 2780 becomes smaller and smaller. Conventional substrate transport is often subject to an inherent possibility of mechanical deflection due to the presence of articulated linkages with bearings that increase weight and reduce stiffness, noting that it may not be practical to compensate for end effector orientation as the wafer passes through the process module opening 2780. In these cases, being able to comply with tighter mechanical deflection constraints becomes increasingly difficult. Aspects of the disclosed embodiments provide a solution to mechanical deflection that dynamically compensates for any mechanical deflection by controlling the orientation of the substrate handler in space relative to a horizontal reference plane (e.g., by adjusting roll, pitch, and yaw angles as described herein) such that the substrate passes through the processing module opening 2780 with substantially no contact between the substrate S and the opening 2780 and substantially no contact between the end effector 1520 and the opening 2780.

[0075] Figures 15A-16C The illustration shows controlled adjustment of the roll and yaw angles of the substrate handler 1500 by the local drive controllers 1750A-1750n and the local sensor controllers 1850A-1850n in addition to the pitch angle. Fig. 27 , controlled adjustment of each of the roll, yaw, and pitch angles (e.g., by at least differentially changing the lifting force vector acting on the substrate 1510 as described herein) enables leveling of the position of the substrate handler 1500 at any suitable substrate holding station, such as the process module 120, so that the plane 2770 of the substrate S (and the end effector 1520 thereon) is substantially the same as the plane 2771 defined by the substrate support surface 2760 of the substrate holding station 120. In some aspects, the roll, yaw, and pitch angles are adjusted independently of each other. Controlled adjustment of the orientation angles (e.g., roll, pitch, and yaw) of the substrate handler 1500 also enables compensation for mechanical deflection of the end effector 1520, for example, due to substrate loading and the weight of the substrate handler 1500 structure.

[0076] refer to Figure 8-Figure 11 as well as Fig.28 and Fig.29 As described above, in some aspects, a plurality of drive lines 177 , 178 are provided to extend longitudinally along the length of the transport chamber 118 to provide for the passage of one substrate handler 1500 by another substrate handler along the longitudinal direction of the transport chamber 118 . Fig.28 The passage of two substrate handlers 1500A, 1500B passing each other is illustrated, wherein the substrate handler 1500A travels along the inbound track 1550A, and wherein the substrate handler 1500B travels along the outbound track 1550B. Here, each of the substrate handlers 1500A, 1500B has roll, pitch, and yaw angles such that the plane 2770 of the end effector 1520 (and the substrate held thereon) is substantially parallel (i.e., horizontal) to the horizontal reference plane 1299. Here, with the end effector 1520 horizontal, the transport chamber 118 has a lateral width W1. However, according to aspects of the disclosed embodiments, the width of the transport chamber 118 may be minimized or otherwise reduced from the lateral width W1 to the lateral width W2 by adjusting one or more of the roll, pitch, and yaw of the substrate handlers 1500A, 1500B as the substrate handlers 1500A, 1500B pass each other along the length of the transport chamber 118. For example, Fig.29 As shown in , the roll angle of each substrate handler 1500A, 1500B can be adjusted to a predetermined angle β relative to the horizontal reference plane 1299 to avoid contact between the substrate handlers 1500A, 1500B when they move past each other during a time period when the two substrate handlers 1500A, 1500B would otherwise occupy the same space. The predetermined roll angle β can depend on the end effector configuration (e.g., so that the substrate S does not slide relative to the end effector). As can be realized, it is advantageous to control the roll, pitch and / or yaw angles of each substrate handler 1500 so as to reduce the footprint of the transport chamber 118 that houses the wafer handling automation equipment, wherein the reduced footprint at least increases the tool density on the floor of the manufacturing facility and reduces the evacuation time of the transport chamber, which may result in increased throughput.

[0077] Reference now Fig.17 and Fig.30 , an exemplary control of an electromagnet array 1700 will be described, wherein dynamic phase allocation is employed. As described herein, a controller 199 (in one aspect, it is a cluster or master controller as described herein - see Fig.39) is operably coupled to the electromagnet array 1700 and the AC power source 1585 (wherein the power source may be of any suitable type and may be direct current, in which case the controller drive circuit will modulate it to the desired frequency / phase as needed for as many AC phases as possible), and is configured to sequentially excite the electromagnets 1700A-1700n with the multi-phase AC current so that the substrate 1510 of the substrate handler 1500 is levitated and propelled with at least one of attitude control and yaw control with a group of common electromagnets 1700A-1700n (such as those of the corresponding drive wires 177-180). As described above, the controller 199 is configured to sequentially excite the electromagnets 1700A-1700n corresponding to the position of the substrate 1510 sensed by the sensor 2000, and the electromagnets 1700A-1700n cooperate in the multi-phase AC excitation to form the motor actuator unit 1701. The number n (an integer of 3 or more in the described example, but in other aspects, two or more) of the electromagnets 1700A-1700n of each motor actuator unit 1701 and the positions (static) of the corresponding n electromagnets 1700A-1700n of each motor actuator unit 1701 can be dynamically selected by the controller 199 to achieve the lifting and propulsion of the substrate (secondary) 1510 at any given time in the overall operation of the motor actuator. Each of the electromagnets 1700A-1700n is excited by a common multi-phase alternating current having a single common frequency per phase to generate individually controllable levitation and propulsion forces on the substrate 1510 so as to control the substrate 1510 with up to six independent degrees of freedom, including at least one of attitude and yaw when the substrate 1510 is suspended. The single frequency common to each phase (here, the respective phases A, B, C) can be selectively varied from different desired excitation frequencies so that the levitation and propulsion forces generated by the motor actuator units 1701 achieve substantially independent control of the substrate 1510 in each of up to six independent degrees of freedom. In one aspect, the controller 199 controls the roll, pitch, and yaw angles generated by the electromagnet arrays 1700A-1700n arranged in the respective motor actuator units 1701, including at least the attitude in the case of levitation and propulsion of the substrate 1510, so as to move the electromagnet arrays 1700A-1700n from a first predetermined position P1 relative to the frame of the chamber 118 (see FIG. 1 ) along at least one drive line 177-180. Figure 1B ) moves to a second different predetermined position P2 relative to the frame of chamber 118 (see Figure 1B In one aspect, controller 199 controls the roll, pitch, and yaw angles generated by electromagnet array 1700, including at least suspending substrate 1510 and stationary relative to electromagnet array 1700 at a predetermined position relative to the frame of chamber 118 along at least one drive line 177-180 (such as Figure 1B The posture of the substrate 1510 and the yaw of the substrate 1510 in the case of position P2).

[0078] Fig.32A and Fig.32B The example shown is one in which each electromagnet (or coil unit) 1700A-1700n is grouped to define a motor actuator unit 1701 having a dynamically selected number of electromagnets, for example three electromagnets (n=3) and three corresponding phases (m=3), with an electrical angle of 120° between the phases (see also Fig.17 ) are also dynamically associated with three different phases A, B, C, such that the association of each phase A, B, C with a corresponding static electromagnet 1700A-1700n is consistent with the dynamic state of the motor actuator unit 1701. Thus, when the electromagnet of the motor actuator unit 1701 advances the substrate 1510 (e.g., along the direction 3100), each phase A, B, C is changed or moved from one static electromagnet to another (i.e., the designation or allocation of the corresponding phase is rolled over to the consecutive electromagnets 1700A-1700n to produce a multi-phase actuator unit 3000, 3000tP for each of the linear motor 1599 and the motor 1599R 1 、3000tP 2 virtual (motion), which is along with the multi-phase actuation unit 3000, 3000tP corresponding to the virtual motion 1 、3000tP 2 The excitation of the electromagnets 1700A-1700n generates a motion of the substrate 1510 commensurate with the motion direction 3100. For convenience, virtual motion is generated between the coil units and the phases of the multi-phase actuator units 3000, 3000tP 1 、3000tP 2 This dynamic relationship or association will be referred to herein as "dynamic phase allocation", wherein the representative virtual motion multi-phase actuator unit 3000, 3000tP that realizes the advancement of the substrate 1510 1 、3000tP 2 The virtual movement is schematically illustrated in Fig.30 (See also Fig.17 ). Here, the virtual motion multi-phase actuator unit (or Fig.17 The MAU in the virtual motion multiphase actuator unit 3000 has dynamically selected three electromagnets and associated phases A, B, C, shown in an initial (representative) position P=0 at time t=t0. The corresponding excitation of the electromagnets of the virtual motion multiphase actuator unit 3000 produces a propulsion force that moves the pressure plate / base plate 1510 between t1 and t2 (see also Figures 32A-32B). Here, as shown, at P=0 and t=t0, the electromagnets 1700A-1700C are grouped to form a virtual motion multi-phase actuator unit 3000 and are associated with phases A, B, and C, respectively. In concert with the generation of the propulsion force Fx, the respective excitations of the electromagnets 1700A-1700C of the virtual motion multi-phase actuator unit 3000 generate individually controllable lifting forces Fy at controlled variable heights relative to the platen / base plate 1510, which simultaneously lift and propel while achieving tilt adjustment of the platen / base plate 1510 (see Figures 32A-32B As can be realized, the platen / base plate 1510 moves with a predetermined lift and tilt (relative to the transfer chamber, and therefore the static electromagnets 1700A-1700C) under the influence of the lifting force Fy and the propulsion force Fx applied by the corresponding electromagnets 1700A-1700C of the virtual motion multi-phase actuator unit 3000 at time t=t0 and position P=0. To maintain steady-state tilt of the platen / baseboard 1510 during movement away from the group of electromagnets 1700A-1700C (defining the virtual motion multi-phase actuator unit 3000 at P=0 and T=T0), the controller 199 and circuit system 3050 of the corresponding electromagnets of the electromagnet array 1700A-1700n are configured to be commensurate with the travel of the corresponding electromagnets 1700B-1700D of the platen / baseboard 1510 from time t=t1 and position P=1 to the present virtual motion multi-phase actuator unit 3000tP1 set at position P=1 at time t=t1. The allocation of the respective phases A, B, C is dynamically "moved" (or "changed") (from the initial virtual motion multi-phase actuator unit 3000 at P=0 and t=t0), and then "moved" (or "changed") commensurate with the travel of the corresponding electromagnets 1700C-1700E of the platen / baseboard 1510 at time t=t2 and position P=2 to the virtual motion multi-phase actuator unit 3000tP2 now defined as being disposed at position P=2 at time t=t2 (from the virtual motion multi-phase actuator unit 3000tP1 at P=1 and t=t1), etc. The dynamic phase allocation is repeated throughout the platen / baseboard 1510 motion so that the phase distribution relative to the platen and the excitation of the respective phases (here, A, B, C) by the platen / baseboard 1510 maintains a substantially steady state throughout the motion of the platen / baseboard 1510.

[0079] Virtual Multiphase Actuator Unit 3000, 3000tP 1 、3000tP 2A series of electromagnets 1700A-1700n of an electromagnet array 1700 coupled to at least a multi-phase AC power source 1585 may be included, which define at least one drive line 177-180 within a drive plane 1598, wherein the electromagnets 1700A-1700n in the series of electromagnets 1700A-1700n are dynamically grouped into at least one multi-phase actuator unit DLIM1, DLIM2, DLIM3, and each of the at least one multi-phase actuator unit DLIM1, DLIM2, DLIM3 is coupled to at least a multi-phase AC power source 1585. In this case, upon initiation of propulsion (achieving motion of the substrate / secondary) by energization of the corresponding electromagnet groups of the motor actuation units in an initial position (P=0, t=0), as described above, the definitions of the phases A, B, C and associated "motors" (e.g., DLIM1, DLIM2, DLIM3) are changed in space and time (Pi, ti) so as to maintain a substantially steady-state force vector FZ1, FZ2, FX1, FX2 imparted on the substrate 1510 throughout the range of motion, which provides the desired substantially steady-state or constant tilt orientation of the substrate handler 1500 throughout the range of motion. As described herein, reference is made to Fig.17 An exemplary actuator control system network 1799 configured to implement dynamic phase allocation is described. Fig.32A and Fig.32B As can be seen, the dynamic phase distribution is controlled by the controller 199 so that the corresponding electromagnets 1700A-1700n grouped into corresponding motor actuator units (such as described herein) energized by multi-phase alternating currents A, B, C present a roughly steady-state multi-phase distribution of the corresponding electromagnets 1700A-1700n of at least one multi-phase actuator unit DLIM1, DLIM2, DLIM3 that is virtually moved relative to the substrate 1510 (represented by the front part 3110 and the rear part 3111). It should be noted that the phase currents A, B, C are illustrated within the respective electromagnets 1700A-1700n, and that the phase current distribution across at least one multiphase actuator unit DLIM1, DLIM2, DLIM3 remains constant or steady state relative to the substrate 1510 (e.g., as an example of steady state, note that throughout the movement of the substrate 1510 and at least one (virtually moving) multiphase actuator unit DLIM1, DLIM2, DLIM3 along the direction 3100, the phase current A remains at the tail end of the rear portion 3111, the phase current C remains at the front end of the rear portion 3111, and the phase current B remains in the center of the rear portion 3111).

[0080] In more detail on dynamic phase allocation, Fig.30 The electromagnets 1700A, 1700B, and 1700C are shown at time t1 and are defined as phases A, B, and C, respectively. Fig.30 and Fig.32A), which generates a spatial force vector that provides individually controllable lifting and propulsion forces of a predetermined substrate handler 1500 (i.e., a wafer handler identified by sensor 2000 and selected for movement by controller 199). As substrate handler 1500 moves in space (e.g., along a drive line associated with electromagnet array 1700), at time t2, electromagnets 1700B, 1700C, 1700D become phases A, B, C, respectively ( Fig.30 and Fig.32B As the substrate carrier 1500 continues along the drive line (in this example, direction 3100, as shown in FIG. Fig.32A , Fig.32B and Fig.32C ) as shown in FIG. 1 , at time t3, phases A, B, and C are associated with electromagnets 1700C, 1700D, and 1700E, respectively. This dynamic phase allocation enables continuous spatial and temporal control of the force vectors that maintain the predetermined propulsion, lifting, and orientation of the substrate handler 1500. In one aspect, the AC power source 1585 is coupled to each of the electromagnets 1700A-1700n of the electromagnet array 1700 through any suitable signal conditioning circuitry 3050 that may include a current amplification power supply unit 3011 or any other suitable signal processing. The phase A, B, and C currents are transmitted to each of the local drive controllers 1750A-1750n, which, under the control of the master controller 1760 or in response to instructions from the master controller 1760, provide the designated one of the phases A, B, and C to the corresponding electromagnet in the manner described above to achieve dynamic phase allocation.

[0081] As described herein, the substrate 1510 ( Fig. 16B ) and at least one multi-phase actuator unit ( Fig.32B) The electromagnets 1700A-1700n of DLIM, DLIM2, DLIM3 cooperate so that the electromagnets 1700A-1700n generate a levitation force and a propulsion force on the substrate 1510 by means of the excitation of the alternating current, and the levitation force and the propulsion force controllably levitate and propel the substrate 1510 along at least one drive line 177-180 in a controlled posture relative to the drive plane 1598. The controller 199 (which in some aspects includes at least a master controller 1760 and any controller subordinate to the master controller, such as local drive controllers 1750A-1750n; however, in other aspects, the controller can have any suitable configuration) is operably coupled to the AC power source 1585 and the electromagnet array 1700. The AC power source 1585 can include any suitable associated circuit system 3050, through which the AC power source 1585 is connected to the electromagnet array 1700. The AC power source 1585 is controlled by a local drive controller or any other suitable controller such as the master controller 1760. Typical control parameters of an AC power source include signal amplitude, signal frequency, and phase shift relative to a reference coil unit. Other types of control parameters may be defined. As used herein, Fig.30 The "phases" A, B, C illustrated in FIG. 1 are analogous to specific coils in a multiphase electric motor; however, the phase definitions (such as Fig.30 Each of A, B, C) in is not physically associated with any particular coil.

[0082] As a comparison to the prior art, if a segmented linear induction motor with static phase assignment is used with its own dedicated control, it will be difficult to achieve angle / tilt control when the substrate handler transitions from one segment to the next. Fig.31A and Fig.31B Illustration of the problem of maintaining pitch control across a static piecewise linear induction motor. Fig.31A The front and rear portions 3110 and 3111 of the substrate 1510 or secondary are shown with inductive forces along the Z and X axes. The first motor segment (SLIM1) with phases A, B and C generates forces Fz1 and Fx1 to lift and propel the rear portion 3111 of the substrate. The second motor segment (SLIM2) generates forces Fz2 and Fx2 for the front portion 3110 of the substrate using its respective phases A, B and C. As the substrate moves in direction 3100, the front and rear portions 3110, 3111 of the substrate will be transferred to the next linear induction motor segment. This is shown in FIG. Fig.31BIn this position, the rear portion 3111 of the substrate overlaps with phases B and C of SLIM1 and phase A of SLIM2. At the same time, the front portion 3110 of the substrate overlaps with phases B and C of SLIM2 and phase A of SLIM3. Therefore, it is not possible to maintain the same required forces Fz1, Fx1, Fz2, Fx2 because, for example, the SLIM2 phase is shared by the front and rear portions 3110, 3111 of the substrate.

[0083] As previously described, and now with reference to Fig.32C In one aspect, simultaneous and separate control of propulsion and suspension (such that propulsion and lift forces are fully and separately controllable such that control of each can be considered independent of the other, even though both forces are affected by excitation by means of a common multi-phase alternating current having a single common frequency per phase, each phase common frequency being selectively variable from a different desired frequency) can be affected by dynamic phase allocation as described herein, wherein one or more dynamic linear motors (DLIMs) can include a selectable number n of phases associated with electromagnets defining virtual motion multi-phase actuator units, where n can be an integer greater than 3. The number n of electromagnets defining the virtual motion multi-phase actuator units can be dynamically selected, for example, to achieve different movements of the platen / baseboard 1510 depending on the kinematic characteristics of the desired movement. Here, the excitation frequency generally applied to each phase of the virtual motion multi-phase actuator unit is selected by the controller 199 so as to produce the desired kinematic performance and control of the platen / baseboard 1510. Here, the phase control algorithm maintains the same electrical phase angle difference between the phases (e.g., the electromagnets of the motors), such as Fig.32C The electrical phase angle difference between the phases is calculated relative to the reference phase and relative to each phase. The electrical phase angle difference may range from about -180 degrees to about 180 degrees, with a value of about 0 degrees corresponding to no propulsion, and positive and negative values ​​providing propulsion in the positive and negative directions, respectively. Here, DLIM1 (illustrated with 6 electromagnets for exemplary purposes) is compared with Fig.32C The boundary between DLIM2 shown in is dynamic. In another aspect of the dynamic linear motor electromagnet / phase allocation, not all electromagnets of the dynamic linear motor need to be energized at the same time. Referring to DLIM 1, only m (in this example, m=4) electromagnets (where m is the number of electromagnets covered by the substrate (or secondary)) of all n (in this example, n=6) electromagnets of the dynamic linear motor DLIM1 are enabled to achieve lifting and advancement of the substrate 1510, while the other electromagnets of the n electromagnets of the dynamic linear motor DLIM1 can be turned off.

[0084] Now refer to e.g. Figure 1A-Figure 11 , Figures 15A-15C, Fig.17 , Fig.28 , Fig.29 , Fig.30 and Fig.41 , an exemplary method for a linear motor 1599 will be described according to one or more aspects of the disclosed embodiments. In the method, a frame ( Fig.41 , box 4100), wherein the frame has a horizontal reference plane 1299. A drive plane 1598 is formed ( Fig.41 , block 4110), wherein the electromagnet array 1700 is connected to the frame. The drive plane 1598 is located at a predetermined height H relative to the horizontal reference plane 1299. The electromagnet array 1700 is arranged so that a series of electromagnets in the electromagnet array define at least one drive line 177, 178 within the drive plane 1598, and each of the electromagnets 1700A-1700n (see Fig. 15B ) is coupled to an alternating current (AC) power source 1585, thereby energizing each electromagnet 1700A-1700n. At least one reaction plate 1510 ( Fig.41 , block 4120), wherein at least one reaction plate 1510 is made of a paramagnetic, diamagnetic or non-magnetic conductive material and is configured to cooperate with the electromagnets 1700A-1700n of the electromagnet array 1700. The electromagnets 1700A-1700n are excited by alternating current to generate a suspension force and a propulsion force FZ, FP ( Fig.41 , box 4130), the suspension force and propulsion force FZ, FP controllably suspend and propel the reaction plate 1510 along at least one drive line in a controlled posture relative to the drive plane 1598. In the method for linear motor 1599, electromagnets 1700A-1700n are sequentially excited by multi-phase alternating current by means of a controller 199 operably coupled to electromagnet array 1700 and AC power source 1585, so that each reaction plate 1510 is suspended and propelled with up to 6 degrees of freedom including at least one of attitude control and yaw control by means of a group of common electromagnets 1700A-1700n, and each of electromagnets 1700A-1700n generates both suspension force and propulsion force FZ, FP on reaction plate 1510 by excitation with a common multi-phase alternating current having a single common frequency in each phase, so as to control reaction plate 1510 with up to 6 degrees of freedom including at least one of reaction plate attitude and reaction plate yaw when reaction plate 1510 is at least suspended.

[0085] Now refer to e.g. Figure 1A-11 , Figures 15A-15C , Fig.17 , Fig.28 , Fig.29 , Fig.30 and Fig.42 , a method for an electromagnetic conveyor substrate transport device 1599 will be described according to one or more aspects of the disclosed embodiments. In the method, a chamber 118 ( Fig.42 , block 4200), the chamber 118 is configured to maintain a sealed atmosphere therein and has a horizontal reference plane 1299 and at least one substrate through opening 118O for transferring a substrate into and out of the chamber 118 through the opening 118O. A drive plane 1598 ( Fig.42 , block 4210), wherein the electromagnet array 1700 is connected to the chamber 118. The drive plane 1598 is located at a predetermined height H relative to the horizontal reference plane 1299. The electromagnet array 1700 is arranged so that a series of electromagnets 1700A-1700n of the electromagnet array 1700 define at least one drive line 177, 178 within the drive plane 1598, the electromagnets 1700A-1700n in the series of electromagnets 1700A-1700n are grouped into at least one multi-phase actuator unit, and each of the at least one multi-phase actuator unit is coupled to a multi-phase alternating current (AC) power source 1585. At least one reaction plate 1510 ( Fig.42 , block 4220), wherein at least one reaction plate 1510 is made of a paramagnetic, diamagnetic or non-magnetic conductive material and is configured to cooperate with the electromagnets 1700A-1700n of at least one multi-phase actuator unit. The electromagnets 1700A-1700n are excited by alternating current to generate a suspension force and a propulsion force FZ, FP ( Fig.42 , block 4230), the levitation force and propulsion force FZ, FP controllably levitate and propel the reaction platen 1510 along at least one drive line 177, 178 in a controlled attitude relative to the drive plane 1598. The reaction platen 1510 is levitated and propelled by sequentially energizing the electromagnets 1700A-1700n by means of a multi-phase alternating current by means of a controller 199 operably coupled to the electromagnet array 1700 and the AC power source 1585, wherein each AC phase of the multi-phase alternating current is dynamically allocated between the corresponding electromagnets 1700A-1700n, so that the AC phase of each corresponding electromagnet 1700A-1700n of the electromagnet group of the at least one multi-phase actuator unit is changed from a first AC phase to a second different AC phase, so that the electromagnet group is virtually moved in reality, and the at least one multi-phase actuator unit formed by the electromagnet group is virtually moved via the dynamic phase allocation along the drive lines 177, 178.

[0086] According to one or more aspects of the disclosed embodiment, a linear motor includes: a frame having a horizontal reference plane; an electromagnet array connected to the frame to form a drive plane at a predetermined height relative to the horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive plane, and each of the electromagnets being coupled to an AC power source so that each electromagnet is energized; at least one reaction plate made of paramagnetic, diamagnetic or non-magnetic conductive material, the reaction plate being vertically arranged to cooperate with the electromagnets in the electromagnet array so that the electromagnets generate a suspension force and a propulsion force on the reaction plate by means of an alternating current excitation, the suspension force and the propulsion force controllably suspending and propelling the reaction plate along the at least one drive line in a controlled posture relative to the drive plane; and a controller operably coupled to the array of electromagnets and the AC power source and configured to sequentially excite the electromagnets with a multi-phase AC current so that each reaction plate is suspended and propelled with up to six degrees of freedom including at least one of attitude control and yaw control with a group of common electromagnets, each of the electromagnets generating both the suspension force and the propulsion force on the reaction plate by excitation with a common multi-phase AC current having a single common frequency per phase so as to control the reaction plate with up to six degrees of freedom including at least one of reaction plate attitude and reaction plate yaw when at least the reaction plate is suspended.

[0087] According to one or more aspects of the disclosed embodiment, the controller controls the up to 6 degrees of freedom produced by the electromagnet array, including at least the reaction platen posture when the reaction platen is suspended and propelled so as to move along the at least one drive line relative to the electromagnet array from a first predetermined position relative to the frame to a second different predetermined position relative to the frame.

[0088] According to one or more aspects of the disclosed embodiment, the controller controls the up to 6 degrees of freedom produced by the electromagnet array, including at least the reaction plate attitude and the reaction plate yaw when the reaction plate is suspended relative to the electromagnet array and stationary in a predetermined position relative to the frame along at least one drive line.

[0089] In accordance with one or more aspects of the disclosed embodiment, the controller controls the propulsive force across the reaction plate generated by the electromagnet array to impart a controlled yaw moment on the reaction plate to cause the reaction plate to yaw about a yaw axis generally normal to the drive plane from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame.

[0090] According to one or more aspects of the disclosed embodiment, the controller controls the propulsion force generated by the electromagnet array to impart a torque on the reaction plate to achieve controlled yaw of the reaction plate to achieve at least one of positioning and centering of a wafer payload on the reaction plate relative to a predetermined wafer holding position of the frame.

[0091] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array so as to impart different suspension forces across the reaction plate, the different suspension forces achieving controlled tilting of the reaction plate relative to the drive plane, which controls a predetermined reaction plate attitude with at least one of reaction plate pitch and reaction plate roll.

[0092] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array to achieve a predetermined biased attitude of the reaction plate relative to the drive plane, which imparts a biased reaction force on a payload supported by the reaction plate mounting surface from the reaction plate payload mounting surface in a direction to offset the payload inertia force generated by acceleration of the reaction plate along the drive plane.

[0093] According to one or more aspects of the disclosed embodiment, the linear motor further includes position feedback sensors distributed on the frame, the position feedback sensors being configured to sense the position of the reaction plate along the drive plane and being communicatively coupled to the controller so that the controller records the sensed position of the reaction plate, wherein the controller is configured to sequentially excite the electromagnets in the electromagnet array corresponding to the sensed positions.

[0094] According to one or more aspects of the disclosed embodiment, the controller is configured to determine the acceleration of the reaction plate along the drive plane from at least a change in the sensed position, and in response to the determined acceleration, control the bias attitude of the reaction plate to provide the predetermined bias attitude that offsets the payload inertia force generated by the acceleration of the reaction plate.

[0095] According to one or more aspects of the disclosed embodiment, the controller controls the excitation of the electromagnets in the electromagnet array so as to set the reaction platen posture to overcome the inertial force biasing the reaction platen, and the inertial force tends to displace the payload seated on the reaction platen relative to the reaction platen along a seat between the payload and the reaction platen.

[0096] According to one or more aspects of the disclosed embodiment, an electromagnetic conveyor substrate transport device includes: a chamber configured to maintain a sealed atmosphere therein and having a horizontal reference plane and at least one substrate through opening for transferring a substrate into and out of the chamber through the opening; an electromagnet array connected to the chamber to form a drive plane at a predetermined height relative to the horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array defines at least one drive line within the drive plane, the electromagnets in the series of electromagnets being grouped into at least one multi-phase actuator unit, and each of the at least one multi-phase actuator unit being coupled to a multi-phase AC power source; at least one reaction plate made of paramagnetic, diamagnetic or non-magnetic conductive material, the reaction plate being vertically arranged to cooperate with the electromagnet in the at least one multi-phase actuator unit, so that the electromagnet generates a suspension force and a propulsion force on the reaction plate by means of an alternating current excitation, and the suspension force and the propulsion force controllably suspend and propel the reaction plate along the at least one drive line in a controlled posture relative to the drive plane; and A controller is operably coupled to the electromagnet array and the AC power source and is configured to sequentially excite the electromagnets with the aid of a multi-phase AC current so that the reaction plate is suspended and propelled, wherein each AC current phase of the multi-phase AC current is dynamically distributed among the corresponding electromagnets so that the AC current phase of each corresponding electromagnet of the electromagnet group of the at least one multi-phase actuator unit is changed from a first AC current phase to a second different AC current phase, so that the electromagnet group actually moves virtually, and the at least one multi-phase actuator unit formed by the electromagnet group moves virtually via the dynamic phase distribution along the drive line.

[0097] According to one or more aspects of the disclosed embodiment, the reaction plate is suspended and propelled with up to 6 degrees of freedom including at least one of attitude and yaw control with the virtually moving at least one multi-phase actuator unit.

[0098] In accordance with one or more aspects of the disclosed embodiment, the controller controls the up to six degrees of freedom produced by the electromagnet array, including at least the reaction platen's posture when the reaction platen is suspended and propelled so as to move along the at least one drive line relative to the electromagnet array from a first predetermined position relative to the chamber to a second, different predetermined position relative to the chamber.

[0099] According to one or more aspects of the disclosed embodiment, the controller controls the up to 6 degrees of freedom produced by the electromagnet array, including at least the reaction plate attitude and the reaction plate yaw when the reaction plate is suspended and stationary in a predetermined position relative to the chamber along at least one drive line relative to the electromagnet array.

[0100] According to one or more aspects of the disclosed embodiment, the dynamic phase allocation is controlled so that the at least one multi-phase actuator unit that is virtually moved moves virtually along the drive line substantially in unison with the reaction platen movement along the drive line propelled by the at least one multi-phase actuator unit that is virtually moved.

[0101] In accordance with one or more aspects of the disclosed embodiment, the controller controls the propulsive force across the reaction plate generated by the electromagnet array to impart a controlled yaw moment on the reaction plate to cause the reaction plate to yaw about a yaw axis generally normal to the drive plane from a first predetermined orientation relative to the chamber to a second, different predetermined orientation relative to the chamber.

[0102] According to one or more aspects of the disclosed embodiment, the controller controls the propulsion force generated by the electromagnet array to impart a torque on the reaction plate to achieve controlled yaw of the reaction plate to achieve at least one of positioning and centering of a wafer payload on the reaction plate relative to a predetermined wafer holding position of the chamber.

[0103] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array so as to impart different suspension forces across the reaction plate, the different suspension forces achieving controlled tilting of the reaction plate relative to the drive plane, which controls a predetermined reaction plate attitude with at least one of reaction plate pitch and reaction plate roll.

[0104] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array to achieve a predetermined biased attitude of the reaction plate relative to the drive plane, which imparts a biased reaction force on a payload supported by the reaction plate mounting surface from the reaction plate payload mounting surface in a direction to offset the payload inertia force generated by acceleration of the reaction plate along the drive plane.

[0105] According to one or more aspects of the disclosed embodiment, the electromagnetic conveyor substrate transport device further includes position feedback sensors distributed on the chamber, which are configured to sense the position of the reaction plate along the drive plane and are communicatively coupled to the controller, so that the controller records the sensed position of the reaction plate, wherein the controller is configured to sequentially excite the electromagnets in the electromagnet array corresponding to the sensed position.

[0106] According to one or more aspects of the disclosed embodiment, the controller is configured to determine the acceleration of the reaction plate along the drive plane from at least a change in the sensed position, and in response to the determined acceleration, control the bias attitude of the reaction plate to provide the predetermined bias attitude that offsets the payload inertia force generated by the acceleration of the reaction plate.

[0107] According to one or more aspects of the disclosed embodiment, the controller controls the excitation of the electromagnets in the electromagnet array so as to set the reaction platen posture to overcome the inertial force biasing the reaction platen, and the inertial force tends to displace the payload seated on the reaction platen relative to the reaction platen along a seat between the payload and the reaction platen.

[0108] According to one or more aspects of the disclosed embodiment, the dynamic phase distribution is controlled so that the corresponding electromagnets energized by the multi-phase alternating current present a substantially steady-state multi-phase distribution of the corresponding electromagnets of the at least one multi-phase actuator unit moving virtually relative to the reaction plate.

[0109] According to one or more aspects of the disclosed embodiment, a method for a linear motor is provided. The method comprises: providing a frame for the linear motor, the frame having a horizontal reference plane; forming a drive plane by means of an array of electromagnets connected to the frame, the drive plane being positioned at a predetermined height relative to the horizontal reference plane, the array of electromagnets being arranged such that a series of electromagnets in the array of electromagnets define at least one drive line within the drive plane, and each of the electromagnets being coupled to an alternating current power source so that each electromagnet is energized; providing at least one reaction plate made of a paramagnetic, diamagnetic or non-magnetic conductive material, the reaction plate being erected to cooperate with the electromagnets in the array of electromagnets; and exciting the electromagnet with alternating current to generate a levitation force and a propulsion force on the reaction platen, the levitation force and the propulsion force controllably levitating and propelling the reaction platen along the at least one drive line in a controlled attitude relative to the drive plane; wherein the electromagnets are sequentially excited by means of a multi-phase alternating current by means of a controller operably coupled to the electromagnet array and the AC power source, so that each reaction plate is suspended and propelled with up to 6 degrees of freedom including at least one of attitude control and yaw control by means of a group of common electromagnets, and each of the electromagnets generates both the suspension force and the propulsion force on the reaction plate by excitation by means of a common multi-phase alternating current having a single common frequency per phase, so as to control the reaction plate with up to 6 degrees of freedom including at least one of reaction plate attitude and reaction plate yaw when at least the reaction plate is suspended.

[0110] According to one or more aspects of the disclosed embodiment, the controller controls the up to 6 degrees of freedom produced by the electromagnet array, including at least the reaction platen posture when the reaction platen is suspended and propelled so as to move along the at least one drive line relative to the electromagnet array from a first predetermined position relative to the frame to a second different predetermined position relative to the frame.

[0111] According to one or more aspects of the disclosed embodiment, the controller controls the up to 6 degrees of freedom produced by the electromagnet array, including at least the reaction plate attitude and the reaction plate yaw when the reaction plate is suspended relative to the electromagnet array and stationary in a predetermined position relative to the frame along at least one drive line.

[0112] In accordance with one or more aspects of the disclosed embodiment, the controller controls the propulsive force across the reaction plate generated by the electromagnet array to impart a controlled yaw moment on the reaction plate to cause the reaction plate to yaw about a yaw axis generally normal to the drive plane from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame.

[0113] According to one or more aspects of the disclosed embodiment, the controller controls the propulsion force generated by the electromagnet array to impart a torque on the reaction plate to achieve controlled yaw of the reaction plate to achieve at least one of positioning and centering of a wafer payload on the reaction plate relative to a predetermined wafer holding position of the frame.

[0114] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array so as to impart different suspension forces across the reaction plate, the different suspension forces achieving controlled tilting of the reaction plate relative to the drive plane, which controls a predetermined reaction plate attitude with at least one of reaction plate pitch and reaction plate roll.

[0115] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array to achieve a predetermined biased attitude of the reaction plate relative to the drive plane, which imparts a biased reaction force on a payload supported by the reaction plate mounting surface from the reaction plate payload mounting surface in a direction to offset the payload inertia force generated by acceleration of the reaction plate along the drive plane.

[0116] According to one or more aspects of the disclosed embodiment, the method further includes sensing the position of the reaction plate along the drive plane by means of a position feedback sensor distributed on the frame and communicatively coupled to the controller, whereby the controller records the sensed position of the reaction plate, wherein the controller sequentially excites the electromagnets in the electromagnet array corresponding to the sensed position.

[0117] According to one or more aspects of the disclosed embodiment, the controller determines the acceleration of the reaction plate along the drive plane from at least the change in the sensed position, and in response to the determined acceleration, controls the bias attitude of the reaction plate to provide the predetermined bias attitude that offsets the payload inertia force generated by the acceleration of the reaction plate.

[0118] According to one or more aspects of the disclosed embodiment, the controller controls the excitation of the electromagnets in the electromagnet array so as to set the reaction platen posture to overcome the inertial force biasing the reaction platen, and the inertial force tends to displace the payload seated on the reaction platen relative to the reaction platen along a seat between the payload and the reaction platen.

[0119] According to one or more aspects of the disclosed embodiment, a method for an electromagnetic conveyor substrate transport device is provided. The method comprises: providing a chamber for the electromagnetic conveyor substrate transport device, the chamber being configured to maintain a sealed atmosphere therein and having a horizontal reference plane and at least one substrate through opening for conveying a substrate into and out of the chamber through the opening; forming a drive plane by means of an array of electromagnets connected to the chamber, the drive plane being positioned at a predetermined height relative to the horizontal reference plane, the array of electromagnets being arranged such that a series of electromagnets in the array of electromagnets defines at least one drive line within the drive plane, the electromagnets in the series of electromagnets being grouped into at least one multi-phase actuator unit, and each of the at least one multi-phase actuator unit being coupled to a multi-phase alternating current power source; providing at least one reaction plate made of a paramagnetic, diamagnetic or non-magnetic electrically conductive material, said reaction plate being erected to cooperate with said electromagnets in said at least one multi-phase actuator unit; and exciting the electromagnet with alternating current to generate a levitation force and a propulsion force on the reaction platen, the levitation force and the propulsion force controllably levitating and propelling the reaction platen along the at least one drive line in a controlled attitude relative to the drive plane; The electromagnets are sequentially excited by means of a multi-phase alternating current by means of a controller operably coupled to the electromagnet array and the AC power supply, so that the reaction pressure plate is suspended and propelled, wherein each AC phase of the multi-phase alternating current is dynamically distributed among the corresponding electromagnets, so that the AC phase of each corresponding electromagnet of the electromagnet group of the at least one multi-phase actuator unit is changed from a first AC phase to a second different AC phase, so that the electromagnet group actually moves virtually, and the at least one multi-phase actuator unit formed by the electromagnet group moves virtually via the dynamic phase distribution along the drive line.

[0120] According to one or more aspects of the disclosed embodiment, the reaction plate is suspended and propelled with up to 6 degrees of freedom including at least one of attitude and yaw control with the virtually moving at least one multi-phase actuator unit.

[0121] In accordance with one or more aspects of the disclosed embodiment, the controller controls the up to six degrees of freedom produced by the electromagnet array, including at least the reaction platen's posture when the reaction platen is suspended and propelled so as to move along the at least one drive line relative to the electromagnet array from a first predetermined position relative to the chamber to a second, different predetermined position relative to the chamber.

[0122] According to one or more aspects of the disclosed embodiment, the controller controls the up to 6 degrees of freedom produced by the electromagnet array, including at least the reaction plate attitude and the reaction plate yaw when the reaction plate is suspended and stationary in a predetermined position relative to the chamber along at least one drive line relative to the electromagnet array.

[0123] According to one or more aspects of the disclosed embodiment, the dynamic phase allocation is controlled so that the virtually moving at least one multi-phase actuator unit is virtually moved along the drive line substantially in unison with the reaction platen movement along the drive line caused by the propulsion of the virtually moving at least one multi-phase actuator unit.

[0124] In accordance with one or more aspects of the disclosed embodiment, the controller controls the propulsive force across the reaction plate generated by the electromagnet array to impart a controlled yaw moment on the reaction plate to cause the reaction plate to yaw about a yaw axis generally normal to the drive plane from a first predetermined orientation relative to the chamber to a second, different predetermined orientation relative to the chamber.

[0125] According to one or more aspects of the disclosed embodiment, the controller controls the propulsion force generated by the electromagnet array to impart a torque on the reaction plate to achieve controlled yaw of the reaction plate to achieve at least one of positioning and centering of a wafer payload on the reaction plate relative to a predetermined wafer holding position of the chamber.

[0126] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array so as to impart different suspension forces across the reaction plate, the different suspension forces achieving controlled tilting of the reaction plate relative to the drive plane, which controls a predetermined reaction plate attitude with at least one of reaction plate pitch and reaction plate roll.

[0127] According to one or more aspects of the disclosed embodiment, the controller controls the suspension force generated by the electromagnet array to achieve a predetermined biased attitude of the reaction plate relative to the drive plane, which imparts a biased reaction force on a payload supported by the reaction plate mounting surface from the reaction plate payload mounting surface in a direction to offset the payload inertia force generated by acceleration of the reaction plate along the drive plane.

[0128] According to one or more aspects of the disclosed embodiment, the method further includes sensing the position of the reaction plate along the drive plane with the aid of the position feedback sensor distributed on the chamber and communicatively coupled to the controller, so that the controller records the sensed position of the reaction plate, wherein the controller is configured to sequentially excite the electromagnets in the electromagnet array corresponding to the sensed position.

[0129] According to one or more aspects of the disclosed embodiment, the controller determines the acceleration of the reaction plate along the drive plane from at least the change in the sensed position, and in response to the determined acceleration, controls the bias attitude of the reaction plate to provide the predetermined bias attitude that offsets the payload inertia force generated by the acceleration of the reaction plate.

[0130] According to one or more aspects of the disclosed embodiment, the controller controls the excitation of the electromagnets in the electromagnet array so as to set the reaction platen posture to overcome the inertial force biasing the reaction platen, and the inertial force tends to displace the payload seated on the reaction platen relative to the reaction platen along a seat between the payload and the reaction platen.

[0131] According to one or more aspects of the disclosed embodiment, the dynamic phase distribution is controlled so that the corresponding electromagnets energized by the multi-phase alternating current present a substantially steady-state multi-phase distribution of the corresponding electromagnets of the at least one multi-phase actuator unit moving virtually relative to the reaction plate.

[0132] It should be understood that the foregoing description is merely illustrative of aspects of the disclosed embodiments. Various alternatives and modifications may be envisioned by those skilled in the art without departing from aspects of the disclosed embodiments. Therefore, aspects of the disclosed embodiments are intended to include all such alternatives, modifications, and variations that fall within the scope of any appended claims. Furthermore, the fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be used to advantage, and such a combination is still within the scope of aspects of the present disclosure.

Claims

1. A linear motor, comprising: a frame having a horizontal reference plane; an electromagnet array connected to the frame to form a drive plane at a predetermined height relative to the horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array define at least one drive line within the drive plane, and each of the electromagnets being coupled to an AC power source so that each electromagnet is energized; at least one reaction plate made of paramagnetic, diamagnetic or non-magnetic conductive material, the reaction plate being arranged to cooperate with the electromagnets in the electromagnet array so that the electromagnets generate a suspension force and a propulsion force on the reaction plate by means of an alternating current excitation, the suspension force and the propulsion force controllably suspending and propulsing the reaction plate in a controlled posture along the at least one driving line relative to the driving plane; as well as A controller operably coupled to the electromagnet array and the AC power source and configured to sequentially excite the electromagnets with a multi-phase AC current describing more than one degree of freedom control of each reaction platen, each reaction platen performing at least one of levitation and propulsion with at least one of stable attitude control and controllably variable attitude control with a group of common electromagnets, each of the electromagnets generating both the levitation force and the propulsion force on the reaction platen by excitation with a common multi-phase AC current having a single common frequency per phase, thereby achieving more than one degree of freedom control of the reaction platen.

2. The linear motor of claim 1 , wherein the controller controls more than one degree of freedom control for each reaction platen produced by the electromagnet array, including at least a reaction platen posture when the reaction platen is suspended and propelled so as to move along the at least one drive line relative to the electromagnet array from a first predetermined position relative to the frame to a second different predetermined position relative to the frame.

3. The linear motor of claim 1 , wherein the controller controls more than one degree of freedom control of the reaction plate produced by the electromagnet array, including at least a reaction plate attitude and a reaction plate yaw when the reaction plate is suspended relative to the electromagnet array and stationary in a predetermined position relative to the frame along the at least one drive line.

4. The linear motor of claim 1 , wherein the controller controls the propulsive force generated by the array of electromagnets across the at least one reaction plate to impart a controlled yaw moment on the at least one reaction plate to cause the at least one reaction plate to yaw about a yaw axis generally normal to the drive plane from a first predetermined orientation relative to the frame to a second, different predetermined orientation relative to the frame; or so as to impart a moment on the at least one reaction platen to achieve controlled yaw of the at least one reaction platen to achieve at least one of positioning and centering of a wafer payload on the at least one reaction platen relative to a predetermined wafer holding position of the frame.

5. The linear motor of claim 1 , wherein the controller controls the suspension force generated by the electromagnet array so as to impart different suspension forces across the at least one reaction plate, the different suspension forces effecting controlled tilting of the at least one reaction plate relative to the drive plane to control a predetermined reaction plate attitude in at least one of a reaction plate pitch and a reaction plate roll.

6. The linear motor of claim 1 , wherein the controller controls the suspension force generated by the electromagnet array to achieve a predetermined biased attitude of the at least one reaction platen relative to the drive plane, which imparts a biased reaction force on a payload supported by the reaction platen mounting surface from the reaction platen payload mounting surface in a direction that counteracts a payload inertia force generated by acceleration of the at least one reaction platen along the drive plane.

7. The linear motor of claim 6 further comprising position feedback sensors distributed on the frame, the position feedback sensors being configured to sense the position of the at least one reaction platen along the drive plane and being communicatively coupled to the controller so that the controller records the sensed position of the at least one reaction platen, wherein the controller is configured to sequentially excite the electromagnets in the electromagnet array corresponding to the sensed position.

8. The linear motor of claim 7 , wherein the controller is configured to determine an acceleration of the at least one reaction platen along the drive plane from at least a change in the sensed position, and in response to the determined acceleration, control a bias attitude of the at least one reaction platen to provide the predetermined bias attitude that counteracts the payload inertia force generated by the acceleration of the at least one reaction platen.

9. The linear motor of claim 1 , wherein the controller controls the energization of the electromagnets in the electromagnet array so as to set the reaction platen posture to bias the reaction platen against an inertial force that tends to displace a payload seated on the reaction platen relative to the reaction platen along a seat between the payload and the reaction platen.

10. A method for an electromagnetic conveyor substrate transport device, the method comprising: providing a chamber for the electromagnetic conveyor substrate transport device, the chamber being configured to maintain a sealed atmosphere therein and having a horizontal reference plane and at least one substrate through opening for conveying a substrate into and out of the chamber through the opening; forming a drive plane by means of an array of electromagnets connected to the chamber, the drive plane being positioned at a predetermined height relative to the horizontal reference plane, the array of electromagnets being arranged such that a series of electromagnets in the array of electromagnets define at least one drive line within the drive plane, the electromagnets in the series of electromagnets being grouped into at least one multiphase actuator unit, and each of the at least one multiphase actuator unit being coupled to a multiphase AC power source; providing at least one reaction platen made of a paramagnetic, diamagnetic or nonmagnetic conductive material, the reaction platen being arranged to cooperate with the electromagnets in the at least one multiphase actuator unit; as well as exciting the electromagnet with alternating current to generate a levitation force and a propulsion force on the reaction platen, the levitation force and the propulsion force controllably levitating and propelling the reaction platen along the at least one drive line in a controlled attitude relative to the drive plane; Wherein, the electromagnets are sequentially excited by means of a multi-phase alternating current that describes the control of more than one degree of freedom of each reaction plate by means of a controller operably coupled to the electromagnet array and the multi-phase alternating current power supply, and the multi-phase alternating current is used to sequentially excite the electromagnets, and each reaction plate is subjected to at least one of a stable attitude control and a controllably variable attitude control by means of a group of common electromagnets to perform at least one of suspension and propulsion, and each of the electromagnets generates both the suspension force and the propulsion force on the reaction plate by means of the excitation of a common multi-phase alternating current having a single common frequency in each phase, thereby achieving more than one degree of freedom control of the reaction plate.

11. The method of claim 10 wherein said controller controls more than one degree of freedom control of each reaction platen produced by said electromagnet array, including at least said reaction platen attitude with said reaction platen suspended and propelled so as to move along said at least one drive line relative to said electromagnet array from a first predetermined position relative to said chamber to a second different predetermined position relative to said chamber.

12. The method of claim 10 wherein the controller controls more than one degree of freedom control of each reaction platen generated by the electromagnet array, including at least the reaction platen attitude and the reaction platen yaw with the reaction platen suspended and stationary in a predetermined position relative to the chamber along the at least one drive line relative to the electromagnet array.

13. The method of claim 10 wherein the controller controls the propulsive force generated by the electromagnet array across the at least one reaction plate to impart a controlled yaw moment on the at least one reaction plate to cause the at least one reaction plate to yaw about a yaw axis generally normal to the drive plane from a first predetermined orientation relative to the chamber to a second, different predetermined orientation relative to the chamber.

14. The method of claim 10, wherein the controller controls the propulsion force generated by the electromagnet array to impart a torque on the at least one reaction platen to achieve controlled yaw of the at least one reaction platen to achieve at least one of positioning and centering of a wafer payload on the at least one reaction platen relative to a predetermined wafer holding position of the chamber.

15. The method of claim 10, wherein the controller controls the levitation force generated by the electromagnet array so as to impart different levitation forces across the at least one reaction plate, the different levitation forces effecting controlled tilting of the at least one reaction plate relative to the drive plane to control a predetermined reaction plate attitude in at least one of a reaction plate pitch and a reaction plate roll.

16. The method of claim 10, wherein the controller controls the levitation force generated by the electromagnet array to achieve a predetermined biased attitude of the at least one reaction platen relative to the drive plane, which imparts a biased reaction force on a payload supported by the at least one reaction platen mounting surface from the reaction platen payload mounting surface in a direction that counteracts a payload inertia force generated by acceleration of the at least one reaction platen along the drive plane.

17. The method of claim 16, further comprising sensing a position of the at least one reaction platen along the drive plane by means of the position feedback sensor distributed on the chamber and communicatively coupled to the controller, whereby the controller records the sensed position of the at least one reaction platen, wherein the controller is configured to sequentially energize the electromagnets in the electromagnet array corresponding to the sensed position.

18. The method of claim 17, wherein the controller determines an acceleration of the at least one reaction plate along the drive plane from at least a change in the sensed position, and in response to the determined acceleration, controls a bias attitude of the at least one reaction plate to provide a predetermined bias attitude that counteracts the payload inertia force generated by the acceleration of the at least one reaction plate.

19. The method of claim 10, wherein the controller controls energization of the electromagnets in the electromagnet array so as to set the reaction platen posture to bias the at least one reaction platen against an inertial force tending to displace a payload seated on the at least one reaction platen relative to the at least one reaction platen along a seat between the payload and the at least one reaction platen.

20. An electromagnetic conveyor substrate transport device comprising: a chamber configured to maintain a sealed atmosphere therein and having a horizontal reference plane and at least one substrate through opening for transferring a substrate into and out of the chamber through the opening; an electromagnet array connected to the chamber to form a drive plane at a predetermined height relative to the horizontal reference plane, the electromagnet array being arranged such that a series of electromagnets in the electromagnet array defines at least one drive line within the drive plane, the electromagnets in the series of electromagnets being grouped into at least one multi-phase actuator unit, and each of the at least one multi-phase actuator unit being coupled to a multi-phase AC power source; at least one reaction plate made of paramagnetic, diamagnetic or non-magnetic conductive material, the reaction plate being arranged to cooperate with the electromagnet in the at least one multi-phase actuator unit, so that the electromagnet generates a suspension force and a propulsion force on the reaction plate by means of excitation of a multi-phase alternating current, and the suspension force and the propulsion force controllably suspend and propel the reaction plate in a controlled posture along the at least one driving line relative to the driving plane; as well as A controller operably coupled to the electromagnet array and the multiphase AC power source and configured to sequentially excite the electromagnets with the multiphase AC current describing more than one degree of freedom reaction plate control of each reaction plate, each reaction plate being at least one of levitated and propelled with at least one of a stable attitude control and a controllably variable attitude control with the aid of a group of common electromagnets, each of the electromagnets generating both the levitation force and the propulsion force on the reaction plate by excitation with the aid of a common multiphase AC current having a single common frequency per phase, thereby achieving more than one degree of freedom control of the reaction plate.

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