Relay circuit board and manufacturing method thereof

Abstract

A relay circuit board comprises a first external circuit structure, a second external circuit structure, an internal circuit structure, a magnetic induction element and a switch assembly. The internal circuit structure is arranged between the first external circuit structure and the second external circuit structure. The switch assembly is disposed in the first cavity of the first external line junction. The magnetic sensing element is arranged in the second cavity of the internal circuit structure. The internal circuit structure comprises a plurality of coil loops, and the plurality of coil loops surround the periphery of the magnetic induction element and are embedded in the inner wall of the second cavity. When the coil loop is electrified, the magnetic induction element can generate a magnetic field. The magnetic induction element and the switch assembly embedded in the circuit board can reduce the overall size of the relay circuit board. In addition, the embedded coil loop is formed in the circuit board by using a spiral drill, so that the process steps can be simplified.

Description

Technical Field

[0001] The invention relates to a relay circuit board and a method for manufacturing the relay circuit board. Background Art

[0002] Conventional relays are usually externally connected to a circuit board, such as mounted on a circuit board, to achieve the function of a relay. However, the thickness of a relay is much greater than that of a general circuit board, which increases the overall size (e.g., volume) of the circuit board on which the relay is mounted, making it difficult to meet the trend of miniaturization of existing electronic products. Summary of the invention

[0003] An embodiment of the present invention provides a relay circuit board and a manufacturing method thereof, wherein a magnetically sensitive element and a switch assembly embedded in the circuit board are used to form an embedded relay circuit board, thereby reducing the overall size of the relay circuit board.

[0004] The relay circuit board provided by at least one embodiment of the present invention comprises a first external circuit structure, a second external circuit structure, an internal circuit structure, a magnetic induction element and a switch assembly. The first external circuit structure has a first cavity. The internal circuit structure is arranged between the first external circuit structure and the second external circuit structure, and has a second cavity, wherein the second cavity extends from the first external circuit structure to the second external circuit structure, and the first cavity is connected to the second cavity. The magnetic induction element is arranged in the second cavity. The switch assembly is arranged in the first cavity, wherein at least one surface of the switch assembly is exposed from the first external circuit structure, and there is a gap between the switch assembly and the magnetic induction element, wherein the internal circuit structure comprises a plurality of coil loops, the plurality of coil loops surround the periphery of the magnetic induction element, and are embedded in the inner wall of the second cavity, wherein when the coil loop is energized, the magnetic induction element generates a magnetic field.

[0005] In some embodiments, the switch assembly includes a moving part and a spring. The moving part includes a main body and an extension connected to the main body, wherein the magnetic sensing element attracts the moving part using a magnetic field so that the moving part is connected to the magnetic sensing element. The spring surrounds the extension of the moving part.

[0006] In some embodiments, the magnetically sensitive element and the moving element are both unmagnetized ferromagnets or unmagnetized ferrite magnets.

[0007] In some embodiments, the switch assembly further includes a housing, wherein a gap is located between the housing and the magnetically sensitive element, and the housing includes an opening for allowing an extension portion of the moving member to shuttle between the interior of the housing and the gap.

[0008] In some embodiments, when the plurality of coil loops are de-energized, the spring moves the moving member to separate the moving member from the magnetically sensitive element.

[0009] The manufacturing method of the relay circuit board provided in at least one embodiment of the present invention comprises the following steps: providing an internal circuit structure; using a first threaded drill to form a first threaded hole in the internal circuit structure, wherein the first inner wall of the first threaded hole has a threaded pattern; depositing a metal layer on the first inner wall of the first threaded hole; after depositing the metal layer, using a second threaded drill to form a second threaded hole in the first threaded hole and the metal layer, wherein the second inner wall of the second threaded hole has a spiral coil loop; setting a magnetically sensitive element in the second threaded hole; forming a first external circuit structure on the first surface of the internal circuit structure; forming a second external circuit structure on the second surface of the internal circuit structure, wherein the first surface is opposite to the second surface; and setting a switch component in the first external circuit structure, wherein there is a gap between the switch component and the magnetically sensitive element.

[0010] In some embodiments, the manufacturing method of the relay circuit board further includes the following steps: before setting the magnetic sensitive element in the second threaded hole, setting tape on the second surface of the internal circuit structure; and after setting the magnetic sensitive element in the second threaded hole, removing the tape.

[0011] In some embodiments, the method for manufacturing a relay circuit board further includes the following steps: during the process of disposing the magnetic inductive element in the second threaded hole, filling a dielectric material between the magnetic inductive element and the second inner wall.

[0012] In some embodiments, the method for manufacturing a relay circuit board further includes the following steps: before disposing the switch component in the first external circuit structure, forming a groove in the first external circuit structure.

[0013] In some embodiments, the method for manufacturing a relay circuit board further includes the following steps: during the process of disposing the switch component in the first external circuit structure, filling a dielectric material between the switch component and the groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] When read in conjunction with the accompanying drawings, the various aspects of the present application can be best understood according to the following detailed description. It should be understood that, in accordance with standard practice in the industry, the various features are not drawn to scale. In fact, the size of the various features can be arbitrarily increased or reduced for clarity.

[0015] Figures 1 to 10 The figure is a cross-sectional view of a relay circuit board in various stages of the process according to at least one embodiment of the present invention.

[0016] Fig.11A It is a partial cross-sectional schematic diagram of multiple coil loops in at least one embodiment of the present invention when power is off.

[0017] Fig. 11B It is a partial cross-sectional schematic diagram of a plurality of coil loops when powered on in at least one embodiment of the present invention. DETAILED DESCRIPTION

[0018] In the following text, in order to clearly present the technical features of the present invention, the dimensions (such as length, width, thickness and depth) of the components (such as circuit layers, dielectric layers and pads, etc.) in the drawings will be enlarged in unequal proportions, and the number of some components will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of components in the drawings and the dimensions and shapes presented by the components, but should cover the dimensions, shapes and deviations thereof caused by actual processes and / or tolerances. For example, the flat surface shown in the drawings may have rough and / or nonlinear features, while the acute angles shown in the drawings may be rounded. Therefore, the components presented in the drawings of the present invention are mainly for illustration, and are not intended to accurately depict the actual shape of the components, nor are they intended to limit the claims of the present invention.

[0019] In addition, spatially relative terms such as "below," "below," "below," "above," "above," and other similar terms are used to facilitate describing the relationship between one element or feature and another element or feature in the figure. In addition to the orientation depicted in the figure, the spatially relative terms also cover other orientations of the device when in use or operation. That is, when the orientation of the device is different from the figure (rotated 90 degrees or in other orientations), the spatially relative terms used in this disclosure can also be interpreted accordingly.

[0020] It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, without departing from the scope of the embodiment, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0021] It should be noted that the first direction D1 and the second direction D2 are marked in the drawings of the present case to show the configuration relationship of each component in the drawings, and the first direction D1 and the second direction D2 are substantially perpendicular to each other.

[0022] Please refer to Figures 1 to 10 , which is a cross-sectional view of the relay circuit board 100 in various stages of the process according to at least one embodiment of the present invention. Figure 1The internal circuit structure 110 includes a plurality of insulating layers 111 and a plurality of circuit layers 112 arranged in a staggered manner. In detail, each insulating layer 111 and each circuit layer 112 extends along a direction parallel to the first direction D1 and is stacked along a second direction D2 perpendicular to the first direction D1. The internal circuit structure 110 includes a first surface 110s1 and a second surface 110s2, wherein the second surface 110s2 is opposite to the first surface 110s1.

[0023] In some embodiments, the material of the insulating layer 111 may be insulating materials such as polyimide (PI), glass fiber epoxy resin (FR4), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) or polyethylene (PE), but is not limited thereto.

[0024] The circuit layer 112 may be formed by an additive method or a semi-additive method. In some embodiments, the circuit layer 112 may be formed by a regular electroplating method or a laser electroplating method. In some embodiments, the material of the circuit layer 112 may be a conductive material such as copper, gold or silver, but is not limited thereto. Different insulating layers 111 and different circuit layers 112 may be laminated to form a stacked structure.

[0025] Please refer to Figure 2 , mechanical drilling or laser drilling may be used to form a through hole 113 in the internal circuit structure 110 , wherein the through hole 113 is in the internal circuit structure 110 along the thickness direction (ie, the second direction D2 ).

[0026] Please refer to Figure 3 A first threaded hole 114 is formed in the through hole 113 using a first threaded drill (not shown), wherein the first inner wall 114s of the first threaded hole 114 has a thread pattern. It is understood that the first threaded drill may be a positive threaded drill so that Figure 3 The first inner wall 114s has a clockwise thread pattern.

[0027] Please refer to Figure 4 A metal layer 115 is formed on the first inner wall 114s of the first threaded hole 114 by a through-hole electroplating process. The metal layer 115 may be, for example, a metal copper layer.

[0028] Please refer to Figure 5 , using a second thread drill (not shown) in the first threaded hole 114 (see Figure 4 ) and the metal layer 115 (please refer to Figure 4 ) forms a second threaded hole 116, wherein a second inner wall 116s of the second threaded hole 116 has a spiral coil loop.

[0029] First, a continuous thread is formed on the internal circuit structure 110 using a first thread drill, and then a spiral coil loop C is formed in the internal circuit structure 110 using a second thread drill, so that the internal circuit structure 110 has a spiral coil loop C. In addition, the external thread direction of the second thread drill can be opposite to the external thread direction of the first thread drill. For example, the first thread drill is a forward thread drill and has a clockwise external thread, while the second thread drill is a reverse thread drill and has a counterclockwise external thread.

[0030] Please refer to Figure 6 , a tape 117 is disposed on the second surface 110s2 of the internal circuit structure 110. In some embodiments, the tape 117 may be a polyimide (PI) tape.

[0031] Please refer to Figure 7 The magnetic sensing element 118 is disposed in the second threaded hole 116 (please refer to Figure 6 ). Specifically, after the magnetic sensing element 118 is placed in the second threaded hole 116, the dielectric material 119 is filled in the gap between the second threaded hole 116 and the magnetic sensing element 118. In other words, the dielectric material 119 is filled between the magnetic sensing element 118 and the second inner wall 116s. In some embodiments, the dielectric material 119 is formed in the gap by laminating.

[0032] The magnetic sensing element 118 may be, for example, an unmagnetized ferromagnet or an unmagnetized ferrite. For example, the unmagnetized ferromagnet may include magnetized ferrites such as iron, cobalt, and nickel. The unmagnetized ferrite may include magnetized ferrites such as iron oxide and / or nickel oxide.

[0033] Please refer to Figure 8 After the magnetically sensitive element 118 is disposed in the second threaded hole 116 , the tape 117 is removed.

[0034] Please refer to Fig. 9 The first external circuit structure 120 is formed on the first surface 110s1 of the internal circuit structure 110 (please refer to Figure 1 ), the second outer circuit structure 130 is formed on the second surface 110s2 of the inner circuit structure 110 (please refer to Figure 1). Similar to the internal circuit structure 110, the first external circuit structure 120 includes a plurality of insulating layers 121 and a plurality of circuit layers 122 arranged in a staggered manner, and the second external circuit structure 130 includes a plurality of insulating layers 131 and a plurality of circuit layers 132 arranged in a staggered manner. The materials of the insulating layers 121 and 131 may be similar to the materials of the insulating layer 111, and will not be described again herein. The materials and manufacturing methods of the circuit layers 122 and 132 may be similar to the materials and manufacturing methods of the circuit layer 112, and will not be described again herein.

[0035] The plurality of insulating layers 121, the plurality of circuit layers 122, the plurality of insulating layers 131 and the plurality of circuit layers 132 may be laminated to form a stacked structure. After forming the first external circuit structure 120, the groove 123 is formed by routing, such as Fig. 9 The groove 123 exposes the top surface of the magnetic sensitive element 118 .

[0036] Please refer to Fig.10 The switch assembly 140 is disposed in the groove 123 of the first external circuit structure 120 (please refer to Fig. 9 ), wherein a gap 124 is provided between the switch assembly 140 and the magnetic inductive element 118. The gap 124 may be, for example, an air gap, that is, the gap 124 may be filled with air. It is understood that the switch assembly 140 is a switch for controlling electrical connection with an external circuit. The detailed structure of the switch assembly 140 will be described in Fig.11A and Fig. 11B .

[0037] like Fig.10 As shown, the dielectric material 126 is filled between the first external circuit structure 120 and the switch element 140. In other words, the dielectric material 126 is filled between the switch element 140 and the groove 123 (please refer to Fig. 9 ) between the inner walls. In some embodiments, dielectric material 126 is the same as dielectric material 119.

[0038] Please refer again Fig.10The relay circuit board 100 includes a first external circuit structure 120, a second external circuit structure 130, an internal circuit structure 110, a magnetic induction element 118 and a switch component 140. The first external circuit structure 120 has a first cavity ca1. The internal circuit structure 110 has a second cavity ca2, wherein the second cavity ca2 extends from the first external circuit structure 120 to the second external circuit structure 130, and the first cavity ca1 is connected to the second cavity ca2. The magnetic induction element 118 is disposed in the second cavity ca2. The switch component 140 is disposed in the first cavity ca1. At least one surface of the switch component 140 is exposed from the first external circuit structure 120, and a gap 124 is provided between the switch component 140 and the magnetic induction element 118.

[0039] The internal circuit structure 110 includes a plurality of coil loops C, which surround the magnetic induction element 118 and are embedded in the inner wall of the second cavity ca2, wherein the coil loops C and the magnetic induction element 118 can form an electromagnet. Therefore, when the coil loop C is energized, the magnetic induction element 118 will generate a magnetic field. In addition, the coil loop C, the magnetic induction element 118 and the switch component 140 can substantially form a relay.

[0040] Fig.11A FIG. 4 is a partial cross-sectional schematic diagram of a plurality of coil loops C when power is cut off in at least one embodiment of the present invention. Fig. 11B This is a partial cross-sectional diagram of multiple coil loops C in at least one embodiment of the present invention when powered on. Fig.11A The switch assembly 140 includes a housing 142. The housing includes an opening 143, wherein the gap 124 is located below the opening 143. In other words, the gap 124 is located between the housing 142 and the magnetically sensitive element 118.

[0041] The switch assembly 140 further includes a moving member 144 and a first spring 146. The moving member 144 includes a main body 144a and an extension 144b connected to the main body 144a. The first spring 146 surrounds the extension 144b of the moving member 144. The opening 143 of the housing 142 is used to allow the extension 144b of the moving member 144 to shuttle between the interior of the housing 142 and the gap 124.

[0042] The moving member 144 is an unmagnetized ferromagnet or an unmagnetized ferrite magnet. For example, the unmagnetized ferromagnet may include magnetized ferrite magnets such as iron, cobalt, and nickel. The unmagnetized ferrite magnet may include magnetized ferrite magnets such as iron oxide and / or nickel oxide.

[0043] Still refer to Fig.11AThe switch assembly 140 further includes a second spring 147 and a conductive block 148. The second spring 147 is used to connect the moving member 144 and the conductive block 148. The conductive block 148 can be, for example, a metal conductive block. The conductive block 148 is used to electrically connect to a load 150 (for example, an external circuit, an electronic component, or a power supply), wherein Fig. 11B The load 150 shown is schematically represented by a block, and does not actually depict the load 150 .

[0044] Please refer to Fig. 11B , since the magnetic induction element 118 generates a magnetic field when the coil loop C is energized, the magnetic induction element 118 uses the magnetic field to attract the moving member 144 so that the moving member 144 is connected to the magnetic induction element 118. In detail, when the magnetic induction element 118 generates a magnetic field, the magnetic induction element 118 and the moving member 144 are temporarily magnetized, so that the extension portion 144b of the moving member 144 passes through the opening 143 and the gap 124 and contacts the top surface of the magnetic induction element 118. Because the moving member 144 is pulled downward along the second direction D2 by the first spring 146, the second spring 147 is extended, so that the conductive block 148 maintains an electrical connection with the load 150, and therefore, the load 150 is electrically connected to the magnetic induction element 118.

[0045] Please refer again Fig.11A When the plurality of coil loops C are de-energized, the first spring 146 moves the moving member 144 to separate the moving member 144 from the magnetic induction element 118. At this time, the conductive block 148 is connected to the load 150 and they are electrically connected to each other, but the load 150 is not electrically connected to the magnetic induction element 118.

[0046] Understandably, Fig.10 Only one set of embedded relays (ie, one set of coil loops C, one magnetic induction element 118 and one switch assembly 140) is shown. However, in other embodiments, the relay circuit board of the present invention may also include multiple sets of embedded relays, not limited to one set of embedded relays.

[0047] In summary, the relay circuit board of the present invention has a magnetic induction element and a switch component embedded in the circuit board, which can reduce the overall size of the relay circuit board, thereby realizing an automatic control circuit. In addition, the embedded coil loop of the present invention is formed in the circuit board using a threaded drill, thereby simplifying the process steps.

[0048] The features of multiple embodiments are summarized above so that those skilled in the art can better understand the aspects of the present application. Those skilled in the art should understand that the present application can be easily used as a basis for designing or modifying other processes and structures to perform the same purposes and / or achieve the same advantages of the embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the present application, and various changes, substitutions and modifications of the present application can be made without departing from the spirit and scope of the present application.

[0049]

Explanation of symbols

[0050] 100: Relay circuit board

[0051] 110: Internal circuit structure

[0052] 110s1: First surface

[0053] 110s2: Second surface

[0054] 111: Insulation layer

[0055] 112: Circuit layer

[0056] 113:Through hole

[0057] 114: First threaded hole

[0058] 114s: First inner wall

[0059] 115:Metal layer

[0060] 116: Second threaded hole

[0061] 116s: Second inner wall

[0062] 117: Tape

[0063] 118: Magnetic Sensing Component

[0064] 119: Dielectric Materials

[0065] 120: First external circuit structure

[0066] 121: Insulation layer

[0067] 122: Circuit layer

[0068] 123: Groove

[0069] 124: Gap

[0070] 126: Dielectric materials

[0071] 130: Second external circuit structure

[0072] 131: Insulation layer

[0073] 132: Circuit layer

[0074] 140: Switch assembly

[0075] 142: Shell

[0076] 143: Opening

[0077] 144: Moving parts

[0078] 144a: Main part

[0079] 144b: Extension

[0080] 146: First Spring

[0081] 147: Second Spring

[0082] 148: Conductive block

[0083] 150: Load

[0084] ca1: first cavity

[0085] ca2: second cavity

[0086] C: Coil loop

[0087] D1: First direction

[0088] D2: Second direction.

Claims

1. A relay circuit board, characterized in that: Include: A first external circuit structure having a first cavity; a second external wiring structure; and an internal circuit structure, disposed between the first external circuit structure and the second external circuit structure, and having a second cavity, wherein the second cavity extends from the first external circuit structure to the second external circuit structure, and the first cavity communicates with the second cavity; A magnetically sensitive element is disposed in the second cavity; and A switch component is disposed in the first cavity, wherein at least one surface of the switch component is exposed from the first external circuit structure, and there is a gap between the switch component and the magnetically sensitive element, wherein the internal circuit structure includes a plurality of coil loops, the plurality of coil loops surround the magnetically sensitive element and are embedded in the inner wall of the second cavity, wherein when the coil loops are energized, the magnetically sensitive element generates a magnetic field.

2. The relay circuit board according to claim 1, wherein the switch assembly comprises: A moving part, comprising a main body and an extension connected to the main body, wherein the magnetically sensitive element attracts the moving part by using the magnetic field so that the moving part is connected to the magnetically sensitive element; and A spring surrounds the extending portion of the moving member. 3 . The relay circuit board according to claim 2 , wherein the magnetically sensitive element and the moving part are both unmagnetized ferromagnets or unmagnetized ferrite magnets.

4. The relay circuit board according to claim 2, wherein the switch assembly further comprises: The housing comprises an opening, wherein the gap is located between the housing and the magnetically sensitive element, and the housing comprises an opening, wherein the opening is used to allow the extension portion of the moving member to shuttle between the interior of the housing and the gap. 5 . The relay circuit board according to claim 4 , wherein when the plurality of coil loops are de-energized, the spring moves the moving member to separate the moving member from the magnetically sensitive element.

6. A method for manufacturing a relay circuit board, characterized in that: Include: Provide internal wiring structure; Using a first thread drill to form a first threaded hole in the internal circuit structure, wherein a first inner wall of the first threaded hole has a thread pattern; depositing a metal layer on the first inner wall of the first threaded hole; After depositing the metal layer, drilling a second thread in the first threaded hole and the metal layer to form a second threaded hole, wherein a second inner wall of the second threaded hole has a spiral coil loop; Disposing a magnetically sensitive element in the second threaded hole; forming a first external circuit structure on a first surface of the internal circuit structure; forming a second outer circuit structure on a second surface of the inner circuit structure, wherein the first surface is opposite to the second surface; as well as A switch component is disposed in the first external circuit structure, wherein a gap is provided between the switch component and the magnetically sensitive element.

7. The method for manufacturing a relay circuit board according to claim 6, wherein: Also includes: Before disposing the magnetically sensitive element in the second threaded hole, disposing an adhesive tape on the second surface of the internal circuit structure; and After the magnetically sensitive element is disposed in the second threaded hole, the tape is removed.

8. The method for manufacturing a relay circuit board according to claim 7, wherein: Also includes: During the process of setting the magnetic induction element in the second threaded hole, a dielectric material is filled between the magnetic induction element and the second inner wall.

9. The method for manufacturing a relay circuit board according to claim 6, wherein: Also includes: Before disposing the switch component in the first external circuit structure, a groove is formed in the first external circuit structure.

10. The method for manufacturing a relay circuit board according to claim 9, wherein: Also includes: During the process of disposing the switch component in the first external circuit structure, a dielectric material is filled between the switch component and the groove.

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