Instrument panel mold with built-in cooling component

Abstract

The invention relates to the related technical field of mold machining, in particular to an instrument panel mold with a built-in cooling component, which comprises an upper mold frame, a lower mold frame, a guide assembly, an upper mold base, an upper mold core, a lower mold base, a lower mold core, a forming cavity and the cooling component, and the cooling component comprises a heat conduction component and a cooling circulation pipeline arranged on the periphery of the heat conduction component. According to the instrument panel mold with the built-in cooling component, the upper mold core is detachably connected with the upper mold base, and the lower mold core is detachably connected with the lower mold base, so that the upper mold core and the lower mold core are conveniently replaced according to actual use requirements, and the use flexibility of the instrument panel mold is effectively improved; the heat conduction assembly in the cooling component facilitates adsorption of condensate water in the heat dissipation process, and therefore the situation that the condensate water is deposited on the periphery of the cooling circulation pipeline due to temperature difference when the cooling circulation pipeline makes contact between the upper mold core and the forming cavity is effectively avoided.

Description

Technical Field

[0001] The invention relates to the technical field related to mold processing, and in particular to an instrument panel mold with a built-in cooling component. Background Art

[0002] Automobile dashboard molds are special tools used to manufacture the interior dashboard of automobiles (i.e., instrument panels). Since automobile dashboards are usually made of plastic materials through injection molding, their mold design and cooling system have specific requirements and challenges. Mold cooling is a key step in injection molding, die casting, and other manufacturing processes.

[0003] Publication number CN102814484B The present invention provides a mold cooling device that stabilizes the flow of cooling water flowing in a cooling path in a mold. The mold cooling device of the present invention distributes cooling water for cooling the mold and supplies it to a plurality of cooling paths (2a to 2e) formed inside a mold (2), respectively, so that the cooling water flowing in each cooling path (2a to 2e) is discharged to the outside of the mold (2) via a discharge pipe (6a to 6e) connected to each cooling path (2a to 2e). The cooling device is configured such that a cooling water suction device (9) is provided in one of the discharge pipes (6a to 6e) for suctioning the cooling water flowing in the cooling path (2a) by using the negative pressure generated by the injection of a driving gas.

[0004] Due to its own design features, the mold cooling device in the above technology realizes cooling of the mold by circulating cooling water in the cooling path. However, due to the change in temperature difference at the contact point of the cooling water with the molding cavity, condensed water is easily deposited on the pipe of the cooling path, thereby reducing the cooling effect of the cooling path on the mold. Summary of the invention

[0005] The present invention solves the problems in the related art and proposes an instrument panel mold with a built-in cooling component, which is intended to solve the technical problem that the current mold cooling device, due to its own design characteristics, realizes cooling of the mold by circulating cooling water in the cooling path. However, due to the change in temperature difference at the contact point of the cooling water with the molding cavity, condensed water is easily deposited on the pipe of the cooling path, thereby reducing the effect of the cooling path on cooling the mold.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions: a dashboard mold with a built-in cooling component, including an upper mold frame, a lower mold frame arranged on the lower end surface of the upper mold frame, a guide assembly arranged between the upper mold frame and the lower mold frame, an upper mold base fixedly connected to the upper mold frame, an upper mold core connected to the upper mold base, a lower mold base fixedly connected to the lower mold frame, a lower mold core connected to the lower mold base, a molding cavity arranged on the lower mold core relative to the upper mold core, and a cooling component arranged in the lower mold base, the cooling component including a heat-conducting component and a cooling circulation pipe arranged around the outer periphery of the heat-conducting component.

[0007] By adopting the above technical scheme, the upper mold core and the upper mold base are detachably connected, and the lower mold core and the lower mold base are detachably connected, which is convenient for replacing the upper mold core and the lower mold core according to actual usage requirements, effectively improving the flexibility of use of the present invention. The heat conduction component in the cooling component is convenient for adsorbing condensed water caused in the heat dissipation process, thereby effectively avoiding the deposition of condensed water on the periphery of the cooling circulation pipeline due to the temperature difference when the cooling circulation pipeline contacts between the upper mold core and the molding cavity.

[0008] As a preferred solution, the upper mold core and the upper mold base are detachably connected by fixing screws, and the lower mold core and the lower mold base are also detachably connected by fixing screws. The fixing screws pass through the upper mold core and the lower mold core and are respectively connected to the upper mold frame and the lower mold frame, and the fixing screws are configured to be embedded.

[0009] By adopting the above technical solution, it is convenient to replace the upper mold core and the lower mold core according to actual usage requirements, which effectively improves the flexibility of use of the present invention. The fixing screws are set to be embedded, avoiding position interference between the upper mold core and the molding cavity during mold molding.

[0010] As a preferred embodiment, the guide assembly includes guide sleeves fixedly arranged at the four corners of the lower end surface of the upper mold frame, guide columns fixedly arranged at the four corners of the upper end surface of the lower mold frame, balls evenly arranged on the outer circumference of the guide columns, and guide grooves arranged on the inner wall of the guide sleeves and adapted to the balls, the balls are rollingly connected to the guide columns, and the balls are arranged as steel balls, and there is a contact surface between the balls and the guide grooves.

[0011] By adopting the above technical solution, the contact surface between the guide sleeve and the guide column is effectively reduced, thereby effectively ensuring the stability of the mutual sliding between the guide column and the guide sleeve. The guide groove is arranged in the height direction of the guide column, which facilitates the guide groove to guide the moving direction of the ball.

[0012] As a preferred embodiment, the heat-conducting component includes a through heat dissipation hole arranged on the lower mold base relative to the molding cavity, a heat dissipation plate arranged in the middle of the inner cavity of the heat dissipation hole, a heat-conducting ring arranged on the outer periphery of the heat dissipation plate, and a heat dissipation fan arranged on the lower end surface of the inner cavity of the heat dissipation hole. The heat dissipation plate is composed of a plurality of interconnected heat-conducting fins, and each of the heat-conducting fins is circumferentially arranged with the center of the heat dissipation hole as the center point.

[0013] By adopting the above technical solution, the heat-conducting fins facilitate the transfer of heat from the inner cavity of the molding cavity to the heat-conducting ring, and the heat-conducting ring is set to be heat-conducting silicone. The heat-conducting silicone has good thermal conductivity, thereby facilitating the heat-conducting silicone to transfer heat to the cooling circulation pipeline.

[0014] As a preferred solution, an adsorbent is arranged on the periphery of the heat-conducting ring, and the adsorbent is made of sponge material.

[0015] By adopting the above technical solution, the adsorption body can easily adsorb the condensed water between the heat conductive ring and the cooling circulation pipe, thereby effectively avoiding the condensed water from being deposited on the periphery of the cooling circulation pipe due to the temperature difference when the cooling circulation pipe contacts the upper mold core and the molding cavity.

[0016] As a preferred solution, a mounting hole is provided in the middle of the upper end surface of the heat conducting plate, a fixing pin is provided on the lower end surface of the heat conducting plate, a mounting groove matching the fixing pin is provided in the heat dissipation hole, and the fixing pin and the mounting groove are connected by a snap-fit ​​or threaded structure.

[0017] By adopting the above technical solution, the complementary effects between the fixing pin and the mounting groove make it convenient for the staff to rotate the heat sink through the mounting hole, thereby facilitating the rapid disassembly and assembly of the heat sink, and further facilitating the maintenance of the heat sink, thereby ensuring the heat dissipation efficiency of the heat sink.

[0018] As a preferred solution, the air inlet end of the heat dissipation fan passes through the lower mold base, and the air outlet end of the heat dissipation fan is arranged relative to the lower mold core.

[0019] By adopting the above technical solution, the heat dissipation fan is convenient for diffusing the hot air in the molding cavity, thereby effectively ensuring the cooling effect of the cooling circulation pipeline on the molding cavity.

[0020] As a preferred embodiment, it also includes an oil injection piece arranged in the inner cavity of the guide sleeve, the oil injection piece includes an oil injection pipeline circumferentially arranged with the center of the guide sleeve as the center point, an oil injection port that passes through the guide sleeve and is connected to the oil injection pipeline, and oil injection branch pipes evenly arranged on the lower end surface of the oil injection pipeline, and the oil injection branch pipes respectively correspond to the guide grooves.

[0021] By adopting the above technical solution, the oil filling port facilitates the injection of lubricating oil into the oil filling pipe, and the lubricating oil flows into the corresponding guide groove through the oil filling branch pipe. When the ball rolls in the guide groove, the ball is fully in contact with the lubricating oil, thereby effectively ensuring the stability of the ball rolling in the guide groove.

[0022] As a preferred embodiment, a buffer assembly is further included between the upper die core and the upper die base, wherein the buffer assembly includes a buffer plate slidably connected to the upper die core, buffer columns respectively arranged on both sides of the buffer plate, and a buffer spring arranged on the periphery of the buffer column.

[0023] As a preferred solution, the buffer plate and the buffer column are fixedly connected to each other, and the other end of the buffer column is fixedly connected to the upper mold base.

[0024] By adopting the above technical solution, the buffer column facilitates connecting the buffer plate with the upper die seat.

[0025] As a preferred solution, one end of the buffer spring is fixedly connected to the upper die base, and the other end of the buffer spring is fixedly connected to the buffer plate.

[0026] By adopting the above technical solution, the buffer spring can easily buffer the instantaneous impact force when the upper die core contacts the forming cavity, thereby effectively avoiding the impact force of the upper die core on the forming cavity during the forming process.

[0027] Compared with the prior art, the present invention has the following advantages: 1. The upper die core and the upper die base are detachably connected, and the lower die core and the lower die base are detachably connected, so that the upper die core and the lower die core can be replaced according to actual use requirements, which effectively improves the use flexibility of the present invention; 2. The heat-conducting components in the cooling member facilitate the adsorption of condensed water caused during the heat dissipation process, thereby effectively preventing the condensed water from being deposited on the periphery of the cooling circulation pipeline due to the temperature difference when the cooling circulation pipeline contacts between the upper mold core and the molding cavity; 3. In order to ensure the lubrication between the ball and the guide groove, an oil injection piece is also included in the inner cavity of the guide sleeve, and the oil injection piece includes an oil injection pipe, an oil injection port and an oil injection branch pipe. The oil injection branch pipes correspond to the guide grooves respectively. The oil injection port facilitates the injection of lubricating oil into the oil injection pipe, and the lubricating oil flows into the corresponding guide groove through the oil injection branch pipe. When the ball rolls in the guide groove, the ball is fully in contact with the lubricating oil, thereby effectively ensuring the rolling stability of the ball in the guide groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the instrument panel mold with a built-in cooling component of the present invention; Figure 2 It is a structural schematic diagram of a partial half-section view of the overall structure of the instrument panel mold with a built-in cooling component of the present invention; Figure 3 The instrument panel mold with built-in cooling member of the present invention Figure 2 A structural schematic diagram of a front view of FIG. Figure 4 It is a structural schematic diagram of a lower die seat in a dashboard die with a built-in cooling member according to the present invention; Figure 5 It is a structural schematic diagram of a heat-conducting component in a dashboard mold with a built-in cooling component of the present invention; Figure 6 It is a position relationship diagram of the guide sleeve and the guide column in the instrument panel mold with built-in cooling member of the present invention; Figure 7 It is a structural schematic diagram of an oil guide pipe in an instrument panel mold with a built-in cooling component of the present invention.

[0029] In the figure: 11. Upper mold frame; 12. Lower mold frame; 21. Guide sleeve; 211. Guide slide groove; 22. Guide column; 221. Ball; 31. Upper mold base; 32. Upper mold core; 41. Lower mold base; 42. Lower mold core; 421. Molding cavity; 5. Heat-conducting component; 51. Heat-conducting fin; 511. Mounting hole; 512. Fixed pin; 52. Heat-conducting ring; 521. Limiting groove; 53. Cooling circulation pipeline; 6. Cooling fan; 71. Buffer plate; 72. Buffer column; 721. Buffer spring; 8. Oil filling part; 81. Oil filling pipeline; 811. Oil filling branch pipe; 812. Oil filling port. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0032] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0033] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the devices or elements referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0034] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0035] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0036] like Figures 1 to 7 As shown, a dashboard mold with a built-in cooling member includes an upper mold frame 11, a lower mold frame 12 arranged on the lower end surface of the upper mold frame 11, a guide assembly arranged between the upper mold frame 11 and the lower mold frame 12, an upper mold base 31 fixedly connected to the upper mold frame 11, an upper mold core 32 connected to the upper mold base 31, a lower mold base 41 fixedly connected to the lower mold frame 12, a lower mold core 42 connected to the lower mold base 41, a molding cavity 421 arranged on the lower mold core 42 relative to the upper mold core 32, and a cooling member arranged in the lower mold base 41, wherein the cooling member includes a heat conducting member 5, an upper mold core 32 arranged on the lower mold core 42, and a lower mold core 42 arranged on the lower mold core 42. The cooling circulation pipe 53 on the periphery of the heat-conducting component 5, in the present invention, the upper mold core 32 and the upper mold base 31 are detachably connected, and the lower mold core 42 and the lower mold base 41 are detachably connected, which is convenient for replacing the upper mold core 32 and the lower mold core 42 according to actual usage requirements, effectively improving the flexibility of use of the present invention, and the heat-conducting component in the cooling component is convenient for adsorbing condensed water caused in the heat dissipation process, thereby effectively avoiding the condensed water caused by the temperature difference when the cooling circulation pipe 53 contacts between the upper mold core 32 and the molding cavity 421. Deposition on the periphery of the cooling circulation pipe 53.

[0037] For details, please refer to Figure 1 , Figure 2 and Figure 3 , including an upper mold frame 11, a lower mold frame 12 arranged on the lower end surface of the upper mold frame 11, an upper mold base 31 fixedly connected to the upper mold base 31, an upper mold core 32 connected to the upper mold base 31, a lower mold base 41 fixedly connected to the lower mold frame 12, and a lower mold core 42 connected to the lower mold base 41, the upper mold core 32 and the upper mold base 31 are detachably connected by fixing screws, and the lower mold core 42 and the lower mold base 41 are also detachably connected by fixing screws, the fixing screws pass through the upper mold core 32 and the lower mold core 42 and are respectively connected to the upper mold frame 11 and the lower mold frame 12, and the fixing screws are arranged to be embedded, so that it is convenient to replace the upper mold core 32 and the lower mold core 42 according to actual use requirements, which effectively improves the use flexibility of the present invention, and the fixing screws are arranged to be embedded, which avoids position interference between the upper mold core 32 and the molding cavity 421 during mold molding.

[0038] For details, please refer to Figure 1 , Figure 2 and Figure 7, a guide assembly is arranged between the upper mold frame 11 and the lower mold frame 12, and the guide assembly includes a guide sleeve 21 fixedly arranged at the four corners of the lower end surface of the upper mold frame 11, a guide column 22 fixedly arranged at the four corners of the upper end surface of the lower mold frame 12, balls 221 evenly arranged on the outer periphery of the guide column 22, and a guide groove 211 arranged on the inner wall of the guide sleeve 21 and adapted to the ball 221. The ball 221 is rollingly connected with the guide column 22, and the ball 221 is set as a steel ball. The contact surface between the ball 221 and the guide groove 211 effectively reduces the contact surface between the guide sleeve 21 and the guide column, thereby effectively ensuring the stability of the mutual sliding between the guide column 22 and the guide sleeve 21. The guide groove 211 is set in the height direction of the guide column 22, so that the guide groove 211 can guide the moving direction of the ball 221.

[0039] For details, please refer to Figure 2 , Figure 3 and Figure 4 , a molding cavity 421 arranged on the lower mold core 42 relative to the upper mold core 32 and a cooling member arranged in the lower mold base 41, the cooling member includes a heat-conducting member 5, a cooling circulation pipe 53 arranged on the periphery of the heat-conducting member 5, the heat-conducting member 5 includes a penetrating heat dissipation hole arranged on the lower mold base 41 relative to the molding cavity 421, a heat dissipation plate arranged in the middle of the heat dissipation hole cavity, a heat-conducting ring 52 arranged on the periphery of the heat dissipation plate, and a heat dissipation fan 6 arranged on the lower end surface of the heat dissipation hole cavity, the heat dissipation plate is composed of a plurality of interconnected heat-conducting fins 51, and each heat-conducting fin 51 is centered around the center of the heat dissipation hole. The heat-conducting fins 51 are arranged to transfer the heat of the inner cavity of the molding cavity 421 to the heat-conducting ring 52. The heat-conducting ring 52 is arranged to be heat-conducting silicone. The heat-conducting silicone has good thermal conductivity, so that the heat-conducting silicone transfers the heat to the cooling circulation pipe 53. The periphery of the heat-conducting ring 52 is provided with an adsorbent. The adsorbent is arranged to be made of sponge material, so that the adsorbent can adsorb the condensed water between the heat-conducting ring 52 and the cooling circulation pipe 53, thereby effectively avoiding the condensed water caused by the temperature difference when the cooling circulation pipe 53 contacts between the upper mold core 32 and the molding cavity 421. Deposition on the periphery of the cooling circulation pipe 53.

[0040] For details, please refer to Figure 5 and Figure 6In order to facilitate the sliding of the heat sink, a mounting hole 511 is provided in the middle of the upper end surface of the heat conducting plate, and a fixing pin 512 is provided on the lower end surface of the heat conducting plate. A mounting groove matched with the fixing pin 512 is provided in the heat dissipation hole, and the fixing pin 512 is connected to the mounting groove by a snap connection or a threaded structure. The fixing pin 512 and the mounting groove complement each other, which makes it easy for the staff to rotate the heat sink through the mounting hole 511, thereby facilitating the rapid disassembly and assembly of the heat sink, and then facilitating the maintenance of the heat sink, thereby ensuring the heat dissipation efficiency of the heat sink.

[0041] For details, please refer to Figure 3 The air inlet end of the heat dissipation fan 6 passes through the lower mold base 41, and the air outlet end of the heat dissipation fan 6 is arranged relative to the lower mold core 42. The heat dissipation fan 6 is convenient for diffusing the hot air in the molding cavity 421, thereby effectively ensuring the cooling effect of the cooling circulation pipeline 53 on the molding cavity 421.

[0042] For details, please refer to Figure 7 In order to ensure the lubrication between the ball 221 and the guide groove 211, an oil injection piece 8 is also included in the inner cavity of the guide sleeve 21. The oil injection piece 8 includes an oil injection pipeline 81 circumferentially arranged with the center of the guide sleeve 21 as the center point, an oil injection port 812 that runs through the guide sleeve 21 and is connected to the oil injection pipeline 81, and oil injection branches 811 that are evenly arranged on the lower end surface of the oil injection pipeline 81. The oil injection branches 811 correspond to the guide grooves 211 respectively. The oil injection port 812 facilitates the injection of lubricating oil into the oil injection pipeline 81, and the lubricating oil flows into the corresponding guide grooves 211 through the oil injection branches 811. When the ball 221 rolls in the guide groove 211, the ball 221 is fully in contact with the lubricating oil, thereby effectively ensuring the rolling stability of the ball 221 in the guide groove 211.

[0043] For details, please refer to Figure 2 In order to reduce the impact force of the upper mold core 32 on the molding cavity 421 during the molding process, it also includes a buffer assembly arranged between the upper mold core 32 and the upper mold base 31, the buffer assembly includes a buffer plate 71 slidably connected to the upper mold core 32, buffer columns 72 respectively arranged on both sides of the buffer plate 71, and a buffer spring 721 arranged on the outer periphery of the buffer column 72, the buffer plate 71 and the buffer column 72 are fixedly connected to each other, and the other end of the buffer column 72 is fixedly connected to the upper mold base 31, the buffer column 72 is convenient for connecting the buffer plate 71 with the upper mold base 31, one end of the buffer spring 721 is fixedly connected to the upper mold base 31, and the other end of the buffer spring 721 is fixedly connected to the buffer plate 71, and the buffer spring 721 is convenient for buffering the instantaneous impact force when the upper mold core 32 contacts the molding cavity 421, thereby effectively avoiding the impact force of the upper mold core 32 on the molding cavity 421 during the molding process.

[0044] In this embodiment, the heat-conducting fins 51 facilitate the transfer of heat from the inner cavity of the molding cavity 421 to the heat-conducting ring 52, thereby facilitating the heat-conducting ring 52 made of heat-conducting silicone to transfer heat to the cooling circulation pipe 53. An adsorbent is arranged on the periphery of the heat-conducting ring 52, and the adsorbent is arranged on a sponge material, so that the adsorbent can adsorb condensed water between the heat-conducting ring 52 and the cooling circulation pipe 53, thereby effectively avoiding the deposition of condensed water on the periphery of the cooling circulation pipe 53 due to the temperature difference when the cooling circulation pipe 53 contacts the molding cavity 421 between the upper mold core 32 and the molding cavity 421. The heat dissipation fan 6 facilitates the diffusion of hot air in the molding cavity 421, thereby effectively ensuring the cooling effect of the cooling circulation pipe 53 on the molding cavity 421.

[0045] The above are preferred implementation modes of the present invention. Those skilled in the art to which the present invention belongs can also change and modify the above implementation modes. Therefore, the present invention is not limited to the above specific implementation modes. Any obvious improvements, substitutions or modifications made by those skilled in the art on the basis of the present invention belong to the protection scope of the present invention.

Claims

1. An instrument panel mold with a built-in cooling member, characterized in that: The invention comprises an upper mold frame (11), a lower mold frame (12) arranged on the lower end surface of the upper mold frame (11), a guide assembly arranged between the upper mold frame (11) and the lower mold frame (12), an upper mold base (31) fixedly connected to the upper mold frame (11), an upper mold core (32) connected to the upper mold base (31), a lower mold base (41) fixedly connected to the lower mold frame (12), a lower mold core (42) connected to the lower mold base (41), a molding cavity (421) arranged on the lower mold core (42) relative to the upper mold core (32), and a cooling component arranged in the lower mold base (41); The cooling component comprises a heat-conducting component (5) and a cooling circulation pipe (53) arranged on the periphery of the heat-conducting component (5).

2. The instrument panel mold with a built-in cooling member according to claim 1, characterized in that: The upper die core (32) and the upper die base (31) are detachably connected via fixing screws, and the lower die core (42) and the lower die base (41) are also detachably connected via fixing screws. The fixing screws penetrate the upper die core (32) and the lower die core (42) and are respectively connected to the upper die frame (11) and the lower die frame (12), and the fixing screws are arranged to be embedded.

3. The instrument panel mold with a built-in cooling member according to claim 1, characterized in that: The guide assembly comprises a guide sleeve (21) fixedly arranged at the four corners of the lower end surface of the upper mold frame (11), a guide column (22) fixedly arranged at the four corners of the upper end surface of the lower mold frame (12), balls (221) uniformly arranged on the outer periphery of the guide column (22), and a guide groove (211) arranged on the inner wall of the guide sleeve (21) and matched with the balls (221), the balls (221) are rollingly connected to the guide column (22), and the balls (221) are set as steel balls.

4. The instrument panel mold with built-in cooling member according to claim 3, characterized in that: The heat-conducting component (5) comprises a penetrating heat-dissipating hole arranged on the lower mold base (41) relative to the molding cavity (421), a heat-dissipating plate arranged in the middle of the inner cavity of the heat-dissipating hole, a heat-conducting ring (52) arranged on the periphery of the heat-dissipating plate, and a heat-dissipating fan (6) arranged on the lower end surface of the inner cavity of the heat-dissipating hole.

5. The instrument panel mold with built-in cooling member according to claim 3, characterized in that: The heat dissipation plate is composed of a plurality of heat-conducting fins (51) connected to each other, and each of the heat-conducting fins (51) is arranged circumferentially with the center of the heat dissipation hole as the center point.

6. The instrument panel mold with built-in cooling member according to claim 2, characterized in that: The heat-conducting ring (52) is configured as heat-conducting silica gel, and an adsorbent is provided on the periphery of the heat-conducting ring (52), and the adsorbent is configured as a sponge material.

7. The instrument panel mold with built-in cooling member according to claim 6, characterized in that: It also includes an oil injection piece (8) arranged in the inner cavity of the guide sleeve (21), the oil injection piece (8) including an oil injection pipeline (81) arranged circumferentially with the center of the guide sleeve (21) as the center point, an oil injection port (812) penetrating the guide sleeve (21) and connected to the oil injection pipeline (81), and oil injection branch pipes (811) evenly arranged on the lower end surface of the oil injection pipeline (81), and the oil injection branch pipes (811) respectively correspond to the guide slide grooves (211).

8. The instrument panel mold with built-in cooling member according to claim 7, characterized in that: It also includes a buffer component arranged between the upper die core (32) and the upper die base (31), the buffer component including a buffer plate (71) slidably connected to the upper die core (32), buffer columns (72) respectively arranged on both sides of the buffer plate (71), and a buffer spring (721) arranged on the periphery of the buffer column (72).

9. The instrument panel mold with built-in cooling member according to claim 8, characterized in that: The buffer plate (71) and the buffer column (72) are fixedly connected to each other, and the other end of the buffer column (72) is fixedly connected to the upper die base (31). The buffer column (72) facilitates the connection of the buffer plate (71) and the upper die base (31).

10. The instrument panel mold with built-in cooling member according to claim 9, characterized in that: One end of the buffer spring (721) is fixedly connected to the upper die seat (31), and the other end of the buffer spring (721) is fixedly connected to the buffer plate (71).

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