Laser perforation control method, laser perforation system and storage medium

Abstract

The application provides a laser perforation control method, a laser perforation system and a storage medium, and belongs to the technical field of product processing. The laser perforation system comprises a first driving module, a second driving module and a laser module. The method comprises the following steps: in response to a starting instruction, the first driving module is controlled to move, and a first position parameter fed back by a first encoder is received; the laser module is controlled to preliminarily process a product to be processed according to the first position parameter and processing parameters; the number of movements of the second driving module is counted; when the number of movements does not reach a preset number, the second driving module is controlled to move, and a second position parameter fed back by a second encoder is received; the laser module is controlled to process the product to be processed again according to the second position parameter and the processing parameters, and the number of movements of the second driving module is updated until the updated number of movements reaches the preset number, and a target perforated product is obtained. The product produced by the application has laser holes with equal distances and uniform energy distribution, and the problem of energy accumulation is avoided.

Description

Technical Field

[0001] This application relates to the field of product processing technology, and in particular to a laser perforation control method, a laser perforation system, and a storage medium. Background Technology

[0002] In laser processing, the uneven energy distribution of fixed-frequency pulsed light means that the energy received by the product is affected by the processing trajectory length and speed. During processing, especially along curves where the path is longer, more energy tends to accumulate, leading to uneven pulsed energy distribution and energy buildup in certain areas. This uneven energy distribution affects the processing quality, causing surface irregularities or excessive ablation. Summary of the Invention

[0003] The main objective of this application is to provide a laser perforation control method, a laser perforation system, and a storage medium that can uniformly distribute energy on the product, avoiding the problem of energy accumulation caused by uneven energy distribution during laser processing.

[0004] To achieve the above objectives, a first aspect of this application proposes a laser perforation control method applied to a laser perforation system. The laser perforation system includes a first driving module, a second driving module, and a laser module. The first driving module is equipped with a first encoder, and the second driving module is equipped with a second encoder. The method includes:

[0005] In response to a start command, the first drive module is controlled to move to drive the product to be processed along a first preset direction, and a first position parameter fed back by the first encoder is received, wherein the first position parameter is used to characterize the position of the first drive module.

[0006] The laser module is controlled to perform preliminary processing on the product to be processed based on the first position parameter and the preset processing parameters.

[0007] Count the number of times the second drive module moves;

[0008] When the number of moves does not reach the preset number, the second drive module is controlled to move to drive the pre-processed product to move along the second preset direction, and the second position parameter fed back by the second encoder is received. The second position parameter is used to characterize the position of the second drive module.

[0009] Based on the second position parameter and the processing parameter, the laser module is controlled to process the product to be processed again after the initial processing, and the number of movements of the second drive module is updated until the updated number of movements reaches the preset number, so as to obtain the target punched product.

[0010] In some embodiments, the laser perforation system further includes a support component and a third drive module, the support component being used to support the product to be processed; before controlling the first drive module to move in a first direction, the method further includes:

[0011] Prior to responding to the startup command, the method further includes:

[0012] Perform a zero-return check on the first drive module, the second drive module, and the third drive module;

[0013] When the first drive module, the second drive module, and the third drive module pass the zero-return check, they load the product to be processed onto the carrier component.

[0014] In some embodiments, the laser module includes a pulse width modulation port; controlling the laser module to perform preliminary processing on the product to be processed according to the first position parameter and preset processing parameters includes:

[0015] A first pulse signal is generated based on the first position parameter and the preset processing parameters;

[0016] The first pulse signal is adjusted by the pulse width modulation port with a preset first duty cycle, and the laser module is triggered to emit laser according to the adjusted first pulse signal to perform laser perforation on the product to be processed.

[0017] In some embodiments, the laser module includes a pulse width modulation port; controlling the laser module to further process the pre-processed product according to the second position parameter and the processing parameter includes:

[0018] A second pulse signal is generated based on the second position parameter and the preset processing parameters;

[0019] The second pulse signal is adjusted by the pulse width modulation port with a preset second duty cycle, and the laser module is triggered to emit laser according to the adjusted second pulse signal to perform laser perforation on the product to be processed after preliminary processing.

[0020] In some embodiments, after counting the number of moves of the second drive module, the method further includes:

[0021] When the number of moves reaches a preset number, the third drive module is controlled to move to a preset safe position, the first drive module is controlled to move to the first waiting position, and the second drive module is controlled to move to the second waiting position.

[0022] Control the load-bearing component to stop the vacuuming operation.

[0023] In some embodiments, after loading the product to be processed onto the carrier component, the method further includes:

[0024] Control the bearing assembly to perform a vacuuming operation;

[0025] The system controls the first drive module to move to a first preset position, controls the second drive module to move to a second preset position, and controls the third drive module to move to a third preset position.

[0026] In some embodiments, after performing a zero-return check on the first driver module, the second driver module, and the third driver module, the method further includes:

[0027] If the first driver module, the second driver module, or the third driver module fails the zero-return check, the parameter return operation is initiated.

[0028] A second aspect of this application provides a laser perforation system, comprising:

[0029] A first drive module is provided with a first encoder. The first drive module is used to move along a first preset direction. The first encoder is used to provide feedback on the position of the first drive module.

[0030] The second drive module is equipped with a second encoder. The second drive module is used to move along a second preset direction, and the second encoder is used to provide feedback on the position of the second drive module.

[0031] Laser module, used to emit laser light;

[0032] The controller, in response to a start command, controls the first drive module to move to move the product to be processed along a first preset direction, and receives a first position parameter fed back by the first encoder, the first position parameter being used to characterize the position of the first drive module; controls the laser module to perform preliminary processing on the product to be processed according to the first position parameter and preset processing parameters; and counts the number of movements of the second drive module; further, when the number of movements has not reached a preset number, controls the second drive module to move to move the pre-processed product to be processed along a second preset direction, and receives a second position parameter fed back by the second encoder, the second position parameter being used to characterize the position of the second drive module; controls the laser module to perform further processing on the pre-processed product to be processed according to the second position parameter and the processing parameters, and updates the number of movements of the second drive module until the updated number of movements reaches the preset number, thereby obtaining the target punched product.

[0033] In some embodiments, the system further includes a support component and a third drive module, wherein the support component is used to support the product to be processed, and the third drive module is used to move along a third preset direction.

[0034] A third aspect of this application provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a computer, the computer is used to perform the laser perforation control method as described in any one of the embodiments of the first aspect of this application.

[0035] The laser perforation control method, laser perforation system, and storage medium proposed in this application have the following beneficial effects: The laser perforation system of this application includes a first driving module, a second driving module, and a laser module. The first driving module is equipped with a first encoder, and the second driving module is equipped with a second encoder. This allows the first encoder to feed back the position information of the first driving module, and the second encoder to feed back the position information of the second driving module, achieving real-time feedback of the positions of the first and second driving modules. During the laser perforation of the product to be processed, this application responds to a start command, controls the first driving module to move, thereby moving the product to be processed along a first preset direction, and receives the first position parameter fed back by the first encoder, thus achieving real-time feedback of the movement position of the first driving module. Then, based on the first position parameter and preset processing parameters, the laser module is controlled to perform preliminary processing on the product to be processed. Precise control of the output power and energy distribution of the laser module can be achieved through the position parameter and processing parameters, thereby achieving equidistant processing of the product to be processed in the first preset direction. The number of movements of the second driving module is then counted and compared with a preset number. If the number of movements does not reach the preset number, it indicates that the product to be processed is not properly processed. The product requires further processing. At this point, the second drive module is controlled to move, driving the pre-processed product along a second preset direction. It also receives second position parameters from the second encoder, enabling real-time feedback on the movement position of the second drive module. Subsequently, based on the second position parameters and processing parameters, the laser module is controlled to further process the pre-processed product. This allows for precise control of the laser module's output power and energy distribution along the second preset direction, achieving equidistant laser energy output processing. The number of movements of the second drive module is updated until the updated number of movements reaches a preset number, completing the laser perforation process and resulting in a target perforated product with equidistant laser holes and uniform energy distribution. This embodiment uses an encoder to provide real-time feedback of the drive module's position information and performs laser perforation on the product based on the position information and preset processing parameters. This ensures equidistant hole spacing during perforation without being affected by processing speed, achieving synchronous position output and avoiding energy accumulation caused by uneven energy distribution during laser processing.

[0036] Other features and advantages of this application will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the application. The objectives and other advantages of this application may be realized and obtained by means of the structures particularly pointed out in the description and the accompanying drawings. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the laser perforation system provided in the embodiments of this application;

[0038] Figure 2 This is a flowchart of the laser perforation control method provided in the embodiments of this application;

[0039] Figure 3 This is a flowchart of a laser perforation control method provided in another embodiment of this application;

[0040] Figure 4 This is a flowchart of a specific method for step S102 provided in an embodiment of this application;

[0041] Figure 5 This is a flowchart illustrating a specific method for controlling a laser module to process a pre-processed product based on a second position parameter and processing parameters, as provided in an embodiment of this application.

[0042] Figure 6 This is a flowchart of a specific method for controlling laser perforation according to another embodiment of this application;

[0043] Figure 7 This is a flowchart of a specific method for controlling laser perforation according to another embodiment of this application;

[0044] Figure 8 This is a flowchart of a specific method for controlling laser perforation according to another embodiment of this application;

[0045] Figure 9 This is a schematic diagram of the hardware structure of the controller provided in the embodiments of this application. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0047] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0048] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0049] The laser perforation control method provided in this application can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, or smartwatch, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), and big data and artificial intelligence platforms; the software can be an application implementing the above method, but is not limited to the above forms.

[0050] The embodiments of this application can be used in numerous general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer controllers, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0051] In laser processing, the uneven energy distribution of fixed-frequency pulsed light means that the energy received by the product is affected by the processing trajectory length and speed. During processing, especially along curves where the path is longer, more energy tends to accumulate, leading to uneven pulsed energy distribution and energy buildup in certain areas. This uneven energy distribution affects the processing quality, causing surface irregularities or excessive ablation.

[0052] To address the aforementioned issues, this embodiment proposes a laser perforation control method, a laser perforation system, and a storage medium. The laser perforation system of this embodiment includes a first driving module, a second driving module, and a laser module. The first driving module is equipped with a first encoder, and the second driving module is equipped with a second encoder. This allows for real-time feedback of the positions of the first and second driving modules, enabling real-time feedback of their positions. During laser perforation of the product to be processed, this embodiment responds to a start command by controlling the first driving module to move, thereby moving the product to be processed along a first preset direction. It also receives first position parameters from the first encoder, achieving real-time feedback of the first driving module's position. Based on the first position parameters and preset processing parameters, the laser module is controlled to perform preliminary processing on the product. Precise control of the laser module's output power and energy distribution is achieved through the position and processing parameters, enabling equidistant processing of the product to be processed along the first preset direction. The number of movements of the second driving module is then counted and compared with a preset number. If the number of movements does not reach the preset number, it indicates that the product to be processed is not properly processed. The product requires further processing. At this point, the second drive module is controlled to move, driving the pre-processed product along a second preset direction. It also receives second position parameters from the second encoder, enabling real-time feedback on the movement position of the second drive module. Subsequently, based on the second position parameters and processing parameters, the laser module is controlled to further process the pre-processed product. This allows for precise control of the laser module's output power and energy distribution along the second preset direction, achieving equidistant laser energy output processing. The number of movements of the second drive module is updated until the updated number of movements reaches a preset number, completing the laser perforation process and resulting in a target perforated product with equidistant laser holes and uniform energy distribution. This embodiment uses an encoder to provide real-time feedback of the drive module's position information and performs laser perforation on the product based on the position information and preset processing parameters. This ensures equidistant hole spacing during perforation without being affected by processing speed, achieving synchronous position output and avoiding energy accumulation caused by uneven energy distribution during laser processing.

[0053] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the laser perforation system provided in the embodiments of this application;

[0054] In some embodiments, the laser perforation system includes a first driving module 110, a second driving module 120, a third driving module 130, a carrier component 200, a laser module (not shown in the figure), and a controller (not shown in the figure).

[0055] Specifically, in this embodiment of the application, the first driving module 110 is used to move along a first preset direction, the second driving module 120 is used to move along a second preset direction, and the third driving module 130 is used to move along a third preset direction, wherein the first preset direction, the second preset direction, and the third preset direction are different directions.

[0056] Depend on Figure 1 It can be seen that the first preset direction in the embodiments of this application is Figure 1 The X-axis direction, the second preset direction is Figure 1 The Y-axis direction in the middle, the third preset direction is Figure 1 The Z-axis direction in the equation.

[0057] In some embodiments, the first drive module 110 is provided with a first encoder, which is used to provide real-time feedback on the position of the first drive module 110. The second drive module 120 is provided with a second encoder, which is used to provide real-time feedback on the position of the second drive module 120. By setting the encoder, real-time feedback on the position of different drive modules can be achieved, which can accurately determine the position information of the drive modules, facilitate the subsequent precise control of the laser module, and realize the position synchronization output function.

[0058] It is understood that the first drive module 110, the second drive module 120 and the third drive module 130 in the embodiments of this application can be DC motors, AC motors, servo motors, etc., and the embodiments of this application do not impose specific limitations.

[0059] In some embodiments, the carrier component 200 includes a carrier platform and a vacuum component. The carrier platform is used to carry the product to be processed and to fix the product to be processed. The vacuum component is used to perform a vacuuming operation on the carrier platform so that the carrier component 200 can be in a vacuum space, which facilitates the subsequent processing of the product to be processed.

[0060] In some embodiments, the controller is used to activate the equidistant processing function to perform laser perforation on the product to be processed, thereby achieving equidistant laser energy output processing and avoiding the problem of energy accumulation caused by uneven energy in laser processing. This process will be described in detail below, and will not be repeated here in the embodiments of this application.

[0061] Based on the structure of the laser perforation system described above, the laser perforation control method of this application embodiment will be described in detail below.

[0062] Please refer to Figure 2 , Figure 2 This is a flowchart of a specific method of the laser perforation control method provided in the embodiments of this application. It is applied, but not limited to, the laser perforation system described above. In some embodiments, the laser perforation control method includes, but is not limited to, steps S101 to S105.

[0063] In step S101, in response to the start command, the first drive module 110 is controlled to move to drive the product to be processed along the first preset direction, and the first position parameter fed back by the first encoder is received.

[0064] It should be noted that the first position parameter is used to characterize the location of the first drive module 110.

[0065] In step S101 of some embodiments, in response to the start command, the first drive module 110 is controlled to move to drive the product to be processed to move along the first preset direction, and the first position parameter fed back by the first encoder is received to realize real-time feedback on the position of the first drive module 110, which can accurately determine the position of the first drive module 110, and facilitate the subsequent control of the output power and energy distribution of the laser module.

[0066] It should be noted that the start command in this application embodiment can be triggered by the user pressing the start button or clicking the relevant control, and this application embodiment does not impose any specific limitations.

[0067] It is understood that the product to be processed in the embodiments of this application can be semiconductor glass, metal products, etc., and the embodiments of this application do not impose specific limitations.

[0068] Step S102: Control the laser module to perform preliminary processing on the product to be processed according to the first position parameters and preset processing parameters.

[0069] In step S102 of some embodiments, the laser module is controlled to process the product to be processed according to the first position parameter and the preset processing parameters, thereby adjusting the power output of the laser in the laser module to perform laser perforation according to the adjusted power, achieving uniform drilling in the first preset direction and avoiding uneven energy.

[0070] It should be noted that the processing parameters in this application embodiment include, but are not limited to, the hole spacing, the number of single-point pulses, and the high / low level holding time. The hole spacing determines the distance between two holes during laser processing; the number of single-point pulses refers to the number of pulses emitted by the laser at a single processing point; specifically, a higher number of single-point pulses means a longer laser module operation time at that point; and the high / low level holding time determines the length of time the laser module maintains a high or low level state. By adjusting the number of single-point pulses and the high / low level holding time, the energy input during processing can be optimized, the heat-affected zone reduced, and the processing quality improved.

[0071] Step S103: Count the number of times the second drive module 120 moves.

[0072] In step S103 of some embodiments, after obtaining the product to be processed after preliminary processing, the present application embodiment will also count the number of times the second drive module 120 moves, so as to compare the number of times the second drive module 120 moves with the preset number, thereby determining whether the second drive module 120 still needs to be moved, so as to achieve precise processing of the product to be processed.

[0073] In step S104, if the number of moves has not reached the preset number, the second drive module 120 is controlled to move to drive the pre-processed product to be processed along the second preset direction, and the second position parameter fed back by the second encoder is received.

[0074] It should be noted that the second position parameter is used to characterize the location of the second drive module 120.

[0075] In step S104 of some embodiments, if the number of moves has not reached the preset number, it indicates that the laser drilling process in the second preset direction has not been completed. The second drive module 120 is controlled to move to drive the pre-processed product to be processed along the second preset direction, so as to facilitate the processing of the product to be processed in the second preset direction. The second position parameter fed back by the second encoder is received to realize real-time feedback on the position of the second drive module 120, which can accurately determine the position of the second drive module 120, and facilitate the subsequent control of the output power and energy distribution of the laser module.

[0076] It should be noted that the preset number of times in this application embodiment can be set according to the user's needs, such as three times, seven times, five times, etc. This application embodiment does not impose specific limitations.

[0077] Step S105: Based on the second position parameters and processing parameters, control the laser module to process the product to be processed again after the initial processing, and update the number of movements of the second drive module 120 until the updated number of movements reaches the preset number, and obtain the target punched product.

[0078] In step S105 of some embodiments, the laser module is controlled to reprocess the product to be processed after preliminary processing according to the second position parameter and processing parameters. That is, processing is continued on the basis of the product to be processed after preliminary processing to achieve equidistant laser energy output processing, further achieving uniform drilling in the second preset direction, avoiding uneven energy, and further avoiding energy accumulation caused by uneven energy in laser processing. The number of movements of the second driving module 120 is updated to achieve real-time updating of the number of movements of the second driving module 120 until the updated number of movements reaches the preset number, thereby completing the equidistant drilling process of the product to be processed.

[0079] It should be noted that after updating the number of moves of the second drive module 120, this embodiment will compare the updated number of moves with the preset number again. If the updated number of moves still does not reach the preset number, the first drive module 110 will continue to move to drive the product to be processed to move along the first preset direction and receive the position parameters fed back by the first encoder. Then, according to the position parameters and the preset processing parameters, the laser module will continue to process the product processed in step S105. That is, steps S101 to S105 will be repeated until the updated number of moves reaches the preset number, and a target punched product with equidistant laser holes and uniform energy distribution will be obtained.

[0080] In some embodiments, after the number of updated moves reaches a preset number, the laser perforation system can be controlled to stop processing, and then the product with equidistant laser holes and uniform energy distribution can be removed.

[0081] Please refer to Figure 3 , Figure 3 This is a flowchart of a specific method of a laser perforation control method provided in another embodiment of this application. In some embodiments, the laser perforation control method includes, but is not limited to, steps S201 to S202.

[0082] It should be noted that steps S201 to S202 occur before the start command.

[0083] Step S201: Perform a zero-return check on the first drive module 110, the second drive module 120, and the third drive module 130.

[0084] Step S202: When the first drive module 110, the second drive module 120 and the third drive module 130 pass the zero-return check, the product to be processed is loaded onto the carrier component 200.

[0085] In steps S201 to S202 of some embodiments, before responding to the start command, the embodiments of this application will perform a zero-return check on the first drive module 110, the second drive module 120, and the third drive module 130 to determine whether the first drive module 110, the second drive module 120, and the third drive module 130 have completed the zero-return, that is, whether the first drive module 110, the second drive module 120, and the third drive module 130 have moved to their reference point or zero point, to prevent errors or accidents caused by inaccurate shaft positions. When the first drive module 110, the second drive module 120, and the third drive module 130 pass the zero-return check, it means that the three drive modules have moved to the designated position, and the product to be processed can be directly loaded onto the bearing component 200, thereby ensuring the positioning accuracy of the product to be processed in the future.

[0086] Please refer to Figure 4 , Figure 4 This is a flowchart of a specific method for step S102 provided in an embodiment of this application. In some embodiments, the method includes, but is not limited to, steps S301 to S302.

[0087] It should be noted that the laser module includes a pulse width modulation port.

[0088] Step S301: Generate a first pulse signal based on the first position parameter and the preset processing parameters.

[0089] In step S302, the first pulse signal is adjusted by the pulse width modulation port with a preset first duty cycle, and the laser module is triggered to emit laser according to the adjusted first pulse signal to perform laser perforation on the product to be processed.

[0090] In steps S301 to S302 of some embodiments, during the process of controlling the laser module to process the product to be processed according to the first position parameter and the preset processing parameters, the embodiments of this application first generate a first pulse signal according to the first position parameter and the preset processing parameters, that is, generate a first pulse signal according to the X-axis position parameter and the processing parameters. This facilitates the subsequent adjustment of the laser's output mode and energy distribution through the first pulse signal. Then, the first pulse signal is adjusted by the pulse width modulation port with a preset first duty cycle to adjust the duty cycle of the first pulse signal. This further adjusts the power output of the laser in the laser module, and triggers the laser in the laser module to emit light according to the adjusted first pulse signal to perform laser perforation on the product to be processed. Specifically, the laser emits light according to the high level state of the adjusted first pulse signal. The higher the duty cycle, the longer the laser emits light, achieving uniform perforation in the first preset direction and avoiding uneven energy distribution.

[0091] It should be noted that the processing parameters in this application embodiment include, but are not limited to, the hole spacing, the number of single-point pulses, and the high / low level holding time. The hole spacing determines the distance between two holes during laser processing; the number of single-point pulses refers to the number of pulses emitted by the laser at a single processing point; specifically, a higher number of single-point pulses means a longer laser module operation time at that point; and the high / low level holding time determines the length of time the laser module maintains a high or low level state. By adjusting the number of single-point pulses and the high / low level holding time, the energy input during processing can be optimized, the heat-affected zone reduced, and the processing quality improved.

[0092] Understandably, the duration of high and low level engagement directly affects the pulse width, which in turn is directly related to the duty cycle. At a given frequency, increasing the pulse width leads to an increase in the duty cycle because the high-level state lasts longer.

[0093] It is worth noting that, in the process of triggering the laser module to emit laser according to the adjusted first pulse signal, this embodiment of the application also ensures that the first pulse signal is synchronized with the position of the axis so as to trigger the laser at the correct machining point.

[0094] Please refer to Figure 5 , Figure 5 This is a flowchart of a specific method for controlling a laser module to reprocess a pre-processed product based on a second position parameter and processing parameters, according to an embodiment of this application. The method includes, but is not limited to, steps S401 to S402.

[0095] Step S401: Generate a second pulse signal based on the second position parameter and the preset processing parameters.

[0096] In step S402, the second pulse signal is adjusted by the pulse width modulation port with a preset second duty cycle, and the laser module is triggered to emit laser according to the adjusted second pulse signal to perform laser perforation on the product to be processed after preliminary processing.

[0097] In steps S401 to S402 of some embodiments, during the process of controlling the laser module to process the pre-processed product according to the second position parameter and the processing parameter, the embodiments of this application generate a second pulse signal according to the second position parameter and the preset processing parameter, that is, generate a second pulse signal according to the Y-axis position parameter and the processing parameter. This facilitates the subsequent adjustment of the laser's output mode and energy distribution through the second pulse signal. Then, the second pulse signal is adjusted by the pulse width modulation port with a preset second duty cycle so that the duty cycle of the second pulse signal matches the set value. The laser module is triggered to emit laser according to the adjusted second pulse signal to perform laser perforation on the pre-processed product, realizing equidistant laser energy output processing, further realizing uniform drilling in the second preset direction, avoiding uneven energy, and further avoiding energy accumulation caused by uneven energy in laser processing.

[0098] Please refer to Figure 6 , Figure 6 This is a flowchart of a specific method of a laser perforation control method provided in another embodiment of this application. In some embodiments, the laser perforation control method includes, but is not limited to, steps S501 to S502.

[0099] It should be noted that steps S501 to S502 occur after the number of moves of the second drive module 120 is counted.

[0100] Step S501: When the number of moves reaches the preset number, control the third drive module 130 to move to the preset safe position, control the first drive module 110 to move to the first waiting position, and control the second drive module 120 to move to the second waiting position.

[0101] Step S502: Control the bearing assembly 200 to stop the vacuuming operation.

[0102] In steps S501 to S502 of some embodiments, after counting the number of moves of the second drive module 120, when the number of moves reaches a preset number, it indicates that the laser perforation system has completed the processing of the product in the X-axis and Y-axis directions. At this time, the third drive module 130 is controlled to move to a preset safe position, that is, the Z-axis is moved to a preset position. The first drive module 110 is controlled to move to the first waiting position, and the second drive module 120 is controlled to move to the second waiting position, so that the first drive module 110, the second drive module 120 and the third drive module 130 are moved to different positions respectively to avoid accidental contact or collision, facilitate product unloading and machine tool maintenance. Then, the bearing component 200 is controlled to stop the vacuuming operation to facilitate subsequent manual material handling, improve production efficiency and ensure equipment safety.

[0103] It should be noted that the safe position in this embodiment refers to a preset position where the Z-axis is moved when the machine tool is not in operation, in order to protect the safety of the machine tool and the operator. This position is usually within the travel range of the machine tool, but far away from the working area, to avoid injury to the workpiece or the operator in the event of accidental start-up. The first and second waiting positions can be set according to the user's needs to facilitate the next processing operation and improve production efficiency.

[0104] It is understandable that when the number of moves reaches the preset number, the embodiments of this application will directly use the pre-processed product to be processed as the target product of the laser perforation process, that is, the final result of the laser perforation process.

[0105] Please refer to Figure 7 , Figure 7 This is a flowchart of a specific method of a laser perforation control method provided in another embodiment of this application. In some embodiments, the laser perforation control method includes, but is not limited to, steps S601 to S602.

[0106] It should be noted that steps S601 to S602 occur after the product to be processed is loaded onto the carrier component 200.

[0107] Step S601: Control the bearing assembly 200 to perform a vacuuming operation.

[0108] Step S602: Control the first drive module 110 to move to the first preset position, control the second drive module 120 to move to the second preset position, and control the third drive module 130 to move to the third preset position.

[0109] In steps S601 to S602 of some embodiments, after the product to be processed is loaded onto the support component 200, the present application embodiment controls the support component 200 to perform a vacuuming operation. Vacuuming can reduce the air layer between the workpiece and the support table, thereby improving the fixation stability of the workpiece, reducing vibration during processing, improving processing accuracy, and preventing the workpiece from deforming due to oxidation or thermal expansion, maintaining the original shape and size of the workpiece. Then, the first drive module 110 is controlled to move to the first preset position, the second drive module 120 is controlled to move to the second preset position, and the third drive module 130 is controlled to move to the third preset position, which facilitates the rapid processing of the product to be processed and improves the processing response speed and processing efficiency.

[0110] It should be noted that, in the embodiments of this application, the first preset position is the processing start position of the first driving module 110, the second preset position is the processing start position of the second driving module 120, and the third preset position is the focal position of the third driving module 130. The focal position refers to the optimal position for focusing the laser beam.

[0111] Please refer to Figure 8 , Figure 8 This is a flowchart of a specific method of a laser perforation control method provided in another embodiment of this application. In some embodiments, the laser perforation control method includes, but is not limited to, step S701.

[0112] It should be noted that step S701 occurs after the first drive module 110, the second drive module 120 and the third drive module 130 have undergone a zero-return check.

[0113] Step S701: If the first drive module 110, the second drive module 120 or the third drive module 130 fails the zero-return check, start the parameter return operation.

[0114] In step S701 of some embodiments, after performing a zero-return check on the first drive module 110, the second drive module 120, and the third drive module 130, if the first drive module 110, the second drive module 120, or the third drive module 130 fails the zero-return check, that is, if any one of the first drive module 110, the second drive module 120, and the third drive module 130 fails to move to the reference point or zero point, it indicates that the zero-return operation has not been completed. At this time, the laser drilling system will start a reference return operation to ensure that the machine tool axis can correctly return to the zero point, ensure the positioning accuracy of the product in the future, and avoid positional deviation.

[0115] Reference Figure 9 , Figure 9 This is a schematic diagram of the hardware structure of the controller provided in the embodiments of this application.

[0116] The following is combined Figure 9 The hardware structure of the controller is described in detail. The controller includes: a processor 910, a memory 920, an input / output interface 930, a communication interface 940, and a bus 950.

[0117] The processor 910 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to achieve the technical solutions provided in the embodiments of this application.

[0118] The memory 920 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 920 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 920 and is called and executed by the processor 910 using the laser perforation control method of the embodiments of this application.

[0119] The input / output interface 930 is used to implement information input and output;

[0120] The communication interface 940 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.); and the bus 950 is used to transmit information between the various components of the device (such as processor 910, memory 920, input / output interface 930 and communication interface 940).

[0121] The processor 910, memory 920, input / output interface 930 and communication interface 940 are connected to each other within the device via bus 950.

[0122] This application also provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a computer, the computer is used to perform the laser perforation control method as described in the above embodiments of this application.

[0123] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0124] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0125] It will be understood by those skilled in the art that Figures 1 to 9 The technical solutions shown do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0126] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0127] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0128] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0129] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0130] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0131] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0132] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0133] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a controller (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0134] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A laser perforation control method, characterized by, The application is applied to a laser perforating system, the laser perforating system comprises a first driving module, a second driving module and a laser module, the first driving module is provided with a first encoder, and the second driving module is provided with a second encoder; the method comprises the following steps: In response to a start instruction, the first driving module is controlled to move to drive a product to be processed to move along a first preset direction, and a first position parameter fed back by the first encoder is received, the first position parameter is used to represent a position of the first driving module; According to the first position parameter and a preset processing parameter, the laser module is controlled to perform preliminary processing on the product to be processed; The number of movements of the second driving module is counted; When the number of movements does not reach a preset number, the second driving module is controlled to move to drive the product to be processed after preliminary processing to move along a second preset direction, and a second position parameter fed back by the second encoder is received, the second position parameter is used to represent a position of the second driving module; According to the second position parameter and the processing parameter, the laser module is controlled to perform reprocessing on the product to be processed after preliminary processing, and the number of movements of the second driving module is updated until the updated number of movements reaches the preset number, and a target perforated product is obtained.

2. The laser perforation control method according to claim 1, characterized by, The laser perforating system further comprises a bearing assembly and a third driving module, and the bearing assembly is used to bear the product to be processed; Before the start instruction is responded to, the method further comprises the following steps: The first driving module, the second driving module and the third driving module are subjected to zero return inspection; When the first driving module, the second driving module and the third driving module pass the zero return inspection, the product to be processed is loaded onto the bearing assembly.

3. The laser perforation control method of claim 1, wherein, The laser module comprises a pulse width modulation port; according to the first position parameter and a preset processing parameter, the laser module is controlled to perform preliminary processing on the product to be processed, which comprises the following steps: A first pulse signal is generated according to the first position parameter and the preset processing parameter; The first pulse signal is adjusted at a preset first duty ratio through the pulse width modulation port, and the laser module is triggered to emit laser according to the adjusted first pulse signal, so as to perform laser perforation on the product to be processed.

4. The laser perforation control method of claim 1, wherein, The laser module comprises a pulse width modulation port; according to the second position parameter and the processing parameter, the laser module is controlled to perform reprocessing on the product to be processed after preliminary processing, which comprises the following steps: A second pulse signal is generated according to the second position parameter and the preset processing parameter; The second pulse signal is adjusted at a preset second duty ratio through the pulse width modulation port, and the laser module is triggered to emit laser according to the adjusted second pulse signal, so as to perform laser perforation on the product to be processed after preliminary processing.

5. The laser perforation control method of claim 2, wherein, After the number of movements of the second driving module is counted, the method further comprises the following steps: When the number of movements reaches a preset number, the third driving module is controlled to move to a preset safe position, the first driving module is controlled to move to a first material waiting position, and the second driving module is controlled to move to a second material waiting position; controlling the carrying assembly to stop the vacuumizing operation.

6. The laser perforation control method of claim 2, wherein, After the product to be processed is fed to the carrying assembly, the method further comprises: controlling the carrying assembly to perform the vacuumizing operation; controlling the first driving module to move to a first preset position, controlling the second driving module to move to a second preset position, and controlling the third driving module to move to a third preset position.

7. The laser perforation control method of claim 2, wherein, After the first driving module, the second driving module, and the third driving module are subjected to the zero-return inspection, the method further comprises: when the first driving module, the second driving module, or the third driving module fails to pass the zero-return inspection, starting a parameter-return operation.

8. A laser perforating system characterized by, comprise: a first driving module provided with a first encoder, the first driving module being configured to move along a first preset direction, and the first encoder being configured to feed back a position of the first driving module; a second driving module provided with a second encoder, the second driving module being configured to move along a second preset direction, and the second encoder being configured to feed back a position of the second driving module; a laser module configured to emit laser light; a controller configured to, in response to a starting instruction, control the first driving module to move to drive a product to be processed to move along a first preset direction, receive a first position parameter fed back by the first encoder, the first position parameter being configured to represent a position of the first driving module, control the laser module to perform preliminary processing on the product to be processed according to the first position parameter and a preset processing parameter, and count a number of movements of the second driving module; and further configured to, when the number of movements does not reach a preset number, control the second driving module to move to drive the preliminarily processed product to move along a second preset direction, receive a second position parameter fed back by the second encoder, the second position parameter being configured to represent a position of the second driving module, control the laser module to perform reprocessing on the preliminarily processed product according to the second position parameter and the processing parameter, and update the number of movements of the second driving module until the updated number of movements reaches the preset number, to obtain a target perforated product.

9. The laser perforating system of claim 8, wherein, further comprise a carrying assembly and a third driving module, the carrying assembly being configured to carry the product to be processed, and the third driving module being configured to move along a third preset direction.

10. A storage medium, characterized by The storage medium is a computer-readable storage medium, and the computer-readable storage medium stores a computer program, when the computer program is executed by a computer, the computer is configured to execute the laser perforation control method according to any one of claims 1 to 7. The storage medium is a computer-readable storage medium, and the computer-readable storage medium stores a computer program, when the computer program is executed by a computer, the computer is configured to execute the laser perforation control method according to any one of claims 1 to 7.

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