Adjustable computer heat dissipation device and heat dissipation method

Abstract

The invention relates to an adjustable computer heat dissipation device and a heat dissipation method.The adjustable computer heat dissipation device comprises a computer mainframe box, a heat dissipation module, an adjusting module and a controller, the heat dissipation module is fixedly connected with an installation assembly, the heat dissipation module comprises fan blades and cooling fins, the fan blades are electrically connected with a driving part, and the driving part is connected with the installation assembly; the adjusting module comprises a replacement plate, a heat dissipation cavity is formed in the replacement plate, a plurality of air flow pipelines are installed in the heat dissipation cavity, the outer side walls of the air flow pipelines are sleeved with deformable rings, energy storage cavities are formed between the air flow pipelines and the deformable rings, and through holes are formed in one ends of the air flow pipelines; the controller is in signal connection with a monitoring assembly, and the controller adjusts the power of the driving part according to real-time temperature data monitored by the monitoring assembly. Compared with the prior art, the detachable and adjustable design enables the heat dissipation equipment to easily adapt to computer mainframe boxes of different models and specifications, and the heat dissipation performance can be automatically adjusted according to temperature and wind speed data monitored in real time.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to an adjustable computer heat dissipation device and a heat dissipation method. Background Art

[0002] With the rapid development of computer technology, the performance of computer hardware has been continuously improved. As a result, the density of electronic components inside the computer mainframe is getting higher and higher, and the power consumption is also increasing sharply. This trend has led to the temperature problem inside the mainframe becoming increasingly prominent, and heat dissipation has become a key factor in ensuring the stable operation of the computer.

[0003] Traditional heat dissipation devices, such as fixed fans and heat sinks, can alleviate the temperature problem inside the computer chassis to a certain extent, but their heat dissipation efficiency is often limited and their adaptability is poor. Especially in the field of high-performance computers and servers, since these devices need to run at high loads for a long time, heat dissipation has become one of the key factors restricting their performance and stable operation.

[0004] For example, the invention with publication number CN107291183A discloses a special heat dissipation chassis for computer hardware, including a main chassis, an upper surface wall of the main chassis is inlaid with a first heat dissipation screen, and a right surface wall of the main chassis is inlaid with a second heat dissipation screen, a computer hardware mainboard arranged inside the main chassis is fixedly connected to the main chassis via a mainboard fixing groove, and the computer hardware mainboard and the heat sink are fixedly connected via a heat conducting plate, a small fan motor is fixedly installed on the front surface wall inside the main chassis, and the small fan motor is fixedly connected to the small fan blades, a fan motor group is fixedly installed on the left side of the heat sink, and the main shaft of the fan motor group is fixedly connected to the main shaft of the fan group, and an air outlet net is arranged on the main chassis on the right side of the heat sink.

[0005] In addition, different models of computer mainframes have differences in size, structure and heat dissipation requirements, which puts higher requirements on the design of heat dissipation equipment. An ideal heat dissipation device should have good versatility and flexibility, and be able to adapt to different models of mainframes to meet various heat dissipation requirements. However, most of the heat dissipation devices on the current market adopt a fixed design, which is difficult to meet the heat dissipation requirements of different models of mainframes. This results in users having to purchase specific heat dissipation devices for different models of mainframes, which not only increases the cost of use, but also brings inconvenience to users' installation and use.

[0006] In addition, traditional cooling equipment also has shortcomings in terms of energy consumption. Due to changes in cooling requirements, traditional equipment is often unable to dynamically adjust its working state according to real-time cooling requirements, resulting in excessive energy consumption. This not only wastes energy, but also increases users' operating costs. Summary of the invention

[0007] The purpose of the present invention is to provide an adjustable computer heat dissipation device and heat dissipation method in order to overcome the problem that the prior art cannot dynamically adjust the working state according to the real-time heat dissipation demand of the computer, resulting in excessive energy consumption.

[0008] The purpose of the present invention can be achieved by the following technical solutions: This program provides An adjustable computer heat dissipation device comprises a chassis, a heat dissipation module and an adjustment module, wherein the heat dissipation module is detachably mounted on one end of the chassis and is used to discharge heat in the chassis; the adjustment module comprises a replacement plate, an air flow duct and an elastic ring, wherein the air flow duct is an hourglass-shaped structure, the replacement plate is detachably mounted on the chassis, a heat dissipation chamber is arranged in the replacement plate, the heat dissipation chamber is divided into a plurality of exhaust chambers by the elastic ring, and each exhaust chamber is connected to the outside of the heat dissipation chamber; The airflow duct is installed in the heat dissipation chamber, one end of the heat dissipation chamber is connected to the inside of the chassis, and the other end is connected to the outside of the chassis, and the elastic ring is enclosed on the outside of the airflow duct; the inner wall of the elastic ring and the outer wall of the airflow duct enclose an energy storage chamber, and a through hole is provided on the side wall of the airflow duct at one end close to the chassis, and the energy storage chamber is connected to the airflow duct through the through hole.

[0009] Preferably, the heat dissipation module comprises a mounting assembly, a motor, fan blades and a heat sink; The mounting assembly is detachably mounted on one end of the chassis, the motor is fixed on a side of the mounting assembly close to the inside of the chassis, the fan blade drive is connected to the motor, the heat sink is connected to the heat dissipation structure, and is arranged in front of the fan blade away from the motor.

[0010] Preferably, the mounting assembly comprises a mounting plate, a connecting rod and an adjusting member; The mounting plate is fixed on the chassis, the adjusting member is rotatably fixed on the mounting plate, a sliding groove is provided on one side of the mounting plate close to the inside of the chassis, the connecting rod is slidably arranged in the sliding groove, one end of the connecting rod drives the connecting adjusting member, and the other end abuts against the inner wall of the chassis; There are multiple slide grooves and connecting rods, each of which is distributed in a circular array around the adjusting member, adjacent slide grooves are perpendicular to each other, each connecting rod is evenly distributed in the slide grooves, and one end of each connecting rod away from the adjusting member is located at the four corners of the same square.

[0011] Preferably, the adjusting member comprises a handle, a gear, a rack and a locking rod; The rack is mounted on one end of the connecting rod, the gear is rotatably fixed on the mounting plate, the gear is meshed with the rack, one end of the handle is fixed on the gear and is suitable for driving the gear to rotate, the other end of the handle is connected to the locking rod, the mounting plate is provided with a socket, and the locking rod is movably inserted in the socket; There are multiple sockets, each of which is distributed along the movement track of the locking rod, and the central axes of the locking rod and the sockets are parallel to each other.

[0012] Preferably, the connecting rod is an L-shaped structure, comprising a driving rod and a mounting rod vertically connected to each other, the driving rod is located in the slide groove, the mounting rod is perpendicular to the plane where the mounting plate is located, and a suction cup is installed on the mounting rod; A boss is provided at one end of the mounting rod contacting the chassis. The boss includes a first end face and a second end face perpendicular to each other. The first end face of the boss on the mounting rod and the second end face of the boss on the adjacent mounting rod are located in the same plane.

[0013] Preferably, the diameter of the air flow duct gradually decreases from the air inlet to the through hole, and gradually increases from the through hole to the air outlet; There are multiple airflow ducts, each of which is distributed on the replacement plate in a rectangular array. The replacement plate is also provided with multiple bolt holes, and each of the bolt holes is evenly distributed around the replacement plate.

[0014] Preferably, the surfaces of the heat sink and the air flow duct are provided with a micro-nano self-cleaning coating, which is suitable for absorbing and decomposing dust particles in the air flow.

[0015] Preferably, the device further comprises a controller and a monitoring component, wherein the controller is respectively connected to the motor and the monitoring component by signals, and the monitoring component is used to measure the real-time temperature inside the chassis and the real-time wind speed in the air flow duct.

[0016] Preferably, the controller signal is connected to an early warning module and a remote monitoring module, the early warning module includes a buzzer and an indicator light, the remote monitoring module includes a mobile device, and the mobile device is wirelessly connected to the controller; The adjustment module further comprises a power piece, the power piece is connected to the controller, and the power piece is used to adjust the shape of the elastic ring.

[0017] The solution also provides an adjustable computer heat dissipation method, comprising the following steps: The real-time temperature inside the chassis and the real-time wind speed of the airflow duct are obtained; when the real-time temperature inside the chassis is greater than the temperature threshold, the heat dissipation efficiency of the heat dissipation module is improved; otherwise, the heat dissipation efficiency of the heat dissipation module is reduced; when the deviation between the real-time wind speed and the ideal wind speed is greater than the preset threshold, the shape of the elastic ring is adjusted until the deviation between the real-time wind speed and the ideal wind speed is less than the preset threshold.

[0018] Compared with the prior art, the present invention has the following beneficial effects: 1. In this solution, the heat dissipation device exchanges heat with the components in the chassis, and the exchanged heat is discharged to the outside of the chassis through the air duct along with the airflow, thereby dissipating heat for the computer. When the temperature inside the chassis rises, the elastic ring deforms due to the heat, pushing the air in the energy storage chamber into the air duct through the through hole, increasing the pressure difference at both ends of the air duct, accelerating the air flow in the air duct, and improving the heat dissipation effect of the heat dissipation module.

[0019] By installing the replacement plate on one side of the chassis as the side wall of the chassis, and setting an air duct connecting the inside and outside of the chassis on the replacement plate, when the temperature inside the chassis rises, the elastic ring compresses the energy storage chamber to send air to the air inlet end of the air duct, accelerating the air flow in the air duct, thereby improving the heat dissipation effect of the chassis. By utilizing the influence of the volume of the energy storage chamber due to temperature changes, the adjustment module can adjust the heat dissipation loading according to the real-time heat dissipation demand, thereby improving the heat dissipation efficiency and response speed of the heat dissipation device.

[0020] 2. Compared with the fixed heat dissipation equipment in the prior art, this solution greatly improves the versatility and flexibility of the heat dissipation equipment by designing a detachable connection between the heat dissipation module and the computer mainframe case, and the adaptability of the installation components to different models of computer mainframe cases. Users can easily install or replace the heat dissipation module according to actual needs and the model of the computer mainframe case, without having to purchase specific heat dissipation equipment for different models of computer mainframe cases, thereby reducing the cost of use.

[0021] 3. Compared with the existing cooling devices that lack intelligent control, this solution realizes real-time monitoring of the internal temperature of the computer mainframe and intelligent adjustment of the drive power through the coordinated work of the controller and the monitoring component. This intelligent control strategy can not only accurately adjust the working state of the cooling module according to the temperature data to avoid excessive or insufficient cooling, but also reduce energy consumption while ensuring the cooling effect, achieving green energy saving.

[0022] 4. Compared with the heat dissipation equipment with complex structures in the prior art, this solution reduces unnecessary components and complex connection structures through a simple and efficient design, thereby reducing the manufacturing and maintenance costs of the heat dissipation equipment. At the same time, the design of the deformable ring and the energy storage chamber also enhances the reliability and durability of the heat dissipation equipment, so that the equipment can maintain good heat dissipation performance during long-term use. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 An isometric view of an embodiment of an automatically controllable computer heat dissipation device of the present invention; Figure 2A cross-sectional view of a computer mainframe case in an embodiment of the computer heat dissipation device that can be automatically controlled according to the present invention; Figure 3 An isometric view of the installation components of the embodiment of the computer heat dissipation device that can be automatically controlled according to the present invention; Figure 4 A rear view of the installation components of the embodiment of the computer heat dissipation device that can be automatically controlled according to the present invention; Figure 5 It is a schematic diagram of the installation components and the heat dissipation module installation of the embodiment of the computer heat dissipation device that can be automatically controlled in the present invention; Figure 6 A rear view of the installation components and the heat dissipation module in the embodiment of the computer heat dissipation device that can be automatically controlled according to the present invention; Figure 7 A cross-sectional view of a replacement block in an embodiment of an automatically controllable computer heat dissipation device of the present invention; Figure 8 for Figure 7 A magnified schematic diagram of center A.

[0024] The figure marks in the drawings of the specification include: 1, chassis; 2, fan blades; 3, motor; 4, replacement plate; 41, heat dissipation chamber; 5, airflow duct; 6, elastic ring; 7, energy storage chamber; 8, through hole; 9, exhaust chamber; 10, mounting plate; 11, slide groove; 12, connecting rod; 121, driving rod; 122, mounting rod; 13, rack; 14, handle; 15, gear; 16, locking rod; 17, socket; 18, bolt hole. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0028] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0029] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0031] Example 1 As attached Figures 1 to 8 As shown: an automatically controllable computer heat dissipation device, including a chassis 1 and a heat dissipation module and an adjustment module detachably connected to the chassis 1, the heat dissipation module is used to discharge the heat generated inside the chassis 1, the adjustment module is used to dynamically adjust the working state of the heat dissipation module according to the heat dissipation demand, the heat dissipation module is fixedly connected with a mounting assembly, the mounting assembly is used to adjust the size according to different models of chassis 1, and the heat dissipation module is installed inside the chassis 1. Through the design of the mounting assembly, the heat dissipation module can flexibly adapt to different models of chassis 1, thereby improving the versatility and practicality of the device of the present invention. The heat dissipation module includes a fan blade 2 and a heat sink, and the fan blade 2 is electrically connected to a driving member, and the driving member is a motor 3 in this embodiment. The driving member is fixedly connected to the mounting assembly, and the heat sink is located in front of the fan blade 2 away from the driving member. The fan blade 2 and the heat sink are reasonably designed and can effectively discharge the heat inside the chassis 1. That is, when the airflow passes through the heat sink, the heat sink absorbs the heat inside the chassis 1 and transfers it to the airflow, thereby realizing heat exchange. The airflow after heat exchange is discharged from the chassis 1 through the airflow duct 5 to achieve the purpose of heat dissipation.

[0032] The mounting assembly includes a mounting plate 10, on which a plurality of slide grooves 11 are provided. In the present embodiment, there are four slide grooves 11, which extend toward the four corners of the mounting plate 10. Connecting rods 12 are slidably fitted in the slide grooves 11. The connecting rods 12 are L-shaped structures, including a driving rod 121 and a mounting rod 122 vertically connected to each other. The driving rod 121 is located in the slide groove 11 and is welded with a rack 13. The mounting rod 122 is perpendicular to the plane where the mounting plate 10 is located, and a plurality of suction cups are installed on the mounting rod 122. A handle 14 is rotatably fitted on the mounting plate 10. One end of the handle 14 passes through the mounting plate 10 and is coaxially fixedly connected with a gear 15. The gear 15 is meshed with the rack 13. A locking member for fixing the handle 14 is installed on the handle 14. The design of the locking member ensures that the handle 14 can be firmly fixed after being adjusted into place to prevent accidental movement. The locking member includes a locking rod 16 , which is slidably matched with an end of the handle 14 away from the gear 15 , and a plurality of insertion holes 17 matching the locking rod 16 are provided on the mounting plate 10 .

[0033] The adjustment module includes a replacement plate 4, in which a heat dissipation chamber 41 is provided. The heat dissipation chamber 41 is installed with a plurality of airflow ducts 5. The outer wall of the airflow duct 5 is sleeved with an elastic ring 6 made of a metal sheet. An energy storage chamber 7 is formed between the outer wall of the airflow duct 5 and the inner wall of the elastic ring 6. The airflow duct 5 connects the inside of the computer main chassis with the outside. A through hole 8 is provided at one end of the airflow duct 5. The airflow duct 5 is connected with the energy storage chamber 7 through the through hole 8. The remaining area of ​​the heat dissipation chamber 41 is divided into an exhaust chamber 9 by the elastic ring 6. The exhaust chamber 9 is connected with the outside of the heat dissipation chamber 41. The cross section of the airflow duct 5 is hourglass-shaped. A plurality of bolt holes 18 are provided on the replacement plate 4. The bolt holes 18 are evenly distributed around the replacement plate 4. In addition to their own functions, the jacks 17 on the mounting plate 10 and the bolt holes 18 on the replacement plate 4 can also play a role in ventilation and heat dissipation to a certain extent.

[0034] Among them, the hourglass-shaped airflow duct design can generate a pressure difference inside the duct by reducing the cross-sectional area of ​​the duct, thereby achieving effective control of the flow rate. This design helps to ensure the stable flow of air in the duct and avoid the situation where the flow rate is too fast or too slow. At the same time, the hourglass-shaped transition section can gradually reduce or increase the cross-sectional area of ​​the duct, making the pressure change of the airflow in the duct more stable, reducing the energy loss and noise caused by sudden pressure changes.

[0035] Moreover, the design of the hourglass-shaped airflow duct helps to increase the turbulence of the airflow in the duct, thereby improving the heat exchange efficiency. Turbulence can increase the contact area and contact time between the airflow and the heat sink, so that the heat can be transferred to the airflow and removed more quickly. In addition, the hourglass-shaped duct can also better utilize the Coanda effect principle, by adjusting the shape of the duct to guide the direction and speed of the airflow, so that the airflow can pass through the heat sink more effectively and remove the heat.

[0036] Furthermore, the design of the bolt holes allows the replacement plate to be securely connected to the computer mainframe case by bolts. Since the bolt holes are evenly distributed around the replacement plate, users can select appropriate bolt hole positions for installation according to actual needs, thereby improving installation flexibility. At the same time, the evenly distributed bolt holes can ensure that the replacement plate is evenly stressed during installation, avoiding deformation or damage caused by uneven stress and improving the stability of the installation. The bolt hole design can be applied to a variety of different models of computer mainframe cases. This design enhances the versatility and interchangeability of the heat dissipation module, allowing users to share replacement plates between different devices and reducing the cost of spare parts.

[0037] The driver signal is connected to the controller, and the controller signal is connected to the monitoring component. The monitoring component includes a temperature sensor, which is used to monitor the temperature inside the chassis 1 in real time and send the temperature data to the controller. The controller adjusts the power of the driver according to the real-time temperature data monitored by the monitoring component, thereby realizing intelligent control of the heat dissipation effect. This intelligent adjustment method not only improves the heat dissipation efficiency, but also reduces energy consumption.

[0038] The specific implementation process is as follows: when in use, the outer shells originally fixed by screws on the left and right sides (i.e., the air inlet side and the air outlet side) of the chassis 1 are removed to make room for the installation of the heat dissipation module and the adjustment module. The heat dissipation module is installed inside the chassis 1 through the installation assembly. During the installation process, the handle 14 on the mounting plate 10 is first rotated, and the rotation of the handle 14 will drive the gear 15 coaxially fixedly connected thereto to rotate together. The gear 15 drives the gear rack 13 meshing therewith to move, and the gear rack 13 drives the connecting rod 12 to slide in the slide groove 11. Because the connecting rod 12 is an L-shaped structure, the end of the connecting rod 12 away from the slide groove 11 will gradually fit the inner wall of the chassis 1 as it slides in the slide groove 11, and the suction cup on the connecting rod 12 is used to fix the connecting rod 12 to the inner wall of the chassis 1. After fixing, the locking rod 16 on the handle 14 is pushed, and the locking rod 16 is inserted into the socket 17 on the mounting plate 10 to fix the handle 14, ensuring that the handle 14 can be firmly fixed after being adjusted into place to prevent accidental movement.

[0039] In this embodiment, the installation component can flexibly adjust the position of the connecting rod according to the internal structure and size of different types of computer mainframes through the sliding cooperation between the slide and the connecting rod, and the meshing transmission between the rack and the gear. This design not only improves the installation flexibility of the heat dissipation module, but also enables it to adapt to more types of computer mainframes, enhancing the versatility and market competitiveness of the heat dissipation equipment. The user only needs to rotate the handle to drive the gear to rotate and drive the rack and the connecting rod to slide along the slide, so as to quickly adjust the position of the suction cup. This mechanical adjustment method is easy to operate and does not require complicated tools or steps, which greatly reduces the installation difficulty and time cost of the user. At the same time, the setting of the locking piece ensures that the handle can be firmly fixed in the desired position after the adjustment is completed, preventing position changes due to accidental touch or vibration, and improving the user experience.

[0040] Among them, the sliding cooperation between the locking rod and the handle, as well as the design of the socket on the mounting plate, allow the user to easily fix the handle in the desired position by simply sliding the locking rod into the corresponding socket. This operation method is not only simple and quick, but also avoids the handle from loosening or falling off due to improper fixation, improving the safety and stability of operation. When the locking rod is inserted into the socket, it can effectively prevent the handle from rotating due to accidental touch, vibration or external force, thereby ensuring that the connecting rod remains in the set position, enhancing the stability and reliability of the heat dissipation module installation. This design enables the heat dissipation module to maintain a stable heat dissipation effect in various complex environments, ensuring the normal operation of the computer main chassis.

[0041] After the installation of the heat dissipation module is completed, the replacement plate 4 in the adjustment module needs to be installed on both sides of the chassis 1. The replacement plate 4 has a number of bolt holes 18 evenly distributed, and these bolt holes 18 match the corresponding screw holes on the chassis 1. Therefore, the replacement plate 4 can be firmly installed on the chassis 1 with the outer shell removed by bolts, and can flexibly adapt to different models of chassis 1.

[0042] After installation, the heat dissipation device enters working state. The temperature inside the chassis 1 is monitored in real time by the temperature sensor on the monitoring component, and the real-time monitored temperature data is transmitted to the controller, which compares and analyzes the real-time temperature data with the preset temperature threshold in real time.

[0043] If the real-time temperature data is greater than the preset temperature threshold, it means that the temperature inside the chassis 1 is too high, and the heat dissipation module needs to be started for heat dissipation. At this time, the controller will start the motor 3 in the heat dissipation module, and the motor 3 will drive the fan blades 2 to rotate, and the rotation of the fan blades 2 will generate airflow. These airflows will pass through the heat sink, and the heat sink will absorb the heat inside the chassis 1 and transfer it to the airflow, thereby realizing heat exchange. The airflow after heat exchange will be discharged from the chassis 1 through the airflow duct 5 to achieve the purpose of heat dissipation. During the entire heat dissipation process, the controller will intelligently adjust the power of the motor 3 according to the temperature data monitored in real time by the temperature sensor. When the temperature is high, the controller will increase the power of the motor 3 to improve the heat dissipation efficiency; when the temperature gradually decreases, the controller will reduce the power of the motor 3 to reduce energy consumption. This intelligent adjustment method not only improves the heat dissipation efficiency but also reduces energy consumption, making the heat dissipation equipment more energy-saving and environmentally friendly.

[0044] When the temperature in the chassis 1 continues to rise due to the increase in operating time and operating load, and reaches the deformation temperature of the metal sheet (40°C), the attached Figure 3 As shown in the direction indicated by the arrow, the elastic ring 6 in the air flow duct 5 of the replacement plate 4 will be deformed. The deformation of the elastic ring 6 will generate pressure on the original air in the energy storage chamber 7, so that the air in the energy storage chamber 7 is discharged into the air flow duct 5 through the through hole 8. As the air in the energy storage chamber 7 is discharged, according to the Coanda effect principle, the air outside the chassis 1 is sucked into the inside of the chassis 1, and the air flow inside the chassis 1 is accelerated, so that the hot air inside the chassis 1 is discharged.

[0045] When the temperature in the airflow duct 5 drops below the temperature threshold (such as 35°C) at which the elastic ring 6 returns to its original state, the elastic ring 6 will return to its original state. At this time, if the temperature inside the chassis 1 rises again and reaches the temperature threshold at which the metal sheet deforms, the elastic ring 6 will deform again and repeat the above heat dissipation process. In this way, the heat dissipation device can continuously dissipate heat inside the chassis 1 to ensure stable operation of the computer.

[0046] Embodiment 2: This embodiment is basically the same as embodiment 1, except that the device further includes an intelligent early warning module, which includes a buzzer and an indicator light. The indicator light is used to flash and emit light of different colors to indicate different early warning reminders. For example, when the temperature inside the chassis 1 is lower than the safety threshold and has not risen, the indicator light may be always on with a green light. When the temperature inside the chassis 1 is slightly higher but has not yet reached a dangerous level, the indicator light may flash with a yellow light to remind the user to pay attention to the heat dissipation. When the temperature rises abnormally and exceeds the preset safety threshold, the indicator light will switch to a red light and flash quickly, indicating that the situation is urgent and immediate measures need to be taken. The buzzer is used to emit different alarm sounds. For example, when the temperature is slightly higher, the buzzer may emit a soft prompt tone, and when the temperature rises abnormally, it will emit a rapid and harsh alarm sound to attract the user's attention.

[0047] The indicator light and buzzer are both connected to the controller signal; when the monitoring component detects that the temperature inside the chassis 1 is abnormal, and the abnormal value exceeds the preset safety threshold, the intelligent early warning module will immediately trigger an alarm, the indicator light will switch to red light and flash rapidly, and the buzzer will also emit a rapid alarm sound. At the same time, the controller will automatically adjust the power of the drive components in the heat dissipation module to increase the heat dissipation efficiency and reduce the temperature inside the chassis 1 to a safe range as soon as possible.

[0048] The specific implementation process is as follows: After installing the heat dissipation equipment and the adjustment module, connect the intelligent early warning module to the controller. Set a preset safety threshold to ensure that when the temperature rises abnormally, the intelligent early warning module can trigger an alarm in time.

[0049] The monitoring component starts to monitor the temperature inside the chassis 1 in real time and sends the temperature data to the controller. When the controller receives the temperature data, it will compare and analyze it with the preset safety threshold in real time. If the temperature data exceeds the preset safety threshold, the controller will immediately send a signal to the intelligent early warning module to trigger an alarm. The indicator light of the intelligent early warning module switches to red light and flashes rapidly, and the buzzer emits a rapid alarm sound. At the same time, the controller automatically adjusts the power of the drive components in the heat dissipation module to increase the heat dissipation efficiency.

[0050] After hearing the alarm and seeing the indicator light flashing, the user should immediately check the heat dissipation of chassis 1 and take necessary measures to ensure the normal operation of the equipment.

[0051] Embodiment 3: This embodiment is basically the same as the embodiment 2, except that the adjustment module further includes a power member for adjusting the airflow duct 5, the power member is connected to the controller signal, and the controller controls the power member according to the temperature and wind speed data monitored in real time by the monitoring component, and dynamically adjusts the shape of the elastic ring 6 of the airflow duct 5 through the power member, thereby changing the cross-sectional area and airflow path of the airflow duct 5. In this embodiment, the power member is an electric cylinder, and the shape of the elastic ring 6 is adjusted by the telescopic movement of the electric cylinder.

[0052] The monitoring component also includes a wind speed sensor, which is respectively arranged on the airflow duct 5 of the replacement plate 4 on the air inlet side and the air outlet side, and is used to monitor the actual wind speed at the corresponding position in real time and send the wind speed data to the controller. When the wind speed sensor detects that the deviation between the actual wind speed on the air inlet side or the air outlet side and the ideal wind speed is greater than a preset threshold, the controller adjusts the shape of the elastic ring 6 through the power part until the deviation between the actual wind speed detected by the wind speed sensor and the ideal wind speed is less than the threshold; at the same time, the controller also comprehensively judges and adjusts the power part according to the data of the temperature sensor.

[0053] The specific implementation process is as follows: the wind speed sensor in the monitoring component monitors the wind speed on the air inlet and air outlet sides in real time, and transmits the real-time monitored wind speed data to the controller, which compares and analyzes the real-time wind speed data with the preset wind speed threshold in real time. If the real-time wind speed data is less than the preset wind speed threshold, the controller sends a start command to the electric cylinder to control the electric cylinder to perform telescopic movement.

[0054] The telescopic movement of the electric cylinder will cause the elastic ring 6 in the airflow duct 5 of the replacement plate 4 to deform. The deformation of the elastic ring 6 will generate pressure on the original air in the energy storage chamber 7, so that the air in the energy storage chamber 7 is discharged into the airflow duct 5 through the through hole 8. As the air in the energy storage chamber 7 is discharged, according to the Coanda effect principle, the air outside the chassis 1 will be sucked into the airflow duct 5, thereby accelerating the air flow speed inside the chassis 1. In this way, not only can the hot air inside the chassis 1 be discharged more effectively, but also the cross-sectional area and airflow path of the airflow duct 5 can be adjusted, so that the actual wind speed gradually approaches the ideal wind speed.

[0055] The controller continuously monitors the temperature and wind speed data and adjusts the electric cylinder according to the actual situation. When the temperature drops to a safe range and the deviation between the actual wind speed and the ideal wind speed is less than the preset threshold, the controller stops adjusting the electric cylinder and maintains the current heat dissipation efficiency.

[0056] The regulating component of the airflow duct dynamically adjusts the shape of the deformable ring of the airflow duct through the power parts, so that the cross-sectional area and airflow path of the airflow duct can be changed in real time. This design enables the cooling system to flexibly adjust the airflow according to the real-time monitored temperature and wind speed data to maximize the cooling efficiency. When the wind speed sensor detects that the actual wind speed on the air inlet or outlet side deviates from the ideal wind speed, the controller can quickly adjust the shape of the deformable ring through the power parts until the deviation between the actual wind speed and the ideal wind speed is less than the preset threshold. This precise wind speed control helps to optimize the heat dissipation performance and ensure that the cooling system is always in the best working state. The controller also comprehensively considers the data of the temperature sensor. By comprehensively judging the changing trends of temperature and wind speed, the controller can more accurately predict the heat dissipation demand and adjust the power parts in advance to avoid overheating or insufficient wind speed in the system and improve the overall stability of the system.

[0057] Embodiment 4: The present embodiment is substantially the same as Example 3, except that the device also includes a self-cleaning module, and the self-cleaning module includes a micro-nano self-cleaning coating, and the coating adopts nanotechnology, and has unique super-hydrophobicity and super-lipophilicity. When dust particles in the air contact the coating surface, they will be adsorbed and fixed by the coating. Subsequently, under the effect of sunlight, ultraviolet rays or other external energy, the active ingredient in the coating will begin to decompose these dust particles, particularly organic matter therein, and eventually convert them into harmless substances. This process not only reduces the accumulation of dust in the heat dissipation channel, but also keeps the surface of the heat sink and the air flow duct 5 clean, thereby improving the heat dissipation efficiency, and the micro-nano self-cleaning coating is all covered on the surface of the heat sink and the air flow duct 5, and the micro-nano self-cleaning coating is used to adsorb and decompose dust particles in the air, reduce the risk of heat dissipation channel blockage, and maintain heat dissipation efficiency.

[0058] At the same time, the controller automatically starts a reverse blowing mode according to a preset time interval or accumulated running time, using the airflow generated by the fan reversal to flush the surface of the heat sink and the air duct 5 for auxiliary cleaning, thereby extending the service life of the heat dissipation equipment and reducing maintenance costs.

[0059] The specific implementation process is as follows: the controller monitors the operating status of the heat dissipation module in real time, including parameters such as temperature and wind speed. When the preset reverse blowing mode start condition is met, the controller automatically enters the preparation stage.

[0060] The controller sends a reverse command to the fan, and the fan starts to reverse and generate reverse airflow. The reverse airflow flushes the surface of the heat sink and the airflow duct 5 to flush away the attached dust particles. During the flushing process, the micro-nano self-cleaning coating continues to exert its self-cleaning function to decompose the residual organic matter.

[0061] After the reverse blowing mode ends, the controller can evaluate the cleaning effect by monitoring parameters such as heat dissipation efficiency and wind speed. If the cleaning effect is not good, the controller can adjust the start frequency or duration of the reverse blowing mode. The controller can issue maintenance reminders to users based on the use of the self-cleaning module, suggesting manual cleaning or replacement of the micro-nano self-cleaning coating, etc.

[0062] Embodiment 5: This embodiment is basically the same as Embodiment 4, except that the device also includes a remote monitoring module, which is used for the user to remotely view the real-time data of the temperature inside the chassis 1 and the fan speed through a mobile phone APP or computer software, and remotely adjust the working power of the cooling module.

[0063] The specific implementation process is as follows: Connect the cooling device to the Internet to ensure normal operation. Register and log in to the user account in the mobile phone APP or computer software, and add the cooling device to the monitoring list. Through the mobile phone APP or computer software, the user can view the temperature and fan speed data inside the chassis 1 in real time. The software interface should clearly display the current data and provide a historical data query function so that users can analyze the cooling trend.

[0064] Based on the real-time data, the user can remotely adjust the working power of the cooling module in the mobile phone APP or computer software. The adjusted power setting should take effect immediately and be reflected in the real-time data. When the temperature or fan speed is abnormal, the remote monitoring module should automatically trigger an alarm and send a notification to the user through the mobile phone APP or computer software. The user can take timely measures based on the alarm information to ensure the safe operation of the chassis 1.

[0065] Users can learn about the cooling status of chassis 1 in real time through mobile phone APP or computer software without having to go to the site in person. The remote monitoring module supports historical data query, which helps users analyze cooling trends and formulate corresponding maintenance plans. When the cooling equipment is abnormal, the remote monitoring module can quickly trigger an alarm and notify the user to avoid potential safety hazards. Users can adjust the cooling power remotely to avoid damage or failure caused by overheating of the equipment. The remote monitoring module reduces users' reliance on on-site monitoring and reduces maintenance costs. Users can remotely adjust the cooling power based on real-time data to avoid unnecessary energy waste.

[0066] The preferred specific embodiments of the present invention are described in detail above. It should be understood that a person skilled in the art can make many modifications and changes based on the concept of the present invention without creative work. Therefore, any technical solution that can be obtained by a person skilled in the art through logical analysis, reasoning or limited experiments based on the concept of the present invention on the basis of the prior art should be within the scope of protection determined by the claims.

Claims

1. An adjustable computer cooling device, characterized in that: The invention comprises a chassis (1), a heat dissipation module and an adjustment module, wherein the heat dissipation module is detachably mounted on one end of the chassis (1) and is used to discharge heat from the chassis (1); the adjustment module comprises a replacement plate (4), an airflow duct (5) and an elastic ring (6), wherein the airflow duct (5) is an hourglass-shaped structure, the replacement plate (4) is detachably mounted on the chassis (1), a heat dissipation chamber (41) is provided in the replacement plate (4), the heat dissipation chamber (41) is divided into a plurality of exhaust chambers (9) by the elastic ring (6), and each exhaust chamber (9) is connected to the outside of the heat dissipation chamber (41); The wind duct (5) is installed in the heat dissipation chamber (41); one end of the heat dissipation chamber (41) is connected to the inside of the chassis (1), and the other end is connected to the outside of the chassis (1); the elastic ring (6) is surrounded on the outside of the wind duct (5); the inner wall of the elastic ring (6) and the outer wall of the wind duct (5) form an energy storage chamber (7); a through hole (8) is provided on the side wall of the wind duct (5) at one end close to the chassis (1); and the energy storage chamber (7) is connected to the wind duct (5) through the through hole (8).

2. The adjustable computer cooling device according to claim 1, characterized in that: The heat dissipation module comprises a mounting assembly, a motor (3), fan blades (2) and a heat sink; The mounting assembly is detachably mounted on one end of the chassis (1); the motor (3) is fixed to a side of the mounting assembly close to the inside of the chassis (1); the fan blade (2) is drivingly connected to the motor (3); and the heat sink is connected to the heat dissipation structure and is arranged in front of a side of the fan blade (2) away from the motor (3).

3. The adjustable computer cooling device according to claim 2, characterized in that: The mounting assembly comprises a mounting plate (10), a connecting rod (12) and an adjusting member; The mounting plate (10) is fixed on the chassis (1), the adjusting member is rotatably fixed on the mounting plate (10), a slide groove (11) is provided on one side of the mounting plate (10) close to the inside of the chassis (1), the connecting rod (12) is slidably arranged in the slide groove (11), one end of the connecting rod (12) drives the connecting adjusting member, and the other end abuts against the inner wall of the chassis (1); The number of the slide grooves (11) and the connecting rods (12) are both multiple, the slide grooves (11) are distributed in a circular array around the adjusting member, adjacent slide grooves (11) are perpendicular to each other, the connecting rods (12) are evenly distributed in the slide grooves (11), and the ends of the connecting rods (12) away from the adjusting member are respectively located at the four corners of the same square.

4. The adjustable computer cooling device according to claim 3, characterized in that: The adjusting member comprises a handle (14), a gear (15), a rack (13) and a locking rod (16); The rack (13) is mounted on one end of the connecting rod (12); the gear (15) is rotatably fixed on the mounting plate (10); the gear (15) is meshed with the rack (13); one end of the handle (14) is fixed on the gear (15) and is suitable for driving the gear (15) to rotate; the other end of the handle (14) is connected to a locking rod (16); a socket (17) is provided on the mounting plate (10); and the locking rod (16) is movably inserted into the socket (17); There are a plurality of the insertion holes (17), each of which is distributed along the movement trajectory of the locking rod (16), and the central axes of the locking rod (16) and the insertion holes (17) are parallel to each other.

5. The adjustable computer cooling device according to claim 4, characterized in that: The connecting rod (12) is an L-shaped structure, comprising a driving rod (121) and a mounting rod (122) which are vertically connected to each other, the driving rod (121) is located in the slide groove (11), the mounting rod (122) is perpendicular to the plane where the mounting plate (10) is located, and a suction cup is installed on the mounting rod (122); One end of the mounting rod (122) contacting the chassis (1) is provided with a boss, the boss comprising a first end face and a second end face perpendicular to each other, the first end face of the boss on the mounting rod and the second end face of the boss on the adjacent mounting rod being located in the same plane.

6. The adjustable computer cooling device according to claim 1, characterized in that: The diameter of the air flow duct (5) gradually decreases from the air inlet to the through hole (8), and gradually increases from the through hole (8) to the air outlet; The number of the air flow ducts (5) is multiple, and the air flow ducts (5) are distributed on the replacement plate (4) in a rectangular array. The replacement plate (4) is also provided with multiple bolt holes (18), and the bolt holes (18) are evenly distributed around the replacement plate (4).

7. The adjustable computer cooling device according to claim 2, characterized in that: The surfaces of the heat sink and the air flow duct (5) are both provided with a micro-nano self-cleaning coating suitable for absorbing and decomposing dust particles in the air flow.

8. The adjustable computer cooling device according to claim 1, characterized in that: The device also includes a controller and a monitoring component, wherein the controller is signal-connected to the motor (3) and the monitoring component respectively, and the monitoring component is used to measure the real-time temperature inside the chassis (1) and the real-time wind speed in the wind duct (5).

9. The adjustable computer cooling device according to claim 8, characterized in that: The controller signal is connected to an early warning module and a remote monitoring module, the early warning module includes a buzzer and an indicator light, and the remote monitoring module includes a mobile device, and the mobile device is wirelessly connected to the controller; The adjustment module further comprises a power piece, the power piece is connected to the controller, and the power piece is used to adjust the shape of the elastic ring (6).

10. A heat dissipation method for an adjustable computer heat dissipation device according to any one of claims 1 to 9, characterized in that: The following steps are involved: Acquiring the real-time temperature inside the chassis (1) and the real-time wind speed of the airflow duct; when the real-time temperature inside the chassis (1) is greater than a temperature threshold, improving the heat dissipation efficiency of the heat dissipation module; On the contrary, the heat dissipation efficiency of the heat dissipation module is reduced; when the deviation between the real-time wind speed and the ideal wind speed is greater than the preset threshold, the shape of the elastic ring is adjusted until the deviation between the real-time wind speed and the ideal wind speed is less than the preset threshold.

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