Testing device of integrated circuit

Abstract

The invention discloses a testing device of an integrated circuit, and relates to the technical field of integrated circuit testing. The testing device of the integrated circuit comprises a mounting bottom plate and an auxiliary mechanism, a fixing plate is arranged above the mounting bottom plate, four groups of testing probes are arranged above the fixing plate, two groups of fixing blocks are arranged below the fixing plate, four groups of cleaning soft blocks are arranged above the mounting bottom plate, and four groups of stable shells are arranged below the fixing plate; and the auxiliary mechanism comprises a fixed adjusting mechanism, a buffer mechanism, a detachable mechanism and a stable shell. Through cooperative use of a fixed short rod, a first damper, a first high-pressure spring, a second damper, a second high-pressure spring, a connecting short plate and a fixed plate, during testing, through contact of the fixed short rod and the connecting short plate, a buffer mechanism can reduce pressure borne by a test probe in the testing process and make the pressure borne by the test probe uniform, and the test efficiency is improved. The service life of the test probe is prolonged, and the working efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit testing, and in particular to a testing device for an integrated circuit. Background Art

[0002] Integrated circuit testing is an important part of the integrated circuit design and manufacturing process. It mainly tests the performance, function and reliability of the integrated circuit to ensure that the integrated circuit can meet the design requirements and performance indicators in actual applications and ensure that all functional modules can correctly perform the intended tasks.

[0003] Chinese professional document CN115201658A discloses a multifunctional testing device for integrated circuits, which relates to the field of integrated circuit testing technology, and comprises: a base, wherein the interior of the base is provided with two guide grooves in a linear array, the guide grooves are used for sliding guide blocks, and a side plate is fixedly connected to the top surface of the base, and there are two side plates in total, and the two side plates are respectively fixedly connected to the left and right sides of the top surface of the base, and a rebounder is fixedly connected to one side of the two side plates, and a guide frame is installed on the inner side of the rebounder, and the guide frame is fixedly connected to the top surface of the guide block, and the integrated circuit installed on the inner side of the carrying box and the heating box installed on the inner side thereof is simulated by the impact of the guide frame to simulate the operating environment of the integrated circuit under bumpy conditions, thereby realizing a more simulated integrated circuit testing environment, and solving the problem that it is difficult to simulate the working conditions of the integrated circuit under the real state under the existing stable environment, and then the test cannot be performed under the simulated condition.

[0004] When the integrated circuit is tested in the above-mentioned multifunctional testing device, the test probe may be subjected to excessive or uneven pressure during the test, causing damage to the test probe, reducing the service life of the test probe and reducing work efficiency. Summary of the invention

[0005] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art and to provide a testing device for an integrated circuit that can solve the above-mentioned problem.

[0006] To achieve the above object, the present invention provides the following technical solution: a testing device for an integrated circuit, comprising:

[0007] A mounting base plate is provided above the mounting base plate, four groups of test probes are provided above the mounting base plate, two groups of fixing blocks are provided below the fixing plate, four groups of cleaning soft blocks are provided above the mounting base plate, four groups of stabilizing shells are provided below the fixing plate, and four groups of arc-shaped stabilizing blocks are provided below the four groups of stabilizing shells;

[0008] The auxiliary mechanism includes a fixed adjustment mechanism, a buffer mechanism, a detachable mechanism and a stable shell. The buffer mechanism is arranged on a fixed plate. The buffer mechanism is used to reduce the pressure on the test probe during the test. The buffer mechanism includes a damper 1, a high-pressure spring 1, a damper 2, a high-pressure spring 2 and a connecting short plate. Two groups of dampers 2 are fixedly installed on the top of the fixed plate. A group of connecting short plates are fixedly installed on the top of the two groups of dampers 2. A group of high-pressure springs 2 are sleeved on the outer walls of the two groups of dampers 2. One end of the two groups of high-pressure springs 2 are fixedly connected to the bottom of a group of connecting short plates. Two groups of dampers 1 are fixedly installed on the bottom of the fixed plate. A group of high-pressure springs 1 are sleeved on the outer walls of the two groups of dampers 1.

[0009] Preferably, the fixed adjustment mechanism is arranged on the mounting base plate, and is used to fix the integrated circuit board for testing. The fixed adjustment mechanism includes a bidirectional threaded rod, a movable block and a bar slide groove. A bar slide groove is provided on the top of the mounting base plate, and a bidirectional threaded rod is rotatably installed inside the bar slide groove. The outer wall of the bidirectional threaded rod is threadedly connected with two groups of movable blocks.

[0010] Preferably, the detachable mechanism is arranged on the fixed plate, and the detachable mechanism is used to replace and clean the cleaning soft block. The detachable mechanism includes a threaded hole and a threaded sleeve. Four groups of threaded holes are opened on the top of the fixed plate, and a group of threaded sleeves are threadedly connected in the four groups of threaded holes.

[0011] Preferably, the stabilizing mechanism is arranged on a stabilizing shell, and the stabilizing mechanism is used to stabilize the test probe, and the stabilizing mechanism includes a rotating adjustment plate, a rotating short rod, a fixed circular plate, a sliding short rod and an arc-shaped connecting block. A rotating adjustment plate is rotatably installed inside the stabilizing shell, a fixed circular plate is fixedly installed inside the stabilizing shell, a rotating short rod is fixedly installed on the outer wall of the rotating adjustment plate, four groups of arc-shaped openings are provided on the rotating adjustment plate, four groups of strip openings are provided on the fixed circular plate, a group of sliding short rods are slidably installed in each of the four groups of arc-shaped openings, one end of the four groups of sliding short rods extend through the strip opening to the bottom of the stabilizing shell and are fixedly installed with a group of arc-shaped connecting blocks, and the sliding short rods are slidably installed through the strip opening and the fixed circular plate.

[0012] Preferably, the other end of the two groups of high-pressure springs 2 is fixedly connected to the fixed plate, one end of the two groups of high-pressure springs 1 is fixedly connected to the bottom of the fixed plate, and the other end of the two groups of high-pressure springs 1 is fixedly connected to the top of the mounting base.

[0013] Preferably, one end of the bidirectional threaded rod extends to one side of the mounting base plate and is fixedly mounted with a handle, the bidirectional threaded rod and the mounting base plate are rotatably mounted, and adjacent side walls of the two groups of moving blocks are fixedly mounted to a group of fixed blocks.

[0014] Preferably, the interiors of the four groups of threaded sleeves are fixedly connected to a group of cleaning soft blocks, one side of the four groups of arc-shaped connecting blocks is fixedly installed to a group of arc-shaped stabilizing blocks, an arc-shaped slide is provided on the outer wall of the stabilizing shell, one end of the rotating short stick extends to the outer wall of the stabilizing shell through the arc-shaped slide and is fixedly installed with a group of handles 2.

[0015] Preferably, two groups of connecting short rods are fixedly installed on the top of the four groups of stable shells, one end of the two groups of connecting short rods is fixedly connected to the fixed plate, and circular openings for the test probe to pass through are provided on the top of the stable shell, the rotating adjustment plate and the fixed circular plate.

[0016] Preferably, a connecting plate is fixedly installed on the top of the mounting base plate, a hydraulic rod is fixedly installed on the top of the connecting plate, the free end of the hydraulic rod extends to the bottom of the connecting plate and an integrated circuit test board is fixedly installed, the bottom of the integrated circuit test board is fixedly connected to four sets of test probes, and two sets of fixed short rods are fixedly installed on the bottom of the integrated circuit test board.

[0017] Preferably, four groups of supports are fixedly mounted on the bottom of the mounting base plate.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) The integrated circuit test device uses a fixed short rod, a damper 1, a high-pressure spring 1, a damper 2, a high-pressure spring 2, a connecting short plate and a fixed plate. When testing, the buffer mechanism can reduce the pressure on the test probe during the test process through the contact between the fixed short rod and the connecting short plate, and make the pressure on the test probe uniform, thereby increasing the service life of the test probe and improving work efficiency.

[0020] (2) The integrated circuit test device can be disassembled by using a threaded hole, a threaded sleeve and a cleaning block, so that the cleaning block can be removed for cleaning, thereby avoiding dust and oil on the surface of the test probe and improving the accuracy of integrated circuit testing.

[0021] (3) The integrated circuit test device, through the coordinated use of a rotating adjustment plate, a rotating short rod, a fixed circular plate, a sliding short rod, an arc-shaped connecting block and an arc-shaped stabilizing block, the stabilizing mechanism can drive the four groups of arc-shaped stabilizing blocks to wrap part of the outer wall of the test probe, thereby strengthening the stable contact between the test probe and the integrated circuit board, reducing the situation where the test probe is offset during testing and causing unstable contact, and improving the accuracy of integrated circuit testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention is further described below in conjunction with the accompanying drawings and embodiments:

[0023] Figure 1It is a main perspective view of the present invention;

[0024] Figure 2 is a side perspective view of the present invention;

[0025] Figure 3 A top perspective view of the present invention;

[0026] Figure 4 is a rear perspective view of the present invention;

[0027] Figure 5 It is a front perspective view of the bidirectional threaded rod of the present invention and its upper part related parts;

[0028] Figure 6 It is a front perspective view of the threaded sleeve rod and its upper part related parts of the present invention;

[0029] Figure 7 A front perspective view of the stable housing and its upper associated components of the present invention;

[0030] Figure 8 It is a cutaway perspective view of the stabilizing mechanism of the present invention.

[0031] Reference numerals: 1, mounting base plate; 2, fixed adjustment mechanism; 201, bidirectional threaded rod; 202, moving block; 203, strip slide; 4, handle 1; 5, connecting plate; 6, hydraulic rod; 7, integrated circuit test board; 8, test probe; 9, fixed short rod; 10, buffer mechanism; 1001, damper 1; 1002, high pressure spring 1; 1003, damper 2; 1004, high pressure spring 2; 1005, Connecting short plate; 11. Fixed plate; 12. Removable mechanism; 1201. Threaded hole; 1202. Threaded sleeve; 13. Cleaning soft block; 14. Connecting short rod; 15. Stabilizing shell; 16. Stabilizing mechanism; 1601. Rotating adjustment plate; 1602. Rotating short rod; 1603. Fixed circular plate; 1604. Sliding short rod; 1605. Arc-shaped connecting block; 17. Arc-shaped stabilizing block; 18. Handle II; 19. Support. DETAILED DESCRIPTION

[0032] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In the description of the present invention, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] See also Figure 1-8 The present invention provides a technical solution: a test device for an integrated circuit, comprising a mounting base plate 1 and an auxiliary mechanism, a fixing plate 11 is arranged above the mounting base plate 1, four groups of test probes 8 are arranged above the fixing plate 11, two groups of fixing blocks 3 are arranged below the fixing plate 11, four groups of cleaning soft blocks 13 are arranged above the mounting base plate 1, four groups of stable shells 15 are arranged below the fixing plate 11, and four groups of arc-shaped stable blocks 17 are arranged below the four groups of stable shells 15;

[0037] The auxiliary mechanism includes a fixed adjustment mechanism 2, a buffer mechanism 10, a detachable mechanism 12 and a stable shell 15. The buffer mechanism 10 is arranged on a fixed plate 11. The buffer mechanism 10 is used to reduce the pressure on the test probe 8 during the test. The buffer mechanism 10 includes a damper 1001, a high-pressure spring 1002, a damper 1003, a high-pressure spring 1004 and a connecting short plate 1005. Two groups of dampers 1003 are fixedly installed on the top of the fixed plate 11. A group of connecting short plates 1005 are fixedly installed on the tops of the two groups of dampers 1003. The outer walls of the two groups of dampers 1003 are both sleeved with a group of high-pressure springs 1004. The two groups of high-pressure springs 1004 One end is fixedly connected to the bottom of a group of connecting short plates 1005, and two groups of dampers 1001 are fixedly installed on the bottom of the fixed plate 11. The outer walls of the two groups of dampers 1001 are sleeved with a group of high-pressure springs 1002. By fixing the short rod 9, damper 1001, high-pressure spring 1002, damper 1003, high-pressure spring 1004, connecting short plates 1005 and fixed plates 11, when testing, through the contact between the fixed short rod 9 and the connecting short plate 1005, the buffer mechanism 10 can reduce the pressure exerted on the test probe 8 during the test and make the pressure exerted on the test probe 8 uniform, thereby increasing the service life of the test probe 8 and improving the work efficiency.

[0038] The fixed adjustment mechanism 2 is arranged on the mounting base plate 1. The fixed adjustment mechanism 2 is used to fix the integrated circuit board for testing. The fixed adjustment mechanism 2 includes a bidirectional threaded rod 201, a moving block 202 and a strip slide 203. A strip slide 203 is opened on the top of the mounting base plate 1. The bidirectional threaded rod 201 is rotatably installed inside the strip slide 203. The outer wall of the bidirectional threaded rod 201 is threadedly connected with two groups of moving blocks 202. Through the coordinated use of the threaded hole 1201, the threaded sleeve 1202 and the cleaning soft block 13, the detachable mechanism 12 can be disassembled, so that the cleaning soft block 13 can be removed for cleaning, thereby avoiding dust and oil on the surface of the test probe 8 and improving the accuracy of integrated circuit testing.

[0039] The detachable mechanism 12 is arranged on the fixed plate 11. The detachable mechanism 12 is used to replace and clean the cleaning soft block 13. The detachable mechanism 12 includes a threaded hole 1201 and a threaded sleeve 1202. Four groups of threaded holes 1201 are opened on the top of the fixed plate 11. A group of threaded sleeves 1202 are threadedly connected in the four groups of threaded holes 1201.

[0040] The stabilizing mechanism 16 is arranged on the stabilizing shell 15, and is used to stabilize the test probe 8. The stabilizing mechanism 16 includes a rotating adjustment plate 1601, a rotating short rod 1602, a fixed circular plate 1603, a sliding short rod 1604 and an arc-shaped connecting block 1605. The rotating adjustment plate 1601 is rotatably installed inside the stabilizing shell 15, and the fixed circular plate 1603 is fixedly installed inside the stabilizing shell 15. The rotating short rod 1602 is fixedly installed on the outer wall of the rotating adjustment plate 1601. Four groups of arc-shaped openings are opened on the rotating adjustment plate 1601, and four groups of strip-shaped openings are opened on the fixed circular plate 1603. A group of sliding short rods 1604 are slidably installed in each of the four groups of arc-shaped openings. The four groups of sliding One end of the short rod 1604 extends through the strip opening to the bottom of the stabilizing shell 15 and is fixedly installed with a group of arc-shaped connecting blocks 1605. The sliding short rod 1604 is slidably installed through the strip opening and the fixed circular plate 1603. By rotating the adjustment plate 1601, rotating the short rod 1602, fixing the circular plate 1603, sliding the short rod 1604, the arc-shaped connecting block 1605 and the arc-shaped stabilizing block 17, the stabilizing mechanism 16 can drive the four groups of arc-shaped stabilizing blocks 17 to wrap part of the outer wall of the test probe 8, strengthen the stable contact between the test probe 8 and the integrated circuit board, reduce the situation where the test probe 8 is offset during testing and causes unstable contact, and improve the accuracy of integrated circuit testing.

[0041] The other ends of the two sets of high-pressure springs 1004 are fixedly connected to the fixed plate 11, one ends of the two sets of high-pressure springs 1002 are fixedly connected to the bottom of the fixed plate 11, and the other ends of the two sets of high-pressure springs 1002 are fixedly connected to the top of the mounting base plate 1.

[0042] One end of the bidirectional threaded rod 201 extends to one side of the mounting base plate 1 and is fixedly mounted with a handle 4. The bidirectional threaded rod 201 and the mounting base plate 1 are rotatably mounted, and the adjacent side walls of the two groups of moving blocks 202 are fixedly mounted with a group of fixed blocks 3.

[0043] The interiors of the four groups of threaded sleeves 1202 are fixedly connected to a group of cleaning soft blocks 13, and one side of the four groups of arc-shaped connecting blocks 1605 is fixedly installed with a group of arc-shaped stabilizing blocks 17. An arc-shaped slide is provided on the outer wall of the stabilizing shell 15, and one end of the rotating short rod 1602 extends to the outer wall of the stabilizing shell 15 through the arc-shaped slide and is fixedly installed with a group of handles 18.

[0044] Two groups of connecting short rods 14 are fixedly installed on the top of the four groups of stable shells 15. One end of the two groups of connecting short rods 14 is fixedly connected to the fixed plate 11. The top of the stable shell 15, the rotating adjustment plate 1601 and the fixed circular plate 1603 are all provided with circular openings for the test probe 8 to pass through.

[0045] A connecting plate 5 is fixedly installed on the top of the mounting base plate 1, a hydraulic rod 6 is fixedly installed on the top of the connecting plate 5, the free end of the hydraulic rod 6 extends to the bottom of the connecting plate 5 and is fixedly installed with an integrated circuit test board 7, the bottom of the integrated circuit test board 7 is fixedly connected to four groups of test probes 8, and two groups of fixed short rods 9 are fixedly installed on the bottom of the integrated circuit test board 7.

[0046] Four groups of supports 19 are fixedly mounted on the bottom of the mounting base plate 1 .

[0047] Working principle: when it is necessary to test the integrated circuit, the operator holds the handle 4 and rotates the bidirectional threaded rod 201. The rotation of the bidirectional threaded rod 201 drives the two sets of moving blocks 202 to slide in the strip slide groove 203. The sliding of the two sets of strip slide grooves 203 drives the two sets of fixed blocks 3 to slide. By adjusting the two sets of fixed blocks 3 to a suitable distance and placing the circuit board to be tested between the two sets of fixed blocks 3, the hydraulic rod 6 is started. The free end of the hydraulic rod 6 extends and drives the integrated circuit test board 7 to move downward. The downward movement of the integrated circuit test board 7 drives the test probe 8 and the fixed short rod 9 to move downward. When the test probe 8 passes through the inside of the cleaning soft block 13, the cleaning soft block 13 can clean the surface of the test probe 8 to clean the dust and oil on the surface of the test probe 8. When the test When the test probe 8 moves through the fixed space formed by the four groups of arc-shaped stabilizing blocks 17, the rotating short rod 1602 is rotated by holding the handle 2 18. The rotating short rod 1602 rotates to drive the rotating adjustment plate 1601 to rotate. The rotating adjustment plate 1601 rotates to drive the four groups of sliding short rods 1604 to slide through the strip opening and partially wrap the test probe 8 passing thereon, thereby strengthening the stable contact between the test probe 8 and the integrated circuit. When the fixed short rod 9 moves downward to contact the connecting short plate 1005, the high-pressure spring 2 1004 and the damper 2 1003 are compressed, and the compression action of the damper 1 1001 and the high-pressure spring 1 1002 drives the fixed plate 11 to move downward, thereby reducing the pressure on the test probe 8 and making the pressure evenly distributed. At this time, the integrated circuit can be tested.

[0048] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A testing device for an integrated circuit, characterized in that: include: A mounting base plate (1), a fixing plate (11) is arranged above the mounting base plate (1), four groups of test probes (8) are arranged above the fixing plate (11), two groups of fixing blocks (3) are arranged below the fixing plate (11), four groups of cleaning soft blocks (13) are arranged above the mounting base plate (1), four groups of stabilizing shells (15) are arranged below the fixing plate (11), and four groups of arc-shaped stabilizing blocks (17) are arranged below each of the four groups of stabilizing shells (15); The auxiliary mechanism comprises a fixed adjustment mechanism (2), a buffer mechanism (10), a detachable mechanism (12) and a stable shell (15), wherein the buffer mechanism (10) is arranged on a fixed plate (11), and the buffer mechanism (10) is used to reduce the pressure on the test probe (8) during the test process, and the buffer mechanism (10) comprises a damper 1 (1001), a high-pressure spring 1 (1002), a damper 2 (1003), a high-pressure spring 2 (1004) and a connecting short plate (1005), and the top of the fixed plate (11) is fixedly installed There are two groups of dampers 2 (1003), the tops of the two groups of dampers 2 (1003) are fixedly installed with a group of connecting short plates (1005), the outer walls of the two groups of dampers 2 (1003) are sleeved with a group of high-pressure springs 2 (1004), one end of the two groups of high-pressure springs 2 (1004) is fixedly connected to the bottom of the group of connecting short plates (1005), and the bottom of the fixed plate (11) is fixedly installed with two groups of dampers 1 (1001), and the outer walls of the two groups of dampers 1 (1001) are sleeved with a group of high-pressure springs 1 (1002).

2. The integrated circuit testing device according to claim 1, characterized in that: The fixing adjustment mechanism (2) is arranged on the mounting base plate (1), and is used to fix the integrated circuit board to be tested. The fixing adjustment mechanism (2) comprises a bidirectional threaded rod (201), a moving block (202) and a strip slide groove (203). The top of the mounting base plate (1) is provided with a strip slide groove (203), the interior of the strip slide groove (203) is rotatably mounted with the bidirectional threaded rod (201), and the outer wall of the bidirectional threaded rod (201) is threadedly connected with two groups of moving blocks (202).

3. The integrated circuit testing device according to claim 2, characterized in that: The detachable mechanism (12) is arranged on the fixed plate (11), and is used for replacing and cleaning the cleaning soft block (13). The detachable mechanism (12) comprises a threaded hole (1201) and a threaded sleeve (1202). Four groups of threaded holes (1201) are provided on the top of the fixed plate (11), and a group of threaded sleeves (1202) are threadedly connected in each of the four groups of threaded holes (1201).

4. The integrated circuit testing device according to claim 3, characterized in that: The stabilizing mechanism (16) is arranged on the stabilizing housing (15), and is used to stabilize the test probe (8). The stabilizing mechanism (16) comprises a rotating adjustment plate (1601), a rotating short rod (1602), a fixed circular plate (1603), a sliding short rod (1604) and an arc-shaped connecting block (1605). The stabilizing housing (15) is provided with a rotating adjustment plate (1601) rotatably mounted inside the stabilizing housing (15), and the fixed circular plate (1603) is fixedly mounted inside the stabilizing housing (15). The rotating adjustment plate (1601) is provided with a rotating adjustment plate (1601). ) is fixedly installed with a rotating short rod (1602), the rotating adjustment plate (1601) is provided with four groups of arc-shaped openings, the fixed circular plate (1603) is provided with four groups of strip-shaped openings, a group of sliding short rods (1604) are slidably installed in each of the four groups of arc-shaped openings, one end of each of the four groups of sliding short rods (1604) passes through the strip-shaped openings and extends to the bottom of the stable shell (15) and is fixedly installed with a group of arc-shaped connecting blocks (1605), and the sliding short rods (1604) are slidably installed through the strip-shaped openings and the fixed circular plate (1603).

5. The integrated circuit testing device according to claim 4, characterized in that: The other ends of the two groups of high-pressure springs 2 (1004) are fixedly connected to the fixed plate (11), one ends of the two groups of high-pressure springs 1 (1002) are fixedly connected to the bottom of the fixed plate (11), and the other ends of the two groups of high-pressure springs 1 (1002) are fixedly connected to the top of the mounting base plate (1).

6. The integrated circuit testing device according to claim 5, characterized in that: One end of the bidirectional threaded rod (201) extends to one side of the mounting base plate (1) and is fixedly mounted with a handle (4); the bidirectional threaded rod (201) and the mounting base plate (1) are rotatably mounted, and adjacent side walls of the two groups of movable blocks (202) are fixedly mounted with a group of fixed blocks (3).

7. The integrated circuit testing device according to claim 6, characterized in that: The interiors of the four groups of threaded sleeves (1202) are fixedly connected to a group of cleaning soft blocks (13), one side of the four groups of arc-shaped connecting blocks (1605) is fixedly installed to a group of arc-shaped stabilizing blocks (17), an arc-shaped slideway is provided on the outer wall of the stabilizing shell (15), one end of the rotating short rod (1602) extends through the arc-shaped slideway to the outer wall of the stabilizing shell (15) and is fixedly installed with a group of handles (18).

8. The integrated circuit testing device according to claim 7, characterized in that: Two groups of connecting short rods (14) are fixedly installed on the top of the four groups of stable shells (15), one end of the two groups of connecting short rods (14) is fixedly connected to the fixed plate (11), and circular openings for the test probe (8) to pass through are provided on the top of the stable shell (15), the rotating adjustment plate (1601) and the fixed circular plate (1603).

9. The integrated circuit testing device according to claim 8, characterized in that: A connecting plate (5) is fixedly mounted on the top of the mounting base plate (1), a hydraulic rod (6) is fixedly mounted on the top of the connecting plate (5), a free end of the hydraulic rod (6) extends to the bottom of the connecting plate (5) and is fixedly mounted with an integrated circuit test board (7), the bottom of the integrated circuit test board (7) is fixedly connected to four groups of test probes (8), and two groups of fixed short rods (9) are fixedly mounted on the bottom of the integrated circuit test board (7).

10. The integrated circuit testing device according to claim 9, characterized in that: Four groups of supports (19) are fixedly mounted on the bottom of the mounting base plate (1).

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