A process and sputtering fixture for improving the sputtering deformation of stainless steel components in semiconductor equipment

Abstract

This invention belongs to the field of electroplating technology and discloses a process and electroplating fixture for improving the electroplating deformation of stainless steel components in semiconductor equipment. The process includes: pre-electroplating treatment, including sandblasting and protection; two electroplating treatments of the stainless steel component at a low current of less than 150A, with cooling water used for cooling; removal of protection and data measurement; high-pressure water washing, ultrasonic cleaning, and drying. This invention replaces the traditional high-current single electroplating with low-current double electroplating, ensuring surface roughness while reducing the current. It also optimizes the electroplating fixture by using water circulation to lower the surface temperature of the component, preventing deformation. The component can be reused by the customer, significantly reducing costs.

Description

Technical Field

[0001] This invention belongs to the field of electroplating technology, specifically a process and electroplating fixture for improving the electroplating deformation of stainless steel components in semiconductor equipment. Background Technology

[0002] Semiconductor equipment manufacturing is a highly precise field, in which stainless steel components are widely used due to their excellent corrosion resistance, mechanical strength, and thermal stability. However, during the melt spraying process, stainless steel components are prone to deformation due to high temperatures and the impact of the melt spraying material, thus affecting the overall performance and precision of the equipment. Therefore, developing a process and fixture that can effectively control melt spraying deformation is particularly important.

[0003] Thermal spraying is a type of thermal spraying technology that involves spraying molten material at high speed onto the surface of a substrate to form a coating with specific properties. This technology is commonly used in semiconductor device manufacturing to strengthen and modify the surface of stainless steel components, improving their wear resistance, corrosion resistance, and high-temperature resistance. However, the high temperatures and impact forces generated during thermal spraying often lead to component deformation.

[0004] This semiconductor equipment component is used in mainstream semiconductor factories and is an indispensable part of chip manufacturing. Mainly after the PVD cavity PM, this stainless steel component is used as a wafer to verify whether the various parameters of the equipment are stable. After the existing melt spraying process, the component will deform. Once the flatness of the component is not good, it will detach during operation due to poor adhesion with the suction cup, and then it will not be able to be used normally.

[0005] However, existing spraying processes cannot simultaneously meet the requirements of low spraying temperature and high surface roughness. In addition, the functions of spraying equipment are not perfect, and the stainless steel component is an indispensable part in semiconductor physical vapor deposition equipment, which is expensive and has high replacement costs. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a process for improving the deformation of stainless steel components in semiconductor equipment during the welding process. The improvement involves two aspects: first, reducing the welding current, as a lower current results in a lower welding temperature; second, adding a water-cooling fixture, where circulating water continuously removes heat from the component surface, keeping the component at a consistently low temperature. Both methods ensure a low surface temperature, preventing changes to the component's morphology, i.e., maintaining its flatness after welding, allowing for reuse. Before reducing the current, the component became severely deformed and unusable after approximately 20 cleaning cycles. After reducing the current, the number of cleaning cycles can reach approximately 60, and the component remains in normal use. Ultimately, the number of cleaning cycles exceeds 60.

[0007] To achieve the above objectives, the technical solution of the invention is as follows:

[0008] A process for improving the deformation of stainless steel components in semiconductor equipment during melt spraying includes the following steps:

[0009] (1) Pretreatment before melt spraying, including sandblasting and protection;

[0010] (2) Spraying: The stainless steel parts are sprayed twice with a low current of less than 150A, and then cooled with cooling water.

[0011] (3) Remove protection and data measurement;

[0012] (4) After high-pressure water washing and ultrasonic cleaning, it is dried.

[0013] Furthermore, the temperature of the melt spraying in step (2) is below 60°C.

[0014] Furthermore, the roughness of the melt spray in step (2) is Ra: 20-60 μm.

[0015] Furthermore, in step (2), the number of fusion sprays is 2 to 4, the air pressure is 60 to 80 psi, and the speed of the fusion gun is 350 to 700.

[0016] Furthermore, in step (2), the first pass of the molten spraying is to lay the base layer. A low current of less than 130A is used to molten spray the component once to create a molten layer on the component with a roughness of 10-15μm. When molten spraying for the second time, the current is controlled within 150A.

[0017] Furthermore, in step (1), the sandblasting material used is aluminum oxide sand.

[0018] Furthermore, the water used for high-pressure water washing in step (4) is ultrapure water with a resistivity greater than or equal to 15 MΩ·cm.

[0019] Furthermore, in step (4), the drying equipment is a dust-free drying oven, and the drying time is greater than 4 hours.

[0020] A spraying fixture for improving the spraying deformation of stainless steel components in semiconductor equipment is disclosed. The fixture mainly consists of a cooling tray and cooling pipes. The cooling tray is designed with slots for placing the cooling pipes, which are evenly coiled within the tray, on which the component is then placed. The cooling pipes have inlet and outlet ends. During component spraying, cooling water flows through the cooling pipes to continuously reduce the surface temperature of the component, thereby preventing deformation. The number of slots in this fixture is not limited; the primary purpose is to facilitate handling. The number of slots can be adjusted according to usage habits. Furthermore, regarding the shape of the cooling tray, it can be designed to correspond to the shape of the product, without any shape restrictions.

[0021] The advantages of this invention compared to the prior art are:

[0022] This invention provides a process to improve the deformation of stainless steel components in semiconductor equipment by replacing the traditional high-current single-stage spraying with a low-current double-stage spraying. This process ensures surface roughness while reducing current. Additionally, the spraying fixture is optimized, and water circulation is used to lower the surface temperature of the component, preventing deformation. The component can be reused by the customer, significantly reducing costs. Attached Figure Description

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0024] Figure 1 This is a diagram showing the effect of a single spraying process and a partial view.

[0025] Figure 2 These are images showing the secondary spraying effect and a partial view.

[0026] Figure 3 This is a schematic diagram of the structure of the lamination fixture;

[0027] Figure 4 This is a schematic diagram of the combined structure of the spraying fixture.

[0028] In the diagram: 1. Cooling tray; 2. Cooling pipe; 3. Water inlet; 4. Water outlet; 5. Groove. Detailed Implementation

[0029] The present invention is described in detail below through specific embodiments, but this does not limit the scope of protection of the present invention. Unless otherwise specified, the experimental methods used in the present invention are all conventional methods, and the experimental equipment, materials, reagents, etc. used can all be obtained commercially.

[0030] Example 1

[0031] This invention mainly relates to a process for improving the deformation of stainless steel components in semiconductor equipment during melt spraying, which includes the following steps:

[0032] (1) Receiving inspection: Print out the engineering sheet and compare it with the information in the sheet. The main tasks are to count the number of parts, check the material of the parts, and check whether there are any abnormalities such as cracks or missing corners in the appearance.

[0033] (2) Decoction: The parts are decoctioned, washed and dried.

[0034] (3) Sandblasting: The stainless steel parts after the film is removed are sandblasted. The surface of the parts is pre-treated to make a certain roughness in order to improve the bonding force of the fusion spray.

[0035] (4) Protection: The areas of stainless steel parts where molten spraying is not allowed are shielded to prevent splashing onto the molten layer.

[0036] (5) Spraying: The stainless steel parts are sprayed. The traditional high-current single spraying is changed to low-current double spraying. While ensuring the roughness, the current is reduced. At the same time, the improved spraying fixture is used to reduce the spraying temperature and avoid deformation of the parts.

[0037] If a roughness requirement of Ra30-60μm is required, the traditional method requires a current of at least 200A to achieve the roughness requirement; however, the low current mentioned in this invention can achieve the Ra30-60μm roughness requirement within 150A. Multiple batches of parts have been verified, and 150A does not cause deformation of the parts. While ensuring the roughness, the current is reduced to avoid part deformation. At the same time, with the improved spraying fixture, the spraying temperature is reduced (the temperature can reach 150℃ before the current is reduced, and the temperature can reach 60℃ after the current is reduced).

[0038] Technical challenges: High surface roughness generally requires high current to achieve the required roughness, but high current will cause the parts to deform, so low current is required. Low current needs to be matched with the number of spraying cycles, air pressure, and the speed of the spray gun needs to be adjusted accordingly.

[0039] The surface roughness is Ra: 20-60μm, the number of fusion sprays is 2 to 4, the air pressure is controlled at 60 to 80psi, and the fusion gun speed is 350 to 700. These can be adjusted according to the specific surface roughness requirements.

[0040] Traditional spraying methods achieve high surface roughness by increasing the current, but high current leads to high temperatures, which can cause deformation of stainless steel parts, rendering them unusable. This invention breaks with this traditional approach, utilizing a "1+1" method—a layered spraying technique—such as... Figure 1 As shown: The first pass is a primer coat, which involves applying a low current to the component to create a molten layer with a surface roughness of approximately 10-15 μm. The current is controlled below 130A. Figure 2 During the second re-spraying, adjustments can be made based on the roughness of the first spray, but the current needs to be controlled within 150A. If the roughness is low, adjustments can be made via air pressure or spraying speed. This superposition method can achieve high roughness requirements while reducing current and spraying temperature, preventing component deformation. Additionally, cooling water circulation can be added to the spraying fixture. Figure 3 As shown in Figure 4, the heat of the component is removed by the cold water circulation. During the component melting and spraying process, the water circulation continuously removes the heat from the surface of the component, keeping the component at a low temperature and effectively preventing the component from deforming.

[0041] (6) Remove protection: After the melting process is completed, remove the protection.

[0042] (7) Data measurement: After the melt spraying is completed, the flatness is measured and compared with the standard value. Qualified products are processed normally, while unqualified products must be reported and handled specially.

[0043] (8) High-pressure water washing: The stainless steel parts are subjected to high-pressure water washing to remove the molten ash and other dirt from the surface of the parts and ensure the cleanliness of the parts surface;

[0044] (9) Ultrasonic cleaning: The stainless steel parts are completely immersed in the ultrasonic tank for ultrasonic cleaning to remove smaller dust particles.

[0045] (10) Final drying: The parts undergo final drying for more than 4 hours;

[0046] (11) Final inspection: Check whether there are any abnormalities such as residual film or marks on the parts. If there are residual film or marks, they need to be processed again. If there are no abnormalities, they are confirmed as qualified products and shipped normally.

[0047] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A process for improving the deformation of stainless steel components in semiconductor equipment during melt spraying, characterized in that, Includes the following steps: (1) Pretreatment before melt spraying, including sandblasting and protection; (2) Spraying: The stainless steel parts are sprayed twice with a low current of less than 150A and cooled with cooling water. The first spraying is to lay the base layer and spray the parts with a low current of less than 130A to make a sprayed layer on the parts with a roughness of 10~15μm. When spraying for the second time, the current is controlled within 150A. (3) Deprotection and data measurement; (4) After high-pressure water washing and ultrasonic cleaning, the product is dried.

2. The process for improving the spray deformation of stainless steel components in semiconductor equipment according to claim 1, characterized in that, The temperature of the melt spraying in step (2) is below 60°C.

3. The process for improving the spray deformation of stainless steel components in semiconductor equipment according to claim 1, characterized in that, Step (2) The roughness of the melt spray is Ra: 20-60μm.

4. The process for improving the spray deformation of stainless steel components in semiconductor equipment according to claim 3, characterized in that, Step (2) involves 2 to 4 fusion injections, with an air pressure of 60 to 80 psi and a fusion gun speed of 350 to 700.

5. The process for improving the spray deformation of stainless steel components in semiconductor equipment according to claim 1, characterized in that, Step (1) Sandblasting uses aluminum oxide abrasive.

6. The process for improving the spray deformation of stainless steel components in semiconductor equipment according to claim 1, characterized in that, Step (4) High-pressure water washing uses ultrapure water with a resistivity greater than or equal to 15 MΩ·cm.

7. The process for improving the spray deformation of stainless steel components in semiconductor equipment according to claim 1, characterized in that, Step (4) The drying equipment is a dust-free drying oven, and the drying time is greater than 4 hours.

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