Automatic control method and system for assembly line glue coating machine

Abstract

The present application relates to the field of gluing control and discloses an automatic control method and system for an assembly line gluing machine. The method includes: when a kitchen panel moves to a gluing position, controlling a gluing fixture to fix the kitchen panel, obtaining an image of the kitchen panel, and determining the gluing area of ​​the kitchen panel based on the image; applying glue according to the gluing area, obtaining an image of the glue liquid in the gluing area after gluing, determining a gluing length adjustment parameter, a gluing flow adjustment parameter, and a gluing height adjustment parameter based on the glue liquid image, and adjusting the parameters of the gluing head based on the gluing length adjustment parameter, the gluing flow adjustment parameter, and the gluing height adjustment parameter. When the glue liquid length value of the glue liquid profile is too large or too small, the gluing length is adjusted to an appropriate value using the gluing length adjustment parameter. The present application can accurately control the amount of glue applied and the gluing position on the kitchen panel.

Description

Technical Field

[0001] The present application relates to the technical field of gluing control, and more specifically, to an automatic control method and system for an assembly line gluing machine. Background Art

[0002] In modern kitchen equipment manufacturing, the connection between kitchenware panels (such as countertops and cabinet panels) and other kitchenware structures (such as brackets and back panels) is a critical step in ensuring product structural stability. Traditional kitchen equipment structures are typically connected through mechanical fasteners (such as screws and bolts) and welding. Although these common mechanical fasteners provide strong connection strength, they are also complex to install, unsightly, and prone to rust.

[0003] As an efficient and reliable connection method, connecting kitchen boards with glue has gradually become an important way to connect boards in kitchenware manufacturing. Gluing technology achieves bonding between the board and other structures by applying or dotting an appropriate amount of glue at the junction of the board and other structures. During the gluing operation, due to the generally large size of kitchen boards, the amount of glue applied on the kitchen panel is large, and kitchen boards often need to be glued in multiple locations. It is difficult to apply glue evenly to the kitchen board by manual gluing, resulting in poor gluing effect on the kitchen board. At the same time, the existing automatic gluing control method is difficult to meet the requirements of accurately controlling the amount and position of glue applied on the kitchen panel. Summary of the Invention

[0004] The purpose of this application is to provide an automatic control method and system for an assembly line gluing machine, which solves the technical problem of difficulty in accurately controlling the amount and position of glue applied on kitchenware panels, and achieves the technical effect of accurately controlling the amount and position of glue applied on kitchenware panels.

[0005] An embodiment of the present application provides an automatic control method for an assembly line gluing machine, the method comprising: when a kitchen plate moves to a gluing position, controlling a gluing fixture to fix the kitchen plate, obtaining a plate image of the kitchen plate, and determining a gluing area of ​​the kitchen plate based on the plate image; gluing according to the gluing area, and obtaining a glue liquid image of the gluing area after gluing, determining a glue length adjustment parameter, a glue flow adjustment parameter, and a glue height adjustment parameter based on the glue liquid image, and adjusting parameters of a gluing head based on the glue length adjustment parameter, the glue flow adjustment parameter, and the glue height adjustment parameter.

[0006] In one possible implementation, the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter are determined according to the glue image, including: determining the glue contour of the glue coating area, determining the glue length value of the glue contour, and determining the width sequence value of the glue in the length direction according to the glue contour; determining the maximum width value and the minimum width value of the width sequence value, and determining the width difference between the maximum width value and the minimum width value in the width sequence value as the width fluctuation value; when the glue length value is greater than or equal to the preset glue length value, determining the glue coating length adjustment parameter to reduce the preset glue coating length, and when the glue length value is less than the preset glue length value, determining the glue coating length adjustment parameter to increase the preset glue coating length; when the minimum width value is less than the preset width value, determining the glue flow adjustment parameter to increase the preset glue flow; when the width fluctuation value is greater than the preset width fluctuation value, determining the glue height adjustment parameter to reduce the preset glue height value.

[0007] In another possible implementation, the method also includes: obtaining a first glue contour within a first length range at the first end of the glue contour and a second glue contour within a second length range at the second end of the glue contour; determining a first area corresponding to the first glue contour, and determining a second area of ​​the second glue contour, and when the difference between the first area and the second area is greater than a preset area difference, prompting an adjustment to the stability of the glue coating flow rate.

[0008] In another possible implementation, the method also includes: obtaining the sequential glue pressure value of the gluing head during the gluing process, and when the difference between the first area and the second area is greater than the preset area difference, and the maximum pressure value of the sequential glue pressure value is greater than the preset maximum pressure value, prompting to replace the glue in the gluing head.

[0009] In another possible implementation, the method also includes: determining the glue pressure change variance value based on the time-series glue pressure value, and determining the glue width change variance value based on the width sequence value of the glue width; when the glue pressure change variance value is greater than the preset glue pressure change variance value, and the glue width change variance value is greater than the preset glue width change variance value, it is prompted to clean the glue outlet of the glue coating head.

[0010] In another possible implementation, the method further includes: determining a first boundary of the kitchen board to which the first end of the glue contour is close, and determining a first boundary distance from the first end of the glue contour to the first boundary; determining a second boundary of the kitchen board to which the second end of the glue contour is close, and determining a second boundary distance from the second end of the glue contour to the second boundary; when the first boundary distance or the second boundary distance is greater than or equal to a preset boundary distance, determining a glue coating length adjustment parameter to increase the preset glue coating length; when the first boundary distance or the second boundary distance is less than the preset boundary distance, determining a glue coating length adjustment parameter to reduce the preset glue coating length; when the difference between the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance difference, prompting to clean the glue outlet of the glue coating head.

[0011] In another possible implementation, a first glue contour in which the first end of the glue contour is within a first length range and a second glue contour in which the second end of the glue contour is within a second length range are obtained, including: the first end of the glue contour is an end close to the start dispensing position, the second end of the glue contour is an end close to the end dispensing position, the first length range is greater than the second length range, and the first glue contour in which the first end of the glue contour is within the first length range and the second glue contour in which the second end of the glue contour is within the second length range are obtained.

[0012] An embodiment of the present application further provides an automatic control system for an assembly line glue coating machine, comprising a unit for executing any of the methods described above.

[0013] An embodiment of the present application also provides an automatic control system for an assembly line glue coating machine, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method described in any one of the above items is implemented.

[0014] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method as described in any one of the above items is implemented.

[0015] An embodiment of the present application further provides a computer program product, including a computer program, which implements the steps of any of the above methods when executed by a processor.

[0016] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0017] The present application provides an automatic control method for an assembly line gluing machine. The method includes: when a kitchenware plate moves to a gluing position, controlling a gluing fixture to secure the kitchenware plate, obtaining an image of the kitchenware plate, and determining the gluing area of ​​the kitchenware plate based on the image; applying glue according to the gluing area, obtaining an image of the glue liquid in the gluing area after gluing, determining a gluing length adjustment parameter, a gluing flow adjustment parameter, and a gluing height adjustment parameter based on the glue liquid image, and adjusting parameters of a gluing head based on the gluing length adjustment parameter, the gluing flow adjustment parameter, and the gluing height adjustment parameter. The method in the present application can control the gluing parameters based on the gluing effect, thereby improving the effect of applying glue to a large amount of kitchenware plates and ensuring the production effect of the kitchenware plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0019] Figure 1 A schematic flow chart of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of a working scenario of an automatic control method for an assembly line gluing machine provided in an embodiment of the present application;

[0021] Figure 3 A schematic diagram of the glue-coated area of ​​a kitchenware plate in an embodiment of the present application;

[0022] Figure 4 A schematic diagram of the working process of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application;

[0023] Figure 5 This is a schematic diagram of the kitchenware board after gluing in the embodiment of the present application;

[0024] Figure 6 This is a schematic diagram of the glue profile obtained by applying glue in the embodiment of this application;

[0025] Figure 7 A schematic diagram of the logical structure of an automatic control system for an assembly line glue coating machine provided in an embodiment of the present application;

[0026] Figure 8 A schematic diagram of the physical structure of an automatic control system for an assembly line gluing machine provided in an embodiment of the present application. DETAILED DESCRIPTION

[0027] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0028] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0029] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0030] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0031] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0032] The existing automatic glue application control method is difficult to meet the requirements of accurately controlling the amount and position of glue applied on the kitchen panel.

[0033] Based on the above reasons, an embodiment of the present application provides an automatic control method for an assembly line gluing machine, the method comprising: when a kitchen plate moves to a gluing position, controlling a gluing fixture to fix the kitchen plate, obtaining an image of the kitchen plate, and determining the gluing area of ​​the kitchen plate based on the image; applying glue according to the gluing area, obtaining an image of the glue liquid in the gluing area after gluing, determining a gluing length adjustment parameter, a gluing flow adjustment parameter, and a gluing height adjustment parameter based on the glue liquid image, and adjusting the parameters of the gluing head based on the gluing length adjustment parameter, the gluing flow adjustment parameter, and the gluing height adjustment parameter. The method in the embodiment of the present application can control the gluing parameters according to the gluing effect, thereby improving the effect of applying a large amount of glue on the kitchen plate and ensuring the production effect of the kitchen plate.

[0034] In some scenarios, an automatic control method for an assembly line gluing machine according to an embodiment of the present application can be applied to the production of kitchenware, and can efficiently and stably connect kitchenware panels and the fixed structure of the kitchenware, thereby improving the connection effect and aesthetics of the kitchenware panels.

[0035] The following describes in detail an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application with reference to specific examples.

[0036] Figure 1 A flow chart of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application is shown as follows: Figure 1 As shown, the method includes S110 to S120, and S110 to S120 are described in detail below.

[0037] S110 , when the kitchen plate moves to the gluing position, controlling the gluing fixture to fix the kitchen plate, acquiring a plate image of the kitchen plate, and determining a gluing area of ​​the kitchen plate according to the plate image.

[0038] In the embodiment of the present application, when gluing the kitchen utensil plates, the kitchen utensil plates can be conveyed through a conveyor line, and the kitchen utensil plates can be sequentially glued on the conveyor line.

[0039] In the embodiment of the present application, when gluing kitchenware panels through a conveyor line, in order to ensure the gluing efficiency and gluing accuracy of the kitchenware panels, it is necessary to quickly adjust the gluing parameters through the method in the embodiment of the present application to ensure the gluing effect of the conveyor line on the kitchenware panels.

[0040] For example, the kitchen utensil plate may be a glass plate. When the method accurately performs the gluing process, it can ensure the efficiency of connecting and fixing the glass kitchen utensil plate and can ensure the aesthetics of the kitchen utensil plate after connection and fixation.

[0041] Figure 2A schematic diagram of a working scenario of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application is shown as follows: Figure 2 As shown, in the embodiment of the present application, when gluing the kitchen board 1, the kitchen board 1 can be moved to the gluing position by controlling the gluing clamp 11 to fix the kitchen board, and obtain the board image of the kitchen board 1, and determine the gluing area of ​​the kitchen board 1 according to the board image, and then glue can be applied on the kitchen board 1 by the gluing head 12.

[0042] When determining the gluing area, the gluing area of ​​the kitchenware board 1 can be determined based on the board image using an image recognition model.

[0043] Figure 3 Schematic diagram of the glue-coated area of ​​the kitchenware board in the embodiment of the present application, as shown in FIG. Figure 3 As shown, the glue-coated area on the kitchen utensil plate 1 may be two glue-coated areas 1 a.

[0044] Figure 4 A schematic diagram of the working process of an automatic control method for an assembly line glue coating machine provided in an embodiment of the present application is shown as follows: Figure 4 As shown, the kitchen board 1 can be positioned by the gluing fixture 11, and the board image of the kitchen board 1 can be detected by the image acquisition component 13 on the gluing head 12. The image acquisition component 13 can be electrically connected to the image recognition component, and the image recognition component is used to identify the gluing area 1a on the board image.

[0045] For example, the gluing head 12 can be driven by the transverse driving assembly 14 to move transversely and longitudinally, and thus gluing can be performed by the movement of the gluing head 12 .

[0046] For example, the gluing area 1a on the kitchen board 1 can be controlled and adjusted by programming a preset gluing program. The preset gluing program can accurately control the gluing area 1a of the kitchen board 1, and gluing can be achieved through the preset gluing program.

[0047] For example, a sensing area for detecting kitchen boards 1 can be set up on the conveyor line, and a photoelectric sensor for detecting kitchen boards is set up on the sensing area. When it is detected that the kitchen boards 1 enter the sensing area, the kitchen boards 1 can be clamped and positioned by the gluing clamps 11 set on both sides of the conveyor line, and then the kitchen boards 1 can be glued by the gluing equipment.

[0048] After the glue is applied to the kitchen board 1 , the glue applying clamps 11 on both sides of the conveyor line stop clamping and positioning the kitchen board 1 , and the kitchen board 1 can continue to be conveyed by the conveyor belt for subsequent processing.

[0049] S120. Apply glue according to the glue application area, and obtain a glue liquid image of the glue application area after gluing, determine the glue application length adjustment parameter, glue application flow adjustment parameter and glue application height adjustment parameter according to the glue liquid image, and adjust the parameters of the glue application head according to the glue application length adjustment parameter, glue application flow adjustment parameter and glue application height adjustment parameter.

[0050] After determining the glue coating area, glue can be applied according to the glue coating area, and a glue liquid image of the glue coating area after gluing can be obtained. The glue liquid image can also be collected by the image acquisition component 13, and then the glue coating quality can be detected based on the glue liquid image, thereby improving the glue coating effect of the glue liquid.

[0051] After obtaining the glue liquid image, the glue coating length adjustment parameter, glue coating flow adjustment parameter and glue coating height adjustment parameter can be determined according to the glue liquid image. The glue coating length adjustment parameter is used to adjust the glue coating length of the glue coating head, the glue coating flow adjustment parameter is used to adjust the flow of the glue liquid of the glue coating head, and the glue coating height adjustment parameter is used to adjust the height of the glue coating head when coating glue. The parameters of the glue coating head are adjusted according to the glue coating length adjustment parameter, the glue coating flow adjustment parameter and the glue coating height adjustment parameter to achieve the influence on the glue coating parameters.

[0052] Figure 5 This is a schematic diagram of the kitchenware board after gluing in the embodiment of the present application. Figure 5 As shown, after the kitchenware board 1 is glued, two glue strips are formed in the two glued areas 1a.

[0053] The beneficial effect of the above-mentioned implementation method is that by obtaining the glue liquid image of the glue coating area after gluing, the glue coating length adjustment parameters, glue coating flow adjustment parameters and glue coating height adjustment parameters are determined according to the glue liquid image, and the parameters of the glue coating head are adjusted according to the glue coating length adjustment parameters, glue coating flow adjustment parameters and glue coating height adjustment parameters, thereby improving the control effect of gluing kitchenware boards on the production line, and greatly improving the gluing accuracy and production aesthetics of kitchenware boards.

[0054] The beneficial effect of the above implementation method is that by obtaining the glue liquid image of the glued area in real time after the glue is applied, the glue control effect on the kitchenware board can be quickly improved, thereby improving the glue application effect on the kitchenware board.

[0055] In some implementations, in the above S120, the glue length adjustment parameter, the glue flow adjustment parameter and the glue height adjustment parameter are determined according to the glue liquid image, including S121 to S122, and S121 to S122 are described in detail below.

[0056] S121: Determine a glue contour of the glue-coated area, determine a glue length value of the glue contour, and determine a width sequence of the glue in the length direction based on the glue contour. Determine a maximum width value and a minimum width value of the width sequence, and determine the width difference between the maximum width value and the minimum width value in the width sequence as a width fluctuation value.

[0057] When adjusting the gluing parameters, the glue contour of the gluing area may be determined first. The glue contour is the shape of the glue formed by the gluing. Then, the gluing parameters may be adjusted according to the glue contour.

[0058] After determining the glue profile, the glue length value of the glue profile can be determined. The glue length value reflects the length control characteristics of the glue coating head during glue coating.

[0059] After determining the glue liquid profile, the width sequence value of the glue liquid in the length direction can be determined according to the glue liquid profile. The width sequence value characterizes the width change characteristics of the glue liquid in the length direction of the glue liquid profile. The width sequence value reflects the flow control characteristics of the glue liquid amount by the glue coating head during gluing.

[0060] After determining the glue profile, the maximum width value and the minimum width value of the width sequence values ​​may be further determined, and the width difference between the maximum width value and the minimum width value in the width sequence values ​​may be determined as the width fluctuation value.

[0061] Figure 6 Schematic diagram of the glue liquid profile obtained by applying glue in the embodiment of this application, as shown in FIG. Figure 6 As shown, the length of the glue profile may be L, and the width sequence value may be a sequence consisting of widths d at different positions along the length direction.

[0062] S122. When the glue length value is greater than or equal to a preset glue length value, the glue length adjustment parameter is determined to decrease the preset glue length. When the glue length value is less than the preset glue length value, the glue length adjustment parameter is determined to increase the preset glue length. When the minimum width value is less than the preset width value, the glue flow rate adjustment parameter is determined to increase the preset glue flow rate. When the width fluctuation value is greater than the preset width fluctuation value, the glue height adjustment parameter is determined to decrease the preset glue height value.

[0063] When adjusting the glue coating parameters, when the glue liquid length value is greater than or equal to the preset glue liquid length value, it means that the glue coating length of the glue coating head is too long. In order to adjust the glue coating length to an appropriate value, the glue coating length adjustment parameter can be determined to reduce the preset glue coating length to appropriately reduce the glue coating length; when the glue liquid length value is less than the preset glue liquid length value, the glue coating length adjustment parameter can be determined to increase the preset glue coating length to appropriately increase the glue coating length;

[0064] Exemplarily, the preset glue coating length may be 1 mm, 3 mm or 5 mm.

[0065] When adjusting the gluing parameters, when the minimum width value is less than the preset width value, it means that the gluing effect at the narrowest part of the glue liquid profile obtained under the current gluing parameters is poor. At this time, the gluing flow rate can be appropriately increased to ensure that the narrowest part of the glue liquid profile meets the quality requirements, and then the gluing flow rate adjustment parameter can be determined to increase the gluing flow rate by the preset gluing flow rate.

[0066] For example, when the gluing head is applying glue, the gluing flow rate may be a constant value, and the preset gluing flow rate may be 1% to 5% of the current gluing flow rate.

[0067] When adjusting the gluing parameters, when the width fluctuation value is greater than the preset width fluctuation value, it means that the width fluctuation amplitude of the glue profile under the current glue flow rate is large. At this time, it means that the height from the glue head to the kitchen board is too large, resulting in the glue falling distance being too long, resulting in the glue profile width fluctuation amplitude being too large. At this time, in order to reduce the width fluctuation amplitude of the glue profile, the glue height adjustment parameter can be determined to reduce the preset glue height value for the glue height to improve the stability of the glue profile width.

[0068] For example, a laser distance sensor for detecting the distance between the gluing head and the kitchen board may be provided on the gluing head, so as to enable feedback adjustment of the distance between the gluing head and the kitchen board.

[0069] The beneficial effect of the above implementation is that when the glue length value of the glue profile is too large or too small, the glue length can be adjusted to a suitable value by adjusting the glue length parameter, thereby ensuring the accuracy of the glue length.

[0070] The beneficial effect of the above implementation is that when the gluing effect at the narrowest part of the glue liquid profile obtained by gluing under the current gluing parameters is poor, the width of the glue liquid can be ensured to meet the requirements by increasing the gluing flow rate.

[0071] The beneficial effect of the above-mentioned implementation method is that when the height from the gluing head to the kitchenware board is too large, resulting in the glue falling distance being too long and the width fluctuation of the glue profile being too large, the stability of the width of the glue profile can be improved by reducing the gluing height by the preset gluing height value.

[0072] In some implementations, the above method further includes S210 to S220, and S210 to S220 are described in detail below.

[0073] S210 , obtaining a first glue contour with a first end within a first length range and a second glue contour with a second end within a second length range.

[0074] like Figure 6 As shown, in order to further evaluate the glue coating quality, a first glue profile within a first length range of the first end A of the glue profile and a second glue profile within a second length range of the second end B of the glue profile can be obtained, and then the glue coating quality can be detected based on the first glue profile and the second glue profile.

[0075] For example, Figure 6 As shown, the length of the first length range may be L1, the length of the second length range may be L2, and the first glue profile and the second glue profile are Figure 6 The shaded area in .

[0076] S220, determining a first area corresponding to the first glue contour, and determining a second area corresponding to the second glue contour, and when a difference between the first area and the second area is greater than a preset area difference, prompting to increase the stability of the glue flow rate.

[0077] After obtaining the first glue contour and the second glue contour, the first area corresponding to the first glue contour and the second area of ​​the second glue contour can be determined. The first area and the second area can characterize the gluing effect at both ends of the glue during gluing.

[0078] Exemplarily, when determining the first area and the second area, the area of ​​the contour may be calculated using a function for calculating the contour area provided by an image processing library.

[0079] After obtaining the first area and the second area, when the difference between the first area and the second area is greater than the preset area difference, it means that the difference in the amount of glue applied between the two ends of the glue is too large, which may cause the connection stability of the glue to the kitchenware board and the external structure to be insufficient, and then it can be suggested to increase the stability of the glue flow to improve the connection stability of the glue.

[0080] The beneficial effect of the above-mentioned implementation method is that by obtaining a first glue contour within a first length range at the first end of the glue contour and a second glue contour within a second length range at the second end of the glue contour, and determining whether the glue coating stability needs to be adjusted based on the areas of the first glue contour and the second glue contour, the stability of the glue coating process is improved.

[0081] In some implementations, the above method also includes: obtaining the sequential glue pressure value of the gluing head during the gluing process, and when the difference between the first area and the second area is greater than the preset area difference, and the maximum pressure value of the sequential glue pressure value is greater than the preset maximum pressure value, prompting to replace the glue in the gluing head.

[0082] When conducting glue coating quality inspection, in order to further accurately detect the glue coating quality, the sequential glue liquid pressure value of the glue coating head during the glue coating process can be obtained. The sequential glue liquid pressure value is the glue liquid pressure of the glue coating process in sequence. The glue liquid pressure value can be obtained by detecting the pressure sensor set on the glue liquid delivery pipe.

[0083] When testing the gluing effect, if the difference between the first area and the second area is greater than a preset area difference, it indicates that the gluing stability at both ends of the glue is poor, possibly due to excessive glue viscosity, resulting in unstable gluing. Furthermore, if the maximum pressure value of the sequential glue pressure values ​​is greater than a preset maximum pressure value, it indicates that the glue viscosity is too high, resulting in an excessively high maximum pressure value in the sequential glue pressure values. This can prompt the glue in the gluing head to be replaced to improve the stability of the gluing process.

[0084] Exemplarily, the preset maximum pressure value may be 110% to 120% of the standard pressure value.

[0085] The beneficial effect of the above implementation method is that when the viscosity of the glue is too high, resulting in poor glue coating stability at both ends of the glue during coating, and the maximum pressure value in the sequential glue pressure value is too large, it can prompt to replace the glue in the glue coating head to improve the stability of the glue coating process.

[0086] In some implementations, the above method also includes: determining the glue pressure change variance value based on the time-series glue pressure value, and determining the glue width change variance value based on the width sequence value of the glue width. When the glue pressure change variance value is greater than the preset glue pressure change variance value, and the glue width change variance value is greater than the preset glue width change variance value, it is prompted to clean the glue outlet of the glue coating head.

[0087] When conducting glue coating detection, in order to further improve the glue coating detection effect, the glue liquid pressure change variance value can be determined based on the time-series glue liquid pressure value. The glue liquid pressure change variance value characterizes the fluctuation of the glue liquid pressure during the glue coating process, and then it can be determined whether the glue coating process needs to be regulated based on the fluctuation of the glue liquid pressure.

[0088] After obtaining the fluctuation of the glue liquid pressure during the gluing process, the glue liquid width variation variance value can also be determined based on the width sequence value of the glue liquid width. The glue liquid width variation variance value characterizes the fluctuation of the glue liquid width, and then the stability of the gluing state can be detected by the fluctuation of the glue liquid width.

[0089] When performing glue coating status detection, when the glue liquid pressure change variance value is greater than the preset glue liquid pressure change variance value, and the glue liquid width change variance value is greater than the preset glue liquid width change variance value, it means that the glue coating pressure fluctuation amplitude is too large as detected from the fluctuation of the glue liquid pressure, and the glue coating width fluctuation amplitude is too large as detected from the perspective of the glue coating width. Based on this, it can be judged that the stability of the gluing process is insufficient, indicating that the stability of the gluing head may be insufficient, resulting in poor gluing effect, and then it can be prompted to clean the glue outlet of the gluing head to improve the stability of the gluing effect.

[0090] The beneficial effect of the above-mentioned implementation method is that it can detect whether the fluctuation amplitude of the gluing pressure is too large from the fluctuation of the glue liquid pressure, and detect whether the fluctuation amplitude of the gluing width is too large from the perspective of the gluing width, and then judge whether the stability of the gluing process meets the requirements, and then judge whether the glue outlet of the gluing head causes unstable glue discharge, which can improve the detection effect of the stability of the gluing process.

[0091] In some implementations, the above method further includes S310 to S320, and S310 to S320 are described in detail below.

[0092] S310: Determine a first boundary of the kitchen board to which the first end of the glue contour is close, and determine a first boundary distance from the first end of the glue contour to the first boundary; determine a second boundary of the kitchen board to which the second end of the glue contour is close, and determine a second boundary distance from the second end of the glue contour to the second boundary.

[0093] In order to detect the quality of glue coating, Figure 6 As shown, the first boundary of the kitchen board to which the first end of the glue contour is close can be determined through image recognition, and a first boundary distance By1 from the first end of the glue contour to the first boundary can be determined. The first boundary distance represents the length from the glue contour to the boundary of the kitchen board, and the gluing position of the first end of the glue contour can be judged based on the first boundary distance.

[0094] In order to detect the quality of glue coating, Figure 6 As shown, the second boundary of the kitchen board to which the second end of the glue contour is close through image recognition can be determined, and a second boundary distance By2 from the second end of the glue contour to the second boundary can be determined. The second boundary distance represents the length from the glue contour to the boundary of the kitchen board, and the gluing position of the second end of the glue contour can be judged based on the second boundary distance.

[0095] S320: When the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance, determine the gluing length adjustment parameter to increase the preset gluing length. When the first boundary distance or the second boundary distance is less than the preset boundary distance, determine the gluing length adjustment parameter to decrease the preset gluing length. When the difference between the first boundary distance and the second boundary distance is greater than or equal to the preset boundary distance difference, prompt the gluing outlet of the gluing head to be cleaned.

[0096] In an embodiment of the present application, when the lengths of the glue contour to the first boundary or the second boundary of the kitchen board are the same, after obtaining the first boundary distance and the second boundary distance, when the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance, it indicates that the first boundary distance or the second boundary distance may be too large due to the fact that the glue coating length is too short. At this time, the glue coating length adjustment parameter can be determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0097] In an embodiment of the present application, when the first boundary distance or the second boundary distance is smaller than the preset boundary distance, it may indicate that the first boundary distance or the second boundary distance is too small due to the excessive length of the glue coating. At this time, the glue coating length adjustment parameter can be determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0098] In an embodiment of the present application, when the difference between the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance difference, it means that the difference in the distance from the glue coating contour to the boundaries at both ends of the kitchen board is too large, which may be due to a malfunction in the glue discharging process of the glue coating head, resulting in poor glue coating quality. At this time, it can be prompted to clean the glue outlet of the glue coating head.

[0099] The beneficial effect of the above-mentioned implementation method is that when the lengths from the glue contour to the first boundary or the second boundary of the kitchen board are the same, if the distance to the first boundary or the distance to the second boundary is too large due to the glue coating length being too small, the glue coating length adjustment parameter is determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0100] The beneficial effect of the above-mentioned implementation method is that when the lengths from the glue contour to the first boundary or the second boundary of the kitchen board are the same, the glue coating length is too large, resulting in the first boundary distance or the second boundary distance being too small. The glue coating length adjustment parameter is determined to increase the preset glue coating length to ensure that the glue coating length meets the requirements.

[0101] The beneficial effect of the above-mentioned implementation method is that when the lengths of the glue contour to the first boundary or the second boundary of the kitchen board are the same, the difference in the distance from the glue contour to the boundaries at both ends of the kitchen board is too large, which may be due to a malfunction in the glue discharge process of the glue coating head, resulting in excessive deviation in the glue coating position, prompting the glue outlet of the glue coating head to be cleaned to ensure that the glue coating position meets the requirements.

[0102] In some implementations, in the above-mentioned S210, a first glue contour with the first end of the glue contour within the first length range and a second glue contour with the second end of the glue contour within the second length range are obtained, including: the first end of the glue contour is an end close to the start dispensing position, the second end of the glue contour is an end close to the end dispensing position, the first length range is greater than the second length range, and the first glue contour with the first end of the glue contour within the first length range and the second glue contour with the second end of the glue contour within the second length range are obtained.

[0103] In order to ensure the detection effect of the glue coating quality, the first end of the glue contour can be determined as the end close to the starting position of glue coating, and the second end of the glue contour can be determined as the end close to the ending position of glue coating. Since the glue at the starting point of glue dispensing has glue falling time, it is necessary to ensure the glue coating effect close to the starting point of glue coating when performing glue coating quality detection. The first length range can be set to be larger than the second length range to ensure the glue coating effect at the starting point of glue coating.

[0104] When performing glue coating quality inspection, a first glue liquid contour within a first length range can be obtained at the first end of the glue liquid contour, and a second glue liquid contour within a second length range can be obtained at the second end of the glue liquid contour. Subsequently, the glue coating quality can be inspected based on the first glue liquid contour and the second glue liquid contour using the above-mentioned method, thereby realizing glue coating quality inspection of a larger glue coating range close to the start of glue coating, thereby ensuring the inspection effect of glue coating quality.

[0105] Exemplarily, the first length range is a glue profile within 0-80 mm.

[0106] Exemplarily, the second length range is a glue profile within 0-50 mm.

[0107] The beneficial effect of the above implementation method is that in order to ensure the gluing effect near the starting point of gluing during gluing quality inspection, the first length range is set to be larger than the second length range, which can ensure the gluing effect at the starting point of gluing.

[0108] An embodiment of the present application further provides an automatic control system for an assembly line glue coating machine, comprising a unit for executing any of the methods described above.

[0109] Figure 7 A schematic diagram of the logical structure of an automatic control system for an assembly line glue coating machine provided in one embodiment of the present application is shown as follows: Figure 7As shown, the system 2 of this embodiment includes a processing unit 21, a storage unit 22, and a transceiver unit 23. The processing unit 21 is used to process data, the storage unit 22 is used to store data, and the transceiver unit 23 is used to send and receive data. The processing unit 21, the storage unit 22, and the transceiver unit 23 cooperate with each other to implement the above method. The beneficial effects of the embodiment of the present application have been described in the above method and will not be repeated here.

[0110] An embodiment of the present application also provides an automatic control system for an assembly line glue coating machine, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the method described in any one of the above items is implemented.

[0111] Figure 8 A schematic diagram of the physical structure of an automatic control system for an assembly line glue coating machine provided in one embodiment of the present application is shown as follows: Figure 8 As shown, the system 3 of this embodiment includes: at least one processor 30 ( Figure 8 Only one processor 30 is shown in the figure), a memory 31, and a computer program 32 stored in the memory 31 and executable on the at least one processor 30. When the processor 30 executes the computer program 32, the steps of any of the above-mentioned method embodiments are implemented. The beneficial effects of the embodiments of the present application have been described in the above-mentioned methods and will not be repeated here.

[0112] It should be noted that the information interaction, execution process, etc. between the above-mentioned systems / units are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment section and will not be repeated here.

[0113] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned system can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0114] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the above-mentioned various method embodiments can be implemented.

[0115] An embodiment of the present application provides a computer program product. When the computer program product is run on a mobile terminal, the mobile terminal can implement the steps in the above-mentioned various method embodiments when executing the computer program product.

[0116] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process of the above-mentioned method embodiment by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When the computer program is executed by a processor, it can implement the steps of each of the above-mentioned method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file, or some intermediate form. The computer-readable medium can at least include: any entity or device capable of carrying computer program code to the camera / terminal device, recording medium, computer memory, read-only memory (ROM), random access memory (RAM), electric carrier signal, telecommunication signal, and software distribution medium. For example, a USB flash drive, mobile hard drive, magnetic disk, or optical disk. In some jurisdictions, according to legislation and patent practice, computer-readable media cannot be electric carrier signals or telecommunication signals.

[0117] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0118] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0119] In the embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of the modules or units is merely a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0120] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0121] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. An automatic control method for a production line glue coating machine, characterized in that: The method comprises: When the kitchen plate moves to the gluing position, the gluing fixture is controlled to fix the kitchen plate, and an image of the kitchen plate is obtained, and the gluing area of ​​the kitchen plate is determined according to the image of the plate; Apply glue according to the glue application area, and obtain a glue liquid image of the glue application area after glue application, determine a glue application length adjustment parameter, a glue application flow adjustment parameter, and a glue application height adjustment parameter according to the glue liquid image, and adjust the parameters of the glue application head according to the glue application length adjustment parameter, the glue application flow adjustment parameter, and the glue application height adjustment parameter; Determine the glue length adjustment parameters, glue flow adjustment parameters and glue height adjustment parameters according to the glue liquid image, including: Determine the glue contour of the glue coating area, determine the glue length value of the glue contour, and determine the width sequence value of the glue in the length direction according to the glue contour; determine the maximum width value and the minimum width value of the width sequence value, and determine the width difference between the maximum width value and the minimum width value in the width sequence value as the width fluctuation value; When the glue liquid length value is greater than or equal to the preset glue liquid length value, the glue coating length adjustment parameter is determined to reduce the preset glue coating length; when the glue liquid length value is less than the preset glue liquid length value, the glue coating length adjustment parameter is determined to increase the preset glue coating length; when the minimum width value is less than the preset width value, the glue coating flow adjustment parameter is determined to increase the preset glue coating flow; when the width fluctuation value is greater than the preset width fluctuation value, the glue coating height adjustment parameter is determined to reduce the preset glue coating height value.

2. The method according to claim 1, wherein The method further comprises: Acquire a first glue contour within a first length range at a first end of the glue contour and a second glue contour within a second length range at a second end of the glue contour; Determine a first area corresponding to the first glue contour, and determine a second area corresponding to the second glue contour. When the difference between the first area and the second area is greater than a preset area difference, it is prompted to adjust the stability of the glue flow rate.

3. The method according to claim 2, wherein The method further comprises: Obtain the sequential glue pressure value of the glue coating head during the gluing process. When the difference between the first area and the second area is greater than the preset area difference, and the maximum pressure value of the sequential glue pressure value is greater than the preset maximum pressure value, it is prompted to replace the glue in the glue coating head.

4. The method according to claim 3, wherein The method further comprises: The glue pressure change variance value is determined according to the time series glue pressure value, and the glue width change variance value is determined according to the width sequence value of the glue width. When the glue pressure change variance value is greater than the preset glue pressure change variance value, and the glue width change variance value is greater than the preset glue width change variance value, it is prompted to clean the glue outlet of the glue coating head.

5. The method according to claim 4, wherein The method further comprises: Determining a first boundary of the kitchen board to which a first end of the glue contour is close, and determining a first boundary distance from the first end of the glue contour to the first boundary; determining a second boundary of the kitchen board to which a second end of the glue contour is close, and determining a second boundary distance from the second end of the glue contour to the second boundary; When the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance, the glue coating length adjustment parameter is determined to increase the preset glue coating length; when the first boundary distance or the second boundary distance is less than the preset boundary distance, the glue coating length adjustment parameter is determined to reduce the preset glue coating length; when the difference between the first boundary distance or the second boundary distance is greater than or equal to the preset boundary distance difference, it is prompted to clean the glue outlet of the glue coating head.

6. An automatic control system for a production line glue coating machine, characterized in that: Comprising means for performing the method according to any one of claims 1 to 5.

7. An automatic control system for an assembly line glue coating machine, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the method according to any one of claims 1 to 5 is implemented.

8. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 5 is implemented.

9. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 5 are implemented.

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