A flexible Local dimming structure for a curved display screen

Abstract

The present invention discloses a flexible Local dimming structure for a curved display screen, which relates to the field of curved display screens and includes a flexible substrate. A plurality of bowl-shaped mounting grooves arranged in a matrix are formed on the flexible substrate; light-emitting chips mounted in the bowl-shaped mounting grooves; copper circuits disposed on the flexible substrate, and at least one positioning bracket for positioning the light-emitting chips is provided on the copper circuits; a heat dissipation member for dissipating heat from the light-emitting chips; a surrounding edge disposed outside the flexible substrate; in the present invention, the elastic contact member is deformed first due to being squeezed, which can not only play a sealing role to prevent glue from overflowing, but also make the flexible diversion member tilt due to inflation. After the optical glue layer is squeezed, the glue will flow outward and flow along the flexible diversion member into the back-shaped accommodating groove, which can further prevent glue from overflowing, thereby facilitating the simplification of the manufacturing process of the curved screen. Moreover, by using the two interception defense lines of the inner side edge and the outer side edge, the probability of liquid optical glue flowing onto the workbench during dispensing can also be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of curved display screens, and specifically to a flexible Local dimming structure for a curved display screen. Background Art

[0002] Local dimming technology (i.e., local backlight adjustment) means dividing the backlight sources arranged in a matrix into several regions, and each region can independently adjust the brightness. In this way, when a certain region in the image needs to display dark details, only the backlight brightness of that region needs to be lowered, while the backlight brightness of other regions remains unchanged.

[0003] For example, the utility model patent with the application number 202321105179.8 discloses a flexible LOCAL DIMMING structure for a curved display screen, which includes a flexible substrate. A number of parallel copper cloth lines are arranged on the flexible substrate. A number of LED wafers are arranged above the copper cloth lines. Solid crystal encapsulating glue is arranged above the LED wafers. White oil is filled between adjacent copper cloth lines. An OCA layer is arranged on the upper part of the solid crystal encapsulating glue; by using FILM film (i.e., polyester film) or FPC film (i.e., polyimide film) as the base material, the LED wafers can be bound more densely, achieving finer brightness and color, and at the same time realizing the thin and light of the curved screen product.

[0004] However, the above-mentioned prior art still has the following deficiencies: the flexible substrate does not have an anti-overflow glue structure. When pasting the flexible LOCAL DIMMING structure with liquid optical glue (OCA layer), the liquid optical glue is easy to overflow. Subsequently, a cutting device needs to be used to cut off the overflowed solidified optical glue, which is not conducive to simplifying the manufacturing process of the curved display screen. Moreover, the liquid optical glue is also easy to flow onto the workbench surface during dispensing. If it is not cleaned in time, it will contaminate the workpieces on the workbench surface. Summary of the Invention

[0005] To solve the defects existing in the prior art, the present invention provides a flexible Local dimming structure for a curved display screen.

[0006] To solve the above technical problems, the present invention provides the following technical solutions:

[0007] A flexible Local dimming structure for a curved display screen of the present invention includes a flexible substrate, and a number of bowl-shaped mounting grooves arranged in a matrix are formed on the flexible substrate;

[0008] Light-emitting chips installed in the bowl-shaped mounting grooves;

[0009] Copper circuits arranged on the flexible substrate, and at least one positioning bracket for positioning the light-emitting chips is arranged on the copper circuits;

[0010] A heat dissipation component for dissipating heat from a light-emitting chip, the heat dissipation component being embedded in a flexible substrate;

[0011] A peripheral edge disposed outside the flexible substrate, the peripheral edge being used to prevent glue from overflowing. A rectangular accommodating groove for accommodating the overflowing glue is provided on the peripheral edge. The peripheral edge is separated by the rectangular accommodating groove into an inner side edge that fits the flexible substrate and an outer side edge that is parallel to and has the same height as the inner side edge. An elastic contact member with a C-shaped cross-section is provided at the top of the outer side edge, and a flexible guiding member that is smoothly connected to the inner side edge is provided in the rectangular accommodating groove.

[0012] As a preferred technical solution of the present invention, a cavity is provided in the flexible guiding member, and a U-shaped air guiding cavity with a cross-section is provided in the peripheral edge. The air guiding cavity is connected to the cavity through an arc-shaped air passage.

[0013] As a preferred technical solution of the present invention, an extrusion air cavity with a C-shaped cross-section is formed in the elastic contact member, and the extrusion air cavity is connected to the air guiding cavity.

[0014] As a preferred technical solution of the present invention, the heat dissipation component includes a heat dissipation frame and a plurality of heat conducting bodies arranged in a matrix. Heat dissipation strips are provided in the heat dissipation frame in a side-by-side manner, and the heat conducting bodies are distributed on the heat dissipation frame and the heat dissipation strips.

[0015] As a preferred technical solution of the present invention, both the heat dissipation frame and the heat dissipation strips are disposed on the back surface of the flexible substrate and do not protrude from the flexible substrate. A plurality of through holes are provided on both the heat dissipation frame and the heat dissipation strips.

[0016] As a preferred technical solution of the present invention, a conductive block that contacts the copper circuit is provided at the bottom of the light-emitting chip, and four insulating positioning blocks are provided outside the conductive block in a rectangular distribution.

[0017] As a preferred technical solution of the present invention, the positioning bracket includes two centrally convex blocks that are symmetrically distributed and fit the conductive block. Two auxiliary convex blocks that are symmetrically distributed and fit the conductive block are provided outside the centrally convex blocks. A positioning opening that matches the insulating positioning block is formed between the centrally convex block and the auxiliary convex blocks.

[0018] As a preferred technical solution of the present invention, an insulator is further provided in the bowl-shaped mounting groove, and a through hole that can allow the heat conducting body to pass through is provided in the insulator.

[0019] As a preferred technical solution of the present invention, white oil layers formed by coating are provided on both the front surface of the flexible substrate and the inner wall of the bowl-shaped mounting groove. A die bonding glue for protecting the light-emitting chip is provided in the bowl-shaped mounting groove, and an optical glue layer is provided on the top of the die bonding glue.

[0020] As a preferred technical solution of the present invention, the height of the inner side is higher than that of the flexible substrate, and the inner side and the flexible substrate cooperate to form a receiving groove for receiving the optical glue layer.

[0021] The beneficial effects of the present invention are as follows:

[0022] 1. In the flexible Local dimming structure of this curved display screen, the elastic contact member is deformed first due to extrusion, which can not only play a sealing role to prevent the liquid optical glue from overflowing, but also the gas in the extrusion air cavity will flow into the cavity through the air guiding cavity, causing the flexible guiding member to tilt due to inflation. After the optical glue layer is extruded, the glue will flow outward and flow along the flexible guiding member into the rectangular receiving groove. The overflowing glue can be received through the rectangular receiving groove, which can further prevent the liquid optical glue from overflowing, thus facilitating the simplification of the manufacturing process of the curved screen. Moreover, by using the two interception lines of the inner side and the outer side, the probability of the liquid optical glue flowing onto the workbench during dispensing can also be reduced.

[0023] 2. In the flexible Local dimming structure of this curved display screen, the heat dissipation frame and heat dissipation strips provided are used to support the heat conductor. Compared with setting the heat conductor alone, the heat dissipation area can be increased, and the through holes provided on the heat dissipation frame and heat dissipation strips are conducive to bending the flexible substrate.

[0024] 3. In the flexible Local dimming structure of this curved display screen, the conductive block can be restricted by the middle convex block and the auxiliary convex block, and the insulating positioning block can be restricted by the positioning port, so as to realize the rapid positioning of the light-emitting chip and reduce the probability of the position of the installed light-emitting chip shifting.

[0025] 4. In the flexible Local dimming structure of this curved display screen, the insulator can not only effectively reduce the leakage current between adjacent copper circuits, reduce energy consumption, but also conduct the heat generated during the operation of the copper circuits and the light-emitting chip to the heat dissipation member. Description of the Drawings

[0026] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention. In the drawings:

[0027] Figure 1 is a schematic structural diagram of a flexible Local dimming structure (omitting the optical glue layer) of a curved display screen of the present invention;

[0028] Figure 2 is a schematic back structure diagram of a flexible Local dimming structure of a curved display screen of the present invention;

[0029] Figure 3 It is a schematic structural diagram of a flexible Local dimming structure (omitting the optical adhesive layer) of a curved display screen of the present invention in a compressed state;

[0030] Figure 4 It is a schematic structural diagram of a flexible Local dimming structure (omitting the optical adhesive layer and die bonding glue) of a curved display screen of the present invention;

[0031] Figure 5 It is a schematic structural diagram of a flexible Local dimming structure (omitting the optical adhesive layer, die bonding glue and light-emitting chip) of a curved display screen of the present invention;

[0032] Figure 6 It is a three-dimensional sectional view of a flexible Local dimming structure (omitting the optical adhesive layer and die bonding glue) of a curved display screen of the present invention;

[0033] Figure 7 It is a flexible Local dimming structure of a curved display screen of the present invention Figure 6 Enlarged view at A;

[0034] Figure 8 It is a schematic structural diagram of a flexible Local dimming structure (omitting the optical adhesive layer and die bonding glue) of a curved display screen of the present invention in a compressed state;

[0035] Figure 9 It is a flexible Local dimming structure of a curved display screen of the present invention Figure 8 Enlarged view at B;

[0036] Figure 10 It is a schematic structural diagram of the connection structure between the light-emitting chip and the copper circuit of a flexible Local dimming structure of a curved display screen of the present invention;

[0037] Figure 11 It is a schematic structural diagram of the light-emitting chip and the copper circuit of a flexible Local dimming structure of a curved display screen of the present invention;

[0038] Figure 12 It is a schematic structural diagram of the heat sink of a flexible Local dimming structure of a curved display screen of the present invention;

[0039] Figure 13 It is a sectional view of a flexible Local dimming structure of a curved display screen of the present invention;

[0040] Figure 14 It is a sectional view of a flexible Local dimming structure of a curved display screen of the present invention in a compressed state.

[0041] In the figure: 1. Flexible substrate; 11. Bowl-shaped mounting groove; 12. Insulator; 2. Die bonding glue; 3. Perimeter; 31. Annular accommodating groove; 32. Air guide cavity; 33. Cavity; 34. Arc-shaped air duct; 35. Flexible flow guide member; 36. Elastic contact member; 4. Heat dissipation frame; 41. Heat conductor; 42. Through hole; 5. Light-emitting chip; 51. Conductive block; 52. Insulating positioning block; 6. Copper circuit; 61. Middle convex block; 62. Positioning port; 63. Auxiliary convex block; 7. Optical glue layer. Specific embodiments

[0042] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not intended to limit the present invention.

[0043] Embodiment: As Figure 1 , Figure 2 , Figure 6 and Figure 7 shown, a flexible Local dimming structure of a curved display screen according to the present invention includes a flexible substrate 1, and a plurality of bowl-shaped mounting grooves 11 arranged in a matrix are formed on the flexible substrate 1;

[0044] A light-emitting chip 5 mounted in the bowl-shaped mounting groove 11;

[0045] A copper circuit 6 disposed on the flexible substrate 1, and at least one positioning bracket for positioning the light-emitting chip 5 is provided on the copper circuit 6;

[0046] A heat dissipation member for dissipating heat from the light-emitting chip 5, and the heat dissipation member is embedded in the flexible substrate 1;

[0047] A perimeter 3 disposed outside the flexible substrate 1, the perimeter 3 is used to prevent glue from overflowing, an annular accommodating groove 31 for accommodating the overflowing glue is provided on the perimeter 3, the perimeter 3 is divided by the annular accommodating groove 31 into an inner side edge that fits with the flexible substrate 1 and an outer side edge that is parallel to the inner side edge and has the same height, an elastic contact member 36 with a C-shaped cross section is provided at the top of the outer side edge, and a flexible flow guide member 35 that is smoothly connected to the inner side edge is provided in the annular accommodating groove 31. By using these two interception lines of the inner side edge and the outer side edge, the probability of glue overflow can be effectively reduced.

[0048] The elastic contact member 36 is higher than the outer side and the inner side. Therefore, when the flexible Local dimming structure is attached to the curved display screen, the elastic contact member 36 is first deformed due to extrusion. The gas in the extrusion air cavity will flow into the cavity 33 through the air guide cavity 32, causing the flexible flow guide member 35 to tilt due to inflation to form an inclined plane with a flow guiding function. Then, the flexible Local dimming structure will be attached to the curved display screen due to the optical adhesive layer 7. After the optical adhesive layer 7 is extruded, the glue will flow outward and then flow along the flexible flow guide member 35 into the rectangular accommodating groove 31. The rectangular accommodating groove 31 is used to accommodate the overflowing glue, thereby effectively preventing the liquid optical glue from overflowing.

[0049] It should be noted that there are multiple arrays of the light-emitting chips 5. To make the drawings clear, the number of the light-emitting chips 5 in the drawings is the simplified number, and the actual number of the light-emitting chips 5 is several hundred or even thousands.

[0050] Among them, as Figure 7 and Figure 9 shown, a cavity 33 is provided in the flexible flow guide member 35, and an air guide cavity 32 with a U-shaped cross-sectional shape is provided in the surrounding edge 3. The air guide cavity 32 is connected to the cavity 33 through an arc-shaped air passage 34. The extrusion air cavity, the cavity 33 and the air guide cavity 32 are filled with gas.

[0051] Among them, as Figure 7 and Figure 9 shown, an extrusion air cavity with a C-shaped cross-sectional shape is provided on the elastic contact member 36. The extrusion air cavity is connected to the air guide cavity 32. After the elastic contact member 36 is extruded, the gas in the extrusion air cavity will flow from the air guide cavity 32 into the cavity 33, causing the flexible flow guide member 35 to tilt due to inflation to form an inclined plane with a flow guiding function. The inclined flexible flow guide member 35 can guide the overflowing liquid optical glue into the rectangular accommodating groove 31, effectively avoiding the situation of liquid optical glue overflowing.

[0052] Among them, as Figure 2 and Figure 12 shown, the heat dissipation member includes a heat dissipation frame 4 and a plurality of heat conduction bodies 41 arranged in a matrix. A heat dissipation strip is provided in the heat dissipation frame 4 in a side-by-side manner, and the heat conduction bodies 41 are distributed on the heat dissipation frame 4 and the heat dissipation strip. The provided heat dissipation frame 4 and heat dissipation strip are used to support the heat conduction bodies 41. Compared with setting the heat conduction bodies 41 alone, the heat dissipation area can be increased.

[0053] Among them, as Figure 2 and Figure 12 shown, the heat dissipation frame 4 and the heat dissipation strip are both provided on the back of the flexible substrate 1 and do not protrude from the flexible substrate 1. A plurality of through holes 42 are provided on both the heat dissipation frame 4 and the heat dissipation strip. The setting of the through holes 42 is beneficial to bending the flexible substrate 1.

[0054] Among them, as Figure 10 and Figure 11 shown, a conductive block 51 in contact with the copper circuit 6 is provided at the bottom of the light-emitting chip 5. Four insulating positioning blocks 52 distributed in a rectangle are provided outside the conductive block 51. The conductive block 51 can be fixed on the copper circuit 6 by soldering. The provided insulating positioning blocks 52 play a role in positioning the light-emitting chip 5.

[0055] Among them, as Figure 10 and Figure 11 shown, the positioning bracket includes two middle convex blocks 61 that are symmetrically distributed and fit with the conductive block 51. Two auxiliary convex blocks 63 that are symmetrically distributed and fit with the conductive block 51 are provided outside the middle convex blocks 61. A positioning opening 62 matching the insulating positioning block 52 is formed between the middle convex blocks 61 and the auxiliary convex blocks 63. The conductive block 51 can be restricted by the middle convex blocks 61 and the auxiliary convex blocks 63, and the insulating positioning block 52 can be restricted by the positioning opening 62, so as to realize the rapid positioning of the light-emitting chip 5 and reduce the probability of the position of the installed light-emitting chip 5 shifting.

[0056] Among them, as Figure 5 shown, an insulator 12 is further provided in the bowl-shaped mounting groove 11. A through hole through which the heat conductor 41 can pass is opened on the insulator 12. The insulator 12 is made of a heat-conducting elastic material, such as heat-conducting silica gel, which can effectively reduce the leakage current of adjacent copper circuits 6, thereby reducing energy consumption, and can also conduct the heat generated when the copper circuit 6 and the light-emitting chip 5 work to the heat dissipation member.

[0057] Among them, as Figure 6 , Figure 13 and Figure 14 shown, white oil layers formed by coating are provided on the front surface of the flexible substrate 1 and the inner wall of the bowl-shaped mounting groove 11. A die bonding glue 2 for protecting the light-emitting chip 5 is provided in the bowl-shaped mounting groove 11. An optical glue layer 7 is provided on the top of the die bonding glue 2; the white oil layer is coated on the front surface of the flexible substrate 1 and the inner wall of the bowl-shaped mounting groove 11 before installing the light-emitting chip 5. It is used in cooperation with the bowl-shaped mounting groove 11 and can reflect light. It belongs to the prior art, so it is not marked in the drawings; after connecting the copper circuit 6 and the light-emitting chip 5, the die bonding glue 2 is injected into the bowl-shaped mounting groove 11. After the die bonding glue 2 is cured, it plays a role in protecting the light-emitting chip 5, not only having good waterproof and moisture-proof effects, but also effectively avoiding the situation that the light-emitting chip 5 is damaged due to being squeezed.

[0058] Among them, as Figure 1 , Figure 6 and Figure 7As shown, the height of the inner side is higher than that of the flexible substrate 1. The inner side and the flexible substrate 1 cooperate to form a receiving groove for receiving the optical adhesive layer 7. The receiving groove is used to receive the optical adhesive layer 7. By intercepting the optical adhesive layer 7 with the inner side, the probability of liquid optical adhesive flowing onto the workbench during dispensing can be reduced.

[0059] During operation, when the flexible Local dimming structure is attached to the curved display screen, the elastic contact member 36 is first deformed due to extrusion. The gas in the extrusion air cavity will flow into the cavity 33 through the air guiding cavity 32, causing the flexible guiding member 35 to tilt due to inflation to form an inclined plane with a guiding function. Then, the flexible Local dimming structure will be attached to the curved display screen due to the optical adhesive layer 7. After the optical adhesive layer 7 is extruded, the glue will flow outward and then flow along the flexible guiding member 35 into the rectangular receiving groove 31. The rectangular receiving groove 31 is used to receive the overflowing glue, which can effectively prevent the liquid optical adhesive from overflowing outside the surrounding edge 3.

[0060] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A flexible local dimming structure for a curved display screen, characterized in that: include: A flexible substrate (1), wherein the flexible substrate (1) is provided with a plurality of bowl-shaped mounting grooves (11) arranged in a matrix; A light-emitting chip (5) installed in the bowl-shaped installation groove (11); A copper circuit (6) arranged on a flexible substrate (1), wherein at least one positioning bracket for positioning a light-emitting chip (5) is provided on the copper circuit (6); A conductive block (51) in contact with the copper circuit (6) is provided at the bottom of the light-emitting chip (5); A heat sink for dissipating heat from the light-emitting chip (5), the heat sink being embedded on the flexible substrate (1); A peripheral edge (3) is arranged outside the flexible substrate (1), the peripheral edge (3) is used to prevent glue from overflowing, the peripheral edge (3) is provided with a circular receiving groove (31) for receiving overflowing glue, the peripheral edge (3) is divided into an inner side edge that is in contact with the flexible substrate (1) and an outer side edge that is parallel to the inner side edge and has the same height as the inner side edge through the circular receiving groove (31), an elastic contact piece (36) with a C-shaped cross-section is provided at the top of the outer side edge, and a flexible flow guide piece (35) that is smoothly connected to the inner side edge is provided in the circular receiving groove (31).

2. The flexible local dimming structure of a curved display screen according to claim 1, characterized in that: The flexible flow guide (35) is provided with a cavity (33), and the surrounding edge (3) is provided with an air guide cavity (32) having a U-shaped cross-section, the air guide cavity (32) being connected to the cavity (33) via an arc-shaped air passage (34).

3. The flexible local dimming structure of a curved display screen according to claim 2, characterized in that: The elastic contact piece (36) is provided with an extrusion air cavity with a C-shaped cross-section, and the extrusion air cavity is connected to the air guide air cavity (32).

4. The flexible local dimming structure of a curved display screen according to claim 1, characterized in that: The heat sink comprises a heat sink frame (4) and a plurality of heat conductors (41) arranged in a matrix, the heat sink frame (4) is provided with heat sink strips arranged in a side-by-side manner, and the heat conductors (41) are distributed on the heat sink frame (4) and the heat sink strips.

5. The flexible local dimming structure of a curved display screen according to claim 4, characterized in that: The heat dissipation frame (4) and the heat dissipation strip are both arranged on the back side of the flexible substrate (1) and do not protrude from the flexible substrate (1); and a plurality of through holes (42) are provided on the heat dissipation frame (4) and the heat dissipation strip.

6. The flexible local dimming structure of a curved display screen according to claim 1, characterized in that: Four insulating positioning blocks (52) distributed in a rectangular shape are arranged outside the conductive block (51).

7. The flexible local dimming structure of a curved display screen according to claim 6, characterized in that: The positioning bracket comprises two middle protrusions (61) which are symmetrically distributed and fit with the conductive block (51); two auxiliary protrusions (63) which are symmetrically distributed and fit with the conductive block (51) are arranged outside the middle protrusion (61); and a positioning opening (62) which matches the insulating positioning block (52) is formed between the middle protrusion (61) and the auxiliary protrusion (63).

8. The flexible local dimming structure of a curved display screen according to claim 4, characterized in that: An insulator (12) is also provided in the bowl-shaped installation groove (11), and a through hole is provided on the insulator (12) through which the heat conductor (41) can pass.

9. The flexible local dimming structure of a curved display screen according to claim 1, characterized in that: The front surface of the flexible substrate (1) and the inner wall of the bowl-shaped mounting groove (11) are both provided with a white oil layer formed by coating, and a crystal-fixing glue (2) for protecting the light-emitting chip (5) is provided in the bowl-shaped mounting groove (11), and an optical glue layer (7) is provided on the top of the crystal-fixing glue (2).

10. The flexible local dimming structure of a curved display screen according to claim 1, characterized in that: The height of the inner side edge is higher than that of the flexible substrate (1), and the inner side edge cooperates with the flexible substrate (1) to form a receiving groove for receiving the optical adhesive layer (7).

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