A PCB aluminum substrate cooling device with intelligent temperature adjustment

Abstract

This invention relates to the field of PCB manufacturing technology, specifically to a PCB aluminum substrate cooling device with intelligent temperature adjustment, comprising a housing, a support mechanism, a first moving component, and a second moving component. The support mechanism includes a support plate, a cylinder, and a clamping plate; it can move up and down to complete the loading and unloading of PCB substrate workpieces. The first moving component includes a first lead screw, a first guide rod, a first motor, and a connecting plate. Cooling pipes are symmetrically distributed between the connecting plates on both sides, with two cooling pipes arranged symmetrically vertically. The input end of the cooling pipe is connected to an external cold air source via a fan, and the cooling pipe also has multiple evenly distributed air holes. The second moving component is used to drive the cooling pipes to move back and forth, keeping the upper and lower cooling pipes moving in opposite directions. This invention utilizes convenient and mobile air supply cooling to improve the cooling uniformity and quality of the PCB board, while intelligently adjusting the air supply volume to achieve convenient temperature adjustment.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and more specifically to a PCB aluminum substrate cooling device with intelligent temperature adjustment. Background Technology

[0002] In PCB manufacturing, the substrate is the basic material. Generally, the substrate is a copper-clad laminate. Single-sided and double-sided PCBs undergo selective processing such as hole machining, chemical copper plating, electroplating, and etching on the copper-clad laminate to obtain the desired circuit pattern. Another type of PCB, the multilayer PCB, also uses a thin copper-clad laminate as its base, alternately laminating conductive pattern layers and prepreg together in a single process to form interconnections between three or more conductive pattern layers. It provides conductivity, insulation, and support. The performance, quality, processability, manufacturing cost, and manufacturing level of a PCB largely depend on the substrate material. Cooling is particularly important in the production of aluminum PCB substrates, but traditional cooling devices for aluminum PCB substrates are ineffective.

[0003] A search of existing public technology, "CN 217200575 U, PCB Board Cooling and Flipping Device," describes a PCB board cooling and flipping device comprising: a frame; a conveying mechanism disposed on the frame for conveying PCB boards; a flipping mechanism disposed in the middle of the conveying mechanism for flipping the PCB boards; and a cooling mechanism disposed on the frame, comprising an air supply module and an exhaust module. The air supply module is located on the side of the flipping mechanism, with its exhaust direction facing the flipping mechanism, and the exhaust module is disposed above the air supply module. By incorporating the flipping mechanism, automatic flipping of the PCB boards can be achieved without manual operation, reducing labor intensity and improving safety. Furthermore, the cooling mechanism can remove heat from the PCB boards on the flipping mechanism, improving the cooling efficiency and product quality of the PCB boards.

[0004] However, the aforementioned existing PCB cooling devices still have the following drawbacks: First, the traditional PCB cooling devices do not provide uniform cooling of the PCB, meaning the airflow structure is singular and cannot achieve uniform cooling of the PCB, resulting in uneven cooling of different parts of the PCB, which can easily cause bending and poor overall quality. Second, the traditional PCB cooling devices are not very effective, meaning they lack adjustable cooling capabilities. Since different PCBs have different temperature requirements, the existing PCB cooling devices have significant limitations, are not intelligent enough, and have poor practicality. Summary of the Invention

[0005] To address the shortcomings and deficiencies of existing PCB manufacturing cooling technologies, this invention provides a PCB aluminum substrate cooling device with a reasonable structural design, utilizing mobile and convenient airflow cooling to improve the uniformity and quality of PCB cooling, and intelligently adjusting the airflow to achieve convenient temperature adjustment.

[0006] The present invention achieves the above objectives by adopting the following technical solution:

[0007] A PCB aluminum substrate cooling device with intelligent temperature adjustment includes a housing, a support mechanism, a first moving component, and a second moving component. The housing is arranged horizontally and has a hollow internal structure. The support mechanism includes a support plate, a cylinder, and a clamping plate. Two support plates are symmetrically arranged and located on the inner wall of the housing cavity. The cross-section of each support plate is concave. A PCB substrate workpiece is placed horizontally between the two support plates. The cylinder is located outside the support plate, with its output end penetrating one side wall of the support plate. One end of the clamping plate is connected to the output end of the cylinder and is located within the concave inner cavity of the support plate, allowing it to move vertically to perform loading and unloading operations on the PCB substrate workpiece. The first moving component includes a first lead screw, a first guide rod, a first motor, and a connecting plate. The first lead screw is vertically arranged between the upper and lower surfaces of the housing and passes through the first moving component. A support plate is provided, and its inner cavity does not interfere with the support plate. The upper and lower parts of the first lead screw are provided with rotating parts with opposite thread directions. The first guide rod is vertically distributed in the inner cavity of the box and is parallel to the first lead screw. The first motor is mounted on the box through a bracket, and its output end is connected to the first lead screw. There are two connecting plates distributed vertically, and they are respectively rotatably connected to the upper and lower rotating parts of the first lead screw. The connecting plates also pass through the first guide rod. Cooling pipes are provided between the connecting plates on the left and right sides. There are two cooling pipes distributed vertically. The input end of the cooling pipe is connected to an external cold air source through a fan. The cooling pipe is also provided with multiple air holes evenly distributed on it, and the air holes distributed on the two cooling pipes are all facing the PCB substrate workpiece distributed in the middle. The second moving part is used to drive the cooling pipe to move back and forth, and keep the upper cooling pipe and the lower cooling pipe moving in opposite directions.

[0008] As a preferred technical solution: the bottom of the box is provided with support legs, and the front of the box is provided with a door.

[0009] A further preferred technical solution: an adjusting screw is provided on one side of the support leg, and a mounting hole is provided on one side of the housing, with the adjusting screw and the mounting hole maintaining a threaded rotational connection.

[0010] As a preferred technical solution, an elastic pad is also bonded to the lower end face of the clamping plate.

[0011] As a preferred technical solution: the first lead screw, the first guide rod, the first motor and the two connecting plates are matched and installed in two sets distributed on the left and right.

[0012] As a preferred technical solution: the fan is a variable frequency fan and is connected to the cooling pipe by a flexible hose, which is long enough.

[0013] As a preferred technical solution: the second moving component includes a fixed block, a second lead screw, a second guide rod, and a second motor; there are two fixed blocks, which are respectively disposed at both ends of the cooling pipe; the connecting plate has side wing plates on both the front and rear sides; the second lead screw is distributed between the front and rear side wing plates on the left side and passes through the fixed block on the left side, and the second lead screw is threadedly connected to the corresponding fixed block; the second guide rod is distributed between the front and rear side wing plates on the right side and passes through the fixed block on the right side, and the second guide rod is slidably connected to the corresponding fixed block; the second motor is mounted on one side of the side wing plate via a bracket and is connected to the second lead screw.

[0014] A further preferred technical solution: the threads of the upper second lead screw and the lower second lead screw have opposite directions.

[0015] A further preferred technical solution: In the initial state, the two cooling pipes are located at the front and rear sides of the inner cavity of the housing, respectively.

[0016] A further preferred technical solution: the support plate and the first lead screw are kept in a state of relative rotation but not relative movement through a keyway fit.

[0017] The advantages of this invention compared to existing technologies are as follows: The invention features a rational structural design. By coordinating a first lead screw, a first guide rod, a first motor, and a connecting plate, the air supply pipe can be moved up and down, thus adjusting the distance between the air supply pipe and the PCB board. Under the premise of a certain fan power, the closer the distance between the air supply pipe and the PCB board, the greater the cooling effect on the PCB board. Furthermore, by employing a fixed block, a second lead screw, a second guide rod, and a second motor, the air supply pipe can be moved back and forth, ensuring uniform airflow to the PCB board. This convenient and mobile air supply cooling significantly improves the uniformity and quality of PCB board cooling. Thus, this cooling device can intelligently adjust the airflow to achieve convenient temperature adjustment, making it more practical. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a perspective view of the overall structure of the present invention;

[0020] Figure 2 This is a schematic cross-sectional view of the overall structure of the present invention;

[0021] Figure 3 This is a partial three-dimensional view of the structure of the present invention;

[0022] Figure 4 for Figure 3 Top view;

[0023] Figure 5 This is a schematic diagram of the cooling pipe of the present invention.

[0024] In the diagram: 1. Box body; 11. Support leg; 12. Box door; 13. Adjusting screw; 14. Mounting hole; 2. Support mechanism; 21. Support plate; 22. Cylinder; 23. Pressing plate; 24. Elastic pad; 3. First moving part; 31. First lead screw; 32. First guide rod; 33. First motor; 34. Connecting plate; 35. Rotating part; 4. Second moving part; 41. Fixed block; 42. Second lead screw; 43. Second guide rod; 44. Second motor; 45. Side wing plate; 5. Cooling pipe; 51. Fan; 52. Air vent; 53. Hose. Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] It should be noted that, in specific embodiments of the present invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations. Furthermore, terms such as "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, the use of phrases such as "comprising one" to define an element does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0027] In the description of this invention, unless otherwise explicitly specified and limited, the terms "installed," "connected," "linked," and "equipped" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] Example: Figures 1 to 5 As shown:

[0029] A PCB aluminum substrate cooling device with intelligent temperature adjustment, comprising a housing 1, a support mechanism 2, a first moving component 3, and a second moving component 4. Figure 1 As shown: The housing 1 is distributed on both sides and has a hollow internal structure; it is used to house and cool PCB boards. Preferably, the bottom of the housing 1 is provided with support legs 11, which facilitates stable support. The front of the housing 1 is provided with a door 12; one side of the door is hinged to the housing, which facilitates opening and closing for loading and unloading while ensuring sufficient sealing. An air vent is provided on the rear side of the housing. Figure 2 As shown: An adjusting screw 13 is provided on one side of the support leg 11, and a mounting hole 14 is provided on one side of the housing 1. The adjusting screw 13 and the mounting hole 14 are connected by a threaded rotation. The purpose of this arrangement is to adjust the horizontal support of the housing by adjusting the rotation of the adjusting screw, thereby ensuring that the housing is always in a horizontal operating state.

[0030] like Figure 3As shown: In this embodiment, the support mechanism 2 includes a support plate 21, a cylinder 22, and a clamping plate 23. Two support plates 21 are symmetrically distributed left and right, both located on the inner wall of the housing 1, extending forward and backward. The cross-section of the support plate 21 is concave, and the PCB substrate workpiece is placed horizontally between the two support plates 21. The cylinder 22 is located outside the support plate 21, with its output end penetrating one side wall of the support plate 21. One end of the clamping plate 23 is connected to the output end of the cylinder 22 and is located within the concave inner cavity of the support plate 21, allowing it to move up and down to complete the loading and unloading of the PCB substrate workpiece. An elastic pad 24 is also bonded to the lower end face of the clamping plate 23. This configuration is structurally sound; the concave structure of the support plate facilitates the formation of a slide rail structure for loading the PCB board. In the initial state, the cylinder retracts, and the clamping plate is at its highest point of travel. An air pump is located on one side of the housing to drive the cylinder. Then the staff starts the cylinder to extend, which will drive the pressure plate and elastic pad to complete the pressing and fixing of the PCB board.

[0031] like Figure 3As shown: In this embodiment, the first moving component 3 includes a first lead screw 31, a first guide rod 32, a first motor 33, and a connecting plate 34. The first lead screw 31 is vertically distributed between the upper and lower surfaces of the housing 1, and passes through the support plate 21 without interfering with the inner cavity of the support plate 21. The support plate 21 and the first lead screw 31 are connected by a keyway to maintain relative rotation but not relative movement. The upper and lower parts of the first lead screw 31 are provided with rotating parts 35 with opposite thread directions; this arrangement allows the two connecting plates connected to the rotating plate to move closer or further away synchronously. The first guide rod 32 is vertically distributed in the inner cavity of the housing 1 and is parallel to the first lead screw 31. The first motor 33 is mounted on the housing 1 via a bracket, and its output end is connected to the first lead screw 31; the first motor is a servo-controlled motor. The connecting plates 34 are two in number, one vertically and one vertically, and are rotatably connected to the upper and lower rotating parts 35 of the first lead screw 31, respectively. The connecting plates 34 also pass through the first guide rod 32. The first lead screw 31, the first guide rod 32, the first motor 33, and the two connecting plates 34 are matched and arranged in two sets, one horizontally and one vertically. That is, the two first lead screws are located on the front side of the housing, and the two first guide rods are located on the rear side of the housing. The upper left and right connecting plates are symmetrically positioned, and the lower left and right connecting plates are also symmetrically positioned. With this arrangement, in the initial state, the distance between the upper and lower connecting plates and the centrally located PCB board is maximized. When the operator starts the first motor and rotates it clockwise, the first lead screw rotates clockwise, causing the upper and lower connecting plates to move along the first lead screw. Specifically, the upper and lower connecting plates move closer to each other. Thus, the connecting plates bring the cooling pipe closer to the PCB board, resulting in a stronger cooling effect on the PCB board, thereby achieving intelligent temperature regulation. Conversely, when the first motor reverses, it will cause the connecting plates distributed above and below to move away from each other. As a result, the further away the connecting plates and cooling pipes are from the PCB board, the weaker the cooling effect on the PCB board.

[0032] like Figure 3 and Figure 4 As shown: In this embodiment, cooling pipes 5 are symmetrically distributed between the connecting plates 34 on the left and right sides. There are two cooling pipes 5 arranged symmetrically vertically. The input end of the cooling pipe 5 is connected to an external cold air source via a fan 51. The fan 51 is a variable frequency fan 51, and it is connected to the cooling pipe 5 via a sufficiently long flexible hose 53. This configuration allows the variable frequency fan to have low, medium, and high power settings, corresponding to low-speed, medium-speed, and high-speed airflow, thus achieving three-level temperature adjustment. Combined with the vertical movement of the cooling pipes, this further enhances the cooling effect on the PCB board. Figure 5As shown: The cooling pipe 5 is also provided with a plurality of evenly distributed air holes 52, and the air holes 52 distributed on the two cooling pipes 5 are all facing the PCB substrate workpiece distributed in the middle; with this configuration, when the operator turns on the fan, the fan begins to deliver cold air into the cooling pipe, and then completes the air supply and cooling operation of the PCB substrate workpiece through the air holes.

[0033] like Figure 3 As shown: In this embodiment, the second moving component 4 is used to drive the cooling pipe 5 to move back and forth, and to keep the upper cooling pipe 5 and the lower cooling pipe 5 moving in opposite directions. In a preferred embodiment, the second moving component 4 includes a fixing block 41, a second lead screw 42, a second guide rod 43, and a second motor 44. There are two fixing blocks 41, which are respectively disposed at both ends of the cooling pipe 5; they serve as carriers for the cooling pipe. The connecting plate 34 has side wing plates 45 on both its front and rear sides, which can be fixed by welding. The second lead screw 42 is distributed front and rear between the front and rear side wing plates 45 on the left side, and passes through the fixing blocks 41 distributed on the left side. The second lead screw 42 and the corresponding fixing block 41 are threadedly connected; this arrangement forms a lead screw and nut structure. The second guide rod 43 is distributed front and rear between the front and rear side wing plates 45 on the right side, and passes through the fixing block 41 on the right side. The second guide rod 43 and the corresponding fixing block 41 are slidably connected; this arrangement provides a good guiding effect. The second motor 44 is mounted on one side of the side wing plate 45 via a bracket and is connected to the second lead screw 42. The threads of the upper and lower second lead screws 42 have opposite directions. Initially, the two cooling pipes 5 are located at the front and rear sides of the inner cavity of the housing 1, respectively. With this configuration, when the operator starts the second motor, the second motor will drive the second lead screw to rotate synchronously. Due to the threaded connection between the second lead screw and the left fixed block, plus the guiding sliding effect between the right fixed block and the second guide rod, the second lead screw will drive the fixed block and the cooling pipe as a whole to move back and forth. Specifically, when the second motor starts rotating forward, it will drive the second lead screw to rotate clockwise, meaning the upper second lead screw will drive the fixed block and the cooling pipe as a whole to move backward. The lower second lead screw will drive the fixed block and the cooling pipe as a whole to move forward.

[0034] By further employing the cooperation of a fixed block, a second lead screw, a second guide rod, and a second motor, the air supply pipe can be moved back and forth to ensure the uniformity of air supply to the PCB board. In turn, the convenient air supply cooling greatly improves the uniformity and quality of PCB board cooling. Thus, the cooling equipment can intelligently adjust the air supply volume to achieve convenient adjustment of cooling temperature, making it more practical.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB aluminum substrate cooling device with intelligent temperature adjustment, characterized in that: The cooling device includes a housing (1), a support mechanism (2), a first moving part (3), and a second moving part (4); the housing (1) is distributed left and right and has an internal cavity structure; the support mechanism (2) includes a support plate (21), a cylinder (22), and a pressing plate (23); there are two support plates (21) symmetrically distributed left and right, and both are set on the inner cavity side wall of the housing (1). The cross-section of the support plate (21) is concave, and the PCB substrate workpiece is placed horizontally between the two support plates (21); the cylinder (22) is set on the outside of the support plate (21), and the output end penetrates through one side wall of the support plate (21); the pressing plate (23) is located on the outside of the support plate (21). One end of the clamping plate (23) is connected to the output end of the cylinder (22) and is located in the concave inner cavity of the support plate (21). It can move up and down to complete the loading and unloading of PCB substrate workpieces. The first moving part (3) includes a first lead screw (31), a first guide rod (32), a first motor (33), and a connecting plate (34). The first lead screw (31) is vertically distributed between the upper and lower end faces of the housing (1) and passes through the support plate (21). It does not interfere with the inner cavity of the support plate (21). The upper and lower parts of the first lead screw are provided with rotating parts (35) with opposite thread directions. The first guide rod (32) is vertically distributed. The first motor (33) is installed in the inner cavity of the housing (1) and is parallel to the first lead screw (31); the first motor (33) is installed in the housing (1) through a bracket and its output end is connected to the first lead screw (31); there are two connecting plates (34) distributed vertically, and they are respectively rotatably connected to the two upper and lower rotating parts (35) of the first lead screw (31). The connecting plates (34) also pass through the first guide rod (32); cooling pipes (5) are also provided between the connecting plates (34) symmetrically distributed on the left and right sides. There are two cooling pipes (5) symmetrically distributed vertically; the input end of the cooling pipe (5) is connected to an external cold air source through a fan (51). The upper part is also provided with a plurality of evenly distributed air holes (52), and the air holes (52) distributed on the two cooling pipes (5) are all facing the PCB substrate workpiece distributed in the middle; when the first motor (33) rotates forward, the first lead screw (31) rotates clockwise, which will drive the upper and lower distributed connecting plates (34) to move along the first lead screw (31), and the connecting plates (34) drive the cooling pipes (5) closer to the PCB board; when the first motor (33) rotates in reverse, the connecting plates (34) drive the cooling pipes (5) further away from the PCB board; the second moving part (4) is used to drive the cooling pipes (5) to move back and forth, and keep the upper cooling pipe (5) and the lower cooling pipe (5) moving in opposite directions.

2. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 1, characterized in that: The bottom of the box (1) is provided with support legs (11), and the front of the box (1) is provided with a door (12).

3. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 2, characterized in that: The support leg (11) is provided with an adjusting screw (13) on one side, and the housing (1) is provided with a mounting hole (14) on one side. The adjusting screw (13) and the mounting hole (14) are connected by a threaded rotation.

4. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 1, characterized in that: An elastic pad (24) is also bonded to the lower end face of the clamping plate (23).

5. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 1, characterized in that: The first lead screw (31), the first guide rod (32), the first motor (33) and the two connecting plates (34) are two sets of matched installations and distributed on the left and right.

6. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 1, characterized in that: The fan (51) is a variable frequency fan (51) and is connected to the cooling pipe (5) by a hose (53) which is long enough.

7. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 1, characterized in that: The second moving part (4) includes a fixed block (41), a second lead screw (42), a second guide rod (43), and a second motor (44); there are two fixed blocks (41), which are respectively set at both ends of the cooling pipe (5); the front and rear sides of the connecting plate (34) are provided with side wing plates (45); the second lead screw (42) is distributed between the front and rear side wing plates (45) on the left side and passes through the fixed block (41) on the left side, and the second lead screw (42) is threadedly connected to the corresponding fixed block (41); the second guide rod (43) is distributed between the front and rear side wing plates (45) on the right side and passes through the fixed block (41) on the right side, and the second guide rod (43) is slidably connected to the corresponding fixed block (41); the second motor (44) is set on one side of the side wing plate (45) through a bracket and is connected to the second lead screw.

8. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 7, characterized in that: The upper second lead screw (42) and the lower second lead screw (42) have opposite thread directions.

9. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 8, characterized in that: In the initial state, the two cooling pipes (5) are located on the front and rear sides of the inner cavity of the housing (1), respectively.

10. The PCB aluminum substrate cooling device with intelligent temperature adjustment as described in claim 9, characterized in that: The support plate and the first lead screw are connected by a keyway to maintain relative rotation but not relative movement.

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