Method and apparatus for determining laser processing head height and related products

Abstract

The application discloses a laser processing head height determination method and device and related products. In the method, a plurality of processing images of a laser processing head of a laser device after processing a material to be processed are obtained based on a plurality of sets of position information; one set of position information corresponds to one processing image; one of the processing images with the thinnest cutting line width is determined as a first target image; and a first target height of the laser processing head for processing the material to be processed is determined based on the height in the set of position information corresponding to the first target image according to the corresponding relationship between the processing image and the position information. The application adjusts the height of the laser processing head multiple times based on the focal depth of the laser device, compares the images after cutting to determine a suitable processing height, is more efficient, intelligent and automatic compared to the manual determination of the height of the laser processing head, and is beneficial to the improvement of the efficiency and yield of semiconductor manufacturing and material processing and reduces the excessive dependence on manual work.

Description

Technical Field

[0001] This application relates to the field of materials processing technology, and in particular to a method, apparatus and related products for determining the height of a laser processing head. Background Technology

[0002] In semiconductor manufacturing and materials processing, lasers are frequently used as processing tools. The height of the laser processing head within the laser determines the processing effect. If the laser processing head is too high or too low relative to the material being processed, laser defocusing may occur. Taking laser surface cutting as an example, an unsuitable laser processing head height leads to laser defocusing, resulting in a wide cutting line on the material surface. In severe cases, the heat effect of the laser may even damage the material itself. Therefore, selecting an appropriate height for the laser processing head is crucial for improving the yield of laser processing. Currently, this mainly relies on repeated manual testing and visual comparison of processing effects. There is an urgent need to develop a more efficient, intelligent, and automated solution for determining the height of the laser processing head. Summary of the Invention

[0003] To address the aforementioned issues, this application provides a method, apparatus, and related products for determining the height of a laser processing head, with the aim of determining the height of the laser processing head more efficiently, intelligently, and automatically, thereby reducing excessive reliance on manual labor.

[0004] The embodiments of this application disclose the following technical solutions:

[0005] The first aspect of this application provides a method for determining the height of a laser processing head, the method comprising:

[0006] The laser processing head of the laser acquires multiple processed images of the material to be processed based on multiple sets of position information; wherein, each processed image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are based on the focal depth of the laser.

[0007] The image with the thinnest cutting line width among the multiple processing images is selected as the first target image; wherein, the cutting line is the processing mark left by the laser processing head on the material to be processed;

[0008] Based on the correspondence between the processed image and the position information, the first target height for the laser processing head to process the material to be processed is determined according to the height in a set of position information corresponding to the first target image.

[0009] In an optional implementation, a set of position information constitutes a set of position offset parameters, including a height offset, which indicates the relative height between the laser processing head and the imaging reference height; the imaging reference height is determined based on the image clarity of the material to be processed by the image acquisition device.

[0010] Determining the first target height for the laser processing head to process the material based on the height in a set of position information corresponding to the first target image includes:

[0011] The sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height is determined as the first target height for the laser processing head to process the material to be processed.

[0012] In an optional implementation, the height offset in the multiple sets of position offset parameters is a × ΔH; in the multiple sets of position offset parameters, a takes a value from 0, 1, 2, 3…N; or, the height offset in the multiple sets of position offset parameters is ±b × ΔH; in the multiple sets of position offset parameters, b takes a value from 0, 1, 2, 3…N; where ΔH represents the depth of focus, and N is a positive integer.

[0013] In an optional implementation, after determining the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height as the first target height for the laser processing head to process the material to be processed, the method further includes:

[0014] Multiple new processing images of the material to be processed are obtained after the laser processing head processes the material based on multiple sets of new position offset parameters; the height of the laser processing head is different in each set of new position offset parameters, and the different heights are based on 0.5 times the depth of focus.

[0015] The image with the thinnest cutting line width among the multiple new processing images is selected as the second target image.

[0016] Based on the correspondence between the new processed image and the new position offset parameters, the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the first target height is determined as the second target height for the laser processing head to process the material to be processed.

[0017] In an optional implementation, the new position offset parameters include a height offset that indicates the relative height of the laser processing head and the first target height; the height offset in the multiple sets of new position offset parameters is ±c×Δh; in the multiple sets of new position offset parameters, c takes values ​​from 0, 1, 2, 3…S; Δh=0.5×ΔH, and S is a positive integer.

[0018] In an optional implementation, determining the imaging reference height based on the image sharpness of the material to be processed by the image acquisition device includes:

[0019] Move the processing platform containing the preset material template directly below the image acquisition device;

[0020] The height of the image acquisition device was adjusted multiple times;

[0021] Based on the image clarity of the preset template material at different heights obtained by the image acquisition device, determine the height at which the image acquisition device can image the preset material template most clearly;

[0022] Remove the preset material template from the processing platform and place the material to be processed onto the processing platform;

[0023] Based on the height at which the image acquisition device captures the clearest image of the preset material template, the image acquisition device is controlled to shift vertically. According to the image clarity of the image acquisition device on the material to be processed at different heights, the height at which the image acquisition device captures the clearest image of the material to be processed is determined as the imaging reference height.

[0024] In an optional implementation, the method further includes:

[0025] Obtain the thickness information of the material to be processed and the thickness information of the new product material;

[0026] Determine whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device;

[0027] If the absolute value is greater than the depth of field, an alarm will be issued;

[0028] If the absolute value is less than or equal to the depth of field, then based on the difference and the first target height of the laser processing head for processing the material to be processed, the third target height of the laser processing head for processing the new product material is determined.

[0029] In an optional implementation, each set of position offset parameters includes a relative offset in the X direction and a relative offset in the Y direction relative to the image acquisition device; the relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two mutually perpendicular directions and perpendicular to the height direction.

[0030] The laser processing head of the laser processes the material to be processed based on multiple sets of position information, including:

[0031] The laser processing head is controlled to adjust its height according to the height offset in the position information, so that the height of the laser processing head reaches the corresponding height.

[0032] The processing stage carrying the material to be processed is controlled to move according to the starting offset in the X direction and the offset in the Y direction, so that the material to be processed reaches the corresponding processing starting position, and the laser is controlled to emit light;

[0033] The processing stage is controlled to move in the X direction according to the X-direction movement termination offset, so that the material to be processed reaches the corresponding processing termination position, and the laser is turned off;

[0034] The X-direction movement start offset and the X-direction movement end offset are both set based on the relative offset in the X direction, and the Y-direction offset is set based on the relative offset in the Y direction.

[0035] In an optional implementation, the starting offset of the X-direction movement is the same and the ending offset of the X-direction movement is the same in the multiple sets of position offset parameters; the offset in the Y-direction differs by a preset interval in the set of position offset parameters corresponding to each of two adjacent laser processing operations.

[0036] A second aspect of this application provides a device for determining the height of a laser processing head, the device comprising:

[0037] The image acquisition module is used to acquire multiple processing images of the laser processing head of the laser after processing the material to be processed based on multiple sets of position information; wherein, each processing image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are based on the focal depth of the laser.

[0038] An image detection module is used to determine the processing image with the thinnest line width of the cutting line from the multiple processing images as the first target image; wherein, the cutting line is the processing mark of the laser processing head on the material to be processed;

[0039] The height determination module is used to determine the first target height for the laser processing head to process the material to be processed based on the correspondence between the processing image and the position information, according to the height in a set of position information corresponding to the first target image.

[0040] A third aspect of this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method for determining the height of a laser processing head as described in the first aspect.

[0041] A fourth aspect of this application provides an electronic device for determining the height of a laser processing head, the electronic device comprising: a processor and a memory;

[0042] The memory stores computer programs;

[0043] The processor is configured to read and run the computer program stored therein, wherein the program executes the method for determining the height of the laser processing head as described in the first aspect.

[0044] This application provides a laser processing system in a fifth aspect. The system includes the electronic device for determining the height of a laser processing head provided in the fourth aspect, and further includes a laser, a ranging sensor, an image acquisition device, a first Z-axis motion assembly, and a second Z-axis motion assembly. The laser includes a laser processing head, and the laser processing head, the ranging sensor, the image acquisition device, the first Z-axis motion assembly, and the second Z-axis motion assembly are all connected to a processor in the electronic device. The laser processing head is mounted on the first Z-axis motion assembly, and the image acquisition device is mounted on the second Z-axis motion assembly.

[0045] The processor is further configured to send a first motion control command to the first Z-axis motion component, so that the first Z-axis motion component drives the laser processing head to move along the Z-axis direction and change the height of the laser processing head;

[0046] The processor is further configured to send a second motion control command to the second Z-axis motion component, so that the second Z-axis motion component drives the image acquisition device to move along the Z-axis direction, thereby changing the height of the image acquisition device;

[0047] The ranging sensor is used to detect the thickness of the material carried on the processing platform.

[0048] Compared with the prior art, this application has the following beneficial effects:

[0049] In this application's technical solution, a laser processing head is used to obtain multiple processing images of the material to be processed after processing, based on multiple sets of positional information. Each processing image corresponds to a set of positional information. Each set of positional information includes the height of the laser processing head and the position of the material to be processed. The height of the laser processing head varies in each set of positional information, and this varying height is based on the laser's depth of focus. The processing image with the thinnest cutting line width is determined from the multiple processing images as the first target image. The cutting line represents the processing mark left by the laser processing head on the material to be processed. Based on the correspondence between the processing images and the positional information, the first target height for the laser processing head to process the material to be processed is determined according to the height in the set of positional information corresponding to the first target image. Since the height of the laser processing head is set based on the depth of focus, each laser processing operation explores the appropriate height of the laser processing head with the depth of focus as the granularity. With a constant laser power, the thinner the cutting line width formed by the laser processing, the better the laser focusing effect; conversely, the wider the cutting line width, the more significant the laser defocusing phenomenon, and the less it meets the processing expectations. The technical solution of this application adjusts the height of the laser processing head multiple times based on the focal depth of the laser, and determines the appropriate processing height by comparing the images after cutting. Compared with the method of manually determining the height of the laser processing head, it is more efficient, intelligent and automated, which is conducive to improving the efficiency and yield of semiconductor manufacturing and material processing, and reducing excessive reliance on manual labor. Attached Figure Description

[0050] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0051] Figure 1 A flowchart illustrating a method for determining the height of a laser processing head, provided as an embodiment of this application;

[0052] Figure 2 A flowchart illustrating another method for determining the height of a laser processing head provided in an embodiment of this application;

[0053] Figure 3 A flowchart for determining an imaging reference height is provided in an embodiment of this application;

[0054] Figure 4 This is a schematic diagram of a cutting calibration interface provided in an embodiment of this application;

[0055] Figure 5 This is a schematic diagram of a device for determining the height of a laser processing head, provided in an embodiment of this application. Detailed Implementation

[0056] In semiconductor manufacturing and materials processing, if the laser processing head height is unsuitable, causing the laser to defocus, it may damage the processed material or result in unsatisfactory laser processing effects. Currently, selecting the laser processing head height mainly relies on manual testing, which is inefficient. The inventors have proposed a technical solution that involves acquiring multiple processing images of materials processed at different laser processing head heights, analyzing these images, and comparing the cutting line width to determine the appropriate height. This solution effectively solves the current problem, determining the laser processing head height in a more efficient, intelligent, and automated manner, reducing excessive reliance on manual labor.

[0057] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0058] See Figure 1 This figure is a flowchart illustrating a method for determining the height of a laser processing head according to an embodiment of this application. Figure 1 As shown, the method includes:

[0059] S101. Acquire multiple processing images of the laser processing head of the laser after processing the material to be processed based on multiple sets of position information.

[0060] Each processing image corresponds to a set of positional information. Each set of positional information includes the height of the laser processing head and the position of the material to be processed. The height of the laser processing head varies in each set of positional information, and this difference in height is based on the focal depth setting of the laser. For example, the height difference between the positional information used in two adjacent laser processing operations is one focal depth.

[0061] For ease of understanding, an illustrative explanation is provided below. Assume there are five sets of positional information, containing laser processing head heights of h1, h2, h3, h4, and h5. Based on these five sets of positional information and their corresponding heights h1, h2, h3, h4, and h5, the laser processing head processes the same material. After each processing step, an image acquisition device captures the resulting cutting line, obtaining the acquired processing images, namely the first image, the second image, the third image, the fourth image, and the fifth image. The cutting line represents the processing marks left by the laser processing head on the material. In this step, these five processing images are acquired for subsequent image analysis.

[0062] In practical applications, taking laser surface dicing as an example, the material to be processed can be a wafer. In one embodiment, the multiple laser processing steps mentioned above can be completed on different dicing tracks of the same wafer, meaning that the same section of the same dicing track will not be repeatedly laser-processed by the laser processing head at multiple different heights. In practical applications, for example, during laser processing, the processing stage can be moved along the X-direction to form a cutting line parallel to the X-direction. After one laser processing step and before the next, the processing stage can be controlled to move a certain distance along the Y-direction (e.g., move one grain step), and then the height of the laser processing head can be adjusted and the laser can be turned on for laser processing. Thus, the cutting lines formed by the laser processing head at different heights are parallel to each other.

[0063] S102. Determine the processing image with the thinnest line width of the cutting line from multiple processing images as the first target image.

[0064] In one possible implementation, to avoid difficulty in distinguishing and identifying cutting lines formed by different laser processing head heights in the processed image, the position of the processing stage can be adjusted before shooting so that the cutting line formed by the latest processing is in the center of the field of view of the image acquisition device.

[0065] The thickness of the cutting line reflects the utilization rate of laser heating energy and the ideal focusing of the laser processing head during laser processing. Compared to a thicker cutting line, a thinner line indicates a higher utilization rate of laser heating energy, a more ideal focusing of the laser processing head, and a higher yield. Therefore, after obtaining multiple processing images through S101, image processing and analysis techniques can be used to identify and analyze the width of the cutting line in each image. This determines the image with the thinnest cutting line and uses it as the first target image. In practical applications, if it is not the first laser processing, the processing image may contain cutting lines formed in previous processing within the field of view of the image acquisition device. Therefore, to accurately identify the line width of the current cutting line, it can be pre-calibrated and aligned to place the cutting line formed in the current processing in an easily identifiable position or area.

[0066] S103. Based on the correspondence between the processing image and the position information, determine the first target height of the material to be processed by the laser processing head according to the height in a set of position information corresponding to the first target image.

[0067] As mentioned earlier, this application provides multiple sets of positional information, each containing a different laser processing head height, and each processing image corresponds to a set of positional information. That is, if a processing image is locked, a unique laser processing head height can be determined. Based on this, having determined the first target image in S102, a uniquely corresponding height can be determined. Since this height results in the finest cutting line, the height corresponding to the first target image is determined as the first target height for the laser head to process the material. It can be considered that, in the multiple laser processing operations already implemented, using a laser processing head of this height can achieve the optimal focusing effect.

[0068] In this application's technical solution, a laser processing head is used to obtain multiple processing images of the material to be processed after processing, based on multiple sets of positional information. Each processing image corresponds to a set of positional information. Each set of positional information includes the height of the laser processing head and the position of the material to be processed. The height of the laser processing head varies in each set of positional information, and this varying height is based on the laser's depth of focus. The processing image with the thinnest cutting line width is determined from the multiple processing images as the first target image. The cutting line represents the processing mark left by the laser processing head on the material to be processed. Based on the correspondence between the processing images and the positional information, the first target height for the laser processing head to process the material to be processed is determined according to the height in the set of positional information corresponding to the first target image. Since the height of the laser processing head is set based on the depth of focus, each laser processing operation explores the appropriate height of the laser processing head with the depth of focus as the granularity. With a constant laser power, the thinner the cutting line width formed by the laser processing, the better the laser focusing effect; conversely, the wider the cutting line width, the more significant the laser defocusing phenomenon, and the less it meets the processing expectations. The technical solution of this application adjusts the height of the laser processing head multiple times based on the focal depth of the laser, and determines the appropriate processing height by comparing the images after cutting. Compared with the method of manually determining the height of the laser processing head, it is more efficient, intelligent and automated, which is conducive to improving the efficiency and yield of semiconductor manufacturing and material processing, and reducing excessive reliance on manual labor.

[0069] In practical applications, to more accurately determine a more suitable height, the height of the laser processing head can be further fine-tuned based on the initial target height, thereby obtaining better laser processing results. An example will be provided below. Figure 2 A flowchart illustrating another method for determining the height of a laser processing head, provided as an embodiment of this application. Figure 2 As shown, the method includes:

[0070] S201. Acquire multiple processing images of the laser processing head of the laser after processing the material to be processed based on multiple sets of position information.

[0071] Here, we introduce a specific form of position information: a set of position information consists of a set of position offsets, which includes a height offset. The height offset indicates the relative height of the laser processing head and the imaging reference height. As mentioned earlier, the laser processing head height included in each set of position information is different; this can be understood as the height offset included in each set of position information being different, while the imaging reference height is uniform.

[0072] For ease of understanding, the imaging reference height is explained below. In the embodiments of this application, the imaging reference height is determined based on the imaging sharpness of the material to be processed by the image acquisition device. Figure 3 A flowchart for determining an imaging reference height is provided for embodiments of this application, such as... Figure 3 An example of how to determine the imaging reference height includes:

[0073] S301. Move the processing platform with the preset material template placed on it directly below the image acquisition device.

[0074] Here, the preset material template can be a material with the same or similar material as the material to be processed, and with the same or similar thickness. For example, "similar thickness" can mean that the thickness difference does not exceed 200 μm.

[0075] For example, if the material to be processed is a wafer, the preset material template can be a wafer template with the same thickness as the wafer to be processed. In order to determine an imaging reference height, the preset material template is moved directly below the image acquisition device via the processing stage to prepare for subsequent imaging acquisition.

[0076] S302. Adjust the height of the image acquisition device multiple times.

[0077] After the preset material template is positioned directly below the image acquisition device, the height of the image acquisition device is adjusted multiple times. The purpose of this is to compare the clarity of images acquired at different heights, thereby facilitating the determination of the imaging reference height for clear imaging.

[0078] S303. Based on the image clarity of the preset template material at different heights, determine the height at which the image acquisition device can image the preset material template most clearly.

[0079] After imaging the preset template material, the sharpness of the resulting image can be evaluated using a subjective evaluation index of detail visibility. Alternatively, image sharpness can also be evaluated using objective evaluation indexes such as grayscale variance, edge gradient, information entropy, spectral entropy, and structural similarity. No specific index is limited in the evaluation of image sharpness here. In summary, by comparison, the height at which the image of the preset material template achieves the sharpest result can be determined. Next, it is necessary to further determine the height at which the image of the material to be processed achieves the sharpest result; for this purpose, steps S304–S305 are executed.

[0080] S304. Remove the preset material template from the processing platform and place the material to be processed onto the processing platform.

[0081] Since the preset material template was originally placed on the processing platform, in order to accurately determine the height at which the image of the material to be processed is clearest, the preset material template needs to be removed from the processing platform before the material to be processed is placed on the processing platform.

[0082] S305. Based on the height at which the image acquisition device captures the clearest image of the preset material template, control the image acquisition device to shift up and down. According to the image acquisition device's image clarity at different heights on the material to be processed, determine the height at which the image acquisition device captures the clearest image of the material to be processed as the imaging reference height.

[0083] Since the thickness of the preset material template is the same as or close to the thickness of the material to be processed, a height that provides the clearest image for the material to be processed can be determined near the height that provides the clearest image for the preset material template, as determined in S303. Specifically, when the material to be processed on the processing platform is directly below the image acquisition device, the image acquisition device is controlled to shift up and down near the height that provides the clearest image for the preset material template. The material to be processed is imaged multiple times at different heights, and the image clarity is analyzed. Finally, the height at which the image acquisition device provides the clearest image for the material to be processed can be determined and used as the imaging reference height.

[0084] In one possible implementation, the height offset in the multiple sets of position offset parameters is a × ΔH; in the multiple sets of position offset parameters, a takes values ​​from 0, 1, 2, 3…N. For example, the height offset in the first set of position offset parameters is 0, the height offset in the second set is ΔH, the height offset in the third set is 2 × ΔH, the height offset in the fourth set is 3 × ΔH, and so on.

[0085] In another possible implementation, the height offset in the multiple sets of position offset parameters is ±b×ΔH; in the multiple sets of position offset parameters, b takes a value from 0, 1, 2, 3…N. For example, the height offset in the first set of position offset parameters is -2×ΔH, the height offset in the second set is -ΔH, the height offset in the third set is 0, the height offset in the fourth set is ΔH, the height offset in the fifth set is 2×ΔH, and so on.

[0086] Where ΔH represents the depth of focus, and N is a positive integer. The depth of focus is determined by the laser wavelength and the properties of the focusing lens, and is an inherent property of the laser. The calculation method for the depth of focus is well known in this field and will not be elaborated here.

[0087] Each set of position offset parameters includes the relative offset in the X direction and the relative offset in the Y direction relative to the image acquisition device; the height offset corresponds to the Z direction. The relative offsets in the X and Y directions are used to indicate the position of the material to be processed; the X and Y directions are two mutually perpendicular directions, and also perpendicular to the height direction. This can be understood as follows: of the X, Y, and Z directions, each pair is perpendicular to the others.

[0088] The laser processing head of the laser machine processes the material to be processed based on multiple sets of positional information. This can involve controlling the laser processing head to adjust its height according to the height offset in the positional information, ensuring the laser head reaches the appropriate height; controlling the processing stage carrying the material to move according to the X-direction starting offset and the Y-direction offset, ensuring the material reaches the corresponding processing start position, and controlling the laser to emit light; and controlling the processing stage to move in the X-direction according to the X-direction ending offset, ensuring the material reaches the corresponding processing end position, and then shutting off the laser. This completes one laser processing cycle based on a set of positional information for the material to be processed.

[0089] The starting and ending offsets of the X-direction movement are both set based on the relative offset in the X-direction, while the Y-direction offset is set based on the relative offset in the Y-direction. For example, if the relative offset in the Y-direction is set to 10 μm, the processing stage needs to move the material to be processed 10 μm along the Y-direction before each processing step.

[0090] For example, in multiple sets of position offset parameters, the starting offset of movement in the X direction is the same, and the ending offset of movement in the X direction is the same. In each set of position offset parameters corresponding to two adjacent laser processing operations, the offset in the Y direction differs by a preset interval (for example, a difference of 10 μm, or 0.01 mm). As a result, the cutting lines formed by multiple laser processing operations are aligned with each other at both ends in the X direction, and the spacing in the Y direction is the same.

[0091] S202. Determine the processing image with the thinnest line width of the cutting line from multiple processing images as the first target image.

[0092] After each linewidth detection of the image, the linewidth of the cutting line formed in that processing can be recorded. For example, the first linewidth is detected as W1, the second as W2, the third as W3, and so on. Finally, the thinnest linewidth is determined, thereby identifying the first target image.

[0093] S203. Based on the correspondence between the processing image and the position information, determine the first target height of the material to be processed by the laser processing head according to the height in a set of position information corresponding to the first target image.

[0094] Since the height offset is relative to the imaging reference height, it is necessary to combine the imaging reference height to determine the height offset ΔH in the position offset parameters. In S203, the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height is determined as the first target height for the laser processing head to process the material to be processed.

[0095] Steps S201 to S203 above can be understood as completing the first round of laser processing and height determination of the laser processing head. In this embodiment, based on the first round of laser processing and height determination, a second round of laser processing and height determination is performed through the following steps. It should be noted that the second round of laser processing and height determination is performed based on the first target height determined in the first round of laser processing and height determination.

[0096] S204. Obtain multiple new processing images of the material to be processed after the laser processing head has processed the material based on multiple new sets of position offset parameters.

[0097] In the second round of laser processing and height determination, similarly, it is necessary to adjust the height of the laser processing head to ultimately determine the appropriate height. For ease of distinction, the position offset parameters used here will be referred to as multiple sets of new position offset parameters. The height of the laser processing head varies in each set of new position offset parameters, and these different heights are based on a 0.5 times depth of focus setting. By reducing the height difference to a finer granularity, i.e., 0.5 times the depth of focus, it is easier to determine a height with further improved accuracy compared to the first target height (i.e., the second target height referred to below) through the second round of laser processing and height determination.

[0098] In one example, the new position offset parameters include a height offset indicating the relative height of the laser processing head to the height of a first target. The height offset in multiple sets of new position offset parameters is ±c × Δh; in these multiple sets of new position offset parameters, c takes values ​​from 0, 1, 2, 3…S; Δh = 0.5 × ΔH, and S is a positive integer. For example, a total of 11 sets of new position offset parameters are configured, with height offsets of: -5 × Δh, -4 × Δh, -3 × Δh, -2 × Δh, -Δh, 0, Δh, 2 × Δh, 3 × Δh, 4 × Δh, 5 × Δh.

[0099] S205. From multiple new processing images, determine the processing image with the thinnest line width of the cutting line as the second target image.

[0100] The specific implementation of this step can refer to step S102 in the previous embodiment, and will not be repeated here.

[0101] S206. Based on the correspondence between the new processing image and the new position offset parameters, the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the height of the first target is determined as the second target height for the laser processing head to process the material to be processed.

[0102] Because there is a correspondence between the linewidth, the new processing image, and the new position offset parameters (including height offset), the height offset corresponding to the second target image can be locked based on this correspondence. This height offset means determining a more precise and suitable laser processing head height compared to the first target height. Furthermore, since the height offset in the new position offset parameters is relative to the first target height, in order to determine the appropriate height for the laser processing head, the aforementioned height offset is summed with the first target height to obtain the second target height for processing the material to be processed by the laser processing head.

[0103] In this embodiment, by performing two rounds of laser processing and height determination, the accuracy of the determined laser processing head height is improved in an intelligent, automated, and efficient manner. This further enhances the yield of semiconductor manufacturing and material processing.

[0104] In the preceding embodiments, the appropriate height of the laser processing head for the product to be processed during laser processing was determined. It is understood that the items on the processing platform may change depending on actual processing needs. For example, after the material to be processed is completed, new product material needs to be placed on the processing platform and laser-processed by the laser processing head. To effectively utilize the previously determined laser processing head height, this application also proposes that, in... Figure 1 In an embodiment of the process shown, it may further include:

[0105] The system acquires the thickness information of the material to be processed and the thickness information of the new product material; it determines whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device; if the absolute value is greater than the depth of field, an alarm is issued; if the absolute value is less than or equal to the depth of field, the system determines the third target height of the laser processing head for processing the new product material based on the difference and the first target height of the laser processing head for processing the material to be processed.

[0106] Similarly, in order to effectively utilize the previously determined laser processing head height, this application also proposes that, in Figure 2 In an embodiment of the process shown, it may further include:

[0107] The system acquires the thickness information of the material to be processed and the thickness information of the new product material; it determines whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device; if the absolute value is greater than the depth of field, an alarm is issued; if the absolute value is less than or equal to the depth of field, the system determines the fourth target height of the laser processing head for processing the new product material based on the difference and the second target height of the laser processing head for processing the material to be processed.

[0108] In the above description, by acquiring the thickness information of the material to be processed and the new product material, the difference in their thicknesses can be compared. Comparing the absolute value of the difference with the relative magnitude of the depth of field of the image acquisition device is to determine whether the laser processing head height determined for the material to be processed, implemented through the methods described above, is suitable as a reference value for determining the laser processing head height for the new product material. If the absolute value of the thickness difference is greater than the depth of field of the image acquisition device, the laser processing head height for the material to be processed is considered unsuitable as a reference value, and an alarm should be issued. After receiving the alarm, the imaging reference height can be determined again using a preset material template that matches the thickness of the material, and a suitable laser processing head height can be finally determined. Conversely, if the absolute value of the thickness difference is less than or equal to the depth of field of the image acquisition device, the laser processing head height for the material to be processed is considered suitable as a reference value. Therefore, based on the height as a reference value and the thickness difference between the two materials, a suitable laser processing head height, i.e., the third target height (corresponding to...), can be determined for the new processing material. Figure 1 The implementation method shown is to perform one round of laser processing and height determination work) or the fourth target height (corresponding to Figure 2 The implementation method shown is to perform two rounds of laser processing and height determination.

[0109] The above method simplifies the process of determining the laser processing head height for new product materials, reduces complexity, and improves the efficiency and yield of laser processing.

[0110] To facilitate understanding of the implementation process of the two-round laser processing and height determination in the technical solution of this application, the process during this period will be described in detail below through an example.

[0111] In this example, after the laser processing head and image acquisition device are installed, they can both move up and down along the Z-axis (also known as the Z-direction or height direction). A preset material template is placed on the processing platform, and the platform is controlled to move the template. Once the template is directly below the image acquisition device, the height of the device is adjusted multiple times to image the template at different heights (i.e., imaging distances). By analyzing the clarity of each image, the height at which the image of the template is most clearly captured is determined. This height is then recorded.

[0112] Next, the image acquisition device is moved up and / or down along the Z-axis multiple times from this height. At this point, the item on the processing stage has been replaced from the preset material template with the material to be processed. After multiple movements of the image acquisition device, the material to be processed is imaged multiple times at different heights until the height at which the image is clearest is found; this height is called the imaging reference height. Subsequent searches for the most suitable height for the laser processing head on the material to be processed are based on and ultimately determined from this imaging reference height.

[0113] Next, the focal depth of the laser is calculated based on its inherent parameters, and the relative position between the laser processing head's emission point and the image acquisition device is obtained. The calibration method for the relative position between the laser processing head's emission point and the image acquisition device can be as follows: First, the bare material used for calibration is moved below the laser processing head, causing the laser processing head to emit laser light, forming a laser cutting point on the bare material. The position information of this point is read, and the horizontal and vertical coordinates are used as the emission point position of the laser processing head. Then, the processing stage is controlled to move, so that the cutting point moves to the center of the field of view of the image acquisition device, and the position information of this point in the field of view is read. Two sets of position information are obtained through the above operations, and the difference between the horizontal and vertical coordinates is used to obtain the relative position between the laser processing head's emission point and the image acquisition device. The above calibration process can be represented by the following formula: △x=X-X1, △y=Y-Y1. Where X and Y are the coordinates of the laser processing head's emission point in the X and Y directions, respectively; X1 and Y1 are the coordinates of the image acquisition device in the X and Y directions, respectively. (△x, △y) represent the relative positions between the laser processing head's light emission point and the image acquisition device.

[0114] For a preset material template, multiple positions along the Z-axis are determined for the height of the laser processing head, denoted as position 0, position 1, position 2...position 10. Position 0 corresponds to the laser processing point where the camera image is clearest, and its height is taken as the imaging reference height. For example, if the imaging reference height is 17.5mm, the Z-axis value for position 0 is 17.5mm. Other positions represent vertical offsets relative to position 0. The initial position of the material to be processed is (100, 200) on the X and Y axes, in mm. The Y offset represents the horizontal offset relative to 200mm (the initial position) along the Y-axis; the Z offset represents the vertical offset relative to 17.5mm. A Z offset of 0 indicates that the laser processing head cuts the material at a height of 17.5mm.

[0115] The Z-axis offset is set to an integer multiple of ΔH, such as 0*ΔH, 1*ΔH, 2*ΔH... and so on. The Y-axis offset is set to a fixed value of 0.01mm, which is a deviation of 10um, and is accumulated to 10um, 20um, 30um... and so on. The cutting length is set to 5mm (in the X direction).

[0116] When cutting the first line, the X-axis moves to the position of 100+△x-2.5, the Y-axis moves to the position of 200+△y+0.01mm, and the Z-axis moves to the position of 17.5mm. Then, the laser is turned on to emit light, the X-axis moves to the position of 100+△x+2.5, and the laser is turned off. The first line is then cut.

[0117] When cutting the second line, the X-axis moves to the position of 100+△x-2.5, the Y-axis moves to the position of 200+△y+0.02mm, and the Z-axis moves to the position of 17.5+1*△Hmm. Then, the laser is turned on to emit light, the X-axis moves to the position of 100+△x+2.5, and the laser is turned off. The cutting of the second line is completed.

[0118] When cutting the third line, the X-axis moves to the position of 100+△x-2.5, the Y-axis moves to the position of 200+△y+0.03mm, and the Z-axis moves to the position of 17.5+2*△Hmm. Then, the laser is turned on to emit light, the X-axis moves to the position of 100+△x+2.5, and the laser is turned off. The cutting of the third line is now complete.

[0119] Following this process, after all lines have been cut, each line is moved to the center of the image acquisition device's field of view, and its width is detected. When detecting the first line, the X-axis is moved to position 100, the Y-axis to 200 + 0.01 mm, and the Z-axis to 17.5, resulting in a line width of W1. For the second line, the X-axis is moved to position 100, the Y-axis to 200 + 0.02 mm, and the Z-axis to 17.5, resulting in a line width of W2. This process continues, detecting all line widths W1, W2, W3, W4, ...; the Z-axis position corresponding to the thinnest line is identified and recorded as the first target height.

[0120] Based on the initial target height, the following steps further refine the second target height. Set the Z-axis offset to Δh = ΔH / 2. Set the X-axis center position to 100, the Y-axis starting position to 210 (other Y values ​​can also be set, as long as they form a Y-direction interval with the previous round of cutting), and the Z-axis starting position to the first target height (denoted as Z2).

[0121] First, set the Z-axis offset to an integer multiple of △h, such as -5*△h, -4*△h, -3*△h...4*△h, 5*△h, etc. Set the Y-axis offset to a fixed value of 0.01mm, which is a deviation of 10um, and accumulate it to 10um, 20um, 30um... and so on. Set the cutting length to 5mm.

[0122] When cutting the first line, the X-axis moves to the position of 100+△x-2.5, the Y-axis moves to the position of 210+△y+0.01mm, and the Z-axis moves to the position of Z2-5*△hmm. Then, the laser is turned on to emit light, the X-axis moves to the position of 100+△x+2.5, and the laser is turned off. The first line is then cut.

[0123] When cutting the second line, the X-axis moves to the position of 100+△x-2.5, the Y-axis moves to the position of 210+△y+0.02mm, and the Z-axis moves to the position of Z2-4*△hmm. Then, the laser is turned on to emit light, the X-axis moves to the position of 100+△x+2.5, and the laser is turned off. The second line cutting is then complete.

[0124] When cutting the third line, the X-axis moves to the position of 100+△x-2.5, the Y-axis moves to the position of 210+△y+0.03mm, and the Z-axis moves to the position of Z2-3*△hmm. Then, the laser is turned on to emit light, the X-axis moves to the position of 100+△x+2.5, and the laser is turned off. The cutting of the third line is now complete.

[0125] Following this process, after all lines have been cut, each line is moved to the center of the image acquisition device's field of view to detect its width. When detecting the first line, the X-axis is moved to position 100, the Y-axis to 210 + 0.01 mm, and the Z-axis to 17.5, resulting in a line width of W11. For the second line, the X-axis is moved to position 100, the Y-axis to 210 + 0.02 mm, and the Z-axis to 17.5, resulting in a line width of W21. This process continues, detecting all line widths W11, W21, W13, W41, and so on. The Z-axis position corresponding to the thinnest line is identified and recorded as Z3. Z3 represents the second target height for the laser processing head to process the material.

[0126] Figure 4 This is a schematic diagram of a cutting calibration interface provided in an embodiment of this application. Figure 4 The image displays seven sets of positional information. The different Z-offsets in these sets indicate varying laser processing head heights. Click "Get" to obtain the specific coordinates of the light emission point; click "Get" again to obtain the center position of the image acquisition device's field of view. The cutting frequency and cutting power can be set separately.

[0127] This application also provides a device for determining the height of a laser processing head. Figure 5 The structure of the device is shown, which includes:

[0128] The image acquisition module 501 is used to acquire multiple processing images of the laser processing head of the laser after processing the material to be processed based on multiple sets of position information; wherein, one processing image corresponds to one set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are based on the focal depth of the laser.

[0129] Image detection module 502 is used to determine the processing image with the thinnest line width of the cutting line from the multiple processing images as the first target image; wherein, the cutting line is the processing mark of the laser processing head on the material to be processed;

[0130] The height determination module 503 is used to determine the first target height for the laser processing head to process the material to be processed based on the correspondence between the processing image and the position information, according to the height in a set of position information corresponding to the first target image.

[0131] Optionally, the set of position information is a set of position offset parameters, the position offset parameters including a height offset, the height offset being used to indicate the relative height of the laser processing head and the imaging reference height; the imaging reference height is determined based on the imaging clarity of the material to be processed by the image acquisition device;

[0132] The height determination module 503 is specifically used to determine the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height as the first target height for the laser processing head to process the material to be processed.

[0133] Optionally, the height offset in the multiple sets of position offset parameters is a × ΔH; in the multiple sets of position offset parameters, a takes a value from 0, 1, 2, 3…N; or, the height offset in the multiple sets of position offset parameters is ±b × ΔH; in the multiple sets of position offset parameters, b takes a value from 0, 1, 2, 3…N; wherein, ΔH represents the depth of focus, and N is a positive integer.

[0134] The image acquisition module 501 is also used to acquire multiple new processing images of the material to be processed after the laser processing head processes the material based on multiple sets of new position offset parameters; the height of the laser processing head is different in each set of new position offset parameters, and the different heights are based on 0.5 times the depth of focus.

[0135] The image detection module 502 is also used to determine the processing image with the thinnest line width of the cutting line from the multiple new processing images as the second target image;

[0136] The height determination module 503 is also used to determine the second target height for the laser processing head to process the material to be processed by the laser processing head by summing the height offset in a set of new position offset parameters corresponding to the second target image with the first target height, based on the correspondence between the new processing image and the new position offset parameters.

[0137] Optionally, the new position offset parameters include a height offset for indicating the relative height of the laser processing head and the first target height; the height offset in the multiple sets of new position offset parameters is ±c×Δh; in the multiple sets of new position offset parameters, c takes values ​​from 0, 1, 2, 3…S; Δh=0.5×ΔH, and S is a positive integer.

[0138] Optionally, the device further includes an imaging reference height determination module for determining the imaging reference height in the following manner:

[0139] Move the processing platform with the preset material template placed on it directly below the image acquisition device; adjust the height of the image acquisition device multiple times; determine the height at which the image acquisition device can image the preset material template most clearly based on the image clarity of the preset material template material at different heights; remove the preset material template from the processing platform and place the material to be processed on the processing platform; based on the height at which the image acquisition device can image the preset material template most clearly, control the vertical offset of the image acquisition device, and determine the height at which the image acquisition device can image the material to be processed most clearly based on the image clarity of the preset material template material at different heights as the imaging reference height.

[0140] Optionally, the device further includes:

[0141] The thickness acquisition module is used to acquire the thickness information of the material to be processed and the thickness information of the new product material;

[0142] The judgment module is used to determine whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device;

[0143] An alarm notification module is used to issue an alarm notification if the absolute value is greater than the depth of field;

[0144] The height determination module 503 is further configured to determine a third target height for the laser processing head to process the new product material based on the difference and a first target height for the laser processing head to process the material to be processed, if the absolute value is less than or equal to the depth of field.

[0145] Optionally, each set of position offset parameters includes a relative offset in the X direction and a relative offset in the Y direction relative to the image acquisition device; the relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two mutually perpendicular directions and perpendicular to the height direction;

[0146] Optionally, the above-mentioned device further includes: a processing control module, used for:

[0147] The laser processing head is controlled to adjust its height according to the height offset in the position information, so that the height of the laser processing head reaches the corresponding height.

[0148] The processing stage carrying the material to be processed is controlled to move according to the starting offset in the X direction and the offset in the Y direction, so that the material to be processed reaches the corresponding processing starting position, and the laser is controlled to emit light;

[0149] The processing stage is controlled to move in the X direction according to the X-direction movement termination offset, so that the material to be processed reaches the corresponding processing termination position, and the laser is turned off;

[0150] The X-direction movement start offset and the X-direction movement end offset are both set based on the relative offset in the X direction, and the Y-direction offset is set based on the relative offset in the Y direction.

[0151] Optionally, in the multiple sets of position offset parameters, the starting offset of the movement in the X direction is the same, and the ending offset of the movement in the X direction is the same; the offset in the Y direction in each set of position offset parameters corresponding to two adjacent laser processing operations differs by a preset interval.

[0152] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method for determining the height of a laser processing head as described in the method embodiments.

[0153] This application embodiment also provides an electronic device for determining the height of a laser processing head, the electronic device including: a processor and a memory;

[0154] The memory stores computer programs;

[0155] The processor is configured to read and run the computer program stored therein, wherein the program executes the method for determining the height of the laser processing head as described in the method embodiment.

[0156] This application embodiment also provides a laser processing system, which includes the aforementioned electronic device for determining the height of a laser processing head, and further includes a laser, a ranging sensor, an image acquisition device, a first Z-axis motion component, and a second Z-axis motion component; the laser includes a laser processing head, and the laser processing head, the ranging sensor, the image acquisition device, the first Z-axis motion component, and the second Z-axis motion component are all connected to a processor in the electronic device; the laser processing head is mounted on the first Z-axis motion component, and the image acquisition device is mounted on the second Z-axis motion component;

[0157] The processor is further configured to send a first motion control command to the first Z-axis motion component, so that the first Z-axis motion component drives the laser processing head to move along the Z-axis direction and change the height of the laser processing head;

[0158] The processor is further configured to send a second motion control command to the second Z-axis motion component, so that the second Z-axis motion component drives the image acquisition device to move along the Z-axis direction, thereby changing the height of the image acquisition device;

[0159] The ranging sensor is used to detect the thickness of the material carried on the processing platform.

[0160] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for the device, equipment, and system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method embodiments. The device, equipment, and system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components indicated as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of the solution in this embodiment according to actual needs. Those skilled in the art can understand and implement this without creative effort.

[0161] The above description is merely one specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for determining the height of a laser processing head, characterized in that, include: The laser processing head of the laser acquires multiple processed images of the material to be processed based on multiple sets of position information; wherein, each processed image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are based on the focal depth of the laser. The image with the thinnest cutting line width among the multiple processing images is selected as the first target image; wherein, the cutting line is the processing mark left by the laser processing head on the material to be processed; Based on the correspondence between the processed image and the position information, the first target height for the laser processing head to process the material to be processed is determined according to the height in a set of position information corresponding to the first target image.

2. The method according to claim 1, characterized in that, The set of position information constitutes a set of position offset parameters, including a height offset, which indicates the relative height of the laser processing head and the imaging reference height; the imaging reference height is determined based on the image clarity of the material to be processed by the image acquisition device. Determining the first target height for the laser processing head to process the material based on the height in a set of position information corresponding to the first target image includes: The sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height is determined as the first target height for the laser processing head to process the material to be processed.

3. The method according to claim 2, characterized in that, The height offset in the multiple sets of position offset parameters is a × ΔH; in the multiple sets of position offset parameters, a takes a value from 0, 1, 2, 3…N; or, the height offset in the multiple sets of position offset parameters is ±b × ΔH; in the multiple sets of position offset parameters, b takes a value from 0, 1, 2, 3…N; where ΔH represents the depth of focus, and N is a positive integer.

4. The method according to claim 2, characterized in that, After determining the sum of the height offset in a set of position offset parameters corresponding to the first target image and the imaging reference height as the first target height for the laser processing head to process the material to be processed, the method further includes: Multiple new processing images of the material to be processed are obtained after the laser processing head processes the material based on multiple sets of new position offset parameters; the height of the laser processing head is different in each set of new position offset parameters, and the different heights are based on 0.5 times the depth of focus. The image with the thinnest cutting line width among the multiple new processing images is selected as the second target image. Based on the correspondence between the new processed image and the new position offset parameters, the sum of the height offset in a set of new position offset parameters corresponding to the second target image and the first target height is determined as the second target height for the laser processing head to process the material to be processed.

5. The method according to claim 4, characterized in that, The new position offset parameters include a height offset that indicates the relative height of the laser processing head and the first target height; the height offset in the multiple sets of new position offset parameters is ±c×Δh; in the multiple sets of new position offset parameters, c takes values ​​in 0, 1, 2, 3…S; Δh=0.5×ΔH, and S is a positive integer.

6. The method according to any one of claims 2-5, characterized in that, Determining the imaging reference height based on the image clarity of the material to be processed by the image acquisition device includes: Move the processing platform containing the preset material template directly below the image acquisition device; The height of the image acquisition device was adjusted multiple times; Based on the image clarity of the preset template material at different heights obtained by the image acquisition device, determine the height at which the image acquisition device can image the preset material template most clearly; Remove the preset material template from the processing platform and place the material to be processed onto the processing platform; Based on the height at which the image acquisition device captures the clearest image of the preset material template, the image acquisition device is controlled to shift vertically. According to the image clarity of the image acquisition device on the material to be processed at different heights, the height at which the image acquisition device captures the clearest image of the material to be processed is determined as the imaging reference height.

7. The method according to claim 6, characterized in that, The method further includes: Obtain the thickness information of the material to be processed and the thickness information of the new product material; Determine whether the absolute value of the difference between the thickness of the new product material and the thickness of the material to be processed is greater than the depth of field of the image acquisition device; If the absolute value is greater than the depth of field, an alarm will be issued; If the absolute value is less than or equal to the depth of field, then based on the difference and the first target height of the laser processing head for processing the material to be processed, the third target height of the laser processing head for processing the new product material is determined.

8. The method according to claim 2, characterized in that, Each set of position offset parameters includes a relative offset in the X direction and a relative offset in the Y direction relative to the image acquisition device; the relative offset in the X direction and the relative offset in the Y direction are used to indicate the position of the material to be processed; the X direction and the Y direction are two mutually perpendicular directions and perpendicular to the height direction; The laser processing head of the laser processes the material to be processed based on multiple sets of position information, including: The laser processing head is controlled to adjust its height according to the height offset in the position information, so that the height of the laser processing head reaches the corresponding height. The processing stage carrying the material to be processed is controlled to move according to the starting offset in the X direction and the offset in the Y direction, so that the material to be processed reaches the corresponding processing starting position, and the laser is controlled to emit light; The processing stage is controlled to move in the X direction according to the X-direction movement termination offset, so that the material to be processed reaches the corresponding processing termination position, and the laser is turned off; The X-direction movement start offset and the X-direction movement end offset are both set based on the relative offset in the X direction, and the Y-direction offset is set based on the relative offset in the Y direction.

9. The method according to claim 8, characterized in that, Among the multiple sets of position offset parameters, the starting offset of the X-direction movement is the same, and the ending offset of the X-direction movement is the same; the offset of the Y-direction in each set of position offset parameters corresponding to two adjacent laser processing operations differs by a preset interval.

10. A device for determining the height of a laser processing head, characterized in that, include: The image acquisition module is used to acquire multiple processing images of the laser processing head of the laser after processing the material to be processed based on multiple sets of position information; wherein, each processing image corresponds to a set of position information; each set of position information includes the height of the laser processing head and the position of the material to be processed, and the height of the laser processing head is different in each set of position information, and the different heights are based on the focal depth of the laser. An image detection module is used to determine the processing image with the thinnest line width of the cutting line from the multiple processing images as the first target image; wherein, the cutting line is the processing mark of the laser processing head on the material to be processed; The height determination module is used to determine the first target height for the laser processing head to process the material to be processed based on the correspondence between the processing image and the position information, according to the height in a set of position information corresponding to the first target image.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method for determining the height of a laser processing head as described in any one of claims 1-9.

12. An electronic device for determining the height of a laser processing head, characterized in that, The electronic device includes: a processor and a memory; The memory stores computer programs; The processor is configured to read and run the computer program stored therein, wherein the program executes the method for determining the height of the laser processing head as described in any one of claims 1-9.

13. A laser processing system, characterized in that, The electronic device for determining the height of a laser processing head as described in claim 12 further includes a laser, a ranging sensor, an image acquisition device, a first Z-axis motion component, and a second Z-axis motion component; the laser includes a laser processing head, and the laser processing head, the ranging sensor, the image acquisition device, the first Z-axis motion component, and the second Z-axis motion component are all connected to a processor in the electronic device; The laser processing head is mounted on the first Z-axis motion assembly, and the image acquisition device is mounted on the second Z-axis motion assembly; The processor is further configured to send a first motion control command to the first Z-axis motion component, so that the first Z-axis motion component drives the laser processing head to move along the Z-axis direction and change the height of the laser processing head; The processor is further configured to send a second motion control command to the second Z-axis motion component, so that the second Z-axis motion component drives the image acquisition device to move along the Z-axis direction, thereby changing the height of the image acquisition device; The ranging sensor is used to detect the thickness of the material carried on the processing platform.

Images