A high-efficiency spray-type texturing device for silicon wafer pretreatment

Abstract

The application discloses a high-efficiency spraying type texturing device for silicon wafer pretreatment, which comprises a texturing tank, a transmission assembly, a driving assembly and a filtering assembly, wherein the side wall of the texturing tank is provided with a flow outlet; the transmission assembly comprises a hollow transmission roller and a sponge sleeve arranged outside the transmission roller, and the circumferential side wall of the transmission roller is provided with spraying through holes; the driving assembly is arranged on the transmission assembly; the filtering assembly is internally provided with a filter; and the liquid delivery assembly comprises a mixing box and a liquid delivery pump, and the mixing box is internally provided with a PH sensor. The high-efficiency spraying type texturing device for silicon wafer pretreatment sprays the texturing solution from inside to outside of the hollow transmission roller towards the sponge sleeve, realizes uniform contact of the reaction solution with the bottom surface of the silicon wafer through the sponge sleeve, and avoids the top surface of the silicon wafer from being contaminated by the reaction solution. In addition, the mixing box can mix clean water, the reaction solution which has not contacted the silicon wafer and the reaction solution which has contacted the silicon wafer and has been filtered, so that the liquid delivery assembly can continuously output the reaction solution with the concentration controlled in a constant range, and the texturing quality is further improved, and the texturing efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of solar cell pretreatment technology, and in particular to a high-efficiency spray texturing device for silicon wafer pretreatment. Background Technology

[0002] The pre-processing technology of solar cells mainly refers to a series of preparation and processing steps before the formation of the PN junction, including silicon wafer cutting, silicon wafer inspection, and surface texturing. These pre-processing steps ensure the quality of the silicon wafer and lay the foundation for subsequent key processes such as diffusion junction formation.

[0003] In existing technologies, spray-type texturing equipment is typically used to spray a reaction liquid onto the surface of silicon wafers for texturing. This texturing equipment mainly includes a spray assembly, a transport assembly, and a reaction liquid circulation assembly. The spray assembly, located at the top of the equipment, consists of multiple spray heads and is used to spray the texturing liquid onto the surface of the silicon wafer. The transport assembly, consisting of rollers or a conveyor belt, is used to transport the silicon wafer through the spray zone. The reaction liquid circulation assembly is used to collect the sprayed texturing liquid, filter and cool it, and then transport it back to the spray assembly to ensure the stability and continuity of the texturing liquid, save on the amount of texturing liquid used, and reduce costs.

[0004] During the operation of the aforementioned device, it is difficult to ensure the uniformity of the reaction solution sprayed from top to bottom on the top surface of the silicon wafer. This results in inconsistent reaction levels across the wafer, reducing the texturing effect. Furthermore, the texturing solution sprayed on the transfer rollers easily comes into contact with the bottom surface of the silicon wafer and reacts with it, further reducing the texturing quality. In addition, although the reaction solution is recycled through the reaction solution circulation component, the concentration of the reaction solution gradually decreases as the reaction continues, while the transfer rate of the transfer component remains mostly constant, causing the texturing effect to gradually decline over time. Moreover, during the texturing process, the reaction between the reaction solution and the silicon wafer causes the temperature of the texturing environment to rise. In order to strictly control the reaction rate, an additional cooling device is required to cool the texturing solution, increasing the cost of the device.

[0005] Therefore, it is necessary to improve the existing spray texturing equipment used for silicon wafer pretreatment. Summary of the Invention

[0006] The purpose of this invention is to overcome the defects in the prior art and provide a high-efficiency spray texturing device for silicon wafer pretreatment that improves texturing quality, ensures texturing efficiency, and reduces costs.

[0007] To achieve the above-mentioned technical effects, the technical solution of the present invention is: a high-efficiency spray-type texturing device for silicon wafer pretreatment, comprising:

[0008] A flocking tank, wherein the top of the flocking tank is open and the side wall is provided with a drain outlet;

[0009] A transmission assembly is horizontally distributed along the length of the flocking tank above the drain outlet. The transmission assembly includes a hollow transmission roller with its axis parallel to the width of the flocking tank and a sponge sleeve sealed outside the transmission roller. The circumferential sidewall of the transmission roller is provided with a spray through hole that communicates with its own inner cavity and is located inside the sponge sleeve. The transmission roller rotates around its own axis inside the flocking tank.

[0010] A driving assembly includes a driving unit and turntables distributed along the length of the texturing pool. The axis of the turntables is parallel to the width of the texturing pool. The distance between the axis of adjacent turntables is less than the length of the silicon wafer. The driving unit drives the turntables to rotate around their own axis. The transfer rollers include an active roller connected to the turntables along the same axis.

[0011] A filtration assembly, wherein the filtration assembly has a built-in filter to output clean reflux liquid;

[0012] An infusion assembly includes a mixing tank and an infusion pump. The mixing tank has a clean water inlet, a raw liquid inlet, a reflux inlet, and a mixing outlet, all of which are connected to its own internal cavity. The mixing tank has a built-in pH sensor. The reflux inlet is connected to the output end of the filter assembly. The mixing outlet is connected to the internal cavity of the transfer roller through the infusion pump. The raw liquid inlet is used to input the reaction solution.

[0013] Preferably, in order to support the stable rotation of the transfer roller around its own axis while facilitating the delivery of reaction liquid into the transfer roller, one end of the transfer roller is closed and adjacent to the drive assembly, and the other end is provided with a liquid inlet hole coaxial with itself and communicating with its own inner cavity. The liquid delivery assembly also includes a liquid delivery pipe extending along the length direction of the texturing tank. The liquid delivery pipe is connected to the output end of the liquid delivery pump. The liquid delivery pipe is fixedly connected to output pipes that are spaced apart along the length direction of the texturing tank. The output pipes correspond one-to-one, and the circumferential outer edge of the output pipe is sealed and fitted to the circumferential inner wall of the liquid inlet hole.

[0014] Preferably, in order to strengthen the connection between the sponge sleeve and the transmission roller and prevent relative rotation between the two, the sponge sleeve is provided with an inner protrusion that penetrates the spray hole on its circumferential inner wall.

[0015] Preferably, in order to achieve stable transport and movement of the silicon wafer and prevent the reaction liquid from flowing to both ends of the transport roller, the two ends of the sponge sleeve are fitted with limiting protrusions that are fixed to the circumferential outer edge of the transport roller and have an outer diameter larger than the outer diameter of the sponge sleeve.

[0016] Preferably, in order to achieve filtration of the reaction liquid after the reaction while ensuring structural compactness, the filtration assembly includes a filter tank with an open top and located immediately below the drain port, and a filter pump connecting the return inlet and the filter tank. The filter is detachably installed inside the filter tank. The texturing tank is also provided with a baffle located below the drain port, and the outer circumferential edge of the baffle is fixedly connected to the inner circumferential wall of the filter tank.

[0017] Preferably, in order to facilitate the storage of high-concentration reaction liquid and further make the device structure more compact, the circumferential inner wall and inner bottom wall of the texturing tank and the partition plate enclose a raw liquid chamber. The texturing tank is fixedly connected to a replenishment pipe that communicates with the raw liquid chamber. The raw liquid chamber and the raw liquid inlet are connected by a raw liquid pump.

[0018] Preferably, in order to facilitate the collection of the reaction liquid output from the transfer roller, the partition is inclined, and the end of the partition adjacent to the drain port is located below the other end of the partition.

[0019] Preferably, in order to achieve stable transport of the silicon wafer, an up-pressure component is also included, which is used to apply downward pressure to the silicon wafer transported by the transport component.

[0020] Preferably, in order to reduce equipment costs and facilitate cooling of the texturing environment to strictly control the reaction rate, the upper pressure assembly includes an upper pressure shell that is adjacent to the transmission surface of the transmission assembly and spaced apart from it by a distance greater than the thickness of the silicon wafer. The bottom surface of the upper pressure shell is horizontal and densely covered with air blowing holes that communicate with its own inner cavity. The upper pressure shell is connected to an air pump.

[0021] Preferably, in order to ensure the cleanliness of the flocking environment, the input end of the air pump is detachably connected to a filter screen.

[0022] In summary, compared with existing technologies, the high-efficiency spray texturing device for silicon wafer pretreatment of this invention sprays texturing liquid from the inside out toward the sponge sleeve through a hollow transfer roller. The sponge sleeve achieves uniform contact between the reaction liquid and the bottom surface of the silicon wafer, and avoids the top surface of the silicon wafer from being contaminated with reaction liquid. Moreover, the mixing tank can mix clean water, reaction liquid that has not been in contact with the silicon wafer, and reaction liquid that has been in contact with the silicon wafer and has been filtered. This allows the infusion assembly to continuously output reaction liquid with a concentration controlled within a constant range, further improving the texturing quality and increasing the texturing efficiency. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention;

[0024] Figure 2 yes Figure 1 A structural diagram from another perspective;

[0025] Figure 3 yes Figure 2 A schematic diagram of the cross-sectional structure;

[0026] Figure 4 yes Figure 3 The front view;

[0027] Figure 5 yes Figure 2 An explosion diagram;

[0028] Figure 6 yes Figure 2 Top view;

[0029] Figure 7 yes Figure 5 Partial structural diagram;

[0030] Figure 8 yes Figure 7 An explosion diagram;

[0031] Figure 9 This is a schematic diagram of the structure of the pressing component of the present invention;

[0032] Figure 10 yes Figure 9 An explosion diagram;

[0033] Figure 11 yes Figure 9 An illustration of the explosion from another perspective;

[0034] Figure 12 This is a schematic diagram of the transmission component of the present invention;

[0035] Figure 13 yes Figure 12 An explosion diagram;

[0036] In the diagram: 1. Texturing tank; 11. Drain outlet; 12. Baffle plate; 13. Liquid replenishment pipe; 131. Sealing plug; 14. Viewing window; 15. Inner convex strip; 151. Positioning through hole; 2. Conveying assembly; 21. Conveying roller; 211. Spray through hole; 212. Liquid inlet hole; 213. Limiting convex ring; 22. Sponge sleeve; 221. Inner convex part; 23. Bearing; 24. Concentric shaft; 3. Driving assembly; 31. Driving unit; 311. Driving motor; 312. Driving gear; 313. Driven gear; 314. Bushing; 32. Turntable; 33. Connecting rod; 4. Filtering assembly; 41. Filter tank; 411. Inner convex frame; 4 2. Filter; 43. Filter pump; 5. Infusion assembly; 51. Mixing tank; 511. Clean water inlet; 512. Raw material inlet; 513. Reflux inlet; 514. Mixing outlet; 52. Infusion pump; 521. Fixing frame; 53. pH sensor; 54. Raw material pump; 55. Clean water pump; 56. Connecting pipe; 57. Tank cover; 58. Infusion tube; 581. Output tube; 6. Pressurization assembly; 61. Pressurization shell; 611. Air vent; 612. Bottom shell; 613. Clamping plate; 614. Top shell; 615. Diverter hole; 616. Positioning post; 62. Air pump; 63. Filter screen; 631. Spiral tube; 7. Silicon wafer. Detailed Implementation

[0037] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solutions of the present invention and should not be construed as limiting the scope of protection of the present invention.

[0038] like Figures 1-11 As shown, the high-efficiency spray texturing apparatus for silicon wafer pretreatment of the present invention includes:

[0039] The top of the flocking tank 1 is open, and the side wall is provided with a drain port 11;

[0040] The transmission assembly 2 is horizontally distributed above the drain outlet 11 along the length of the flocking tank 1. The transmission assembly 2 includes a hollow transmission roller 21 with its axial direction parallel to the width direction of the flocking tank 1 and a sponge sleeve 22 sealed outside the transmission roller 21. The circumferential sidewall of the transmission roller 21 is provided with a spray through hole 211 that communicates with its own inner cavity and is located inside the sponge sleeve 22. The transmission roller 21 rotates around its own axis inside the flocking tank 1.

[0041] The driving assembly 3 includes a driving unit 31 and a turntable 32 distributed along the length direction of the texturing tank 1. The axis of the turntable 32 is parallel to the width direction of the texturing tank 1. The distance between the axis of adjacent turntables 32 is less than the length dimension of the silicon wafer. The driving unit 31 drives the turntable 32 to rotate around its own axis. The transfer roller 21 includes an active roller connected to the turntable 32 along the same axis.

[0042] Filter assembly 4, with built-in filter 42 to output clean return liquid;

[0043] The infusion assembly 5 includes a mixing tank 51 and an infusion pump 52. The mixing tank 51 has a clean water inlet 511, a raw liquid inlet 512, a reflux inlet 513, and a mixing outlet 514, all of which are connected to its own inner cavity. The mixing tank 51 has a built-in pH sensor 53. The reflux inlet 513 is connected to the output end of the filter assembly 4. The mixing outlet 514 is connected to the inner cavity of the transfer roller 21 through the infusion pump 52. The raw liquid inlet 512 is used to input the reaction solution.

[0044] When in use, the device detects the pH value of the reaction solution in the mixing tank 51 using a pH sensor 53 to monitor the concentration of the reaction solution. When the concentration is high, clean water is injected into the mixing tank 51 through the clean water inlet 511. When the concentration is low, unreacted, high-concentration reaction solution is added to the mixing tank 51 through the raw solution inlet 512. This ensures that the reaction solution in the mixing tank 51 maintains a concentration within a preset range, which helps control the reaction rate and extent between the reaction solution and the silicon wafer 7, preventing excessively high concentrations of the reaction solution in contact with the silicon wafer 7, which could lead to over-reaction. Excessive corrosion and low concentration of the reaction solution can lead to incomplete corrosion reaction and affect the texturing effect. To prevent contamination of the mixed reaction solution in the mixing tank 51 and affect the texturing quality, the top of the mixing tank 51 is covered with a tank cover 57. The clean water inlet 511 is connected to a clean water pump 55, which is used to input clean water into the mixing tank 51 to reduce the concentration of the reaction solution. In addition, after the texturing is completed, clean water can be directly injected into the mixing tank 51 and delivered to the transmission roller 21 through the liquid delivery component 5 to clean the outer sponge sleeve 22 of the transmission roller 21.

[0045] A reaction solution with a fixed concentration is formed and stored in the mixing tank 51. The reaction solution with a fixed concentration is drawn from the mixing tank 51 by the infusion pump 52 through the mixing outlet 514 and delivered to the interior of each hollow transfer roller 21 of the transfer assembly 2, so that the reaction solution is sprayed out through the spray hole 211, wets the sponge sleeve 22, and contacts the bottom surface of the silicon wafer 7 through the sponge sleeve 22.

[0046] With the above design, on the one hand, the drive assembly 3 drives part of the transfer roller 21 to rotate in the texturing tank 1, so that the transfer roller 21 can be used to transfer the silicon wafer 7, and at the same time, the transfer roller 21 can also replace the nozzle to spray the texturing liquid. The sponge sleeve 22 covers the spray holes 211 of the transfer roller 21, so that after the sponge sleeve 22 is wetted, it contacts the bottom surface of the silicon wafer 7, so that the reaction liquid adsorbed by the sponge sleeve 22 contacts the bottom surface of the silicon wafer 7, so as to achieve uniform contact reaction between the bottom surface of the silicon wafer 7 and the reaction liquid, ensuring the texturing quality. Moreover, the sponge sleeve 22 is a flexible porous material, which makes... The sponge sleeve 22 can flexibly contact the bottom surface of the silicon wafer 7, avoiding rigid contact with the silicon wafer 7 and thus preventing increased wear on the bottom surface of the silicon wafer 7. In addition, since the sponge sleeve 22 is sealed outside the transfer roller 21 and is used to support the bottom surface of the silicon wafer 7, it can prevent the reaction liquid sprayed from the sponge sleeve 22 from contacting the top surface of the silicon wafer 7. That is, by wrapping the transfer roller 21 with the sponge sleeve 22 and covering the spray hole 211, it can effectively prevent the reaction liquid from being sprayed out and corroding the top surface of the silicon wafer 7. In this way, efficient texturing of one side of the silicon wafer 7 is achieved, and the texturing quality is guaranteed.

[0047] After the sponge sleeve 22, which is soaked in the reaction solution, comes into contact with the bottom surface of the silicon wafer 7, some of the reaction solution drips downwards and is discharged through the drain port 11. It then enters the filter assembly 4, where the filter 42 filters out impurities mixed in with the reaction solution, and outputs a clean reaction solution with a reduced concentration. This clean reaction solution is then fed into the mixing tank 51 through the return inlet 513. It is mixed with clean water and other unreacted and highly concentrated reaction solutions to form a reaction solution within a preset concentration range. This solution is then output by the original solution pump 54. In this way, the reaction solution is recycled and reused multiple times, saving the amount of reaction solution and reducing the texturing cost. Moreover, by controlling the concentration of the reaction solution, the reaction rate can be controlled, avoiding excessively high or low concentrations, thus ensuring texturing efficiency and texturing effect.

[0048] In this embodiment, the texturing pool 1 is rectangular, and the drain outlet 11 is located on the lower part of the side wall at one end of the texturing pool 1, extending along the width direction of the texturing pool 1.

[0049] A further improvement is that the filter assembly 4 includes a filter tank 41 with an open top and located below the drain port 11, and a filter pump 43 connecting the return inlet 513 and the filter tank 41. The filter 42 is detachably installed inside the filter tank 41. A baffle 12 located below the drain port 11 is also provided inside the texturing tank 1. The outer circumferential edge of the baffle 12 is fixedly connected to the inner circumferential wall of the filter tank 41.

[0050] Specifically, the filter tank 41 is integrally formed at one end of the texturing tank 1, making the device structure more compact and reducing the floor space. The filter tank 41 is located below the drain port 11, and both ends of the filter tank 41 are flush with the sides of the texturing tank 1. The baffle 12 can guide the reaction liquid to flow out of the drain port 11 and then flow downward into the filter tank 41.

[0051] A horizontal inner protruding frame 411 is provided on the circumferential inner wall of the filter tank 41. The filter 42 is a filter screen frame, and its circumferential outer edge is sealed and fitted with the circumferential inner wall of the inner protruding frame 411. The top of the filter screen frame is provided with an outward flange. The inner protruding frame 411 facilitates the support of the outward flange and the positioning of the filter 42 in the horizontal direction, and makes the bottom of the filter 42 separated from the inner bottom wall of the filter tank 41. The inner bottom wall, circumferential inner wall, inner protruding frame 411 and filter 42 enclose the filter chamber. The input end of the filter pump 43 is connected to the filter chamber, and the output end is connected to the return inlet 513.

[0052] With the above structure, the reaction liquid flows out from the drain port 11 and enters the filter tank 41. The filter 42 filters out the residue and impurities, allowing the clean and less concentrated reaction liquid to enter the filter chamber. The filter pump 43 starts, and the reaction liquid with reduced concentration after the reaction is input into the mixing box 51 through the return inlet 513. The inner convex frame 411 realizes the plug-in fit between the filter 42 and the filter tank 41, which makes it convenient to remove the filter 42 for cleaning after long-term use, and then reinstall it in the filter tank 41, so as to ensure the long-term stable and efficient filtration performance of the filter assembly 4.

[0053] A further improvement is that the circumferential inner wall and inner bottom wall of the texturing tank 1 are enclosed by the partition 12 to form a raw liquid chamber. The texturing tank 1 is fixedly connected to a replenishment pipe 13 that is connected to the raw liquid chamber. The raw liquid chamber and the raw liquid inlet 512 are connected by a raw liquid pump 54.

[0054] With the above structure, the texturing tank 1 forms a raw liquid chamber by enclosing itself with the partition 12 through its inner wall, which is used to store the high-concentration reaction liquid that has not participated in the reaction, and separates the reaction liquid from the reaction liquid whose concentration decreases after participating in texturing. When the concentration of the reaction liquid in the mixing tank 51 decreases, the raw liquid pump 54 is started to transport the high-concentration reaction liquid into the mixing tank 51 through the raw liquid inlet 512, so as to control the reaction liquid in the mixing tank 51 within the preset over-temperature range.

[0055] The end of the replenishment tube 13 away from the texturing tank 1 extends upward to facilitate the injection of high-concentration reaction liquid into the original liquid chamber. The replenishment tube 13 is threaded with a sealing plug 131 to ensure the sealing of the original liquid chamber and prevent the reaction liquid from being contaminated. In order to facilitate the observation of the remaining amount of reaction liquid in the original liquid chamber, an observation port is provided on the side wall of the texturing tank 1. A viewing window 14 is provided in the observation port, and the viewing window 14 is directly facing the original liquid chamber.

[0056] A further improvement is that the partition 12 is inclined, with one end of the partition 12 adjacent to the drain port 11 located below the other end of the partition 12. With this design, on the one hand, it facilitates guiding the reaction liquid dripping from the sponge sleeve 22 and the bottom surface of the silicon wafer 7, allowing it to drain out through the drain port 11 along the inclined partition 12, reducing the residual amount of reaction liquid; on the other hand, it increases the storage capacity of the original liquid chamber, facilitating the storage of more reaction liquid.

[0057] A further improvement is that one end of the transfer roller 21 is closed and adjacent to the drive assembly 3, and the other end is provided with an inlet hole 212 that is coaxial with itself and communicates with its own inner cavity. The infusion assembly 5 also includes an infusion pipe 58 extending along the length of the texturing pool 1. The infusion pipe 58 is connected to the output end of the infusion pump 52. The infusion pipe 58 is fixedly connected to an output pipe 581 that is spaced apart along the length of the texturing pool 1. The output pipes 581 correspond one to one. The circumferential outer edge of the output pipe 581 is sealed and fitted to the circumferential inner wall of the inlet hole 212.

[0058] like Figure 10 and Figure 11 As shown, bearings 23 are provided at both ends of the transmission roller 21. The inner ring of the bearing 23 is fixedly connected to the circumferential outer edge of the end of the transmission roller 21, and the outer ring is fixedly connected to the inner walls on both sides of the flocking pool 1, so as to support the transmission roller 21 to rotate stably around its own axis.

[0059] The closed end of the transfer roller 21 is coaxially fixedly connected to a concentric shaft 24. The concentric shaft 24 seals through the side wall of the texturing pool 1. The turntable 32 in the drive assembly 3 is coaxially fixedly connected to part of the concentric shaft 24. The other end of the transfer roller 21 is located inside the texturing pool 1 and is provided with a liquid inlet hole 212.

[0060] In the infusion assembly 5, the infusion pump 52 is fixedly connected to the side wall of the texturing tank 1 through the fixing bracket 521. The input end of the infusion pump 52 is connected to the mixing outlet 514 through the connecting pipe 56, and the output end is connected to the infusion pipe 58. The output pipe 581 is fixedly penetrated through the side wall of the texturing tank 1. One end is connected to the infusion pipe 58, and the outer circumferential edge of the other end is sealed and fitted to the inner circumferential wall of the inlet hole 212. The output pipe 581, the inlet hole 212 and the transfer roller 21 are coaxial.

[0061] With the above structure, while facilitating the rotation of the transfer roller 21 around its own axis, the infusion pump 52 draws reaction liquid of a specific concentration from the mixing outlet 514 through the connecting pipe 56. After the reaction liquid flows into the infusion pipe 58, it enters the inner cavity of the transfer roller 21 through the output pipe 581 and the inlet hole 212, and can then be discharged from the spray through hole 211 to wet the sponge sleeve 22. This facilitates the contact between the sponge sleeve 22 and the bottom surface of the silicon wafer 7, and allows for texturing of the bottom surface of the silicon wafer 7.

[0062] In order to enable the silicon wafer 7 to move along the length of the texturing tank 1 under the support of the transmission component 2, the multiple transmission rollers 21 in this embodiment are divided into active rollers and driven rollers. The active rollers are connected to the driving component 3 and are driven to rotate by the driving component 3. The active rollers and driven rollers are distributed at intervals, and the interval between adjacent active rollers is less than the length of the silicon wafer 7. In this way, it is ensured that the silicon wafer 7 is always connected to at least one active roller during the transmission process. The active rollers are driven to rotate by the driving component 3, thereby realizing the translation of the silicon wafer 7 along the length of the texturing tank 1.

[0063] In the drive assembly 3, two adjacent turntables 32 are hinged together by a connecting rod 33, and the distance between the hinge position and the axis of the turntable 32 is fixed. The drive unit 31 drives one of the turntables 32 to rotate around its own axis. In this way, the connecting rod 33 drives the other turntables 32 to rotate synchronously and at the same speed, thereby realizing the synchronous and same speed rotation of each transmission roller 21 around its own axis in the flocking pool 1.

[0064] The drive unit 31 includes a drive motor 311. The output end of the drive motor 311 is coaxially fixedly connected to a drive gear 312 and has a bushing 314 at its end. The bushing 314 is fixed above the flocking pool 1 to ensure that the drive gear 312 can rotate stably around its own axis. The drive gear 312 meshes with a driven gear 313. The driven gear 313 is a toothed ring and its circumferential inner wall is fixedly connected to the circumferential outer edge of one of the turntables 32.

[0065] With the above structure, the drive motor 311 starts and drives the drive gear 312 to rotate stably around its own axis under the support of the bushing 314, causing the driven gear 313 to rotate, which in turn drives the turntable 32, which is coaxial with the driven gear 313, to rotate. The turntable 32 acts on other turntables 32 through the connecting rod 33, so that each turntable 32 and each transmission roller 21 rotate synchronously and at the same speed to realize the translation of the silicon wafer 7.

[0066] A further improvement is that the inner wall of the sponge sleeve 22 is provided with an inner protrusion 221 that penetrates the spray hole 211.

[0067] Specifically, the conveyor roller 21 is densely covered with spray through holes 211, and the inner protrusion 221 on the inner side of the sponge sleeve 22 corresponds one-to-one with the spray through holes 211. The outer diameter of the inner protrusion 221 is consistent with the inner diameter of the spray through holes 211.

[0068] With the above structure, the relatively fixed connection between the transfer roller 21 and the sponge sleeve 22 can be achieved through the cooperating inner protrusion 221 and the spray through hole 211, avoiding relative rotation and axial displacement, so as to ensure the smooth transfer of the silicon wafer 7. Moreover, the inner protrusion 221 that penetrates the spray through hole 211 can easily contact the reaction liquid in the transfer roller 21, so that the sponge sleeve 22 can absorb the reaction liquid in the transfer roller 21 and contact the bottom surface of the silicon wafer 7 to carry out the reaction.

[0069] A further improvement is that the two ends of the sponge sleeve 22 are fitted with limiting protrusions 213 that are fixed to the circumferential outer edge of the transmission roller 21 and have an outer diameter larger than the outer diameter of the sponge sleeve 22.

[0070] The limiting protrusion ring 213 can limit the axial movement distance of the silicon wafer 7 on the sponge sleeve 22, limit the transmission trajectory of the silicon wafer 7, and prevent the silicon wafer 7 from axially shifting a large distance relative to the transmission roller 21. In addition, the limiting protrusion ring 213 can also limit the flow of the reaction liquid absorbed by the sponge sleeve 22 to the end of the transmission roller 21, thereby preventing the reaction liquid from leaking from the connection between the transmission roller 21 and the texturing pool 1.

[0071] In this invention, the transmission roller 21 is provided with four limiting protrusions 213 that are equally spaced along its length direction, and a sponge sleeve 22 is provided between two adjacent limiting protrusions 213, with both ends of the sponge sleeve 22 fitting against the limiting protrusions 213.

[0072] A further improvement is that it also includes an uppressure assembly 6, which is used to apply downward pressure to the silicon wafer 7 conveyed by the transport assembly 2.

[0073] By setting up the upper pressure component 6, the upper pressure component 6 can apply downward pressure to the silicon wafer 7, thereby increasing the pressure between the bottom surface of the silicon wafer 7 and the sponge sleeve 22, ensuring the transmission force of the sponge sleeve 22 on the silicon wafer 7, and promoting the smooth movement of the silicon wafer 7. In addition, by applying pressure to the silicon wafer 7, the full contact between the silicon wafer 7 and the sponge sleeve 22 is ensured, which in turn facilitates the reaction liquid absorbed by the sponge sleeve 22 to contact the bottom surface of the silicon wafer 7, and to etch the bottom surface of the silicon wafer 7 for texturing.

[0074] A further improvement is that the upper pressure assembly 6 includes an upper pressure shell 61 that is adjacent to the upper surface of the transmission assembly 2 and spaced apart from it by a distance greater than the thickness of the silicon wafer 7. The bottom surface of the upper pressure shell 61 is horizontal and densely covered with air holes 611 that communicate with its own inner cavity. The upper pressure shell 61 is connected to an air pump 62. The input end of the air pump 62 is detachably connected to a filter screen 63.

[0075] When pressure is applied, the air pump 62 starts, drawing in external air and filtering dust and impurities from the air using the filter screen 63. This allows the incoming air to be delivered to the upper pressure shell 61 by the air pump 62 and ejected from the air blowing hole 611 on the bottom surface of the upper pressure shell 61. The air acts downwards. Since the distance between the bottom surface of the upper pressure shell 61 and the transmission surface of the transmission component 2 is greater than the thickness of the silicon wafer 7, the silicon wafer 7 avoids collision with the upper pressure shell 61 when it is transmitted through the transmission component 2. The clean air ejected from the bottom of the upper pressure shell 61 not only applies downward pressure to the silicon wafer 7, increasing the transmission pressure between the silicon wafer 7 and the sponge sleeve 22 and ensuring stable transmission of the silicon wafer 7, but the ejected airflow also drives the airflow on the surface of the silicon wafer 7 and its surroundings, thereby accelerating heat dissipation, reducing the temperature of the silicon wafer 7 and the texturing environment, and preventing the temperature increase caused by the chemical reaction that occurs after the reaction liquid comes into contact with the silicon wafer 7 during texturing. Thus, the pressure-up component 6 not only enables stable transmission of silicon wafer 7, but also applies pressure in a non-contact manner, avoiding markings on the top surface of silicon wafer 7 during pressure application. It also promotes the contact and reaction between silicon wafer 7 and the reaction liquid absorbed by the sponge sleeve 22, while driving the surrounding airflow to accelerate heat dissipation. This prevents the temperature from rising and the reaction rate from accelerating as the reaction proceeds. In other words, by accelerating heat dissipation, the reaction environment temperature is controlled, and the corrosion rate is prevented from being too fast. Combined with the stable concentration of reaction liquid output by the liquid delivery component 5, the texturing quality of silicon wafer 7 is further improved.

[0076] In addition, the filter screen 63 is fixedly connected to the screw tube 631, which is threadedly connected to the input end of the air pump 62. This facilitates quick and detachable connection between the filter screen 63 and the air pump 62, and allows for regular disassembly of the filter screen 63 for cleaning, thus ensuring filtration performance.

[0077] The upper pressure shell 61 includes a bottom shell 612, a clamping plate 613, and a top shell 614 connected sequentially from bottom to top. The top of the bottom shell 612 is open, and the bottom of the top shell 614 is open. The bottom and top surfaces of the clamping plate 613 cover the top of the bottom shell 612 and the bottom surface of the top shell 614, respectively. The bottom shell 612 is densely covered with air blowing holes 611. The clamping plate 613 is provided with diversion holes 615 distributed along its length. The input end of the air pump 62 is fixedly connected to the top surface of the top shell 614 and communicates with the cavity formed by the top shell 614 and the clamping plate 613.

[0078] With the above structure, the bottom shell 612, the clamping plate 613 and the top shell 614 enclose and form two cavities. The air pump 62 introduces external air into the upper cavity and flows into the lower cavity through the diversion hole 615. The airflow is evenly sprayed from the air blowing hole 611 of the bottom shell 612 to pressurize and cool the silicon wafer 7.

[0079] A further improvement is that the upper pressing components 6 are spaced apart along the length of the texturing pool 1 and are detachably connected to the texturing pool 1.

[0080] Specifically, positioning posts 616 extending vertically are fixed at both ends of the clamping plate 613. Horizontal inner protrusions 15 are provided on the inner walls on both sides of the flocking pool 1. The inner protrusions 15 extend along the length of the flocking pool 1. Positioning through holes 151 are evenly distributed on the inner protrusions 15 along the length of the flocking pool 1. The positioning through holes 151 are inserted and engaged with the positioning posts 616.

[0081] With the above structure, it is convenient to detachably connect the pressing component 6 to the texturing tank 1, thereby facilitating the adjustment of the installation position and distribution quantity of the pressing component 6.

[0082] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A high-efficiency spray-type texturing device for silicon wafer pretreatment, characterized in that, include: The top of the flocking tank (1) is open and the side wall is provided with a drain port (11). The transmission assembly (2) is horizontally distributed along the length of the fabrication tank (1) above the drain outlet (11). The transmission assembly (2) includes a hollow transmission roller (21) with its axial direction parallel to the width of the fabrication tank (1) and a sponge sleeve (22) sealed outside the transmission roller (21). The circumferential sidewall of the transmission roller (21) is provided with a spray through hole (211) that communicates with its own inner cavity and is located inside the sponge sleeve (22). The transmission roller (21) rotates around its own axis inside the fabrication tank (1). The driving assembly (3) includes a driving unit (31) and a turntable (32) distributed along the length direction of the texturing pool (1). The axis of the turntable (32) is parallel to the width direction of the texturing pool (1). The distance between the axis of adjacent turntables (32) is less than the length dimension of the silicon wafer. The driving unit (31) drives the turntable (32) to rotate around its own axis. The transfer roller (21) includes an active roller connected to the turntable (32) along the same axis. Filter assembly (4), which has a built-in filter (42) to output clean reflux liquid; The infusion assembly (5) includes a mixing tank (51) and an infusion pump (52). The mixing tank (51) has a clean water inlet (511), a raw liquid inlet (512), a reflux inlet (513), and a mixing outlet (514) that are all connected to its own inner cavity. The mixing tank (51) has a built-in pH sensor (53). The reflux inlet (513) is connected to the output end of the filter assembly (4). The mixing outlet (514) is connected to the inner cavity of the transfer roller (21) through the infusion pump (52). The raw liquid inlet (512) is used to input the reaction solution.

2. The high-efficiency spray-texturing device for wafer pretreatment of claim 1, wherein: One end of the transmission roller (21) is closed and adjacent to the drive assembly (3), and the other end is provided with an inlet hole (212) that is coaxial with itself and communicates with its own inner cavity. The infusion assembly (5) also includes an infusion pipe (58) extending along the length direction of the fabrication tank (1). The infusion pipe (58) is connected to the output end of the infusion pump (52). The infusion pipe (58) is fixedly connected to an output pipe (581) that is spaced apart along the length direction of the fabrication tank (1). The output pipe (581) corresponds one to one with the output pipe (581). The circumferential outer edge of the output pipe (581) is sealed and fitted to the circumferential inner wall of the inlet hole (212).

3. The high efficiency spray etching device for wafer pretreatment of claim 1, wherein: The inner wall of the sponge sleeve (22) is provided with an inner protrusion (221) that penetrates the spray hole (211).

4. The high efficiency spray etching device for wafer pretreatment of claim 1, wherein: The two ends of the sponge sleeve (22) are fitted with limiting protrusions (213) that are fixed to the circumferential outer edge of the transmission roller (21) and have an outer diameter larger than the outer diameter of the sponge sleeve (22).

5. The high-efficiency spray texturing device for silicon wafer pretreatment according to claim 1, characterized in that: The filter assembly (4) includes a filter pool (41) with an open top and located below the drain port (11) and a filter pump (43) connected between the return inlet (513) and the filter pool (41). The filter (42) is detachably installed in the filter pool (41). The texturing tank (1) is also provided with a partition (12) located below the drain port (11). The outer circumferential edge of the partition (12) is fixedly connected to the inner circumferential wall of the filter pool (41).

6. The high efficiency spray etching device for wafer pretreatment of claim 5, wherein: The circumferential inner wall and inner bottom wall of the texturing pool (1) are enclosed by the partition (12) to form a raw liquid cavity. The texturing pool (1) is fixedly connected to a replenishment pipe (13) that is connected to the raw liquid cavity. The raw liquid cavity and the raw liquid inlet (512) are connected by a raw liquid pump (54).

7. The high efficiency spray etching device for wafer pretreatment of claim 5, wherein: The partition (12) is inclined, and one end of the partition (12) adjacent to the drain port (11) is located below the other end of the partition (12).

8. The high efficiency spray etching device for silicon wafer pretreatment of claim 1, wherein: It also includes an uppressure assembly (6) for applying downward pressure to the silicon wafer conveyed by the transport assembly (2).

9. The high efficiency spray etching device for wafer pretreatment of claim 8, wherein: The upper pressure assembly (6) includes an upper pressure shell (61) that is adjacent to the transmission surface of the transmission assembly (2) and spaced apart from it by a distance greater than the thickness of the silicon wafer. The bottom surface of the upper pressure shell (61) is horizontal and densely covered with air holes (611) that communicate with its own inner cavity. The upper pressure shell (61) is connected to an air pump (62).

10. The high efficiency spray etching device for silicon wafer pretreatment of claim 9, wherein: The input end of the air pump (62) is detachably connected to a filter screen (63).

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