A handheld terminal self-heating structure

Abstract

The present invention discloses a self-heating structure of a handheld terminal, which relates to the technical field of electrical equipment housing components. The present invention installs an infrared probe and a loudspeaker on the front of a main shell, and can monitor the temperature of a fire scene through infrared scanning and collection. When the temperature in the area in front of the firefighter reaches the warning threshold, an alarm will be issued to the firefighter through the loudspeaker, reminding the firefighter to avoid the high-temperature dangerous area in time, which is beneficial to improving the safety of firefighters during fire rescue. In addition, the circuit board is enclosed in a relatively independent space by an insulating cabin box. With the help of conduction of the first C-shaped copper tube, the second C-shaped copper tube and the low-boiling point liquid filled inside, and active cooling and cooling of the semiconductor refrigeration plate, the temperature inside the insulating cabin can be prevented from being too high by active cooling, thereby achieving the purpose of cooling and dissipating heat inside the insulating cabin, which is beneficial to improving the stability of the device in operation in extremely high-temperature fire scenes.

Description

Technical Field

[0001] The present invention relates to the technical field of electrical equipment housing components, and in particular to a handheld terminal self-heating structure. Background Art

[0002] In modern firefighting and rescue operations, a handheld terminal is an electronic device used by firefighters for communication, data collection and transmission, and location positioning at the fire scene. The stability of its performance is directly related to the efficiency and safety of fire rescue operations.

[0003] Typically, a fire scene is an extremely harsh, high-temperature environment. When a fire occurs, the heat generated by the burning materials causes the surrounding air temperature to rise sharply. The excessively high ambient temperature causes handheld terminals to face severe heat dissipation problems. Traditional handheld terminals mainly rely on airflow to achieve heat dissipation. However, due to the high temperature environment at the fire scene, this conventional heat dissipation method cannot meet the operating requirements of handheld terminals used for firefighting and disaster relief. Continuous high temperatures invade the interior of the handheld terminal. High temperatures and heat radiation will seriously affect the operating stability of internal electronic components, affecting the safety and stability of the handheld terminal in the fire scene. In severe cases, it may even cause great interference to rescue operations.

[0004] Therefore, a handheld terminal self-heating structure is proposed to solve some problems existing in the above-mentioned prior art. Summary of the Invention

[0005] The purpose of the present invention is to solve the shortcomings of the existing technology of poor operating efficiency of the internal heat dissipation structure of handheld terminals used for fire rescue, which causes the internal electronic components of the handheld terminals to easily become high-temperature, affecting the stability and safety of fire rescue use, and propose a self-heating structure for handheld terminals.

[0006] In order to solve the problems existing in the prior art, the present invention adopts the following technical solutions:

[0007] A handheld terminal self-heating structure includes a main shell, a back cover is fixedly installed on the back of the main shell, and an elastic hook is installed on the back of the back cover, an infrared probe is fixedly installed at a position above the front of the main shell, a speaker is installed in the main shell, and a vertically arranged antenna is installed on the top of the main shell, an insulating cabin is fixed in the main shell, and a circuit board connected to the infrared probe, the speaker and the antenna is installed in the insulating cabin, the circuit board integrates a wireless transmission module, a positioning module and a charging and discharging module, a battery connected to the charging and discharging module is installed in the insulating cabin, a charging port connected to the charging and discharging module is installed on the main shell, a plurality of evenly distributed first C-shaped copper tubes are fixedly installed in the insulating cabin, a second C-shaped copper tube connected to the plurality of first C-shaped copper tubes is installed on the back of the insulating cabin, the first C-shaped copper tube and the second C-shaped copper tube are filled with a low-boiling-point liquid, a semiconductor refrigeration plate is installed in the main shell, and the heat absorption surface of the semiconductor refrigeration plate is in contact with the second C-shaped copper tube, and the heat dissipation surface of the semiconductor refrigeration plate is away from the insulating cabin and faces the outside of the main shell.

[0008] Preferably, the main housing, the back cover, and the exterior of the antenna are all made of engineering plastics.

[0009] Preferably, a graphene layer and an aluminum foil layer are sequentially attached to the inner end walls of the main shell and the rear cover.

[0010] Preferably, a bracket arranged on the back of the heat-insulating cabin box is fixedly installed in the main shell, and a plug-in board is slidably inserted in the bracket, one end of the plug-in board is exposed on the outside of the main shell, the semiconductor refrigeration plate is fixedly embedded in the plug-in board, a plug connected to the circuit board is fixed in the bracket, a socket adapted to the plug is provided on the plug-in board, and the socket is connected to the semiconductor refrigeration plate.

[0011] Preferably, the two ends of the second C-shaped copper tube are slidably inserted into the two ends of the corresponding first C-shaped copper tube, and a copper plate is commonly connected between the multiple second C-shaped copper tubes corresponding to the same semiconductor refrigeration plate. A spring for elastically supporting the copper plate is fixedly installed on the back of the insulation box. The copper plate fits tightly with the heat-absorbing surface of the semiconductor refrigeration plate with the help of the elastic support of the spring.

[0012] Preferably, a copper box that fits tightly against the heat dissipation surface of the semiconductor refrigeration plate is fixedly installed in the back cover, and the copper box is filled with water. A threaded cover that communicates with the interior of the copper box is screwed onto the back of the back cover.

[0013] Preferably, a plurality of volutes are fixedly mounted on the front inner end wall of the heat-insulating cabin box, and a fan wheel is rotatably mounted inside the volute.

[0014] Preferably, the air inlet of the volute faces the first C-shaped copper tube, and the air outlet of the volute faces the inner side end wall of the heat-insulating cabin box.

[0015] Preferably, the thickness of the volute is set to 5 mm, and a driving mechanism for driving the fan wheel to rotate is installed on the heat-insulating cabin box.

[0016] Preferably, a partition is fixedly installed in the middle position of the thermal insulation box, and the interior of the thermal insulation box is divided into two independent spaces that are not connected to each other by the partition, each independent space is installed with a volute, each independent space corresponds to a semiconductor refrigeration plate, and there is a temperature difference between the two independent spaces, the driving mechanism includes a heat pipe fixedly installed in the two independent spaces, and a first slider is slidably installed in the heat pipe, the heat pipe is filled with a low-boiling point liquid located on one side of the first slider, a slide groove corresponding to the heat pipe is opened on the outer end wall of the thermal insulation box, and a second slider is slidably installed in the slide groove, magnetically attracted magnets are installed in the first slider and the second slider, a rack rod parallel to the slide groove is fixed on the second slider, the rotation of the impeller passes through the outside of the thermal insulation box, and a transmission belt is connected between the rotating shafts of the two adjacent impellers, and a gear meshing with the rack rod is fixedly installed on the rotating shaft of one of the impellers.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In the present invention, by integrating the positioning module into the circuit board, the command center outside the fire scene can monitor the position of firefighters in a timely and accurate manner. At the same time, the infrared probe and speaker are installed on the front of the main housing. Through infrared scanning and collection, the temperature of the fire scene can be monitored. When the temperature in the area in front of the firefighter reaches the warning threshold, an alarm will be issued to the firefighter through the speaker, reminding the firefighter to avoid the high-temperature dangerous area in time, which is conducive to improving the safety of firefighters during fire rescue. In addition, the circuit board is enclosed in a relatively independent space by the insulation box. With the help of the first C-shaped copper tube, the second C-shaped copper tube and the low-boiling point liquid filled inside, as well as the active cooling and cooling of the semiconductor refrigeration chip, the temperature inside the insulation box can be prevented from being too high by active cooling, thereby achieving the purpose of cooling and dissipating heat inside the insulation box, which is conducive to improving the stability of the device in extremely high-temperature fire scenes.

[0019] 2. In the present invention, by sliding the plug-in board into the bracket and embedding the semiconductor refrigeration chip into the plug-in board, the semiconductor refrigeration chip can be flexibly and conveniently replaced when damaged, which is conducive to ensuring that the device can continuously and stably actively cool and dissipate heat. At the same time, by sliding the two ends of the second C-shaped copper tube into the two ends of the corresponding first C-shaped copper tube, and cooperating with the elastic support of the spring, the copper plate fixedly connected to the second C-shaped copper tube can adaptively fit closely with the heat-absorbing surface of the semiconductor refrigeration chip, which is conducive to ensuring the effect and stability of the cooling effect of the heat-absorbing surface of the semiconductor refrigeration chip on the second C-shaped copper tube.

[0020] 3. In the present invention, by installing an ultra-thin volute and impeller within the insulated cabin, the rotation of the impeller within the volute can drive airflow within the insulated cabin, making the cooling and heat dissipation inside the insulated cabin more uniform. At the same time, the interior of the insulated cabin is divided into two independent and unconnected spaces by a partition, creating a temperature difference, which drives the drive mechanism to provide power for the rotation of the impeller. This allows the device to provide rotational drive for the impeller without using a motor, effectively reducing the space occupied by the volute and impeller within the insulated cabin, and preventing unnecessary heat generated by the motor from affecting the heat dissipation inside the insulated cabin, which helps to further ensure the stability of the heat dissipation operation within the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0022] Figure 1 This is a split diagram of the present invention from the front perspective;

[0023] Figure 2 This is a disassembled diagram of the internal structure of the main shell of the present invention from the front perspective;

[0024] Figure 3 This is a disassembled diagram of the present invention from the back perspective;

[0025] Figure 4 This is a disassembled diagram of the internal structure of the main shell of the present invention from the back perspective;

[0026] Figure 5 A perspective view of the present invention;

[0027] Figure 6 It is a front view of the present invention;

[0028] Figure 7 For the present invention Figure 6 Cross-sectional view at AA in the middle;

[0029] Figure 8 For the present invention Figure 6 Cross-sectional view at the middle BB;

[0030] Figure 9 For the present invention Figure 6 Cross-sectional view at CC;

[0031] Figure 10 This is a disassembled view of the volute and impeller of the present invention.

[0032] Serial number in the picture:

[0033] 1. Main housing; 101. Back cover; 102. Elastic hook; 103. Infrared probe; 104. Speaker; 105. Antenna;

[0034] 2. Insulated chamber; 201. Circuit board; 202. First C-shaped copper tube; 203. Second C-shaped copper tube; 204. Copper plate; 205. Reed; 206. Semiconductor cooling plate; 207. Partition;

[0035] 3. Bracket; 301. Plug board; 302. Plug; 303. Socket;

[0036] 4. volute; 401. fan wheel;

[0037] 5. Heat pipe; 501. First slider; 502. Slide; 503. Second slider; 504. Rack rod; 505. Drive belt; 506. Gear;

[0038] 6. Copper box; 601, screw cap. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0040] Example: This example provides a handheld terminal self-heating structure, see Figure 1 - Figure 10 Specifically, it includes a main shell 1, a back cover 101 is fixedly installed on the back of the main shell 1, and an elastic hook 102 is installed on the back of the back cover 101, an infrared probe 103 is fixedly installed on the upper position of the front of the main shell 1, a speaker 104 is installed in the main shell 1, and a vertically arranged antenna 105 is installed on the top of the main shell 1, a heat-insulating cabin 2 is fixed in the main shell 1, and a circuit board 201 connected to the infrared probe 103, the speaker 104 and the antenna 105 is installed in the heat-insulating cabin 2, the circuit board 201 integrates a wireless transmission module, a positioning module and a charging and discharging module, and the heat-insulating cabin 2 is installed with a charging and discharging module. The discharge module is connected to a battery, and a charging port connected to the charge and discharge module is installed on the main shell 1. A plurality of evenly distributed first C-shaped copper tubes 202 are fixedly installed in the insulation box 2, and a second C-shaped copper tube 203 is installed on the back of the insulation box 2, which is connected to the plurality of first C-shaped copper tubes 202 in a one-to-one correspondence. The first C-shaped copper tube 202 and the second C-shaped copper tube 203 are filled with a low-boiling-point liquid. A semiconductor refrigeration plate 206 is installed in the main shell 1, and the heat absorption surface of the semiconductor refrigeration plate 206 is in contact with the second C-shaped copper tube 203, and the heat dissipation surface of the semiconductor refrigeration plate 206 is away from the insulation box 2 toward the outside of the main shell 1.

[0041] When in use, the device is suitable for fire rescue scenes. In daily use, the battery installed in the insulation box 2 can be charged through the charging port installed on the main shell 1, and the battery can provide power support for the device. During the fire rescue process, the device can be mounted on the chest and shoulder of the firefighter through the elastic hook 102. The positioning module integrated in the circuit board 201 can locate the position of the device in the fire scene in real time, and exchange data with the external server through the wireless transmission module and antenna 105, so that the command center can understand the location of the firefighter in time. The infrared probe 103 can detect the fire situation at the fire scene, monitor the temperature at the fire scene through infrared scanning, and transmit the relevant data to the circuit board 201 for processing. When the infrared probe 103 detects that the temperature in the area in front of the firefighter at the fire scene reaches the warning threshold, it will send an alarm to the firefighter through the speaker 104, reminding the firefighter to avoid the high-temperature dangerous area, which is beneficial to improve the safety of firefighters during fire rescue.

[0042] In the specific implementation process, Figure 1 and Figure 3 As shown, the main shell 1, the back cover 101, and the exterior of the antenna 105 are all made of engineering plastics, and a graphene layer and an aluminum foil layer are attached to the inner end walls of the main shell 1 and the back cover 101 in sequence. When the device is in use, by using anti-fall and high-temperature resistant engineering plastics to make the main shell 1, the back cover 101 and the exterior of the antenna 105, the overall protection performance of the device can be effectively improved, so that the device can be used normally in a high-temperature environment in a fire scene. The graphene layer and aluminum foil layer attached to the inside of the main shell 1 and the back cover 101 can effectively absorb, reflect and shield the heat radiation in the fire scene, preventing excessive heat radiation in the fire scene from diffusing to the inside of the insulation cabin 2, which is beneficial to ensuring the stability of the circuit board 201 inside the insulation cabin 2 during operation.

[0043] When the device is in use, its interior presents a relatively independent space, and the high temperature environment in the fire scene is not easy to affect the normal operation of the internal parts of the device. In order to prevent the circuit board 201 inside the heat-insulating chamber 2 from being affected by the high temperature environment at the fire scene, the interior of the heat-insulating chamber 2 is kept in a relatively stable low-temperature environment by actively cooling, thereby ensuring the stability of the operation of the circuit board 201 inside the heat-insulating chamber 2. During operation, the semiconductor refrigeration chip 206 installed inside the main shell 1 is powered on and started. Based on the Peltier effect, when current passes through the thermocouple, one of the nodes emits heat, while the other node absorbs heat, making the semiconductor One side of the refrigeration plate 206 forms a heat-absorbing surface, and the other side of the semiconductor refrigeration plate 206 forms a heat-dissipating surface. Since the heat-absorbing surface of the semiconductor refrigeration plate 206 is in contact with the second C-shaped copper tube 203, with the help of the first C-shaped copper tube 202, the second C-shaped copper tube 203 and the flow conduction of the low-boiling-point liquid therein, active cooling of the interior of the thermal insulation chamber 2 is achieved, so that the interior of the thermal insulation chamber 2 is in a low-temperature environment, thereby ensuring the stability of the low-temperature operation of the circuit board 201 when the device is used in a high-temperature fire scene. The low-boiling-point liquid filled in the first C-shaped copper tube 202 and the second C-shaped copper tube 203 can be water, alcohol or ethylene glycol.

[0044] By enclosing the circuit board 201 in a sealed and heat-insulated independent space through the insulating chamber 2, the interference of the high temperature environment of the external fire scene on the operating environment of the circuit board 201 inside the insulating chamber 2 can be reduced. At the same time, by providing a semiconductor refrigeration plate 206 for cooling, combined with the flow conduction of the first C-shaped copper tube 202, the second C-shaped copper tube 203 and the internal low-boiling point liquid, the internal temperature of the insulating chamber 2 can be prevented from being too high through active cooling, thereby achieving the purpose of cooling and dissipating heat inside the insulating chamber 2, which is beneficial to improving the stability of the device in operation in extremely high-temperature fire scenes.

[0045] In the specific implementation process, Figure 1 - Figure 4As shown, a bracket 3 arranged on the back of the heat-insulating chamber 2 is fixedly installed in the main shell 1, and a plug board 301 is slidably inserted in the bracket 3, one end of the plug board 301 is exposed on the outside of the main shell 1, and the semiconductor refrigeration piece 206 is fixedly embedded in the plug board 301. A plug 302 connected to the circuit board 201 is fixed in the bracket 3, and a socket 303 adapted to the plug 302 is provided on the plug board 301, and the socket 303 is connected to the semiconductor refrigeration piece 206. When the device is used, the plug board 301 is slidably inserted into the bracket 3 from the outside of the main shell 1, and the semiconductor refrigeration piece 206 is embedded in the plug board 301. The power supply connection of the semiconductor refrigeration piece 206 during use is continuous. The semiconductor refrigeration plate 206 in the device is replaceable by plugging in the plug 302 and the socket 303. Due to the high temperature environment of fire rescue, the semiconductor refrigeration plate 206 usually operates in a relatively extreme high-temperature environment during use. It is overloaded in a harsh environment and is easily damaged. Therefore, the actual condition of the semiconductor refrigeration plate 206 needs to be tested after each fire rescue. If the semiconductor refrigeration plate 206 is damaged or has a poor effect, the semiconductor refrigeration plate 206 can be replaced. The plug-in connection method can effectively improve the convenience of replacing the semiconductor refrigeration plate 206 of the device.

[0046] In the specific implementation process, Figure 2 、 Figure 4 and Figure 7 - Figure 9 As shown, the two ends of the second C-shaped copper tube 203 are slidably inserted into the two ends of the corresponding first C-shaped copper tube 202, and a plurality of second C-shaped copper tubes 203 corresponding to the same semiconductor cooling plate 206 are commonly connected with a copper plate 204. A spring 205 for elastically supporting the copper plate 204 is fixedly installed on the back of the heat-insulating chamber 2. The copper plate 204 is tightly fitted with the heat-absorbing surface of the semiconductor cooling plate 206 by means of the elastic support of the spring 205. When the device is used, the two ends of the second C-shaped copper tube 203 are slidably inserted into the two ends of the corresponding first C-shaped copper tube 202, which makes the second C-shaped copper tube 203 relatively close to the first C-shaped copper tube. The tube 202 is slidably adjusted, and multiple second C-shaped copper tubes 203 corresponding to the same semiconductor refrigeration plate 206 are fixedly connected through the copper plate 204, which can effectively improve the heat conduction area between the multiple second C-shaped copper tubes 203 and the semiconductor refrigeration plate 206, and with the help of the elastic support of the reed 205, the copper plate 204 can adaptively fit tightly with the heat absorption surface of the semiconductor refrigeration plate 206, always ensuring the tight and stable fit between the heat absorption surface of the semiconductor refrigeration plate 206 and the copper plate 204, which is conducive to improving the effect and stability of the cooling and cooling effect of the heat absorption surface of the semiconductor refrigeration plate 206 on the second C-shaped copper tube 203.

[0047] In the specific implementation process, Figure 1 、 Figure 3 and Figure 7 As shown, a copper box 6 that fits tightly with the heat dissipation surface of the semiconductor refrigeration chip 206 is fixedly installed in the back cover 101, and the copper box 6 is filled with water. A threaded cover 601 that is connected to the inside of the copper box 6 is screwed on the back of the back cover 101. When the device is in use, with the help of the fit between the copper box 6 and the heat dissipation surface of the semiconductor refrigeration chip 206, after the semiconductor refrigeration chip 206 is powered on and started, the heat generated inside the semiconductor refrigeration chip 206 will be absorbed by the water filled in the copper box 6 through conduction of the copper box 6. With the help of the large specific heat capacity of water, the heat generated by the heat dissipation surface of the semiconductor refrigeration chip 206 can be temporarily stored in the water in the copper box 6, which is beneficial to ensure the stability of the semiconductor refrigeration chip 206 in the high temperature environment at the fire scene. The threaded cover 601 can be opened by rotation, which is convenient for replenishing and replacing the water in the copper box 6.

[0048] In the specific implementation process, Figure 4 、 Figure 7 and Figure 10 As shown, a plurality of volutes 4 are fixedly mounted on the front inner end wall of the heat-insulating cabin 2, and a fan wheel 401 is rotatably mounted in the volute 4, the air inlet of the volute 4 faces the first C-shaped copper tube 202, and the air outlet of the volute 4 faces the inner side end wall of the heat-insulating cabin 2. When the device is in use, the fan wheel 401 installed in the volute 4 will rotate continuously, forming a continuously flowing airflow in the heat-insulating cabin 2. Since the air inlet of the volute 4 faces the first C-shaped copper tube 202, and the air outlet of the volute 4 faces other positions inside the heat-insulating cabin 2, the low-temperature environment formed by the cooling and cooling of the semiconductor refrigeration plate 206 on the first C-shaped copper tube 202 will be entrained during the flow of the airflow, forming a low-temperature airflow flowing in other directions inside the heat-insulating cabin 2, so that the cooling and heat dissipation inside the heat-insulating cabin 2 is more uniform, which is conducive to ensuring the operational stability of the self-heating and cooling inside the device.

[0049] In the specific implementation process, Figure 2 、 Figure 3 and Figure 7As shown, the thickness of the volute 4 is set to 5mm, a driving mechanism for driving the impeller 401 to rotate is installed on the heat-insulating chamber 2, a partition 207 is fixedly installed in the middle position of the heat-insulating chamber 2, and the interior of the heat-insulating chamber 2 is divided into two independent spaces that are not connected to each other by the partition 207, each independent space is equipped with a volute 4, each independent space corresponds to a semiconductor refrigeration plate 206, and there is a temperature difference between the two independent spaces, the driving mechanism includes a heat pipe 5 fixedly installed in the two independent spaces, and a first slider 501 is slidably installed in the heat pipe 5, and the heat pipe 5 is filled with a liquid located on the first slider. The low-boiling-point liquid on one side of the block 501, a slide groove 502 corresponding to the heat pipe 5 is opened on the outer end wall of the insulation box 2, and a second slider 503 is slidably installed in the slide groove 502, and magnetically attracted magnets are installed in the first slider 501 and the second slider 503. A rack rod 504 arranged parallel to the slide groove 502 is fixed on the second slider 503, and the rotation of the impeller 401 passes through the outside of the insulation box 2. A transmission belt 505 is connected between the rotating shafts of two adjacent impellers 401, and a gear 506 meshing with the rack rod 504 is fixed on the rotating shaft of one of the impellers 401.

[0050] When the device is in use, the interior of the heat-insulating chamber 2 is divided into two independent spaces that are not connected to each other by the partition 207. Each independent space corresponds to a different semiconductor refrigeration chip 206. By controlling the semiconductor refrigeration chip 206, the temperature of the two different independent spaces in the heat-insulating chamber 2 can be controlled separately. The cooling coefficients of the heat dissipation surfaces of the two semiconductor refrigeration chips 206 are different, which causes a temperature difference in the two independent spaces. Due to the temperature difference, the low-boiling-point liquid in the heat pipe 5 inserted in the two independent spaces undergoes gas-liquid conversion, absorbing heat and vaporizing in the independent space with a higher temperature, and releasing heat in the independent space with a lower temperature. Thermal liquefaction is circulated, thereby driving the first slider 501 to continuously move in the heat pipe 5. The low-boiling-point liquid in the heat pipe 5 can be water, alcohol or ethylene glycol. With the help of the magnetic attraction of the magnets in the first slider 501 and the second slider 503, during the reciprocating movement of the first slider 501, the second slider 503 can be driven to reciprocate synchronously in the slide groove 502, thereby driving the rack rod 504 fixedly connected to the second slider 503 to reciprocate, and then with the help of the meshing of the rack rod 504 and the gear 506, and the transmission connection of the transmission belt 505, power is provided for the rotation of the impeller 401 in the volute 4.

[0051] During the operation of the device, by setting the volute 4 to a thickness of 5 mm and not using a motor to drive the rotation of the impeller 401, the space occupied by the volute 4 and the impeller 401 in the heat-insulating chamber 2 can be effectively reduced, which is conducive to making the device more integrated. At the same time, not using a motor to drive the impeller 401 to rotate can avoid unnecessary heat generated during the operation of the motor, which is conducive to further ensuring the stability of the internal heat dissipation operation of the device.

[0052] Specifically, the working principle and operation method of the present invention are as follows:

[0053] When firefighters are fighting fires and rescuing people at a fire scene, they can hang the device on their chest and shoulders through the elastic hook 102. The positioning module integrated in the circuit board 201 can locate the position of the firefighters wearing the device in the fire scene in real time, making it convenient to arrange fire rescue according to the real-time position. The infrared probe 103 installed on the front of the main shell 1 can collect infrared temperature of the fire scene in front and transmit the relevant data to the circuit board 201 for analysis. When the temperature on the front path exceeds the safety threshold, the loudspeaker 104 is used to alarm the firefighters, making it convenient for the firefighters to avoid the dangerous area in time. When the device is running, the semiconductor refrigeration plate 206 is inserted into the bracket 3 through the plug-in board 301 for installation. With the elastic support of the reed 205, the copper plate 204 is tightly attached to the heat-absorbing surface of the semiconductor refrigeration plate 206. The heat dissipation surface of the semiconductor refrigeration plate 206 is tightly fitted with the copper box 6. After the semiconductor refrigeration plate 206 is powered on and started, the heat-absorbing surface is cooled and refrigerated. Through the first C-shaped copper tube 202 and the second C-shaped Heat conduction between the copper tube 203 and the low-boiling-point liquid within transfers the low temperature to the insulated chamber 2. The heat generated by the heat dissipation surface is absorbed by the water stored in the copper box 6. Because the insulated chamber 2 is divided into two independent, unconnected compartments by the partition 207, the different temperatures of the heat-absorbing surfaces of the two semiconductor refrigeration plates 206 are controlled to maintain different temperatures within the two independent compartments. This creates a temperature difference, which continuously converts the low-boiling-point liquid within the heat pipe 5 into a gas-liquid state. This drives the first slider 501 to circulate within the heat pipe 5. The magnetic attraction between the magnets within the first and second sliders 501, 503, drives the rack rod 504 to synchronously reciprocate along the slide 502. The meshing of the rack rod 504 and the gear 506, coupled with the transmission connection of the drive belt 505, drives the impeller 401 to rotate within the volute 4, forming a continuous airflow within the two independent compartments. This airflow evenly distributes the cooling and cooling within the insulated chamber 2, ensuring uniform heat dissipation and cooling.

[0054] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A handheld terminal self-heating structure, comprising a main housing (1), characterized in that: A back cover (101) is fixedly mounted on the back of the main shell (1), and an elastic hook (102) is mounted on the back of the back cover (101); an infrared probe (103) is fixedly mounted on the upper front of the main shell (1); a speaker (104) is mounted in the main shell (1); a vertically arranged antenna (105) is mounted on the top of the main shell (1); a heat-insulating cabin (2) is fixed in the main shell (1), and a circuit board (201) connected to the infrared probe (103), the speaker (104) and the antenna (105) is mounted in the heat-insulating cabin (2); a wireless transmission module, a positioning module and a charging and discharging module are integrated in the circuit board (201); and a charging and discharging module is mounted in the heat-insulating cabin (2). A storage battery connected to an electric module, wherein a charging port connected to a charging and discharging module is installed on the main shell (1), a plurality of evenly distributed first C-shaped copper tubes (202) are fixedly installed in the heat-insulating chamber (2), a second C-shaped copper tube (203) connected to the plurality of first C-shaped copper tubes (202) is installed on the back of the heat-insulating chamber (2), the first C-shaped copper tube (202) and the second C-shaped copper tube (203) are filled with a low-boiling-point liquid, a semiconductor cooling plate (206) is installed in the main shell (1), and the heat-absorbing surface of the semiconductor cooling plate (206) is in contact with the second C-shaped copper tube (203), and the heat-dissipating surface of the semiconductor cooling plate (206) is away from the heat-insulating chamber (2) and toward the outside of the main shell (1); A plurality of volutes (4) are fixedly mounted on the front inner end wall of the heat-insulating cabin box (2), and a fan wheel (401) is rotatably mounted in the volute (4). A driving mechanism for driving the fan wheel (401) to rotate is mounted on the heat-insulating cabin box (2); A partition (207) is fixedly installed in the middle position of the heat-insulating chamber (2), and the interior of the heat-insulating chamber (2) is divided into two independent spaces that are not connected to each other by the partition (207). A volute (4) is installed in each of the independent spaces. Each of the independent spaces corresponds to a semiconductor refrigeration plate (206). The cooling coefficients of the heat dissipation surfaces of the two semiconductor refrigeration plates (206) are different, and there is a temperature difference between the two independent spaces. The driving mechanism includes a heat pipe (5) fixedly installed in the two independent spaces, and a first slider (501) is slidably installed in the heat pipe (5). The heat pipe (5) is filled with a low-boiling-point liquid located on one side of the first slider (501). A slide groove (502) corresponding to the heat pipe (5) is provided on the outer end wall of the heat insulation chamber (2), and a second slider (503) is slidably installed in the slide groove (502), and magnets that attract each other are installed in the first slider (501) and the second slider (503), and a rack rod (504) arranged parallel to the slide groove (502) is fixed on the second slider (503). The rotation of the fan wheel (401) extends to the outside of the heat insulation chamber (2), and a transmission belt (505) is connected between the rotating shafts of two adjacent fan wheels (401), and a gear (506) meshing with the rack rod (504) is fixed on the rotating shaft of one of the fan wheels (401).

2. The handheld terminal self-heating structure according to claim 1, characterized in that: The main housing (1), the back cover (101), and the exterior of the antenna (105) are all made of engineering plastics.

3. The handheld terminal self-heating structure according to claim 1, characterized in that: A graphene layer and an aluminum foil layer are sequentially attached to the inner end walls of the main housing (1) and the rear cover (101).

4. The handheld terminal self-heating structure according to claim 1, characterized in that: A bracket (3) arranged on the back side of the heat-insulating chamber (2) is fixedly installed in the main shell (1), and a plug board (301) is slidably inserted in the bracket (3), one end of the plug board (301) is exposed outside the main shell (1), the semiconductor cooling plate (206) is fixedly embedded in the plug board (301), a plug (302) connected to the circuit board (201) is fixed in the bracket (3), a socket (303) adapted to the plug (302) is provided on the plug board (301), and the socket (303) is connected to the semiconductor cooling plate (206).

5. The handheld terminal self-heating structure according to claim 4, characterized in that: The two ends of the second C-shaped copper tube (203) are slidably inserted into the two ends of the corresponding first C-shaped copper tube (202); a copper plate (204) is commonly connected between the plurality of second C-shaped copper tubes (203) corresponding to the same semiconductor cooling plate (206); a spring (205) for elastically supporting the copper plate (204) is fixedly installed on the back of the heat-insulating chamber (2); the copper plate (204) is tightly fitted with the heat-absorbing surface of the semiconductor cooling plate (206) by means of the elastic support of the spring (205).

6. The handheld terminal self-heating structure according to claim 5, characterized in that: A copper box (6) that is tightly fitted with the heat dissipation surface of the semiconductor refrigeration plate (206) is fixedly installed in the back cover (101), and the copper box (6) is filled with water. A threaded cover (601) that is in communication with the interior of the copper box (6) is screwed onto the back of the back cover (101).

7. The handheld terminal self-heating structure according to claim 1, characterized in that: The air inlet of the volute (4) faces the first C-shaped copper tube (202), and the air outlet of the volute (4) faces the inner side end wall of the heat-insulating cabin box (2).

8. The handheld terminal self-heating structure according to claim 1, characterized in that: The thickness of the volute (4) is set to 5 mm.

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