Magnetic sensor and magnetic sensor device

Abstract

The invention relates to a magnetic sensor and a magnetic sensor device. A region in which a component other than a magnetic sensor or a magnetic sensor device is disposed is added on a component mounting surface of a substrate on which the magnetic sensor or the magnetic sensor device using a large Barkhausen effect is disposed. A magnetic sensor (1) is provided with a magnetic wire (2) that plays a large Barkhausen effect, a coil (3), and a bobbin (4) having a wire winding part in which the magnetic wire is disposed and the coil (3) is provided on the outer periphery thereof, and a pair of pillar parts (7) provided on both end portions of the wire winding part, respectively. The pair of pillar portions respectively protrude downward from both end portions of the wire winding portion, and the protruding amount of the pair of pillar portions is set such that, when the magnetic sensor (1) is mounted on the substrate (11), a component placement space (8) in which a component (12) can be placed is formed between a portion of the outer peripheral surface of the coil facing the component placement surface (11A) and the component placement surface.

Description

Technical Field

[0001] The present invention relates to a magnetic sensor and a magnetic sensor device using a large Barkhausen effect. Background Art

[0002] A magnetic sensor using the large Barkhausen effect includes a magnetic wire that exerts the large Barkhausen effect, a coil, and a bobbin. The magnetic wire is disposed inside the bobbin, and the coil is formed by winding an electric wire around the bobbin and disposed on the outer circumference of the magnetic wire.

[0003] The magnetic wire that exerts the large Barkhausen effect has a uniaxial anisotropy in which the direction of easy magnetization is the axial direction of the magnetic wire. In addition, the magnetic wire has the property that the magnetization direction of the magnetic wire is rapidly reversed in accordance with the change in the direction of the external magnetic field. Due to the rapid reversal of the magnetization direction of the magnetic wire, a pulsed current is generated in the coil. The current can be extracted as a detection pulse, thereby detecting the change in the direction of the external magnetic field based on the detection pulse.

[0004] A magnetic sensor utilizing the large Barkhausen effect can be used as a detection element for detecting the rotation of a rotating body. An example thereof is described in International Publication No. 2016 / 021074. In the case of detecting the rotation of a rotating body by a magnetic sensor utilizing the large Barkhausen effect, the magnet is fixed to the rotating body and the rotating body is rotated integrally. Thus, when the rotating body rotates, a rotating magnetic field is formed around the rotating body. In addition, a plurality of magnetic sensors are provided on a substrate, and the substrate is provided on the outer peripheral side of the rotating body in a manner that does not contact the rotating body and any of the magnets. A plurality of magnetic sensors are respectively arranged near the rotating track of the magnet and at positions different from each other in the rotation direction of the magnet. Thus, when the rotating body rotates, a plurality of magnetic sensors are placed in the rotating magnetic field. As a result, since the direction of the external magnetic field acting on each magnetic sensor changes accordingly with the rotation of the rotating body, a detection pulse can be obtained from the coil of each magnetic sensor. In addition, by arranging the plurality of magnetic sensors at different positions in the rotation direction of the magnet, the direction of the external magnetic field can be changed at different times in each magnetic sensor in accordance with the rotation of the rotating body, and thus the detection pulses obtained from the coils of each magnetic sensor can be obtained at different times in accordance with the rotation of the rotating body. Thus, the rotation amount, rotation angle, rotation speed, rotation direction, etc. of the rotating body can be detected based on the detection pulses obtained from the coils of each magnetic sensor.

[0005] Patent Document 1: International Publication No. 2016 / 021074

[0006] For example, when the rotation of a rotating body is detected by a magnetic sensor using the large Barkhausen effect, the magnetic sensor using the large Barkhausen effect is mounted on a substrate. In most cases, a plurality of electrical and electronic components are mounted on the substrate in addition to the magnetic sensor. As the electrical and electronic components mounted on the substrate, various components such as resistors, capacitors, diodes, transistors, or integrated circuits can be considered.

[0007] Since the magnetic sensor utilizing the large Barkhausen effect has a structure in which a coil is provided on the outer peripheral side of the magnetic wire that exerts the large Barkhausen effect, it is difficult to reduce its size to the millimeter level. Therefore, when the magnetic sensor utilizing the large Barkhausen effect is arranged on the component mounting surface of the substrate, the proportion of the area occupied by the magnetic sensor on the component mounting surface of the substrate becomes large, and as a result, there is a possibility that the area on the component mounting surface of the substrate for arranging electrical and electronic components other than the magnetic sensor is insufficient. Summary of the invention

[0008] The present invention is made, for example, in view of the above-mentioned problems, and the subject of the present invention is to provide a magnetic sensor utilizing the large Barkhausen effect, which is a magnetic sensor capable of increasing the area for configuring components other than the magnetic sensor on the component mounting surface of the substrate on which the magnetic sensor is configured, or to provide a magnetic sensor device utilizing the large Barkhausen effect, which is a magnetic sensor device capable of increasing the area for configuring components other than the magnetic sensor device on the component mounting surface of the substrate on which the magnetic sensor device is configured.

[0009] In order to solve the above-mentioned problems, the magnetic sensor of the present invention is a magnetic sensor using a large Barkhausen effect, characterized in that the magnetic sensor includes: a magnetic wire that exerts a large Barkhausen effect; a coil in which a current corresponding to a change in the magnetization direction of the magnetic wire flows; and a bobbin having a wire winding portion in which the magnetic wire is arranged and a wire forming the coil is wound around the outer circumference, and a pair of support portions respectively provided at both end side portions of the wire winding portion, the pair of support portions respectively protruding from the both end side portions of the wire winding portion in one direction intersecting with the axis of the wire winding portion, the end surface of the protruding end side of each of the support portions being a surface that contacts the component mounting surface when the magnetic sensor is mounted on the substrate, and the protrusion amount of the pair of support portions from the both end side portions of the wire winding portion in the one direction is set so that when the magnetic sensor is mounted on the substrate, a component placement space in which components that are expected to be placed on the component mounting surface other than the magnetic sensor can be placed is formed between a portion of the outer circumferential surface of the coil that faces the component mounting surface and the component mounting surface. According to the magnetic sensor of the present invention, it is possible to arrange components other than the magnetic sensor that are conceivably arranged on the component mounting surface in an area where the component mounting space is formed on the component mounting surface of the substrate on which the magnetic sensor is arranged. Thus, according to the magnetic sensor of the present invention, it is possible to increase the area for arranging components other than the magnetic sensor on the component mounting surface of the substrate on which the magnetic sensor is arranged.

[0010] In addition, in the magnetic sensor of the present invention, it is preferred that the protrusion amount of the pair of pillars is set so that when the magnetic sensor is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil facing the component mounting surface and the component mounting surface is greater than the height dimension of the component. In addition, in the magnetic sensor of the present invention, it is also possible that the protrusion amount of the pair of pillars is set so that when the magnetic sensor is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil facing the component mounting surface and the component mounting surface is greater than the value obtained by adding the height dimension of the component to the insulation distance to be ensured between the component and the magnetic sensor.

[0011] In order to solve the above-mentioned problems, the magnetic sensor device of the present invention is a magnetic sensor device that utilizes the large Barkhausen effect, and is characterized in that the above-mentioned magnetic sensor device comprises: a magnetic sensor having a magnetic wire that exerts a large Barkhausen effect, a coil in which a current corresponding to a change in the magnetization direction of the above-mentioned magnetic wire flows, and a winding tube in which the above-mentioned magnetic wire is arranged inside and an electric wire forming the above-mentioned coil is wound around the outer periphery; and a sensor support component for supporting the above-mentioned magnetic sensor on a component mounting surface of a substrate, the above-mentioned sensor support component comprising: a main body having a predetermined three-dimensional shape extending in a first direction; and a sensor mounting portion, which is arranged on the above-mentioned main body and mounts the above-mentioned magnetic sensor so that the axis of the above-mentioned winding tube becomes parallel to a plane including the above-mentioned first direction. The main body is mounted in a direction of the main body; and a plurality of pillars are provided on the main body, each of the pillars protrudes from the main body in a second direction intersecting with a plane including the first direction, an end surface of each of the pillars on the protruding end side is a surface that contacts the component mounting surface when the magnetic sensor device is mounted on the substrate, and the protrusion amount of each of the pillars from the main body in the second direction is set so that when the magnetic sensor device is mounted on the substrate, a component placement space in which components other than the magnetic sensor device that are expected to be placed on the component mounting surface is formed between a portion of the outer peripheral surface of the coil of the magnetic sensor mounted on the sensor mounting portion that is opposed to the component mounting surface and the component mounting surface. According to the magnetic sensor device of the present invention, components other than the magnetic sensor device that are expected to be placed on the component mounting surface can be placed in an area where the component placement space is formed on the component mounting surface of the substrate on which the magnetic sensor device is placed. In this way, according to the magnetic sensor device of the present invention, an area for placing components other than the magnetic sensor device can be increased on the component mounting surface of the substrate on which the magnetic sensor device is placed.

[0012] In addition, in the magnetic sensor device of the present invention, it is preferred that the protrusion amount of each of the pillars is set so that when the magnetic sensor device is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil of the magnetic sensor mounted on the sensor mounting portion that faces the component mounting surface and the component mounting surface is greater than the height dimension of the component. In addition, in the magnetic sensor device of the present invention, it is also possible that the protrusion amount of each of the pillars is set so that when the magnetic sensor device is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil of the magnetic sensor mounted on the sensor mounting portion that faces the component mounting surface and the component mounting surface is greater than the value obtained by adding the height dimension of the component to the insulation distance to be ensured between the component and the magnetic sensor.

[0013] In addition, in the magnetic sensor device of the present invention, the sensor support member may include a fixing portion for fixing the sensor support member to the substrate using a fixing member. In addition, in the magnetic sensor device of the present invention, a yoke may be provided on the main body, and the yoke may control the direction of the magnetic flux of the magnetic field acting on the magnetic sensor. In addition, in the magnetic sensor device of the present invention, a plurality of magnetic sensors may be provided, and the sensor support member may include a plurality of sensor mounting portions for mounting the plurality of magnetic sensors on the main body, respectively.

[0014] According to the present invention, it is possible to provide a magnetic sensor that utilizes a large Barkhausen effect and is a magnetic sensor that can increase the area for arranging components other than the magnetic sensor on the component mounting surface of a substrate on which the magnetic sensor is arranged. In addition, according to the present invention, it is possible to provide a magnetic sensor device that utilizes a large Barkhausen effect and is a magnetic sensor device that can increase the area for arranging components other than the magnetic sensor device on the component mounting surface of a substrate on which the magnetic sensor device is arranged. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 (A) to (C) are perspective views showing embodiments of the magnetic sensor of the present invention.

[0016] Figure 2 It is a front view of an embodiment of the magnetic sensor of the present invention.

[0017] Figure 3 This is a perspective view showing a state in which a coil is removed in the embodiment of the magnetic sensor of the present invention.

[0018] Figure 4 (A) and (B) are explanatory diagrams showing an embodiment of the magnetic sensor of the present invention mounted on a substrate.

[0019] Figure 5 (A) and (B) are explanatory diagrams showing a rotation detection device as one use example of an embodiment of the magnetic sensor of the present invention.

[0020] Figure 6 (A)~(C) represent Figure 5 (A) and (B) are explanatory diagrams of the operation of the magnetic sensor of the rotation detection device.

[0021] Figure 7 (A) and (B) are perspective views showing a first embodiment of the magnetic sensor device of the present invention.

[0022] Figure 8 It is a perspective view showing a magnetic sensor and a yoke according to a first embodiment of the magnetic sensor device of the present invention.

[0023] Fig. 9 It is a perspective view showing a magnetic sensor according to a first embodiment of the magnetic sensor device of the present invention.

[0024] Fig.10 (A) to (C) are explanatory diagrams showing the magnetic sensor according to the first embodiment of the magnetic sensor device of the present invention.

[0025] Fig.11 It is an explanatory diagram showing a yoke provided inside a sensor support member in the first embodiment of the magnetic sensor device of the present invention.

[0026] Fig.12 (A) to (D) are explanatory diagrams showing a first embodiment of the magnetic sensor device of the present invention.

[0027] Fig.13 It is an explanatory diagram showing a method of attaching a magnetic sensor to a sensor support member in the first embodiment of the magnetic sensor device of the present invention.

[0028] Fig.14 (A) and (B) are explanatory diagrams showing the first embodiment of the magnetic sensor device of the present invention mounted on a substrate.

[0029] Fig.15 It is an explanatory diagram showing a rotation detection device as one use example of the first embodiment of the magnetic sensor device of the present invention.

[0030] Fig.16 (A) and (B) represent Fig.15 An explanatory diagram of the function of the yoke of the magnetic sensor device of the rotation detection device.

[0031] Fig.17 This is a perspective view showing a state in which the second embodiment of the magnetic sensor device of the present invention is mounted on a substrate, as seen from obliquely above.

[0032] Fig.18 It is a perspective view showing a second embodiment of the magnetic sensor device of the present invention, as seen obliquely from below.

[0033] Fig.19 It is an explanatory diagram showing a state of the magnetic sensor device according to the second embodiment of the present invention as viewed from above.

[0034] Fig. 20 It is an explanatory diagram showing a state of the magnetic sensor device according to the second embodiment of the present invention as seen from the lateral direction.

[0035] Fig.21 It is a perspective view showing a magnetic sensor and a yoke according to a second embodiment of the magnetic sensor device of the present invention.

[0036] Fig. 22 (A) and (B) are perspective views of a magnetic sensor showing a second embodiment of the magnetic sensor device of the present invention.

[0037] Fig.23 (A) and (B) are explanatory diagrams showing a magnetic sensor according to a second embodiment of the magnetic sensor device of the present invention.

[0038] Fig.24 It is a perspective view showing a terminal included in a magnetic sensor of a second embodiment of the magnetic sensor device of the present invention.

[0039] Fig.25 It is a perspective view showing a sensor support member according to a second embodiment of the magnetic sensor device of the present invention, as seen obliquely from below.

[0040] Fig.26 It is an explanatory diagram showing a second embodiment of the magnetic sensor device of the present invention mounted on a substrate.

[0041] Fig. 27 It means along Fig.26 A cross-sectional view of the magnetic sensor device cut along the cutting line LL in FIG.

[0042] Fig.28 It is an explanatory diagram showing a rotation detection device as one use example of the second embodiment of the magnetic sensor device of the present invention.

[0043] Description of Reference Numerals

[0044] 1, 61...magnetic sensor; 2, 62...magnetic wire; 3, 63...coil; 4, 64...bobbin; 5, 65...wire winding portion; 7, 66...pillar portion; 7A, 66A...lower end surface (end surface on the protruding end side); 8, 89...component arrangement space; 11, 51, 91...substrate; 11A, 51A, 91A...component placement surface; 12, 52, 92...other components (components); 30, 60...magnetic sensor device; 31...magnetic sensor; 32...magnetic wire; 33...coil; 34...bobbin; 36, 77...yoke; 41, 81...sensor supporting portion; 42, 82...main body; 43, 84...sensor mounting portion; 44, 86...pillar portion; 44A, 86A...lower end surface (end surface on the protruding end side); 45...component arrangement space; 87...fixing portion; 93, 94...fixing member. DETAILED DESCRIPTION

[0045] Implementation of magnetic sensors

[0046] use Figure 1 (A)~ Figure 6 (C) describes an embodiment of the magnetic sensor of the present invention. In this embodiment, when describing the directions of up (Ud), down (Dd), front (Fd), back (Bd), left (Ld), and right (Rd), the directions are as follows: Figures 1 to 4 For convenience of explanation, when the magnetic sensor is arranged on the component mounting surface of the substrate, the direction away from the component mounting surface is set as upward, and the direction close to the component mounting surface is set as downward.

[0047] Figure 1 (A) shows a state of the magnetic sensor 1 which is an embodiment of the magnetic sensor of the present invention as viewed from the upper right side of the front side thereof. Figure 1 (B) shows the state of the magnetic sensor 1 as viewed from the upper right rear side thereof. Figure 1 (C) shows the state of the magnetic sensor 1 as viewed from the lower right side of the front side thereof. Figure 2 The magnetic sensor 1 is shown as viewed from the front. Figure 3 The magnetic sensor 1 is shown after the coil 3 has been removed. Figure 4 (A) shows a state where the magnetic sensor 1 mounted on the substrate 11 is viewed from the front. Figure 4 (B) shows a state where the magnetic sensor 1 mounted on the substrate 11 is viewed from above.

[0048] The magnetic sensor 1 is a magnetic sensor using the large Barkhausen effect. Figure 1 As shown in FIG. 8 (A), the magnetic sensor 1 includes a magnetic wire 2 , a coil 3 , a bobbin 4 , and a pair of terminals 9 .

[0049] The magnetic wire 2 is a magnetic wire that exerts a large Barkhausen effect and is called a composite magnetic wire. The magnetic wire 2 is formed of, for example, a semi-hard magnetic material containing iron and cobalt, and is a wire having a diameter of, for example, about 0.1 mm to 1 mm and a length of, for example, about 10 mm to 30 mm. The magnetic wire 2 is formed, for example, by drawing the semi-hard magnetic material and twisting it multiple times while changing the direction. The magnetic wire 2 has a uniaxial anisotropy in which the direction of easy magnetization is the direction of the central axis of the magnetic wire 2. In addition, in the magnetic wire 2, the coercive force of the central side portion is greater than the coercive force of the peripheral side portion. The magnetic wire 2 has the property that the magnetization direction of the magnetic wire 2 (the peripheral side portion) is rapidly reversed in accordance with the change in the direction of the external magnetic field.

[0050] The coil 3 is formed by winding an insulated wire such as an enameled wire, for example. The coil 3 is arranged on the outer peripheral side of the magnetic wire 2. When the direction of the external magnetic field changes and the magnetization direction of the magnetic wire 2 is rapidly reversed accordingly, a pulsed current flows in the coil 3. By extracting this current as a detection pulse, the change in the direction of the external magnetic field can be detected based on the detection pulse.

[0051] The bobbin 4 is formed of a non-magnetic material such as resin. Figure 3 As shown, the bobbin 4 includes an electric wire winding portion 5 and a pair of support portions 7 .

[0052] The wire winding portion 5 is formed in a cylindrical shape extending in the left-right direction. The axis D of the wire winding portion 5 extends in the left-right direction (see Figure 2 ). A magnetic wire 2 is arranged inside the wire winding portion 5. Specifically, a groove 6 extending in the left-right direction is formed in the wire winding portion 5, and the magnetic wire 2 is arranged in the groove 6. The magnetic wire 2 is arranged such that its axis extends in the left-right direction and is parallel to the axis D. In addition, instead of the groove 6, a hole extending in the left-right direction may be formed in the wire winding portion 5, and the magnetic wire 2 may be arranged in the hole. In addition, as Figure 1 As shown in FIG. 2 (B), the insulated electric wire forming the coil 3 is wound around the outer periphery of the electric wire winding portion 5 .

[0053] like Figure 2 As shown, a pair of support parts 7 are respectively provided at the two end side parts in the left-right direction of the wire winding part 5. The pair of support parts 7 protrude from the two end side parts in the left-right direction of the wire winding part 5 in a direction orthogonal to the axis D of the wire winding part 5. Specifically, the pair of support parts 7 protrude downward from the left end side part and the right end side part of the wire winding part 5. In addition, as shown Figure 1 As shown in (C), the end surface of each support portion 7 on the protruding end side, that is, the lower end surface 7A, is a flat surface extending in the left-right direction and the front-back direction. Figure 4 As shown in FIG. 1A , when the magnetic sensor 1 is mounted on the substrate 11 , the lower end surface 7A of each support portion 7 is in contact with the component mounting surface 11A of the substrate 11 .

[0054] In addition, if Figure 4As shown in (A), the amount of downward protrusion of the pair of support portions 7 from the two end side portions of the wire winding portion 5 is set so that when the magnetic sensor 1 is mounted on the substrate 11, a component placement space 8 in which other components 12 can be placed is formed between the portion of the outer peripheral surface of the coil 3 that faces the component placement surface 11A and the component placement surface 11A, that is, between the lowermost portion of the outer peripheral surface of the coil 3 and the component placement surface 11A. The other components 12 refer to electrical and electronic components that can be expected to be placed on the component placement surface 11A of the substrate 11 other than the magnetic sensor 1, such as resistors, capacitors, diodes, transistors, or integrated circuits. For example, the other components 12 are electrical and electronic components required for detection using the magnetic sensor 1. For example, the other components 12 are integrated circuit chips provided with a counting circuit for counting detection pulses output from the coil 3 of the magnetic sensor 1, or a memory chip provided with a memory element for storing the number of detection pulses counted by the counting circuit, or a custom chip provided with a detection circuit including the counting circuit and the memory element.

[0055] Specifically, the above-mentioned protrusion amount of each support portion 7 is set so that when the magnetic sensor 1 is mounted on the substrate 11, the distance G between the lowest part of the outer peripheral surface of the coil 3 and the component mounting surface 11A is greater than the height dimension (the dimension in the vertical direction) of the other components 12. At present, various surface-mounted (chip-type) electrical and electronic components with a height dimension of less than 0.8 mm are generally widely used. In the case where the other component 12 is a surface-mounted electrical and electronic component with a height dimension of less than 0.8 mm, the above-mentioned protrusion amount of each support portion 7 is set so that the distance G is greater than 0.8 mm. However, sometimes the other component 12 is an electrical and electronic component with a height dimension greater than 0.8 mm. For example, in the case where the other component 12 is an electrical and electronic component with a height dimension of 1.7 mm, the above-mentioned protrusion amount of each support portion 7 is set so that the distance G is greater than 1.7 mm.

[0056] In addition, the protrusion amount of each support portion 7 may be set so that, when the magnetic sensor 1 is mounted on the substrate 11, the distance G between the lowermost portion of the outer peripheral surface of the coil 3 and the component mounting surface 11A is greater than or equal to the sum of the height dimension of the other component 12 and the insulation distance to be ensured between the other component 12 and the magnetic sensor 1. For example, when the height dimension of the other component 12 is 0.8 mm and the insulation distance to be ensured between the other component 12 and the magnetic sensor 1 is 0.2 mm, the protrusion amount of each support portion 7 is set so that the distance G is greater than or equal to 1 mm. In addition, for example, when the height dimension of the other component 12 is 1.7 mm and the insulation distance to be ensured between the other component 12 and the magnetic sensor 1 is 0.2 mm, the protrusion amount of each support portion 7 is set so that the distance G is greater than or equal to 1.9 mm.

[0057] like Figure 1 As shown in (B), each terminal 9 is formed into an L shape by a conductive material such as a metal material. Each terminal 9 is a surface-mounted terminal. A pair of terminals 9 are respectively mounted and fixed to the rear of the two end side portions of the wire winding portion 5, or the rear of a pair of support portions 7. In addition, at the upper portion of one terminal 9, one end portion of the insulated wire forming the coil 3 after the insulating coating is removed is connected. In addition, at the upper portion of the other terminal 9, the other end portion of the insulated wire forming the coil 3 after the insulating coating is removed is connected. In addition, the rear end side portion of the lower portion of each terminal 9 is welded to a connecting pad provided on the component mounting surface 11A of the substrate 11 when the magnetic sensor 1 is mounted on the substrate 11.

[0058] Figure 5 (A), (B) and Figure 6 (A) to (C) show an example of use of the magnetic sensor 1. That is, Figure 5 (A) shows a rotation detection device 15 using three magnetic sensors 1 . Figure 5 (B) shows the Figure 5 The rotation detection device 15 cut by the cutting line KK in (A) Figure 5 The state observed in the lower right corner of (A). Figure 6 (A) and Figure 6 (B) shows a state in which the direction of the magnetic field around the magnetic sensor 1 changes in accordance with the rotation of the rotation shaft 19 . Figure 6 (C) shows a pulsed current flowing through the coil 3 of the magnetic sensor 1 in accordance with a change in the direction of the magnetic field.

[0059] exist Figure 5 In (A), the rotation detection device 15 is a device that detects the rotation of a rotating shaft 19 as a rotating body. For example, the rotating shaft 19 is an output shaft of a motor. The rotation detection device 15 includes a magnetic field forming member 16 , three magnetic sensors 1 , and a substrate 17 .

[0060] The magnetic field forming member 16 is formed into a ring shape by a magnetic material such as ferrite. The magnetic field forming member 16 is coaxially arranged on the outer peripheral side of the rotating shaft 19 and fixed to the rotating shaft 19. The magnetic field forming member 16 is a magnet magnetized by multi-pole, and four magnetic poles of N pole, S pole, N pole, and S pole are formed in this order, for example, at intervals of 90 degrees along the circumference of the magnetic field forming member 16 on the outer peripheral side of the magnetic field forming member 16. In addition, the magnetic field forming member 16 can also be formed by four magnets that are not magnetized by multi-pole.

[0061] The substrate 17 is provided on the outer circumference side of the rotating shaft 19. In addition, the substrate 17 is provided near the magnetic field forming member 16. The substrate 17 is arranged so that its member mounting surface 17A faces upward. Figure 5As shown in (B), the substrate 17 is configured so that a plane including a component mounting surface 17A is orthogonal to the rotation axis of the rotating shaft 19. In addition, an insertion hole 18 is formed in the central portion of the substrate 17, and the rotating shaft 19 is inserted into the insertion hole 18. In addition, the diameter of the insertion hole 18 is larger than the outer diameter of the rotating shaft 19, and the rotating shaft 19 does not contact the substrate 17. In addition, the substrate 17 is fixed to a frame of a motor that supports the rotating shaft 19 so that it can rotate, for example, via a bracket.

[0062] The three magnetic sensors 1 are provided on the component mounting surface 17A of the substrate 17. In addition, the three magnetic sensors 1 are arranged on the outer peripheral side of the magnetic field forming member 16 at intervals of 120 degrees in the rotation direction of the magnetic field forming member 16. In addition, each magnetic sensor 1 is arranged so that the extension direction of the axis of the magnetic wire 2 is parallel to the component mounting surface 17A of the substrate 17. In addition, when the component mounting surface 17A of the substrate 17 is observed from above, each magnetic sensor 1 is arranged so that the central part of the extension direction of the magnetic wire 2 is tangent to the circle B drawn on the outer peripheral side of the magnetic field forming member 16 and centered on the rotation center A of the rotation axis 19.

[0063] The magnetic field forming member 16 does not contact any of the three magnetic sensors 1. In addition, the magnetic field forming member 16 rotates together with the rotating shaft 19, while each magnetic sensor 1 does not move. When the magnetic field forming member 16 rotates together with the rotating shaft 19, the magnetic field formed by the magnetic field forming member 16 rotates. As a result, a magnetic field (rotating magnetic field) rotating around the rotation axis of the rotating shaft 19 is formed. The three magnetic sensors 1 are placed in this magnetic field. Each magnetic sensor 1 detects a change in the direction of the magnetic field.

[0064] Here, we focus on Figure 5 The three magnetic sensors 1 of (A) are arranged in Figure 5 The magnetic field detection operation of the magnetic sensor 1 is described below. Figure 5 In (A), the S pole of the magnetic field forming component 16 is close to the left front of the upper magnetic sensor 1, and the N pole of the magnetic field forming component 16 is close to the right front of the magnetic sensor 1. When the rotating shaft 19 rotates 90 degrees clockwise from this state, as shown in FIG. Figure 6 As shown in (A), the N pole of the magnetic field forming component 16 approaches the left front of the magnetic sensor 1, and the S pole of the magnetic field forming component 16 approaches the right front of the magnetic sensor 1. At this time, the direction of the magnetic field acting on the magnetic wire 2 of the magnetic sensor 1 changes to the right direction. As a result, the magnetization direction of the magnetic wire 2, which was in the left direction just before, is rapidly reversed to the right direction. As a result, Figure 6 As shown in (C), a pulse current P1 in the positive direction is generated in the coil 3, for example.

[0065] Thereafter, when the rotating shaft 19 is further rotated 90 degrees clockwise, as shown in FIG. Figure 6 As shown in (B), the S pole of the magnetic field forming component 16 is close to the left front of the magnetic sensor 1, and the N pole of the magnetic field forming component 16 is close to the right front of the magnetic sensor 1. At this time, the direction of the magnetic field acting on the magnetic wire 2 of the magnetic sensor 1 changes to the left direction. As a result, the magnetization direction of the magnetic wire 2, which was in the right direction just before, is rapidly reversed to the left direction. As a result, Figure 6 As shown in (C), a pulse current P2 in the negative direction flows through the coil 13, for example.

[0066] Each terminal 9 of each magnetic sensor 1 is electrically connected to a detection circuit provided on a substrate 11. In each magnetic sensor 1, currents P1 and P2 flowing to the coil 3 are output to the detection circuit as detection pulses. The detection circuit detects the rotation amount and rotation direction of the rotating shaft 19 based on the detection pulses respectively output from the coils 3 of the three magnetic sensors 1. Among them, as a method for detecting the rotation amount and rotation direction of the rotating shaft 19 in the rotation detection device 15, for example, the method described in International Publication No. 2016 / 002437 can be used.

[0067] In addition, the detection circuit is, for example, a custom chip having a counting circuit for counting detection pulses output from the coil 3 of each magnetic sensor 1, and a storage element for storing the number of detection pulses counted by the counting circuit. Three component configuration spaces 8 are formed on the component mounting surface 11A of the substrate 11 by the three magnetic sensors 1 mounted on the substrate 11. The custom chip of the detection circuit is arranged as another component 12 on the component mounting surface 11A in an area where any one of the three component configuration spaces 8 is formed. For example, Figure 5 The other component 12 in (A) is a customized chip of the above-mentioned detection circuit.

[0068] As described above, in the magnetic sensor 1 of the embodiment of the magnetic sensor of the present invention, the bobbin 4 has a pair of support portions 7, and the amount of protrusion of the pair of support portions 7 downwardly protruding from the two end side portions of the wire winding portion 5 is set so that when the magnetic sensor 1 is mounted on the substrate 11, a component arrangement space 8 in which other components 12 can be arranged is formed between a portion of the outer peripheral surface of the coil 3 that is opposite to the component mounting surface 11A and the component mounting surface 11A. According to this structure, when the magnetic sensor 1 is mounted on the substrate 11, a component arrangement space 8 is formed between the portion of the magnetic sensor 1 where the coil 3 is wound and the component mounting surface 11A. Figure 4 As shown in (B), other components 12 can be arranged in the area of ​​the component placement surface 11A where the component placement space 8 is formed. Thus, according to the magnetic sensor 1 of this embodiment, an area for arranging electric and electronic components other than the magnetic sensor 1 can be increased in the component placement surface 11A where the magnetic sensor 1 is arranged.

[0069] First Embodiment of Magnetic Sensor Device

[0070] use Figure 7 (A)~ Fig.16 (B) is a first embodiment of the magnetic sensor device of the present invention. In this embodiment, when describing the directions of up (Ud), down (Dd), front (Fd), back (Bd), left (Ld), and right (Rd), the directions are as follows: Figure 7 (A)~ Fig.14 For convenience of explanation, when the magnetic sensor device is mounted on the component mounting surface of the substrate, the direction away from the component mounting surface is set as upward, and the direction close to the component mounting surface is set as downward.

[0071] Figure 7 (A) shows a state of the magnetic sensor device 30 according to the first embodiment of the magnetic sensor device of the present invention as viewed from the upper right side of the front side. Figure 7 (B) shows the state of the magnetic sensor device 30 as viewed from the lower right side of the front side thereof. Figure 8 The magnetic sensor 31 and the yoke 36 included in the magnetic sensor device 30 are shown.

[0072] The magnetic sensor device 30 is a magnetic sensor device that utilizes the large Barkhausen effect. Figure 7 (A) Figure 7 (B) and Figure 8 As shown, the magnetic sensor device 30 includes a magnetic sensor 31 , a yoke 36 , and a sensor support member 41 . The magnetic sensor 31 is attached to the sensor support member 41 , and the yoke 36 is embedded in the sensor support member 41 .

[0073] Fig. 9 The magnetic sensor 31 is shown as viewed from the upper right side of the front side thereof. Fig.10 (A) shows the state of the magnetic sensor 31 as viewed from the front. Fig.10 (B) shows the state of the magnetic sensor 31 as viewed from the rear. Fig.10 (C) shows the state of the magnetic sensor 31 viewed from the right. Fig.11 The yoke 36 and the sensor support part 41 are shown.

[0074] like Fig. 9 As shown in FIG. 1 , the magnetic sensor 31 includes a magnetic wire 32, a coil 33, a bobbin 34, and a pair of terminals 35. The magnetic wire 32 and the coil 33 are connected to Figure 1 The magnetic wire 2 and the coil 3 of the magnetic sensor 1 in (A) are the same. Fig.10As shown in (A) to (C) of FIG. 1 , the bobbin 34 does not have a support portion, that is, both end side portions of the bobbin 34 in the left-right direction do not protrude downward. The bobbin 34 is the same as the bobbin 4 of the magnetic sensor 1 except that it does not have a support portion. In addition, Fig.10 E in (A) is the axis of the bobbin 34. In addition, each terminal 35 is also the same as the terminal 9 of the magnetic sensor 1. However, since there is no support portion in the bobbin 34, the lower part of each terminal 35 protrudes downward from the lower surface 34A of the bobbin 34. Figure 7 As shown in FIG. 2 (B), the magnetic sensor 31 is mounted and fixed to a sensor mounting portion 43 provided on the sensor support member 41 .

[0075] The yoke 36 has a function of controlling the direction of the magnetic flux of the magnetic field acting on the magnetic sensor 31 (the magnetic field around the magnetic sensor 31). Figure 8 As shown, the yoke 36 has two yoke pieces 36A. Each yoke piece 36A is formed of a soft magnetic material such as iron. A portion of the yoke piece 36A on one side is arranged in front of the left portion of the magnetic sensor 31, and the other portion of the yoke piece 36A on one side is arranged above the left end portion of the magnetic sensor 31. In addition, a portion of the other yoke piece 36A is arranged in front of the right portion of the magnetic sensor 31, and the other portion of the other yoke piece 36A is arranged above the right end portion of the magnetic sensor 31. Fig.11 As shown, the yoke 36 is embedded in the front portion of the main body 42 of the sensor support member 41. For example, the sensor support member 41 and the yoke 36 are integrally formed by insert molding.

[0076] Fig.12 (A) shows the state of the magnetic sensor device 30 as viewed from the front. Fig.12 (B) shows the state of the magnetic sensor device 30 as viewed from below. Fig.12 (C) shows the state of the magnetic sensor device 30 as viewed from the rear. Fig.12 (D) shows the state of the magnetic sensor device 30 as viewed from the right. Fig.13 A method of attaching the magnetic sensor 31 to the sensor support member 41 is shown. Fig.14 (A) shows a state where the magnetic sensor device 30 mounted on the substrate 51 is viewed from the front. Fig.14 (B) shows a state where the magnetic sensor device 30 mounted on the substrate 51 is viewed from above.

[0077] In the magnetic sensor device 30, the sensor support member 41 is a member for supporting the magnetic sensor 31 and the yoke 36 on the member mounting surface 51A of the substrate 51. The sensor support member 41 is formed of a non-magnetic material such as resin. Fig.12As shown in (A) to (D) of FIG. 8 , the sensor support member 41 includes a main body portion 42 , a sensor mounting portion 43 , and a plurality of support columns 44 .

[0078] The main body 42 has a predetermined three-dimensional shape extending in the first direction. Fig.12 As shown in (A), the main body 42 is formed into a flat plate shape extending in the left-right direction and the front-back direction, which can cover most of the magnetic sensor 31 from above and has a thickness that can bury the yoke 36 inside. In addition, in this embodiment, the "first direction" refers to the left-right direction or the front-back direction.

[0079] The sensor mounting portion 43 is a portion for mounting the magnetic sensor 31 on the main body portion 42. The main body portion 42 has a lower surface 42A extending in the left-right direction and the front-back direction. Fig.13 As shown in FIG. 1 , the sensor mounting portion 43 is a recessed portion that is long in the left-right direction and is provided on the lower surface 42A of the main body portion 42. The magnetic sensor 31 is inserted into the sensor mounting portion 43 from the bottom of the main body portion 42. Fig.12 As shown in (A) of FIG. 1 , the magnetic sensor 31 is installed in the sensor installation portion 43 in such a manner that the axis E of the bobbin 34 is parallel to the lower surface 42A of the main body portion 42. Fig.12 As shown in (B), the shape of the sensor mounting portion 43 is set so that the bobbin 34 provided with the coil 33 is just inserted and the magnetic sensor 31 is supported in the sensor mounting portion 43. In addition, when the magnetic sensor 31 is mounted on the sensor mounting portion 43, the position of the lowermost portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 is substantially the same as the position of the lower surface 42A of the main body 42 in the up-down direction.

[0080] A plurality of support pillars 44 are provided on the lower surface 42A of the main body 42. Each support pillar 44 protrudes from the lower surface 42A of the main body 42 in a second direction intersecting with a plane including the first direction. In the present embodiment, each support pillar 44 protrudes from the lower surface 42A of the main body 42 in a direction orthogonal to the lower surface 42A, i.e., downward. In the present embodiment, the "second direction" refers to the downward direction.

[0081] In this embodiment, the sensor support member 41 has two support columns 44. One support column 44 is disposed on the left side of the lower surface 42A of the main body 42, and the other support column 44 is disposed on the right side of the lower surface 42A of the main body 42. The end surface of each support column 44, i.e., the lower end surface 44A, which is the end surface on the protruding end side, is a flat surface parallel to the lower surface 42A of the main body 42. Fig.14 As shown in FIG. 5A , when the magnetic sensor device 30 is mounted on the substrate 51 , the lower end surface 44A of each support portion 44 is in contact with the component mounting surface 51A of the substrate 51 .

[0082] In addition, if Fig.14 As shown in (A), the amount of downward protrusion of the pair of support portions 44 from the lower surface 42A is set so that when the magnetic sensor device 30 is mounted on the substrate 51, a component placement space 45 in which other components 52 can be placed is formed between the portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 mounted on the sensor mounting portion 43 that is opposite to the component placement surface 51A and the component placement surface 51A, that is, between the lowest portion of the outer peripheral surface of the coil 33 and the component placement surface 51A. The other components 52 refer to electrical and electronic components that can be expected to be placed on the component placement surface 51A of the substrate 51 other than the magnetic sensor device 30, and the details are the same as those described above. Figure 4 The same is true for other components 12 in (A) and (B).

[0083] Specifically, the protrusion amount of each support portion 44 is set so that when the magnetic sensor device 30 is mounted on the substrate 51, the distance H between the lowest portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 mounted on the sensor mounting portion 43 and the component mounting surface 51A is greater than the height dimension (the dimension in the vertical direction) of the other component 52. In addition, the protrusion amount of each support portion 44 may be set so that when the magnetic sensor device 30 is mounted on the substrate 51, the distance H between the lowest portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 mounted on the sensor mounting portion 43 and the component mounting surface 51A is greater than the value obtained by adding the height dimension of the other component 52 and the insulation distance to be ensured between the other component 52 and the magnetic sensor 31.

[0084] The lower surface of the rear end side portion of each terminal 35 is located in the same plane as the lower end surface 44A of each support portion 44. The rear end side portion of the lower portion of each terminal 35 is soldered to a connection pad provided on the component mounting surface 51A of the substrate 51 when the magnetic sensor device 30 is mounted on the substrate 51.

[0085] Fig.15 as well as Fig.16 (A) and (B) show an example of using the magnetic sensor device 30. That is, Fig.15 A rotation detection device 55 using three magnetic sensor devices 30 is shown. Fig.16 (A) and (B) show how the direction of the magnetic field around the magnetic sensor device 30 changes in accordance with the rotation of the rotation axis 19. Fig.15 The rotation detection device 55 and Figure 5 When comparing the rotation detection device 15 in (A) and (B), Fig.15 The rotation detection device 55 in addition to Figure 5Except that the three magnetic sensors 1 of the rotation detection device 15 in (A) and (B) are replaced by three magnetic sensor devices 30, Figure 5 The rotation detection device 15 in (A) and (B) is the same. Fig.15 In the rotation detection device 55, Figure 5 The same components of the rotation detection device 15 in (A) and (B) are denoted by the same reference numerals, and the description thereof is simplified or omitted.

[0086] exist Fig.15 In the embodiment, the rotation detection device 55 is a device for detecting the rotation of the rotating shaft 19 , and includes the magnetic field forming member 16 , the three magnetic sensor devices 30 , and the substrate 17 .

[0087] The three magnetic sensor devices 30 are arranged on the component mounting surface 17A of the substrate 17. In addition, the three magnetic sensor devices 30 are arranged on the outer peripheral side of the magnetic field forming member 16 at intervals of 120 degrees in the rotation direction of the magnetic field forming member 16. In addition, each magnetic sensor device 30 is arranged so that the extension direction of the axis of the magnetic wire 32 of the magnetic sensor 31 is parallel to the component mounting surface 17A of the substrate 17. In addition, when the component mounting surface 17A of the substrate 17 is observed from above, each magnetic sensor device 30 is arranged so that the central part of the extension direction of the magnetic wire 32 of the magnetic sensor 31 is tangent to the circle B drawn on the outer peripheral side of the magnetic field forming member 16 with the rotation center A of the rotation axis 19 as the center.

[0088] The magnetic field forming member 16 does not contact any of the three magnetic sensor devices 30. In addition, the magnetic field forming member 16 rotates together with the rotating shaft 19, and each magnetic sensor device 30 does not move. When the magnetic field forming member 16 rotates together with the rotating shaft 19, the magnetic field formed by the magnetic field forming member 16 rotates. As a result, a magnetic field (rotating magnetic field) that rotates around the rotation axis of the rotating shaft 19 is formed. The three magnetic sensors 31 respectively provided in the three magnetic sensor devices 30 are placed in the magnetic field. Each magnetic sensor 31 detects a change in the direction of the above-mentioned magnetic field.

[0089] The magnetic field detection operation of each magnetic sensor 31 is basically the same as the magnetic field detection operation of the magnetic sensor 1 described above, and therefore the description thereof is omitted. Here, the yoke 36 included in each magnetic sensor device 30 will be described.

[0090] In each magnetic sensor device 30, the yoke 36 is embedded in the front portion of the main body 42 of the sensor support member 41. Fig.15 As shown, when each magnetic sensor device 30 is arranged on the component mounting surface 51A of the substrate 51 , the yoke 36 is arranged between the magnetic sensor 31 and the magnetic field forming member 16 .

[0091] The yoke 36 controls the direction of the magnetic flux so that the magnetic flux of the magnetic field formed by the two magnetic poles of the magnetic field forming member 16 close to the left front and right front of the magnetic sensor 31 is concentrated on the magnetic wire 32 of the magnetic sensor 31 .

[0092] Specifically, if Fig.16 As shown in (A), in one of the three magnetic sensor devices 30 arranged on the component mounting surface 51A of the substrate 51, when the N pole of the magnetic field forming component 16 approaches the left front of the magnetic sensor 31 and the S pole of the magnetic field forming component 16 approaches the right front of the magnetic sensor 31, the direction of the magnetic flux of the magnetic field formed by the two magnetic poles of the magnetic field forming component 16 is as follows: Fig.16 As shown by arrow S in (A), the magnetic sensor 31 is controlled by the yoke 36 disposed between the magnetic sensor 31 and the magnetic field forming member 16. As a result, the magnetic flux of the magnetic field formed by the two magnetic poles is concentrated on the magnetic line 32 of the magnetic sensor 31.

[0093] In addition, if Fig.16 As shown in (B), in the magnetic sensor device 30, when the S pole of the magnetic field forming component 16 approaches the left front of the magnetic sensor 31 and the N pole of the magnetic field forming component 16 approaches the right front of the magnetic sensor 31, the direction of the magnetic flux of the magnetic field formed by the two magnetic poles of the magnetic field forming component 16 is as follows: Fig.16 As shown by arrow T in (B), the magnetic sensor 31 is controlled by the yoke 36 disposed between the magnetic sensor 31 and the magnetic field forming member 16. As a result, the magnetic flux of the magnetic field formed by the two magnetic poles is concentrated on the magnetic line 32 of the magnetic sensor 31.

[0094] By using the yoke 36 to concentrate the magnetic flux on the magnetic wire 32, the magnetic flux is caused to flow along the extension direction of the magnetic wire 32, and the magnetic flux is caused to reliably pass through the magnetic wire 32. As a result, the magnetization direction of the magnetic wire 32 of each magnetic sensor 31 can be reliably reversed in accordance with the change of the magnetic field formed by the rotating magnetic field forming member 16, so that the pulse waveform of the pulse-shaped current flowing in the coil 33 can be sharpened in accordance with the reversal of the magnetization direction of the magnetic wire 32.

[0095] As described above, in the magnetic sensor device 30 which is the first embodiment of the magnetic sensor device of the present invention, the sensor support member 41 includes a plurality of support portions 44, and the amount of protrusion of each support portion 44 downward from the lower surface 42A of the main body portion 42 is set so that when the magnetic sensor device 30 is mounted on the substrate 51, the component placement space 45 in which other components 52 can be placed is formed between the portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 mounted on the sensor mounting portion 43 that faces the component mounting surface 51A and the component mounting surface 51A. According to this structure, when the magnetic sensor device 30 is mounted on the substrate 51, the component placement space 45 is formed between the portion of the magnetic sensor 31 mounted on the sensor mounting portion 43 around which the coil 33 is wound and the component mounting surface 51A.

[0096] Furthermore, in the magnetic sensor device 30 of the present embodiment, when the magnetic sensor device 30 is mounted on the substrate 51, the main body 42 is lifted up by the support portions 44 as a whole. That is, the main body 42 is disposed as a whole at a position above the component mounting surface 51A and away from the component mounting surface 51A, and the distance between the lower surface 42A of the main body 42 and the component mounting surface 51A is substantially the same as the distance H between the portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 mounted on the sensor mounting portion 43 that faces the component mounting surface 51A and the component mounting surface 51A. As a result, a component placement space 45 in which other components 52 can be placed is formed not only between the portion of the magnetic sensor 31 mounted on the sensor mounting portion 43 where the coil 33 is wound and the component mounting surface 51A, but also between the middle portion in the left-right direction of the lower surface 42A of the main body 42 and the component mounting surface 51A.

[0097] like Fig.14 As shown in (B), other components 52 can be arranged in the area of ​​the component mounting surface 51A where the component arrangement space 45 is formed. In this way, according to the magnetic sensor device 30 of this embodiment, an area for arranging electric and electronic components other than the magnetic sensor device 30 can be increased in the component mounting surface 51A of the substrate 51 on which the magnetic sensor device 30 is arranged.

[0098] In addition, in the magnetic sensor device 30 of the present embodiment, the yoke 36 is provided inside the main body 42 of the sensor support member 41. Moreover, when the magnetic sensor device 30 is mounted on the substrate 51, the main body 42 is arranged at a position above the component mounting surface 51A of the substrate 51 and away from the component mounting surface 51A through the support 44. Therefore, when the magnetic sensor device 30 is mounted on the substrate 51, the yoke 36 is arranged at a position above the component mounting surface 51A of the substrate 51 and away from the component mounting surface 51A. Moreover, when the magnetic sensor device 30 is mounted on the substrate 51, a part of the component arrangement space 45 is located below most of the yoke 36. As a result, other components 52 can also be arranged below the yoke 36. In this way, according to the magnetic sensor device 30 of the present embodiment, in the component mounting surface 51A of the substrate 51, the area where electric and electronic components other than the magnetic sensor device 30 cannot be arranged due to the arrangement of the yoke 36 can be reduced.

[0099] Second Embodiment of Magnetic Sensor Device

[0100] use Figures 17 to 28 A second embodiment of the magnetic sensor device of the present invention is described. In this embodiment, when describing the directions of up (Ud), down (Dd), front (Fd), back (Bd), left (Ld), and right (Rd), the directions are as follows: Figure 20 to Figure 24 , Fig. 27 For convenience of explanation, when the magnetic sensor device is arranged on the component mounting surface of the substrate, the direction away from the component mounting surface is set as upward, and the direction close to the component mounting surface is set as downward.

[0101] Fig.17 FIG. 2 shows a magnetic sensor device 60 according to a second embodiment of the magnetic sensor device of the present invention, as viewed from obliquely above. Fig.17 , a state where the magnetic sensor device 60 is mounted on the substrate 91 is shown. Fig.18 The magnetic sensor device 60 is shown as viewed obliquely from below. Fig.19 The magnetic sensor device 60 is shown as viewed from above. Fig. 20 The magnetic sensor device 60 is shown as viewed from the lateral direction. Fig.21 One magnetic sensor 61 of the three magnetic sensors 61 included in the magnetic sensor device 60 and one magnetic yoke 77 of the three magnetic yokes 77 included in the magnetic sensor device 60 are shown.

[0102] The magnetic sensor device 60 is a magnetic sensor device that utilizes the large Barkhausen effect. Figures 17 to 21As shown, the magnetic sensor device 60 includes three magnetic sensors 61, three yokes 77, and a sensor support member 81. The three magnetic sensors 61 are mounted on the sensor support member 81, and the three yokes 77 are embedded in the sensor support member 81. In addition, the structures of the three magnetic sensors 61 themselves are the same as each other, and the structures of the three yokes 77 themselves correspond to each other.

[0103] Fig. 22 (A) shows a state where one magnetic sensor 61 among the three magnetic sensors 61 included in the magnetic sensor device 60 is viewed from the upper right of the front side thereof. Fig. 22 (B) shows Fig. 22 (A) is a state of the magnetic sensor 61 viewed from the lower right side of the front side thereof. Fig.23 (A) shows Fig. 22 (A) is a state of the magnetic sensor 61 viewed from the front. Fig.23 (B) shows Fig. 22 (A) is a state where the magnetic sensor 61 is viewed from the right.

[0104] like Fig. 22 As shown in (A), the magnetic sensor 61 includes a magnetic wire 62, a coil 63, a bobbin 64, and a pair of terminals 71. The magnetic wire 62 and the coil 63 are connected to Figure 1 The magnetic wire 2 and the coil 3 of the magnetic sensor 1 in (A) are the same.

[0105] In addition, comparison Figure 2 and Fig.23 From (A), we can see that Fig.23 The bobbin 64 of the magnetic sensor 61 shown in (A) and Figure 2 The bobbin 4 of the magnetic sensor 1 shown in the figure similarly has a wire winding portion 65 and a pair of support portions 66. The wire winding portion 65 of the magnetic sensor 61 is formed in a cylindrical shape extending in the left-right direction, similarly to the wire winding portion 5 of the magnetic sensor 1, and the axis F of the wire winding portion 65 extends in the left-right direction. In addition, a magnetic wire 62 is arranged inside the wire winding portion 65 of the magnetic sensor 61, similarly to the wire winding portion 5 of the magnetic sensor 1. In addition, an insulated wire forming a coil 63 is wound around the outer periphery of the wire winding portion 65 of the magnetic sensor 61.

[0106] A pair of support pillars 66 are provided at both end portions of the wire winding portion 65 in the left-right direction. The pair of support pillars 66 protrude from both end portions of the wire winding portion 65 in the left-right direction in a direction orthogonal to the axis F of the wire winding portion 65. Specifically, the pair of support pillars 66 protrude downward from the left end portion and the right end portion of the wire winding portion 65. Fig. 22As shown in (B), the end surface of each support portion 66 on the protruding end side, that is, the lower end surface 66A is a flat surface extending in the left-right direction and the front-back direction. When the magnetic sensor device 60 is mounted on the substrate 91, the lower end surface 66A of each support portion 66 contacts the component mounting surface 91A of the substrate 91 (see Fig.26 and 27).

[0107] The amount of downward protrusion of the pair of support portions 66 from the end side portions of the wire winding portion 65 is set so that, when the magnetic sensor device 60 is mounted on the substrate 91, a component placement space 89 (see FIG. 1 ) in which other components 92 can be placed is formed between a portion of the outer peripheral surface of the coil 63 of the magnetic sensor 61 that is opposed to the component placement surface 91A and the component placement surface 91A, that is, between the lowermost portion of the outer peripheral surface of the coil 63 and the component placement surface 91A. Fig.26 ). Other components 92 refer to electrical and electronic components other than the magnetic sensor device 60 that are assumed to be arranged on the component mounting surface 91A of the substrate 91, and the details thereof are the same as those described above. Figure 4 The same is true for other components 12 in (A) and (B).

[0108] Specifically, the protrusion amount of each support portion 66 is set so that when the magnetic sensor device 60 is mounted on the substrate 91, the distance J between the lowermost portion of the outer peripheral surface of the coil 63 and the component mounting surface 91A is greater than the height dimension (the dimension in the vertical direction) of the other components 92 (see Fig. 27 ). In addition, the protrusion amount of each support portion 66 can also be set so that when the magnetic sensor device 60 is mounted on the substrate 91, the distance J between the lowermost portion of the outer peripheral surface of the coil 63 and the component mounting surface 91A becomes greater than the value obtained by adding the height dimension of the other component 92 and the insulation distance to be ensured between the other component 92 and the magnetic sensor 61.

[0109] In addition, if Fig.23 As shown in (A), the bobbin 64 is provided with two joints 67 for joining the magnetic sensor 61 and the sensor support member 81. One of the joints 67 is provided on the left side of the left support portion 66, and the other joint 67 is provided on the right side of the right support portion 66. Fig. 22 As shown in FIG. 2(A) , each engaging portion 67 is provided with an engaging hole 68 into which an engaging protrusion 85 of a sensor mounting portion 84 provided on a sensor support member 81 is inserted.

[0110] Each terminal 71 is a compression terminal. In addition, the compression terminal is sometimes also called a spring terminal. Fig.24 Terminal 71 is shown. Fig.24As shown, each terminal 71 is formed of a conductive material such as a metal material. Each terminal 71 has a base 72, a wire connecting portion 73, a spring portion 74, and a contact portion 75. The base 72 is formed into a plate-like shape bent into a U-shape. The wire connecting portion 73 protrudes forward from the front end portion on the upper side of the base 72. The wire connecting portion 73 is connected to the end portion of the insulated wire forming the coil 63, from which the insulating coating is removed. The spring portion 74 protrudes downward and rearward from the front end portion on the lower side of the base 72, and a contact portion 75 is provided at the protruding end portion of the spring portion 74. In addition, a slit 76 is formed in the spring portion 74 and the contact portion 75. The spring portion 74 is a portion that functions as a leaf spring, and can displace the contact portion 75 in the up and down directions by elastic deformation. The contact portion 75 contacts the connection pad provided on the component mounting surface 91A of the substrate 91.

[0111] like Fig.23 As shown in (A), a terminal mounting hole 69 is provided in front of each support portion 66 of the bobbin 64. The terminal 71 is fixed to the support portion 66 by inserting the base portion 72 into the terminal mounting hole 69. Fig.23 As shown in (B), a cutout 70 is formed at the lower end of the front portion of each support portion 66 of the bobbin 64, through which the spring portion 74 of the terminal 71 passes. The spring portion 74 and the contact portion 75 pass through the cutout 70 and protrude downward from the lower end surface 66A of the support portion 66. When the magnetic sensor device 60 is mounted on the substrate 91, the contact portion 75 of each terminal 71 is arranged on the connection pad provided on the component mounting surface 91A of the substrate 91. When the lower end surface 66A of each support portion 66 is brought into contact with the component mounting surface 91A, the contact portion 75 is pressed upward by the upper surface of the connection pad, and the spring portion 74 is elastically deformed accordingly, and the contact portion 75 is displaced upward. As a result, the contact portion 75 is pressed against the upper surface of the connection pad by the elastic force of the spring portion 74.

[0112] like Fig.21 As shown, the yoke 77 has two yoke pieces 77A. Each yoke piece 77A is formed of a soft magnetic material such as iron. A portion of the yoke piece 77A on one side is arranged in front of the left portion of the magnetic sensor 61, and the other portion of the yoke piece 77A on one side is arranged above the left end portion of the magnetic sensor 61. In addition, a portion of the yoke piece 77A on the other side is arranged in front of the right portion of the magnetic sensor 61, and the other portion of the yoke piece 77A on the other side is arranged above the right end portion of the magnetic sensor 61.

[0113] The three magnetic sensors 61 are mounted on three sensor mounting portions 84, which are provided on the outer periphery of the main body 82 of the sensor support member 81. In addition, the three yokes 77 are embedded in the inner periphery of the main body 82. For example, the sensor support member 81 and the yokes 77 are integrally formed by insert molding. In addition, as Fig.19As shown, in the main body 82, three yokes 77 are arranged to correspond to the three magnetic sensors 61. In the main body 82, one magnetic sensor 61 and one yoke 77 corresponding to each other are arranged so that the positional relationship between the two is Fig.21 The position relationship shown.

[0114] The sensor support member 81 is a member for supporting the three magnetic sensors 61 and the three magnetic yokes 77 on the member mounting surface 91A of the substrate 91. The sensor support member 81 is formed of a non-magnetic material such as resin. Figures 17 to 20 As shown, the sensor support member 81 includes a main body portion 82 , three sensor mounting portions 84 , three pairs of support portions 86 , and three fixing portions 87 .

[0115] The main body 82 has a predetermined three-dimensional shape extending in the first direction. Fig.17 As shown, the main body 82 is formed into a flat plate shape that can cover most of the three magnetic sensors 61 from above and has a thickness that can bury the three magnetic yokes 77 inside and extends in the left-right direction and the front-back direction. In addition, in this embodiment, the "first direction" refers to the left-right direction or the front-back direction. In addition, as Fig.19 As shown in FIG. 1 , the main body 82 has a three-dimensionally symmetrical (120-degree symmetrical) polygonal shape when the magnetic sensor device 60 is viewed from above. A central hole 83 is formed at the center of the main body 82 so as to penetrate the main body 82 in the vertical direction.

[0116] The sensor mounting portion 84 is a portion for mounting the magnetic sensor 61 on the main body portion 82 , and is provided on the lower surface 82A of the main body portion 82 . Fig.25 FIG. 8 shows the state of the sensor support member 81 as viewed from obliquely below. Fig.25 As shown, three sensor mounting portions 84 are provided on the lower surface 82A of the main body 82 to mount the three magnetic sensors 61 of the magnetic sensor device 60. Each sensor mounting portion 84 is a recess or cutout provided on the outer periphery of the lower surface 82A of the main body 82. The three sensor mounting portions 84 are arranged at intervals of 120 degrees on the outer periphery of the lower surface 82A of the main body 82 so that the distances from the center of the main body 82 are equal.

[0117] like Fig.18 As shown in FIG. 1 , each magnetic sensor 61 is inserted from below the main body 82 and installed in the sensor installation portion 84. Each magnetic sensor 61 is installed in the sensor installation portion 84 in such a manner that the axis F of the bobbin 64 is parallel to the lower surface 82A of the main body 82. In addition, when the magnetic sensor device 60 is viewed from above, as shown in FIG. Fig.19As shown, the three magnetic sensors 61 respectively mounted on the three sensor mounting portions 84 are arranged at intervals of 120 degrees along a circle Q centered on the center C of the main body 82. In addition, when the magnetic sensor device 60 is viewed from above, each magnetic sensor 61 is arranged so that the central portion of the extension direction of the magnetic wire 62 is tangent to the circle Q.

[0118] In addition, if Fig.25 As shown, a coupling protrusion 85 is provided at one end and the other end of each sensor mounting portion 84. When the magnetic sensor 61 is inserted into the sensor mounting portion 84 from below, the two coupling protrusions 85 provided on the sensor mounting portion 84 are respectively inserted into the coupling holes 68 formed in the two coupling portions 67 provided on the bobbin 64 of the magnetic sensor 61. In this state, each coupling protrusion 85 is coupled to each coupling portion 67 by means of heat riveting or the like, thereby fixing the magnetic sensor 61 in the sensor mounting portion 84.

[0119] Six support pillars 86 are provided on the lower surface 82A of the main body 82. Each support pillar 86 protrudes downward from the lower surface 82A of the main body 82. Fig.25 As shown in FIG. 1 , the six support portions 86 are arranged on both sides of the three sensor mounting portions 84 so as to sandwich the three sensor mounting portions 84. In addition, the end surface of each support portion 86, i.e., the lower end surface 86A, is a flat surface parallel to the lower surface 82A of the main body 82. When the magnetic sensor device 60 is mounted on the substrate 91, the lower end surface 86A of each support portion 86 contacts the component mounting surface 91A of the substrate 91. In addition, as shown in FIG. Fig.18 As shown, the amount of downward protrusion of each support portion 86 from the lower surface 82A is set so that the lower end surface 86A of the support portion 86 and the lower end surface 66A of each support portion 66 of the bobbin 64 of the magnetic sensor 61 mounted on each sensor mounting portion 84 are aligned in the vertical direction.

[0120] Each fixing portion 87 has a function of fixing the sensor support member 81 to the substrate 91 using a fixing member. Fig.19As shown in FIG. 1 , each fixing portion 87 is provided on the outer periphery of the main body 82. In addition, three fixing portions 87 are arranged on the outer periphery of the main body 82 at intervals of 120 degrees, for example. In addition, each fixing portion 87 is arranged between two adjacent sensor mounting portions 84 on the outer periphery of the main body 82. In addition, each fixing portion 87 protrudes downward from the main body 82, and the lower end surface of each fixing portion 87 is aligned with the lower end surface 86A of the support portion 86 and the lower end surface 66A of each support portion 66 of the bobbin 64 of the magnetic sensor 61 mounted to each sensor mounting portion 84 in the vertical direction. When the magnetic sensor device 60 is mounted on the substrate 91, the lower end surface of each fixing portion 87 contacts the component mounting surface 91A of the substrate 91. In addition, each fixing portion 87 is formed with a fixing hole 88 for inserting a fixing member for fixing the sensor support member 81 to the substrate 91. The fixing hole 88 penetrates the fixing portion 87 in the vertical direction.

[0121] Fig.26 The magnetic sensor device 60 mounted on the substrate 91 is shown as viewed from above. Fig. 27 Schematically shows the Fig.26 The cross section of the magnetic sensor device 60 and the substrate 91 cut along the cutting line LL in FIG. Fig.26 In addition, since the magnetic sensor device 60 has a three-dimensional symmetrical structure when viewed from above, Fig.26 The cross section of the magnetic sensor device 60 cut along the cutting line MM in FIG. Fig.26 The cross sections of the magnetic sensor device 60 cut along the cutting line NN in FIG. Fig.26 The cross section of the magnetic sensor device 60 cut along the cutting line LL in FIG. Fig. 27 The cross-sections of the magnetic sensor devices 60 shown are identical.

[0122] When the magnetic sensor device 60 is mounted on the substrate 91, Fig.26 as well as Fig. 27 As shown, the sensor support member 81 is arranged on the component mounting surface 91A of the substrate 91 while the fixing holes 88 of the fixing portions 87 of the sensor support member 81 are aligned with the holes for fixing the magnetic sensor device provided on the substrate 91. Then, a fixing member 93 such as a bolt is inserted into the fixing hole 88 and the hole for fixing the magnetic sensor device, and another fixing member 94 such as a nut is coupled (for example, fastened) to the fixing member 93. Thus, the sensor support member 81 is fixed to the component mounting surface 91A of the substrate 91.

[0123] Thus, when the sensor support member 81 is fixed to the substrate 91, the lower end surface 66A of each support portion 66 of the bobbin 64 of each magnetic sensor 61, the lower end surface 86A of each support portion 86 of the sensor support member 81, and the lower end surface of each fixing portion 87 of the sensor support member 81 are respectively in contact with the component mounting surface 91A of the substrate 91. In addition, each terminal 71 of each magnetic sensor 61 is in contact with a connection pad provided on the component mounting surface 91A. In addition, as Fig. 27 As shown in the figure, the portion of the outer circumferential surface of the coil 63 of each magnetic sensor 61 that faces the component mounting surface 91A and the component mounting surface 91A are separated from each other, and the distance J therebetween is greater than the height dimension of the other component 92. That is, a component arrangement space 89 in which the other component 92 can be arranged is formed between the portion of the outer circumferential surface of the coil 63 of each magnetic sensor 61 that faces the component mounting surface 91A and the component mounting surface 91A.

[0124] In addition, if Fig.28 As shown, by using the magnetic sensor device 60, it is possible to form a Fig.15 The rotation detection device 95 is a rotation detection device 95 having the same structure as the rotation detection device 55 shown in FIG. Since the three magnetic sensors 61 and the three yokes 77 are respectively fixed to the sensor support member 81 of the magnetic sensor device 60, the rotation detection device 95 can be easily formed by placing and fixing the sensor support member 81 on the component mounting surface 91A of the substrate 91 while determining the position of the sensor support member 81 relative to the rotating shaft 19 or the magnetic field forming member 16. In addition, when the sensor support member 81 is placed on the component mounting surface 91A of the substrate 91 while determining the position of the sensor support member 81 relative to the rotating shaft 19 or the magnetic field forming member 16, the central hole 83 of the sensor support member 81 is aligned with the insertion hole 18 formed in the substrate 17, and the rotating shaft 19 inserted into the insertion hole 18 and the magnetic field forming member 16 fixed to the rotating shaft 19 are arranged in the central hole 83 of the sensor support member 81. As a result, the three yokes 77 and the three magnetic sensors 61 are arranged on the outer peripheral side of the magnetic field forming member 16.

[0125] As described above, according to the magnetic sensor device 60 which is the second embodiment of the magnetic sensor device of the present invention, other components 92 can be arranged in the area forming the component arrangement space 89 on the component mounting surface 91A of the substrate 91. Thus, according to the magnetic sensor device 60, an area for arranging electric and electronic components other than the magnetic sensor device 60 can be increased in the component mounting surface 91A on which the magnetic sensor device 60 is arranged.

[0126] Furthermore, in the above-described embodiments, the case where electric and electronic components other than the magnetic sensor or the magnetic sensor device are arranged in the component arrangement space is exemplified, but components other than the electric and electronic components may also be arranged in the component arrangement space.

[0127] In addition, although in the above-mentioned magnetic sensor embodiment and the first embodiment of the magnetic sensor device, surface mount terminals are listed as examples of terminals of the magnetic sensor, and in the second embodiment of the above-mentioned magnetic sensor device, compression terminals are listed as examples of terminals of the magnetic sensor, the terminals of the magnetic sensor in the present invention can be either DIP type terminals or press-fit type terminals.

[0128] In the second embodiment of the magnetic sensor device, the main body 82 of the sensor support member 81 is shown as an example. Fig.19 Although the case where three magnetic sensors 61 and three yokes 77 are arranged is shown, the number and positions of the magnetic sensors and yokes arranged in the main body of the sensor support member can be changed according to the purpose of use of the magnetic sensor device, etc.

[0129] The present invention can be modified appropriately within the scope that does not violate the gist or concept of the invention that can be read from the claims and the entire specification, and the magnetic sensor and magnetic sensor device accompanying such modifications are also included in the technical concept of the present invention.

Claims

1. A magnetic sensor using a large Barkhausen effect, characterized in that: The magnetic sensor has: Magnetic wires play a big Barkhausen effect; a coil through which a current flows in accordance with a change in the magnetization direction of the magnetic wire; and The bobbin includes a wire winding portion in which the magnetic wire is arranged and the wire forming the coil is wound around the outer periphery, and a pair of support portions provided at both end side portions of the wire winding portion, The pair of support parts protrude from both end side parts of the wire winding part in a direction intersecting with the axis of the wire winding part. The end surface of each of the pillar portions on the protruding end side is a surface that contacts the component mounting surface when the magnetic sensor is mounted on the substrate. The amount of protrusion of the pair of support portions from the two end side portions of the wire winding portion in the one direction is set so that, when the magnetic sensor is mounted on the substrate, a component configuration space is formed between a portion of the outer peripheral surface of the coil that is opposite to the component mounting surface and the component mounting surface, in which components that are conceivable to be configured on the component mounting surface other than the magnetic sensor are configured.

2. The magnetic sensor according to claim 1, characterized in that The protrusion amount of the pair of support portions is set so that, when the magnetic sensor is mounted on the substrate, a distance between a portion of the outer peripheral surface of the coil facing the component mounting surface and the component mounting surface is greater than a height dimension of the component.

3. The magnetic sensor according to claim 1, characterized in that The protrusion amount of the pair of support portions is set so that, when the magnetic sensor is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil that is opposite to the component mounting surface and the component mounting surface is greater than a value obtained by adding a height dimension of the component and an insulation distance to be ensured between the component and the magnetic sensor.

4. A magnetic sensor device, which is a magnetic sensor device using a large Barkhausen effect, characterized in that: The magnetic sensor device comprises: A magnetic sensor having a magnetic wire that exerts a large Barkhausen effect, a coil through which a current flows in accordance with a change in the magnetization direction of the magnetic wire, and a bobbin in which the magnetic wire is arranged and an electric wire forming the coil is wound around the outer periphery; and a sensor support component for supporting the magnetic sensor on a component mounting surface of the substrate, The sensor support component has: The main body has a predetermined three-dimensional shape extending along a first direction; a sensor mounting portion provided on the main body portion, and mounting the magnetic sensor on the main body portion in such a manner that the axis of the bobbin is oriented parallel to a plane including the first direction; as well as A plurality of support pillars are provided on the main body. Each of the support portions protrudes from the main body portion in a second direction intersecting a plane including the first direction. The end surface of each of the support portions on the protruding end side is a surface that contacts the component mounting surface when the magnetic sensor device is mounted on the substrate. The amount of protrusion of each of the support portions from the main body toward the second direction is set so that, when the magnetic sensor device is mounted on the substrate, a component configuration space capable of configuring components conceivably configured on the component mounting surface other than the magnetic sensor device is formed between a portion of the outer peripheral surface of the coil of the magnetic sensor mounted on the sensor mounting portion that is opposite to the component mounting surface and the component mounting surface.

5. The magnetic sensor device according to claim 4, characterized in that The protrusion amount of each of the support portions is set so that, when the magnetic sensor device is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil of the magnetic sensor mounted on the sensor mounting portion that is opposite to the component mounting surface and the component mounting surface is greater than the height dimension of the component.

6. The magnetic sensor device according to claim 4, characterized in that The protrusion amount of each of the support portions is set so that, when the magnetic sensor device is mounted on the substrate, the distance between the portion of the outer peripheral surface of the coil of the magnetic sensor mounted on the sensor mounting portion that is opposite to the component mounting surface and the component mounting surface is greater than a value obtained by adding a height dimension of the component and an insulation distance to be ensured between the component and the magnetic sensor.

7. The magnetic sensor device according to claim 4, characterized in that The sensor support member has a fixing portion for fixing the sensor support member to the substrate using a fixing tool.

8. The magnetic sensor device according to claim 4, characterized in that The main body is provided with a yoke that controls the direction of magnetic flux of a magnetic field acting on the magnetic sensor.

9. The magnetic sensor device according to claim 4, characterized in that A plurality of magnetic sensors are provided, The sensor support member includes a plurality of sensor mounting portions for mounting the plurality of magnetic sensors on the main body portion, respectively.

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