A chip placement device for semiconductor chip processing

Abstract

The present invention discloses a patch device for semiconductor chip processing, which relates to the field of semiconductor chip processing, including a workbench and a bracket, a material box is installed on the workbench, a bracket is fixed on the workbench, and a gluing mechanism is fixed on the bracket. The patch device for semiconductor chip processing adopts an automatic gluing structure, which can realize the continuous automatic gluing of the chip. Specifically, the positioning plate is driven downward by the first cylinder. When the positioning plate is fitted with the chip, the first cylinder continues to extend, and the barrel and the gluing plate can be moved in cooperation with the action of the connecting rod and the slider, thereby realizing the automatic gluing action. In the gluing process, the piston, the cylinder, the air inlet check valve and the air outlet check valve on the cylinder are cooperated to allow the cylinder air to enter the barrel. By increasing the internal air pressure of the barrel, the glue inside the barrel can be more easily discharged, thereby ensuring the normal gluing.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor chip processing, in particular to a chip mounting device for semiconductor chip processing. Background Art

[0002] A chip refers to a silicon wafer containing an integrated circuit. It is very small and is an important component of a computer or other electronic device. During the chip production process, a patch operation is required, which is mainly performed by applying glue on the chip and then using a patch device to perform the patch operation. However, in actual use, the existing chip patch device mainly relies on manual glue application and then placing the chip on the patch device for patching, which is more troublesome and less efficient. Therefore, in view of the above problems, a patch device for semiconductor chip processing is designed to better meet actual use needs. Summary of the invention

[0003] The object of the present invention is to provide a chip bonding device for semiconductor chip processing to solve the problems raised in the above-mentioned background technology.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a patch device for semiconductor chip processing, comprising a workbench and a bracket, a material box is installed on the workbench, a bracket is fixed on the workbench, a gluing mechanism is fixed on the bracket, the gluing mechanism comprises a first cylinder, a fixed plate, a movable plate, a piston, a first spring, a cylinder, a vertical rod, a positioning plate, a connecting rod, a slider, a material barrel and a gluing plate, the first cylinder is fixed on the bracket, a fixed plate is fixed on the output end of the first cylinder, a movable plate is arranged under the fixed plate, pistons are symmetrically fixed on the movable plate, a first spring is fixed between the movable plate and the fixed plate, the piston is slidably connected to the fixed plate and the cylinder, an air inlet check valve and an air outlet check valve are arranged on the cylinder, the movable plate The cam is fixedly connected to the positioning plate through a vertical rod, and a gluing hole is provided on the lower end surface of the positioning plate, the fixed plate is rotatably connected to one end of the connecting rod, the other end of the connecting rod is rotatably connected to the slider, and the slider is slidably connected to the movable plate, a barrel is fixed to the lower end of the slider, and the barrel is connected to the air outlet one-way valve of the cylinder through a conduit, a gluing plate is installed at the lower end of the barrel, and the gluing plate and the positioning plate are slidably connected, and a gluing port that passes through the barrel is provided on the gluing plate. When gluing the chip, the positioning plate is driven to cooperate with the chip by the first cylinder, and then the barrel and the gluing plate are moved by the action of the connecting rod to realize the gluing operation, and when the barrel moves, the action of the piston is cooperated to allow the air in the barrel to enter the barrel, and the glue in the barrel is discharged by the action of the air pressure.

[0005] Preferably, a disc driven to rotate by a motor is also installed on the workbench, and a positioning groove is provided on the disc, and the rotation angle of the disc each time is equal to the angle between two adjacent positioning grooves. The positioning groove can facilitate the positioning of the chip, and the rotation of the disc can realize automatic loading of the chip to ensure the normal operation of the device.

[0006] Preferably, the workbench is also equipped with an adjustment mechanism and a fixing frame, and electric heating wires are fixed on the fixing frame at equal intervals. The chips after mounting can be dried by the electric heating wires to ensure the stability of the mounting.

[0007] Preferably, the adjusting mechanism includes a slot plate, a first motor, a first threaded rod, a movable frame, a second motor, a second threaded rod, a movable block and a second cylinder. The slot plate is fixed on the workbench, and the first motor is fixed on the slot plate, and the first threaded rod is fixed on the output end of the first motor. At the same time, the first threaded rod bearing is connected to the slot plate, and the first threaded rod is connected to the movable frame through a thread, and the movable frame and the slot plate are slidably connected. Through the above structure, a basic guarantee can be provided for realizing the left and right adjustment of the patch mechanism.

[0008] Preferably, a second motor is fixed on the movable frame, and a second threaded rod is fixed on the output end of the second motor, and the second threaded rod bearing is connected to the movable frame, and the second threaded rod is connected to the movable block through a thread, and the movable block and the movable frame are slidably connected. Through the above structure, the front and rear positions of the patch mechanism can be realized.

[0009] Preferably, a second cylinder is fixed to the lower end surface of the movable block, and a patch mechanism is fixed to the output end of the second cylinder. Through the action of the second cylinder, the upper and lower positions of the patch mechanism can be adjusted to ensure normal patching.

[0010] Preferably, the patch mechanism includes a mounting frame, a vacuum pump, a negative pressure cylinder, an air guide rod, a multi-eye camera, a suction cup, a second spring, a connecting frame and a sealing plug. The mounting frame is fixed on the output end of the second cylinder, and a vacuum pump is installed on the mounting frame. The vacuum pump is connected to the negative pressure cylinder through a conduit, and the negative pressure cylinder is fixed on the mounting frame. Through the action of the vacuum pump and the vacuum pump, a basic guarantee can be provided for the adsorption of the patch.

[0011] Preferably, the negative pressure cylinder is slidably connected to an air guide rod, and a multi-eye camera is fixed on the air guide rod, and a suction cup is connected to the lower end of the air guide rod. The multi-eye camera can provide a basic guarantee for visual positioning, and the suction cup can realize the adsorption of the patch.

[0012] Preferably, the air guide rod and one end of the second spring are fixed to each other, and the other end of the second spring is fixed to the negative pressure cylinder, and the elastic action of the second spring can provide a basic force for automatic reset of the air guide rod.

[0013] Preferably, a connecting frame is fixed on the air guide rod, and the connecting frame and the mounting frame are slidably connected, and a sealing plug is fixed on the connecting frame. At the same time, the sealing plug cooperates with the negative pressure cylinder to achieve a sealing effect. The sealing plug is separated from the negative pressure cylinder by moving the connecting frame, so that the negative pressure effect in the negative pressure cylinder can be released, thereby automatically releasing the adsorption effect on the patch.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. The chip bonding device for semiconductor chip processing adopts an automatic gluing structure, which can realize the continuous automatic gluing of the chip. Specifically, the first cylinder drives the positioning plate to move downward. When the positioning plate is bonded with the chip, the first cylinder continues to extend, and cooperates with the action of the connecting rod and the slider to move the barrel and the gluing plate, thereby realizing the automatic gluing action. In the gluing process, the piston, the cylinder, the air inlet check valve and the air outlet check valve on the cylinder are cooperated to allow the cylinder air to enter the barrel. By increasing the internal air pressure of the barrel, the glue inside the barrel can be discharged more easily, thereby ensuring the normal gluing.

[0016] 2. The chip bonding device for semiconductor chip processing adopts a self-unloading pressure structure, which can automatically release the adsorption effect of the workpiece after the chip bonding is completed, providing a basic guarantee for the continuous operation of the device. Specifically, the automatic adsorption of the workpiece can be achieved through the action of the vacuum pump, the negative pressure cylinder, the air guide rod and the suction cup. During the chip bonding process, the sliding action between the air guide rod and the negative pressure cylinder allows the connecting frame and the sealing plug to move, thereby releasing the seal of the negative pressure cylinder and further releasing the adsorption effect of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the device of the present invention;

[0018] Figure 2 It is a schematic diagram of the front view of the three-dimensional structure of the gluing mechanism of the present invention;

[0019] Figure 3 It is a bottom-up three-dimensional structural schematic diagram of the gluing mechanism of the present invention;

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the cylindrical section of the present invention;

[0021] Figure 5 It is a schematic diagram of the cross-sectional three-dimensional structure of the adjustment mechanism of the present invention;

[0022] Figure 6 It is a schematic diagram of the front view of the three-dimensional structure of the patch mechanism of the present invention;

[0023] Figure 7 It is a schematic diagram of the three-dimensional structure of the patch mechanism of the present invention when viewed from the bottom;

[0024] Figure 8 It is a bottom-up three-dimensional structural schematic diagram of the fixing frame of the present invention.

[0025] In the figure: 1, workbench; 101, material box; 2, disc; 201, positioning groove; 3, bracket; 4, glue coating mechanism; 401, first cylinder; 402, fixed plate; 403, movable plate; 404, piston; 405, first spring; 406, cylinder; 407, vertical rod; 408, positioning plate; 409, connecting rod; 410, slider; 411, barrel; 412, glue coating plate; 5, adjustment mechanism; 501, slot plate; 502, first A motor; 503, a first threaded rod; 504, a movable frame; 505, a second motor; 506, a second threaded rod; 507, a movable block; 508, a second cylinder; 6, a patch mechanism; 601, a mounting frame; 602, a vacuum pump; 603, a negative pressure cylinder; 604, an air guide rod; 6041, a multi-eye camera; 605, a suction cup; 606, a second spring; 607, a connecting frame; 608, a sealing plug; 7, a fixing frame; 701, a heating wire. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0027] See also Figure 1-Figure 8The present invention provides a technical solution: a chip placement device for semiconductor chip processing, comprising a workbench 1 and a bracket 3, a material box 101 is installed on the workbench 1, the bracket 3 is fixed on the workbench 1, a glue coating mechanism 4 is fixed on the bracket 3, and the glue coating mechanism 4 comprises a first cylinder 401, a fixed plate 402, a movable plate 403, a piston 404, a first spring 405, a cylinder 406, a vertical rod 407, a positioning plate 408, a connecting rod 409, a slider 410, a barrel 411 and a glue coating plate 41 2, the first cylinder 401 is fixed on the bracket 3, the output end of the first cylinder 401 is fixed with a fixed plate 402, a movable plate 403 is arranged below the fixed plate 402, pistons 404 are fixed symmetrically on the movable plate 403, a first spring 405 is fixed between the movable plate 403 and the fixed plate 402, the piston 404 is slidably connected to the fixed plate 402 and the cylinder 406, an inlet check valve and an outlet check valve are arranged on the cylinder 406, and the movable plate 403 is connected to the fixed plate 402 and the cylinder 406 through a vertical rod 407. The positioning plate 408 is fixedly connected, and a glue coating hole is opened on the lower end surface of the positioning plate 408. The fixed plate 402 is rotatably connected to one end of the connecting rod 409. The other end of the connecting rod 409 is rotatably connected to the slider 410. The slider 410 is slidably connected to the movable plate 403. A barrel 411 is fixed to the lower end of the slider 410, and the barrel 411 is connected to the gas outlet check valve of the cylinder 406 through a conduit. A glue coating plate 412 is installed at the lower end of the barrel 411, and the glue coating plate 412 is connected to the positioning plate 408. There is a sliding connection between them, and the glue coating plate 412 is provided with a glue outlet that passes through the barrel 411. When gluing the chip, the first cylinder 401 drives the positioning plate 408 to cooperate with the chip, and then the connecting rod 409 is used to move the barrel 411 and the glue coating plate 412 to realize the gluing operation. When the barrel 411 moves, the piston 404 cooperates to allow the air in the cylinder 406 to enter the barrel 411, and the glue in the barrel 411 is discharged by the air pressure.

[0028] A disc 2 driven to rotate by a motor is also installed on the workbench 1, and a positioning groove 201 is provided on the disc 2, and the rotation angle of the disc 2 each time is equal to the angle between two adjacent positioning grooves 201;

[0029] When using the semiconductor chip processing bonding device, Figure 1-Figure 8As shown, firstly, the chip to be processed is placed in the positioning groove 201. The positioning groove 201 can realize the positioning of the chip to ensure the stability of the chip during the subsequent processing. After the chip is placed, the motor drives the disc 2 to rotate counterclockwise. When the chip rotates to the bottom of the positioning disc 408, the disc 2 stops rotating, and the first cylinder 401 extends to drive the positioning disc 408 to move downward. When the positioning disc 408 contacts the chip, the glue coating hole on the positioning disc 408 just matches the chip mounting position, and the first cylinder 401 continues to extend, so that the fixed plate 402 moves downward relative to the movable plate 403. At this time, the piston 404 slides upward in the cylinder 406 to realize the exhaust function of the cylinder 406, and cooperates with the air inlet check valve and the air outlet check valve on the cylinder 406. The action of the valve causes the air in the cylinder 406 to enter the barrel 411 through the conduit, thereby increasing the air pressure in the space above the rubber in the barrel 411. The rubber in the barrel 411 is discharged onto the glue coating plate 412 through the action of the air pressure. When the fixed plate 402 moves downward relative to the movable plate 403, the sliding block 410 is forced to slide on the movable plate 403 in cooperation with the transmission action of the connecting rod 409, thereby driving the barrel 411 and the glue coating plate 412 to move. In cooperation with the action of the glue outlet on the glue coating plate 412, the rubber can be bonded to the chip through the glue coating hole on the positioning plate 408, thereby realizing the automatic gluing of the chip. After the gluing is completed, the glue coating plate 412 and the barrel 411 can be reset by contracting the first cylinder 401 to facilitate the next gluing.

[0030] The workbench 1 is also equipped with an adjustment mechanism 5 and a fixing frame 7, and electric heating wires 701 are fixed on the fixing frame 7 at equal intervals; the adjustment mechanism 5 includes a slot plate 501, a first motor 502, a first threaded rod 503, a movable frame 504, a second motor 505, a second threaded rod 506, a movable block 507 and a second cylinder 508, the slot plate 501 is fixed on the workbench 1, and the first motor 502 is fixed on the slot plate 501, and the output end of the first motor 502 is fixed with a first threaded rod 503, and the first threaded rod 503 is connected to the slot plate 501 by a bearing. On the plate 501, the first threaded rod 503 is connected to the movable frame 504 through a thread, and the movable frame 504 and the slot plate 501 are connected in a sliding manner; a second motor 505 is fixed to the movable frame 504, and a second threaded rod 506 is fixed to the output end of the second motor 505, and the second threaded rod 506 is connected to the movable frame 504 by a bearing, and the second threaded rod 506 is connected to the movable block 507 through a thread, and the movable block 507 and the movable frame 504 are connected in a sliding manner; a second cylinder 508 is fixed to the lower end surface of the movable block 507 , and the output end of the second cylinder 508 is fixed with a patch mechanism 6; the patch mechanism 6 includes a mounting frame 601, a vacuum pump 602, a negative pressure cylinder 603, an air guide rod 604, a multi-eye camera 6041, a suction cup 605, a second spring 606, a connecting frame 607 and a sealing plug 608, the mounting frame 601 is fixed on the output end of the second cylinder 508, and a vacuum pump 602 is installed on the mounting frame 601, and the vacuum pump 602 is connected to the negative pressure cylinder 603 through a conduit, and the negative pressure cylinder 603 is fixed on the mounting frame 601; the negative pressure cylinder 6 03 is slidably connected with an air guide rod 604, and a multi-eye camera 6041 is fixed on the air guide rod 604, and a suction cup 605 is connected to the lower end of the air guide rod 604; the air guide rod 604 and one end of the second spring 606 are fixed to each other, and the other end of the second spring 606 is fixed to the negative pressure cylinder 603; a connecting frame 607 is also fixed on the air guide rod 604, and the connecting frame 607 is slidably connected to the mounting frame 601, and a sealing plug 608 is fixed on the connecting frame 607, and the sealing plug 608 cooperates with the negative pressure cylinder 603 to achieve a sealing effect;

[0031] After the chip is glued, Figure 1-Figure 8As shown, at this time, the motor continues to drive the disc 2 to rotate counterclockwise, thereby driving the glue-coated chip to rotate. When the glue-coated chip rotates to the bottom of the patch mechanism 6, the disc 2 stops rotating. The patch position of the chip can be located and identified through the multi-eye camera 6041. After the identification is completed, the left and right positions of the patch mechanism 6 can be adjusted through the first motor 502, the first threaded rod 503 and the movable frame 504. The front and rear positions of the patch mechanism 6 can be adjusted by cooperating with the second motor 505, the second threaded rod 506 and the movable block 507. In step 1, the suction cup 605 is moved according to the detection information of the multi-eye camera 6041, so that the suction cup 605 moves to the top of the material box 101 corresponding to the workpiece. At this time, the negative pressure cylinder 603 and the suction cup 605 are moved downward by the second cylinder 508, and the downward position of the suction cup 605 is detected by the multi-eye camera 6041. When the suction cup 605 contacts the workpiece, the second cylinder 508 stops extending and is started by the vacuum pump 602, so that a negative pressure state is formed in the negative pressure cylinder 603 and the air guide rod 604, so that the suction cup 605 can adsorb the workpiece. After the adsorption is completed, the second cylinder 508 is used to move the suction cup 605 downward. The cylinder 508 contracts and drives the suction cup 605 to reset. Through the above-mentioned moving mechanism, the suction cup 605 and the workpiece are moved to the chip bonding position, and then the second cylinder 508 is controlled to extend, so that the workpiece moves down to contact the chip for bonding. When the workpiece contacts the chip, the second cylinder 508 extends and continues to extend to apply a certain pressure to the suction cup 605 and the workpiece, which can not only ensure the bonding effect of the workpiece and the chip, but also make the suction cup 605 and the air guide rod 604 move upward relative to the negative pressure cylinder 603, thereby driving the connecting frame 607 and the sealing plug 608 to move upward relative to the negative pressure cylinder 603. The sealing plug 608 is moved to separate from the negative pressure cylinder 603, thereby releasing the sealing effect of the negative pressure cylinder 603, and the vacuum pump 602 stops working synchronously at this time, thereby releasing the adsorption effect of the workpiece, ensuring that the suction cup 605 can be normally separated from the workpiece when it is reset. After the patch is completed, the motor continues to drive the disc 2 to rotate counterclockwise. When the chip after the patch rotates to the bottom of the heating wire 701, the action of the heating wire 701 can realize the drying effect of the glue between the chip and the workpiece, ensuring the stability of the bonding between the chip and the workpiece. This is the working principle of the patch device for semiconductor chip processing.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip placement device for semiconductor chip processing, comprising a workbench (1) and a bracket (3), wherein a material box (101) is mounted on the workbench (1), and the bracket (3) is fixed on the workbench (1), characterized in that: A glue coating mechanism (4) is fixed on the support (3), and the glue coating mechanism (4) comprises a first cylinder (401), a fixed plate (402), a movable plate (403), a piston (404), a first spring (405), a cylinder (406), a vertical rod (407), a positioning plate (408), a connecting rod (409), a sliding block (410), a barrel (411) and a glue coating plate (412). The first cylinder (401) is fixed on the support (3), a fixed plate (402) is fixed on the output end of the first cylinder (401), a movable plate (403) is arranged below the fixed plate (402), pistons (404) are symmetrically fixed on the movable plate (403), a first spring (405) is fixed between the movable plate (403) and the fixed plate (402), and a first spring (405) is fixed between the piston (404) and the fixed plate (402) and the cylinder (406). The cylinder (406) is provided with an air inlet check valve and an air outlet check valve. The movable plate (403) is fixedly connected to the positioning plate (408) through a vertical rod (407). The lower end surface of the positioning plate (408) is provided with a glue coating hole. The fixed plate (402) is rotatably connected to one end of the connecting rod (409). The other end of the connecting rod (409) is rotatably connected to the slider (410). The slider (410) 0) is slidably connected to the movable plate (403), a barrel (411) is fixed to the lower end of the slider (410), and the barrel (411) is connected to the gas outlet one-way valve of the cylinder (406) through a conduit, a glue coating plate (412) is installed at the lower end of the barrel (411), and the glue coating plate (412) and the positioning plate (408) are slidably connected, and a glue outlet that penetrates the barrel (411) is provided on the glue coating plate (412).

2. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: A disc (2) driven to rotate by a motor is also mounted on the workbench (1), and a positioning groove (201) is provided on the disc (2), and the angle of each rotation of the disc (2) is equal to the angle between two adjacent positioning grooves (201).

3. A chip bonding device for semiconductor chip processing according to claim 1, characterized in that: The workbench (1) is also equipped with an adjustment mechanism (5) and a fixing frame (7), and electric heating wires (701) are fixed at equal intervals on the fixing frame (7).

4. A chip bonding device for semiconductor chip processing according to claim 3, characterized in that: The adjusting mechanism (5) comprises a slot plate (501), a first motor (502), a first threaded rod (503), a movable frame (504), a second motor (505), a second threaded rod (506), a movable block (507) and a second cylinder (508); the slot plate (501) is fixed on the workbench (1); the first motor (502) is fixed on the slot plate (501); the first threaded rod (503) is fixed at the output end of the first motor (502); the first threaded rod (503) is bearing-connected to the slot plate (501); the first threaded rod (503) is connected to the movable frame (504) via threads; the movable frame (504) and the slot plate (501) are slidably connected.

5. A chip bonding device for semiconductor chip processing according to claim 4, characterized in that: A second motor (505) is fixed on the movable frame (504), and a second threaded rod (506) is fixed to the output end of the second motor (505). The second threaded rod (506) is bearing-connected to the movable frame (504), and the second threaded rod (506) is connected to the movable block (507) via threads. The movable block (507) and the movable frame (504) are slidably connected.

6. A chip bonding device for semiconductor chip processing according to claim 5, characterized in that: A second cylinder (508) is fixed to the lower end surface of the movable block (507), and a patch mechanism (6) is fixed to the output end of the second cylinder (508).

7. A chip bonding device for semiconductor chip processing according to claim 6, characterized in that: The patch mechanism (6) comprises a mounting frame (601), a vacuum pump (602), a negative pressure cylinder (603), an air guide rod (604), a multi-eye camera (6041), a suction cup (605), a second spring (606), a connecting frame (607) and a sealing plug (608); the mounting frame (601) is fixed on the output end of the second cylinder (508), and a vacuum pump (602) is installed on the mounting frame (601), and the vacuum pump (602) is connected to the negative pressure cylinder (603) through a conduit, and the negative pressure cylinder (603) is fixed on the mounting frame (601).

8. A chip bonding device for semiconductor chip processing according to claim 7, characterized in that: The negative pressure cylinder (603) is slidably connected to an air guide rod (604), a multi-eye camera (6041) is fixed to the air guide rod (604), and a suction cup (605) is connected to the lower end of the air guide rod (604).

9. A chip bonding device for semiconductor chip processing according to claim 7, characterized in that: The air guide rod (604) and one end of the second spring (606) are fixed to each other, and the other end of the second spring (606) is fixed to the negative pressure cylinder (603).

10. A chip bonding device for semiconductor chip processing according to claim 7, characterized in that: A connecting frame (607) is also fixed on the air guide rod (604), and the connecting frame (607) and the mounting frame (601) are slidably connected. A sealing plug (608) is fixed on the connecting frame (607), and the sealing plug (608) cooperates with the negative pressure cylinder (603) to achieve a sealing effect.

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