Wiring substrate, back sheet, and light emitting device

Abstract

The wiring substrate, the back plate and the light emitting device provided by the present disclosure comprise: a substrate; a plurality of connection electrode regions arranged in an array on the substrate; and a plurality of touch electrodes, the orthographic projection of the plurality of touch electrodes on the substrate and the orthographic projection of the plurality of connection electrode regions on the substrate do not overlap.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular, to a wiring substrate, a backplane and a light emitting device. BACKGROUND

[0002] Mini / Micro LED (Mini / Micro Light Emitting Diode) mainly uses microfabrication technology to miniaturize, array and thin film traditional LED chips, and then uses massive transfer technology to transfer the LED crystal thin film to the driving backplane in batches, uses physical deposition to manufacture a protective layer, and finally completes packaging.

[0003] Mini LED backlight is a backlight source including dozens of LED lamp beads on the side of a display screen, which is replaced by a direct backlight source including thousands of, tens of thousands of or even more Mini LED lamp beads; each pixel of a Micro LED display screen can be addressed and individually driven to light up, and can be regarded as a self-luminous LED display screen without backlight with a pixel pitch of microns. Compared with the already mass-produced LCD technology and OLED technology, Mini / Micro LED has very superior performance advantages in various technical dimensions, such as long service life, high contrast, high resolution, fast response speed, wider viewing angle effect, rich color, ultra-high brightness and lower power consumption, etc. SUMMARY

[0004] The embodiments of the present disclosure provide a wiring substrate, a backplane and a light emitting device to realize display and touch integration.

[0005] Therefore, the wiring substrate provided by the embodiments of the present disclosure comprises:

[0006] a substrate substrate;

[0007] a plurality of connection electrode regions arranged in an array on the substrate substrate;

[0008] a plurality of touch electrodes, a projection of the plurality of touch electrodes on the substrate substrate and a projection of the plurality of connection electrode regions on the substrate substrate do not overlap each other.

[0009] In some embodiments, in the wiring substrate provided by the embodiments of the present disclosure, part of the touch electrodes and the plurality of connection electrode regions are arranged in the same layer.

[0010] In some embodiments, in the wiring substrate provided by the embodiments of the present disclosure, a plurality of first signal lines arranged in the same layer as the part of the touch electrodes are further included, and the part of the touch electrodes are arranged at gaps of the first signal lines.

[0011] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located;

[0012] The remaining touch electrodes are arranged in the same layer as the plurality of second signal lines, and the remaining touch electrodes are located in the gaps between the second signal lines.

[0013] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of data signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located; the remaining touch electrodes are multiplexed with the plurality of data signal lines.

[0014] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located;

[0015] The remaining touch electrodes are located on a side of the layer where the multiple connection electrode regions are located away from the base substrate, and the orthographic projections of the remaining touch electrodes on the base substrate coincide with the orthographic projections of the second signal lines on the base substrate.

[0016] In some embodiments, the wiring substrate provided in the embodiments of the present disclosure further includes a plurality of first signal lines disposed on the same layer as the plurality of connection electrode areas, and a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located;

[0017] Some of the touch electrodes and the remaining touch electrodes are cross-arranged in different layers on a side of the layer where the multiple connection electrode areas are located, away from the base substrate, and one of the orthographic projections of some of the touch electrodes on the base substrate and the orthographic projections of the remaining touch electrodes on the base substrate coincides with the orthographic projections of the multiple first signal lines on the base substrate, and the other coincides with the orthographic projections of the multiple second signal lines on the base substrate.

[0018] In some embodiments, in the above-mentioned wiring substrate provided by the embodiments of the present disclosure, the multiple touch electrodes include multiple touch drive electrodes and multiple touch sensing electrodes, and the layer where the multiple touch sensing electrodes are located is located on a side of the layer where the multiple touch drive electrodes are located away from the base substrate.

[0019] In some embodiments, in the above-mentioned wiring substrate provided by the embodiments of the present disclosure, at least one of the touch driving electrodes and the touch sensing electrodes has a grid structure.

[0020] In some embodiments, in the wiring substrate provided by the embodiments of the present disclosure, the line width of the grid structure is 2 μm to 5 μm, and the line spacing is 150 μm to 600 μm.

[0021] In some embodiments, in the wiring substrate provided by the embodiments of the present disclosure, the substrate is a transparent substrate.

[0022] Based on the same inventive concept, the embodiments of the present disclosure provide a backplane comprising the wiring substrate provided by the embodiments of the present disclosure and a plurality of element groups, the plurality of element groups being electrically connected to the plurality of connection electrode regions.

[0023] Based on the same inventive concept, the embodiments of the present disclosure provide a light emitting device comprising the backplane provided by the embodiments of the present disclosure, the element group comprising at least one light emitting element, and the connection electrode region comprising at least one connection electrode group, the at least one light emitting element being connected to the at least one connection electrode group.

[0024] The present disclosure has the following advantages:

[0025] The wiring substrate, the backplane and the light emitting device provided by the embodiments of the present disclosure comprise a substrate, a plurality of connection electrode regions arranged in an array on the substrate, and a plurality of touch electrodes, the orthographic projection of the plurality of touch electrodes on the substrate and the orthographic projection of the plurality of connection electrode regions on the substrate do not overlap. In the wiring substrate provided by the embodiments of the present disclosure, the connection electrode regions can be connected to the light emitting elements to realize display function, and the touch electrodes can realize touch function, thereby realizing display and touch integration. In addition, since the orthographic projection of the touch electrodes on the substrate and the orthographic projection of the connection electrode regions on the substrate do not overlap, the touch function and the display function do not affect each other. Furthermore, compared with the scheme of realizing touch function by externally mounting a touch module, the scheme of realizing touch function by integrating touch electrodes in the wiring substrate provided by the present disclosure has lower cost. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A structural schematic diagram of the backplane provided by the embodiments of the present disclosure;

[0027] Figure 2 A cross-sectional view along line A-A' in FIG. 1; Figure 1

[0028] A structural schematic diagram of the touch electrode in FIG. 1; Figure 3 Figure 1 A structural schematic diagram of the light emitting functional layer in FIG. 1;

[0029] Figure 4 Figure 1 A structural schematic diagram of the light emitting functional layer in FIG. 1;

[0030] Figure 5a A structural schematic diagram of the light emitting functional layer in FIG. 1; Figure 4 ​​A magnified structural diagram of the middle Z1 region;

[0031] Figure 5b for Figure 5a Alternative structural diagrams of the structures shown;

[0032] Figure 6 for Figure 5b A magnified structural diagram of the middle Z2 region;

[0033] Figure 7 For the Figure 6 Cross-section of line BB';

[0034] Figure 8 for Figure 1 Working timing diagram of data signal line;

[0035] Figure 9 A schematic structural diagram of a wiring substrate provided in an embodiment of the present disclosure;

[0036] Figure 10 For the Figure 9 Cross-section of line C-C';

[0037] Figure 11 for Figure 9 Schematic diagram of the structure of the touch electrode;

[0038] Figure 12 A schematic diagram of another structure of a wiring substrate provided in an embodiment of the present disclosure;

[0039] Figure 13 For the Figure 11 Cross-section of line D-D';

[0040] Figure 14 for Figure 12 Schematic diagram of the structure of the touch electrode;

[0041] Figure 15 A schematic diagram of another structure of a wiring substrate provided in an embodiment of the present disclosure;

[0042] Figure 16 For the Figure 15 Sectional view along line E-E';

[0043] Figure 17 for Figure 15 Schematic diagram of the structure of the touch electrode;

[0044] Figure 18 A schematic diagram of another structure of a wiring substrate provided in an embodiment of the present disclosure;

[0045] Figure 19 For the Figure 18 Cross-sectional view along line F-F';

[0046] Figure 20 for Figure 18 Schematic diagram of the structure of the touch electrode. DETAILED DESCRIPTION

[0047] To further clarify the objectives, technical solutions, and advantages of the embodiments of the present disclosure, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present disclosure. It should be noted that in the drawings, the thicknesses of layers, films, panels, regions, etc. are exaggerated for clarity. In this disclosure, exemplary embodiments are described with reference to cross-sectional views that are schematic representations of idealized embodiments. As such, deviations from the shapes shown in the drawings are to be expected, for example, as a result of manufacturing techniques and / or tolerances. Therefore, the embodiments described in this disclosure should not be construed as limited to the specific shapes of the regions shown in this disclosure, but rather include deviations in shape resulting from, for example, manufacturing. For example, a region illustrated or described as flat may typically have rough and / or nonlinear features; a sharp angle illustrated may be rounded, etc. Therefore, the regions shown in the drawings are schematic in nature, and their sizes and shapes are not intended to illustrate the precise shapes of the regions or reflect true scale, but are intended solely to illustrate the present disclosure. Throughout, identical or similar reference numerals denote identical or similar elements or elements having identical or similar functions. In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed descriptions of known functions and known components.

[0048] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the present disclosure belongs. The words "first", "second" and similar terms used in the present disclosure and the claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Inside", "outside", "upper", "lower" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0049] In the following description, when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on the other element or layer, or be indirectly on the other element or layer with intervening elements or layers. When an element or layer is referred to as being "set on" one side of another element or layer, it can be directly on the side of the other element or layer, be directly connected to the other element or layer, or there can be intervening elements or layers. However, when an element or layer is referred to as being "directly on" another element or layer, or "directly connected to" another element or layer, there are no intervening elements or layers. The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] In the LCD display process, the emitted light of the backlight source passes through the polarizer and the color filter in turn, and a large amount of energy is lost in the display process. Compared with the LCD display, the power consumption of the Mini / Micro LED can be reduced by about 10% by using the structure of three primary color subpixels self-emitting light. The Mini / Micro LED uses inorganic material to emit light, and the OLED uses organic material to emit light. Compared with the OLED, the Mini / Micro LED has lower light-emitting power consumption. Moreover, unlike the OLED using organic material, the Mini / Micro LED uses gallium nitride (GaN) material in the light-emitting part, which can provide brightness significantly better than the OLED. In the Mini / Micro LED display product, each Mini / Micro LED is a pixel (Pixel) capable of self-emitting light, and at the same time, a single Mini / Micro LED is in the micron level, so it can achieve very high resolution. In the related art, the pixel density of the Mini / Micro LED display screen can be more than 1500 PPI, while the PPI of the LCD and OLED screens is about 800 PPI and 400 PPI.

[0051] Based on the above advantages, the Mini / Micro LED display will become the next generation display after the LCD display and the OLED display, and has a wide application prospect. However, in the related Mini / Micro LED display product, the touch function is realized by using the external touch module, which has the disadvantages of high cost, low light transmittance, and thick product as a whole.

[0052] In order to at least solve the above technical problems existing in the related art, the embodiments of the present disclosure provide a wiring substrate, as shown in Figures 1 to 4 The wiring substrate includes:

[0053] a substrate 101;

[0054] A plurality of connection electrode regions 102 are arranged in an array on the base substrate 101; optionally, the connection electrode regions 102 are connected to an element group 104 including at least one light-emitting element to achieve light-emitting display;

[0055] The orthographic projections of the touch electrodes 103 on the base substrate 101 do not overlap with the orthographic projections of the connection electrode regions 102 on the base substrate 101 , so that the patterns of the touch electrodes 103 do not interfere with the connection electrode regions 102 .

[0056] In the wiring substrate provided in the embodiment of the present disclosure, the connection electrode area 102 can be connected to the light-emitting element to realize the display function, and the touch electrode 103 can realize the touch function, thereby realizing the integration of display and touch. Moreover, because the orthographic projection of the touch electrode 103 on the base substrate 101 does not overlap with the orthographic projection of the connection electrode area 102 on the base substrate 101, the touch function and the display function do not affect each other. In addition, compared with the solution of realizing the touch function by using an external touch module, the solution disclosed in the present disclosure realizes the touch function by integrating the touch electrode 103 inside the wiring substrate, which is lower in cost, higher in transmittance, and thinner in overall product.

[0057] Optionally, in the wiring substrate provided in the embodiment of the present disclosure, the base substrate 101 can be a transparent substrate that allows visible light to pass through, so as to be applied in transparent display fields such as smart transportation, smart windows, and outdoor displays; in some embodiments, the transparent substrate can be made of glass, quartz, plastic, polyimide and other materials.

[0058] In some embodiments, as Figure 1 、 Figures 4 to 6 As shown, in order to achieve color display, the element group 104 connected to the electrode area 102 includes at least a first type of light-emitting element 1041 and a second type of light-emitting element 1042. The first type of light-emitting element 1041 and the second type of light-emitting element 1042 are configured to emit light of different wavelengths, respectively. The first type of light-emitting element 1041 emits light in a wavelength range of 615nm to 650nm, and the second type of light-emitting element 1042 emits light in a wavelength range of 440nm to 550nm. For example, the first type of light-emitting element 1041 includes only one type of light-emitting element, which is used to emit red light of 615nm to 650nm, and its peak wavelength can be 600nm. The second type of light-emitting element 1042 includes two types of light-emitting elements, which are used to emit blue light of 440nm to 480nm and green light of 495nm to 550nm, respectively, and their peak wavelengths can be 450nm and 530nm, respectively.

[0059] The first type of light emitting element 1041 and the second type of light emitting element 1042 can both be inorganic light emitting diodes (LEDs). The type of inorganic light emitting diodes is not limited here. LEDs with quantum well junctions, LEDs with columnar structures, LEDs with double heterojunctions, etc. can be used. The LEDs can be structures with sizes miniaturized to the order of hundreds of microns, i.e., Mini LEDs or Micro LEDs, etc. The area of ​​the light emitting region of the LED is preferably 1mm 2 Below, more preferably 10000 μm 2 Below, more preferably 3000 μm 2 Below, more preferably 700 μm 2 Below, even 200μm 2 the following.

[0060] Continue to see Figure 5a 、 Figure 5b and Figure 6 It can be seen that the first type of light-emitting element 1041 and the second type of light-emitting element 1042 in the element group 104 both include a first electrode “+” and a second electrode “-”, wherein the first electrode “+” of the first type of light-emitting element 1041 is connected to the corresponding first fixed potential signal line VR, and the first electrode “+” of the second type of light-emitting element 1042 is connected to the corresponding first fixed potential signal line VGB, and the second electrodes “-” of the first type of light-emitting element 1041 and the second type of light-emitting element 1042 are both connected to the micro-driver chip 105, and the micro-driver chip 105 is also respectively connected to the common potential signal line GND, the data signal line Data and the first power supply signal line VCC1.

[0061] In a specific implementation, the first power signal line VCC1 can transmit either a DC signal or a digital signal. It is used to power the connected micro-driver chip 105. The data signal line Data transmits a digital signal. The micro-driver chip 105 receives the digital signal transmitted by the data signal line Data to determine the light-emitting time of each light-emitting element in the driver element group 104, thereby controlling the brightness of each light-emitting element. The common potential signal line GND transmits a set potential signal, providing a constant potential. The first electrode "+" of the first-type light-emitting element 1041 is connected to the first fixed potential signal line VR, and the second electrode "-" is connected to the common potential signal line GND through the micro-driver chip 105. The first fixed potential signal line VR is used to provide a first fixed potential. The micro-driver chip 105 controls the conduction and disconnection between the first-type light-emitting element 1041 and the common potential signal line GND, thereby controlling the light-emitting time of the first-type light-emitting element 1041 by controlling the conduction time of the first-type light-emitting element 1041. Similarly, the first electrode "+" of the second type light emitting element 1042 is connected to the first fixed potential signal line VGB, and the second electrode "-" is connected to the common potential signal line GND via the micro driver chip 105. The first fixed potential signal line VGB is used to provide a second fixed potential. The micro driver chip 105 controls the conduction and disconnection between the second type light emitting element 1042 and the common potential signal line GND, thereby controlling the light emission time of the second type light emitting element 1042 by controlling the conduction time of the second type light emitting element 1042. When the second type light emitting element 1042 includes two light emitting elements, such as Figure 5a As shown, the first electrodes "+" of the two light emitting elements can be connected to the second fixed potential line 32 respectively, or, as shown in FIG. Figure 5b As shown, the first electrodes "+" of the two light emitting elements can be connected and then connected to the second fixed potential line 32; the second electrodes "-" of the two light emitting elements are respectively connected to the micro driver chip 105, as shown in FIG. Figure 5a and Figure 5b shown.

[0062] In addition, if Figure 4 As shown, since the wiring substrate generally forms a bonding area at the edge of at least one side in the first direction Y, a second power signal line VCC2 is provided in the embodiment of the present disclosure for connecting to the first power signal line VCC1. One second power signal line VCC2 can be connected to one first power signal line VCC1, thereby connecting the corresponding first power signal line VCC1 to the bonding area. In some embodiments, as Figure 7As shown, the wiring substrate may include a first conductive layer L1 and a second conductive layer L2. Optionally, the second power signal line VCC2 is located in the first conductive layer L1, and the first power signal line VCC1 is located in the second conductive layer L2, and the two are electrically connected via a via that penetrates the insulating layer (for example, the stacked first inorganic insulating layer PVX1-1, the first organic insulating layer OC1, and the second inorganic insulating layer PVX1-2).

[0063] In some embodiments, as Figures 4 to 7 As shown, in the first conductive layer L1 where the second power signal line VCC2 is located, a first fixed potential signal line VR, a second fixed potential signal line VGB, a common potential signal line GND and a data signal line Data may also be provided; in the second conductive layer L2 where the first power signal line VCC1 is located, multiple types of connecting lines 106 may also be provided. These connecting lines 106 may be used to connect the first fixed potential signal line VR with the first type of light-emitting element 1041, the second fixed potential signal line VGB with the second type of light-emitting element 1042, the first type of light-emitting element 1041 with the micro-driving chip 105, the second type of light-emitting element 1042 with the micro-driving chip 105, the micro-driving chip 105 with the data signal line Data, and the micro-driving chip 105 with the first power signal line VCC1, etc.; optionally, the connecting line 106 for connecting the micro-driving chip 105 with the first power signal line VCC1 is integrally provided with the first power signal line VCC1.

[0064] In the embodiment of the present disclosure, a first power signal line VCC1 is connected to a row of micro driver chips 105 arranged along the second direction X, and a second power signal line VCC2 is connected to a first power signal line VCC1. Figure 1 The figure only illustrates a case where the number of columns of the micro-driver chips 105 arranged along the first direction Y is the same as the number of rows of the micro-driver chips 105 arranged along the second direction X. In a specific implementation, the number of columns of the micro-driver chips 105 arranged along the first direction Y and the number of rows of the micro-driver chips 105 arranged along the second direction X may be different. For example, when the number of columns of the micro-driver chips 105 arranged along the first direction Y is greater than the number of rows of the micro-driver chips 105 arranged along the second direction X, only the same number of second power signal lines VCC2 as the number of rows of the micro-driver chips 105 need be provided. The second power signal lines VCC2 are electrically connected to the corresponding first power signal lines VCC1 through vias in the insulating layer. When the arrangement of the micro-driver chips 105 and the component group 104 changes, the via connection method between the first power signal lines VCC1 and the second power signal lines VCC2 can also be adaptively adjusted, which is not limited in the present embodiment.

[0065] In addition, if Figure 2 and Figure 7As shown, the wiring substrate can further include a buffer layer (PVX0) between the first conductive layer L1 and the substrate 101. The buffer layer (PVX0) can be made of an insulating material such as silicon nitride, and is used to offset the deformation of the substrate 101 that can be caused in the process of manufacturing the signal lines in the first conductive layer L1. When the signal lines are arranged on both sides of the substrate 101, the stress between the corresponding signal lines is offset, and the deformation of the substrate 101 is not caused. In this case, the buffer layer (PVX0) can not be arranged.

[0066] Continuing to refer to Figure 7 As shown, the wiring substrate can further include a buffer layer (PVX0) between the first conductive layer L1 and the substrate 101. The buffer layer (PVX0) can be made of an insulating material such as silicon nitride, and is used to offset the deformation of the substrate 101 that can be caused in the process of manufacturing the signal lines in the first conductive layer L1. When the signal lines are arranged on both sides of the substrate 101, the stress between the corresponding signal lines is offset, and the deformation of the substrate 101 is not caused. In this case, the buffer layer (PVX0) can not be arranged.

[0067] It should be understood that the touch electrodes 103 can be self-capacitive touch electrodes or mutual-capacitive touch electrodes. The disclosure is described by taking the mutual-capacitive touch electrodes as an example. For example, when the touch electrodes 103 are mutual-capacitive touch electrodes, the plurality of touch electrodes 103 can include a plurality of touch driving electrodes Tx and a plurality of touch sensing electrodes Rx. Optionally, to improve the touch sensitivity, the layer on which the plurality of touch sensing electrodes Rx is arranged can be located on the side of the layer on which the plurality of touch driving electrodes Tx is arranged away from the substrate 101.

[0068] In some embodiments, in the wiring substrate provided in the embodiments of the disclosure, part of the touch electrodes 103 can be arranged in the same layer as the plurality of connection electrode areas 102. For example, in Figures 1 to 3 part of the touch electrodes 103 (for example, the touch sensing electrodes Rx) are arranged in the second conductive layer L2 on which the plurality of connection electrode areas 102 are arranged. In this way, the pattern of part of the touch electrodes 103 (for example, the touch sensing electrodes Rx) can be formed by patterning the second conductive layer L2 on which the plurality of connection electrode areas 102 are arranged, so as to reduce the newly added film layer as much as possible, improve the transmittance, and facilitate the design of thinness.

[0069] As shown in Figure 1It can be seen that a plurality of first signal lines (e.g., first power signal line VCC1) are provided in the second conductive layer L2 where the plurality of connection electrode regions 102 are located. Optionally, to prevent some touch electrodes 103 (e.g., touch sensing electrodes Rx) from being short-circuited with the first signal lines (e.g., first power signal line VCC1), some touch electrodes 103 (e.g., touch sensing electrodes Rx) may be provided at the gaps between the first signal lines (e.g., first power signal line VCC1). Figures 1 to 3 In the illustrated embodiment, each touch sensing electrode Rx is strip-shaped and extends along the second direction X. Adjacent touch sensing electrodes Rx are spaced apart along the first direction Y. Optionally, the touch sensing electrodes Rx are made of copper. Generally, the larger the area of ​​the touch sensing electrodes Rx, the better the touch sensitivity. Therefore, the present disclosure can maximize the size of the touch sensing electrodes Rx in the first direction Y while ensuring that some touch electrodes 103 (e.g., the touch sensing electrodes Rx) are not short-circuited with the first signal line (e.g., the first power signal line VCC1).

[0070] exist Figure 1 Also shown are multiple data signal lines Data. As can be seen from the above, the data signal lines Data are located in the first conductive layer L1 between the base substrate 101 and the second conductive layer L2 where the multiple connection electrode areas 102 are located. The present disclosure can reuse the remaining touch electrodes (such as touch drive electrodes Tx) with the multiple data signal lines Data, thus avoiding the need to add additional film layers, which is conducive to a lightweight design, and the remaining touch electrodes (such as touch drive electrodes Tx) will not have any effect on the transmittance. Figure 3 It can be seen that each touch driving electrode Tx is strip-shaped, and each touch driving electrode Tx extends along the first direction Y, and adjacent touch driving electrodes Tx are arranged at intervals along the second direction X. Optionally, the material of the touch driving electrode Tx includes copper. Figure 8 The timing shown drives the wiring substrate in a time-sharing manner. Specifically, display is performed when the DATA signal provided by the data signal line Data is at a high level, and touch is performed when the TX signal provided by the data signal line Data is at a high level; alternatively, display is performed when the DATA signal provided by the data signal line Data is at a low level, and touch is performed when the TX signal provided by the data signal line Data is at a low level. Figure 1 In this example, the touch drive electrodes Tx are multiplexed with multiple data signal lines Data, and the touch sensing electrodes Rx are placed on the same layer as the first power signal line VCC1. The touch sensing electrodes Rx are arranged in the gap between the first power signal lines VCC1. Compared with the wiring substrate without touch function in the related art, no additional layers are added, and the transmittance reduction is within 5%.

[0071] In some embodiments, as Figures 9 to 11As shown, when some touch electrodes 103 (e.g., touch sensing electrodes Rx) are located in the second conductive layer L2 where the connection electrode area 102 is located, the remaining touch electrodes (e.g., touch drive electrodes Tx) can also be located in the first conductive layer L1 between the base substrate 101 and the second conductive layer L2 where the multiple connection electrode areas 102 are located, thereby eliminating the need for a new conductive layer (e.g., a metal layer) to form the touch electrodes 103. Optionally, each touch sensing electrode Rx is strip-shaped and extends along the second direction X, with adjacent touch sensing electrodes Rx arranged at intervals along the first direction Y. Each touch drive electrode Tx is strip-shaped and extends along the first direction Y, with adjacent touch drive electrodes Tx arranged at intervals along the second direction X. The touch drive electrodes Tx and the touch sensing electrodes Rx can both be made of copper, for example. However, the first conductive layer L1 where the multiple connection electrode regions 102 are located is provided with multiple second signal lines (e.g., a first fixed potential signal line VR, a second fixed potential signal line VGB, a common potential signal line GND, a data signal line Data, and a second power signal line VCC2). Therefore, to prevent the remaining touch electrodes (e.g., the touch drive electrodes Tx) provided on the same layer from short-circuiting with the second signal lines (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, the common potential signal line GND, the data signal line Data, and the second power signal line VCC2), the remaining touch electrodes (e.g., the touch drive electrodes Tx) can be provided in the gaps between the second signal lines (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, the common potential signal line GND, the data signal line Data, and the second power signal line VCC2). This solution affects the transmittance by 5%-10%.

[0072] In some embodiments, in order to avoid connecting the electrode area 102 and the pad area 102' and prevent the pulse signal of the data signal line Data from interfering with the signals of the other touch electrodes (eg, the touch driving electrodes Tx), as shown in FIG. Figure 9 As shown, the remaining touch electrodes (e.g., touch drive electrodes Tx) may be disposed in the gap between the first fixed potential signal line VR and the common potential signal line GND, and / or the remaining touch electrodes (e.g., touch drive electrodes Tx) may be disposed in the gap between the second fixed potential signal line VGB and the common potential signal line GND.

[0073] In some embodiments, as Figures 12 to 14 As shown, the touch driving electrode Tx can also be used as part of the touch electrode 103 and set on the same layer as the first power signal line VCC1 (for example, on the second conductive layer L2), and in order to avoid short circuit between the touch driving electrode Tx and the first power signal line VCC1, the touch driving electrode Tx can be set in the gap between the first power signal line VCC1. Figure 14As can be seen, each touch drive electrode Tx is strip-shaped and extends along the second direction X. Adjacent touch drive electrodes Tx are spaced apart along the first direction Y. Optionally, the touch drive electrodes Tx are made of copper, for example. Generally, the larger the area of ​​the touch drive electrode Tx, the better the touch sensitivity. Therefore, the present disclosure can maximize the size of the touch drive electrode Tx in the first direction Y while ensuring that the touch drive electrode Tx and the first power signal line VCC1 are not short-circuited.

[0074] exist Figures 12 to 14 In the figure, the touch sensing electrode Rx is used as the remaining touch electrodes 103 and is disposed on the side of the second conductive layer L2 where the first power signal line VCC1 is located, away from the base substrate 101. That is, the layer where the touch sensing electrode Rx is located is a newly added film layer. Optionally, to avoid the influence of the touch sensing electrode Rx on the transmittance, the orthographic projection of the touch sensing electrode Rx on the base substrate 101 can be overlapped with the orthographic projection of each second signal line (e.g., the first fixed potential signal line VR, the second fixed potential signal line VGB, and the second power signal line VCC2) on the base substrate 101. Figure 14 It can be seen that each touch sensing electrode Rx is strip-shaped, and each touch sensing electrode Rx extends along the first direction Y, and adjacent touch sensing electrodes Rx are spaced apart along the second direction X. In some embodiments, the material of the touch sensing electrodes Rx includes copper, etc. It should be understood that, if Figure 12 As shown, in order to prevent the touch sensing electrode Rx from affecting the connection electrode area 102 binding the light emitting element and the pad area 102' binding the micro driver chip 105, the touch sensing electrode Rx avoids the common potential signal line GND overlapping with the connection electrode area 102 and the data signal line Data near the pad area 102'. Figures 12 to 14 In the solution shown, only the touch driving electrodes Tx are shielded, and the transmittance is affected by less than 5%.

[0075] Optionally, in order to avoid short circuit between the second conductive layer L2 where the first power signal line VCC1 is located and the newly added film layer of the touch sensing electrode Rx, as shown in FIG. Figure 13 As shown, an insulating layer (e.g., OC2) is provided between the two. In some embodiments, as Figure 13 As shown, an insulating layer (eg, OC3) is further provided on the side of the newly added film layer of the touch sensing electrode Rx away from the base substrate 101 to achieve insulation protection for the touch sensing electrode Rx.

[0076] In some embodiments, as Figures 15 to 20 As shown, the layer where the touch driving electrodes Tx and the layer where the touch sensing electrodes Rx are located can also be arranged on the side of the second conductive layer L2 where the multiple connection electrode areas 102 are located away from the base substrate 101, that is, two new conductive layers are added to respectively form the touch driving electrodes Tx and the touch sensing electrodes Rx.

[0077] Optionally, to avoid the influence of the touch driving electrodes Tx and the touch sensing electrodes Rx on the transmittance, and to avoid the influence on the bonding of the light emitting elements by the connection electrode area 102 and the bonding of the micro driving chip 105 by the pad area 102', in Figures 15 to 17 the embodiments, the orthographic projection of the touch sensing electrodes Rx on the substrate 101 coincides with the orthographic projection of the second signal lines, such as the first fixed potential signal line VR, the second fixed potential signal line VGB and the second power signal line VCC2, on the substrate 101, and the orthographic projection of the touch driving electrodes Tx on the substrate 101 coincides with the orthographic projection of the first power signal line VCC1 on the substrate 101. For example, each touch sensing electrode Rx is in a strip shape and extends along the first direction Y, and adjacent touch sensing electrodes Rx are arranged along the second direction X with a spacing. Each touch driving electrode Tx is in a strip shape and extends along the second direction X, and adjacent touch driving electrodes Tx are arranged along the first direction Y with a spacing. The materials of the touch driving electrodes Tx and the touch sensing electrodes Rx can include copper and the like. Figures 18 to 20 the embodiments, the orthographic projection of the touch sensing electrodes Rx on the substrate 101 coincides with the orthographic projection of the first power signal line VCC1 on the substrate 101, and the orthographic projection of the touch driving electrodes Tx on the substrate 101 coincides with the orthographic projection of the second signal lines, such as the first fixed potential signal line VR, the second fixed potential signal line VGB and the second power signal line VCC2, on the substrate 101. For example, each touch driving electrode Tx is in a strip shape and extends along the first direction Y, and adjacent touch driving electrodes Tx are arranged along the second direction X with a spacing. Each touch sensing electrode Rx is in a strip shape and extends along the second direction X, and adjacent touch sensing electrodes Rx are arranged along the first direction Y with a spacing. The materials of the touch driving electrodes Tx and the touch sensing electrodes Rx can include copper and the like.

[0078] It should be noted that in the embodiments provided in the present disclosure, due to the limitation of process conditions or the influence of other factors such as measurement, the "coincidence" may be exactly coincident or may have some deviation (for example, with a deviation of ±2μm), and therefore the "coincidence" between the related features as long as the error is allowed, all belong to the protection scope of the present disclosure.

[0079] In some embodiments, to reduce the impact on transmittance, at least one of the touch drive electrodes Tx and the touch sensing electrodes Rx can be arranged in a grid structure. Optionally, to reduce the probability of wire breakage, the grid structure has a line width of 2μm to 5μm, such as 2μm, 3μm, 4μm, 5μm, etc., and a line spacing of 150μm to 600μm, such as 150μm, 200μm, 250μm, 300μm, 350μm, 400μm, 450μm, 500μm, 550μm, 600μm, etc.

[0080] In some embodiments, the wiring substrate provided by the present disclosure can be applied to the field of transparent display. Figure 1 、 Figure 4 、 Figure 9 、 Figure 12 、 Figure 15 and Figure 18 In the figure, 2*2 pixel areas are separated by dotted lines. When the touch electrode 103 is not set, in one pixel area, the wiring (for example, the first fixed potential signal line VR, the second fixed potential signal line VGB, the common potential signal line GND, the data signal line Data, the first power signal line VCC1, the second power signal line VCC2), the connecting line 106, the connecting electrode area 102 and the pad area 102' are opaque areas, and the rest are translucent areas. The area ratio of the opaque area to the translucent area is in the range of 25:75 to 35:65 (for example, 30:70). In the present disclosure, since the touch electrodes 103 adopt a metal grid structure, the transmittance of the area where the single-layer touch electrodes 103 are located is in the range of 92% to 98% (for example, 95%); preferably, one of the touch electrodes 103 (for example, the touch drive electrode Tx) is multiplexed with a certain routing line (for example, the data signal line Data), or the orthographic projection of at least one of the touch electrodes 103 (for example, the touch drive electrode Tx and / or the touch sensing electrode Rx) coincides with the routing line (for example, the first fixed potential signal line VR, the second fixed potential signal line VGB, the first power signal line VCC1, and the second power signal line VCC2), which can better ensure that the entire wiring substrate has good transmittance and can achieve a display effect with high transparency.

[0081] Based on the same inventive concept, the embodiment of the present disclosure further provides a backplane, such as Figure 1 As shown, the backplane includes the wiring substrate provided in the embodiment of the present disclosure and multiple component groups 104, and the multiple component groups 104 are electrically connected to multiple connection electrode areas 102. Since the principle of solving the problem by the backplane is similar to that of solving the problem by the wiring substrate, the implementation of the backplane can refer to the embodiment of the wiring substrate, and the repeated parts will not be repeated.

[0082] Based on the same inventive concept, embodiments of the present disclosure further provide a light-emitting device, comprising the aforementioned backplane provided in embodiments of the present disclosure, wherein the element group includes at least one light-emitting element, and the connection electrode region includes at least one connection electrode group. Optionally, one light-emitting element is connected to one connection electrode group. Because the principles for solving the problem solved by this light-emitting device are similar to those for solving the problem solved by the aforementioned wiring substrate, the implementation of this light-emitting device can be referred to the embodiments of the aforementioned wiring substrate, and any repetitions will not be repeated here.

[0083] In some embodiments, the light-emitting device can be any product or component with a display function, such as a projector, a 3D printer, a virtual reality device, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a smart watch, a fitness wristband, a personal digital assistant, etc. The display device includes, but is not limited to, components such as a radio frequency unit, a network module, an audio output & input unit, a sensor, a display unit, a user input unit, an interface unit, and a control chip. Optionally, the control chip is a central processing unit, a digital signal processor, a system-on-chip (SoC), etc. For example, the control chip may also include a memory, a power module, etc., and realize power supply and signal input and output functions through additionally provided wires, signal lines, etc. For example, the control chip may also include hardware circuits and computer executable code, etc. The hardware circuit may include conventional very large scale integration (VLSI) circuits or gate arrays and existing semiconductors or other discrete components such as logic chips and transistors; the hardware circuit may also include field programmable gate arrays, programmable array logic, programmable logic devices, etc. In addition, those skilled in the art will understand that the above structure does not constitute a limitation on the above display device provided in the embodiment of the present disclosure. In other words, the above display device provided in the embodiment of the present disclosure may include more or fewer of the above components, or a combination of certain components, or different component arrangements.

[0084] Although the present disclosure has described preferred embodiments, it should be understood that those skilled in the art may make various changes and modifications to the embodiments without departing from the spirit and scope of the embodiments of the present disclosure. Thus, if such modifications and variations of the embodiments of the present disclosure fall within the scope of the claims of the present disclosure and their equivalents, the present disclosure is intended to include such modifications and variations.

Claims

1. A wiring substrate, characterized in that: include: substrate; A plurality of connecting electrode areas are arranged in an array on the base substrate; a plurality of touch electrodes, wherein the orthographic projections of the plurality of touch electrodes on the base substrate do not overlap with the orthographic projections of the plurality of connection electrode regions on the base substrate; Some of the touch electrodes are arranged in the same layer as the plurality of connection electrode areas; The wiring substrate further includes a plurality of first signal lines arranged in the same layer as the part of the touch electrodes, and the part of the touch electrodes is arranged in the gaps between the first signal lines; The wiring substrate further includes a plurality of second signal lines located between the base substrate and the layer where the plurality of connection electrode areas are located; the remaining touch electrodes are arranged on the same layer as the plurality of second signal lines, and the remaining touch electrodes are located in the gaps between the second signal lines; The wiring substrate further includes a plurality of data signal lines located between the base substrate and the layer where the plurality of connection electrode regions are located; the remaining touch electrodes are multiplexed with the plurality of data signal lines.

2. The wiring substrate according to claim 1, wherein The plurality of touch electrodes include a plurality of touch driving electrodes and a plurality of touch sensing electrodes. The layer where the plurality of touch sensing electrodes are located is located on a side of the layer where the plurality of touch driving electrodes are located away from the base substrate.

3. The wiring substrate according to claim 2, wherein At least one of the touch driving electrodes and the touch sensing electrodes has a grid structure.

4. The wiring substrate according to claim 3, wherein The line width of the grid structure is 2 μm to 5 μm, and the line spacing is 150 μm to 600 μm.

5. The wiring substrate according to any one of claims 1 to 4, wherein: The base substrate is a transparent substrate.

6. A back plate, characterized in that: The method comprises the wiring substrate according to any one of claims 1 to 5 and a plurality of component groups, wherein the plurality of component groups are electrically connected to the plurality of connection electrode regions.

7. A light emitting device, characterized in that: The backplane comprises the backplane as claimed in claim 6, wherein the element group comprises at least one light-emitting element, the connecting electrode area comprises at least one connecting electrode group, and the at least one light-emitting element is connected to the at least one connecting electrode group.

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