Semiconductor processing device

Abstract

The present invention discloses a semiconductor processing device, which relates to the field of semiconductor processing technology. The device comprises a base with a component sliding groove and a pin placement groove on the top surface. The component sliding groove and the pin placement groove are used in conjunction with each other to place semiconductor components, and the lower surfaces of the pins on both sides of the semiconductor components abut against the surfaces of the pin placement grooves. A pressing drive mechanism is provided on one side of the base. The output end of the pressing drive mechanism is driven and connected to a pressing seat. A downwardly extending pressing block is fixedly connected to each side of the pressing seat. The two pressing blocks correspond to the pins on both sides of the semiconductor components, respectively. An escape space is formed between the bottom of the pressing seat and the two pressing blocks. The escape space is used for the free passage of semiconductor components. In the present invention, the pressing seat is driven downward by the pressing drive mechanism, so that the pressing block generates pressure on the pins of the semiconductor components placed in the component placement grooves. Under the action of pressure, the upward warping phenomenon of the pins can be improved, thereby facilitating subsequent assembly processes.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a semiconductor processing device. Background Art

[0002] Semiconductor components usually still need to undergo a series of operations after the packaging process is completed, such as post-curing, rib cutting, molding and electroplating. The rib cutting process usually involves cutting off the pins on the outside of the semiconductor component, and the rib cutting structure produced by the semiconductor component is often used to achieve aligned cutting of the pins.

[0003] When the cutter is retracted, the friction on the pins may cause the pins to warp up due to the friction of the blade, thereby affecting the subsequent installation of semiconductor components, which may cause poor contact of the pins and affect the performance of the chip, or cause the semiconductor components to pop out of the fixing port and fall aside, affecting the subsequent process. Therefore, it is necessary to press the pins of the semiconductor components after the rib cutting operation to prevent the pins of the semiconductor components from warping up after cutting and affecting the subsequent assembly. Summary of the Invention

[0004] An object of the present invention is to provide a semiconductor processing device to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A semiconductor processing device, comprising:

[0007] A base having a component sliding groove and a pin placement groove on the top surface, wherein the component sliding groove cooperates with the pin placement groove to place a semiconductor component, and the lower surfaces of the pins on both sides of the semiconductor component abut against the surface of the pin placement groove;

[0008] A pressing drive mechanism is provided on one side of the base, and the output end of the pressing drive mechanism is driven and connected to the pressing seat. A downward-extending pressing block is fixedly connected to both sides of the pressing seat. The two pressing blocks respectively correspond to the pins on both sides of the semiconductor element. An avoidance space is formed between the bottom of the pressing seat and the two pressing blocks. The avoidance space is used for the free passage of the semiconductor element.

[0009] Furthermore, the pressing and adjusting drive mechanism includes a vertical plate vertically connected to the outer wall of one side of the base, the upper end of the vertical plate is connected to the cylinder mounting plate, the bottom of the cylinder mounting plate is vertically installed with a pressing and adjusting cylinder, the cylinder rod end of the pressing and adjusting cylinder is connected to a lifting block, an adjustment screw is vertically passed through the surface of the lifting block, the lower end of the adjustment screw is connected to a floating unit, and the floating unit is used to connect the adjustment screw and the pressing and adjusting seat.

[0010] Furthermore, two adjusting nuts are sleeved on the peripheral thread of the adjusting screw, and the end faces of the two adjusting nuts are respectively abutted against the upper and lower outer walls of the lifting block. The two adjusting nuts are screwed together on the peripheral thread of the adjusting screw to adjust the length of the lower end of the adjusting screw passing through the lifting block.

[0011] Furthermore, the floating unit includes a floating seat fixed to the lower end of the adjusting screw, a guide column fixed to the bottom of the floating seat, a guide sleeve fixed to the top of the pressing seat, the guide column is telescopically inserted into the guide sleeve, a plurality of limit pins are horizontally penetrated through the outer wall of the guide sleeve, a waist-shaped groove is opened on the periphery of the guide column for the end of the limit pin to be inserted, and the limit pin slides freely up and down in the waist-shaped groove, and an elastic member is provided between the floating seat and the pressing seat, and the elastic member has a downward elastic supporting force on the pressing seat.

[0012] Furthermore, the elastic member is a spring wrapped around the guide column and the periphery of the guide sleeve, and the two ends of the spring in the direction of elastic force respectively abut against the floating seat and the pressing seat.

[0013] Furthermore, a limiting bolt is passed through the vertical thread at the lower end of the guide column.

[0014] Furthermore, positioning guide blocks are connected to both sides of the pressing seat, and the two positioning guide blocks correspond to the other two sides of the semiconductor element respectively, and a guiding slope is provided on the outer wall of one side of the lower end of the positioning guide block facing the semiconductor element.

[0015] Furthermore, a plurality of pin correction units are provided at the bottom of the floating seat, and the pin correction units are used to generate a horizontal squeezing force on the pins.

[0016] Furthermore, the pin correction unit includes a plurality of pin correction blocks vertically fixed to the bottom of the floating seat, the surface of the pressing seat is provided with a through groove for the pin correction block to pass freely, the surface of the base is provided with a slot for the pin correction block to be inserted, the minimum spacing between two adjacent slots is consistent with the pin width, and guide sections are provided on both sides of the lower end of the pin correction block, and the thickness of the guide section decreases successively from top to bottom.

[0017] Furthermore, an expansion slot is provided on the surface of the pin correction block and passes through the bottom surface of the pin correction block. A fixed block is fixed to the bottom wall of the slot, and an expansion block is fixed to the top of the fixed block. The expansion block is used in conjunction with the expansion slot.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. In the present invention, the pressing block is driven by a pressing drive mechanism to move downward, so that the pressing block exerts pressure on the pins of the semiconductor components placed in the component placement slots. Under the action of the pressure, the upward warping of the pins can be improved, thereby facilitating subsequent assembly processes.

[0020] 2. In the present invention, when the floating seat moves downward, the pressing seat contacts the pin. As the floating seat continues to move downward, the pressing seat and the pin remain relatively stationary, and the elastic member is compressed to accumulate elastic potential energy, thereby causing the pressing block to exert pre-pressure on the pin, so that the pin is clamped and positioned by the pressing block. When the end of the limit bolt abuts against the surface of the pressing seat, the pressing blocks on both sides of the pressing seat will exert a large extrusion force on the pin, thereby flattening the upturned pin.

[0021] 3. When the pressing block of the present invention pre-presses and clamps the pins for positioning, the pin correction block moves downward with the floating seat and penetrates between two adjacent pins, that is, the pins can be clamped by two adjacent pin correction blocks. During the clamping process, the pin correction block can correct the horizontally bent pins and cooperate with the pressing block to perform longitudinal correction on the pins, thereby enabling the pins to be in the correct assembly form. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the overall structure of a semiconductor processing device in the present invention;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure from the first perspective;

[0024] Figure 3 for Figure 1 A schematic diagram of the structure of the second perspective;

[0025] Figure 4 This is a schematic diagram of the structure of the base, floating seat and pressing seat after assembly in the present invention;

[0026] Figure 5 for Figure 4 Schematic diagram of the exploded structure;

[0027] Figure 6 for Figure 5 A structural diagram from another perspective;

[0028] Figure 7 This is a schematic diagram of the structure after the floating seat, the pressing seat and the pin correction block are assembled in the present invention;

[0029] Figure 8 for Figure 7 A structural diagram from another perspective;

[0030] Figure 9 for Figure 7The schematic diagram of the structure after omitting the semiconductor components;

[0031] Figure 10 This is a schematic diagram of the structure after the floating seat, guide column and limit bolt are assembled in the present invention;

[0032] Figure 11 for Figure 10 Schematic diagram of the positional relationship after the middle part of the structure is cut open.

[0033] In the figure, the description of each figure mark is as follows: 1. Pressing cylinder; 2. Vertical plate; 3. Adjusting screw; 4. Lifting block; 5. Floating seat; 6. Pressing seat; 7. Semiconductor component; 8. Pin placement groove; 9. Component sliding groove; 10. Base; 11. Positioning guide block; 12. Pressing block; 13. Pin correction block; 14. Spring; 15. Guide sleeve; 16. Slot; 17. Pin; 18. Fixed block; 19. Expansion groove; 20. Limiting bolt; 21. Through groove; 22. Avoidance space; 23. Guide column; 24. Expansion block; 25. Waist-shaped groove; 26. Limiting pin. DETAILED DESCRIPTION

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0035] See also Figure 1 - Figure 11 The present invention provides a technical solution: a semiconductor processing device, comprising a base 10, the top surface of the base 10 is provided with a component sliding groove 9 and a pin placement groove 8, the length direction of the component sliding groove 9 is consistent with the length direction of the base 10, the component sliding groove 9 is used to place the semiconductor component 7, and the pin placement groove 8 is used to place the pins 17 (such as) on both sides of the semiconductor component 7 (in the width direction) Figure 5 As shown), the lower surfaces of the pins 17 on both sides of the semiconductor element 7 abut against the surface of the pin placement groove 8. When the pins 17 are placed in the pin placement groove 8, the lower surface of the semiconductor element 7 does not contact the upper surface of the element sliding groove 9;

[0036] The cam 2 is screwed to the upper and lower ends of the cam 2 and the lower ends of the cam 2 are screwed together, so that the cam 2 can slide freely on the cam 2 and slide forward.

[0037] The lower end of the adjusting screw 3 is welded with a floating seat 5, and the bottom of the floating seat 5 is fixed with a guide column 23 (such as Figure 9 As shown), a guide sleeve 15 is provided on the periphery of the guide column 23 (combined with Figure 5 and Figure 6 ), the guide sleeve 15 slides freely on the periphery of the guide column 23, or the guide column 23 is telescopically inserted into the guide sleeve 15, and the outer wall of the guide sleeve 15 is horizontally penetrated with two limit pins 26 (combined with Figure 5 and Figure 10 ), a waist-shaped groove 25 is provided on the periphery of the guide column 23 for the end of the limit pin 26 to be inserted, and the limit pin 26 slides freely up and down in the waist-shaped groove 25, and the limit pin 26 slides in the waist-shaped groove 25, and the waist-shaped groove 25 has a limit on the limit pin 26, so that the guide sleeve 15 will not be separated from the guide column 23, and the lower end of the guide sleeve 15 is horizontally welded with a pressing seat 6, and a spring 14 is provided between the floating seat 5 and the pressing seat 6. The spring 14 is wrapped around the guide column 23 and the periphery of the guide sleeve 15, and the two ends of the spring 14 in the elastic direction respectively abut the floating seat 5 and the pressing seat 6, and a downward extending pressing block 12 is fixed on both sides of the pressing seat 6. The two pressing blocks 12 correspond to the pins 17 on both sides of the semiconductor element 7, respectively. An escape space 22 is formed between the bottom of the pressing seat 6 and the two pressing blocks 12. The escape space 22 is used for the free passage of the semiconductor component 7 to avoid extrusion and wear on the surface of the semiconductor component 7. A limit bolt 20 is vertically threaded through the lower end of the guide column 23. A positioning guide block 11 is connected to each side of the pressing seat 6. The two positioning guide blocks 11 correspond to the other two sides of the semiconductor component 7 respectively, and a guiding inclined surface is provided on the outer wall of the side facing the semiconductor component 7 at the lower end of the positioning guide block 11. The positioning guide block 11 is used to position the semiconductor component 7 placed in the component sliding groove 9, so that the pin 17 of the semiconductor component 7 slides on the surface of the pin placement groove 8, thereby moving the semiconductor component 7 to the bottom of the pressing seat 6;

[0038] A plurality of pin correction blocks 13 are vertically fixed to the bottom of the floating seat 5, and a through groove 21 is provided on the surface of the pressing seat 6 for the pin correction block 13 to pass freely. A slot 16 is provided on the surface of the base 10 for the pin correction block 13 to be inserted. The minimum spacing between two adjacent slots 16 is consistent with the width of the pin 17. Guide sections are provided on both sides of the lower end of the pin correction block 13. The thickness of the guide section decreases from top to bottom. The surface of the guide section faces the slot 16. An expansion slot 19 is provided on the surface of the pin correction block 13 that passes through the bottom surface of the pin correction block 13, and the inner walls on both sides of the expansion slot 19 correspond to the two sides of the length direction of the base 10 respectively. A fixed block 18 is fixed to the inner bottom wall of the slot 16, and an expansion block 24 is fixed to the top of the fixed block 18. The expansion block 24 is used in conjunction with the expansion slot 19. Figure 8 As shown, the width of the expansion block 24 increases from top to bottom, and the width of the upper end of the expansion block 24 is smaller than the width of the lower side opening of the expansion slot 19, so that the expansion block 24 can be stuck in the expansion slot 19.

[0039] Working principle of the present invention:

[0040] The staff places the semiconductor component 7 to be trimmed flat in the component sliding groove 9, with the pins 17 in contact with the surface of the pin placement groove 8. Then, the staff pushes the semiconductor component 7 so that the semiconductor component 7 is roughly located below the pressing seat 6 and basically between the guide slopes of the two positioning guide blocks 11. The staff starts the pressing cylinder 1, and the cylinder rod of the pressing cylinder 1 extends and drives the lifting block 4 to move downward. In turn, the floating seat 5 is driven downward by the adjusting screw 3. When the floating seat 5 moves downward, it simultaneously drives the pressing seat 6 downward.

[0041] When the pressing seat 6 moves downward, the lower side of the guiding slope of the positioning guide block 11 will contact the surface of the semiconductor element 7, thereby generating a lateral thrust on the semiconductor element 7, causing the semiconductor element 7 to move to the bottom of the pressing seat 6. When the upper side of the guiding slope of the positioning guide block 11 is out of contact with the semiconductor element 7, the outer wall of the semiconductor element 7 will contact the (vertical) surface of the positioning guide block 11, so that the semiconductor element 7 is positioned by the two positioning guide blocks 11. At this time, the pins 17 on both sides of the semiconductor element 7 will be correspondingly located between the two adjacent slots 16;

[0042] The floating seat 5 continues to move downward, and the pressing blocks 12 on both sides of the pressing seat 6 will contact the upper surface of the pin 17, thereby generating pre-pressure on the pin 17 and the semiconductor element 7. At this time, the semiconductor element 7 is basically in a positioned and clamped state. The floating seat 5 continues to move downward at this time, so that the spring 14 is squeezed by the floating seat 5 and accumulates elastic potential energy. In addition, at this time, the pin correction block 13 also passes through the lower side mouth of the through slot 21 of the pressing seat 6 and enters between the pins 17. In other words, the two adjacent pins 17 are located on the adjacent sides of the same pin correction block 13. Since the pins 17 may have water Therefore, when the pin 17 is squeezed by the horizontally bent pin, the pin correction block 13 produces elastic contraction, that is, the inner walls on both sides of the expansion slot 19 of the pin correction block 13 approach each other, so that the pin correction block 13 can be smoothly inserted into the slot 16, and then the upper end of the expansion block 24 (preferably, the upper end of the expansion block 24 does not protrude from the surface of the pin placement slot 8) is inserted into the expansion slot 19, so that the expansion slot 19 is expanded laterally, so that the outer wall of the pin correction block 13 produces a lateral squeezing force on the pin 17, so that the horizontal bending phenomenon of the pin 17 can be corrected;

[0043] Then, as the floating seat 5 moves downward, until the end of the limiting bolt 20 abuts against the pressing seat 6, the pressing blocks 12 on both sides of the pressing seat 6 exert downward pressure on the pins 17, so that the upturned pins 17 can be flattened.

[0044] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the invention, and the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor processing device, characterized in that: include: A base (10) is provided with a component sliding groove (9) and a pin placement groove (8) on the top surface, wherein the component sliding groove (9) is used in conjunction with the pin placement groove (8) to place a semiconductor component (7), and the lower surfaces of the pins (17) on both sides of the semiconductor component (7) abut against the surface of the pin placement groove (8); A compression drive mechanism is provided on one side of the base (10), wherein the output end of the compression drive mechanism is driven and connected to a compression seat (6), and downwardly extending compression blocks (12) are fixedly connected to both sides of the compression seat (6), and the two compression blocks (12) respectively correspond to the pins (17) on both sides of the semiconductor element (7), and an escape space (22) is formed between the bottom of the compression seat (6) and the two compression blocks (12), and the escape space (22) is used for allowing the semiconductor element (7) to pass freely; The pressing and adjusting driving mechanism comprises a vertical plate (2) vertically connected to the outer wall of one side of the base (10), the upper end of the vertical plate (2) is connected to a cylinder mounting plate, a pressing and adjusting cylinder (1) is vertically mounted on the bottom of the cylinder mounting plate, the end of the cylinder rod of the pressing and adjusting cylinder (1) is connected to a lifting block (4), an adjusting screw (3) is vertically passed through the surface of the lifting block (4), the lower end of the adjusting screw (3) is connected to a floating unit, and the floating unit is used to connect the adjusting screw (3) and the pressing and adjusting seat (6); The floating unit includes a floating seat (5) fixed to the lower end of the adjusting screw (3), a guide column (23) fixed to the bottom of the floating seat (5), a guide sleeve (15) fixed to the top of the pressing seat (6), the guide column (23) is telescopically inserted into the guide sleeve (15), a plurality of limit pins (26) are horizontally penetrated through the outer wall of the guide sleeve (15), a waist-shaped groove (25) for the end of the limit pin (26) to be inserted is opened on the periphery of the guide column (23), and the limit pin (26) slides freely up and down in the waist-shaped groove (25), an elastic member is provided between the floating seat (5) and the pressing seat (6), and the elastic member has a downward elastic supporting force on the pressing seat (6); A plurality of pin correction units are provided at the bottom of the floating seat (5), and the pin correction units are used to generate a horizontal squeezing force on the pins (17); The pin correction unit includes a plurality of pin correction blocks (13) vertically fixed to the bottom of the floating seat (5), the surface of the pressing seat (6) is provided with a through groove (21) for the pin correction block (13) to pass freely, the surface of the base (10) is provided with a slot (16) for the pin correction block (13) to be inserted, the minimum distance between two adjacent slots (16) is consistent with the width of the pin (17), and the two sides of the lower end of the pin correction block (13) are provided with a guide section, and the thickness of the guide section decreases from top to bottom; The surface of the pin correction block (13) is provided with an expansion slot (19) that passes through the bottom surface of the pin correction block (13); the bottom wall of the slot (16) is fixedly connected to a fixed block (18); the top of the fixed block (18) is fixedly connected to an expansion block (24); the expansion block (24) is used in conjunction with the expansion slot (19).

2. The semiconductor processing device according to claim 1, wherein: The adjusting screw (3) is threadedly sleeved with two adjusting nuts, and the end faces of the two adjusting nuts are respectively in contact with the upper and lower outer walls of the lifting block (4). The two adjusting nuts are screwed together with the threaded periphery of the adjusting screw (3) to adjust the length of the lower end of the adjusting screw (3) passing through the lifting block (4).

3. The semiconductor processing device according to claim 1, wherein The elastic member is a spring (14) wrapped around the periphery of the guide column (23) and the guide sleeve (15), and the two ends of the spring (14) in the elastic force direction respectively abut against the floating seat (5) and the pressing seat (6).

4. The semiconductor processing device according to claim 1, wherein: A limiting bolt (20) is vertically threaded through the lower end of the guide column (23).

5. The semiconductor processing device according to claim 1, wherein: A positioning guide block (11) is connected to each of the two sides of the pressing seat (6), and the two positioning guide blocks (11) correspond to the other two sides of the semiconductor element (7) respectively, and a guiding slope is provided on the outer wall of one side of the lower end of the positioning guide block (11) facing the semiconductor element (7).

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