Test load device and test method of high voltage source

Abstract

The invention provides a test load device and a test method of a high voltage source. The test load device comprises a test box body which comprises an accommodating space; the M load units are located in the containing space, and at least one load unit comprises one or more loads; and the N test interfaces are located on at least one surface of the test box body, and the test interfaces are electrically connected with at least one part of the M load units. Wherein the N test interfaces comprise a first test interface and a second test interface, all the load units electrically connected with the first test interface have a first resistance value as a whole, all the load units electrically connected with the second test interface have a second resistance value as a whole, and the first resistance value is different from the second resistance value; wherein M and N are positive integers greater than or equal to 2.

Description

Technical Field

[0001] The present disclosure relates to the technical field of high voltage testing, and more specifically, to a testing method for testing a load device and a high voltage source. Background Art

[0002] Resistive load is a common test tool used in the field of switching power supplies and is widely used in the field of power electronics. Resistive load is often used to test the load capacity of switching power supplies, assisting designers and production personnel to determine whether the design capacity and load capacity of the switching power supply meet the use requirements.

[0003] High voltage power supply is a kind of switching power supply subdivision, belonging to special switching power supply, its output voltage value is much higher than conventional switching power supply, the output amplitude is usually 160kV~300kV, and the power is also different, so the design of test load for high voltage power supply is relatively difficult, and the selection of resistance model is cumbersome. Usually, suitable test loads cannot be purchased on the market. The test loads are designed by high voltage power supply manufacturers themselves, which are bulky and cumbersome to use. It is difficult to apply to a variety of different models of high voltage power supply products, which affects the performance test and mass production efficiency of the products. Summary of the invention

[0004] In view of this, an embodiment of the present disclosure provides a test method for testing a load device and a high voltage source.

[0005] One aspect of the present disclosure provides a test load device, comprising:

[0006] A test box, the test box comprising a containing space;

[0007] M load units, located in the accommodation space, at least one of the load units comprising one or more loads; and

[0008] N test interfaces are located on at least one surface of the test box, and the test interfaces are electrically connected to at least a portion of the M load units.

[0009] Among them, the N test interfaces include a first test interface and a second test interface, all the load units electrically connected to the first test interface have a first resistance as a whole, and all the load units electrically connected to the second test interface have a second resistance as a whole, and the first resistance is different from the second resistance, wherein M and N are positive integers greater than or equal to 2.

[0010] According to an embodiment of the present disclosure, one of the load units is connected to one of the test interfaces; and / or,

[0011] At least two of the load units are connected in series or in parallel and then connected to one of the test interfaces.

[0012] According to an embodiment of the present disclosure, the test load device further includes at least one insulating structure located in the accommodating space, and at least one of the insulating structures is located between two adjacent load units.

[0013] According to an embodiment of the present disclosure, the insulating structure comprises a solid insulating plate, and at least two of the load units are electrically connected via a connecting wire that bypasses the insulating plate; and / or,

[0014] At least one of the insulating plates comprises a via hole, and at least two of the load units are electrically connected via a connecting wire passing through the via hole.

[0015] According to an embodiment of the present disclosure, the test load device further includes insulating oil located in the accommodating space, and the load unit is in direct contact with the insulating oil.

[0016] According to an embodiment of the present disclosure, the test load device further includes an oil cooler, which is located outside the test box, and the insulating oil is connected to the oil cooler via an oil cooler interface, which is located on at least one surface of the test box.

[0017] According to an embodiment of the present disclosure, the test box further includes an oil inlet and an oil outlet.

[0018] According to an embodiment of the present disclosure, the test load device further includes a grounding terminal located at the test box, and the grounding terminal is configured to ground the test box.

[0019] According to an embodiment of the present disclosure, the test load device further includes an ammeter and a current detection terminal located on the surface of the test box, one end of the ammeter is grounded, and the other end of the ammeter is electrically connected to the load unit through the current detection terminal.

[0020] According to an embodiment of the present disclosure, one end of the load unit is electrically connected to the test interface, and the other end of the load unit is electrically connected to the current detection end.

[0021] According to an embodiment of the present disclosure, the test load device further includes a plurality of casters located at a lower portion of the test box.

[0022] According to an embodiment of the present disclosure, the pressure resistance performance of materials of at least two of the test interfaces is different.

[0023] Another aspect of the present disclosure provides a method for testing a high voltage source, comprising:

[0024] Providing a test load device as described in any one of the above items;

[0025] According to the target voltage of the high voltage source to be tested, selecting a corresponding test interface in the test load device;

[0026] Connecting the output end of the high voltage source to the corresponding test interface in the test load device;

[0027] Grounding the ground terminal of the test load device;

[0028] increasing the voltage at the output end of the high voltage source to the target voltage; and

[0029] The voltage at the output end of the high voltage source is maintained at the target voltage and continuously operated for a predetermined time period to complete the high voltage source test.

[0030] According to an embodiment of the present disclosure, the high voltage source includes at least one of a high voltage power supply and a high voltage ray source.

[0031] One or more of the above embodiments have the following beneficial effects:

[0032] (1) With the compatibility design of different voltages and powers, one set of test load device can be compatible with testing multiple sets of products, avoiding the redundancy of test tools and saving costs;

[0033] (2) Relatively small in size, which can save floor space;

[0034] (3) Safe insulation design prevents high voltage electricity from being exposed in the air, thus improving the safety of operators;

[0035] (4) Good oil cooling design to extend the continuous operation time and service life of the load;

[0036] (5) Transportation and movement are convenient, avoiding the transportation troubles caused by changing locations or relocating positions. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other objects, features and advantages of the present disclosure will become more apparent through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0038] Figure 1A is a schematic structural diagram of a CT device according to an exemplary embodiment of the present disclosure.

[0039] Figure 1B yes Figure 1A A side view of a CT device is shown.

[0040] Figure 2 is a schematic structural diagram of an X-ray generator according to an exemplary embodiment of the present disclosure.

[0041] Figure 3is a schematic diagram schematically illustrating a principle of generating X-rays by an X-ray generator according to an exemplary embodiment of the present disclosure.

[0042] Figure 4A is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a single power supply method.

[0043] Figure 4B is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a dual power supply method.

[0044] Figure 5 is a schematic diagram of a power supply for an X-ray generator according to an exemplary embodiment of the present disclosure.

[0045] Figure 6 is a schematic structural diagram of a test load device according to an embodiment of the present disclosure.

[0046] Figure 7 is a flow chart of a method for testing a high voltage source according to an embodiment of the present disclosure.

[0047] Figure 8 A block diagram of an electronic device suitable for implementing the function of controlling the test load device and / or the test method of the high voltage source according to an embodiment of the present disclosure is schematically shown.

[0048] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the sizes of the overall / local structures or the overall / local areas may be enlarged or reduced, that is, these drawings are not drawn according to the actual scale. DETAILED DESCRIPTION

[0049] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present disclosure. In the following detailed description, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessary confusion of the concepts of the present disclosure.

[0050] The terms used herein are only for describing specific embodiments and are not intended to limit the present disclosure. The terms "comprise", "include", etc. used herein indicate the existence of the features, steps, operations and / or components, but do not exclude the existence or addition of one or more other features, steps, operations or components.

[0051] All terms (including technical and scientific terms) used herein have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0052] CT equipment usually includes a high-voltage power supply and / or a high-voltage radiation source. For example, the mainstream slip ring CT products in the industry install the high-voltage power supply and X-ray tube on the slip ring, and perform a 360° tomographic scan of the object or human body through the bearing rotation. The computer algorithm is used to reconstruct the three-dimensional image and the two-dimensional image to determine whether there are drugs or explosives in the package, or whether there are fractures or diseases in the human body.

[0053] Figure 1A is a schematic structural diagram of a CT device according to an exemplary embodiment of the present disclosure, Figure 1B yes Figure 1A A side view of a CT device is shown.

[0054] Combined with reference Figure 1A and Figure 1B According to an exemplary embodiment of the present disclosure, a CT device 10 includes: a conveying device 17 for conveying an object to be inspected in a conveying direction V; a slip ring 12 capable of rotating around a rotation axis, and the rotation axis can be substantially parallel to the conveying direction V; a radiation source 11 connected to the slip ring 12; a detection device 16 opposite to the radiation source 11 and connected to the slip ring 12, and the detection device 16 and the radiation source 11 can rotate together with the slip ring 12; a control device 18 for controlling the operation of the CT device 10; and a data processing device 15 for processing data detected by the detection device 16.

[0055] In the embodiment of the present disclosure, the ray source 11 can emit X-rays, that is, the ray source 11 can be an X-ray generator. For example, the ray source 11 can be an X-ray tube (also called an X-ray tube).

[0056] It should be noted that although Figure 1A and Figure 1B The CT device shown in the figure is a CT device for inspecting luggage or articles, but the figure is only for illustration. The CT device according to the embodiment of the present disclosure is not limited to a CT device for inspecting luggage or articles, for example, it can also be a CT device for inspecting the human body.

[0057] Figure 2 is a schematic structural diagram of an X-ray generator according to an exemplary embodiment of the present disclosure. Figure 3 is a schematic diagram schematically illustrating a principle of generating X-rays by an X-ray generator according to an exemplary embodiment of the present disclosure.

[0058] Reference Figure 2 and Figure 3 The X-ray generator 20 according to the exemplary embodiment of the present disclosure may include a tube shell 21 , the interior of the tube shell 21 is vacuum; and an anode 22 and a cathode 24 disposed in the tube shell 21 .

[0059] For example, the tube shell 21 may be a glass shell, which is used to fix and support the anode 22 and the cathode 24 and maintain the vacuum degree in the tube. The tube shell 21 may be made of molybdenum-group hard glass with high melting point, high insulation strength and small expansion coefficient. Since the expansion coefficients of the molybdenum-group glass shell and the metals of the cathode and anode are different, the two are not suitable for direct welding. Therefore, an alloy ring containing about 54% iron, about 29% nickel and about 17% cobalt may be inlaid on the copper body as an intermediate transition body, and then the glass shell is welded on the alloy ring, so that the expansion coefficients of the alloy ring and the hard glass are close to each other, so as to avoid cracks or breakages in the glass at the joint due to temperature changes.

[0060] In order to prevent the gas discharge in the tube shell 21 and ensure that the electrons emitted by the cathode 24 can fly to the anode 22 unimpeded and at high speed, the vacuum degree in the tube shell 21 should be maintained at 133.3×10 -7 In addition, all parts installed in the tube shell 21 are strictly cleaned, degreased and thoroughly degassed, for example, high-frequency vacuum heating and degassing can be used.

[0061] The main function of the anode 22 is to block the high-speed electron flow EB and generate X-rays XB, and at the same time radiate or conduct away the heat generated during exposure. In addition, the anode 22 can also absorb secondary electrons and scattered rays. In the embodiment of the present disclosure, the anode 22 can be a fixed anode or a rotating anode. Figure 2 In the illustrated embodiment, the schematic diagram shows that the anode 22 is a rotating anode.

[0062] Reference Figure 2 The anode 22 may include a target plate 221 and a target surface 222. The X-ray generator 20 may also include a driving mechanism 25 for driving the anode 22 to rotate. For example, the driving mechanism 25 may include a rotor 251, a stator 252, a rotating shaft 253, a bearing 254 and a bracket 255.

[0063] For example, the target disk 221 may be a single convex disk, the center of which is fixed on the rotating shaft 253, and the other end of the rotating shaft 253 is connected to the rotor 251. The target surface 222 has a certain target angle α (refer to Figure 3), for example, the target angle α can be between 6° and 17.5°. For example, a rhenium-tungsten alloy (e.g., containing 10% to 20% rhenium) can be used to make the target surface 222, and molybdenum or graphite can be used to make the target disk 221. In this way, the target surface of the rhenium-tungsten alloy has fine grains, high thermal expansion resistance, and high recrystallization temperature, thereby reducing or even eliminating defects such as cracking and roughness of the target surface. Compared with metal tungsten, molybdenum and graphite have large heat capacity, good heat dissipation rate and small mass. In this way, the formed target disk 221 has the advantages of large heat capacity, good heat dissipation effect and light mass, which effectively improves the continuous load capacity of the X-ray generator 20.

[0064] The rotor 251 is connected to the target plate 221 and the target surface 222 through the molybdenum rod 256. When the rotor 251 rotates, the target plate 221 and the target surface 222 rotate accordingly. In an X-ray tube using a rotating anode, the rotor 251 is installed in the tube shell 21, the stator 252 is installed outside the tube shell 21, a bearing 254 is installed at each end of the rotating shaft 253, and the rotor 251, the stator 252, the rotating shaft 253 and the bearing 254 are supported by a bracket 255.

[0065] The main function of the cathode 24 is to emit an electron beam and focus the electron beam so that the electron beam bombarding the target surface has a certain size and shape. The cathode 24 may include a filament 241. For example, the filament 241 may be made of tungsten, because tungsten has certain electron emission capabilities at high temperatures, a high melting point, good ductility, is easy to draw, has good tensile strength, and is not easily deformed under a strong electric field. The filament 241 may be wound into a small solenoid shape. For example, the filament voltage may be AC ​​5 to 10 V / 50 Hz, and the filament current may be 2 to 9 A. After the filament 241 is powered on, the temperature gradually rises, and electrons begin to be emitted after reaching a certain temperature (about 2100 K).

[0066] When a high voltage is applied between the anode 22 and the cathode 24 and a certain voltage is applied to both ends of the filament 241, a large number of free electrons are emitted from the cathode 24, which will collide with the rotating target surface 222. After the energy carried by the high-speed electron beam EB is sharply blocked, part of it is lost in the form of heat energy, and the other effective part will produce X-rays XB.

[0067] Figure 4A is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a single power supply method. Figure 4B is a schematic diagram of a power supply method of an X-ray generator according to an exemplary embodiment of the present disclosure, which schematically shows a dual power supply method. Figure 5 is a schematic diagram of a power supply for an X-ray generator according to an exemplary embodiment of the present disclosure.

[0068] Combined with reference Figure 4A , Figure 4B and Figure 5 According to an exemplary embodiment of the present disclosure, the power supply 30 of the X-ray generator may include a high voltage power supply 31 and a filament power supply 32, wherein the high voltage power supply 31 is used to apply a high voltage to the anode 22 and the cathode 24, and the filament power supply 32 is used to provide current to the filament 241.

[0069] exist Figure 4A In the embodiment shown, the high voltage power supply 31 and the filament power supply 32 can be closed-loop controlled by a set of control systems, and the control circuit is relatively simple.

[0070] exist Figure 4B In the embodiment shown, a dual power supply mode of positive and negative high voltage power supplies is adopted, which makes it easier to obtain high voltage. The output of the same high voltage is only half of that of a single power supply mode, and the device voltage resistance and power supply volume can be reduced.

[0071] According to the working principle of the X-ray tube, a sufficiently high voltage, i.e., a sufficient electric field strength, is required between the anode 22 (corresponding to the target) and the cathode 24 (corresponding to the filament) to make the electrons of the filament hit the target at high energy and high speed. Therefore, the voltage provided by the high-voltage power supply 31 needs to be sufficiently high. For example, the voltage amplitude provided by the high-voltage power supply 31 can be tens to hundreds of kilovolts (KV). The filament power supply 32 supplies the filament 241 with a low voltage power supply, whose voltage amplitude can be tens of volts (V) and power is tens of watts (W).

[0072] In the embodiment of the present disclosure, the negative electrode of the filament power supply 32 is electrically connected to the negative electrode of the high voltage power supply 31, so that the filament 241 of the entire X-ray tube is at a negative high voltage potential. Therefore, the high voltage insulation requirements for the filament power supply 32 are extremely high. In other words, the voltage at the high potential end inside the power supply 30 of the X-ray generator 20 is relatively high, and the withstand voltage and insulation requirements of the device are extremely high.

[0073] In the embodiment of the present disclosure, a filament transformer 40 may be added between the high voltage power supply 31 and the filament power supply 32 to achieve isolation.

[0074] Reference Figure 5 The power supply 30 may further include an initial power supply 33 , the high voltage power supply 31 may include a high voltage power supply controller 311 and a high voltage voltage doubling circuit 312 , and the filament power supply 32 may include a filament driving circuit 321 and a filament transformer 40 .

[0075] For example, the initial power source 33 may be AC ​​power such as a city power source, or may be DC power of an energy storage device. The high-voltage power source controller 311 converts the power provided by the initial power source 33 into a high-frequency AC power form, rectifies it through the high-voltage voltage multiplier circuit 312, and performs N-fold voltage boosting to a high voltage (for example, a high voltage of tens to hundreds of KV), and provides the high voltage to the target and filament of the X-ray tube on the high-voltage side.

[0076] The filament driving circuit 321 converts the electric energy provided by the initial power supply 33 into high-frequency alternating current, performs voltage conversion through the filament transformer 40, and transmits the alternating current energy from the low-voltage side to the filament 241 on the high-voltage side. The filament power supply 32 can directly supply power to the filament 241 in the form of alternating current, or can further rectify and supply power to the filament 241 in the form of direct current.

[0077] It should be understood that in the embodiment of the present disclosure, the filament transformer 40 may be a step-down transformer, and the voltage of the high-frequency alternating current output by the filament driving circuit 321 may be about 100-200V, for example, about 150V, and after the voltage conversion by the filament transformer 40, it is converted to about 10-50V, for example, about 10V. Since one end of the filament 241 is electrically connected to the negative electrode of the high-voltage power supply, the potential of one end of the filament 241 is a negative high voltage (for example, negative tens to hundreds of KV), and the potential of the other end is the negative high voltage plus the voltage after the voltage conversion of the filament transformer 40, so that the potential difference between the two ends of the filament 241 is tens of volts (V), for example, about 10-50V, about 10V.

[0078] That is, in the embodiment of the present disclosure, one end of the filament transformer 40 is connected to the high potential point ( Figure 5 The filament transformer 40 is electrically connected to the HP point in the middle of the filament transformer 40, and the potential amplitude of the high potential point is greater than 10 kV. Therefore, the filament transformer 40 requires higher voltage resistance and isolation insulation, that is, the filament transformer 40 requires a higher isolation voltage level.

[0079] The inventor has found through research that the performance of the high-voltage power supply is closely related to the performance of the X-ray generator, which in turn affects the performance stability of related products (such as CT equipment). In order to ensure the reliability and stability of related products, before assembling the high-voltage power supply and / or the high-voltage ray source (such as the X-ray generator) to the related products, it is necessary to test the high-voltage power supply and / or the high-voltage ray source, such as the load aging test, to ensure the reliability and stability of the high-voltage power supply and / or the high-voltage ray source, thereby improving the reliability and stability of the related products.

[0080] In the related art, some high-voltage power supply or radiation source manufacturers do not design resistive loads. When the power supply needs to be tested, an X-ray tube is used to match the test output power and power supply indicators. Limited by the price of the X-ray tube, the disadvantage of this is that the test cost is high, and the X-ray tube has a short service life and is easily damaged by long-term aging tests. Some manufacturers have designed resistive loads, but they are limited by the large insulation distance requirements of the high-voltage power supply and the bulky size. They even need to prepare a separate test room to introduce the high voltage and place the resistor in the air. When testing high-power power supplies, a large amount of forced air cooling is required to ensure that the load will not be overheated and damaged. The resistive loads designed by some manufacturers are not universal. For example, a 160kV4kW power supply needs to design a set of loads, and a 180kV10mA power supply needs to design another set of loads, which also causes redundancy and waste of cost and space.

[0081] Figure 6 is a schematic diagram of the structure of a test load device according to an embodiment of the present disclosure.

[0082] Exemplarily, an embodiment of the present disclosure provides a test load device 60. Figure 6 The test load device 60 may include a test box 601 , and the test box includes a containing space 600 .

[0083] Exemplarily, the test load device 60 may further include M load units RT, such as a first load unit R1 , a second load unit R2 , . . . , an Mth load unit RM, where M is a positive integer greater than or equal to 2. The M load units may be located in the accommodation space 600 .

[0084] Exemplarily, at least one load unit RT may include one or more loads. For example, a load unit RT may include multiple loads, and the multiple loads may be connected in series or parallel in various forms, so that the load unit RT has a set resistance value. For example, the resistance value of the first load unit R1 may be about 5MΩ, and the resistance value of the second load unit R2 may be about 700KΩ. The resistance value of each load unit may be specifically set according to the requirements, and the embodiments of the present disclosure are not limited thereto.

[0085] By arranging multiple load units in a closed accommodation space, the high voltage of the multiple load units can be prevented from being exposed when used for high voltage source testing, which is beneficial to increasing the safety of testers and can also reduce the test space and save floor space.

[0086] Exemplarily, the test load device 60 may further include N test interfaces HV. For example, the first test interface HV 1 , Second test interface HV 2 , ..., Nth test interface HV N . Wherein, N is a positive integer greater than or equal to 2.

[0087] Exemplarily, the N test interfaces may be located on at least one surface of the test box 601 .

[0088] In some embodiments, the N test interfaces may be located on the same surface of the test box 601 .

[0089] In some embodiments, at least a portion of the N test interfaces may be located on different surfaces of the test box 601 .

[0090] Exemplarily, the test interface HV may be electrically connected to at least a portion of the M load units.

[0091] For example, one test interface HV can be connected to one load unit RT. For example, the first load unit R1 can be connected to the first test interface HV alone. 1 The first test interface HV 1 The corresponding high voltage source can be tested. For example, the resistance of the first load unit R1 is about 6.4MΩ, so that the first test interface HV 1 It can be used to test the corresponding high voltage source, for example, to perform load aging test on a 160kV, 4kW high voltage source.

[0092] Exemplarily, at least two load units RT may be connected in series or in parallel and then connected to a test interface HV. For example, the first load unit R1 and the second load unit R2 may be connected in series or in parallel and then connected to a test interface HV. For example, the resistance of the first load unit R1 is about 6.4 MΩ, and the resistance of the second load unit R2 is about 11.6 MΩ. The first load unit R1 and the second load unit R2 may be connected in series and then connected to the second test interface HV. 2 connection, so that the second test interface HV 2 It can be used to test the corresponding high voltage source, for example, to perform load aging test on a 180kV, 10mA high voltage source.

[0093] For example, in some embodiments of the present disclosure, the first test interface HV 1 All the load units electrically connected have a first resistance value as a whole and are connected to the second test interface HV 2 All the electrically connected load units have a second resistance value as a whole, and the first resistance value is different from the second resistance value.

[0094] Through such a design, a set of test load devices can be compatible with testing multiple sets of products, the utilization rate of the test load device is higher, and the cost can be reduced.

[0095] In some embodiments, multiple test interfaces can be connected to the same load unit, thereby improving the utilization rate of the load unit to a greater extent, which is conducive to reducing costs, and can also save space and floor space.

[0096] In some embodiments of the present disclosure, the overall resistance values ​​of one or more loads corresponding to multiple test interfaces HV may be different, so that multiple test interfaces HV can be suitable for high-voltage source testing scenarios with different requirements. For example, the first test interface HV1 can be used for load testing of a 160KV high-voltage source, the second test interface HV2 can be used for load testing of a 225KV high-voltage source, and the Nth test interface can be used for load testing of a 300KV high-voltage source.

[0097] Through the resistance design of multiple load units and the flexible series-parallel design between multiple load units, the multiple test interfaces of the load testing device can realize the switching of different resistance values ​​and different high-voltage interfaces. A set of test load devices can be compatible with testing multiple sets of products, which is highly efficient, avoids the redundancy of test tooling, and saves costs. At the same time, one load unit can be used for multiple test interfaces, which is conducive to saving space and achieving relatively small size.

[0098] Exemplarily, the pressure resistance performance of the materials of at least two test interfaces HV is different. For example, multiple test interfaces can respectively adopt high-voltage socket interfaces of different specifications such as R24, R28 and R30. For example, the R24 model high-voltage socket interface can be used for 160KV high-voltage source testing. The R28 model high-voltage socket interface can be used for 225KV high-voltage source testing. The R30 model high-voltage socket interface can be used for 300KV high-voltage source testing.

[0099] By designing high-voltage sockets of different specifications, different test requirements can be met and the safety of the test can be improved.

[0100] For example, in some embodiments of the present disclosure, continue to refer to Figure 6 The test load device 60 may further include at least one insulating structure 610 located in the accommodating space 600 .

[0101] Exemplarily, at least one insulating structure 610 is located between two adjacent load units RT.

[0102] In some embodiments, an insulating structure 610 may be disposed between any two adjacent load units RT.

[0103] In some embodiments, an insulating structure 610 may be disposed between the load unit RT near the test box 601 and the test box.

[0104] This design can prevent breakdown, sparks, and other situations from occurring during the test, further improving safety.

[0105] Exemplarily, the insulating structure 610 may include a solid insulating plate, and at least two load units RT may be electrically connected via a connecting trace bypassing the insulating plate; and / or, at least one insulating plate includes a via VH, and at least two load units RT may be electrically connected via a connecting trace passing through the via VH.

[0106] Through such a design, it is possible to prevent breakdown, sparking, etc. from occurring during the test process while ensuring that multiple load units can be connected in series and parallel in a variety of flexible ways, thereby improving the utilization rate of the load units, saving space, and reducing costs.

[0107] For example, in some embodiments of the present disclosure, continue to refer to Figure 6 The test load device 60 may further include insulating oil in the accommodation space 600, and the load unit RT is in direct contact with the insulating oil. For example, the insulating oil may include a liquid insulating material, and the insulating oil may be injected into the accommodation space 600 so that the multiple load units RT are completely immersed or at least partially immersed in the insulating oil.

[0108] Through such a design, composite insulation can be achieved using liquid insulating oil and solid insulating structure, which can further improve the insulation effect, prevent breakdown, sparks, etc. during the test process, and further improve safety.

[0109] For example, in some embodiments of the present disclosure, continue to refer to Figure 6 The test load device 60 may further include an oil cooler 603 . The oil cooler 603 is located outside the test box 601 . The insulating oil may be connected to the oil cooler 603 through an oil cooler interface 602 . The oil cooler interface 602 is located on at least one surface of the test box 601 .

[0110] Through such a design, insulating oil can be used to dissipate heat for the load unit, which is beneficial to reducing the temperature of the load unit during the test process, thereby facilitating extending the continuous operation time and service life of the load.

[0111] Exemplarily, the test box 601 may further include an oil inlet 604 and an oil outlet 605. The oil inlet 604 may be used to inject insulating oil during assembly, and the oil outlet 605 may be used to discharge the insulating oil during maintenance.

[0112] Such a design can facilitate the injection and removal of insulating oil and the installation and maintenance of the load test device.

[0113] For example, in some embodiments of the present disclosure, continue to refer to Figure 6The test load device 60 may further include a ground terminal 606 located in the test box. The ground terminal 606 is configured to ground the test box 601.

[0114] With such a design, when the load test device is used for testing, the current on the surface of the test box can be introduced into the ground through the grounding terminal 606 to achieve leakage protection, thereby improving the safety of the test.

[0115] For example, in some embodiments of the present disclosure, continue to refer to Figure 6 The test load device 60 may further include an ammeter 608 and a current detection terminal 607 located on the surface of the test box.

[0116] Exemplarily, one end of the ammeter 608 is grounded, and the other end of the ammeter 608 is electrically connected to the load unit RT through the current detection end 607 .

[0117] Exemplarily, one end of the load unit RT is electrically connected to the test interface HV, and the other end of the load unit RT is electrically connected to the current detection end 607 .

[0118] Through such a design, the load current can be displayed during the test and the load current can be monitored in real time. The load current can assist in the identification and judgment of abnormal situations during the test, thereby facilitating timely relevant processing and improving the reliability and safety of the test.

[0119] For example, in some embodiments of the present disclosure, continue to refer to Figure 6 The test load device 60 may also include a plurality of casters 609 located at the bottom of the test box. For example, four casters may be installed at the bottom of the test box, so that the load test device can be moved more conveniently, thereby improving the practicality of the load test device.

[0120] Figure 7 is a flow chart of a method for testing a high voltage source according to an embodiment of the present disclosure.

[0121] Exemplarily, an embodiment of the present disclosure further provides a method for testing a high voltage source. Figure 7 The testing method may include the following steps S01-S06.

[0122] In step S01 , a test load device 60 as described in any one of the above items is provided.

[0123] In step S02, according to the target voltage of the high-voltage source to be tested, a corresponding test interface is selected in the test load device. For example, if the high-voltage source to be tested is a 160kV, 4kW high-voltage source, a test interface suitable for the test requirements can be selected from multiple test interfaces. For example, through the series-parallel design and resistance switching of one or more load units, the overall resistance of the load unit connected to the test interface can be about 6.4MΩ, so that the test interface can be suitable for load aging test of a 160kV, 4kW high-voltage source.

[0124] In step S03, the output end of the high voltage source is connected to the corresponding test interface in the test load device. For example, the output end of the high voltage source can be connected to the corresponding test interface in the test load device through a high voltage cable.

[0125] In step S04, the ground terminal of the test load device is grounded.

[0126] In step S05, the voltage at the output end of the high voltage source is increased to a target voltage. For example, if the high voltage source is a 200KV high voltage source, the target voltage may be the voltage when the high voltage source is working normally, such as 200KV.

[0127] In step S06 , the voltage at the output end of the high voltage source is maintained at the target voltage and continuously operated for a predetermined time period to complete the high voltage source test.

[0128] Exemplarily, the high voltage source may include at least one of a high voltage power supply and a high voltage ray source.

[0129] Through this method, the test interface can be flexibly selected to test high voltage sources of various specifications or requirements, thereby improving the applicability of the test.

[0130] It should be understood that this testing method has the same beneficial effects as the testing load device provided by the aforementioned embodiment.

[0131] Figure 8 A block diagram of an electronic device suitable for implementing the function of controlling the test load device and / or the test method of the high voltage source according to an embodiment of the present disclosure is schematically shown.

[0132] like Figure 8As shown, the electronic device 1100 according to an embodiment of the present disclosure includes a processor 1101, which can perform various appropriate actions and processes according to a program stored in a read-only memory (ROM) 1102 or a program loaded from a storage part 1108 to a random access memory (RAM) 1103. The processor 1101 may include, for example, a general-purpose microprocessor (such as a CPU), an instruction set processor and / or a related chipset and / or a special-purpose microprocessor (for example, an application-specific integrated circuit (ASIC)), etc. The processor 1101 may also include an onboard memory for caching purposes. The processor 1101 may include a single processing unit or multiple processing units for performing different actions of the method flow according to an embodiment of the present disclosure.

[0133] In RAM 1103, various programs and data required for the operation of electronic device 1100 are stored. Processor 1101, ROM 1102 and RAM 1103 are connected to each other through bus 1104. Processor 1101 performs various operations of the method flow according to the embodiment of the present disclosure by executing the program in ROM 1102 and / or RAM 1103. It should be noted that the program can also be stored in one or more memories other than ROM 1102 and RAM 1103. Processor 1101 can also perform various operations of the method flow according to the embodiment of the present disclosure by executing the program stored in the one or more memories.

[0134] According to an embodiment of the present disclosure, the electronic device 1100 may further include an input / output (I / O) interface 1105, which is also connected to the bus 1104. The electronic device 1100 may further include one or more of the following components connected to the I / O interface 1105: an input portion 1106 including a keyboard, a mouse, etc.; an output portion 1107 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc., and a speaker, etc.; a storage portion 1108 including a hard disk, etc.; and a communication portion 1109 including a network interface card such as a LAN card, a modem, etc. The communication portion 1109 performs communication processing via a network such as the Internet. A drive 1110 is also connected to the I / O interface 1105 as needed. A removable medium 1111, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 1110 as needed, so that a computer program read therefrom is installed into the storage portion 1108 as needed.

[0135] Those skilled in the art can understand that the embodiments described above are exemplary and can be improved by those skilled in the art. The structures described in various embodiments can be freely combined without causing conflicts in structure or principle.

[0136] After describing the preferred embodiments of the present disclosure in detail, those skilled in the art can clearly understand that various changes and modifications can be made without departing from the scope and spirit of the appended claims, and the present disclosure is not limited to the implementation methods of the exemplary embodiments listed in the specification.

Claims

1. A test load device, characterized in that: include: A test box, the test box comprising a containing space; M load units, located in the accommodation space, at least one of the load units comprising one or more loads; and N test interfaces are located on at least one surface of the test box, and the test interfaces are electrically connected to at least a portion of the M load units. Among them, the N test interfaces include a first test interface and a second test interface, all the load units electrically connected to the first test interface have a first resistance as a whole, and all the load units electrically connected to the second test interface have a second resistance as a whole, and the first resistance is different from the second resistance, wherein M and N are positive integers greater than or equal to 2.

2. The test load device according to claim 1, characterized in that: One of the load units is connected to one of the test interfaces; and / or, At least two of the load units are connected in series or in parallel and then connected to one of the test interfaces.

3. The test load device according to claim 1 or 2, characterized in that: The test load device further includes at least one insulating structure located in the accommodating space, and at least one of the insulating structures is located between two adjacent load units.

4. The test load device according to claim 3, characterized in that: The insulating structure comprises a solid insulating plate, and at least two of the load units are electrically connected via a connecting line bypassing the insulating plate; and / or, At least one of the insulating plates comprises a via hole, and at least two of the load units are electrically connected via a connecting wire passing through the via hole.

5. The test load device according to any one of claims 1 to 4, characterized in that: The test load device further includes insulating oil located in the accommodation space, and the load unit is in direct contact with the insulating oil.

6. The test load device according to claim 5, characterized in that: The test load device further includes an oil cooler, which is located outside the test box. The insulating oil is connected to the oil cooler via an oil cooler interface, and the oil cooler interface is located on at least one surface of the test box.

7. The test load device according to claim 6, characterized in that: The test box also includes an oil inlet and an oil outlet.

8. The test load device according to claim 7, characterized in that: The test load device further includes a ground terminal located at the test box, and the ground terminal is configured to ground the test box.

9. The test load device according to claim 8, characterized in that: The test load device further comprises an ammeter and a current detection terminal located on the surface of the test box, one end of the ammeter is grounded, and the other end of the ammeter is electrically connected to the load unit through the current detection terminal.

10. The test load device according to claim 9, characterized in that: One end of the load unit is electrically connected to the test interface, and the other end of the load unit is electrically connected to the current detection end.

11. The test load device according to claim 1, characterized in that: The test load device also includes a plurality of casters located at the lower portion of the test box.

12. The test load device according to claim 1, characterized in that: The pressure resistance properties of materials of at least two of the test interfaces are different.

13. A method for testing a high voltage source, characterized in that: include: Providing a test load device as described in any one of claims 1-12; According to the target voltage of the high voltage source to be tested, selecting a corresponding test interface in the test load device; Connecting the output end of the high voltage source to the corresponding test interface in the test load device; Grounding the ground terminal of the test load device; Increasing the voltage at the output end of the high voltage source to the target voltage; as well as The voltage at the output end of the high voltage source is maintained at the target voltage and continuously operated for a predetermined time period to complete the high voltage source test.

14. The method according to claim 13, characterized in that The high voltage source includes at least one of a high voltage power supply and a high voltage ray source.

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