System, method and device for visual positioning of wafer equipment

Abstract

The present invention relates to the field of semiconductor manufacturing technology, and discloses a system, a method and a device for visual positioning of a wafer equipment. In the system for visual positioning of the wafer equipment, a wafer clamping robotic arm and a waterproof cover with a built-in vision camera are combined to form a combined robotic arm. The method includes: when controlling the combined robotic arm to move to a first set position in the DSP area, obtaining first current image information of a first placement hole on the planetary gear captured by the vision camera, and when controlling the combined robotic arm to move to a second set position in the DSP area, obtaining second current image information of a second placement hole on the planetary gear captured by the vision camera; determining the position information of each placement hole on the planetary gear according to the first current image information and the second current image information, wherein there are three placement holes on the planetary gear, and each placement hole carries a wafer. In this way, the efficiency of visual positioning is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a system, method and device for visual positioning of wafer equipment. Background Art

[0002] With the development of science and technology, semiconductor products have received increasing attention, and the degree of automation in semiconductor product manufacturing has also become higher and higher, including: cleaning equipment, double-sided grinding and polishing equipment (Double Side Polishing, DSP), etching equipment, deposition equipment, etc. A semiconductor wafer refers to a silicon substrate wafer used for manufacturing silicon semiconductor integrated circuits. Since its shape is circular, it is called a wafer. In semiconductor manufacturing, wafer production is one of the core links, and its quality directly determines the performance and reliability of the final product.

[0003] During the production process of the wafer, the DSP needs to polish the wafer. During the polishing process, it is necessary to position the wafer placement holes (Hotel) on the planetary gear (carrie). Currently, it is necessary to move the vision camera between the upper plate and the lower plate, take a vision photo, and then perform positioning according to the photo information. Generally, there are three Hotels on the carrier of the DSP. Since the DSP has a vertical lifting structure, the height between the upper plate and the lower plate is very low after the cover is opened, and the field of view of the vision camera cannot cover the three wafer carrier position placement holes Hotel of the carrier. It is necessary to move the camera multiple times to take pictures, so as to determine the coordinates of the placement points of the three wafers respectively. In this way, the wafer positioning efficiency is relatively low. Moreover, during the process of opening the cover of the DSP and taking and placing the wafer, there is some grinding fluid on the lower grinding plate, and the upper grinding plate may also splash grinding fluid. The dripping grinding fluid and water mist will affect the vision photo-taking effect, and even the contamination of the lens by the liquid or water mist will cause the inability to achieve vision positioning. Summary of the Invention

[0004] In order to solve the above problems existing in the prior art, the present invention provides a system, method and device for visual positioning of wafer equipment. The technical problems to be solved by the present invention are achieved through the following technical solutions:

[0005] In the first aspect of the embodiment of the present invention, a system for visual positioning of wafer equipment is provided, including: a wafer clamping robotic arm, a vision camera located in a waterproof cover, and a control device, wherein,

[0006] The waterproof cover includes a camera cover and a camera lens cover, which are respectively combined with the wafer clamping robotic arm through mounting plates to form a combined robotic arm, and the end face of the camera lens cover is provided with a vision window, which is matched with the position of the vision camera lens;

[0007] A vision camera, configured to capture current image information of a wafer processing position in a wafer device through a vision window when a combined robotic arm moves to a set position;

[0008] A control device, configured to control the movement of the combined robotic arm and determine the position information of the wafer processing position according to the current image information obtained by the vision camera.

[0009] A second aspect of an embodiment of the present invention provides a method for vision positioning of a wafer device. A wafer clamping robotic arm and a waterproof cover with a built-in vision camera are combined to form a combined robotic arm. The method includes:

[0010] When controlling the combined robotic arm to move to a first set position in the DSP area, obtaining first current image information of a first placement hole on a planetary gear captured by the vision camera, and when controlling the combined robotic arm to move to a second set position in the DSP area, obtaining second current image information of a second placement hole on the planetary gear captured by the vision camera;

[0011] Determining the position information of each placement hole on the planetary gear according to the first current image information and the second current image information, where there are three placement holes on the planetary gear, and each placement hole holds a wafer.

[0012] A third aspect of an embodiment of the present invention provides a device for vision positioning of a wafer device, including: The device includes a processor and a memory storing program instructions. The processor is configured to execute the above method for vision positioning of a wafer device when executing the program instructions.

[0013] Advantages of the present invention:

[0014] The vision camera is located inside the waterproof cover, and the waterproof cover is combined with the wafer clamping robotic arm to form a combined robotic arm, which facilitates the position control of the vision camera. Moreover, since the vision camera is located inside the waterproof cover, the probability of the lens being contaminated by liquid or water mist can be reduced, improving the effectiveness and positioning accuracy of vision positioning of the wafer device.

[0015] Other features and advantages of the present invention will be described in the following specification, and some will become obvious from the specification or be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained by the structures specifically pointed out in the written specification and the drawings.

[0016] The technical solutions of the present invention will be further described in detail below through the drawings and embodiments. Description of the Drawings

[0017] The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the accompanying drawings:

[0018] Figure 1 is a schematic structural diagram of a combined robotic arm provided by an embodiment of the present invention;

[0019] Figure 2 is a front view schematic diagram of a combined robotic arm provided by an embodiment of the present invention;

[0020] Figure 3 is a schematic structural diagram of a planetary gear in a DSP device provided by an embodiment of the present invention;

[0021] Figure 4 is a geometric schematic diagram corresponding to the planetary gear in a DSP device provided by an embodiment of the present invention;

[0022] Figure 5 is a schematic flow diagram of a method for visual positioning of a wafer device provided by an embodiment of the present invention;

[0023] Figure 6-1 、 6-2 is a schematic flow diagram of a method for visual positioning of a DSP device provided by an embodiment of the present invention;

[0024] Figure 7 is a schematic structural diagram of a device for visual positioning of a wafer device provided by an embodiment of the present invention.

[0025] In the accompanying drawings: 1. Wafer clamping robotic arm; 2. Wafer pressing hand; 3. Wafer pressing detection; 401. Camera cover; 402. Camera lens cover; 403. Window water spraying column; 404. Window drying column; 405. Visual window; 406. Camera cable waterproof joint; 407. Mounting plate; 408. Positive pressure waterproof start joint; 409. Water injection joint; 410. Dry gas joint. Detailed Embodiments

[0026] The following further describes the present invention in detail with reference to specific embodiments, but the embodiments of the present invention are not limited thereto.

[0027] With the development of science and technology, the degree of automation in semiconductor product manufacturing is also getting higher and higher. During the wafer production process, many devices used for wafer production, namely wafer devices, need visual positioning. For example, in a DSP device, a vision camera is required to position the wafer placement holes (Hotels) on the planetary carrier. If the positioning accuracy is low, the wafer cannot be placed into the wafer placement hotel on the planetary carrier, or the position when placing the wafer is not accurate enough, which will cause chips to be generated during the polishing process, resulting in serious economic losses. In the embodiments of the present invention, the vision camera is located inside a waterproof cover, and the waterproof cover is combined with the wafer clamping robotic arm to form a combined robotic arm, which facilitates the position control of the vision camera. Moreover, since the vision camera is located inside the waterproof cover, the probability of the lens being contaminated by liquid or water mist can be reduced, improving the effectiveness and positioning accuracy of the visual positioning of the wafer device. Additionally, when performing visual positioning on a DSP device, only the image information of two placement holes on the planetary carrier needs to be obtained through the vision camera, and then the position information of three placement holes on the planetary carrier can be obtained, that is, the visual positioning of the wafer processing position is achieved, reducing the number of times the vision camera moves for taking pictures and improving the efficiency of the visual positioning of the wafer device.

[0028] In the related art, wafer processing can perform automatic loading and unloading through a robotic arm. That is, during the wafer production process of a wafer device, the wafer clamping robotic arm can achieve functions such as unloading clamping, pressing, and pressing detection. In the embodiments of the present invention, the vision camera can be combined with the wafer clamping robotic arm to form a combined robotic arm. In this way, through the combined robotic arm, the vision camera can move in and out of the wafer device for taking pictures. Moreover, the vision camera can also be placed in a waterproof cover, and the waterproof cover is combined with the wafer clamping robotic arm to form a combined robotic arm, thereby reducing the probability of the lens being contaminated by liquid or water mist and improving the effectiveness and positioning accuracy of the visual positioning of the wafer device.

[0029] Therefore, a system for visual positioning of a wafer device includes: a wafer clamping robotic arm, a vision camera located inside a waterproof cover, and a control device, wherein the waterproof cover is combined with the wafer clamping robotic arm to form a combined robotic arm. The control device is respectively connected to the combined robotic arm and the vision camera for control.

[0030] Such as Figure 1As shown in the figure, the combined robotic arm includes: a wafer clamping arm 1, a camera cover 401, a camera lens cover 402, and a mounting plate 407. According to the shape of the vision camera, the waterproof covers for placing the vision camera can be divided into a cuboid camera cover 401 and a cylindrical camera lens cover 402. The camera cover 401 and the camera lens cover 402 can be combined with the wafer clamping robotic arm 1 through the mounting plate 407 respectively to form a combined robotic arm. And the end face of the camera lens cover 402 is configured with a vision window 405, which is matched with the position of the vision camera lens. Moreover, the vision window 405 can be made of high-definition transparent material. In this way, the vision camera is configured to capture the current image information of the wafer processing position in the wafer equipment through the vision window 405 when the combined robotic arm moves to the set position.

[0031] The control device can control the combined robotic arm and the vision camera respectively. Thus, when the control device controls the combined robotic arm to move to the set position, it can control the vision camera to take pictures and obtain the current image information captured by the vision camera. Furthermore, based on the current image information obtained by the vision camera, the position information of the wafer processing position can be determined.

[0032] For example: when the wafer equipment is a DSP equipment, after the DSP equipment is opened, when the control device controls the combined robotic arm to move to the set position and the position of the lens of the vision camera is matched with the position of a placement hole on the planetary gear, the vision camera can obtain the current image information of the placement hole through the vision window 405, and then send the current image information to the control device. Thus, the control device can perform image recognition to obtain the coordinate information of the placement point corresponding to the placement hole, that is, the position information of the placement hole can be obtained.

[0033] In an embodiment of the present invention, the control device may be a device. A Programmable Logic Controller (PLC) is a digital computing operation electronic system designed specifically for use in industrial environments. It uses a programmable memory to store instructions for performing operations such as logical operations, sequential control, timing, counting, and arithmetic operations internally, and controls various types of mechanical equipment or production processes through digital or analog inputs and outputs. Therefore, the control device may be a PLC or other industrial controller, or the control device may be composed of two or more devices, for example: a PLC and a microprocessor embedded in a vision camera, etc. When the control device is a PLC, the PLC can control the combined robotic arm to move, control the vision camera to take pictures, obtain the current image information sent by the vision camera, and perform image recognition to obtain the position information of the corresponding wafer processing position. Or, when the control device includes a PLC and a microprocessor embedded in a vision camera, the PLC can control the combined robotic arm to move and trigger the microprocessor in the vision camera. The microprocessor can obtain the current image information captured by the vision camera, perform image recognition, obtain the position information of the corresponding wafer processing position, and send it to the PLC.

[0034] Since in the process of wafer manufacturing and processing by some wafer equipment, there may be liquid or water mist. In this way, putting the vision camera into a waterproof cover can reduce the probability of the lens being contaminated by liquid or water mist. Combining Figure 1 、 Figure 2 , in some embodiments, a positive pressure waterproof starting joint 408 is configured on the camera lens cover 402, which is in a normally open state, so that compressed air enters the waterproof cover through the positive pressure waterproof starting joint 408, causing the air around the vision camera to flow out of the waterproof cover. In this way, during the startup process of the wafer equipment, the normally open positive pressure waterproof starting joint 408 can be connected to an external compressed air pump. In this way, compressed air enters the waterproof cover through the positive pressure waterproof starting joint 408, making the air in the waterproof cover in a positive pressure state, and the air around the vision camera flows out of the waterproof cover. In this way, it is very difficult for water mist, water molecules, etc. outside the waterproof cover to enter the waterproof cover, further reducing the probability of the lens of the vision camera being contaminated by liquid or water mist.

[0035] Since the vision camera captures the image information of the wafer processing position in the wafer equipment through the vision window 405, the vision window 405 also needs to be kept clean and dry. Therefore, in some embodiments, combining Figure 1 and Figure 2, a water injection joint 409 is arranged on the camera lens cover 402. When the water injection joint 409 is in an open state, cleaning water flushes the visual window 405; a dry gas joint 410 is arranged on the camera lens cover 402. When the dry gas joint 410 is in an open state, dry gas purges the visual window 405.

[0036] When the cleaning degree of the image information captured by the vision camera is less than the set value, the control device can control the water injection joint 409 to be in an open state. At this time, it can be connected to an external water pump, and the cleaning water can flush the visual window 405. After the flushing set time or when the set flushing conditions are met, the control device can control the water injection joint 409 to be in a closed state. At this time, the control device can control the dry gas joint 410 to be in an open state. At this time, it is connected to an external dry gas pump, and the dry gas can automatically purge the visual window 405 to accelerate the evaporation and flow of the cleaning water, so that the visual window 405 remains dry and clean. Of course, in some embodiments, the system for visual positioning of the wafer equipment may further include a heating device, such as a heating pipe, located between the external dry gas pump and the dry gas joint 410 to heat the dry gas. In this way, the heated gas can further dry the water droplets, water mist, etc. on the visual window 405.

[0037] In some embodiments, the system for visual positioning of the wafer equipment may further include: a wiper configured to wipe the visual window 405 when the combined robotic arm moves to a wiping position matching the wiper. In this way, after the control device controls the water injection joint 409 to be in a closed state, it can control the combined robotic arm to move to a wiping position matching the wiper and control the wiper to wipe the visual window 405. After the wiping set time or when other set conditions are met, the PLC can control the dry gas joint 410 to be in an open state. Thus, the dry gas can automatically heat and purge the visual window 405, further increasing the drying speed of the visual window 405.

[0038] It can be seen that in the embodiments of the present invention, the visual window 405 can be automatically cleaned and dried by means such as flushing with cleaning water, wiping water droplets, purging with dry gas, etc., further improving the accuracy of visual positioning and the intelligence of the system.

[0039] Such as Figure 3As shown, the planetary gear of the DSP device includes three placement holes, and each placement hole holds a wafer, that is, the placement holes are the wafer processing positions in the DSP device. In the embodiment of the present invention, during the visual positioning process of the DSP device, the vision camera only needs to capture the image information of two placement holes to obtain the position information of each placement hole on the planetary gear. That is, in some embodiments, the control device is configured to, when controlling the combined robotic arm to move to the first set position in the DSP area, obtain the first current image information of the first placement hole on the planetary gear captured by the vision camera through the vision window 405, and when controlling the combined robotic arm to move to the second set position in the DSP area, obtain the second current image information of the second placement hole on the planetary gear captured by the vision camera through the vision window 405, and determine the position information of each placement hole on the planetary gear according to the first current image information and the second current image information, where the planetary gear includes three placement holes, and each placement hole holds a wafer.

[0040] Among them, the control device is specifically configured to perform image recognition according to the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole, and determine the third current position information of the third placement hole according to the positional relationship of the three placement holes on the planetary gear, the first current position information, and the second current position information.

[0041] As Figure 4 shown, the centers A, B, and C of the three placement holes that need to be visually positioned are evenly distributed within a large circle, and the connecting lines form an equilateral triangle, with coordinates A(X1, Y1), B(X2, Y2), and C(X3, Y3) respectively. The image information that can be obtained through the vision camera can be used to achieve the coordinate positioning of points A and B. Then, based on the fact that the centers of the three placement holes on the planetary gear form an equilateral triangle, the coordinates of point C can be calculated. The specific method is as follows:

[0042] Since the positions of the three placement holes on the planetary gear of the DSP device are fixed, therefore, the vector BA = (X1 - X2, Y1 - Y2), and the vector BC = (X3 - X2, Y3 - Y2) are known, and the angle B is 60°. The vector BC can be regarded as the vector BA rotated by 60°. According to the vector formula, we can get:

[0043] X3 - X2 = (X1 - X2) * COSθ - (Y1 - Y2) * SINθ

[0044] Y3 - Y2 = (X1 - X2) * SINθ + (Y1 - Y2) * COSθ

[0045] where θ = 60°, and further we can get

[0046] X3 = COSθ(X1 - X2) - SINθ(Y1 - Y2) + X2

[0047] Y3 = SINθ(X1 - X2) + COSθ(Y1 - Y2) + Y2

[0048] That is, X3 = 1 / 2(X1 - X2) - √3 / 2(Y1 - Y2) + X2 = 1 / 2(X1 + X2) - √3 / 2(Y1 - Y2)

[0049] Y3 = √3 / 2(X1 - X2) + 1 / 2(Y1 - Y2) + Y2 = 1 / 2(Y1 + Y2) + √3 / 2(X1 - X2).

[0050] Therefore, in the embodiments of the present invention, the vision camera only needs to capture the image information corresponding to any two placement holes, and the control device can determine the position information of each placement hole on the planetary gear according to the image information. Thus, the frequency of movement of the combined robotic arm is reduced, and the number of times the vision camera captures images is also reduced, thereby improving the speed and efficiency of vision positioning.

[0051] As Figure 5 shown, a method for vision positioning of a wafer device provided by an embodiment of the present disclosure is applied to the above-mentioned system for vision positioning of a wafer device, and includes:

[0052] Step 501: When controlling the combined robotic arm to move to a first set position in the DSP area, obtain the first current image information of the first placement hole on the planetary gear captured by the vision camera, and when controlling the combined robotic arm to move to a second set position in the DSP area, obtain the second current image information of the second placement hole on the planetary gear captured by the vision camera.

[0053] When vision positioning is required, the DSP cover is opened, and the control device can control the combined robotic arm to move to a first set position between the upper disk and the lower disk, so that the lens position of the vision camera matches the position of the first placement hole on the planetary gear. Then, the control device controls the vision camera to take an image, and obtains the first current image information of the first placement hole captured by the vision camera. Then, the control device controls the combined robotic arm to move to a second set position between the upper disk and the lower disk, so that the lens position of the vision camera matches the position of the second placement hole on the planetary gear. Then, the control device controls the vision camera to take an image, and obtains the second current image information of the second placement hole captured by the vision camera.

[0054] Among them, the first set position and the second set position can be the stored coordinate position information of the corresponding combined robotic arm. That is, according to the stored first set coordinate position information of the combined robotic arm, the control device can control the combined robotic arm to move to the first set position in the DSP area. Similarly, according to the stored second set coordinate position information of the combined robotic arm, the control device can control the combined robotic arm to move to the second set position in the DSP area.

[0055] Step 502: Determine the position information of each placement hole on the planetary gear according to the first current image information and the second current image information. Among them, there are three placement holes on the planetary gear, and each placement hole carries a wafer.

[0056] In some embodiments, image recognition is performed according to the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole; then, according to the positional relationship of the three placement holes on the planetary gear, the first current position information, and the second current position information, the third current position information of the third placement hole can be determined.

[0057] As above, after the control device recognizes the coordinate information A(X1, Y1) of the center A of the first placement hole and the coordinate information B(X2, Y2) of the center B of the second placement hole, since the centers of the three placement holes on the planetary gear form an equilateral triangle, the coordinate information C(X3, Y3) of the center C of the third placement hole can be calculated, where X3 = 1 / 2(X1 - X2) - √3 / 2(Y1 - Y2) + X2 = 1 / 2(X1 + X2) - √3 / 2(Y1 - Y2);

[0058] Y3 = √3 / 2(X1 - X2) + 1 / 2(Y1 - Y2) + Y2 = 1 / 2(Y1 + Y2) + √3 / 2(X1 - X2).

[0059] In the embodiment of the present invention, during the processing of the wafer by the DSP device, the wafer rotates while revolving around a central point, that is, a uniform polishing effect is achieved through planetary motion to avoid unevenness on the surface. Therefore, each time the DSP is opened for corresponding visual positioning, the large circle corresponding to the planetary gear will be displaced as a whole. Therefore, points A, B, and C will also be displaced respectively. Therefore, after the control device first moves the combined robotic arm to the first set position in the DSP area and first moves the combined robotic arm to the second set position in the DSP area, the vision camera can obtain the corresponding first initial image information and second initial image information, and according to the first initial image information and the second initial image information, determine the initial position information of each placement hole on the star wheel, which are the initial coordinate information of the corresponding centers, and can be A(X1, Y1), B(X2, Y2), C(X3, Y3).

[0060] In this way, after the control device controls the combined robotic arm to move to the first set position in the DSP area to obtain the first current image information, and controls the combined robotic arm to move to the second set position in the DSP area to obtain the second current image information, the control device can, through image recognition and comparison with the first initial image information and the second initial image information obtained by the first shooting, obtain the corresponding position offset and calculate the third position offset. That is, in some embodiments, determining the third current position information of the third placement hole includes: obtaining the first position offset between the first current position information and the saved first initial position information, and obtaining the second position offset between the second current position information and the saved second initial position information; according to the positional relationship of the three placement holes on the planetary gear, and the first position offset and the second position offset, obtaining the third position offset corresponding to the third placement hole.

[0061] Similarly, as Figure 4 shown, after the control device obtains the first current image information and the second current image information captured by the vision camera, it can obtain the first current position information and the second current position information. Then, the first position offset between the first current position information and the saved first initial position information, which are respectively (ΔX1, ΔY1), and the second position offset between the second current position information and the saved second initial position information, which are respectively (ΔX2, ΔY2), can be obtained.

[0062] According to the above, X3 + ΔX3 = 1 / 2(X1 + ΔX1 + (X2 + ΔX2)) - √3 / 2(Y1 + ΔY1 - (Y2 + ΔY2)); Y3 + ΔY3 = √3 / 2(X1 + ΔX1 + (X2 + ΔX2)) + 1 / 2(Y1 + ΔY1 + (Y2 + ΔY2)).

[0063] Therefore, ΔX3 = 1 / 2(X1 + ΔX1 + (X2 + ΔX2)) - √3 / 2(Y1 + ΔY1 - (Y2 + ΔY2)) - X3, that is, ΔX3 = 1 / 2(ΔX1 + ΔX2) - √3 / 2(ΔY1 - ΔY2).

[0064] Similarly, ΔY3 = √3 / 2(X1 + ΔX1 + (X2 + ΔX2)) + 1 / 2(Y1 + ΔY1 + (Y2 + ΔY2)) - Y3; therefore, ΔY3 = √3 / 2(X1 + ΔX1 + (X2 + ΔX2)) + 1 / 2(Y1 + ΔY1 + (Y2 + ΔY2)) - (1 / 2(Y1 + Y2) + √3 / 2(X1 - X2)), that is, ΔY3 = √3 / 2(ΔX1 - ΔX2) + 1 / 2(ΔY1 + ΔY2)

[0065] In this way, the third position offset (ΔX3, ΔY3) corresponding to the third placement hole can be obtained. In this way, through the offset, the position information of each placement hole on the planetary gear can also be determined, realizing visual positioning in the DSP device.

[0066] It can be seen that in the embodiment of the present invention, each time visual positioning of the DSP device is performed, the control device only needs to move the combined robotic arm twice and control the vision camera to take two pictures to determine the position information of the three placement holes on the planetary gear of the DSP device, reducing the frequency of movement of the combined robotic arm and the number of times the vision camera takes pictures, thereby improving the speed and efficiency of visual positioning.

[0067] The following describes the specific process of visual positioning of the wafer device in combination with specific embodiments.

[0068] In this embodiment, the system for visual positioning of the DSP device can be as described above. The wafer clamping robotic arm and the vision camera located in the waterproof cover are combined to form a combined robotic arm. The control device can be a PLC to control the operation of the combined robotic arm, thereby driving the operation of the vision camera.

[0069] As Figure 6-1 、 6-2 shown, the process of visual positioning of the DSP device includes:

[0070] Step 601: The DSP device starts this operation. When performing visual positioning for the first time, the PLC controls the combined robotic arm to move to the first set position in the DSP area according to the saved first set position coordinates.

[0071] Step 602: The PLC controls the vision camera to take a picture to obtain the first current image information of the first placement hole on the planetary gear.

[0072] Step 603: Determine whether the clarity of the first current image information is greater than the set clarity? If so, execute step 608; otherwise, execute step 604.

[0073] Step 604: The PLC moves the combined robotic arm outside the DSP area and controls the water injection joint to be in the open state so that the cleaning water flushes the vision window.

[0074] Step 605: When the flushing duration reaches the first set time, the PLC closes the water injection joint, moves the combined robotic arm to the wiping position matching the windshield wiper, and controls the windshield wiper to wipe the vision window.

[0075] Step 606: When the wiping duration reaches the second set time, the PLC controls the windshield wiper to stop running and controls the drying gas joint to be in the open state so that the heated drying gas dries the vision window.

[0076] Step 607: When the drying duration reaches the third set time, the PLC controls the drying gas connector to be in the closed state, and controls the combined robotic arm to move to the first set position in the DSP area according to the saved first set position coordinates. Return to Step 602.

[0077] Step 608: The PLC determines the first current image information as the first initial image information, and controls the combined robotic arm to move to the second set position in the DSP area according to the saved second set position coordinates.

[0078] Step 609: The PLC controls the vision camera to take a picture, obtains the second current image information of the second placement hole on the planetary gear, and determines it as the second initial image information.

[0079] Step 610: The PLC determines the first initial position information A (X1, Y1) of the center position of the first placement hole and the second initial position information B (X2, Y2) of the center position of the second placement hole according to the first initial image information and the second initial image information.

[0080] Step 611: The PLC obtains the third initial position information C (X3, Y3) through the equilateral triangle formed by the centers of the three placement holes on the planetary gear according to the first initial position information A (X1, Y1) and the second initial position information B (X2, Y2).

[0081] Wherein, X3 = 1 / 2(X1 + X2) - √3 / 2(Y1 - Y2); Y3 = 1 / 2(Y1 + Y2) + √3 / 2(X1 - X2).

[0082] Step 612: When it is determined that it is not the first time for visual positioning, the PLC controls the combined robotic arm to move to the first set position in the DSP area according to the saved first set position coordinates, and controls the vision camera to take a picture to obtain the first current image information of the first placement hole on the planetary gear.

[0083] Of course, during each visual positioning, image clarity inspection can also be performed. The specific process is as described in Steps 603 - 607 and will not be described in detail here.

[0084] Step 613: The PLC controls the combined robotic arm to move to the second set position in the DSP area according to the saved second set position coordinates, and controls the vision camera to take a picture to obtain the second current image information of the second placement hole on the planetary gear.

[0085] Step 614: The PLC performs image recognition according to the first current image information and the second current image information to obtain the first current position information of the first placement hole and the second current position information of the second placement hole.

[0086] Step 615: The PLC obtains a first position offset (ΔX1, ΔY1) between the first current position information and the saved first initial position information, and obtains a second position offset (ΔX2, ΔY2) between the second current position information and the saved second initial position information.

[0087] Step 616: The PLC obtains a third position offset (ΔX3, ΔY3) corresponding to the third placement hole according to the first position offset and the second position offset through an equilateral triangle formed by the centers of three placement holes on the planetary gear.

[0088] Wherein, ΔX3 = 1 / 2(ΔX1 + ΔX2) - √3 / 2(ΔY1 - ΔY2); ΔY3 = √3 / 2(ΔX1 - ΔX2) + 1 / 2(ΔY1 + ΔY2).

[0089] Of course, during the operation of the DSP device, when visual positioning is also required, it can return to step 612 to continue obtaining the position offset each time and continue with the corresponding positioning.

[0090] It can be seen that in the embodiment of the present invention, the PLC only needs to move the combined robotic arm twice and control the vision camera to take two pictures to determine the position information of the three placement holes on the planetary gear of the DSP device, reducing the frequency of movement of the combined robotic arm and the number of times the vision camera takes pictures, thereby improving the speed and efficiency of visual positioning. Moreover, the PLC can also perform flushing and drying treatments on the vision window, further improving the accuracy of visual positioning and the intelligence of the system.

[0091] Combined Figure 7 , the embodiment of the present invention provides a device 700 for visual positioning of a wafer device, including:

[0092] A processor 1000 and a memory 1001, and may further include a communication interface 1002 and a bus 1003. Among them, the processor 1000, the communication interface 1002, and the memory 1001 can communicate with each other through the bus 1003. The communication interface 1002 can be used for information transmission. The processor 1000 can call the logical instructions in the memory 1001 to execute the method for controlling a semiconductor manufacturing device in the above embodiment.

[0093] In addition, when the logical instructions in the above-mentioned memory 1001 are implemented in the form of a software functional unit and sold or used as an independent product, they can be stored in a computer-readable storage medium.

[0094] The memory 1001, as a computer-readable storage medium, can be used to store software programs and computer-executable programs, such as the program instructions / modules corresponding to the methods in the embodiments of the present invention. The processor 1000 executes functional applications and data processing by running the program instructions / modules stored in the memory 1001, that is, implements the method for visual positioning of wafer equipment in the above method embodiments.

[0095] The memory 1001 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function; the data storage area can store data created according to the use of the terminal device, etc. In addition, the memory 1001 may include high-speed random access memory and may also include non-volatile memory.

[0096] An embodiment of the present invention provides a device for controlling semiconductor manufacturing equipment, including: a processor and a memory storing program instructions, and the processor is configured to execute the method for visual positioning of wafer equipment when executing the program instructions.

[0097] An embodiment of the present invention provides a storage medium storing program instructions, and when the program instructions are running, they execute the method for visual positioning of wafer equipment as described above.

[0098] The present invention is described with reference to the flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, and the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate a device for implementing the functions specified in one process Figure 1 one process or multiple processes and / or blocks Figure 1 or multiple blocks.

[0099] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory generate a manufactured product including an instruction device, and the instruction device implements the functions specified in one process Figure 1 one process or multiple processes and / or blocks Figure 1 or multiple blocks.

[0100] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus, so that a series of operation steps are performed on the computer or other programmable apparatus to produce a computer-implemented process, thereby providing instructions for implementing the steps specified in one process or a plurality of processes and / or blocks Figure 1 one process or a plurality of processes and / or blocks Figure 1 steps of the functions specified in one block or a plurality of blocks.

[0101] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention is also intended to include these modifications and variations.

Claims

1. A method for visual positioning of wafer equipment, characterized in that: The wafer holding robot arm and the waterproof cover with a built-in visual camera are combined together to form a combined robot arm. The method includes: When the combined robotic arm is controlled to move to a first set position in the double-sided grinding and polishing equipment area, a first current image information of a first placement hole on the planetary wheel taken by the visual camera is obtained; and, when the combined robotic arm is controlled to move to a second set position in the double-sided grinding and polishing equipment area, a second current image information of a second placement hole on the planetary wheel taken by the visual camera is obtained; Determine the position information of each placement hole on the planetary wheel according to the first current image information and the second current image information, wherein the planetary wheel includes three placement holes, and each placement hole carries a wafer; Wherein, determining the position information of each placement hole on the planetary wheel includes: Perform image recognition according to the first current image information and the second current image information to obtain first current position information of the first placement hole and second current position information of the second placement hole; Determine the third current position information of the third placement hole according to the position relationship of the three placement holes on the planetary wheel, the first current position information, and the second current position information; The determining of the third current position information of the third placement hole comprises: Obtaining a first position offset between the first current position information and the stored first initial position information, and obtaining a second position offset between the second current position information and the stored second initial position information; According to the positional relationship among the three placement holes on the planetary wheel, and the first position offset and the second position offset, a third position offset corresponding to the third placement hole is obtained.

2. A device for visual positioning of wafer equipment, comprising: The device comprises a processor and a memory storing program instructions, wherein the processor is configured to execute the method for visual positioning of wafer equipment as claimed in claim 1 when executing the program instructions.

Images