Rapid powder removing device for silicon material

Abstract

The invention discloses a silicon material rapid powder removing device which comprises a processing box, a spiral feeding structure, a transmission device, a plasma fan, an electrostatic adsorption plate and a scraping device, the spiral feeding structure is arranged in the processing box, the plasma fan and the electrostatic adsorption plate are arranged on the two sides of the spiral feeding structure respectively, the scraping device is arranged on the processing box, and the transmission device is arranged on the processing box. Powder on the electrostatic adsorption plate is scraped; according to the silicon material and powder separation device, charges on silicon materials and powder are removed through the plasma fan, the powder is blown to the electrostatic adsorption plate, the powder carries the charges again and is adsorbed to the electrostatic adsorption plate, separation of the silicon materials and the powder is achieved, the conveying device is arranged, and therefore the silicon materials and the powder can be separated conveniently and rapidly. The screening holes are formed in the bottom of the conveying device, the silicon material and the powder are subjected to secondary separation, powder flying can be avoided, the separation efficiency of the silicon material and the powder can be improved, the purity of the silicon material is higher, and rapid powder removal is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon material production, and in particular to a device for rapidly removing powder from silicon material. Background Art

[0002] Silicon material is a material containing the element silicon and is an important raw material for the preparation of semiconductor chips.

[0003] In order to facilitate the manufacturing of semiconductor chips, solar cells, electronic components and other fields, silicon materials are mostly prepared into granular silicon to improve the applicability and processability of silicon materials, making them easier to process, integrate and utilize in different application fields.

[0004] However, in the preparation of granular silicon, the silicon material is subjected to physical crushing (such as silicon material mining, crushing and processing), wear (such as handling, transportation and treatment), chemical reactions and temperature changes, which can easily cause powder adhesion.

[0005] In the related art, a vibration platform is usually set up to separate the powder from the granular silicon through mechanical vibration to achieve the powder removal effect. However, this method easily causes the powder to fly again and re-attach to the granular silicon, and the effect is not ideal.

[0006] There is also a dust removal spray method, which is to spray dust removal liquid on the surface of the silicon material to quickly wet and remove the powder. However, this method is likely to cause dust removal liquid residue and affect the purity of the silicon material. Summary of the invention

[0007] The present invention aims to solve one of the technical problems in the above-mentioned technology at least to some extent.

[0008] To this end, one purpose of the present application is to propose a device for rapid silicon material powder removal, which removes the electric charge on the silicon material and powder through a plasma blower, and blows the powder onto an electrostatic adsorption plate, so that the powder carries the charge again and is adsorbed onto the electrostatic adsorption plate, thereby achieving separation of the silicon material and the powder. By setting up a transmission device and setting sieve holes at the bottom of the transmission device, the silicon material and the powder are separated for the second time, which can not only prevent the powder from flying, but also improve the efficiency of the separation of the silicon material and the powder, make the silicon material purer, and achieve rapid powder removal.

[0009] To achieve the above-mentioned purpose, the first embodiment of the present application proposes a silicon material rapid powder removal device, comprising: a processing box, a spiral feeding structure, a transmission device, a plasma fan, an electrostatic adsorption plate and a scraping device, wherein the spiral feeding structure is arranged in the processing box, and the spiral feeding structure comprises a feed pipe, a spiral tube and a discharge pipe connected in sequence, wherein the spiral tube is a grid-shaped spiral pipe; the feed pipe extends to the outside of the top of the processing box; the discharge pipe extends to the outside of the bottom of the processing box; the plasma fan is arranged on one side of the spiral tube to remove the charge between the silicon material and the powder, and blow the powder to the outside of the spiral tube; the electrostatic adsorption plate is arranged on the other side of the spiral tube to adsorb the powder outside the spiral tube; the scraping device is arranged on the processing box to scrape the powder on the electrostatic adsorption plate; the transmission device is connected to the discharge pipe, and a sieve hole is opened at the bottom of the transmission device to separate the silicon material and the powder that has not been blown out of the spiral tube.

[0010] The silicon material rapid powder removal device of the embodiment of the present application removes the electric charge on the silicon material and powder through a plasma blower, and blows the powder onto an electrostatic adsorption plate, so that the powder carries the electric charge again and is adsorbed onto the electrostatic adsorption plate, thereby realizing the separation of the silicon material and the powder. Furthermore, by providing a transmission device and arranging sieve holes at the bottom of the transmission device, the silicon material and the powder are subjected to secondary separation, which can not only prevent the powder from flying, but also improve the efficiency of the separation of the silicon material and the powder, make the silicon material purer, and realize rapid powder removal.

[0011] In addition, the silicon material rapid powder removal device proposed in the above embodiment of the present application may also have the following additional technical features:

[0012] In one embodiment of the present application, the transmission device includes an installation cavity, a first drive motor, a threaded transmission blade and a discharge pipe, wherein the feed end of the installation cavity is connected to the discharge pipe; the first drive motor is arranged outside the installation cavity; the threaded transmission blade is arranged in the installation cavity and connected to the first drive motor; the discharge pipe is arranged at the discharge end of the installation cavity; wherein the sieve hole is opened at the bottom of the installation cavity.

[0013] In one embodiment of the present application, there are multiple plasma blowers, which are arranged in sequence from top to bottom in the processing box.

[0014] In one embodiment of the present application, a starting power supply is provided outside the processing box, and the starting power supply is connected to the electrostatic adsorption plate through an electrode system.

[0015] In one embodiment of the present application, the scraping device includes a scraper, a lifting structure and a stabilizing rod, wherein the scraper is abutted against the electrostatic adsorption plate; the lifting structure is arranged on the processing box, and the lifting end of the lifting structure is connected to the scraper; the stabilizing rod is arranged in the processing box, and the scraper is slidably connected to the stabilizing rod.

[0016] In one embodiment of the present application, the lifting structure includes a second drive motor, a lead screw and a lead screw slider, wherein the second drive motor is arranged on the processing box; the lead screw is connected to the second drive motor and extends vertically downward into the processing box; the lead screw slider is embedded in the scraper and connected to the lead screw.

[0017] In one embodiment of the present application, an inclined material guide plate is provided below the electrostatic adsorption plate, and a material discharge port is provided at the connection between the processing box and the lower side of the material guide plate.

[0018] In one embodiment of the present application, a storage box is provided at the discharge port, and an openable and closable box cover is provided on the storage box.

[0019] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0021] Figure 1 is a schematic structural diagram of a silicon material rapid powder removal device according to an embodiment of the present application;

[0022] Figure 2 This is a schematic diagram of the internal structure of a silicon material rapid powder removal device according to an embodiment of the present application;

[0023] Figure 3 is a schematic diagram of the connection structure of the spiral feeding structure and the transmission device according to an embodiment of the present application;

[0024] Figure 4 is a schematic diagram of the internal structure of a transmission device according to an embodiment of the present application;

[0025] Figure 5 is a schematic diagram of the internal structure of a processing box according to an embodiment of the present application;

[0026] Figure 6 is a schematic structural diagram of a scraping device according to an embodiment of the present application;

[0027] As shown in the figure:

[0028] 100, processing box; 101, discharge port; 200, spiral feeding structure; 210, feed pipe; 220, spiral tube; 230, discharge pipe; 300, transmission device; 310, installation cavity; 320, first drive motor; 330, threaded transmission blade; 340, discharge pipe; 301, sieve hole; 400, plasma fan; 500, electrostatic adsorption plate; 501, starting power supply; 600, scraping device; 610, scraper; 620, lifting structure; 621, second drive motor; 622, lead screw; 623, lead screw slider; 630, stabilizing rod; 700, guide plate; 800, storage box. DETAILED DESCRIPTION

[0029] Embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0030] The silicon material rapid powder removal device according to the embodiment of the present application is described below with reference to the accompanying drawings.

[0031] like Figure 1 and Figure 2 As shown, the silicon material rapid powder removal device of the embodiment of the present application may include a processing box 100, a spiral feeding structure 200, a transmission device 300, a plasma blower 400, an electrostatic adsorption plate 500 and a scraping device 600.

[0032] The spiral feeding structure 200 is disposed in the processing box 100 .

[0033] like Figure 3 As shown, the rotary feeding structure 200 includes a feed pipe 210, a spiral pipe 220 and a discharge pipe 230 which are connected in sequence.

[0034] The spiral pipe 220 is a grid-shaped spiral pipe, the feed pipe 210 extends to the outside of the top of the processing box 100 , and the discharge pipe 230 extends to the outside of the bottom of the processing box 100 .

[0035] It should be noted that a feed hopper is provided at the end of the feed pipe 210 away from the spiral tube 220 to facilitate relevant staff to pour silicon materials into the feed pipe 210 , and the silicon materials enter the spiral tube 220 from the feed pipe 210 and slide along the spiral tube 220 .

[0036] It is understandable that the mesh size of the spiral tube 220 is smaller than the size of the granular silicon material to prevent the granular silicon from falling from the outer wall of the spiral tube 220, so as to achieve separation of the powder and the silicon material.

[0037] The plasma blower 400 is disposed at one side of the spiral tube 220 to remove the electric charge between the silicon material and the powder and blow the powder out of the spiral tube 220 .

[0038] In one embodiment of the present application, Figure 5 As shown, there are multiple plasma blowers 400 , which are sequentially arranged in the processing box 100 from top to bottom, and the multiple plasma blowers 400 are sequentially opposite to the spiral tube 220 .

[0039] It should be noted that the plasma blower 400 is a device that uses ionized gas to generate ions and generates airflow through an electric field. By blowing wind, it can remove the electric charge between the silicon material and the powder in the spiral tube 220, so that the powder is no longer adsorbed on the silicon material, and the powder is affected by the wind and blown out from the grid-shaped spiral tube 220.

[0040] The electrostatic adsorption plate 500 is disposed on the other side of the spiral tube 220 to adsorb powder outside the spiral tube 220 .

[0041] In one embodiment of the present application, a starting power source 501 is disposed outside the processing box 100 , and the starting power source 501 is connected to the electrostatic adsorption plate 500 through an electrode system.

[0042] It should be noted that the electrode system can be a conductive wire or an electrode rod, which is connected to the ionization device and then connected to the electrostatic adsorption plate 500 to generate an electric field.

[0043] It can be understood that the ionization device is used to ionize molecules in the air to generate charged air ions, which can carry electric charges on the powder again and attract it to the electrostatic adsorption plate 500.

[0044] The scraping device 600 is disposed on the processing box 100 to scrape the powder on the electrostatic adsorption plate 500 .

[0045] In one embodiment of the present application, Figure 6 As shown, the scraping device 600 includes a scraper 610 , a lifting structure 620 and a stabilizing bar 630 .

[0046] Among them, the scraper 610 is in contact with the electrostatic adsorption plate 500, the lifting structure 620 is set on the processing box 100, and the lifting end of the lifting structure 620 is connected to the scraper 610, the stabilizing rod 630 is set in the processing box 100, and the scraper 610 is slidably connected to the stabilizing rod 630.

[0047] It should be noted that the lifting structure 620 can drive the scraper 610 to scrape the electrostatic adsorption plate 500. After the silicon material powder is removed, the electrostatic adsorption plate 500 is powered off and the lifting structure 620 is driven so that the lifting structure 620 drives the scraper 610 to move on the electrostatic adsorption plate 500 to scrape the powder still adsorbed on the electrostatic adsorption plate 500.

[0048] To clearly illustrate the above embodiment, in one embodiment of the present application, the lifting structure 620 includes a second driving motor 621 , a lead screw 622 and a lead screw slider 623 .

[0049] The second drive motor 621 is disposed on the processing box 100 , the lead screw 622 is connected to the second drive motor 621 and extends vertically downward into the processing box 100 , and the lead screw slider 623 is embedded in the scraper 610 and connected to the lead screw 622 .

[0050] It should be noted that relevant staff can drive the second drive motor 621 so that the screw 622 rotates along with the second drive motor 621 , thereby making the screw slider 623 move on the screw 622 to realize the driving of the scraper 610 by the screw slider 623 .

[0051] The transmission device 300 is connected to the discharge pipe 230 , and a sieve hole 301 is provided at the bottom of the transmission device 300 to separate the silicon material and the powder that is not blown out of the spiral tube 220 .

[0052] like Figure 4 As shown, the transmission device 300 includes a mounting cavity 310 , a first driving motor 320 , a threaded transmission blade 330 , and a discharge pipe 340 .

[0053] The feeding end of the installation cavity 310 is connected to the discharge pipe 230, the first driving motor 320 is arranged outside the installation cavity 310, the threaded transmission leaf 330 is arranged in the installation cavity 310 and connected to the first driving motor 320, and the discharge pipe 340 is arranged at the discharge end of the installation cavity 310;

[0054] The sieve hole 301 is provided at the bottom of the installation cavity 310 .

[0055] It should be noted that after the silicon material passes through the spiral feeding structure, it falls into the installation cavity 310 and is pushed toward the discharge pipe 340 by the rotating threaded transmission blades 330 . During the pushing process, the remaining powder falls from the sieve hole 301 .

[0056] In another embodiment of the present application, a receiving bucket is provided at the bottom of the installation cavity 310 for receiving the sieved powder to further prevent the powder from flying.

[0057] Specifically, when the relevant staff needs to remove the powder from the silicon material, first, the relevant staff turns on the plasma blower 400 , the electrostatic adsorption plate 500 and the first driving motor 320 .

[0058] Then the relevant staff pours the silicon material along the feed pipe 210, and the silicon material slides from the feed pipe 210 into the spiral tube 220. When passing through the spiral tube 220, it is acted upon by the plasma blower 400, and the powder on the silicon material is blown out from the spiral tube 220 to the electrostatic adsorption plate 500. The powder is then adsorbed by the electrostatic adsorption plate 500 and adsorbed on the electrostatic adsorption plate 500.

[0059] The silicon material continues to slide along the spiral tube 220 and reaches the installation cavity 310 after passing through the discharge tube 230. The first drive motor 320 drives the threaded transmission blade 330 to rotate to push the falling silicon material. During the pushing process, the remaining powder falls along the sieve hole 301, and the silicon material is finally pushed to the discharge tube 340 and discharged through the discharge tube 340.

[0060] After the silicon material is de-powdered, the relevant staff turns off the plasma blower 400 , the starter power supply 501 and the first drive motor 320 .

[0061] After turning off the starting power supply 501, part of the powder falls along the electrostatic adsorption plate 500, and the other part still remains on the electrostatic adsorption plate 500. The relevant staff turns on the second drive motor 621, so that the lifting structure 620 drives the scraper 610 to move, and the scraper 610 scrapes off the powder remaining on the electrostatic adsorption plate 500 to facilitate the subsequent use of the electrostatic adsorption plate 500.

[0062] In one embodiment of the present application, an inclined material guide plate 700 is arranged below the electrostatic adsorption plate 500, and a discharge port 101 is opened at the connection between the processing box 100 and the lower side of the material guide plate 700. A storage box 800 is arranged at the discharge port 101, and an openable and closable box cover is provided on the storage box 800.

[0063] It should be noted that after the silicon material is de-powdered, the powder falls from the electrostatic adsorption plate 500 to the material guide plate 700 , slides along the inclined material guide plate 700 to the material outlet 101 , and reaches the storage box 800 .

[0064] When the relevant personnel clean the powder in the storage box 800, the box cover can be opened to take out the powder in the storage box 800.

[0065] In summary, the silicon material rapid powder removal device of the embodiment of the present application removes the electric charge on the silicon material and powder through a plasma blower, and blows the powder onto the electrostatic adsorption plate, so that the powder carries the electric charge again and is adsorbed onto the electrostatic adsorption plate, thereby realizing the separation of the silicon material and the powder. By setting a transmission device and setting sieve holes at the bottom of the transmission device, the silicon material and the powder are separated for the second time, which can not only prevent the powder from flying, but also improve the efficiency of the separation of the silicon material and the powder, make the silicon material purer, and realize rapid powder removal.

[0066] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0067] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0068] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0069] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0070] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0071] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0073] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A silicon material rapid powder removal device, characterized in that: The invention comprises a processing box (100), a spiral feeding structure (200), a transmission device (300), a plasma blower (400), an electrostatic adsorption plate (500) and a scraping device (600), wherein: The spiral feeding structure (200) is arranged in the processing box (100), and the spiral feeding structure (200) comprises a feed pipe (210), a spiral pipe (220) and a discharge pipe (230) which are connected in sequence, wherein: The spiral pipe (220) is a grid-shaped spiral pipe; The feed pipe (210) extends to the outside of the top of the processing box (100); The discharge pipe (230) extends to the outside of the bottom of the processing box (100); The plasma blower (400) is arranged on one side of the spiral tube (220) to remove the electric charge between the silicon material and the powder and blow the powder out of the spiral tube (220); The electrostatic adsorption plate (500) is arranged on the other side of the spiral tube (220) to adsorb powder outside the spiral tube (220); The scraping device (600) is arranged on the processing box (100) to scrape the powder on the electrostatic adsorption plate (500); The transmission device (300) is connected to the discharge pipe (230), and a sieve hole (301) is provided at the bottom of the transmission device (300) to separate the silicon material and the powder that is not blown out of the spiral tube (220).

2. The silicon material rapid powder removal device according to claim 1, characterized in that: The transmission device (300) comprises a mounting cavity (310), a first driving motor (320), a threaded transmission blade (330) and a discharge pipe (340), wherein: The feed end of the installation cavity (310) is in communication with the discharge pipe (230); The first driving motor (320) is arranged outside the installation cavity (310); The threaded transmission blade (330) is disposed in the installation cavity (310) and is connected to the first driving motor (320); The discharge pipe (340) is arranged at the discharge end of the installation cavity (310); Wherein, the sieve hole (301) is opened at the bottom of the installation cavity (310).

3. The silicon material rapid powder removal device according to claim 1, characterized in that: There are multiple plasma fans (400), which are arranged in sequence from top to bottom in the processing box (100).

4. The silicon material rapid powder removal device according to claim 1, characterized in that: A starting power source (501) is provided outside the processing box (100), and the starting power source (501) is connected to the electrostatic adsorption plate (500) through an electrode system.

5. The silicon material rapid powder removal device according to claim 1, characterized in that: The scraping device (600) comprises a scraper (610), a lifting structure (620) and a stabilizing rod (630), wherein: The scraper (610) abuts against the electrostatic adsorption plate (500); The lifting structure (620) is arranged on the processing box (100), and the lifting end of the lifting structure (620) is connected to the scraper (610); The stabilizing rod (630) is disposed in the processing box (100), and the scraper (610) is slidably connected to the stabilizing rod (630).

6. The silicon material rapid powder removal device according to claim 5, characterized in that: The lifting structure (620) comprises a second driving motor (621), a lead screw (622) and a lead screw slider (623), wherein: The second driving motor (621) is arranged on the processing box (100); The lead screw (622) is connected to the second drive motor (621) and extends vertically downward into the processing box (100); The lead screw slider (623) is embedded in the scraper (610) and connected to the lead screw (622).

7. The silicon material rapid powder removal device according to claim 1, characterized in that: An inclined material guide plate (700) is arranged below the electrostatic adsorption plate (500), and a material discharge port (101) is provided at a connection between the processing box (100) and a lower side of the material guide plate (700).

8. The silicon material rapid powder removal device according to claim 7, characterized in that: A storage box (800) is provided at the discharge port (101), and an openable and closable box cover is provided on the storage box (800).

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