A device and method for detecting semiconductor target materials

Abstract

This invention belongs to the field of target material production, specifically a device and method for inspecting semiconductor targets. Addressing the problems of existing methods using micrometers, vernier calipers, and other inspection instruments, which can only inspect one type at a time, resulting in low efficiency, frequent clamping operations that easily damage the target material, and inconvenience, this invention proposes the following solution: A worktable and a target material are included. A rotating disk supporting the target material is rotatably mounted on the top of the worktable. Four telescopic rods slide along the outer wall of the rotating disk, integrating driving components such as a motor, a first electric push rod, and a second electric push rod, as well as detection elements such as a first contact switch and a second contact switch. This achieves highly efficient and automated inspection of semiconductor targets. Through unified control by a controller, multiple steps such as target positioning, rotation, outer wall inspection, rectangular opening inspection, and through-hole inspection can be automatically completed, greatly improving inspection efficiency and accuracy.

Description

Technical Field

[0001] This invention relates to the field of target material production technology, and in particular to a device and method for detecting semiconductor target materials. Background Technology

[0002] Metal sputtering targets, especially those made of metals or alloys with relatively low melting points and strengths, are prone to creep during sputtering, which affects the sputtering process. These targets need to be bonded to another material with high strength and low creep resistance using easily deformable, low-melting-point metals (solder or brazing filler metal), thus creating composite targets. After fabrication, the holes, slots, and diameters must be inspected.

[0003] Existing testing methods typically employ measuring instruments such as micrometers and vernier calipers, but these can only test one type at a time, resulting in low testing efficiency. Additionally, there are methods using testing equipment, but these still require multiple clamping operations, which can easily damage the target material and are not convenient to operate. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies that use micrometers, vernier calipers, and other testing instruments for detection, which can only detect one type at a time, resulting in low detection efficiency, and the reciprocating clamping can easily damage the target material, making them inconvenient to use. Therefore, this invention proposes a device and method for detecting semiconductor targets.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A semiconductor target material testing device includes a worktable and a target material. A rotating disk for carrying the target material is rotatably mounted on the top of the worktable. Four telescopic rods are slidably mounted on the outer wall of the rotating disk. A positioning rod is fixedly mounted on the top of each telescopic rod. A limiting strip that cooperates with the multiple positioning rods is slidably mounted on the top of the worktable. A first electric push rod is fixedly mounted on the top of the worktable. The output end of the first electric push rod is fixedly connected to the limiting strip and is used to drive the multiple positioning rods to move closer to each other to position and clamp the target material.

[0007] A motor is fixedly installed at the bottom of the workbench, and the output end of the motor is fixedly connected to the rotating disk to drive the target material to rotate.

[0008] A support frame is fixedly mounted on the top of the workbench. A second electric push rod is fixedly mounted on the top of the support frame. The output end of the second electric push rod passes through the bottom of the support frame and is fixedly mounted with a stop cylinder for detecting the outer wall of the target material.

[0009] A connecting frame is fixedly mounted on the output end of the first electric push rod. A first detection head for detecting a rectangular opening is movably mounted on the connecting frame. A first contact switch for detecting the position of the first detection head is fixedly mounted on the top of the connecting frame. The rectangular opening is used to determine whether it is qualified based on the position of the first detection head.

[0010] A lifting rod is movably disposed on the outside of the stop cylinder and is connected to the connecting frame for transmission, used to drive the lifting rod to move up and down. The output end of the lifting rod is movably provided with a second detection head for detecting the through hole. The bottom of the lifting rod is fixedly provided with a second contact switch for detecting the second detection head, used to determine whether the through hole is qualified according to the position of the second detection head.

[0011] The controller is fixedly mounted on the top of the support frame and is connected to the motor, the first electric push rod, the second electric push rod, the first contact switch and the second contact switch via wires.

[0012] In one possible design, the top of the workbench is fixedly provided with multiple guide rails, and the outer wall of the guide rails is slidably fitted with sliding blocks. The multiple sliding blocks are fixedly connected to the limiting strip. The output end of the first electric push rod is fixedly connected to one of the sliding blocks. The connecting frame is fixedly mounted on one of the sliding blocks. Both ends of the limiting strip are provided with extensions. The two extensions are in a figure-eight shape and are used to guide the positioning rod.

[0013] In one possible design, two second guide rods are slidably provided through one side of the connecting frame, and one end of the two second guide rods is fixedly provided with the same fixing strip. The fixing strip is located above the first contact switch. A second spring is sleeved on the outer wall of the second guide rod. The two ends of the second spring are respectively fixedly connected to the fixing strip and the side of the connecting frame that are close to each other. The first detection head is fixedly provided on the other side of the fixing strip.

[0014] In one possible design, the inner wall of the rotating disk is provided with a rotating shaft, the outer wall of the rotating shaft is fixedly fitted with a first gear, one end of the telescopic rod located inside the rotating disk is fixedly fitted with a first rack that meshes with the first gear, for simultaneously driving the four telescopic rods to move relative to each other, and the outer wall of the rotating shaft is fitted with a torsion spring, the two ends of the torsion spring being fixedly connected to the bottom of the first gear and the bottom wall of the rotating disk respectively, to provide the first gear with a reset power.

[0015] In one possible design, the output end of the second electric push rod is rotatably fitted with a rotating frame located at the top of the stop cylinder. The lifting rod is slidably mounted on the top of the rotating frame. A nut ring is rotatably mounted on the top of the rotating frame. The nut ring is threaded onto the outer wall of the lifting rod. A second gear is fixedly mounted on the outer wall of the nut ring. A second rack is slidably mounted on the top of the rotating frame. A snap-fit ​​is provided on the top of the connecting frame. During the downward movement of the rotating frame, the second rack can snap into the connecting frame.

[0016] In one possible design, the snap-fit ​​component includes a top plate fixedly mounted on the top of the connecting frame. A positioning block is slidably mounted through the top of the top plate. Two third guide rods are slidably mounted through the top of the positioning block. The top ends of the third guide rods are fixedly mounted on the bottom of the top plate. A third spring is sleeved on the outer wall of the third guide rod. The two ends of the third spring are fixedly connected to the top of the positioning block and the bottom of the third guide rod, respectively, to provide a reset force for the positioning block. A positioning hole for cooperating with the positioning block is opened at the bottom of the second rack.

[0017] In one possible design, a limiting plate is fixedly provided at one end of the second rack to cooperate with the second gear for limiting the second rack. A fixed seat is fixedly provided at the top of the rotating frame. A fourth guide rod is slidably provided through one side of the fixed seat. One end of the fourth guide rod is fixedly connected to the limiting plate. A fourth spring is sleeved on the outer wall of the fourth guide rod. The two ends of the fourth spring are fixedly connected to one side of the fixed seat and the other end of the outer wall of the fourth guide rod, respectively, to provide reset power for the second rack.

[0018] In one possible design, the top end of the second detection head is slidably disposed inside the lifting rod, and the lifting rod is provided with a fifth spring. The two ends of the fifth spring are respectively fixedly connected to the top wall of the lifting rod and the top of the second detection head to provide reset power for the second detection head.

[0019] In one possible design, a first guide rod is slidably provided through the top of the support frame, and the bottom end of the first guide rod is fixedly connected to the rotating frame to guide the rotating frame.

[0020] A detection method for a semiconductor target detection device includes the following steps:

[0021] S1. First, place the target on the rotating disk, then start the first electric push rod to move the limit bar. During the movement of the limit bar, the four telescopic rods move to clamp the target.

[0022] S2. Then start the second electric push rod to move the stop cylinder downwards and inspect the outer wall of the target material. If the stop cylinder can be completely fitted onto the target material, it means that the diameter of the target material is qualified; otherwise, it is unqualified.

[0023] S3. Restart the first electric push rod to move the lifting rod downward to detect the through hole. If the second contact switch cannot detect the second detection head, the through hole is unqualified; otherwise, it is qualified.

[0024] S4. Simultaneously, the first detection head moves to detect the rectangular opening. If the first contact switch does not detect the fixing strip, the rectangular opening is unqualified; otherwise, it is qualified.

[0025] Beneficial effects: In this invention, the semiconductor target material testing device, through the telescopic rod and positioning rod on the rotating disk, as well as the limiting strip and the first electric push rod on the top of the worktable, can achieve precise positioning and stable clamping of the target material, while not affecting the rotation of the target material driven by the rotating disk. This not only ensures the stability of the target material during the testing process, but also improves the accuracy and reliability of the testing.

[0026] In this invention, a semiconductor target material testing device is used to test the rectangular opening and through hole of the target material through a first testing head and a second testing head, respectively. The design of the stop cylinder can realize all-round testing of the outer wall of the target material. This multi-functional design enables the device to meet multiple testing requirements of the target material and improves the testing efficiency.

[0027] In this invention, the semiconductor target material testing device, through the setting of a first contact switch and a second contact switch, can detect the position of the first detection head and the second detection head in real time, and intelligently determine the qualification of the rectangular opening and the through hole based on the position information. The intelligent judgment and feedback mechanism not only improves the accuracy of detection, but also reduces the degree of manual intervention.

[0028] In this invention, the semiconductor target material testing device achieves the lifting and lowering movement of the lifting rod by setting a rotating frame, a nut ring, a second gear, and a second rack in cooperation. In addition, the design of the snap-fit ​​component allows the second rack to be stably snapped into the connecting frame, ensuring that the lifting rod can accurately perform lifting and lowering operations, enabling the first detection head and the second detection head to move synchronously, improving detection efficiency and reducing usage costs.

[0029] This invention integrates driving components such as a motor, a first electric actuator, and a second electric actuator, as well as detection elements such as a first contact switch and a second contact switch, achieving highly efficient and automated detection of semiconductor targets. Through unified control by the controller, multiple steps, including target positioning, rotation, outer wall detection, rectangular opening detection, and through-hole detection, can be automatically completed, greatly improving detection efficiency and accuracy. Attached Figure Description

[0030] Figure 1 This is a three-dimensional structural schematic diagram of a semiconductor target detection device proposed in this invention;

[0031] Figure 2 This is a schematic diagram of the limiting strip installation structure of a semiconductor target material detection device proposed in this invention;

[0032] Figure 3 This is a schematic diagram of the mounting structure of the stop cylinder of a semiconductor target material detection device proposed in this invention;

[0033] Figure 4 This is a schematic diagram of the installation structure of the telescopic rod and rotating seat of a semiconductor target detection device proposed in this invention;

[0034] Figure 5 This is a schematic diagram of the first detection head mounting structure of a semiconductor target material detection device proposed in this invention;

[0035] Figure 6 This is a schematic diagram of the positioning block mounting structure of a semiconductor target material detection device proposed in this invention;

[0036] Figure 7 This is a schematic diagram of the installation structure of the lifting rod and rotating frame of a semiconductor target material detection device proposed in this invention;

[0037] Figure 8 for Figure 7 Another perspective structural diagram;

[0038] Figure 9 This is a schematic diagram of the lifting rod and the second detection head structure of a semiconductor target detection device proposed in this invention.

[0039] In the diagram: 1. Workbench; 2. Limiting strip; 3. Target material; 4. First electric push rod; 5. Connecting frame; 6. First detection head; 7. Rectangular opening; 8. Through hole; 9. Support frame; 10. Second electric push rod; 11. Stop cylinder; 12. Rotating frame; 13. Lifting rod; 14. Controller; 15. First guide rod; 16. Sliding block; 17. Guide rail; 18. Rotating disk; 19. Telescopic rod; 20. Positioning rod; 21. Extension; 22. Rotating shaft; 23. First gear; 4. Torsion spring; 25. First rack; 26. Fixing bar; 27. Second guide rod; 28. Second spring; 29. ​​First contact switch; 30. Top plate; 31. Positioning block; 32. Third guide rod; 33. Third spring; 34. Nut ring; 35. Second gear; 36. Second rack; 37. Limiting plate; 38. Fixing base; 39. Fourth guide rod; 40. Fourth spring; 41. Positioning hole; 42. Second detection head; 43. Fifth spring; 44. Second contact switch. Detailed Implementation

[0040] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0041] Example 1: Refer to Figure 1 - Figure 9 A semiconductor target material testing device, used in the target material production field, includes a worktable 1 and a target material 3. A rotating disk 18 supporting the target material 3 is rotatably mounted on the top of the worktable 1. Four telescopic rods 19 are slidably mounted on the outer wall of the rotating disk 18, and positioning rods 20 are fixedly mounted on the top of each of the four telescopic rods 19. Furthermore, a limiting strip 2 is slidably mounted on the top of the worktable 1, which can cooperate with multiple positioning rods 20. To drive the limiting strip 2 to slide, thereby causing the multiple positioning rods 20 to move closer together and position and clamp the target material 3, a first electric push rod 4 is fixedly mounted on the top of the worktable 1, and its output end is fixedly connected to the limiting strip 2.

[0042] At the bottom of the workbench 1, a motor is fixedly installed. The output end of the motor is fixedly connected to the rotating disk 18, so that the target material 3 can be driven to rotate.

[0043] A support frame 9 is fixedly installed on the top of the workbench 1, and a second electric push rod 10 is fixedly installed on the top of the support frame 9. The output end of the second electric push rod 10 passes through the bottom of the support frame 9 and is fixedly installed with a stop cylinder 11 for detecting the outer wall of the target material 3.

[0044] To inspect the rectangular opening 7 on the target material 3, a connecting frame 5 is fixedly installed at the output end of the first electric push rod 4. A first detection head 6 is movably installed on the connecting frame 5 for inspecting the rectangular opening 7. A first contact switch 29 is also fixedly installed on the top of the connecting frame 5 to determine whether the rectangular opening 7 is qualified based on the position of the first detection head 6. If the rectangular opening 7 is unqualified, the first detection head 6 cannot be inserted, causing the first detection head 6 to shift.

[0045] A lifting rod 13 is movably mounted on the outside of the stop cylinder 11. This lifting rod 13 is connected to the connecting frame 5 and can move up and down. A second detection head 42 is movably mounted at the output end of the lifting rod 13 for detecting the through hole 8 on the target material 3. A second contact switch 44 is fixedly mounted through the bottom of the lifting rod 13 to determine whether the through hole 8 is qualified based on the position of the second detection head 42. If the through hole 8 is unqualified, the second detection head 42 cannot be inserted and will be displaced.

[0046] In addition, a controller 14 is fixedly installed on the top of the support frame 9. The controller 14 is connected to the motor, the first electric push rod 4, the second electric push rod 10, the first contact switch 29 and the second contact switch 44 through wires to realize the control of the entire detection device. It is also equipped with three alarms, which correspond to the stop cylinder 11, the first detection head 6 and the second detection head 42 respectively, and the sounds they emit are different.

[0047] Multiple guide rails 17 are fixedly installed on the top of the workbench 1. Sliding blocks 16 are slidably fitted onto the outer wall of the guide rails 17, and all sliding blocks 16 are fixedly connected to the limiting strip 2. The output end of the first electric push rod 4 is fixedly connected to one of the sliding blocks 16 to drive the limiting strip 2 to slide. At the same time, the connecting frame 5 is also fixedly installed on one of the sliding blocks 16 to achieve synchronous movement with the limiting strip 2. In order to guide the positioning rod 20, both ends of the limiting strip 2 are provided with V-shaped extensions 21 so that the positioning rod will not loosen when rotating around the rotating disk 18.

[0048] Two second guide rods 27 are slidably mounted through one side of the connecting frame 5. One end of each second guide rod 27 is fixedly mounted with the same fixing strip 26, which is located above the first contact switch 29. A second spring 28 is fitted onto the outer wall of each second guide rod 27. Both ends of the second spring 28 are fixedly connected to the fixing strip 26 and the adjacent side of the connecting frame 5, respectively, to provide reset power. The first detection head 6 is fixedly mounted on the other side of the fixing strip 26.

[0049] A rotating shaft 22 is rotatably mounted on the inner wall of the rotating disk 18, and a first gear 23 is fixedly sleeved on the outer wall of the rotating shaft 22. A first rack 25, meshing with the first gear 23, is fixedly mounted at one end of a telescopic rod 19 located inside the rotating disk 18, so as to simultaneously drive the four telescopic rods 19 to move relative to each other. To provide a reset force for the first gear 23, a torsion spring 24 is also sleeved on the outer wall of the rotating shaft 22. The two ends of the torsion spring 24 are fixedly connected to the bottom of the first gear 23 and the bottom wall of the rotating disk 18, respectively, providing a reset force for the rotating shaft 22.

[0050] A nut ring 34 is rotatably mounted on the top of the rotating frame 12, and this nut ring 34 is threaded onto the outer wall of the lifting rod 13. When the nut ring 34 rotates, it moves up and down along the thread of the lifting rod 13, thereby driving the lifting rod 13 to rise and fall. In order to drive the rotation of the nut ring 34, a second rack 36 is also slidably mounted on the top of the rotating frame 12, and this second rack 36 can mesh with the second gear 35 fixedly mounted on the outer wall of the nut ring 34.

[0051] A snap-fit ​​component is designed at the top of the connecting frame 5 to engage the second rack 36 with the connecting frame 5 during the downward movement of the rotating frame 12 driven by the second electric push rod 10. This snap-fit ​​component includes a top plate 30 fixedly mounted on the top of the connecting frame 5, with a positioning block 31 slidably disposed through the top of the top plate 30. Two third guide rods 32 are also slidably disposed through the top of the positioning block 31, with their top ends fixedly mounted on the bottom of the top plate 30 for guiding the positioning block 31. A third spring 33 is fitted onto the outer wall of the third guide rod 32, with its two ends fixedly connected to the top of the positioning block 31 and the bottom of the third guide rod 32, respectively, providing a reset force for the positioning block 31. When the rotating frame 12 moves downward, the bottom of the second rack 36 will abut against the positioning block 31 and move downward. The second rack 36 has a positioning hole 41 that works with the positioning block 31. During the resetting and moving process of the connecting frame 5, the positioning block 31 can be inserted into the positioning hole 41 under the force of the third spring 33. A positioning hole 41 that works with the positioning block 31 is opened so that the positioning block 31 can be locked in it, thereby achieving the locking.

[0052] Example 2: Reference Figure 1 - Figure 9 An improvement upon Embodiment 1 is made: a rotating frame 12 located on top of the stop cylinder 11 is rotatably fitted onto the output end of the second electric push rod 10. This rotating frame 12 can move up and down with the output end of the second electric push rod 10. A lifting rod 13 is slidably disposed on top of the rotating frame 12 to achieve the lifting function.

[0053] In addition, a limiting plate 37, which works in conjunction with the second gear 35, is fixedly installed at one end of the second rack 36 to limit its movement and prevent excessive movement. A fixed base 38 is also fixedly installed on the top of the rotating frame 12. A fourth guide rod 39 is slidably mounted through one side of the fixed base 38, and one end of the fourth guide rod 39 is fixedly connected to the limiting plate 37. A fourth spring 40 is fitted onto the outer wall of the fourth guide rod 39, and both ends of the fourth spring 40 are fixedly connected to one side of the fixed base 38 and the other end of the outer wall of the fourth guide rod 39, respectively, to provide reset power for the second rack 36.

[0054] The design of the lifting rod 13 has also been optimized. The top end of the second detection head 42 is slidably disposed within the lifting rod 13, allowing it to slide within a certain range. A fifth spring 43 is installed within the lifting rod 13, with its two ends fixedly connected to the top wall of the lifting rod 13 and the top of the second detection head 42, respectively, providing a reset force for the second detection head 42.

[0055] Finally, to guide the rotating frame 12, a first guide rod 15 is slidably installed through the top of the support frame 9, and the bottom end of the first guide rod 15 is fixedly connected to the rotating frame 12. When the rotating frame 12 moves up and down, the first guide rod 15 will slide along the support frame 9, thereby ensuring that the moving direction of the rotating frame 12 is always correct.

[0056] A detection method for a semiconductor target detection device includes the following steps:

[0057] S1. First, place the target material 3 on the rotating disk 18, and then start the first electric push rod 4 to drive the limit bar 2 to move. During the movement of the limit bar 2, it drives the four telescopic rods 19 to move and clamp the target material 3.

[0058] S2. Then start the second electric push rod 10 to drive the stop cylinder 11 to move downward and inspect the outer wall of the target material 3. If the stop cylinder 11 can be completely fitted onto the target material 3, it means that the diameter of the target material 3 is qualified; otherwise, it is unqualified.

[0059] S3. Restart the first electric push rod 4 to drive the lifting rod 13 to move downward to detect the through hole 8. If the second contact switch 44 cannot detect the second detection head 42, the through hole 8 is unqualified; otherwise, it is qualified.

[0060] S4. Simultaneously, the first detection head 6 is moved to detect the rectangular opening 7. If the first contact switch 29 does not detect the fixing strip 26, the rectangular opening 7 is unqualified; otherwise, it is qualified.

[0061] In this application, firstly, the target material 3 is placed on the rotating disk 18. Then, the first electric push rod 4 is extended. During the extension of the first electric push rod 4, it can drive the corresponding sliding block 16 to move. The movement of the sliding block 16 can drive the limit strip 2 to move. The movement of the limit strip 2 can drive the corresponding positioning rod 20 to move towards the rotating disk 18, thereby driving the corresponding telescopic rod 19 to slide into the rotating disk 18. During the sliding of the telescopic rod 19, it can drive the first rack 25 to move. The movement of the first rack 25 can drive the first gear 23 to rotate. At the same time, the rotation of the first gear 23 can drive the other first racks 25 to move. Thus, the target material 3 can be positioned and clamped by multiple telescopic rods 19 and positioning rods 20. During the rotation of the first gear 23, the torsion spring 24 can be compressed. When the first electric push rod 4 retracts... The first gear 23 can be reset and rotated under the force of the torsion spring 24, and drive multiple telescopic rods 19 to reset and move, releasing the clamped target 3. During the movement of the first electric push rod 4, it can drive the connecting frame 5 to move through the corresponding sliding block 16, and can drive the first detection head 6 to approach the target 3. When the first detection head 6 is misaligned with the rectangular opening 7, the first detection head 6 will abut against the outer edge of the target 3, and drive the fixing strip 26 to approach the connecting frame 5, while compressing the second spring 28. Then, the motor at the bottom of the workbench 1 is started to drive the rotating disk 18 to rotate. The rotation of the rotating disk 18 can drive the target 3 to rotate. When one of the rectangular openings 7 corresponds to the first detection head 6, the first detection head 6 can be reset and moved under the force of the second spring 28, and inserted into the corresponding rectangular opening 7 to position the target 3.

[0062] Then, the second electric push rod 10 is activated to move the stop cylinder 11 downwards, inspecting the outer wall of the target material 3. If the stop cylinder 11 can be completely fitted onto the target material 3, the diameter of the target material 3 is acceptable. If the stop cylinder 11 is stuck on the outer wall of the target material 3, the second electric push rod 10 cannot fully extend, and the controller 14 can determine that it is unacceptable. During the extension of the second electric push rod 10, it can move the rotating frame 12 downwards, and move the lifting rod 13 above the through hole 8. During the downward movement of the rotating frame 12, it can move the second rack 36 downwards. During the process, it can abut against the positioning block 31 and drive the positioning block 31 to move downward. The downward movement of the positioning block 31 can drive the third guide rod 32 to move downward and compress the third spring 33. Then, the first electric push rod 4 is activated to retract. During the retraction of the first electric push rod 4, it can be driven by the corresponding sliding block 16. The movement and reset of the sliding block 16 can drive the connecting frame 5 to reset and move. The movement of the connecting frame 5 can drive the positioning block 31 to move. When the positioning block 31 corresponds to the positioning hole 41, the positioning block 31 can be reset upward under the action of the third spring 33 and inserted into the corresponding positioning hole 41.

[0063] When the first electric push rod 4 is activated again, it extends and drives the connecting frame 5 to move so that the first detection head 6 approaches the insertion rectangular opening 7. At this time, the movement of the connecting frame 5 can drive the positioning block 31 to move through the top plate 30. The movement of the positioning block 31 can drive the second rack 36 to move. The movement of the second rack 36 can drive the second gear 35 to rotate. The rotation of the second gear 35 can drive the nut ring 34 to rotate. During the rotation of the nut ring 34, the lifting rod 13 can move downward within the rotating frame 12, thereby driving the second detection head 42 to move downward. When the second contact switch 44 cannot detect the second detection head 42, the second detection head 42 cannot be inserted into the through hole 8. Then, the controller 14 will issue an alarm to determine that the through hole 8 is unqualified.

[0064] Then, the first electric push rod 4 is activated to retract, driving the lifting rod 13 and the first detection head 6 to reset and move. The motor at the bottom of the workbench 1 is activated to drive the target material 3 to rotate, and the position of the through hole 8 is adjusted. The first electric push rod 4 is activated again to perform the test. When the first contact switch 29 fails to detect the fixing strip 26, the controller 14 issues an alarm to determine that the rectangular opening 7 is unqualified, and the test is performed sequentially.

[0065] However, as is well known to those skilled in the art, the working principles and wiring methods of the first electric actuator 4, the second electric actuator 10, the controller 14, the first contact switch 29 and the second contact switch 44 are commonplace and belong to conventional means or common knowledge. They will not be described in detail here. Those skilled in the art can make any selections according to their needs or convenience.

[0066] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A device for detecting semiconductor target materials, characterized in that, The utility model provides a target material positioning device, including workbench (1) and target material (3), the top rotation of workbench (1) is equipped with the rotating disc (18) of bearing target material (3), the outer wall of rotating disc (18) is equipped with four telescopic rods (19) slidingly, the top of telescopic rod (19) is equipped with the locating rod (20) fixedly, the top of workbench (1) is equipped with the limiting strip (2) of using with multiple locating rod (20) slidingly, the top of workbench (1) is equipped with the first electric push rod (4) fixedly, the output of first electric push rod (4) is fixedly connected with limiting strip (2), for driving multiple locating rod (20) close to each other and target material (3) positioning clamping; The bottom of the workbench (1) is fixedly provided with a motor, and the output end of the motor is fixedly connected with the rotating disc (18) for driving the target material (3) to rotate; The support frame (9) is fixedly arranged on the top of the workbench (1), and the top of the support frame (9) is fixedly provided with a second electric push rod (10), the output end of the second electric push rod (10) penetrates through the bottom of the support frame (9) and is fixedly provided with a stop cylinder (11) for detecting the outer wall of the target material (3); The connecting frame (5) is fixedly arranged on the output end of the first electric push rod (4), and a first detection head (6) for detecting the rectangular port (7) is movably arranged on the connecting frame (5), and a first contact switch (29) for detecting the position of the first detection head (6) is fixedly arranged on the top of the connecting frame (5), so as to determine whether the rectangular port (7) is qualified according to the position of the first detection head (6); The lifting rod (13) is movably arranged on the outer side of the stop cylinder (11) and is in transmission connection with the connecting frame (5) for driving the lifting rod (13) to move up and down, and the output end of the lifting rod (13) is movably provided with a second detection head (42) for detecting the through hole (8), and the bottom of the lifting rod (13) penetrates through and is fixedly provided with a second contact switch (44) for detecting the second detection head (42), so as to determine whether the through hole (8) is qualified according to the position of the second detection head (42); The controller (14) is fixedly arranged on the top of the support frame (9), and the controller (14) is connected with the motor, the first electric push rod (4), the second electric push rod (10), the first contact switch (29) and the second contact switch (44) through wires.

2. The apparatus for detecting a semiconductor target according to claim 1, wherein A plurality of guide rails (17) are fixedly arranged on the top of the workbench (1), the outer wall of the guide rail (17) is slidably sleeved with a sliding block (16), a plurality of sliding blocks (16) are fixedly connected with the limiting strip (2), the output end of the first electric push rod (4) is fixedly connected with one of the sliding blocks (16), the connecting frame (5) is fixedly arranged on one of the sliding blocks (16), and both ends of the limiting strip (2) are provided with extension parts (21), the two extension parts (21) are in an eight-character shape, and the extension parts (21) are used for guiding the locating rod (20).

3. The apparatus for detecting a semiconductor target according to claim 1, wherein One side of the connecting frame (5) is provided with two second guide rods (27) penetratingly sliding, one end of the two second guide rods (27) is fixedly provided with a same fixed strip (26), the fixed strip (26) is located above the first contact switch (29), the outer wall of the second guide rod (27) is sleeved with a second spring (28), the two ends of the second spring (28) are fixedly connected with the fixed strip (26) and the side of the connecting frame (5) which is close to each other respectively, and the first detection head (6) is fixedly arranged on the other side of the fixed strip (26).

4. The apparatus for detecting a semiconductor target according to claim 1, wherein The inner wall of the rotating disc (18) is rotatably provided with a rotating shaft (22), the outer wall of the rotating shaft (22) is fixedly sleeved with a first gear (23), one end of the telescopic rod (19) located in the rotating disc (18) is fixedly provided with a first rack (25) engaged with the first gear (23), for simultaneously driving the four telescopic rods (19) to move, the outer wall of the rotating shaft (22) is sleeved with a torsional spring (24), the two ends of the torsional spring (24) are fixedly connected with the bottom of the first gear (23) and the bottom wall of the rotating disc (18) respectively, and the first gear (23) is provided with a reset power.

5. The apparatus for detecting a semiconductor target according to claim 1, wherein The output end of the second electric push rod (10) is rotatably sleeved with a rotating frame (12) located at the top of the stop cylinder (11), the lifting rod (13) penetrates and slides on the top of the rotating frame (12), the top of the rotating frame (12) is rotatably provided with a nut ring (34), the nut ring (34) is threadedly sleeved on the outer wall of the lifting rod (13), the outer wall of the nut ring (34) is fixedly sleeved with a second gear (35), the top of the rotating frame (12) is slidably provided with a second rack (36), and the top of the connecting frame (5) is provided with a clamping piece, the second rack (36) can be clamped with the connecting frame (5) in the process that the rotating frame (12) moves downward.

6. The apparatus for detecting a semiconductor target according to claim 5, wherein The clamping piece comprises a top plate (30) fixedly arranged on the top of the connecting frame (5), a positioning block (31) penetratingly and slidingly arranged on the top of the top plate (30), two third guide rods (32) penetratingly and slidingly arranged on the top of the positioning block (31), the top end of the third guide rod (32) is fixedly arranged on the bottom of the top plate (30), the outer wall of the third guide rod (32) is sleeved with a third spring (33), the two ends of the third spring (33) are fixedly connected with the top of the positioning block (31) and the bottom end of the third guide rod (32) respectively, the bottom of the second rack (36) is provided with a positioning hole (41) used in cooperation with the positioning block (31).

7. The apparatus for detecting a semiconductor target according to claim 5, wherein One end of the second rack (36) is fixedly provided with a limiting plate (37) matched with the second gear (35) for limiting the second rack (36), the top of the rotating frame (12) is fixedly provided with a fixing seat (38), one side of the fixing seat (38) is slidably penetrated by a fourth guide rod (39), one end of the fourth guide rod (39) is fixedly connected with the limiting plate (37), the outer wall of the fourth guide rod (39) is sleeved with a fourth spring (40), and the two ends of the fourth spring (40) are fixedly connected with the one side of the fixing seat (38) and the other end of the fourth guide rod (39) respectively, so that the second rack (36) is provided with reset power.

8. The apparatus for detecting a semiconductor target according to claim 1, wherein The top end of the second detection head (42) is slidably arranged in the lifting rod (13), the lifting rod (13) is provided with a fifth spring (43), and the two ends of the fifth spring (43) are fixedly connected with the top wall of the lifting rod (13) and the top of the second detection head (42) respectively, so that the second detection head (42) is provided with reset power.

9. The apparatus for detecting a semiconductor target according to claim 1, wherein The top of the supporting frame (9) is slidably penetrated by a first guide rod (15), and the bottom end of the first guide rod (15) is fixedly connected with the rotating frame (12) for guiding the rotating frame (12).

10. The method according to any one of claims 1 to 9, wherein The method comprises the following steps: S1, first, the target material (3) is placed on the rotating disc (18), then the first electric push rod (4) is started to drive the limiting strip (2) to move, the limiting strip (2) drives the four telescopic rods (19) to move to clamp the target material (3) in the moving process; S2, then the second electric push rod (10) is started to drive the stop cylinder (11) to move downwards to detect the outer wall of the target material (3), if the stop cylinder (11) can be completely sleeved on the target material (3), it indicates that the diameter of the target material (3) is qualified, otherwise it is unqualified; S3, the first electric push rod (4) is started again to drive the lifting rod (13) to move downwards to detect the through hole (8), when the second contact switch (44) cannot detect the second detection head (42), the through hole (8) is unqualified, otherwise it is qualified; S4, the first detection head (6) is driven to move to detect the rectangular port (7), when the first contact switch (29) cannot detect the fixed strip (26), the rectangular port (7) is unqualified, otherwise it is qualified.

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