Substrate pickup tool, substrate assembly station, and substrate assembly method

Abstract

A substrate picking tool is suitable for picking a substrate provided with a through hole. The substrate picking tool comprises a movable frame and a flexible clamping jaw. The flexible clamping jaw comprises an assembling ring part and a plurality of jaw parts. The assembly ring part is arranged on the movable frame. The claw parts are connected to the assembly ring part and each provided with an outer abutting face, and the flexible clamping claw is suitable for corresponding to the penetrating holes, so that the claw parts swing relative to the assembly ring part and abut against the hole wall faces of the penetrating holes through the outer abutting faces.

Description

Technical Field

[0001] The present invention relates to a picking tool, an assembling station and an assembling method, in particular to a substrate picking tool, a substrate assembling station and a substrate assembling method. Background Art

[0002] With the advancement of technology, the manufacturing process of each component of electronic devices has become more complicated. For example, semiconductor wafers, printed circuit boards or display panels need to go through multiple processes such as grinding, machining, etching, high-temperature heating, etc., and even after each process is completed, it is necessary to add the process of assembling with external components.

[0003] Taking the assembly of semiconductor wafers to external components as an example, in the past, vacuum adsorption was used to fix and move semiconductor wafers. However, since multiple electronic components can be set on semiconductor wafers today, the surface of semiconductor wafers is no longer flat, so the previous vacuum adsorption method can no longer fix and move semiconductor wafers with electronic components. Therefore, how to effectively fix and move semiconductor wafers with electronic components is one of the problems that R&D personnel should start to solve. Summary of the invention

[0004] The invention provides a substrate picking tool, a substrate assembling station and a substrate assembling method, so as to stack a substrate with electronic parts on an assembling plate.

[0005] A substrate picking tool disclosed in an embodiment of the present invention is suitable for picking up a substrate with a through hole. The substrate picking tool includes a movable frame and a flexible clamp. The flexible clamp includes an assembly ring and a plurality of claws. The assembly ring is mounted on the movable frame. The claws are connected to the assembly ring and each has an outer abutment surface. The flexible clamp is suitable for corresponding to the through hole, so that the claws swing relative to the assembly ring and support the hole wall of the through hole through the outer abutment surfaces.

[0006] A substrate assembly station disclosed in another embodiment of the present invention is suitable for assembling a substrate provided with a through hole and an assembly plate. The substrate assembly station includes a carrying device, a moving mechanism and a substrate picking tool. The carrying device includes a first carrying surface and a second carrying surface. The first carrying surface and the second carrying surface are suitable for carrying the substrate and the assembly plate, respectively. The moving mechanism is disposed on the carrying device and is provided with a movable portion that can move relative to the carrying device. The substrate picking tool includes a movable frame and a flexible clamp. The movable frame is disposed on the movable portion of the moving mechanism. The flexible clamp includes an assembly ring portion and a plurality of claw portions. The assembly ring portion is mounted on the movable frame. These claw portions are connected to the assembly ring portion and each has an outer abutment surface. The flexible clamp portions are suitable for corresponding to the through holes, so that these claw portions swing relative to the assembly ring portion and support the hole walls of these through holes through these outer abutment surfaces to pick up the substrate, and the substrate is driven by the moving mechanism and is disposed on the assembly plate.

[0007] Another embodiment of the present invention discloses a substrate assembly method comprising the following steps: fixing a substrate by an outer abutment surface of a flexible clamping jaw of a substrate picking tool, lifting the substrate picking tool, moving the substrate picking tool, and stacking the substrate on an assembly plate.

[0008] According to the substrate picking tool, substrate assembly station and substrate assembly method of the above-mentioned embodiments, the outer abutment surface of the flexible clamping claw supports the through-hole of the substrate, so that the substrate picking tool can take into account both the non-flat surface substrate with electronic components and the flat surface substrate without electronic components to be stacked on the assembly board.

[0009] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention and to provide further explanation of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 4 is a perspective schematic diagram of a substrate assembly station according to a first embodiment of the present invention.

[0011] Figure 2 for Figure 1 Schematic diagram of the floor plan.

[0012] Figure 3 for Figure 1 A schematic plan view of a substrate and a portion of a supporting device.

[0013] Figure 4 for Figure 1 A bottom view of a substrate picking tool.

[0014] Figure 5A for Figure 1 A partial three-dimensional schematic diagram of a substrate picking tool.

[0015] Figure 5B for Figure 5A Schematic diagram of a partial cross section.

[0016] Figures 6 to 11 for Figure 1 Schematic diagram of substrate assembly of a substrate assembly station.

[0017] The reference numerals are described as follows:

[0018] 10: Substrate assembly station

[0019] 20: Substrate

[0020] 22: Electronic parts

[0021] 24: Perforation

[0022] 30: Assemble the board

[0023] 40: Gas supply machine

[0024] 100: Carrying device

[0025] 110: Loading platform

[0026] 111: First bearing surface

[0027] 120: Conveyor belt

[0028] 121: Second bearing surface

[0029] 200: Mobile mechanism

[0030] 210: Activities Department

[0031] 300: Substrate Pickup Tool

[0032] 310: Mobile rack

[0033] 320: Flexible jaws

[0034] 321: Assemble the ring

[0035] 3211: Inner wall surface

[0036] 322: Claw

[0037] 3221: Bevel claw section

[0038] 3222: Straight claw section

[0039] 3223: External abutment surface

[0040] 32211: Give way to the slope

[0041] 330: Pipeline connector

[0042] 340: Suction Cup

[0043] 350: Connecting pipe

[0044] 410: First Image Capturer

[0045] 420: Second image capture device

[0046] A: Central axis

[0047] G: Gap

[0048] D1~D5: Direction

[0049] E1, E2: extension direction

[0050] F: Gas

[0051] S: Chamber

[0052] T1, T2: thickness DETAILED DESCRIPTION

[0053] See also Figures 1 to 3 . Figure 1 FIG. 1 is a perspective schematic diagram of a substrate assembly station 10 according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the floor plan. Figure 3 for Figure 1 A schematic plan view of a substrate 20 and a portion of a carrying device 100 is shown.

[0054] The substrate assembly station 10 of the present embodiment is suitable for assembling a substrate 20 and an assembly plate 30. The substrate 20 is, for example but not limited to, a semiconductor wafer (System on Wafer, SOW) having a plurality of electronic components 22, and the substrate 20 is, for example, provided with a plurality of through holes 24. The assembly plate 30 is, for example but not limited to, a cold plate.

[0055] The substrate assembly station 10 includes a carrier device 100, a moving mechanism 200 and a substrate picking tool 300. The carrier device 100 includes a carrier platform 110 and a conveyor belt 120. The carrier platform 110 has a first carrier surface 111, and the first carrier surface 111 is used to carry the substrate 20. The conveyor belt 120 has a second carrier surface 121, and the second carrier surface 121 is used to carry the assembly board 30.

[0056] In this embodiment, the carrying device 100 includes a carrying platform 110 and a conveyor belt 120, but the present invention is not limited thereto. In other embodiments, the carrying device may include only a single carrying platform, and the single carrying platform includes both the first carrying surface and the second carrying surface. Alternatively, the carrying device includes two carrying platforms, and the two carrying platforms include the first carrying surface and the second carrying surface respectively. Alternatively, the carrying device includes two conveyor belts, and the two conveyor belts include the first carrying surface and the second carrying surface respectively.

[0057] The moving mechanism 200 is, for example but not limited to, a multi-axis robot arm, such as a two-axis or three-axis robot arm. The moving mechanism 200 is disposed on the carrying device 100 and has a movable portion 210 that can move relative to the carrying device 100 .

[0058] See also Figure 1 , Figure 4 , Figure 5A and Figure 5B . Figure 4 for Figure 1 A bottom view of a substrate picking tool 300 is shown. Figure 5A for Figure 1 A partial three-dimensional schematic diagram of a substrate picking tool 300 is shown. Figure 5B for Figure 5AThe substrate picking tool 300 includes a movable frame 310 and a plurality of flexible clamps 320. The movable frame 310 is disposed on the movable portion 210 of the moving mechanism 200. Each flexible clamp 320 is made of, for example, rubber and includes an assembly ring 321 and a plurality of claws 322. The assembly ring 321 is mounted on the movable frame 310, for example, through a pipe joint 330. The assembly ring 321 has a chamber S (such as Figure 5B As shown), the chamber S is surrounded by the inner wall surface 3211 of the assembly ring portion 321, and the chamber S is connected to the pipe joint 330, and the pipe joint 330 is further connected to a gas supply machine 40 (as shown) through a connecting pipe 350. Figure 1 As shown). The gas supply machine 40 is, for example but not limited to, an air compressor. In order to clearly present the diagram, Figure 1 and Figure 2 Only some of the pipe joints 330 are connected to the connecting pipe 350. In fact, each pipe joint 330 is connected to the connecting pipe 350.

[0059] Each claw portion 322 extends from the assembly ring portion 321 in a direction away from the movable frame 310, and the claw portion 322 has an outer abutment surface 3223. Specifically, the claw portions 322 of each flexible clamping jaw 320 surround a gap G, and the outer abutment surfaces 3223 of the claw portions 322 face away from the gap G. Gas F (such as Figure 8 As shown in the figure, the flexible clamping jaw 320 is adapted to flow to the chamber S via the connecting pipe joint 330, and squeeze the inner wall surface 3211 surrounding the chamber S to make the claws 322 of the flexible clamping jaw 320 move away from each other.

[0060] When the gas F flows through the chamber S, the inner wall surface 3211 of the chamber S is supported by the gas F, and the claws 322 of the flexible clamps 320 are moved away from each other through the deformation of the chamber S, and the outer abutting surfaces 3223 are supported against the hole walls of the through holes 24, so as to jointly pick up the substrate 20, and the substrate 20 is set on the assembly plate 30 under the drive of the moving mechanism 200. The outer abutting surfaces 3223 of the claws 322 are supported against the hole walls of the through holes 24, for example, to prevent the claws 322 from sliding relative to the substrate 20 through the friction between the claws 322 and the substrate 20, so as to achieve the effect of supporting the substrate 20 through the claws 322.

[0061] In this embodiment, each claw portion 322 includes an oblique claw section 3221 and a straight claw section 3222. The oblique claw section 3221 is connected to the assembly ring portion 321, and the extension direction E1 of the oblique claw section 3221 is, for example, angularly related to the central axis A of the assembly ring portion 321, such as the extension direction E1 of the oblique claw section 3221 is not parallel to the central axis A of the assembly ring portion 321. The straight claw section 3222 is connected to the oblique claw section 3221, and the extension direction E2 of the straight claw section 3222 is parallel to the central axis A of the assembly ring portion 321, that is, the straight claw section 3222 is connected to the assembly ring portion 321 via the oblique claw section 3221, and the extension direction E2 of the straight claw section 3222 is angularly related to the extension direction E1 of the oblique claw section 3221, such as the extension direction E2 of the straight claw section 3222 is not parallel to the extension direction E1 of the oblique claw section 3221. In addition, the aforementioned outer supporting surface 3223 is, for example, located on the side of the oblique claw section 3221 and the straight claw section 3222 away from the gap G, so as to support the substrate 20 through the straight claw section 3222 alone, or support the substrate 20 through the oblique claw section 3221 alone, or support the substrate 20 through both the straight claw section 3222 and the oblique claw section 3221.

[0062] In this embodiment, each inclined claw section 3221 includes two oblique surfaces 32211 , and the two oblique surfaces 32211 are designed to prevent the flexible clamping claw 320 from interfering with the electronic component 22 of the substrate 20 .

[0063] In this embodiment, the thickness of each inclined claw section 3221 gradually decreases from the side away from the straight claw section 3222 to the side close to the straight claw section 3222, that is, the thickness T1 of each inclined claw section 3221 away from the straight claw section 3222 is greater than the thickness T2 of each inclined claw section 3221 close to the straight claw section 3222, so that the gas F (such as Figure 8 When the gas F flows into the chamber S (as shown), the gas F will squeeze the inner wall surface 3211 surrounding the chamber S, and drive the inclined claw section 3221 and the straight claw section 3222 to expand outward through the deformation of the chamber S, or in other words, the inclined claw section 3221 and the straight claw section 3222 move in the direction away from the gap G, or in other words, the gap G between each inclined claw section 3221 and the gap G between each straight claw section 3222 will become larger.

[0064] In this embodiment, the substrate 20 is described as being not bent or deformed, that is, each flexible clamping jaw 320 only supports the substrate 20 through the straight jaw section 3222 of the flexible clamping jaw 320, but the present invention is not limited thereto. In other embodiments, the design of the flexible clamping jaw can also allow for the substrate to be bent or deformed. If the substrate is bent or deformed, such as to be in a smiling shape, the outer periphery of the substrate can be supported by the oblique jaw section of the jaw, and the center of the substrate can be supported by the straight jaw section of the jaw.

[0065] In this embodiment, the assembly ring 321 is installed on the movable frame 310 through the pipe joint 330, but the present invention is not limited thereto. In other embodiments, the assembly ring 321 can also be directly installed on the frame.

[0066] In this embodiment, the substrate assembly station 10 may further include a first image capturer 410 and a second image capturer 420. The first image capturer 410 and the second image capturer 420 are both cameras, for example. The first image capturer 410 is disposed on the carrier 110 of the carrier device 100. The second image capturer 420 is disposed on the movable portion 210 of the moving mechanism 200 to move together with the movable portion 210 of the moving mechanism 200.

[0067] In this embodiment, since the substrate 20 still has a planar area, the substrate picking tool 300 may be further equipped with a plurality of suction cups 340 to absorb the planar area of ​​the substrate 20 through the suction cups 340. In this way, the reliability of the substrate picking tool 300 picking up the substrate 20 may be further improved. However, the number of suction cups 340 is not limited thereto. In other embodiments, the substrate picking tool may not be provided with suction cups 340 or the number of suction cups 340 may be changed to a single one or other number.

[0068] See also Figures 6 to 11 . Figures 6 to 11 for Figure 1 Schematic diagram of substrate 20 assembly of substrate assembly station 10. In order to clearly present the diagram, Figures 9 to 11 Only some of the pipe connectors 330 are connected to the connecting pipe 350. In fact, each pipe connector 330 is connected to the connecting pipe 350. Figure 6 and Figure 7 As shown in FIG. 1 , the flexible clamping claws 320 of the substrate picking tool 300 are extended into the plurality of through holes 24 of the substrate 20 along the direction D1. Figure 8 As shown, through the gas supply machine 40 (such as Figure 1 As shown in FIG. 1 , the gas F is allowed to flow through the chamber S of the flexible clamping jaw 320, and the gas F is squeezed around the inner wall surface 3211 of the chamber S, so that the multiple claws 322 of the flexible clamping jaw 320 are driven to expand outward along the direction D2 toward the hole wall surface of the through hole 24 through the deformation of the chamber S. In this way, the outer abutting surfaces 3223 of the claws 322 can be supported against the hole wall surface of the through hole 24 to fix the substrate 20 together. In other words, the substrate 20 can be fixed by the flexible clamping jaws 320 of the substrate picking tool 300.

[0069] Then, if Fig. 9As shown, the substrate picking tool 300 is lifted along the direction D3 by the moving mechanism 200, so that the substrate 20 moves along the direction D3 and is separated from the first carrying surface 111 of the carrying platform 110. In addition, when the substrate 20 is separated from the first carrying surface 111 of the carrying platform 110, the first image capturer 410 can be moved above and the first image capturer 410 (such as Figure 2 ) photographs the substrate 20 to obtain a first image.

[0070] Then, if Fig.10 As shown, the substrate picking tool 300 is moved along the direction D4 by the moving mechanism 200 to move the substrate 20 to the top of the assembly plate 30 along the direction D4. In addition, when the substrate 20 is located above the assembly plate 30, the second image capturer 420 (such as Figure 2 Then, the substrate 20 is aligned with the assembly board 30 according to the first image and the second image.

[0071] Then, if Fig.11 As shown, the substrate picking tool 300 is moved along a direction D5 to bring the substrate 20 close to the second carrying surface 121 and stacked on an assembly plate 30 .

[0072] In addition, before the step of moving the substrate picking tool 300 and stacking the substrates on the assembly plate 30 , the assembly plate 30 may be transported by a conveyor belt 120 for stacking the substrates 20 .

[0073] In addition, in the above embodiment, the substrate 20 is, for example, a large-sized wafer and is provided with a plurality of through holes 24. Correspondingly, the number of the flexible clamping claws 320 of the substrate picking tool 300 is multiple, but the present invention is not limited thereto. In other embodiments, if the substrate is changed to a small-sized wafer with a single through hole, the number of the flexible clamping claws of the substrate picking tool can also be correspondingly changed to a single one.

[0074] According to the substrate picking tool, substrate assembly station and substrate assembly method of the above-mentioned embodiments, the outer abutment surface of one or more flexible clamps is supported against the through-holes of the substrate, so that the substrate picking tool can take into account both the non-flat surface substrate with electronic components and the flat surface substrate without electronic components to be stacked on the assembly board.

[0075] Although the present invention is disclosed as above with the aforementioned embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be determined by the claims attached to this specification.

Claims

1. A substrate picking tool, suitable for picking up a substrate with a through hole, the substrate picking tool comprising: a movable frame; and A flexible clamping jaw comprises an assembly ring and a plurality of claws, the assembly ring is mounted on the movable frame, the plurality of claws are connected to the assembly ring and each has an outer abutment surface, the flexible clamping jaw is suitable for corresponding to the through hole, so that the plurality of claws swing relative to the assembly ring and are supported against a hole wall of the through hole through the outer abutment surface. 2 . The substrate picking tool as claimed in claim 1 , wherein the flexible clamping jaw is provided with a chamber surrounded by an inner wall surface of the flexible clamping jaw.

3. The substrate picking tool as described in claim 1, wherein each claw portion comprises an oblique claw section and a straight claw section, the oblique claw section is connected to the assembly ring portion, the straight claw section is connected to the oblique claw section, and the straight claw section and the oblique claw section have an angle relationship. 4 . The substrate picking tool as claimed in claim 3 , wherein the inclined claw section is provided with at least one inclined surface for giving way. 5 . The substrate picking tool as claimed in claim 3 , wherein a thickness of the oblique claw section gradually decreases from a side away from the straight claw section toward a side close to the straight claw section.

6. A substrate assembly station, adapted to assemble a substrate having a through hole and an assembly plate, the substrate assembly station comprising: A carrying device, comprising a first carrying surface and a second carrying surface, wherein the first carrying surface and the second carrying surface are suitable for carrying the substrate and the assembly board respectively; a moving mechanism, disposed on the carrying device and having a movable portion movable relative to the carrying device; and A substrate picking tool comprising: a movable frame, disposed on the movable portion of the moving mechanism; and A flexible clamp comprises an assembly ring and a plurality of claws, the assembly ring is mounted on the movable frame, the claws are connected to the assembly ring and each has an outer abutment surface, the flexible clamp is suitable for corresponding to the through hole, so that the claws swing relative to the assembly ring and are supported against a hole wall of the through hole through the outer abutment surface to pick up the substrate, and the substrate is driven by the moving mechanism to be set on the assembly plate. 7 . The substrate assembly station as claimed in claim 6 , wherein the flexible clamping jaw has a chamber surrounded by an inner wall surface of the flexible clamping jaw.

8. The substrate assembly station as described in claim 6, wherein each of the claws includes an oblique claw section and a straight claw section, the oblique claw section is connected to the assembly ring section, the straight claw section is connected to the oblique claw section, and the straight claw section has an angle relationship with the oblique claw section.

9. The substrate assembly station as claimed in claim 8, wherein the inclined claw section has at least one inclined surface for giving way. 10 . The substrate assembly station as claimed in claim 8 , wherein a thickness of the oblique claw section gradually decreases from a side away from the straight claw section toward a side close to the straight claw section.

11. The substrate assembly station of claim 6, wherein the moving mechanism is a robot arm. 12 . The substrate assembly station as claimed in claim 6 , wherein the carrying device comprises a carrying platform and a conveyor belt, the first carrying surface is located on the carrying platform, and the second carrying surface is located on the conveyor belt. 13 . The substrate assembly station as claimed in claim 6 , further comprising a first image capturer disposed on the carrying device. 14 . The substrate assembly station as claimed in claim 13 , further comprising a second image capturer, wherein the second image capturer is disposed on the movable portion of the moving mechanism.

15. A substrate assembly method, comprising: Fixing a substrate by an outer abutment surface of a flexible clamping jaw of a substrate picking tool; lifting the substrate pick-up tool; and The substrate picking tool is moved to stack the substrate on an assembly plate.

16. The substrate assembly method of claim 15, wherein the step of fixing the substrate by the flexible clamp of the substrate picking tool comprises: extending the flexible clamping jaw of the substrate picking tool into a through hole of the substrate; and The plurality of claws of the flexible clamp are expanded toward a hole wall of the through hole, so that the outer abutting surfaces of the plurality of claws are supported against the hole wall of the through hole to fix the substrate.

17. The substrate assembly method of claim 15, wherein the steps of lifting and moving the substrate picking tool are driven by a moving mechanism.

18. The substrate assembly method according to claim 15, wherein before the step of moving the substrate picking tool and stacking the substrate on the assembly plate, the method further comprises: The assembled panel is transported by a conveyor belt.

19. The substrate assembly method according to claim 15, wherein before the step of moving the substrate picking tool and stacking the substrate on the assembly plate, the method further comprises: The substrate is photographed by a first image capturer located on a carrying device.

20. The substrate assembly method according to claim 19, wherein before the step of moving the substrate picking tool and stacking the substrate on the assembly plate, the method further comprises: The assembly plate is photographed by a second image capturer located on a moving mechanism to align the substrate with the assembly plate.

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