Radio frequency rod state detection method and device and thin film deposition method

Abstract

The invention provides a radio frequency rod state detection method, a radio frequency rod state detection device and a thin film deposition method. The detection method comprises the following steps: placing an electrode plate on the upper surface of the heating disc, and enabling the lower surface of the electrode plate to be in full contact with the upper surface of the heating disc; connecting one end of a capacitance tester to the electrode plate, and connecting the other end of the capacitance tester to the lower end of the radio frequency rod so as to determine an actually measured capacitance value from the electrode plate to the lower end of the radio frequency rod; and determining the connection state of the radio frequency rod and the radio frequency electrode according to the actually measured capacitance value. According to the device, the actually measured capacitance value from the electrode plate to the lower end of the radio frequency rod can be collected, judgment can be performed according to the actual capacitance value, and the device is used for detecting the connection state between the radio frequency rod and the radio frequency electrode online, so that the influence of poor contact between the radio frequency rod and the radio frequency electrode on the precision and stability of a thin film deposition process is prevented.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor device processing, and in particular to a method for detecting a radio frequency rod state, a device for detecting a radio frequency rod state, and a thin film deposition method. Background Art

[0002] The problem of loose RF rods frequently occurs in existing thin film deposition equipment. Here, the RF rod is made of conductive material, and its upper end is connected to the RF electrode in the heating plate. However, the loosening of the RF rod causes poor welding between the RF electrode and the RF rod, which in turn leads to unstable energy in the plasma field, which affects the uniformity and repeatability of the process, and thus reduces the quality of the film. In addition, in the absence of good grounding, the static electricity in the plasma field cannot be effectively released, and may accumulate to a high enough potential, thereby causing arcing, causing permanent damage to the heating plate. Secondly, the electromagnetic radiation generated by the lack of grounding may also interfere with other surrounding electronic equipment. In addition, the poor contact caused by the loose RF rod may also weaken the electrostatic adsorption force of the electrostatic chuck (ESC), causing the wafer to be processed to shift, which directly affects the accuracy and stability of the process, and even causes an alarm.

[0003] In order to overcome the above-mentioned defects of the prior art, the art urgently needs an improved method for detecting the state of the RF rod, which can be used to detect the connection state between the RF rod and the RF electrode online, thereby preventing the poor contact between the RF rod and the RF electrode from affecting the accuracy and stability of the thin film deposition process. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects in the prior art, the present invention provides a method for detecting the state of a radio frequency rod, a device for detecting the state of a radio frequency rod and a thin film deposition method. The method can collect the measured capacitance value from the electrode plate to the lower end of the radio frequency rod and make a judgment based on the actual capacitance value to detect the connection state between the radio frequency rod and the radio frequency electrode online, thereby preventing the poor contact between the radio frequency rod and the radio frequency electrode from affecting the accuracy and stability of the thin film deposition process.

[0006] Specifically, a method for detecting the state of the above-mentioned RF rod is provided according to the first aspect of the present invention. The RF rod is made of a conductive material, and its upper end is connected to the RF electrode in the heating disk of the thin film deposition equipment. The detection method includes the following steps: placing an electrode plate on the upper surface of the heating disk, and making the lower surface of the electrode plate fully contact the upper surface of the heating disk; connecting one end of a capacitance tester to the electrode plate, and connecting the other end to the lower end of the RF rod to determine the measured capacitance value from the electrode plate to the lower end of the RF rod; and determining the connection state of the RF rod and the RF electrode based on the measured capacitance value.

[0007] Furthermore, in some embodiments of the present invention, the step of determining the connection status between the RF rod and the RF electrode based on the measured capacitance value includes: in response to the measured capacitance value being greater than or equal to a preset capacitance threshold, determining that the RF rod is firmly connected to the RF electrode; and in response to the measured capacitance value being less than the capacitance threshold, determining that the RF rod is detached from the RF electrode.

[0008] Further, in some embodiments of the present invention, the step of connecting one end of the capacitance tester to the electrode plate and the other end to the lower end of the RF rod to determine the measured capacitance value from the electrode plate to the lower end of the RF rod includes: connecting one end of the capacitance tester to the electrode plate and the other end to the lower end of the RF rod to collect the measured capacitance value from the electrode plate to the lower end of the RF rod multiple times. The step of determining the connection state of the RF rod and the RF electrode based on the measured capacitance value further includes: in response to the measured capacitance values ​​collected multiple times being greater than or equal to the capacitance threshold, determining that the RF rod is firmly connected to the RF electrode; and in response to the measured capacitance values ​​collected multiple times being less than the capacitance threshold, determining that the RF rod is detached from the RF electrode.

[0009] Furthermore, in some embodiments of the present invention, the step of determining the connection status of the RF rod and the RF electrode based on the measured capacitance value also includes: in response to at least one of the measured capacitance values ​​collected multiple times being greater than or equal to the capacitance threshold, and at least another of the measured capacitance values ​​collected multiple times being less than the capacitance threshold, adding a counterweight block to the lower end of the RF rod to pull the RF rod away from the heating disk, and collecting the measured capacitance value from the electrode plate to the lower end of the RF rod again; in response to the measured capacitance value collected again being greater than or equal to the capacitance threshold, determining that the RF rod is firmly connected to the RF electrode; and in response to the measured capacitance value collected again being less than the capacitance threshold, determining that the contact between the RF rod and the RF electrode is poor.

[0010] Further, in some embodiments of the present invention, the step of recollecting the measured capacitance value from the electrode plate to the lower end of the RF rod includes: recollecting the measured capacitance value from the electrode plate to the lower end of the RF rod multiple times. The step of determining that the RF rod is firmly connected to the RF electrode in response to the measured capacitance value recollected being greater than or equal to the capacitance threshold value includes: determining that the RF rod is firmly connected to the RF electrode in response to the measured capacitance values ​​recollected multiple times being greater than or equal to the capacitance threshold value. The step of determining that the contact between the RF rod and the RF electrode is poor in response to the measured capacitance value recollected being less than the capacitance threshold value includes: determining that the contact between the RF rod and the RF electrode is poor in response to at least one of the measured capacitance values ​​recollected multiple times being less than the capacitance threshold value.

[0011] Further, in some embodiments of the present invention, the RF rod extends in the handle of the heating plate. The handle is connected to the mounting support of the heating plate via a mounting assembly. The step of connecting one end of the capacitance tester to the electrode plate and the other end thereof to the lower end of the RF rod comprises: clamping a first clamp of the capacitance tester to the electrode plate; and inserting a first end of an extension strap made of a conductive material into a detection hole of the mounting assembly to connect the lower end of the RF rod, and clamping a second clamp of the capacitance tester to the second end of the extension strap.

[0012] Furthermore, in some embodiments of the present invention, the step of adding a counterweight block to the lower end of the RF rod to pull the RF rod in a direction away from the heating plate includes: connecting it to the second threaded portion of the second end of the extension strap via the first threaded portion of the counterweight block to pull the RF rod downward.

[0013] In addition, the detection device for the state of the above-mentioned RF rod provided according to the second aspect of the present invention includes an electrode plate and a capacitance tester. The lower surface of the electrode plate fully contacts the upper surface of the heating disk of the thin film deposition device. One end of the capacitance tester is connected to the electrode plate, and the other end is connected to the lower end of a RF rod, which is used to detect the measured capacitance value from the electrode plate to the lower end of the RF rod to determine the connection state of the RF rod and the RF electrode. The RF rod is made of a conductive material, and its upper end is connected to the RF electrode in the heating disk.

[0014] In addition, the above-mentioned thin film deposition method provided according to the third aspect of the present invention includes the following steps: before performing thin film deposition on the wafer, first use the detection device provided by the second aspect of the present invention to detect the connection status of the RF rod of the thin film deposition equipment and the RF electrode in the heating plate; in response to the detection result that the RF rod is tightly connected to the RF electrode, allow the thin film deposition to be performed; and in response to the detection result that the RF rod is detached from the RF electrode or the contact between the two is poor, output a corresponding alarm signal, and / or prevent the execution of the thin film deposition.

[0015] Furthermore, in some embodiments of the present invention, during the thin film deposition process, the RF rod provides an RF voltage to the RF electrode to cooperate with another RF electrode of the thin film deposition device to form an in-situ plasma in the process chamber of the thin film deposition device. And / or during the thin film deposition process, the RF rod provides an AC voltage to the RF electrode to electrostatically adsorb the wafer via the heating plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0017] Figure 1 A device for detecting the state of a radio frequency rod provided according to some embodiments of the present invention is shown.

[0018] Figure 2 A schematic flow chart of a method for detecting a radio frequency rod state provided according to some embodiments of the present invention is shown.

[0019] Figure 3 A schematic flow chart of a method for detecting a radio frequency rod state provided according to some embodiments of the present invention is shown.

[0020] Figure 4 A schematic flow chart of a thin film deposition method provided according to some embodiments of the present invention is shown.

[0021] Reference numerals:

[0022] 11. Electrode Plate

[0023] 12 Capacitance Tester

[0024] 13 RF rod

[0025] 14 Radiofrequency Electrode

[0026] 15 Heating plate

[0027] 16 Wafer

[0028] 17 Installing Components DETAILED DESCRIPTION

[0029] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0032] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0033] As mentioned above, the looseness of the RF rod causes poor welding between the RF electrode and the RF rod, which in turn leads to unstable energy in the plasma field, which affects the uniformity and repeatability of the process and reduces the quality of the film. In addition, without good grounding, the static electricity in the plasma field cannot be effectively released and may accumulate to a high enough potential, thereby causing arcing and causing permanent damage to the heating plate. Secondly, the electromagnetic radiation generated by the lack of grounding may also interfere with other surrounding electronic equipment. In addition, the poor contact caused by the loose RF rod may also weaken the electrostatic adsorption force of the electrostatic chuck (ESC), causing the wafer to be processed to shift, which directly affects the accuracy and stability of the process and even causes an alarm.

[0034] In order to overcome the above-mentioned defects in the prior art, the present invention provides a method for detecting the state of a radio frequency rod, a device for detecting the state of a radio frequency rod and a thin film deposition method. The method can collect the measured capacitance value from the electrode plate to the lower end of the radio frequency rod and make a judgment based on the actual capacitance value to detect the connection state between the radio frequency rod and the radio frequency electrode online, thereby preventing the poor contact between the radio frequency rod and the radio frequency electrode from affecting the accuracy and stability of the thin film deposition process.

[0035] In some non-limiting embodiments, the above-mentioned method for detecting the state of the radio frequency rod provided in the first aspect of the present invention can be implemented based on the above-mentioned device for detecting the state of the radio frequency rod provided in the second aspect of the present invention.

[0036] Please refer to Figure 1 . Figure 1 A device for detecting the state of a radio frequency rod provided according to some embodiments of the present invention is shown.

[0037] exist Figure 1 In the illustrated embodiment, the detection device for the state of the above-mentioned RF rod provided by the second aspect of the present invention includes an electrode plate 11 and a capacitance tester 12. Here, the lower surface of the electrode plate 11 fully contacts the upper surface of the heating disk of the thin film deposition device. One end of the capacitance tester 12 is connected to the electrode plate 11, and the other end is connected to the lower end of a RF rod 13, which is used to detect the measured capacitance value from the electrode plate 11 to the lower end of the RF rod 13 to determine the connection state of the RF rod 13 and the RF electrode 14. The RF rod 13 is made of a conductive material, and its upper end is connected to the RF electrode 14 (for example: a mesh electrode) in the heating disk 15.

[0038] The following will describe the working principle of the above-mentioned RF rod state detection device in conjunction with some embodiments of the RF rod state detection method. Those skilled in the art will understand that these embodiments of the RF rod state detection method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the RF rod state detection device. Similarly, the RF rod state detection device is only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the execution subject or execution order of each step in these RF rod state detection methods.

[0039] Please refer to Figure 2 . Figure 2 A schematic flow chart of a method for detecting a radio frequency rod state provided according to some embodiments of the present invention is shown.

[0040] like Figure 2 As shown, the above-mentioned RF rod state detection device provided by the second aspect of the present invention can first place an electrode plate 11 on the upper surface of the heating disk 15, and make the lower surface of the electrode plate 11 fully contact the upper surface of the heating disk 15.

[0041] Afterwards, the detection device can connect one end of the capacitance tester 12 to the electrode plate 11 and the other end thereof to the lower end of the RF rod 13 to determine the measured capacitance value from the electrode plate 11 to the lower end of the RF rod 13 .

[0042] Thereafter, the detection device may determine the connection status between the RF rod 13 and the RF electrode 14 according to the measured capacitance value.

[0043] Specifically, in response to the measured capacitance value being greater than or equal to a preset capacitance threshold (eg, 3.0 nF), or both being in the nF order of magnitude, the detection device can determine that the RF rod 13 is firmly connected to the RF electrode 14 .

[0044] On the contrary, in response to the measured capacitance value being smaller than the capacitance threshold value (eg, 2.0 nF) or both being in the PF order of magnitude, the detection device may determine that the RF rod 13 is separated from the RF electrode 14 .

[0045] Please refer to further Figure 3 . Figure 3 A schematic flow chart of a method for detecting a radio frequency rod state provided according to some embodiments of the present invention is shown.

[0046] exist Figure 3 In the illustrated embodiment, the detection device can connect one end of the capacitance tester 12 to the electrode plate 11 and the other end to the lower end of the RF rod 13 to collect the measured capacitance values ​​from the electrode plate 11 to the lower end of the RF rod 13 multiple times.

[0047] Please refer to Tables 1 to 3. Table 1 shows the measured capacitance values ​​when the RF rod is tightly connected to the RF electrode according to some embodiments of the present invention. Table 2 shows the measured capacitance values ​​when the RF rod is in poor contact with the RF electrode according to some embodiments of the present invention. Table 3 shows the measured capacitance values ​​when the RF rod is separated from the RF electrode according to some embodiments of the present invention.

[0048] Table 1 Measured capacitance values ​​when the RF rod is tightly connected to the RF electrode RF rod fastening connection RF electrode

[0049] The measured capacitance value during the action process is the first time, the second time, and the third time.

[0050] Machine direct detection Cs / nF 4.2178 4.2330 4.2394 Remove the AC filter Cs / nF 4.2589 4.2571 4.2505 Remove the mounting assembly Cs / nF 4.2351 4.2291 4.2420

[0051] Table 2 Measured capacitance values ​​of poor contact between RF rod and RF electrode

[0052]

[0053] Table 3 Measured capacitance values ​​of RF rods separated from RF electrodes

[0054]

[0055] Afterwards, as shown in Table 1, in response to the fact that the measured capacitance values ​​collected multiple times are all greater than or equal to the capacitance threshold (for example, 3.0 nF), or are all in the nF order of magnitude, the detection device can determine that the RF rod 13 is firmly connected to the RF electrode 14 .

[0056] On the contrary, as shown in Table 3, in response to the fact that the measured capacitance values ​​collected multiple times are all smaller than the capacitance threshold (eg, 2.0 nF), or are all in the PF order of magnitude, the detection device can determine that the RF rod 13 is detached from the RF electrode 14 .

[0057] Alternatively, in some embodiments, in response to at least one of the measured capacitance values ​​collected multiple times being greater than or equal to the capacitance threshold, and at least another of the measured capacitance values ​​collected multiple times being less than the capacitance threshold, the detection device can add a counterweight (for example: 25N) to the lower end of the RF rod 13 to pull the RF rod 13 away from the heating disk, and collect the measured capacitance value from the electrode plate 11 to the lower end of the RF rod 13 again.

[0058] Afterwards, in response to the re-collected measured capacitance value being greater than or equal to the capacitance threshold, the detection device may determine that the RF rod is firmly connected to the RF electrode.

[0059] On the contrary, in response to the measured capacitance value collected again being less than the capacitance threshold, the detection device can determine that there is poor contact between the RF rod 13 and the RF electrode 14. Here, in the case of poor contact, the RF rod 13 and the RF electrode 14 are connected, but the conductive performance is poor and unstable.

[0060] Furthermore, in the process of collecting the measured capacitance value again, the detection device can collect the measured capacitance value from the electrode plate 11 to the lower end of the RF rod 13 multiple times.

[0061] Afterwards, in response to the fact that the measured capacitance values ​​collected multiple times are all greater than or equal to the capacitance threshold, the detection device can determine that the RF rod 13 is tightly connected to the RF electrode 14 .

[0062] On the contrary, as shown in Table 2, in response to at least one of the measured capacitance values ​​recollected multiple times being smaller than the capacitance threshold, the detection device may determine that the contact between the RF rod 13 and the RF electrode 14 is poor.

[0063] In addition, Figure 3 In the illustrated embodiment, the RF rod 13 extends in the handle of the heating plate 15, and the handle is connected to the mounting support of the heating plate 15 via a mounting assembly 17. Specifically, the detection device can clamp the first clamp of the capacitance tester 12 to the electrode plate 11. Thereafter, the detection device can insert the first end of the extension strap made of conductive material into the detection hole of the mounting assembly 17 to connect the lower end of the RF rod 13, and clamp the second clamp of the capacitance tester 12 to the second end of the extension strap.

[0064] Here, in the process of pulling the RF rod 13 in a direction away from the heating plate, the detection device can connect the counterweight to the second threaded portion of the second end of the extension strap via the first threaded portion of the counterweight to pull the RF rod 13 downward.

[0065] Please refer to further Figure 4 . Figure 4 A schematic flow chart of a thin film deposition method provided according to some embodiments of the present invention is shown.

[0066] like Figure 4 As shown, before performing thin film deposition on the wafer 16, the technician may first detect the connection status between the RF rod 13 of the thin film deposition equipment and the RF electrode 14 in the heating plate 15 through the detection device provided by the second aspect of the present invention.

[0067] Thereafter, in response to the detection result that the RF rod 13 is firmly connected to the RF electrode 14 , thin film deposition may be allowed to be performed.

[0068] On the contrary, in response to the detection result that the RF rod 13 is separated from the RF electrode 14 or the contact between the two is poor, a corresponding alarm signal can be output and / or the execution of thin film deposition can be prevented.

[0069] Furthermore, in some embodiments, during the thin film deposition process, the RF rod 13 provides RF voltage to the RF electrode 14 to cooperate with another RF electrode of the thin film deposition device to form an in-situ plasma in a process chamber of the thin film deposition device.

[0070] Alternatively, in some embodiments, the RF rod 13 provides an AC voltage to the RF electrode 14 during the thin film deposition process, so as to electrostatically adsorb the wafer 16 via the heating plate 15 .

[0071] In this way, the above-mentioned thin film deposition method provided in the third aspect of the present invention can improve the detection efficiency through online detection, and enhance the processing accuracy and stability of the thin film deposition process.

[0072] In summary, the above-mentioned RF rod state detection method, RF rod state detection device and a thin film deposition method provided by the present invention can all collect the measured capacitance value from the electrode plate to the lower end of the RF rod and make a judgment based on the actual capacitance value, so as to detect the connection status between the RF rod and the RF electrode online, thereby preventing the poor contact between the RF rod and the RF electrode from affecting the accuracy and stability of the thin film deposition process.

[0073] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0074] Those skilled in the art will appreciate that information, signals, and data may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips cited throughout the above description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, optical fields or optical particles, or any combination thereof.

[0075] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithm steps described in conjunction with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or a combination of the two. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. The technician may implement the described functionality in different ways for each specific application, but such implementation decisions should not be interpreted as resulting in a departure from the scope of the present invention.

[0076] The various illustrative logic modules and circuits described in conjunction with the embodiments disclosed herein may be implemented or executed with a general purpose processor, a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in cooperation with a DSP core, or any other such configuration.

[0077] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0078] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0079] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for detecting the state of a radio frequency rod, wherein: The radio frequency rod is made of a conductive material, and its upper end is connected to a radio frequency electrode in a heating plate of a thin film deposition device. The detection method comprises the following steps: Placing an electrode plate on the upper surface of the heating plate, and making the lower surface of the electrode plate fully contact the upper surface of the heating plate; Connecting one end of a capacitance tester to the electrode plate and the other end thereof to the lower end of the RF rod to determine a measured capacitance value from the electrode plate to the lower end of the RF rod; and The connection state between the RF rod and the RF electrode is determined according to the measured capacitance value.

2. The detection method according to claim 1, characterized in that The step of determining the connection state between the RF rod and the RF electrode according to the measured capacitance value comprises: In response to the measured capacitance value being greater than or equal to a preset capacitance threshold, determining that the RF rod is tightly connected to the RF electrode; and In response to the measured capacitance value being less than the capacitance threshold, it is determined that the RF rod is separated from the RF electrode.

3. The detection method according to claim 2, characterized in that The step of connecting one end of the capacitance tester to the electrode plate and the other end thereof to the lower end of the RF rod to determine the measured capacitance value from the electrode plate to the lower end of the RF rod comprises: connecting one end of the capacitance tester to the electrode plate and the other end thereof to the lower end of the RF rod to collect the measured capacitance values ​​from the electrode plate to the lower end of the RF rod for multiple times, The step of determining the connection status of the RF rod and the RF electrode based on the measured capacitance value further includes: in response to the measured capacitance values ​​collected multiple times being greater than or equal to the capacitance threshold, determining that the RF rod is tightly connected to the RF electrode; and in response to the measured capacitance values ​​collected multiple times being less than the capacitance threshold, determining that the RF rod is detached from the RF electrode.

4. The detection method according to claim 3, characterized in that The step of determining the connection state between the RF rod and the RF electrode according to the measured capacitance value further includes: In response to at least one of the measured capacitance values ​​collected multiple times being greater than or equal to the capacitance threshold, and at least another of the measured capacitance values ​​collected multiple times being less than the capacitance threshold, adding a counterweight block to the lower end of the RF rod to pull the RF rod away from the heating plate, and collecting the measured capacitance value from the electrode plate to the lower end of the RF rod again; In response to the re-collected measured capacitance value being greater than or equal to the capacitance threshold, determining that the RF rod is firmly connected to the RF electrode; and In response to the re-collected measured capacitance value being less than the capacitance threshold, it is determined that the contact between the RF rod and the RF electrode is poor.

5. The detection method according to claim 4, characterized in that: The step of again collecting the measured capacitance value from the electrode plate to the lower end of the radio frequency rod comprises: recollecting the measured capacitance value from the electrode plate to the lower end of the radio frequency rod for multiple times, The step of determining that the RF rod is firmly connected to the RF electrode in response to the measured capacitance value collected again being greater than or equal to the capacitance threshold comprises: determining that the RF rod is firmly connected to the RF electrode in response to the measured capacitance values ​​collected again for multiple times being greater than or equal to the capacitance threshold, The step of determining that the contact between the RF rod and the RF electrode is poor in response to the measured capacitance value collected again being less than the capacitance threshold includes: determining that the contact between the RF rod and the RF electrode is poor in response to at least one of the measured capacitance values ​​collected again multiple times being less than the capacitance threshold.

6. The detection method according to claim 4, characterized in that: The RF rod extends in the handle of the heating plate, and the handle is connected to the mounting support of the heating plate via a mounting assembly. The step of connecting one end of the capacitance tester to the electrode plate and the other end thereof to the lower end of the RF rod comprises: clamping the first clamp of the capacitance tester to the electrode plate; and Insert the first end of the extension strap made of conductive material into the detection hole of the mounting assembly to connect the lower end of the radio frequency rod, and clamp the second clamp of the capacitance tester to the second end of the extension strap.

7. The detection method according to claim 6, characterized in that The step of adding a counterweight block at the lower end of the RF rod to pull the RF rod in a direction away from the heating plate comprises: The counterweight is connected to the second threaded portion of the second end of the extension strap via the first threaded portion of the counterweight to pull the RF rod downward.

8. A device for detecting the state of a radio frequency rod, characterized in that: include: an electrode plate, the lower surface of which fully contacts the upper surface of a heating plate of a thin film deposition device; as well as A capacitance tester, one end of which is connected to the electrode plate and the other end of which is connected to the lower end of a radio frequency rod, is used to detect the measured capacitance value from the electrode plate to the lower end of the radio frequency rod to determine the connection status between the radio frequency rod and the radio frequency electrode, wherein the radio frequency rod is made of conductive material and its upper end is connected to the radio frequency electrode in the heating plate.

9. A thin film deposition method, characterized in that: The following steps are involved: Before performing thin film deposition on the wafer, the connection state between the radio frequency rod of the thin film deposition equipment and the radio frequency electrode in the heating plate is detected by the detection device as claimed in claim 8; In response to a detection result that the RF rod is tightly connected to the RF electrode, allowing the thin film deposition to be performed; as well as In response to the detection result that the RF rod is separated from the RF electrode or the contact between the two is poor, a corresponding alarm signal is output, and / or the execution of the thin film deposition is prevented.

10. The thin film deposition method according to claim 9, characterized in that: The RF rod provides RF voltage to the RF electrode during the thin film deposition process to cooperate with another RF electrode of the thin film deposition device to form an in-situ plasma in the process chamber of the thin film deposition device, and / or During the thin film deposition process, the RF rod provides an AC voltage to the RF electrode to electrostatically adsorb the wafer via the heating plate.

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