System and method for preparing an srp sample

Abstract

The present disclosure relates to a system and method for preparing an SRP sample, the system comprising: a support device for fixedly and horizontally supporting the SRP sample thereon; a grinding device having a grinding application surface, the grinding device being configured to grind the SRP sample by the grinding application surface to form a ground surface thereon; an adjusting device configured to adjust a grinding angle of the grinding application surface with respect to the SRP sample in the horizontal; and a control device configured to control the adjusting device to adjust the grinding angle based on a preset grinding angle so that the grinding device grinds the SRP sample at the preset grinding angle. With the system and method, the accuracy of sample preparation is improved and thus the accuracy of testing is improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor processing and manufacturing technology, and more specifically, to systems and methods for preparing SRP samples. Background Technology

[0002] Spreading Resistance Profile (SRP) can obtain detailed distribution curves of resistivity and carrier concentration of the tested sample from the silicon wafer surface to the substrate with depth. It is often used to determine the resistivity stability of the epitaxial layer of silicon wafers.

[0003] In the preparation of SRP samples, the silicon wafer is usually split into multiple square silicon blocks of uniform size, and the silicon blocks are attached to the angle gauge using paraffin wax. Then, the silicon blocks are ground using a horizontally fixed grinding disc to grind the silicon blocks into a beveled section in the thickness direction for testing.

[0004] However, when using paraffin wax to bond the silicon block to the angle gauge, the paraffin wax must be melted at high temperature before bonding. This makes it easy for the silicon block to tilt relative to the bonding surface during bonding, resulting in a large angle error between the polished surface and the expected polished surface. Consequently, the measured resistivity cannot accurately reflect the actual resistivity of the silicon wafer. Summary of the Invention

[0005] This section provides a general overview of this disclosure, rather than a full disclosure of the entire scope or all features of this disclosure.

[0006] The purpose of this disclosure is to provide a system for preparing SRP samples that can improve the precision of SRP sample preparation and thus improve the accuracy of resistivity testing.

[0007] To achieve the above objectives, according to one aspect of this disclosure, a system for preparing SRP samples is provided, comprising:

[0008] A support device for fixing and horizontally supporting the SRP sample thereon;

[0009] A grinding apparatus having a grinding application surface, the grinding apparatus being used to grind an SRP sample by means of the grinding application surface to form a grinding surface thereon;

[0010] An adjustment device for adjusting the grinding angle of the grinding application surface relative to the horizontal SRP sample; and

[0011] A control device is used to control the adjustment device to adjust the grinding angle based on a preset grinding angle so that the grinding device grinds the SRP sample at the preset grinding angle.

[0012] The system described above for preparing SRP samples may include a detection device for detecting the flatness of the polished surface. A control device communicates with the detection device to control an adjustment device to adjust the polishing angle based on the flatness obtained from the detection device, so that the polishing device polishes the polished surface again at the adjusted polishing angle to improve the flatness of the polished surface.

[0013] In the above-described system for preparing SRP samples, the detection device may include a laser emitter and a sensor. The laser emitter is configured such that the laser emitted by it sweeps across the entire grinding surface at an angle equal to a preset grinding angle relative to the horizontal plane. The sensor communicates with the control device and is configured to sense the optical path formed by the laser that has swept across the grinding surface and obtain a flatness condition based on the deviation angle of the optical path relative to the ideal optical path, wherein the ideal optical path is the optical path formed when the laser is emitted at that angle without obstruction.

[0014] In the system described above for preparing SRP samples, the laser emitter can be configured to emit a laser beam from one side of the grinding surface in the longitudinal direction and / or one side in the transverse direction toward the grinding surface.

[0015] In the system described above for preparing SRP samples, the control device can be configured to feed the grinding application surface intermittently during the grinding process via the adjustment device to perform multiple grindings step by step, and the detection device is configured to detect the flatness of the grinding surface formed by the grinding at the end of each grinding in the multiple grindings, so that the control device controls the adjustment device to adjust the grinding angle accordingly.

[0016] In the system described above for preparing SRP samples, the laser emitter may include a concave focusing mirror, which is used to focus the light source of the laser emitter.

[0017] In the system described above for preparing SRP samples, the laser emitter may include a variable-direction concave mirror, which is used to change the direction of the laser source of the laser emitter so that the laser emitted by the laser emitter can sweep across the entire grinding surface in an oscillating manner.

[0018] In the system described above for preparing SRP samples, the sensing area of ​​the sensor capable of sensing the laser may include an indicator mark, which is arranged to indicate that the SRP sample is ground to a predetermined grinding depth for the preset grinding angle when the laser emitted at a preset grinding angle irradiates the indicator mark.

[0019] In the system described above for preparing SRP samples, the length of the sensing area of ​​the sensor that can sense the laser in the direction parallel to the ideal optical path can be set so that the laser that has swept across the entire polishing surface can be fully sensed by the sensor.

[0020] According to another aspect of this disclosure, a method for preparing SRP samples is provided, the method being performed using a system for preparing SRP samples as described in any of the preceding paragraphs.

[0021] According to this disclosure, by fixing and horizontally supporting the SRP sample and enabling the grinding apparatus to grind the SRP sample at a preset grinding angle, the problem that can occur when grinding the SRP sample by attaching it to an angle gauge with paraffin wax is avoided. This avoids the silicon block tilting relative to the bonding surface, leading to a large angular error between the ground surface and the intended ground surface, resulting in the measured resistivity not accurately reflecting the actual resistivity of the silicon wafer. This improves the precision of sample preparation and thus the accuracy of testing. Furthermore, by detecting the flatness of the ground surface and adjusting the grinding angle accordingly based on the detected flatness, the flatness of the ground surface is improved, further enhancing the precision of sample preparation and thus the accuracy of testing.

[0022] The above-described features and advantages, as well as other features and advantages, of this disclosure will become clearer from the following detailed description of exemplary embodiments of the disclosure in conjunction with the accompanying drawings. Attached Figure Description

[0023] Figure 1 A system for preparing SRP samples according to an embodiment of the present disclosure is illustrated schematically.

[0024] Figure 2 A system for preparing SRP samples according to another embodiment of the present disclosure is illustrated schematically.

[0025] Figure 3 The support platform and the protrusion on it are schematically shown from a top-down perspective.

[0026] Figure 4 The diagram schematically illustrates a laser emitter emitting a laser from the upper side of the grinding surface in the longitudinal direction toward the grinding surface.

[0027] Figure 5 The internal structure of a laser emitter according to an embodiment of the present disclosure is schematically shown.

[0028] Figure 6 A sensor according to an embodiment of the present disclosure is schematically shown.

[0029] Figure 7 A sensor according to another embodiment of the present disclosure is schematically shown. Detailed Implementation

[0030] The present disclosure will now be described in detail with reference to the accompanying drawings and exemplary embodiments. It should be noted that the following detailed description of the present disclosure is for illustrative purposes only and is not intended to limit the scope of the disclosure.

[0031] Reference Figure 1 and Figure 3 According to embodiments of this disclosure, a system for preparing SRP samples is provided. System 1 includes a support device 10, a grinding device 20, an adjustment device 30, and a control device 40.

[0032] The support device 10 is used to fix and horizontally support the SRP sample 2 thereon.

[0033] For example, such as Figure 1 As shown, the support device 10 can be a support platform, which may have a horizontal support plane 101. By placing the SRP sample 2 on the horizontal support plane 101, the SRP sample 2 can be horizontally supported. The support plane 101 may also be provided with a protrusion 101a, such as... Figure 3 As shown, the protrusion 101a is constructed in a rectangular or square shape according to the outer periphery of the SRP sample 2 to securely support the SRP sample 2 on the support plane 101. It is understood that this fixation can be such that the SRP sample 2 is fixed at least in the horizontal direction.

[0034] It is conceivable that other structures could be used for the support device 10 to achieve the fixation and horizontal support of the SRP sample.

[0035] The grinding apparatus 20 has a grinding application surface 200, which is used to grind the SRP sample 2 through the grinding application surface 200 to form a grinding surface 2a thereon (see...). Figure 4 The grinding device 20 can be, for example, a grinding disc, such as... Figure 1 As shown, the grinding application surface 200 is the lower surface of the grinding disc.

[0036] The adjustment device 30 is used to adjust the grinding angle of the grinding application surface 200 relative to the horizontal SRP sample 2.

[0037] like Figure 1As shown, the adjusting device 30 can be a linkage structure movably connected to the grinding device 20. This linkage structure allows the grinding device 20 to move in multiple directions, such as vertical and horizontal, and can adjust the tilt angle of the grinding device 20, thereby adjusting the grinding angle of the grinding application surface 200. It is understood that the grinding angle is the angle of the grinding application surface 200 relative to the horizontal SRP sample 2, that is, the angle of the grinding application surface 200 relative to the horizontal surface of the SRP sample. It is conceivable that the adjusting device 30 may also take other forms.

[0038] The control device 40 is used to control the adjustment device 30 to adjust the grinding angle based on the preset grinding angle so that the grinding device 20 grinds the SRP sample 2 at the preset grinding angle.

[0039] The control device 40 can control the adjustment device 30 to adjust the grinding angle of the grinding application surface 200 of the grinding device 20 relative to the horizontal SRP sample 2 to a preset grinding angle, so that the SRP sample 2 can be ground at the expected angle.

[0040] By fixing and horizontally supporting the SRP sample 2, and enabling the polishing device 20 to polish the SRP sample at a preset polishing angle, the problem of the silicon block tilting relative to the bonding surface, which can occur when polishing the SRP sample by attaching it to an angle gauge with paraffin wax, resulting in a large angular error between the polished surface and the intended polished surface, and thus causing the measured resistivity to not accurately reflect the actual resistivity of the silicon wafer, is avoided. This improves the accuracy of the test. Furthermore, since the polishing angle can be adjusted based on the preset polishing angle using a control device, the use of an angle gauge to set the polishing angle is avoided. Therefore, the problem of poor flatness of the test surface due to gaps between the angle gauge and the groove of the polishing machine, resulting in inaccurate measured resistivity values, is also avoided.

[0041] It is conceivable that, for example Figure 1 As shown, the control device 40 may include a display and input section for inputting and displaying a preset grinding angle. For example, the preset grinding angle can be input in the display and input section, thereby controlling the adjustment device 30 to adjust the grinding application surface 200 of the grinding device 20 to the preset grinding angle, so as to start grinding of the SRP sample.

[0042] According to embodiments of this disclosure, such as Figure 2As shown, system 1 may include a detection device 50 for detecting the flatness of the grinding surface, and a control device 40 communicating with the detection device 50 to control the adjustment device 30 to adjust the grinding angle according to the flatness obtained from the detection device 50, so that the grinding device 20 grinds the grinding surface again at the adjusted grinding angle to improve the flatness of the grinding surface.

[0043] When the grinding device 20 grinds the SRP sample 2, for example, the following situations may occur: due to uneven grinding, a certain part of the grinding surface becomes relatively convex, resulting in poor flatness of the grinding surface; or, due to the error between the actual grinding angle and the preset grinding angle, the flatness of the grinding surface is also poor.

[0044] In this embodiment, the system 1 is equipped with a detection device 50 for detecting the flatness of the grinding surface. Here, flatness refers to the difference in flatness between the actual grinding surface and an ideal, absolutely flat grinding surface achieved at a preset grinding angle. This can include, for example, the outline and position of uneven parts. The control device 40 acquires this flatness information by communicating with the detection device 50, and controls the adjustment device 30 to adjust the grinding angle accordingly based on this information. For example, this information is converted into an electrical signal, which triggers the adjustment device 30 to adjust the grinding angle, so that the grinding device 20 grinds the grinding surface again with the adjusted grinding angle. For instance, when a portion of the grinding surface is slightly protruding, the grinding angle is adjusted accordingly based on the detected protrusion, so that the grinding application surface can just grind away the protruding portion or at least a portion of it, thereby improving the flatness of the grinding surface.

[0045] It is conceivable that the testing device 50 could be a flatness tester that measures the surface height by means of distance measurement to detect flatness, or any other suitable type of flatness testing device capable of measuring the flatness of the ground surface.

[0046] By setting up a detection device 50 and communicating with the control device 40 to control the adjustment device 30 to adjust the grinding angle based on the flatness condition and then grinding the grinding surface again with the adjusted grinding angle, the flatness problem of the grinding surface caused by the above situation can be corrected, thereby improving the flatness of the grinding surface.

[0047] like Figure 2 as well as Figures 4 to 7 As shown, according to an embodiment of the present disclosure, the detection device 50 may include a laser emitter 500 and a sensor 501.

[0048] The laser emitter 500 is configured such that the laser emitted by it sweeps across the entire grinding surface at the same angle as the preset grinding angle relative to the horizontal plane. The sensor 501 communicates with the control device 40 and is configured to sense the light track formed by the laser that has swept across the grinding surface and obtain a flat state based on the deviation angle of the light track relative to the ideal light track, wherein the ideal light track is the light track formed when the laser is emitted at the above angle without obstruction.

[0049] Reference Figure 2 and Figure 4 When the grinding application surface 200 grinds an inclined grinding surface on the SRP sample 2 at a preset grinding angle, the laser emitted by the laser emitter 500 sweeps across the entire grinding surface at the same angle as the preset grinding angle, and the sensor 501 senses the light trail formed by the laser that has swept across the grinding surface. In this case, if there are uneven parts on the grinding surface, such as protrusions, the protrusions will block the laser in the corresponding part when the laser sweeps across the grinding surface, preventing it from passing through. However, the flat parts and the top of the protrusions will allow the laser to pass through because there is no obstruction. Therefore, the light trail sensed by the sensor 501, especially at the lower edge of the light trail, will clearly show the outline of the protrusion.

[0050] By comparing the light track exhibiting a raised profile with the ideal light track, the deviation angle can be obtained, and thus the flatness based on the deviation angle can be obtained. The ideal light track is the light track formed when the laser is emitted at the aforementioned angle without obstruction. It can be understood that, due to the lack of obstruction, the laser will pass entirely through the ideal polished surface, thus forming a straight line, for example, as... Figure 2 As shown, the ideal light trail would be a horizontal line. In this case, the deviation angle is the angle by which the raised profile deviates from the horizontal line.

[0051] Based on the deviation angle, the control device 40 can control the adjustment device 30 to adjust the grinding angle accordingly, so that the grinding device 20 can grind away the deviation angle, i.e. grind away the protrusion, by grinding the grinding surface again with the adjusted grinding angle, thereby improving the flatness of the grinding surface.

[0052] like Figure 2 As shown, the laser emitter 500 can rotate in a plane perpendicular to the horizontal plane to achieve the desired emission angle.

[0053] It is understandable that "laser sweeping across the entire grinding surface" means that the emitted laser covers the entire area of ​​the grinding surface. For example, it can be that a laser beam sweeps from one side of the grinding surface to the opposite side to achieve coverage, or it can be that a laser beam of equal length to one side of the grinding surface directly passes through the grinding surface to achieve coverage.

[0054] The aforementioned detection device 50 has a simple structure and can accurately reflect the actual flatness of the grinding surface, which helps the grinding device 20 to accurately improve the flatness of the grinding surface.

[0055] According to embodiments of this disclosure, such as Figure 2 and Figure 4 As shown, the laser emitter 500 can be configured to emit a laser from the upper side of the grinding surface 2a in the longitudinal direction toward the grinding surface 2a.

[0056] The laser emitted from the upper side of the grinding surface 2a in the longitudinal direction can reflect the flatness of the grinding surface 2a in the longitudinal direction. Therefore, the grinding application surface 200 can adjust the angle deviation in the longitudinal direction so as to ultimately eliminate or at least reduce the unevenness of the grinding surface 2a in the longitudinal direction through grinding.

[0057] It is conceivable that the laser emitter 500 can also be configured to emit a laser from the lower side of the grinding surface 2a in the longitudinal direction toward the grinding surface 2a.

[0058] Furthermore, it is conceivable that the laser emitter 500 can also be configured to emit a laser from one side of the grinding surface 2a in the transverse direction toward the grinding surface 2a. For example, Figure 4 The left or right side of the grinding surface 2a shown in the figure.

[0059] According to an embodiment of the present disclosure, the control device 40 may be configured such that the grinding application surface 200 is fed intermittently by the adjustment device 30 during the grinding process to perform multiple grindings gradually, and the detection device 50 is configured to detect the flatness of the grinding surface formed by the grinding at the end of each grinding in the multiple grindings, so that the control device 40 controls the adjustment device 30 to adjust the grinding angle accordingly.

[0060] Intermittent grinding of the grinding application surface 200 gradually forms multiple grinding surfaces on the SRP sample before reaching the final expected grinding depth, allowing the detection device 50 to check the current grinding status in real time by detecting the flatness of these grinding surfaces. Figure 2 As shown, the laser emitter 500 can move a corresponding distance in the vertical direction according to the grinding depth of each grinding, so that the laser emitted by the laser emitter 500 can always sweep across the grinding surface formed by the grinding at a preset grinding angle, so as to accurately reflect the flatness of the grinding surface formed by the grinding.

[0061] If the flatness of the grinding surface formed by the grinding has been detected, as mentioned before, the control device 40 will control the adjustment device 30 to adjust the grinding angle of the grinding application surface 200 of the grinding device 20 according to the flatness obtained from the detection device 50, so that the grinding device 20 can continue to grind the grinding surface at the adjusted grinding angle.

[0062] By performing intermittent, gradual, and multiple grinding operations and checking the flatness of the corresponding grinding surface at each interval, the accuracy of the grinding in terms of flatness can be adjusted in real time before reaching the final expected grinding depth. This can improve the flatness of the grinding surface when the expected grinding depth is finally reached, and also reduce the risk that it may be difficult to adjust the flatness of the grinding surface well when grinding to the expected grinding depth in one go.

[0063] According to embodiments of this disclosure, such as Figure 5 As shown, the laser emitter 500 may include a concave focusing mirror 500a, which is used to focus the light source of the laser emitter.

[0064] By using a concave focusing mirror 500a to focus the light source, the light source will obtain better directionality and light intensity, thereby making the direction of the laser emitted by the laser emitter 500 more consistent and the brightness higher. This makes the light track formed by the laser more accurate and clear, which is conducive to accurately determining the flatness of the grinding surface, such as the deviation angle, so as to more accurately adjust the grinding angle to better improve the flatness of the grinding surface.

[0065] Reference Figure 5 The laser emitter 500 may include three concave focusing mirrors 500a. These three concave focusing mirrors 500a are arranged such that each pair of adjacent concave focusing mirrors is arranged in a opposed and staggered manner, allowing the light source to be reflected and converged sequentially on these three concave focusing mirrors 500a, thereby ultimately enhancing the focusing effect. For example, Figure 5 The diagram shows two concave condenser mirrors arranged on the side of the laser emitter 500 opposite the light source inlet side, and one concave condenser mirror arranged on the light source inlet side. In this manner, when light from the light source inlet side is directed towards the outermost of the two concave condenser mirrors on the aforementioned side, it is reflected by that mirror to the concave condenser mirror on the light source inlet side, and then reflected by that mirror to the other of the two concave condenser mirrors on the aforementioned side, and then reflected by that other mirror. However, it is understood that the number of concave condenser mirrors is not limited. The laser emitter 500 may include any other suitable number of concave condenser mirrors, or, for example, in conjunction with... Figure 5 In an arrangement similar to that shown, the laser emitter 500 may include any other suitable odd number of concave focusing mirrors.

[0066] According to embodiments of this disclosure, such as Figure 5 As shown, the laser emitter 500 may include a variable-direction concave mirror 500b, which is used to change the direction of the light source of the laser emitter 500 so that the laser emitted by the laser emitter 500 can sweep across the entire grinding surface 2a in an oscillating manner.

[0067] Changing the direction of the light source by using the variable-direction concave mirror 500b can change the direction of the light source in a plane with a preset grinding angle to the horizontal plane, so as to realize the oscillating movement of the laser from one side of the grinding surface to the opposite side.

[0068] It is conceivable that changing the direction of the light source using the variable-direction concave mirror 500b could also change the direction of the light source in a plane perpendicular to the horizontal plane, allowing the laser to strike the grinding surface at different angles relative to the horizontal plane. This would achieve adjustment of the angle of the laser-sweeped surface relative to the horizontal plane, i.e., realize the rotational movement of the laser. Of course, it is also conceivable that the variable-direction concave mirror 500b could be used to change other directions of the light source.

[0069] like Figure 5 As shown, for example, the variable-direction concave mirror 500b can change the direction of the light source incident on it by moving the concave surface of the mirror portion via a rotating member located at its bottom and connected to the housing of the laser emitter, thereby changing the direction of the laser emitted by the laser emitter. For example, to achieve the aforementioned oscillating or rotating movement of the emitted laser, the concave surface can be rotated in the corresponding plane. It is understood that any other suitable structure for moving the concave surface of the variable-direction concave mirror can also be conceived.

[0070] In this way, the oscillation and rotation of the laser can be achieved solely through a variable-direction concave mirror, thereby enabling the laser to cover the grinding surface and adjust the irradiation angle without the need for multiple laser emitters or for the laser emitters to oscillate and rotate. This simplifies the related structure of the laser emitter, thereby reducing costs and improving the flexibility and agility of controlling directional changes.

[0071] Condensing mirrors and variable-direction condensing mirrors can be placed inside the housing of the laser emitter, such as... Figure 5 As shown in the diagram. However, it is conceivable that the focusing concave mirror and the variable-direction concave mirror could also be placed outside the housing of the laser emitter, as long as the functions of the focusing concave mirror and the variable-direction concave mirror can be realized respectively.

[0072] According to embodiments of this disclosure, such as Figure 6As shown, the sensing area of ​​the sensor 501 that can sense the laser may include an indicator mark 501a, which is arranged to indicate that the SRP sample 2 is ground to a predetermined grinding depth for the preset grinding angle when the laser emitted at a preset grinding angle irradiates the indicator mark.

[0073] In this way, it is possible to accurately check and determine whether the SRP sample has been ground to the corresponding predetermined grinding depth for a preset grinding angle. Especially in the case of intermittent grinding, as the grinding application surface 200 gradually grinds the SRP sample 2, the grinding depth gradually increases, and the grinding process can be monitored in real time using the indicator mark 501a. For example, during the process of gradually approaching the predetermined grinding depth through intermittent grinding, once the indicator mark 501a is detected being illuminated by a laser emitted at the preset grinding angle, it indicates that the SRP sample 2 has been ground to the predetermined grinding depth for the preset grinding angle, and the grinding operation can be stopped. In this way, it is possible to simply and quickly determine whether the predetermined grinding depth has been reached.

[0074] It is conceivable that the indicator mark 501a could be a photosensitive element in the sensor 501 capable of sensing laser irradiation. However, it is also conceivable that the indicator mark 501a could be a visible solid line disposed on the outer surface of the sensor 501.

[0075] The indicator mark 501a can be a line or a relatively wider area. For example, as shown... Figure 6 As shown, the indicator mark 501a can be the area defined between two adjacent lines, or, as... Figure 7 As shown, indicator mark 501a can be a single line.

[0076] It is also conceivable that there can be multiple indicator marks 501a to correspond to different predetermined grinding depths for different preset grinding angles.

[0077] According to embodiments of this disclosure, such as Figure 7 As shown, the length of the sensing area 501b of the sensor 501 that can sense the laser in the direction parallel to the direction of the ideal optical path can be set so that the laser that has swept across the entire grinding surface can be fully sensed by the sensor 501.

[0078] Only when the entire laser beam sweeping across the grinding surface is detected by the sensing area of ​​sensor 501 can the detected light track be considered a complete light track, fully reflecting the flatness of the entire grinding surface, rather than just a portion of it. This facilitates comprehensive detection of the actual flatness of the grinding surface, avoiding situations where unevenness in a certain area of ​​the grinding surface goes undetected, thus improving detection accuracy.

[0079] It is also conceivable that the sensing area of ​​sensor 501 capable of sensing the laser can be set to be continuous in the direction perpendicular to the ideal optical path, such as... Figure 7 As shown in the diagram, the continuous sensing area allows for the detection of the flatness of the polished surface at any point in time during the polishing process, and at any depth of polishing, through laser emission and sensing.

[0080] It is conceivable that, for example Figure 6 As shown, the sensing area can also be configured as multiple separate regions in a direction perpendicular to the ideal optical path, and each separate region can be circular or other shapes, such as square. In this case, laser sensing can be performed only for multiple specific preset grinding angles.

[0081] According to the embodiments of this disclosure, the initiation of SRP sample grinding can also be carried out in the following manner: when no SRP sample is placed, a preset grinding angle is input in the display and input section of the control device 40. Through communication between the control device 40 and the laser emitter 500 of the detection device 50, the laser emitter 500 automatically adjusts to emit laser at an angle relative to the horizontal plane that is the same as the preset grinding angle. When the sensor 501 senses the laser, the control device 40 obtains the relevant angle information and triggers the adjustment device 30 to adjust the grinding application surface 200 of the grinding device 20 to the preset grinding angle.

[0082] According to another aspect of this disclosure, a method for preparing an SRP sample is also provided, the method being performed using a system for preparing an SRP sample according to an embodiment of this disclosure.

[0083] This method may include, for example, the following steps:

[0084] The SRP sample is fixedly and horizontally supported on it by means of a support device;

[0085] The control device controls the adjustment device to adjust the grinding angle of the grinding application surface of the grinding device relative to the horizontal SRP sample to the preset grinding angle based on the preset grinding angle.

[0086] The SRP sample is ground using a grinding device at a preset grinding angle.

[0087] The method may also include, for example, the following steps:

[0088] The flatness of the ground surface is detected using a detection device;

[0089] The control device obtains a flat surface and controls the adjustment device accordingly to adjust the grinding angle.

[0090] The surface is then ground again using a grinding device at an adjusted grinding angle, thereby improving the flatness of the surface.

[0091] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A system for preparing SRP samples, characterized in that, include: A support device for fixing and horizontally supporting the SRP sample thereon; A grinding apparatus having a grinding application surface, the grinding apparatus being used to grind the SRP sample through the grinding application surface to form a grinding surface thereon; An adjustment device for adjusting the grinding angle of the grinding application surface relative to the horizontal SRP sample; as well as A control device is used to control the adjustment device to adjust the grinding angle based on a preset grinding angle, so that the grinding device grinds the SRP sample at the preset grinding angle. The system further includes a detection device for detecting the flatness of the polished surface, and the control device communicates with the detection device to control the adjustment device to adjust the polishing angle based on the flatness obtained from the detection device, so that the polishing device polishes the polished surface again at the adjusted polishing angle to improve the flatness of the polished surface.

2. The system for preparing SRP samples according to claim 1, characterized in that, The detection device includes a laser emitter and a sensor. The laser emitter is configured such that the emitted laser sweeps across the entire grinding surface at an angle equal to the preset grinding angle relative to the horizontal plane. The sensor communicates with the control device and is configured to sense the light track formed by the laser that has swept across the grinding surface and obtain the flatness based on the deviation angle of the light track relative to an ideal light track, wherein the ideal light track is the light track formed when the laser is emitted at the angle without obstruction.

3. The system for preparing SRP samples according to claim 2, characterized in that, The laser emitter is configured to emit the laser from one side of the grinding surface in the longitudinal direction and / or one side in the transverse direction toward the grinding surface.

4. The system for preparing SRP samples according to claim 2 or 3, characterized in that, The control device is configured such that the grinding application surface is fed intermittently by the adjustment device during the grinding process to perform multiple grinding operations step by step, and the detection device is configured to detect the flatness of the grinding surface formed by the grinding operation at the end of each grinding operation, so that the control device controls the adjustment device to adjust the grinding angle accordingly.

5. The system for preparing SRP samples according to claim 2 or 3, characterized in that, The laser emitter includes a concave focusing mirror, which is used to focus the light source of the laser emitter.

6. The system for preparing SRP samples according to claim 2 or 3, characterized in that, The laser emitter includes a variable-direction concave mirror, which is used to change the direction of the light source of the laser emitter so that the laser emitted by the laser emitter can sweep across the entire grinding surface in an oscillating manner.

7. The system for preparing SRP samples according to claim 4, characterized in that, The sensing area of ​​the sensor capable of sensing the laser includes an indicator mark, which is arranged to indicate that the SRP sample is ground to a predetermined grinding depth for the preset grinding angle when the laser emitted at the preset grinding angle irradiates the indicator mark.

8. The system for preparing SRP samples according to claim 2 or 3, characterized in that, The length of the sensing area of ​​the sensor capable of sensing the laser in the direction parallel to the direction of the ideal optical path is set such that the laser that has swept across the entire grinding surface can be fully sensed by the sensor.

9. A method for preparing SRP samples, characterized in that, The method is performed using the system for preparing SRP samples according to any one of claims 1 to 8.

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