Method for manufacturing optical structure, optical structure, display panel and display device

Abstract

The application provides a preparation method of an optical structure, the optical structure, a display panel and a display device, relates to the technical field of optics, and can realize the following effects: without surface treatment of the optical structure layer by adopting etching and other processes, low preparation difficulty, low requirement on preparation precision, high preparation efficiency, and improved preparation quality of the optical structure. The preparation method of the optical structure comprises the following steps: arranging a first optical material layer on one side of a substrate, wherein the first optical material layer comprises a first sub-optical material layer and a second sub-optical material layer, the first sub-optical material layer is located on the side, away from the substrate, of the second sub-optical material layer, the thermal expansion coefficient of the first sub-optical material layer is different from the thermal expansion coefficient of the second sub-optical material layer, the surface, away from the substrate, of the first optical material layer is subjected to heating treatment, and a second optical material layer is obtained, wherein the surface, away from the substrate, of the second optical material layer comprises a concave-convex surface, and the substrate and the second optical material layer are peeled off.

Description

Technical Field

[0001] This application relates to the field of optical technology, and in particular to methods for fabricating optical structures, optical structures, display panels, and display devices. Background Technology

[0002] With the development of new energy technologies and intelligent vehicle driving technologies, the trend of larger and more multi-screen in-vehicle displays is becoming increasingly apparent. Therefore, the requirements for the light output and display effect of display panels are gradually increasing. In existing display panels, an optical structure layer is usually set on the light-emitting side of the emissive layer. This optical structure alters the light path emitted from the emissive layer, thereby increasing the light output at the front viewing angle and improving the display effect.

[0003] However, in traditional optical structure fabrication methods, surface treatment of the optical structure layer is usually required by processes such as etching, which makes the fabrication difficult, requires high precision, and has low efficiency, thus affecting the fabrication quality of the optical structure. Summary of the Invention

[0004] Therefore, it is necessary to provide a method for fabricating an optical structure, an optical structure, a display panel, and a display device to address the aforementioned technical problems. This method eliminates the need for surface treatment of the optical structure layer using processes such as etching, reduces fabrication difficulty, lowers the requirements for fabrication precision, and increases fabrication efficiency, thereby improving the fabrication quality of the optical structure.

[0005] A first aspect of this application provides a method for fabricating an optical structure, comprising:

[0006] A first optical material layer is disposed on one side of a substrate, wherein the first optical material layer includes a first sub-optical material layer and a second sub-optical material layer, the first sub-optical material layer is located on the side of the second sub-optical material layer away from the substrate, and the coefficient of thermal expansion of the first sub-optical material layer is different from that of the second sub-optical material layer;

[0007] The surface of the first optical material layer away from the substrate is heated to obtain a second optical material layer, wherein the surface of the second optical material layer away from the substrate includes an uneven surface;

[0008] The substrate and the second optical material layer are peeled off.

[0009] In one embodiment, the provision of a first optical material layer on one side of the substrate includes:

[0010] An initial optical material layer is disposed on one side of the substrate;

[0011] The initial optical material layer is subjected to ion beam etching to obtain the first optical material layer.

[0012] In one embodiment, the material of the initial optical material layer includes photoresist.

[0013] In one embodiment, when the material of the initial optical material layer includes photoresist, the provision of the initial optical material layer on one side of the substrate includes:

[0014] The photoresist is spin-coated onto one side of the substrate;

[0015] The initial optical material layer is obtained by curing the photoresist with ultraviolet light.

[0016] In one embodiment, prior to the step of forming the first optical material layer on one side of the substrate, the method further includes:

[0017] Provide the initial base;

[0018] The initial substrate is processed to make the hydrophobicity of the substrate greater than that of the initial substrate.

[0019] In one embodiment, the initial substrate is treated with octadecyltrichlorosilane vapor to obtain the substrate.

[0020] In one embodiment, the heating treatment of the surface of the first optical material layer away from the substrate includes:

[0021] The surface of the first optical material layer away from the substrate is subjected to high-temperature annealing treatment, wherein the annealing temperature is 80℃~120℃.

[0022] A second aspect of this application provides an optical structure, including:

[0023] The optical structure is prepared by the optical structure preparation method described in any one of the first aspects above.

[0024] A third aspect of this application provides a display panel, including:

[0025] Substrate;

[0026] A light-emitting layer is located on one side of the substrate;

[0027] An optical structure is prepared by the method for preparing an optical structure according to any one of claims 1 to 7, wherein the optical structure is located on the side of the light-emitting layer away from the substrate.

[0028] A fourth aspect of this application provides a display device, comprising:

[0029] The display panel described in the third aspect.

[0030] The optical structure fabrication method, optical structure, display panel, and display device provided in this application embodiment involve depositing a first optical material layer on one side of a substrate. This first optical material layer includes a first sub-optical material layer and a second sub-optical material layer. The first sub-optical material layer is located on the side of the second sub-optical material layer away from the substrate. The thermal expansion coefficients of the first and second sub-optical material layers are different. The second optical material layer is obtained by heating the surface of the first optical material layer on the side away from the substrate. This surface of the second optical material layer on the side away from the substrate includes an uneven surface. By utilizing the difference in thermal expansion coefficients between the first and second sub-optical material layers, heating the surface of the first optical material layer on the side away from the substrate causes the first sub-optical material layer to deform, while the shape of the second sub-optical material layer remains unchanged. This allows the surface of the second optical material layer on the side away from the substrate to form a randomly shaped uneven surface, facilitating light scattering on one side of the uneven surface when light exits through the optical structure, thereby improving the optical structure's ability to regulate light. Therefore, the processing procedure for the surface of the optical structure can be simplified. By changing the thermal expansion coefficient of the first sub-optical material layer, the heating temperature and heating time during the heating process, the shape of the concave and convex surface of the optical structure can be adjusted, reducing the difficulty of preparation and the requirements for preparation accuracy, improving preparation efficiency, and further improving the preparation quality of the optical structure. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 A schematic flowchart illustrating a method for fabricating an optical structure according to an embodiment of this application;

[0033] Figure 2 A schematic structural diagram obtained in step S12 of a method for fabricating an optical structure according to an embodiment of this application;

[0034] Figure 3 A schematic structural diagram obtained in step S13 of a method for fabricating an optical structure according to an embodiment of this application;

[0035] Figure 4 A schematic flowchart of steps S121 to S122 in a method for fabricating an optical structure provided in an embodiment of this application;

[0036] Figure 5 A schematic structural diagram obtained in steps S121 to S122 of a method for fabricating an optical structure according to an embodiment of this application;

[0037] Figure 6 A schematic flowchart of steps S1211 to S1212 in a method for fabricating an optical structure according to an embodiment of this application;

[0038] Figure 7 A schematic flowchart of steps S111 to S112 in a method for fabricating an optical structure according to an embodiment of this application;

[0039] Figure 8 A schematic structural diagram of an optical structure provided in this application embodiment;

[0040] Figure 9 A schematic structural diagram of a display panel provided in an embodiment of this application;

[0041] Figure 10 This is a schematic structural diagram of a display device provided in an embodiment of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] 1000, Display panel; 10, Substrate; 20, First optical material layer; 201, First sub-optical material layer; 202, Second sub-optical material layer; 203, Initial optical material layer; 30, Second optical material layer; 40, Substrate; 50, Light-emitting layer; 60, Optical structure. Detailed Implementation

[0044] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0046] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this invention, the first element, component, region, layer, doping type, or portion discussed below may be represented as a second element, component, region, layer, or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.

[0047] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0048] When used herein, the singular forms of “a,” “an,” and “ / the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “including / contains” or “having,” etc., specify the presence of the stated features, wholes, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0049] With the development of new energy technologies and intelligent vehicle driving technologies, the trend of larger and more multi-screen in-vehicle displays is becoming increasingly apparent. Therefore, the requirements for the light output and display effect of display panels are gradually increasing. In existing display panels, an optical structure layer is usually set on the light-emitting side of the emissive layer. This optical structure alters the light path emitted from the emissive layer, thereby increasing the light output at the front viewing angle and improving the display effect.

[0050] However, in traditional optical structure fabrication methods, surface treatment of the optical structure layer is usually required by processes such as etching, which makes the fabrication difficult, requires high precision, and has low efficiency, thus affecting the fabrication quality of the optical structure.

[0051] like Figure 1 As shown in the figure, this application provides a method for fabricating an optical structure, including:

[0052] S12: A first optical material layer is disposed on one side of the substrate, wherein the first optical material layer includes a first sub-optical material layer and a second sub-optical material layer, the first sub-optical material layer is located on the side of the second sub-optical material layer away from the substrate, and the thermal expansion coefficient of the first sub-optical material layer is different from that of the second sub-optical material layer.

[0053] For example, please refer to Figure 2 The substrate 10 may include, but is not limited to, a glass substrate.

[0054] S13: The surface of the first optical material layer away from the substrate is heated to obtain a second optical material layer, wherein the surface of the second optical material layer away from the substrate includes an uneven surface.

[0055] For example, please refer to 3. The first sub-optical material layer 201 and the second sub-optical material layer 202 have different coefficients of thermal expansion. When the first optical material is heated in the future, the expansion degree of the first sub-optical material layer 201 at the same temperature is different from that of the second sub-optical material layer 202, so that the surface of the first sub-optical material layer 201 becomes an uneven surface, thereby obtaining the second optical material layer 30.

[0056] For example, given that the coefficient of thermal expansion of the first optical material layer is determined, the uneven surface morphology of the obtained second optical material layer can be adjusted by changing the heating time and heating temperature of the first optical material layer.

[0057] S14: Peel off the substrate and the second optical material layer.

[0058] For example, physical or chemical methods can be used to peel off the substrate 10 and the second optical material layer 30.

[0059] The method for fabricating an optical structure provided in this application involves depositing a first optical material layer 20 on one side of a substrate 10. The first optical material layer 20 includes a first sub-optical material layer 201 and a second sub-optical material layer 202. The first sub-optical material layer 201 is located on the side of the second sub-optical material layer 202 away from the substrate 10. The coefficient of thermal expansion of the first sub-optical material layer 201 is different from that of the second sub-optical material layer 202. The second optical material layer 202 is obtained by heating the surface of the first optical material layer 20 away from the substrate 10. The surface of the second optical material layer 202 on the side away from the substrate 10 includes an uneven surface. By utilizing the difference in thermal expansion coefficients between the first sub-optical material layer 201 and the second sub-optical material layer 202, when the surface of the first optical material layer 20 away from the substrate 10 is heated, the first sub-optical material layer 201 deforms upon heating, while the shape of the second sub-optical material layer 202 remains unchanged. This allows the surface of the second optical material layer 20 away from the substrate 10 to form a randomly shaped uneven surface, facilitating light scattering on one side when light exits through the optical structure 60, thereby improving the optical structure's ability to regulate light. Therefore, the surface processing procedure of the optical structure 60 can be simplified. By changing the thermal expansion coefficient of the first sub-optical material layer 201, the heating temperature, and the heating time, the shape of the uneven surface of the optical structure 60 can be adjusted, reducing the fabrication difficulty and the requirements for fabrication precision, improving fabrication efficiency, and further enhancing the fabrication quality of the optical structure.

[0060] like Figure 4 As shown, in some embodiments, a first optical material layer is disposed on one side of the substrate, including:

[0061] S121: An initial optical material layer is provided on one side of the substrate.

[0062] For example, the material of the initial optical material layer 203 can be determined according to the refractive index of the optical structure in the actual application scenario to meet different application requirements.

[0063] For example, please refer to Figure 5An initial optical material layer 203 may be formed on one side of the substrate 10 using, but not limited to, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), or atomic layer deposition (ALD).

[0064] S122: Ion beam etching is performed on the initial optical material layer to obtain the first optical material layer.

[0065] For example, the thickness of the first optical material layer 20 at different locations can be changed by ion beam etching to further adjust the shape of the uneven surface.

[0066] For example, please continue reading Figure 2 The thermal expansion coefficients of the first sub-optical material layer 201 and the second sub-optical material layer 202 can be modified using, but not limited to, ion beam etching processes, so that the thermal expansion coefficients of the first sub-optical material layer 201 and the second sub-optical material layer 202 are different. Specifically, an argon ion beam can be used to modify the first sub-optical material layer 201 and the second sub-optical material layer 202, and the beam current density and energy of the argon ion beam can be adjusted according to the modification time of the first sub-optical material layer 201 and the second sub-optical material layer 202.

[0067] The method for fabricating the optical structure provided in this application provides initial materials for fabricating the optical structure 60 by setting an initial optical material layer 203 on one side of the substrate 10. The initial material can be selected based on the light emission characteristics of the actual device to provide a high-quality display effect. The initial optical material layer 203 is then subjected to ion beam etching to obtain a first optical material layer 20. Ion beam etching of the first optical material layer 20 yields first optical material layers 20 with different internal coefficients of thermal expansion. Furthermore, it ensures that the refractive indices of the first and second sub-optical material layers are the same, preventing further light refraction at the interface between the first and second sub-optical material layers, thereby improving the light adjustment capability of the optical structure.

[0068] Please continue reading. Figure 5 In some embodiments, the material of the initial optical material layer 203 includes photoresist.

[0069] For example, the material of the initial optical material layer 203 includes photoresist. Photoresist has good light transmission properties. Using photoresist as the initial optical material will not affect the light transmission properties of the optical structure 60. In addition, photoresist has good light-concentrating properties and flexibility, which can make the optical structure 60 concentrate light while making it easier to peel off from the substrate 10 in the future.

[0070] The optical structure fabrication method provided in this application embodiment, by setting the initial optical material layer 203 to a photoresist material, allows for the peeling of the fabricated optical structure 60 from the substrate 10 without loss of emitted light, utilizing the flexibility of the photoresist material, without damaging the optical structure 60. Furthermore, the photoresist can change its internal expansion coefficient during ion beam etching, thereby altering the surface shape of the first sub-optical material layer upon heating to form an uneven surface, further simplifying the optical structure fabrication method.

[0071] Please see Figure 6 In some embodiments, when the material of the initial optical material layer includes photoresist, the initial optical material layer is disposed on one side of the substrate, including:

[0072] S1211: Spin-coat photoresist on one side of the substrate.

[0073] S1212: The initial optical material layer is obtained by curing the photoresist with ultraviolet light.

[0074] For example, please continue reading Figure 5 Photoresist can be spin-coated on one side of the substrate 10 using photoresist coating and developing equipment, but not limited to photoresist coating equipment. The thickness of the spin-coated photoresist can be controlled according to the actual situation. Specific embodiments of this application do not impose specific limitations.

[0075] For example, please continue reading Figure 5 The photoresist can be cured by exposing it to ultraviolet light to maintain the surface shape of the cured photoresist. The exposure time of the spin-coated photoresist under ultraviolet light can be adjusted according to the actual situation to adjust the hardness of the cured photoresist.

[0076] The method for fabricating the optical structure provided in this application embodiment includes a photoresist as the material of the initial optical material layer 203. By spin-coating the photoresist to one side of the substrate 10, the original material of the initial optical material layer 203 can be provided. Then, by curing the photoresist with ultraviolet light, the spin-coated photoresist can be cured to maintain the surface shape of the cured photoresist.

[0077] Please see Figure 7 In some embodiments, prior to the step of depositing the first optical material layer on one side of the substrate, the method further includes:

[0078] S111: Provides the initial base.

[0079] S112: The initial substrate is treated to make the hydrophobicity of the substrate greater than that of the initial substrate.

[0080] It should be noted that hydrophobicity is the physical property of hydrophobic materials repelling water. The hydrophobic properties of the substrate 10 are an important factor affecting the peeling of optical structures. Poor hydrophobic properties of the initial substrate 10 will affect the peeling effect after the optical structure 60 is formed, causing damage to the formed optical structure 60 during peeling.

[0081] The method for fabricating an optical structure provided in this application embodiment can improve the hydrophobicity of the initial substrate 10 by processing it, thereby making the initial substrate 10 have better hydrophobic properties. This facilitates the subsequent peeling of the optical structure 60 from the substrate 10 after the optical structure 60 is formed, thereby improving the integrity of the optical structure, accelerating the peeling of the optical structure, and improving the fabrication efficiency of the optical structure.

[0082] In some embodiments, please continue reading Figure 2 The initial substrate 10 was treated with octadecyltrichlorosilane vapor to obtain substrate 10.

[0083] For example, the modification time of the initial substrate 10 by octadecyltrichlorosilane vapor can be controlled according to the actual situation. The modification time of the initial substrate 10 by octadecyltrichlorosilane vapor can be 2 hours to 6 hours. For example, the modification time of the initial substrate 10 by octadecyltrichlorosilane vapor can be 2 hours, 3 hours, 4 hours, 5 hours or 6 hours. Specifically, in this embodiment, the modification time of the initial substrate 10 by octadecyltrichlorosilane vapor is 4 hours.

[0084] The optical material preparation method provided in this application embodiment treats the initial substrate 10 with octadecyltrichlorosilane vapor to improve the hydrophobic properties of the surface of the initial substrate 10. The modification time of the initial substrate 10 by octadecyltrichlorosilane vapor can be controlled according to the actual situation to flexibly change the hydrophobic properties of the substrate 10 so that the hydrophobic properties of the substrate 10 are within the range most suitable for phase separation from the optical structure 60.

[0085] Please see Figures 2 to 3 In some embodiments, the surface of the first optical material layer 20 away from the substrate 10 is subjected to heat treatment, including: high-temperature annealing treatment of the surface of the first optical material layer 20 away from the substrate 10, wherein the annealing temperature is 80°C to 120°C.

[0086] For example, the annealing temperature for high-temperature annealing of the surface of the first optical material layer 20 away from the substrate 10 can be 80°C to 120°C. For instance, the annealing temperature for high-temperature annealing of the surface of the first optical material layer 20 away from the substrate 10 can be 80°C, 90°C, 100°C, 110°C or 120°C.

[0087] The optical material preparation method provided in this application involves high-temperature annealing of the surface of the first optical material layer 20 away from the substrate 10. Due to the difference in thermal expansion coefficients between the surface and interior of the first optical material, the high-temperature annealing process causes the volume of the first optical material layer to expand, forming a concave-convex structure. This allows for the formation of a concave-convex surface on the surface of the first optical material layer. Consequently, when the optical device emits light, the concave-convex surface of the first optical material layer 20 can improve the light extraction efficiency, reduce the fabrication difficulty of the optical structure, increase fabrication efficiency, improve the fabrication quality of the optical structure, and enhance the optical structure's ability to regulate light.

[0088] Please see Figure 8 This application also provides an optical structure 60, comprising: an optical structure 60 prepared by any of the optical structure preparation methods described in the above embodiments.

[0089] The optical structure 60 provided in this application embodiment comprises a first optical material layer 20 disposed on one side of a substrate 10. The first optical material layer 20 includes a first sub-optical material layer 201 and a second sub-optical material layer 202. The first sub-optical material layer 201 is located on the side of the second sub-optical material layer 202 away from the substrate 10. The thermal expansion coefficients of the first sub-optical material layer 201 and the second sub-optical material layer 202 are different. By utilizing the thermal expansion coefficients of the first and second sub-optical material layers 201, the heating effect of the first sub-optical material layer 201 can be controlled. Under these conditions, an uneven surface is formed on the substrate 10 to form a material that changes the light emission angle of the device. Then, the surface of the first optical material layer 20 away from the substrate 10 is heated to obtain the second optical material layer 30. The surface of the second optical material layer 30 away from the substrate 10 includes an uneven surface. The uneven surface can change the light emission angle of the device, thereby increasing the light emission rate of the device. Finally, the substrate 10 and the second optical material layer 30 are peeled off to obtain an optical structure 60 that improves the light emission rate of the device. Placing the obtained structure on the light emission surface of the device can improve the display quality of the device.

[0090] Please see Figure 9This application also provides a display panel, including: a substrate 40, a light-emitting layer 50 and an optical structure 60. The light-emitting layer 50 is located on one side of the substrate 40, and the optical structure 60 is prepared by the optical structure 60 preparation method of any of the above embodiments. The optical structure 60 is located on the side of the light-emitting layer 50 away from the substrate 40.

[0091] For example, the display panel may include an organic light-emitting display panel or a liquid crystal display panel. The light-emitting layer 50 may include an organic light-emitting layer or a liquid crystal layer and a light-emitting substrate.

[0092] Exemplarily, the substrate 40 may include, but is not limited to, at least one of a silicon substrate, a gallium nitride substrate, a silicon carbide substrate, a sapphire substrate, a silicon-on-insulator substrate, a silicon-on-diamond substrate, and a strain-layer silicon substrate deposited on a germanium-silicon wafer; in this embodiment, the substrate is a silicon substrate. The substrate is the foundation of the display panel, and the substrate can provide a robust and stable support platform for the entire display structure.

[0093] The display panel in this embodiment includes a substrate 40, a light-emitting layer 50, and an optical structure 60. Utilizing the difference in thermal expansion coefficients between the first sub-optical material layer 201 and the second sub-optical material layer 202 within the optical structure 60, when the surface of the first optical material layer 20 away from the substrate 10 is heated, the first sub-optical material layer 201 deforms, while the shape of the second sub-optical material layer 202 remains unchanged. This allows the surface of the second optical material layer 20 away from the substrate 10 to form a randomly shaped uneven surface, facilitating light scattering on one side of the uneven surface when light exits through the optical structure 60, thereby improving the optical structure's ability to regulate light. Therefore, the surface processing of the optical structure 60 can be simplified. By changing the thermal expansion coefficient of the first sub-optical material layer 201, the heating temperature, and the heating time, the shape of the uneven surface of the optical structure 60 can be adjusted, reducing the fabrication difficulty and precision requirements, improving fabrication efficiency, and further enhancing the fabrication quality of the optical structure. Furthermore, the optical structure 60 is located on the side of the light-emitting layer 50 away from the substrate 40, which allows the light emitted from the light-emitting layer 50 to exit after passing through the optical structure 60. Therefore, when the light emitted from the light-emitting layer 50 enters the optical structure 60, the uneven surface of the optical structure 60 provides an initial angle for the emitted light, which can further adjust the emission angle of the light, increase the amount of light emitted, and further increase the light output of the display panel, thereby improving the display performance and display effect of the display panel.

[0094] like Figure 10 As shown in the figure, this application embodiment also provides a display device, including: the display panel 1000 in the above embodiment.

[0095] The display device in this embodiment of the application provides an optical structure 60 in the display panel 1000. Utilizing the difference in thermal expansion coefficients between the first sub-optical material layer 201 and the second sub-optical material layer 202, when the surface of the first optical material layer 20 away from the substrate 10 is heated, the first sub-optical material layer 201 deforms, while the shape of the second sub-optical material layer 202 remains unchanged. This allows the surface of the second optical material layer 20 away from the substrate 10 to form a randomly shaped uneven surface, facilitating light scattering on one side of the uneven surface when light exits through the optical structure 60, thereby improving the optical structure's ability to regulate light. Therefore, the processing procedure for the surface of the optical structure 60 can be simplified. By changing the thermal expansion coefficient of the first sub-optical material layer 201, the heating temperature during the heating process, and the heating time, the shape of the uneven surface of the optical structure 60 can be adjusted, reducing the difficulty of fabrication and the requirements for fabrication precision, improving fabrication efficiency, and further improving the fabrication quality of the optical structure.

[0096] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0097] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0098] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for fabricating an optical structure, characterized in that, include: Provide the initial base; The initial substrate is processed to obtain a substrate; The hydrophobicity of the substrate is greater than that of the initial substrate; A first optical material layer is disposed on one side of a substrate, wherein the first optical material layer includes a first sub-optical material layer and a second sub-optical material layer, the first sub-optical material layer is located on the side of the second sub-optical material layer away from the substrate, the thermal expansion coefficient of the first sub-optical material layer is different from that of the second sub-optical material layer, and the refractive index of the first sub-optical material layer and the second sub-optical material layer is the same; The surface of the first optical material layer away from the substrate is subjected to high-temperature annealing to obtain a second optical material layer, wherein the surface of the second optical material layer away from the substrate includes an uneven surface; the annealing temperature is 80℃~120℃; The substrate and the second optical material layer are peeled off.

2. The method for fabricating the optical structure according to claim 1, characterized in that, The provision of a first optical material layer on one side of the substrate includes: An initial optical material layer is disposed on one side of the substrate; The initial optical material layer is subjected to ion beam etching to obtain the first optical material layer.

3. The method for fabricating the optical structure according to claim 2, characterized in that, The material of the initial optical material layer includes photoresist.

4. The method for fabricating the optical structure according to claim 3, characterized in that, When the material of the initial optical material layer includes photoresist, the provision of the initial optical material layer on one side of the substrate includes: The photoresist is spin-coated onto one side of the substrate; The initial optical material layer is obtained by curing the photoresist with ultraviolet light.

5. The method for fabricating the optical structure according to claim 1, characterized in that, The substrate is obtained by treating the initial substrate with octadecyltrichlorosilane vapor.

6. An optical structure, characterized in that, include: The optical structure is prepared by the method described in any one of claims 1 to 5.

7. A display panel, characterized in that, include: Substrate; A light-emitting layer is located on one side of the substrate; An optical structure is prepared by the method for preparing an optical structure according to any one of claims 1 to 5, wherein the optical structure is located on the side of the light-emitting layer away from the substrate.

8. A display device, characterized in that, include: The display panel according to claim 7.

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