Solder paste dispensing valve

Abstract

The invention discloses a solder paste dispensing valve which comprises a glue storage barrel, a dispensing assembly and a glue solution recycling assembly. The glue solution recovery assembly comprises a waste liquid box, a pipeline for communicating the waste liquid box with the nozzle, and a negative pressure generation device communicated with the waste liquid box, and the negative pressure generation device is electrically connected with a control unit for controlling the pressure of the negative pressure generation device. According to the glue dispensing device, residual glue liquid on the edge of the nozzle needs to be cleaned after glue dispensing is completed, glue dripping is avoided, and the redundant glue liquid can be well sucked through the adsorption effect of the pipeline.

Description

Technical Field

[0001] The invention relates to the technical field of glue dispensing, and in particular to a solder paste glue dispensing valve. Background Art

[0002] A Chinese patent with application number 202110802109.7 records a glue dispensing machine, comprising a shell, a glue inlet valve group and a glue outlet valve, a glue storage chamber being arranged inside the shell, the glue inlet valve group and the glue outlet valve being respectively arranged on the side walls of the shell, the glue outlet of the glue inlet valve group and the glue inlet of the glue outlet valve being respectively connected to the glue storage chamber; a glue dispensing machine provided by the present invention comprises a glue outlet valve, wherein the glue outlet valve stem and a control chamber are arranged to form a glue back suction structure inside the glue outlet valve, and the glue outlet valve stem moves up and down to change the volume of the inner cavity of the glue outlet valve to form a negative pressure, thereby effectively sucking the residual glue inside the glue dispensing tube back into the glue outlet valve at the moment when the glue dispensing machine stops dispensing, thereby effectively avoiding the occurrence of glue dripping or wire drawing.

[0003] The manual states as follows: before the dispensing valve piston 302 drives the dispensing valve stem 303 to move downward, the glue inlet valve assembly 2 has stopped injecting glue, and the driving motor 4 also stops injecting the glue in the glue storage chamber 101 into the glue inlet chamber 3013.

[0004] However, the negative pressure required for dispensing is a relatively precise number. Too large or too small a number will affect the dispensing process.

[0005] Therefore, it is necessary to provide a new technical solution to overcome the above-mentioned defects. Summary of the invention

[0006] The object of the present invention is to provide a solder paste dispensing valve which can effectively solve the above-mentioned technical problems.

[0007] In order to achieve the purpose of the present invention, the following technical scheme is adopted:

[0008] A solder paste dispensing valve, comprising: a glue storage cylinder, a dispensing component and a glue recovery component;

[0009] The glue liquid recovery component includes a waste liquid tank, a pipe connecting the waste liquid tank and the nozzle, and a negative pressure generating device connected to the waste liquid tank. The negative pressure generating device is electrically connected to a control unit for controlling its pressure.

[0010] Further: the pressure control unit includes: a controller, a first information acquisition unit for acquiring first information of the pipeline; a second information acquisition unit for acquiring second information of the pipeline; the controller sends an instruction to the negative pressure generating device based on the comparison of the first information, the second information and the preset information.

[0011] Further: the first information is flow information, the second information is pressure information, and the preset information is preset flow and preset pressure;

[0012] The controller declutters the acquired flow information and pressure information, and generates adjustment information based on the decluttered data. The controller declutters the adjustment information again based on the negative pressure generating device, generates instructions, and sends them to the negative pressure generating device.

[0013] Further: The specific steps of the controller generating instructions are:

[0014] Step S1: filtering the collected flow information and pressure information;

[0015] Step S2: Definition: u(t) is the adjustment information; Ea is the flow gain; Ed is the flow integral; Ei is the flow differential; Fm is the pressure gain; Fd is the pressure integral; Fc is the pressure differential; Ga is the preset flow; Gb is the actual flow; Ha is the preset pressure; Hb is the actual pressure;

[0016] Then: e(t)=Ga-Gb;

[0017] b(t) = Ha-Hb;

[0018] Substituting e(t) and b(t) into the equation, we obtain:

[0019] u(t)={Ea*e(t)+Ed*∫e(t)dt+Ei*de(t) / dt}+{Fm*b(t)+Fd*∫b(t)dt+Fc*db(t) / dt};

[0020] Step S3: Filter the adjustment information and generate instructions.

[0021] Further: In step S2, the method for obtaining Ea, Ed, Ei, Fm, Fd, and Fc is:

[0022] Perform auto-tuning on Ea, Ed, Ei, Fm, Fd, and Fc.

[0023] Further: the dispensing component includes:

[0024] A motor, a push rod mounted on the motor shaft, and a nozzle.

[0025] Compared with the prior art, the present invention has the following beneficial effects: after the solder paste dispensing valve of the present invention has finished dispensing, it is necessary to clean the residual glue on the edge of the nozzle to avoid glue dripping, and the excess glue can be well absorbed through the adsorption effect of the pipeline. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0027] Figure 1 Schematic diagram of the solder paste dispensing valve of the present invention.

[0028] Figure 2 It is a schematic diagram of the pipeline and nozzle of the solder paste dispensing valve of the present invention.

[0029] Figure 3 for Figure 2 Enlarged schematic diagram of part A.

[0030] In the figure: 1. Glue storage cylinder; 2. Waste liquid tank; 3. Pipeline; 4. Nozzle. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are partial embodiments of the present invention, rather than all embodiments.

[0032] In the description of the present invention, it should be understood that the terms "center", "lateral", "longitudinal", "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present invention. When a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a centered component. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centered component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centered component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0033] like Figures 1 to 3 As shown, the solder paste dispensing valve of the present invention comprises: a glue storage cylinder 1, a dispensing assembly and a glue recovery assembly. The dispensing assembly comprises: a motor, a push rod mounted on the motor shaft and a nozzle 3. The motor and push rod of the present application are prior art, and the nozzle 3 is at the end of the push rod.

[0034] The glue liquid recovery assembly includes a waste liquid tank 2, a pipe 4 connecting the waste liquid tank 2 and the nozzle 3, and a negative pressure generating device connected to the waste liquid tank 2, and the negative pressure generating device is electrically connected to a control unit for controlling its pressure.

[0035] It needs to be explained in detail here that the pipe 4 is at the edge of the nozzle 3, and the nozzle dispenses glue intermittently. After each dispensing, the residual glue on the edge of the nozzle 3 needs to be cleaned to avoid glue dripping. The adsorption effect of the pipe 4 can well absorb the excess glue.

[0036] However, pressure is an important value when absorbing excess glue. If the pressure is too high, it will affect the glue just applied, so the pressure needs to be controlled.

[0037] The pressure control unit includes: a controller, a first information acquisition unit for acquiring first information of the pipeline; a second information acquisition unit for acquiring second information of the pipeline 4; the controller sends an instruction to the negative pressure generating device according to the comparison between the first information, the second information and the preset information.

[0038] The first information is flow information, the second information is pressure information, and the preset information is preset flow and preset pressure; the controller declutters the acquired flow information and pressure information, and generates adjustment information based on the decluttered data, and the controller declutters the adjustment information for a second time based on the negative pressure generating device, generates instructions, and sends them to the negative pressure generating device.

[0039] The specific steps of the controller generating instructions are:

[0040] Step S1: filtering the collected flow information and pressure information;

[0041] Step S2: Definition: u(t) is the adjustment information; Ea is the flow gain; Ed is the flow integral; Ei is the flow differential; Fm is the pressure gain; Fd is the pressure integral; Fc is the pressure differential; Ga is the preset flow; Gb is the actual flow; Ha is the preset pressure; Hb is the actual pressure;

[0042] Then: e(t)=Ga-Gb;

[0043] b(t) = Ha-Hb;

[0044] According to the feedback adjustment algorithm, e(t) and b(t) are substituted to obtain:

[0045] u(t)={Ea*e(t)+Ed*∫e(t)dt+Ei*de(t) / dt}+{Fm*b(t)+Fd*∫b(t)dt+Fc*db(t) / dt};

[0046] Step S3: Filter the adjustment information and generate instructions.

[0047] In step S2, the method for obtaining Ea, Ed, Ei, Fm, Fd, and Fc is:

[0048] Self-tuning of Ea, Ed, Ei, Fm, Fd, and Fc. The specific operation method is as follows: Step 1: Establish a historical database; Step 2: Simulate the data according to the historical database and generate a calculation formula; The specific method of Step 2 is as follows: First, input u(t), Ga, Gb, Ha, and Hb to make the system in a preliminary stable state, that is, pre-adjustment; Then set the time interval T, and within T, increase a certain parameter, such as Hb, to make the system in an unstable state, and then self-adjust Ea, Ed, Ei, Fm, Fd, and Fc. When the system is stable, the adjustment process can be regarded as completed, and the stability of the system can be determined through the waveform diagram.

[0049] As a further improvement of the present invention: a flow channel is provided on the waste liquid tank 2, and the flow channel is detachably connected to the glue storage cylinder 1 to achieve positioning of the waste liquid tank 2 when it is disassembled; a window is provided on the waste liquid tank 2 to facilitate the user to observe whether the waste liquid tank 2 is overflowing.

[0050] Finally, it should be noted that the outside of the pipeline 4 is connected to a hose, to which a flow meter, a pressure sensor and a negative pressure generating device are connected. The flow meter, the pressure sensor and the negative pressure generating device all adopt existing mature designs and will not be described here; the end of the hose is connected to the waste liquid tank 2, that is, under the action of the negative pressure generating device, excess glue enters from the pipeline 4 into the hose and into the waste liquid tank 2.

[0051] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. A solder paste dispensing valve, characterized in that: include: Glue storage cylinder, glue dispensing components and glue recovery components; The glue liquid recovery component includes a waste liquid tank, a pipe connecting the waste liquid tank and the nozzle, and a negative pressure generating device connected to the waste liquid tank. The negative pressure generating device is electrically connected to a control unit for controlling its pressure.

2. The solder paste dispensing valve according to claim 1, characterized in that: The pressure control unit includes: a controller, a first information acquisition unit for acquiring first information of the pipeline; and a second information acquisition unit for acquiring second information of the pipeline. The controller sends an instruction to the negative pressure generating device according to the comparison between the first information, the second information and the preset information.

3. The solder paste dispensing valve according to claim 2, characterized in that: The first information is flow information, the second information is pressure information, and the preset information is preset flow and preset pressure; The controller declutters the acquired flow information and pressure information, and generates adjustment information based on the decluttered data. The controller declutters the adjustment information again based on the negative pressure generating device, generates instructions, and sends them to the negative pressure generating device.

4. The solder paste dispensing valve according to claim 3, characterized in that: The specific steps of the controller generating instructions are: Step S1: filtering the collected flow information and pressure information; Step S2: Definition: u(t) is the adjustment information; Ea is the flow gain; Ed is the flow integral; Ei is the flow differential; Fm is the pressure gain; Fd is the pressure integral; Fc is the pressure differential; Ga is the preset flow; Gb is the actual flow; Ha is the preset pressure; Hb is the actual pressure; Then: e(t)=Ga-Gb; b(t) = Ha - Hb; Substituting e(t) and b(t) into the equation, we obtain: u(t)={Ea*e(t)+Ed*∫e(t)dt+Ei*de(t) / dt}+{Fm*b(t)+Fd*∫b(t)dt+Fc*db(t) / dt}; Step S3: Filter the adjustment information and generate instructions.

5. The solder paste dispensing valve according to claim 4, characterized in that: In step S2, the method for obtaining Ea, Ed, Ei, Fm, Fd, and Fc is: Perform auto-tuning on Ea, Ed, Ei, Fm, Fd, and Fc.

6. The solder paste dispensing valve according to claim 1, characterized in that: The dispensing component comprises: A motor, a push rod mounted on the motor shaft, and a nozzle.

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