Detection system and detection method of electronic device

Abstract

A detection system of an electronic device includes an optical detection module and a control module, and the optical detection module includes a first light source, a second light source and an image capturing assembly. The first light source provides a first light beam to irradiate an object to be measured. The second light source provides a second light beam to irradiate the to-be-measured object. The image capturing assembly is coupled with the first light source and the second light source and is used for shooting the object to be detected. The wavelength of the first light beam is different from that of the second light beam, and the wavelength of one of the first light beam and the second light beam is between 300 nanometers and 3000 nanometers. The control module is coupled with the optical detection module and is used for controlling the first light source, the second light source and the image acquisition assembly and receiving and analyzing the image of the object to be detected acquired by the image acquisition assembly so as to judge whether the object to be detected has defects or not. The invention also provides a detection method of the electronic device.

Description

Technical Field

[0001] The present invention relates to a detection system and a detection method for an electronic device, and in particular to a detection system and a detection method for improving defect detection rate. Background Art

[0002] Electronic devices such as tablets, laptops, smartphones, monitors and TVs have become an indispensable necessity in modern society. With the booming development of such portable electronic products, consumers have high expectations for the quality, functionality or price of these products.

[0003] On the other hand, packaging technology can improve the integration density of electronic components (e.g., transistors, diodes, resistors, capacitors, etc.) in a given area, and has been widely used in the production and manufacturing of electronic devices in recent years. With the evolution of high-end packaging technology and the development of polymer material technology, the defects of some materials can no longer be effectively detected by visible light detection. For example, when these materials are located at the bottom of the structure, visible light cannot penetrate, or when these materials are located on the surface of the structure, the high reflectivity or low transmittance characteristics also make visible light impossible to detect. However, if the optical non-destructive inspection system cannot be used for quality management in real time during the manufacturing process of electronic devices, it will cause a large loss of yield and production capacity.

[0004] As mentioned above, developing an inspection system and an inspection method for electronic devices that can improve the defect detection rate is still one of the research topics that the industry is committed to. Summary of the invention

[0005] According to some embodiments of the present invention, a detection system for an electronic device is provided, comprising an optical detection module and a control module, wherein the optical detection module comprises a first light source, a second light source, and an image capture component. The first light source provides a first light beam to irradiate the object to be tested. The second light source provides a second light beam to irradiate the object to be tested. The image capture component is coupled to the first light source and the second light source, and is used to photograph the object to be tested. The wavelength of the first light beam is different from the wavelength of the second light beam, and the wavelength of one of the first light beam and the second light beam is between 300 nanometers and 3000 nanometers. The control module is coupled to the optical detection module, and is used to control the first light source, the second light source, and the image capture component, and receives and analyzes the image of the object to be tested obtained from the image capture component to determine whether there is a defect in the object to be tested.

[0006] According to some embodiments of the present invention, there is also provided a detection method for an electronic device, comprising providing an object to be tested and using a detection system to detect the object to be tested. The detection system comprises an optical detection module and a control module coupled to the optical detection module, the optical detection module comprises a first light source, a second light source, and an image capture component coupled to the first light source and the second light source, and the control module receives and analyzes the image of the object to be tested obtained from the image capture component. In addition, the detection method for an electronic device comprises: providing a first light beam to irradiate the object to be tested by a first light source; providing a second light beam to irradiate the object to be tested by a second light source, the wavelength of the first light beam is different from the wavelength of the second light beam, and the wavelength of one of the first light beam and the second light beam is between 300 nanometers and 3000 nanometers; photographing the object to be tested by the image capture component; and determining whether the object to be tested has defects by the control module.

[0007] In order to make the features and advantages of the present invention more obvious and easy to understand, some embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 A block diagram showing a detection system for an electronic device according to some embodiments of the present invention;

[0009] Figure 2A Shows a structural side view of an optical detection module according to some embodiments of the present invention;

[0010] Figure 2B Shows a structural side view of an optical detection module according to some embodiments of the present invention;

[0011] Figure 2C A bottom view showing the structure of a second light source of an optical detection module according to some embodiments of the present invention;

[0012] Figure 3 A conceptual schematic diagram showing the image acquisition component performing multi-wavelength imaging in a single scan according to some embodiments of the present invention.

[0013] Reference numerals:

[0014] 10: Detection system for electronic devices

[0015] 100: Optical detection module

[0016] 102: Carrier substrate

[0017] 110: First Light Source

[0018] 120: Second light source

[0019] 120b: Base

[0020] 120e: Light emitting components

[0021] 120M: Bottom

[0022] 120o: Opening

[0023] 120T: Top

[0024] 130: Image Capture Component

[0025] 140: Optical lens assembly

[0026] 140s:Spectral Components

[0027] 140p: Optical Path

[0028] 150: Filter component

[0029] 200: Control module

[0030] 210: Image capture component control unit

[0031] 220: Data processing unit

[0032] CM1: First Photographic Installation

[0033] CM2: Second Photographic Device

[0034] G1: Light-emitting components

[0035] G2: Light-emitting components

[0036] L1: First beam

[0037] L2: Second beam

[0038] R1: First reflected beam

[0039] R2: Second reflected beam

[0040] SP: Object to be tested DETAILED DESCRIPTION

[0041] The following is a detailed description of the detection system and detection method of the electronic device according to the embodiment of the present invention. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present invention. The specific components and arrangements described below are only for simple and clear description of some embodiments of the present invention. Of course, these are only used as examples and are not limitations of the present invention. In addition, similar and / or corresponding numbers may be used in different embodiments to indicate similar and / or corresponding components to clearly describe the present invention. However, the use of these similar and / or corresponding numbers is only for the purpose of simply and clearly describing some embodiments of the present invention, and does not represent any correlation between the different embodiments and / or structures discussed.

[0042] It should be understood that in the embodiments, relative terms such as "lower" or "bottom" or "upper" or "top" may be used to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described on the "lower" side will become the component on the "upper" side. The embodiments of the present invention can be used in conjunction with the attached drawings. Figure 1 It is also understood that the drawings of the present invention are also considered as part of the invention description. It should be understood that the drawings of the present invention are not drawn according to scale, and in fact, the size of the components may be arbitrarily enlarged or reduced to clearly show the features of the present invention.

[0043] Furthermore, when a first material layer is mentioned as being located on or above a second material layer, it may include a situation where the first material layer is in direct contact with the second material layer or the first material layer and the second material layer may not be in direct contact, that is, there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is directly located on the second material layer, it means that the first material layer and the second material layer are in direct contact.

[0044] In addition, it should be understood that the ordinal numbers used in the specification and claims, such as "first", "second", etc., to modify components, do not imply or represent any previous ordinal numbers of the (or multiple) components, nor do they represent the order of one component and another component, or the order of the manufacturing method. The use of multiple ordinal numbers is only used to make a component with a certain name clearly distinguishable from another component with the same name. The claims and the specification may not use the same words, for example, the first component in the specification may be the second component in the claims.

[0045] In some embodiments of the present invention, terms such as "connection" and "interconnection" related to bonding and connection, unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, wherein another structure is disposed between the two structures. Such terms related to bonding and connection may also include situations where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "coupled" include any direct and indirect electrical connection means.

[0046] In the text, the terms "about", "substantially", and "approximately" generally mean within 10%, or within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The term "range between a first value and a second value" means that the range includes the first value, the second value, and other values ​​therebetween. Furthermore, any two values ​​or directions used for comparison may have a certain error. If the first value is equal to the second value, it implies that there may be an error of about 10% between the first value and the second value; if the first direction is perpendicular to the second direction, the angle between the first direction and the second direction may be between 80 degrees and 100 degrees; if the first direction is parallel to the second direction, the angle between the first direction and the second direction may be between 0 degrees and 10 degrees.

[0047] According to embodiments of the present invention, a scanning electron microscope (SEM), an optical microscope (OM), an α-step, an ellipsometer, or other suitable methods may be used to measure the width, thickness, or height of each component, and the spacing or distance between components. Specifically, according to some embodiments, a scanning electron microscope may be used to obtain a cross-sectional structural image of a component to be measured, and the width, thickness, or height of each component, and the spacing or distance between components may be measured.

[0048] It should be understood that the following embodiments can replace, reorganize, and combine the features of several different embodiments to complete other embodiments without departing from the spirit of the present invention. The features of each embodiment can be combined and used in any combination as long as they do not violate the spirit of the invention or conflict with each other.

[0049] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meanings as commonly understood by those skilled in the art to which the present invention belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present invention, and should not be interpreted in an idealized or overly formal manner unless specifically defined in the embodiments of the present invention.

[0050] According to an embodiment of the present invention, a detection system and a detection method for an electronic device are provided, including an automatic detection method using multiple wavelengths, multiple light sources and a specific image capture component, so that the detection light source can penetrate the polymer material in the structure, thereby improving the ability to judge defects. The detection system and method provided by the embodiment of the present invention can perform real-time quality management in a non-destructive detection manner during the manufacturing process of the electronic device, thereby improving the defect detection rate, and further improving the process yield and production capacity of the electronic device.

[0051] According to an embodiment of the present invention, the electronic device may include a power module, a semiconductor packaging device, a display device, a light-emitting device, a backlight device, an antenna device, a touch device, a sensing device, a wearable device, a vehicle device, a battery device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The antenna device may be a liquid crystal antenna device or a non-liquid crystal antenna device. The sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. Furthermore, the electronic device may, for example, include liquid crystal, quantum dots (QD), fluorescence, phosphorescence, other suitable materials or a combination of the foregoing. The electronic device may include electronic components, and the electronic components may include passive components and active components, such as capacitors, resistors, inductors, diodes, transistors, etc. The diode may include a light-emitting diode or a photodiode. The light emitting diode may include, for example, an organic light emitting diode (OLED), a sub-millimeter light emitting diode (mini LED), a micro LED, or a quantum dot light emitting diode (quantum dot LED), but is not limited thereto. According to some embodiments, the electronic device may include a panel and / or a backlight module, and the panel may include, for example, a liquid crystal panel or other self-luminous panels, but is not limited thereto. The splicing device may be, for example, a display splicing device or an antenna splicing device, but is not limited thereto. It should be understood that the electronic device may be any arrangement or combination of the foregoing, but is not limited thereto.

[0052] According to an embodiment of the present invention, the provided detection system and detection method can be applied to any stage in the manufacturing process of an electronic device. For example, it can be applied to a wafer-level package (WLP) process or a panel-level package (PLP) process, or any process that requires real-time product detection, but is not limited thereto.

[0053] Please refer to Figure 1 , Figure 1 A schematic diagram of the module structure of a detection system 10 for an electronic device according to some embodiments of the present invention is shown. Figure 1 As shown, the detection system 10 of the electronic device includes an optical detection module 100 and a control module 200, and the control module 200 is coupled to the optical detection module 100. According to some embodiments, the control module 200 may further include an image capture component control unit 210 and a data processing unit 220, and the data processing unit 220 is coupled to the image capture component control unit 210.

[0054] First, the optical detection module 100 is described. Figure 2A as well as Figure 2B , Figure 2A A structural side view of an optical detection module 100 according to some embodiments of the present invention is shown. Figure 2B Another structural side view of the optical detection module 100 according to some embodiments of the present invention is shown. It should be understood that for the sake of clarity, some components of the optical detection module 100 may be omitted in the drawings, and only some components are schematically shown. According to some embodiments, additional features may be added to the optical detection module 100 described below. According to other embodiments, some features of the optical detection module 100 described below may be replaced or omitted.

[0055] like Figure 2A as well as Figure 2B As shown, the optical inspection module 100 may include a first light source 110, a second light source 120, an image capture component 130, and an optical lens component 140. According to some embodiments, the first light source 110 may be disposed on the side wall of the optical lens group 140, the second light source 120 may be disposed at the bottom of the optical lens group 140, and the image capture component 130 may be disposed on the top of the optical lens group 140. According to some embodiments, the optical inspection module 100 may further include a carrier substrate 102, and the object to be detected SP may be disposed on the carrier substrate 102. According to some embodiments, the carrier substrate 102 may be adjusted in angle or rotated in the XY plane, the XZ plane, or the YZ plane, so that there may be more detection angles to choose from between the light source and the object to be detected SP, thereby obtaining more precise detection results.

[0056] The first light source 110 can provide a first light beam L1 to illuminate the object SP, the second light source 120 can provide a second light beam L2 to illuminate the object SP, and the image capture component 130 can be coupled to the first light source 110 and the second light source 120 to photograph the object SP.

[0057] Furthermore, the wavelength of the first light beam L1 provided by the first light source 110 is different from the wavelength of the second light beam L2 provided by the second light source 120, and the wavelength of one of the first light beam L1 and the second light beam L2 may be between 300 nanometers and 3000 nanometers. In particular, the optical inspection module 100 may enhance the diversity of the inspection light source by using multiple light sources (e.g., at least two light sources, the first light source 110 and the second light source 120) and the multiple wavelength ranges provided by them, thereby being applicable to the inspection of more types of materials and enhancing the ability to judge defects.

[0058] Specifically, according to some embodiments, the wavelength of the first light beam L1 provided by the first light source 110 may be between 300 nanometers and 3000 nanometers (i.e., 300 nm ≤ wavelength of the first light beam L1 ≤ 3000 nm), for example, between 300 nanometers and 700 nanometers, or between 700 nanometers and 3000 nanometers, or between 700 nanometers and 1700 nanometers. According to some embodiments, the wavelength of the second light beam L2 provided by the second light source 120 may be between 300 nanometers and 3000 nanometers (i.e., 300 nm ≤ wavelength of the second light beam L2 ≤ 3000 nm), for example, between 300 nanometers and 700 nanometers, or between 700 nanometers and 3000 nanometers, or between 700 nanometers and 1700 nanometers. In other words, the first light beam L1 provided by the first light source 110 may be visible light or infrared light (e.g., near infrared light), and the second light beam L2 provided by the second light source 120 may also be visible light or infrared light (e.g., near infrared light).

[0059] According to some embodiments, the wavelength of one of the first light beam L1 and the second light beam L2 may be between 300 nanometers and 3000 nanometers, and the wavelength of the other of the first light beam L1 and the second light beam L2 may be between 300 nanometers and 700 nanometers, that is, the first light source 110 and the second light source 120 may be adjusted so that one of them provides visible light and the other provides infrared light, but it is not limited thereto. According to other embodiments, the wavelengths of the first light beam L1 and the second light beam L2 may both be between 300 nanometers and 3000 nanometers, that is, the first light beam L1 and the second light beam L2 may both be infrared light. According to other embodiments, the wavelengths of the first light beam L1 and the second light beam L2 may both be between 300 nanometers and 700 nanometers, that is, the first light beam L1 and the second light beam L2 may both be visible light.

[0060] In addition, according to some embodiments, the first light source 110 may provide a coaxial light source, and the second light source 120 may provide an annular dark field light source. In particular, the optical inspection module 100 may further enhance the diversity of the inspection light source by utilizing the characteristics of different types of light sources (e.g., coaxial light and dark field light), thereby being applicable to the inspection of more types of materials and enhancing the ability to judge defects.

[0061] According to some embodiments, the optical lens assembly 140 may have an optical path 140p, and the first light source 110 may provide a first light beam L1 via the optical path 140p. In addition, according to some embodiments, the first light beam L1 generates a first reflected light beam R1 after irradiating the object SP to be tested, and the second light beam L2 generates a second reflected light beam R2 after irradiating the object SP to be tested, and the first reflected light beam R1 and the second reflected light beam R2 may also be transmitted to the image capture assembly 130 via the optical path 140p. According to some embodiments, the optical lens assembly 140 may further include a beam splitter assembly 140s, and the beam splitter assembly 140s is disposed in the optical path 140p. The beam splitter assembly 140s may split the incident light into two separate light beams at a specific ratio.

[0062] Specifically, if Figure 2B As shown, according to some embodiments, the image capture component 130 may include a first camera CM1 and a second camera CM2, and the light splitting component 140s of the optical lens component 140 may allow the first reflected light beam R1 and the second reflected light beam R2 to be transmitted to the first camera CM1 and the second camera CM2 respectively. According to some embodiments, the first reflected light beam R1 and the second reflected light beam R2 generated after irradiating the object to be tested SP may be mixed first, and then separated by the light splitting component 140s to be transmitted to the first camera CM1 and the second camera CM2, but not limited thereto. According to other embodiments, the object to be tested SP may be irradiated separately to generate the first reflected light beam R1 and the second reflected light beam R2, and the first reflected light beam R1 and the second reflected light beam R2 may be, for example, transmitted to the first camera CM1 and the second camera CM2 respectively without passing through the light splitting component 140s. According to some embodiments, the grayscale of the image or result presented by the first reflected light beam R1 through the first photographic device CM1 is different from the grayscale of the image or result presented by the second reflected light beam R2 through the second photographic device CM2, or the grayscale ratio of the two is at least greater than or equal to 2, thereby facilitating identification.

[0063] Furthermore, although the optical lens assembly 140 includes two light splitting components 140s in the illustrated embodiment, the present invention is not limited thereto, and in other embodiments, the optical lens assembly 140 may include other suitable numbers of light splitting components 140s. In addition, according to some embodiments, the optical lens assembly 140 may further include other suitable optical components that can adjust or facilitate light beam transmission.

[0064] As mentioned above, according to some embodiments, the image capture component 130 includes a first camera CM1 and a second camera CM2, and the first camera CM1 and the second camera CM2 can be used to receive light beams with different wavelength ranges. In particular, the optical inspection module 100 can be used with light sources of multiple wavelengths to capture images in multiple wavelength ranges, so it can be applied to the inspection of more types of materials and improve the ability to judge defects.

[0065] Specifically, according to some embodiments, the first camera CM1 can be used to receive a light beam with a wavelength between 300 nanometers and 900 nanometers, for example, a light beam with a wavelength between 300 nanometers and 700 nanometers, or a light beam with a wavelength between 700 nanometers and 900 nanometers. According to some embodiments, the second camera CM2 can be used to receive a light beam with a wavelength between 700 nanometers and 3000 nanometers, for example, a light beam with a wavelength between 700 nanometers and 1700 nanometers, or a light beam with a wavelength between 1700 nanometers and 3000 nanometers. In other words, the first camera CM1 can receive a light beam of visible light, and the second camera CM2 can receive a light beam of infrared light (for example, near-infrared light).

[0066] According to some embodiments, one of the first camera CM1 and the second camera CM2 can be used to receive a light beam with a wavelength between 300 nanometers and 900 nanometers, and the other of the first camera CM1 and the second camera CM2 can be used to receive a light beam with a wavelength between 700 nanometers and 3000 nanometers. That is, one of the first camera CM1 and the second camera CM2 receives a light beam in the visible light range, and the other receives a light beam in the infrared light range, but is not limited thereto.

[0067] In addition, the first photographing device CM1 and the second photographing device CM2 may be area-scan or line-scan photographing devices.

[0068] Furthermore, if Figure 2A as well as Figure 2BAs shown, according to some embodiments, the optical detection module 100 may further include a filter component 150, and the filter component 150 may be disposed between the first light source 110 and the optical lens component 140. The optical detection module 100 may enable the first light source 110 to provide light beams with different wavelength ranges through the filter component 150. According to some embodiments, the filter component 150 may include a plurality of filter layers for filtering different wavelength ranges, for example, a red filter layer, a green filter layer, a blue filter layer, a white filter layer, or a yellow filter layer, but is not limited thereto. According to some embodiments, the position of the filter layer of the filter component 150 may be adjusted to overlap with the travel path of the first light beam L1 provided by the first light source 110, so as to provide the first light beam L1 with different wavelength ranges.

[0069] In addition, as mentioned above, according to some embodiments, the second light source 120 can provide an annular dark field light source. The structure of the second light source 120 is further described below. Figure 2A , Figure 2B as well as Figure 2C , Figure 2C A bottom view of the structure of the second light source 120 of the optical detection module 100 according to some embodiments of the present invention is shown.

[0070] According to some embodiments, the second light source 120 may include a base 120b and a plurality of light emitting components 120e disposed on the base 120b, and the plurality of light emitting components 120e may provide light beams with different wavelength ranges and different incident angles. In detail, the base 120b may be a cover having an arc or curvature. According to some embodiments, the curvature of the surface of the base 120b may be between 10° and 80°. In addition, the top 120T of the base 120b may have an opening 120o, so that the first light beam L1 provided by the first light source 110, the first reflected light beam R1 generated by the first light beam L1 irradiating the object to be tested SP, and the second reflected light beam R2 generated by the second light beam L2 irradiating the object to be tested SP can be transmitted to the image capture component 130.

[0071] Furthermore, a plurality of light emitting components 120e may be disposed on the inner surface of the base 120b, and a portion of the light emitting components 120e may be disposed at a relatively high position of the base 120b, such as a position close to the top 120T. Figure 2C The light emitting components 120e (indicated as light emitting components G1) can illuminate the object SP with a high-angle incident light beam. In addition, another part of the light emitting components 120e is disposed at a relatively low position of the base 120b, such as a position close to the bottom 120M. The plurality of light emitting components 120e (indicated as light emitting components G1 for clarity) can illuminate the object SP with a high-angle incident light beam. Figure 2C The light emitting component G2 in the middle can illuminate the object to be tested SP with a low-angle incident light beam.

[0072] In addition, the plurality of light emitting components 120e may include lamp beads of a plurality of different colors, for example, red, green, blue, white or yellow lamp beads, etc., but not limited thereto. The lamp beads of different colors may be arranged alternately. According to some embodiments, the light emitting component 120e may include a light emitting diode (LED) or other suitable light emitting components.

[0073] Please refer again Figure 1 The control module 200 is coupled to the optical inspection module 100 to control the first light source 110, the second light source 120 and the image capture component 130, and receives and analyzes the image of the object SP obtained from the image capture component 130 to determine whether the object SP has defects. According to some embodiments, the control module 200 may include an image capture component control unit 210 and a data processing unit 220 coupled to the image capture component control unit 210. The image capture component control unit 210 can be used to control the beam form provided by the first light source 110 and the second light source 120 and the wavelength range received by the image capture component 130. Furthermore, the data processing unit 220 can establish a model by an algorithm, and the model can detect and classify defects.

[0074] According to some embodiments, the image capture component control unit 210 may include a computer that controls the optical detection module 100. Specifically, the image capture component control unit 210 may control the wavelength range of the first light beam L1 provided by the first light source 110, the wavelength range and incident angle of the second light beam L2 provided by the second light source 120, and the wavelength range and frequency of the image capture component 130 through an electronic control unit (ECU).

[0075] According to some embodiments, the data processing unit 220 may include an AI GPU server, which can detect and classify the images obtained by the image capture component 130 in real time through an edge computing system. In addition, if the number of images obtained by the image capture component 130 is large, parallel computing can be used to increase the GPU server to improve the computing power. According to some embodiments, the data processing unit 220 can perform defect detection and classification through rule-based machine learning algorithms and AI algorithm modeling. If the detection result of the algorithm shows that the confidence level is less than 95%, it can be automatically assigned to an online operator for re-judgment. Finally, the judgment result of the optical inspection module 100 is automatically stored in a file server to achieve automated production.

[0076] According to some embodiments of the present invention, a detection method of an electronic device is also provided, comprising providing an object to be tested SP, and using the detection system 10 of the electronic device to detect the object to be tested SP. As mentioned above, the detection system 10 of the electronic device may include an optical detection module 100 and a control module 200 coupled to the optical detection module, the optical detection module 100 includes a first light source 110, a second light source 120, and an image capture component 130 coupled to the first light source 110 and the second light source 120, and the control module 200 may receive and analyze the image of the object to be tested SP obtained from the image capture component 130. According to some embodiments, the object to be tested SP includes a wafer, a packaging component, an electronic device with a perforated substrate, a probe, a display, a light-emitting device, or a finished product or semi-finished product in any manufacturing process, but is not limited thereto.

[0077] Specifically, the electronic device detection method may include providing a first light beam L1 to illuminate the object SP by the first light source 110, providing a second light beam L2 to illuminate the object SP by the second light source 120, photographing the object SP by the image capture component 130, and determining whether the object SP has defects by the control module 200.

[0078] As mentioned above, the wavelength of the first light beam L1 is different from the wavelength of the second light beam L2, and the wavelength of one of the first light beam L1 and the second light beam L2 may be between 300 nanometers and 3000 nanometers. According to some embodiments, the wavelength of the other of the first light beam L1 and the second light beam L2 may be between 300 nanometers and 700 nanometers, that is, the first light source 110 and the second light source 120 may be adjusted so that one of them provides visible light and the other provides infrared light, but it is not limited thereto. In addition, according to some embodiments, the first light source 110 may provide a coaxial light source, and the second light source 120 may provide an annular dark field light source.

[0079] According to some embodiments, the first light beam L1 irradiates the object SP to generate a first reflected light beam R1 , and the second light beam L2 irradiates the object SP to generate a second reflected light beam R2 . The first reflected light beam R1 and the second reflected light beam R2 are transmitted to the image capture component 130 .

[0080] As mentioned above, according to some embodiments, the image capture component 130 may include a first camera CM1 and a second camera CM2, and the first camera CM1 and the second camera CM2 may be used to receive light beams with different wavelength ranges. According to some embodiments, one of the first camera CM1 and the second camera CM2 may be used to receive a light beam with a wavelength between 300 nanometers and 900 nanometers, and the other of the first camera CM1 and the second camera CM2 may be used to receive a light beam with a wavelength between 700 nanometers and 3000 nanometers. That is, one of the first camera CM1 and the second camera CM2 receives a light beam in the visible light range, and the other receives a light beam in the infrared light range, but is not limited thereto. In addition, the first camera CM1 and the second camera CM2 may be used in the form of surface scanning or line scanning.

[0081] According to some embodiments, the optical detection module 100 may further include a filter component 150, and the filter component 150 may be disposed between the first light source 110 and the optical lens component 140. The optical detection module 100 may enable the first light source 110 to provide light beams with different wavelength ranges through the filter component 150. In the detection method of the electronic device, the position of the filter layer of the filter component 150 may be adjusted (for example, by rotating a rotating disk carrying a plurality of filter layers) so that the filter layer overlaps with the travel path of the first light beam L1 provided by the first light source 110, so as to provide the first light beam L1 with different wavelength ranges.

[0082] As mentioned above, according to some embodiments, the second light source 120 may include a base 120b and a plurality of light-emitting components 120e disposed on the base 120b. In the detection method of the electronic device, the light-emitting state of the plurality of light-emitting components 120e may be adjusted so that the second light source 120 can provide light beams with different wavelength ranges and different incident angles. Specifically, in the detection method of the electronic device, the wavelength and incident angle of the second light beam L2 provided by the second light source 120 may be adjusted by adjusting the color, quantity and position of the light emitted by the light-emitting component 120e.

[0083] Specifically, the control module 200 of the electronic device inspection system 10 may include an image capture component control unit 210 and a data processing unit 220 coupled to the image capture component control unit. The image capture component control unit 210 may control the beam form provided by the first light source 110 and the second light source 120 and the wavelength range received by the image capture component 130. Specifically, in the electronic device inspection method, the wavelength range of the first light beam L1 provided by the first light source 110, the wavelength range and incident angle of the second light beam L2 provided by the second light source 120, and the wavelength range and frequency of the image capture component 130 may be controlled. Furthermore, according to some embodiments, the image capture component control unit 210 may enable the first light source 110 and the second light source 120 to provide the first light beam L1 and the second light beam L2 at the same time, or enable one of the first light source 110 and the second light source 120 to provide the first light beam L1 or the second light beam L2. In addition, the data processing unit 220 establishes a model by an algorithm, and the model detects and classifies defects.

[0084] In particular, the image capture component control unit 210 can control the beam form provided by the first light source 110 and the second light source 120 and the wavelength range received by the image capture component 130, so that the image capture component 130 can perform multi-wavelength imaging in a single scan. Figure 3 , Figure 3 A conceptual diagram showing the image capture component 130 performing multi-wavelength imaging in a single scan according to some embodiments of the present invention. Figure 3 In the figure, when the circle marked as the first light source 110 is a slash pattern, it means that the first light source 110 emits light, and different slash patterns represent lights of different wavelengths (colors), and when the circle marked as the first light source 110 is a dot, it means that the first light source 110 does not emit light; when the circle marked as the second light source 120 (light-emitting component G1) is a slash pattern, it means that the second light source 120 provides a light-emitting component 120e (G1) with a high-angle incident light beam to emit light, and different slash patterns represent lights of different wavelengths (colors), and when the circle marked as the second light source 120 is a dot, it means that the first light source 110 does not emit light; When the circle of the second light source 120 (light-emitting component G1) is a dot, it means that the light-emitting component G1 of the second light source 120 does not emit light; when the circle marked as the second light source 120 (light-emitting component G2) is a diagonal background, it means that the light-emitting component 120e (G2) of the second light source 120 that provides a low-angle incident light beam emits light, and different diagonal backgrounds represent light of different color wavelengths (colors), and when the circle marked as the second light source 120 (light-emitting component G2) is a dot, it means that the light-emitting component G2 of the second light source 120 does not emit light.

[0085] like Figure 3As shown, according to some embodiments, please refer to the leftmost schematic diagram, the image capture component control unit 210 can be used to make the first light source 110 provide coaxial light, for example, by using the filter component 150 to provide red light, and the second light source 120 does not emit light; please refer to the second schematic diagram from the left, the image capture component control unit 210 can be used to make the first light source 110 provide coaxial light, for example, by using the filter component 150 to provide white light, and the second light source 120 does not emit light; please refer to the third schematic diagram from the left, the image capture component control unit 210 can be used to make The first light source 110 is prevented from emitting light, and the second light source 120 is made to provide annular dark field light, for example, the light emitting component G2 providing a low-angle incident light beam provides annular red light, while the light emitting component G1 providing a high-angle incident light beam does not emit light; finally, please refer to the fourth schematic diagram from the left, the first light source 110 can be prevented from emitting light by the image capture component control unit 210, and the second light source 120 can be made to provide annular dark field light, for example, the light emitting component G1 providing a high-angle incident light beam provides annular blue light, while the light emitting component G2 providing a low-angle incident light beam does not emit light.

[0086] It is worth noting that the above four types of images can be obtained from a single scan of the image capture component 130. By combining the multiple images from different light sources and wavelengths, the detection method of the electronic device can be applied to the detection of more types of materials, thereby improving the ability to judge defects.

[0087] Furthermore, it should be understood that Figure 3 This is only a conceptual diagram of multi-wavelength imaging, and the light beam forms provided by the first light source 110 and the second light source 120 are not limited to this. According to different embodiments, the image capture component control unit 210 can control other combinations of light beam forms provided by the first light source 110 and the second light source 120 and adjust the wavelength range received by the image capture component 130.

[0088] In summary, according to the embodiments of the present invention, the detection system and detection method of the electronic device provided include an automatic detection method using multiple wavelengths, multiple light sources and specific image capture components, so that the detection light source can penetrate the polymer material in the structure, and improve the ability to judge defects. The detection system and method provided by the embodiments of the present invention can perform real-time quality management in a non-destructive detection manner during the manufacturing process of the electronic device, thereby improving the defect detection rate, and further improving the process yield and production capacity of the electronic device.

[0089] Although the embodiments of the present invention and their advantages have been disclosed as above, it should be understood that any person with ordinary knowledge in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. The features between the embodiments of the present invention can be mixed and matched as needed as long as they do not violate the spirit of the invention or conflict with each other. In addition, the scope of protection of the present invention is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person with ordinary knowledge in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present invention. As long as the same functions can be implemented in the embodiments described herein or the same results can be obtained, they can be used according to the present invention. Therefore, the scope of protection of the present invention includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. The scope of protection of the present invention shall be defined by the scope of the claims attached above. Any embodiment or claim of the present invention does not need to achieve all the purposes, advantages and features disclosed in the present invention.

Claims

1. A detection system for an electronic device, characterized in that: include: An optical detection module, comprising: A first light source provides a first light beam to illuminate an object to be measured; a second light source, providing a second light beam to illuminate the object to be tested; and an image capturing component, coupled to the first light source and the second light source, for photographing the object to be tested, wherein the wavelength of the first light beam is different from the wavelength of the second light beam, and the wavelength of one of the first light beam and the second light beam is between 300 nanometers and 3000 nanometers; and A control module is coupled to the optical detection module, and is used to control the first light source, the second light source and the image capture component, and receive and analyze the image of the object to be tested obtained from the image capture component to determine whether the object to be tested has defects.

2. The electronic device detection system as claimed in claim 1, characterized in that: The optical detection module further comprises: An optical lens assembly has an optical path, wherein the first light source provides the first light beam via the optical path.

3. The detection system of an electronic device as claimed in claim 2, characterized in that: The first light beam generates a first reflected light beam after irradiating the object to be tested, and the second light beam generates a second reflected light beam after irradiating the object to be tested. The first reflected light beam and the second reflected light beam are transmitted to the image capture component via the optical path.

4. The detection system for an electronic device as claimed in claim 1, wherein: The wavelength of the other of the first light beam and the second light beam is between 300 nanometers and 700 nanometers.

5. The electronic device detection system as claimed in claim 1, characterized in that: The image capture component includes a first photographing device and a second photographing device, wherein the first photographing device and the second photographing device are used to receive light beams with different wavelength ranges.

6. The detection system for an electronic device as claimed in claim 2, wherein: The optical detection module further comprises: A filter component is arranged between the first light source and the optical lens component.

7. The electronic device detection system as claimed in claim 1, characterized in that: The second light source includes a base and a plurality of light-emitting components disposed on the base. The plurality of light-emitting components can provide light beams with different wavelength ranges and different incident angles.

8. A method for detecting an electronic device, characterized in that: include: Providing a test object; The object to be tested is tested using a testing system, wherein the testing system includes an optical testing module and a control module coupled to the optical testing module, the optical testing module includes a first light source, a second light source, and an image capturing component coupled to the first light source and the second light source, the control module receives and analyzes an image of the object to be tested obtained from the image capturing component, The detection method of the electronic device includes: Providing a first light beam to illuminate the object to be tested by the first light source; Providing a second light beam to irradiate the object to be measured by the second light source, wherein the wavelength of the first light beam is different from the wavelength of the second light beam, and the wavelength of one of the first light beam and the second light beam is between 300 nanometers and 3000 nanometers; photographing the object to be tested by means of the image capturing component; and The control module is used to determine whether the object to be tested has defects.

9. The detection method of an electronic device as claimed in claim 8, characterized in that: The first light beam irradiates the object to be tested to generate a first reflected light beam, and the second light beam irradiates the object to be tested to generate a second reflected light beam. The first reflected light beam and the second reflected light beam are transmitted to the image capture component.

10. The detection method of an electronic device as claimed in claim 8, characterized in that: The image capture component includes a first photographing device and a second photographing device, wherein the first photographing device and the second photographing device receive light beams with different wavelength ranges.

Images