Display panel

Abstract

Disclosed is a display panel including a substrate including a first portion having a first thickness and a second portion adjacent to the first portion in a first direction. The second portion has a second thickness less than the first thickness. The display panel further includes a circuit layer disposed on the substrate and an element layer disposed on the circuit layer. A plurality of slit grooves extending in a second direction crossing the first direction and recessed in a thickness direction of the substrate are defined on a bottom surface of the first portion of the substrate.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0127107, filed on September 22, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Embodiments of the present disclosure described herein relate to a rollable display panel and an electronic device including the rollable display panel. Background Art

[0003] Flexible display panels are being developed according to market demand. Some flexible display panels include curved display panels fixed at a specific curvature, foldable display panels that can be bent at a specific curvature radius or a larger curvature radius or bend around a folding axis, and rollable display panels that can be rolled at a specific curvature radius. Electronic devices using rollable display panels among them can have a small volume but provide a large display area. Summary of the invention

[0004] An embodiment of the present disclosure provides a rollable display panel.

[0005] An embodiment of the present disclosure also provides an electronic device including a rollable display panel.

[0006] According to one embodiment, a display panel includes: a substrate, including: a first part, having a first thickness, and a second part, adjacent to the first part in a first direction and having a second thickness less than the first thickness; a circuit layer, arranged on the substrate; and an element layer, arranged on the circuit layer, and defining a plurality of slit grooves on the bottom surface of the first part of the substrate, extending along a second direction intersecting the first direction and recessed in the thickness direction of the substrate.

[0007] A width of the substrate in the second direction may be substantially equal to a length of each of the plurality of slit grooves in the second direction.

[0008] A depth of each of the plurality of slit grooves may be substantially equal to a difference between the first thickness and the second thickness.

[0009] A depth of each of the plurality of slit grooves may be greater than a difference between the first thickness and the second thickness.

[0010] A depth of each of the plurality of slit grooves may be less than a difference between the first thickness and the second thickness.

[0011] The first thickness may be five times or more than the second thickness.

[0012] Each of the plurality of slit grooves may have a shape that is concave from a lower surface of the substrate toward an upper surface of the substrate, and the upper surface of the substrate may continuously extend across the first portion and the second portion to define a same plane.

[0013] The lower surface of the substrate may include a first lower surface overlapping the first portion and a second lower surface overlapping the second portion, and a boundary surface connecting the first lower surface and the second lower surface is a flat surface, and the first lower surface is the bottom surface of the first portion.

[0014] The lower surface of the substrate may include a first lower surface overlapping the first portion and a second lower surface overlapping the second portion, and a boundary surface connecting the first lower surface and the second lower surface includes a curved surface.

[0015] The display panel may further include a plurality of filling members respectively disposed in the plurality of slit grooves.

[0016] Each of the plurality of slit grooves may have a shape that is concave from a lower surface of the substrate toward an upper surface of the substrate, and each of the plurality of filling members may be aligned with the lower surface of the substrate.

[0017] Each of the plurality of slit grooves may have a shape recessed from a lower surface of the substrate toward an upper surface of the substrate, and each of the plurality of filling members may be aligned with the lower surface of the substrate and have a shape concavely recessed from the lower surface of the substrate.

[0018] Each of the plurality of slit grooves may have a shape concave from a lower surface of the substrate toward an upper surface of the substrate, and each of the plurality of filling members may have a shape convexly protruding from the lower surface of the substrate.

[0019] The display panel may further include a covering layer provided integrally with the plurality of filling members and covering the bottom surface of the first portion of the substrate.

[0020] A cross-sectional shape of each of the plurality of slit grooves may be defined by a first line, a straight line connected to the first line, and a second line connected to the straight line.

[0021] A cross-sectional shape of each of the plurality of slit grooves may be defined by a first line, a curved line connected to the first line, and a second line connected to the curved line.

[0022] The substrate may be a glass substrate, and the first portion and the second portion of the substrate may be flexible.

[0023] According to one embodiment, an electronic device includes: a housing in which a slot is defined; a rotating part arranged in the housing; and a display panel connected to the rotating part, the display panel including: a substrate including a first part having a first thickness and a second part adjacent to the first part in a first direction and having a second thickness; a circuit layer arranged on the substrate; and an element layer arranged on the circuit layer, and having a plurality of slit grooves extending along a second direction intersecting the first direction and recessed in the thickness direction of the substrate defined on the bottom surface of the first part of the substrate.

[0024] The display panel may further include a first surface on which an image is displayed and a second surface opposite to the first surface, and a portion of the first surface of the display panel is coupled to the rotating part.

[0025] The display panel may further include a first surface on which an image is displayed and a second surface opposite to the first surface, and a portion of the second surface of the display panel is coupled to the rotating part.

[0026] The electronic device may further include: a connection film electrically connected to the display panel and attached to a region overlapping the first portion; and a circuit substrate electrically connected to the connection film and disposed on the rotating portion.

[0027] The electronic device may further include a seating space defined in the rotating portion and recessed from an outer peripheral surface on which the display panel is wound, wherein the circuit substrate is disposed in the seating space.

[0028] The electronic device may further include a circuit substrate fixing portion provided in a space defined in the rotating portion, wherein the circuit substrate is fixed to the circuit substrate fixing portion, and the circuit substrate fixing portion is fixed to the rotating portion.

[0029] The display panel may further include a plurality of filling members respectively disposed in the plurality of slit grooves.

[0030] According to one embodiment, a display panel includes: a substrate, including: a first part, and a second part, adjacent to the first part in a first direction; a circuit layer, arranged on the substrate; and an element layer, arranged on the circuit layer and overlapping with the second part, wherein the first part includes: a plurality of first sub-parts, having a first thickness, and a plurality of second sub-parts, having a second thickness less than the first thickness, wherein the plurality of first sub-parts and the plurality of second sub-parts are repeatedly and alternately arranged one after another in the first direction.

[0031] The second portion may have a thickness less than the first thickness.

[0032] The thickness of the second portion may be greater than the second thickness, or may be less than the second thickness.

[0033] The display panel may further include a filling member disposed between two adjacent first sub-portions among the plurality of first sub-portions. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the attached drawings.

[0035] Figure 1A is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0036] Figure 1B is a perspective view of an electronic device according to an embodiment of the present disclosure.

[0037] Figure 2 is a plan view of a display device according to an embodiment of the present disclosure.

[0038] Figure 3 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0039] Figure 4A is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0040] Figure 4B is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0041] Figure 5A is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0042] Figure 5B is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0043] FIG. 6A to FIG. 6C FIG. 1 is a diagram illustrating a part of a process of manufacturing a display panel according to an embodiment of the present disclosure.

[0044] Figure 7 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0045] Fig. 8A is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0046] Figure 8B is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0047] Figure 8Cis a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0048] Fig. 9 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0049] Fig. 10A is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0050] Fig. 10B is a cross-sectional view of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0051] In the specification, when it is described that a component (or region, layer or part, etc.) is "disposed on", "connected to" or "coupled to" another component, it means that the former component may be directly disposed on, directly connected to or coupled to the latter component, or a third component may be disposed between them.

[0052] The same reference numerals refer to the same elements. In addition, in the drawings, in order to effectively describe the technical content, the proportions and sizes (eg, thickness) of the components are exaggerated. "And / or" includes all combinations of one or more components that can be defined by the relevant components.

[0053] Although the terms "first," "second," and the like may be used to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component without departing from the scope of the present disclosure. Singular expressions include plural expressions unless the context clearly states otherwise.

[0054] In addition, terms such as "below", "on the lower side", "above", and "on the upper side" are used to describe the relationship between components illustrated in the drawings. The above terms are relative concepts and are described based on the directions indicated in the drawings.

[0055] It should be understood that terms such as “include” or “have” are intended to specify the presence of features, numbers, steps, operations, components, parts, or a combination thereof described in the specification, but do not exclude the possibility of adding one or more other features, numbers, steps, operations, components, parts, or a combination thereof.

[0056] As used herein, the term "substantially" means approximately or virtually. The term "substantially equal" means approximately equal or virtually equal. The term "substantially the same" means approximately the same or virtually the same.

[0057] Embodiments of the present disclosure support one or more processes (or methods) that support the features and embodiments described herein. Descriptions of elements that are "configurable," "formable," "etchable," etc. include processes (or methods) and techniques for configuring, forming, etching, positioning, and modifying elements, etc., according to the example aspects described herein.

[0058] Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meanings as those generally understood by those of ordinary skill in the art to which the present disclosure belongs. In addition, terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with the meanings of these terms in the context of the relevant technology, and should not be interpreted as having overly ideal or overly formal meanings unless explicitly defined herein.

[0059] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0060] Figure 1A is a perspective view of an electronic device ED according to an embodiment of the present disclosure. Figure 1B is a perspective view of an electronic device ED according to an embodiment of the present disclosure.

[0061] refer to Figure 1A and Figure 1B , the electronic device ED may be a device that is activated based on an electrical signal. The electronic device ED may be used for large electronic devices such as a television or an external billboard as an example, and small and medium-sized electronic devices such as a personal computer (e.g., a laptop computer), a personal digital terminal, a car navigation unit, a game console, a portable electronic device, and a camera as an example. In addition, these are presented as examples, and it is obvious that they can be adopted in other electronic devices as long as they do not deviate from the concept of the present disclosure.

[0062] The electronic device ED may include a display panel DP. In one example, the display panel DP may be a small size of several inches or a dozen inches or less or a medium size. Alternatively, the display panel DP may be a large size of several dozen inches or more. As an example, Figure 1A and Figure 1B An electronic device ED including a display panel DP of several tens of inches or more is exemplified. Figure 1A and Figure 1B The electronic device ED illustrated in FIG. 4 may be a television.

[0063] The electronic device ED may further include a housing HS. As an example, Figure 1A and Figure 1BThe illustrated housing HS has a rectangular parallelepiped shape including edges extending in the first direction DR1, the second direction DR2, and the third direction DR3. However, the shape of the housing HS is not limited thereto. The shape of the housing HS may be modified to support various shapes for accommodating the display panel DP in the housing HS.

[0064] The slot HS-OP is defined in the housing HS. The slot HS-OP is an opening that may be defined on the upper surface of the housing HS, and the display panel DP may be inserted and withdrawn through the slot HS-OP. In some alternative embodiments, the slot HS-OP may be defined on another surface (e.g., a side surface) of the housing HS. Figure 1A illustrates a first state of the electronic device ED, and Figure 1B The second state of the electronic device ED is illustrated. The first state refers to a state in which the display panel DP is completely accommodated in the housing HS, and the second state refers to a state in which the display area DA of the display panel DP is exposed to the outside of the housing HS.

[0065] Figure 2 is a plan view of a display device DD according to an embodiment of the present disclosure.

[0066] refer to Figure 1A , Figure 1B and Figure 2 , the electronic device ED may include a display device DD, and the display device DD may include a display panel DP, a connection film COF, and a circuit substrate PCB.

[0067] The display panel DP may be a component that actually generates an image. The display panel DP may be a light-emitting display panel, and for example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel or an organic-inorganic light-emitting display panel, a quantum dot display panel, a micro LED display panel or a nano LED display panel.

[0068] A display area DA and a non-display area NDA may be defined in the display panel DP. The display panel DP may display an image through the display area DA. For example, the display panel DP may include a plurality of pixels PX, and the pixels PX may be disposed in the display area DA. The display area DA may include a surface defined by a first direction DR1 and a second direction DR2. The non-display area NDA may surround a periphery of the display area DA.

[0069] The display device DD may include a plurality of connection films COF. The display device DD may include a driving circuit (e.g., a data driving circuit) for driving a display panel DP mounted on each of the connection films COF. A plurality of connection films COF may be connected to a non-display area NDA of the display panel DP. For example, the connection film COF may be attached to one side of the display panel DP. In an embodiment of the present disclosure, the connection film COF may be connected to a pad area PDA of the display panel DP. The pad area PDA may be defined in the non-display area NDA of the display panel DP. The connection film COF and the display panel DP may be connected to each other via an anisotropic conductive film (ACF), but the present disclosure is not particularly limited thereto.

[0070] The display device DD may include a plurality of circuit substrates PCB. Each of the circuit substrates PCB may be electrically connected to the display panel DP through a corresponding portion of the connection film COF. A chip (eg, a timing controller) controlling the operation of the display panel DP may be mounted on the circuit substrate PCB.

[0071] Figure 2 Twelve connection films COF are exemplified, but embodiments of the present disclosure are not limited thereto. Figure 2 Two circuit substrates PCB are illustrated, but the embodiments of the present disclosure are not limited thereto. For example, the number of connection films COF and the number of circuit substrates PCB may vary based on the resolution of the display panel DP, the size of the display panel DP, and the specifications of the data driving circuit.

[0072] Figure 3 is a cross-sectional view of a display panel DP according to an embodiment of the present disclosure. For example, Figure 3 Can be along Figure 2 A cross-sectional view taken along line II'.

[0073] refer to Figure 3 , the display panel DP may include a display layer 100, a first optical layer 200, and a second optical layer 300. In an embodiment of the present disclosure, the first optical layer 200 and the second optical layer 300 may be omitted. The display layer 100 may include a substrate 110, a circuit layer 120, an element layer 130, and an encapsulation layer 140.

[0074] The substrate 110 may be a member providing a substrate surface on which the circuit layer 120 is disposed. The substrate 110 may be a flexible substrate that is bendable, foldable, or curlable. Stated another way, the substrate 110 may be bendable, foldable, or curlable. The substrate 110 may be a glass substrate. In the case where the substrate 110 includes glass, the substrate 110 may be bent, folded, or curled by at least one of a thickness control process and a chemical strengthening process. For example, the substrate 110 may be formed by at least one of a thickness control process and a chemical strengthening process that supports bending, folding, or curling of the substrate 110.

[0075] The circuit layer 120 may be disposed on the substrate 110. The circuit layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer are formed on the substrate 110 by coating or deposition, and then the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by a plurality of photoetching processes. Thereafter, the semiconductor pattern, the conductive pattern, and the signal line included in the circuit layer 120 may be formed.

[0076] The display panel DP may include a buffer layer BFL. The buffer layer BFL may improve the coupling strength between the substrate 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure in which silicon oxide layers and silicon nitride layers are alternately laminated.

[0077] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, not limited thereto, the semiconductor pattern may include amorphous silicon, low temperature polysilicon, or an oxide semiconductor.

[0078] Figure 3 Some semiconductor patterns are simply exemplified, and the display panel DP may include semiconductor patterns further arranged in other regions. The semiconductor patterns may be arranged across pixels based on specific rules. The semiconductor patterns may have different electrical characteristics based on whether the semiconductor patterns are doped. In one example, each semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with an N-type dopant or a P-type dopant. The P-type transistor may include a doped region doped with a P-type dopant, and the N-type transistor may include a doped region doped with an N-type dopant. The second region may be a non-doped region or a region doped with a concentration lower than that of the first region.

[0079] The conductivity of the first region is greater than that of the second region, and the first region can be substantially used as an electrode or a signal line. The second region can substantially correspond to an active region (or channel) of a transistor. In other words, a portion of the semiconductor pattern can be an active region of a transistor, another portion of the semiconductor pattern can be a source or drain of the transistor, and another portion of the semiconductor pattern can be a connection electrode or a connection signal line.

[0080] Each of the pixels PX may include a pixel circuit and a light emitting element 100PE. As an example, Figure 3 A transistor 100PC included in a pixel circuit is illustrated. A source region SC, an active region AL, and a drain region DR of the transistor 100PC may be formed of a semiconductor pattern. The source region SC and the drain region DR may extend in opposite directions from the active region AL in a cross section. Figure 3A portion of a connection signal line SCL formed of a semiconductor pattern is illustrated Although not separately illustrated, the connection signal line SCL may be connected to the drain region DR of the transistor 100PC on a plane.

[0081] The first insulating layer 10 may be disposed on the buffer layer BFL. The first insulating layer 10 overlaps with a plurality of pixels and may cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and the first insulating layer 10 may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In one embodiment, the first insulating layer 10 may be a single layer of silicon oxide, but is not limited thereto. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and the first insulating layer 10 may have a single-layer or multi-layer structure. Additionally or alternatively, the insulating layer of the circuit layer 120 described later may be an inorganic layer and / or an organic layer, and the insulating layer may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above materials, but the embodiments of the present disclosure are not limited thereto.

[0082] The gate portion GT of the transistor 100PC is disposed on the first insulating layer 10. The gate portion GT may be a portion of a metal pattern. The gate portion GT overlaps the active area AL. The gate portion GT may be used as a mask in a process of doping a semiconductor pattern.

[0083] The second insulating layer 20 is disposed on the first insulating layer 10 and may cover the gate portion GT. The second insulating layer 20 may overlap with the pixel. The second insulating layer 20 may be an inorganic layer and / or an organic layer, and the second insulating layer 20 may have a single layer or a multilayer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multilayer structure including a silicon oxide layer and a silicon nitride layer.

[0084] The third insulating layer 30 may be disposed on the second insulating layer 20. The third insulating layer 30 may have a single layer or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0085] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL through a contact hole CNT-1 that passes through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0086] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single layer of silicon oxide. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0087] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 through a contact hole CNT-2 that passes through the fourth insulating layer 40 and the fifth insulating layer 50.

[0088] The sixth insulating layer 60 is disposed on the fifth insulating layer 50 and may cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0089] The element layer 130 may be disposed on the circuit layer 120. The element layer 130 may include a light emitting element 100PE. For example, the element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro LED, or a nano LED. Hereinafter, the light emitting element 100PE will be described as an example of an organic light emitting element, but the present disclosure is not particularly limited thereto.

[0090] The light emitting element 100PE may include a first electrode AE, a light emitting layer EL, and a second electrode CE. The first electrode AE ​​may be disposed on the sixth insulating layer 60. The first electrode AE ​​may be connected to the second connection electrode CNE2 through a contact hole CNT-3 that passes through the sixth insulating layer 60.

[0091] The pixel defining film 70 is disposed on the sixth insulating layer 60 and may cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.

[0092] Display area DA (see Figure 2 ) may include a light emitting region PXA and a non-emitting region NPXA adjacent to the light emitting region PXA. The non-emitting region NPXA may surround the light emitting region PXA. In this embodiment, the light emitting region PXA is defined as a partial region corresponding to the first electrode AE ​​exposed by the opening 70-OP.

[0093] The light emitting layer EL may be disposed on the first electrode AE. The light emitting layer EL may be disposed in a region corresponding to the opening 70-OP. That is, the light emitting layer EL may be formed so that individual light emitting layers EL are formed in each of the pixels and are separated from each other. In an example in which individual light emitting layers EL are formed in each of the pixels and are separated from each other, each of the light emitting layers EL may emit light of at least one color of blue, red, and green. However, the embodiments of the present disclosure are not limited thereto, and the light emitting layer EL may be connected to the pixel and may be included as a common light emitting layer. In this case, the light emitting layer EL may provide blue light or white light.

[0094] The second electrode CE may be disposed on the light emitting layer EL. The second electrode CE has an overall shape and may be commonly included in a plurality of pixels.

[0095] Although not illustrated, the hole control layer may be disposed between the first electrode AE ​​and the light emitting layer EL. The hole control layer may be disposed in the light emitting region PXA and the non-emitting region NPXA. The hole control layer may include a hole transport layer, and may further include a hole injection layer. The electron control layer may be disposed between the light emitting layer EL and the second electrode CE. The electron control layer includes an electron transport layer, and may further include an electron injection layer. The hole control layer and the electron control layer may be formed together in a plurality of pixels by using an open mask or an inkjet process.

[0096] The encapsulation layer 140 may be disposed on the element layer 130. The encapsulation layer 140 may protect the element layer 130 from foreign substances such as moisture, oxygen, and dust particles. The encapsulation layer 140 may include a first inorganic encapsulation layer 141, an organic encapsulation layer 142, and a second inorganic encapsulation layer 143 laminated in sequence, but the embodiments of the present disclosure are not limited thereto. The first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 protect the element layer 130 from moisture and oxygen, and the organic encapsulation layer 142 protects the element layer 130 from foreign substances such as dust particles.

[0097] The first optical layer 200 may be disposed on the encapsulation layer 140. The first optical layer 200 may include a dam 210, a first filling layer 220, a first cover layer 230, a second cover layer 240, and a third cover layer 250.

[0098] The bank 210 may be disposed to overlap the non-emission area NPXA. Figure 3 In the embodiment, although the dam 210 is illustrated as having an inverted trapezoidal shape in cross section as an example, the present disclosure is not particularly limited thereto. For example, the dam 210 may have a trapezoidal shape or a rectangular shape.

[0099] The first filling layer 220 may overlap the light emitting area PXA and may be disposed between adjacent dams 210. The upper surface of the first filling layer 220 may have a concave shape. However, the present disclosure is not particularly limited thereto. The shape of the upper surface of the first filling layer 220 may be flat or may have a convex shape.

[0100] The first capping layer 230 may be disposed on the dam 210 and the first filling layer 220. The first capping layer 230 may protect the dam 210 and the first filling layer 220. The first capping layer 230 may be provided as a single layer or multiple layers. The first capping layer 230 may include an inorganic material. For example, the first capping layer 230 may include at least one of silicon nitride, silicon oxynitride, and silicon oxide.

[0101] The second cover layer 240 may be disposed on the first cover layer 230. The second cover layer 240 may be referred to as a low refractive index layer. For example, the second cover layer 240 may be a layer having a refractive index lower than that of other adjacent layers (e.g., a layer adjacent to the second cover layer 240). The second cover layer 240 may provide a flat top surface (also referred to herein as a planar surface).

[0102] The third cover layer 250 may be disposed on the second cover layer 240. The third cover layer 250 may protect the second cover layer 240. The third cover layer 250 may be provided as a single layer or multiple layers. The third cover layer 250 may include an inorganic material. For example, the third cover layer 250 may include at least any one of silicon nitride, silicon oxynitride, and silicon oxide.

[0103] The second optical layer 300 may be disposed on the first optical layer 200. The second optical layer 300 may reduce reflectivity of external light entering from outside the display panel DP. Alternatively, the second optical layer 300 may be provided to transmit light of a specific wavelength range among light provided from the light emitting layer.

[0104] The second optical layer 300 may include a plurality of color filters 310, 320, and 330 and an outer coating layer 340. One of the color filters 310, 320, and 330 may overlap the light emitting area PXA, and at least two of the color filters 310, 320, and 330 may overlap the non-emitting area NPXA. In an embodiment of the present disclosure, a light shielding pattern may be further provided in the non-emitting area NPXA. The outer coating layer 340 may cover the color filters 310, 320, and 330, and may provide a flat upper surface.

[0105] Figure 4A is a cross-sectional view of an electronic device ED according to an embodiment of the present disclosure.

[0106] refer to Figure 4A , a housing HS, a rotating portion RSC, and a display panel DP included in the electronic device ED are illustrated as examples.

[0107] The rotating portion RSC may be disposed in the housing HS. The rotating portion RSC may be referred to as a column or a cylinder. The rotating portion RSC may have a structure rotatable in the housing HS. For example, the rotating portion RSC may rotate clockwise and counterclockwise around an axis AR extending in the second direction DR2.

[0108] The display panel DP may include a first surface DP-u on which an image is displayed and a second surface DP-b opposite to the first surface DP-u. The display panel DP may display an image through the first surface DP-u. Figure 4A The direction IDR of the displayed image is illustrated.

[0109] In an embodiment of the present disclosure, a portion of the display panel DP may be coupled to the rotating portion RSC. For example, a portion of the first surface DP-u of the display panel DP may be coupled to, attached to, or contact the rotating portion RSC. In an example in which the display panel DP is rolled on the rotating portion RSC, the first surface DP-u on which the display area of ​​the display panel DP is defined may be rolled to face the rotating portion RSC. Figure 4A The described example may be referred to as an incurled structure.

[0110] In one embodiment of the present disclosure, the position of the slot HS-OP of the housing HS may be offset in one direction. For example, the first width WTA1 of the first area HAR1 from the slot HS-OP to one corner of the housing HS may be greater than the second width WTA2 of the second area HAR2 from the slot HS-OP to another corner of the housing HS. In this case, the area of ​​the first area HAR1 located in the image display direction IDR may be greater than the area of ​​the second area HAR2. However, this is a simple example, and the slot HS-OP of the housing HS may be located at the central portion of the housing HS.

[0111] Figure 4B is a cross-sectional view of an electronic device EDa according to an embodiment of the present disclosure.

[0112] refer to Figure 4B , a housing HSa, a rotating portion RSC, and a display panel DPa included in the electronic device EDa are illustrated as examples.

[0113] The display panel DPa may include a first surface DP-ua on which an image is displayed and a second surface DP-ba opposite to the first surface DP-ua. The display panel DPa may display an image through the first surface DP-ua. Figure 4B The direction IDRa of the displayed image is illustrated.

[0114] In an embodiment of the present disclosure, a portion of the display panel DPa may be coupled to the rotating portion RSC. For example, a portion of the second surface DP-ba of the display panel DPa may be coupled to, attached to, or in contact with the rotating portion RSC. In an example in which the display panel DPa is wound on the rotating portion RSC, the second surface DP-ba on which the display area of ​​the display panel DPa is not defined may be wound facing the rotating portion RSC. Figure 4B The described example may be referred to as an outer curl structure.

[0115] In one embodiment of the present disclosure, the position of the slot HS-OPa of the housing HSa may be offset in one direction. For example, the first width WTA1a of the first area HAR1a from the slot HS-OPa to one corner of the housing HSa may be smaller than the second width WTA2a of the second area HAR2a from the slot HS-OPa to another corner of the housing HSa. In this case, the area of ​​the first area HAR1a located in the direction IDRa of displaying the image may be smaller than the area of ​​the second area HAR2a. However, this is a simple example, and the slot HS-OPa of the housing HSa may be located at the central portion of the housing HSa.

[0116] Figure 5A is a cross-sectional view of an electronic device ED according to an embodiment of the present disclosure.

[0117] refer to Figure 5A , exemplifying a connection film COF electrically connected to the display panel DP and a circuit substrate PCB electrically connected to the connection film COF. The circuit substrate PCB may be mounted (installed) on the rotating portion RSC.

[0118] In one embodiment of the present disclosure, the radius of curvature R-RSC of the outer peripheral surface of the rotating portion RSC may be 5 cm, but the present disclosure is not particularly limited thereto. A placement space MS (recessed from the outer peripheral surface on which the display panel DP is wound) may be defined in the rotating portion RSC. The circuit substrate PCB may be disposed in the placement space MS. The placement space MS may also be referred to as an installation space.

[0119] According to an embodiment of the present disclosure, the entire area of ​​the display panel DP may have a bendable structure based on the shape of the rotating portion RSC. Accordingly, the display panel DP may be bendable starting from an edge of the display panel DP at least partially covered by the connection film COF.

[0120] Figure 5B is a cross-sectional view of an electronic device EDb according to an embodiment of the present disclosure.

[0121] refer to Figure 5B The electronic device EDb may further include a circuit substrate fixing portion FM disposed in a space IS defined inside the rotating portion RSCa. In some aspects, the circuit substrate PCB is fixed to the circuit substrate fixing portion FM. The circuit substrate fixing portion FM may be fixed to the rotating portion RSCa.

[0122] The electronic device EDb may include a penetration portion RSC-OP defined in the rotating portion RSCa. The penetration portion RSC-OP passes through the outer peripheral surface of the rotating portion RSCa from the internal space IS. A connection film COF connected to the circuit substrate PCB and the display panel DP may be provided to pass through the penetration portion RSC-OP.

[0123] FIG. 6A to FIG. 6C FIG. 1 is a diagram illustrating a part of a process of manufacturing a display panel according to an embodiment of the present disclosure.

[0124] refer to Figure 3 and Fig. 6A , the mother substrate MG is illustrated. A plurality of preliminary display panels DP-bf may be formed on the mother substrate MG. The mother substrate MG may be a glass substrate. For example, the mother substrate MG may become the substrate 110 through subsequent processes.

[0125] In one embodiment of the present disclosure, the circuit layer 120, the element layer 130, the encapsulation layer 140, the first optical layer 200, and the second optical layer 300 may all be formed on one surface of the mother substrate MG. For example, after forming a protective layer covering the circuit layer 120, the element layer 130, the encapsulation layer 140, the first optical layer 200, and the second optical layer 300, a process of processing the mother substrate MG may be performed, but the present disclosure is not particularly limited thereto.

[0126] refer to Fig. 6A , a first portion AR1-bf and a second portion AR2-bf may be defined in the mother substrate MG. The laser beam is irradiated to the first portion AR1-bf. A plurality of thin grooves LZP arranged along the first direction DR1 and the second direction DR2 may be formed in the first portion AR1-bf by the irradiated laser beam. Each of the thin grooves LZP is obtained by removing a portion of the mother substrate MG in the thickness direction and does not pass through the mother substrate MG.

[0127] refer to Fig. 6A and Figure 6B , the mother substrate MG is etched. In this case, a plurality of slit grooves 110-S1 may be formed, to which the thin grooves LZP are connected. Each of the plurality of slit grooves 110-S1 may extend along the second direction DR2. The plurality of slit grooves 110-S1 may be defined such that the plurality of slit grooves 110-S1 are spaced apart in the first direction DR1.

[0128] After this (for example, after forming the plurality of slit grooves 110-S1), a chemical strengthening process may be performed, which may strengthen the Na-containing + ions and the mother substrate MG containing K + ions in contact with the salt so that the Na + Ions and K + The ions are exchanged. However, the chemical strengthening process may be omitted. In addition, a process of filling each of the plurality of slit grooves 110-S1 with a resin to form a filling member is additionally performed.

[0129] The process of etching a portion of the rear surface of the mother substrate MG may be similar to that of the reference Figure 6BThe process of etching the mother substrate MG described above is performed simultaneously. Figure 7 , the substrate 110 includes a first portion AR1 and a second portion AR2. The process for reducing the thickness of the second portion AR2 of the substrate 110 may be the same as that of the reference Figure 6B The process of etching the mother substrate MG is described as being performed simultaneously. However, this is an example, and the embodiments of the present disclosure are not limited thereto. For example, the process of processing the second portion AR2 may be performed after the process of forming the slit groove 110-S1 in the first portion AR1, and additionally or alternatively, the process of processing the second portion AR2 may be performed before the process of forming the slit groove 110-S1 in the first portion AR1.

[0130] refer to Figure 6B and Figure 6C , the mother substrate MG may be cut (based on the cutting line CT) to form a plurality of display panels DP. The length LT-PT of each of the slit grooves 110-S1 in the second direction DR2 may be substantially equal to the width WT-DP of the display panel DP in the second direction DR2. Accordingly, for example, the width of the substrate 110 in the second direction DR2 may be substantially equal to the respective lengths LT-PT of the slit grooves 110-S1 in the second direction DR2.

[0131] According to an embodiment of the present disclosure, the first portion AR1 may be flexible due to the slit groove 110-S1. The first portion AR1 may have rigidity, which is provided when the first portion AR1 is attached to the connection film COF (see Figure 2 ) supports reducing damage to the first portion AR1 by the filling member filled in the slit groove 110-S1. That is, in some aspects, the entire area of ​​the display panel DP has a rollable structure, and the area in which the connection film COF is attached is rigid, thereby eliminating or reducing unnecessary dummy areas. Accordingly, the chamfering efficiency of the mother substrate MG can be improved.

[0132] Figure 7 is a cross-sectional view of a display device DD according to an embodiment of the present disclosure. For example, Figure 7 Can be along Figure 2 A cross-sectional view taken along line II-II'.

[0133] refer to Figure 7 , the substrate 110 may be a glass substrate. The substrate 110 may include a first portion AR1 and a second portion AR2 adjacent to the first portion AR1. Figure 3 , the second portion AR2 of the substrate 110 may overlap with the element layer 130. In addition, the second portion AR2 of the substrate 110 may overlap with the display area DA (see Figure 1B )overlapping.

[0134] The first portion AR1 may have a first thickness TK1, and the second portion AR2 may have a second thickness TK2. The second thickness TK2 may be smaller than the first thickness TK1. The first thickness TK1 may correspond to a maximum thickness of the first portion AR1, and the second thickness TK2 may correspond to a minimum thickness or an average thickness of the second portion AR2.

[0135] The substrate 110 may include an upper surface 110us and a lower surface 110bs. The upper surface 110us of the substrate 110 may extend continuously in the first portion AR1 and the second portion AR2 to define the same plane. Stated another way, the upper surface 110us of the substrate 110 may extend continuously across the first portion AR1 and the second portion AR2 to define the same plane. The lower surface 110bs of the substrate 110 may include a first lower surface 110bs1 overlapping the first portion AR1 and a second lower surface 110bs2 overlapping the second portion AR2. The first lower surface 110bs1 and the second lower surface 110bs2 may be discontinuous.

[0136] In an embodiment of the present disclosure, the boundary surface BS may be disposed between the first lower surface 110bs1 and the second lower surface 110bs2. The boundary surface BS may be connected to the first lower surface 110bs1 and the second lower surface 110bs2, and the boundary surface BS may be a flat surface. Figure 7 In the example of , the boundary surface BS may be a surface parallel to the second direction DR2 and the third direction DR3.

[0137] In one embodiment of the present disclosure, both the first portion AR1 and the second portion AR2 of the substrate 110 may be flexible. Accordingly, the entire area of ​​the display panel DP may be bendable or rollable. A plurality of slit grooves 110-S1 extending along a second direction DR2 intersecting the first direction DR1 may be defined on a first lower surface (also referred to as a bottom surface) 110bs1 of the first portion AR1 of the substrate 110. Each of the plurality of slit grooves 110-S1 may have a shape that is concave in the thickness direction of the substrate 110. For example, each of the plurality of slit grooves 110-S1 may have a shape that is concave from the lower surface 110bs of the substrate 110 toward the upper surface 110us of the substrate 110. The plurality of slit grooves 110-S1 may be referred to by various names, such as taking a concave pattern, a concave pattern, or a groove as an example.

[0138] In an embodiment of the present disclosure, each of the plurality of slit grooves 110-S1 may have a rectangular shape in a cross section defined by the first direction DR1 and the third direction DR3. For example, the shape of each of the plurality of slit grooves 110-S1 may be defined by a first line L1, a straight line SL connected to the first line L1, and a second line L2 connected to the straight line SL. However, the shape of each of the plurality of slit grooves 110-S1 is not limited thereto. For example, each of the plurality of slit grooves 110-S1 may have a trapezoidal shape, an inverted trapezoidal shape, or a triangular shape.

[0139] In an embodiment of the present disclosure, the first portion AR1 may include a first sub-portion ARs1 having a first thickness TK1. The first portion AR1 may include a second sub-portion ARs2 having a third thickness TK1-R less than the first thickness TK1. The first sub-portion ARs1 and the second sub-portion ARs2 may be repeatedly and alternately arranged one after another in the first direction DR1.

[0140] The pattern 110-pt may be defined between two adjacent slit grooves 110-S1 among the plurality of slit grooves 110-S1. The pattern 110-pt may correspond to the first sub-portion ARs1. Accordingly, the thickness TK1 of the pattern 110-pt may correspond to the thickness TK1 of the first sub-portion ARs1 of the substrate 110.

[0141] In an embodiment of the present disclosure, the second thickness TK2 of the second portion AR2 may be substantially equal to the third thickness TK1-R of the second sub-portion ARs2. Accordingly, the depth DT of each of the plurality of slit grooves 110-S1 is substantially equal to the difference between the first thickness TK1 of the first portion AR1 and the second thickness TK2 of the second portion AR2.

[0142] In one embodiment of the present disclosure, the first thickness TK1 of the first portion AR1 may be five times or more than the second thickness TK2 of the second portion AR2, but the present disclosure is not particularly limited thereto. For example, the first thickness TK1 of the first portion AR1 may be 500 microns, the second thickness TK2 of the second portion AR2 may be 100 microns, and the depth DT of each of the plurality of slit grooves 110-S1 may be 400 microns. However, this is a simple example, and the first thickness TK1, the second thickness TK2, and the depth DT are not limited to the example values ​​provided herein.

[0143] In an embodiment of the present disclosure, the width DT-P of each of the plurality of slit grooves 110-S1 and the interval WT-P between the plurality of slit grooves 110-S1 are determined based on the target curvature value. For example, the width DT-P of each of the plurality of slit grooves 110-S1 may be 80 micrometers to 150 micrometers, and the interval WT-P between the plurality of slit grooves 110-S1 may be in the range of 150 micrometers to 170 micrometers. The width DT-P of each of the plurality of slit grooves 110-S1 may correspond to the interval between the first sub-portions ARs1 or the interval between the patterns 110-pt. The interval WT-P between the plurality of slit grooves 110-S1 may correspond to the width of each of the first sub-portions ARs1 or the width of each of the patterns 110-pt.

[0144] In an embodiment of the present disclosure, the display device DD may further include a plurality of filling members 110-RS respectively disposed in the plurality of slit grooves 110-S1. Each of the plurality of filling members 110-RS may include resin. Each of the plurality of filling members 110-RS may be aligned with the lower surface 110bs (specifically, the first lower surface 110bs1) of the substrate 110. For example, one filling member 110-RS may be disposed between two adjacent first sub-portions ARs1 of the plurality of first sub-portions ARs1.

[0145] According to the present disclosure, the first portion AR1 can be easily bent by the plurality of slit grooves 110-S1, and the relatively thin second portion AR2 can also be easily bent. That is, the entire area of ​​the display panel DP can have a rollable structure. In addition, the pad area PDA to which the connection film COF is attached can be defined in the first portion AR1. The first thickness TK1 of the first portion AR1 is greater than the second thickness TK2 of the second portion AR2. In addition, the filling member 110-RS is disposed in the plurality of slit grooves 110-S1 corresponding to the relatively thin portion. By filling the slit grooves 110-S1 with the filling member 110-RS, the substrate 110 can have a rollable structure when the connection film COF (see Figure 2 ) can prevent the substrate 110 from being broken or damaged. Accordingly, during the process of bonding the connection film COF to the pad area PDA, the possibility of cracks occurring in the first portion AR1 can be reduced or eliminated.

[0146] Fig. 8A FIG. 2 is a cross-sectional view of a display device DDa according to an embodiment of the present disclosure. Fig. 8A When Figure 7 The same components as those described in are denoted by the same reference numerals, and repeated description of these components is omitted for brevity.

[0147] refer to Fig. 8AThe display device DDa may further include a plurality of filling members 110-RSa respectively disposed in the plurality of slit grooves 110-S1. Each of the plurality of filling members 110-RSa may include resin. Each of the plurality of filling members 110-RSa may have a concave shape relative to the lower surface 110bs (specifically, the first lower surface 110bs1) of the substrate 110.

[0148] Figure 8B FIG. 4 is a cross-sectional view of a display device DDb according to an embodiment of the present disclosure. Figure 8B When Figure 7 The same components as those described in are denoted by the same reference numerals, and repeated description of these components is omitted for brevity.

[0149] refer to Figure 8B The display device DDb may further include a plurality of filling members 110-RSb disposed in the plurality of slit grooves 110-S1. The plurality of filling members 110-RSb may include resin. Each of the plurality of filling members 110-RSb may have a shape that convexly protrudes relative to the lower surface 110bs (specifically, the first lower surface 110bs1) of the substrate 110.

[0150] Figure 8C FIG. 4 is a cross-sectional view of a display device DDc according to an embodiment of the present disclosure. Figure 8C In the description of Figure 7 The same components as those described in are denoted by the same reference numerals, and repeated description of these components is omitted for brevity.

[0151] refer to Figure 8C The display device DDc may further include a plurality of filling members 110-RS respectively disposed in the plurality of slit grooves 110-S1, and a covering layer 110-RSc provided integrally with the plurality of filling members 110-RS and covering the lower surface 110bs (specifically, the first lower surface 110bs1) of the substrate 110.

[0152] According to an embodiment of the present disclosure, since the cover layer 110-RSc is additionally provided, Figure 8C The first thickness TK1 of the first portion AR1 described may be smaller than that of the previously described Figure 7 , Fig. 8A and Figure 8B The first portion AR1 has a first thickness TK1 as described. However, the present disclosure is not particularly limited thereto.

[0153] Fig. 9 FIG. 4 is a cross-sectional view of a display device DDd according to an embodiment of the present disclosure. Fig. 9 In the description of Figure 7The same components as those described in are denoted by the same reference numerals, and repeated description of these components is omitted for brevity.

[0154] refer to Fig. 9 , the substrate 110 may include a first portion AR1 and a second portion AR2 adjacent to the first portion AR1. The substrate 110 may include an upper surface 110us and a lower surface 110bs. The upper surface 110us of the substrate 110 may extend continuously in the first portion AR1 and the second portion AR2 to define the same plane. Stated in another way, the upper surface 110us of the substrate 110 may extend continuously across the first portion AR1 and the second portion AR2 to define the same plane. The lower surface 110bs of the substrate 110 may include a first lower surface 110bs1 overlapping the first portion AR1 and a second lower surface 110bs2 overlapping the second portion AR2. The first lower surface 110bs1 and the second lower surface 110bs2 may be discontinuous.

[0155] In an embodiment of the present disclosure, a boundary surface BSa may be disposed between the first lower surface 110bs1 and the second lower surface 110bs2. The boundary surface BSa may be connected to the first lower surface 110bs1 and the second lower surface 110bs2, and the boundary surface BSa may include a curved surface. For example, each of the first lower surface 110bs1 and the second lower surface 110bs2 may be a surface parallel to the first direction DR1 and the second direction DR2, and the boundary surface BSa may connect (e.g., smoothly connect) the first lower surface 110bs1 and the second lower surface 110bs2.

[0156] In an embodiment of the present disclosure, both the first portion AR1 and the second portion AR2 of the substrate 110 may be flexible. Accordingly, the entire area of ​​the display panel DP may be bendable or rollable. A plurality of slit grooves 110-S1a extending along a second direction DR2 intersecting the first direction DR1 is defined on a first lower surface 110bs1 of the first portion AR1 of the substrate 110. Each of the plurality of slit grooves 110-S1a may have a shape that is concave in the thickness direction of the substrate 110.

[0157] In an embodiment of the present disclosure, the shape of each of the plurality of slit grooves 110-S1a may be defined by a first line L1a, a curve CL connected to the first line L1a, and a second line L2a connected to the curve CL in a cross section defined in the first direction DR1 and the third direction DR3. However, the shape of each of the plurality of slit grooves 110-S1a is not limited thereto.

[0158] Fig. 10A FIG. 4 is a cross-sectional view of a display device DDe according to an embodiment of the present disclosure. Fig. 10A In the description of Figure 7The same components as those described in are denoted by the same reference numerals, and repeated description of these components is omitted for brevity.

[0159] refer to Fig. 10A , a plurality of slit grooves 110-S1b may be defined on the first lower surface 110bs1 of the first portion AR1 of the substrate 110. Each of the plurality of slit grooves 110-S1b may have a shape that is concave in a thickness direction of the substrate 110.

[0160] In an embodiment of the present disclosure, the first portion AR1 includes a first subportion ARs1 having a first thickness TK1 and a second subportion ARs2a having a third thickness TK1-Ra less than the first thickness TK1. The first subportion ARs1 and the second subportion ARs2a may be repeatedly and alternately arranged one after another along the first direction DR1.

[0161] In an embodiment of the present disclosure, the second thickness TK2 of the second portion AR2 may be greater than the third thickness TK1-Ra of the second sub-portion ARs2a. The depth DTa of each of the plurality of slit grooves 110-S1b may be greater than the difference between the first thickness TK1 of the first portion AR1 and the second thickness TK2 of the second portion AR2.

[0162] Fig. 10B FIG. 4 is a cross-sectional view of a display device DDf according to an embodiment of the present disclosure. Fig. 10B In the description of Figure 7 The same components as those described in are denoted by the same reference numerals, and repeated description of these components is omitted for brevity.

[0163] refer to Fig. 10B , a plurality of slit grooves 110 -S1c may be defined on the first lower surface 110bs1 of the first portion AR1 of the substrate 110. Each of the plurality of slit grooves 110 -S1c may have a shape that is concave in a thickness direction of the substrate 110.

[0164] In an embodiment of the present disclosure, the first portion AR1 may include a first subportion ARs1 having a first thickness TK1 and a second subportion ARs2b having a third thickness TK1-Rb less than the first thickness TK1. The first subportion ARs1 and the second subportion ARs2b may be repeatedly and alternately arranged one after another along the first direction DR1.

[0165] In an embodiment of the present disclosure, the second thickness TK2 of the second portion AR2 may be less than the third thickness TK1-Rb of the second sub-portion ARs2b. The depth DTb of each of the plurality of slit grooves 110-S1c may be less than the difference between the first thickness TK1 of the first portion AR1 and the second thickness TK2 of the second portion AR2.

[0166] Previous references Figures 7 to 10B The features of the described embodiments may be combined with each other. Figures 7 to 10B Examples illustrated in .

[0167] According to the above description, the substrate of the display panel may include a first portion and a second portion having different thicknesses. The first portion having a relatively large thickness is provided with a plurality of slit grooves, and a filling member is disposed in the slit grooves. Due to the slit grooves, the first portion may also be bendable, and the entire area of ​​the display panel may be rollable. In some aspects, the substrate has rigidity, by which the substrate is not damaged by the filling member filled in the slit groove when the connecting film is attached.

[0168] The above has been described with reference to the exemplary embodiments of the present disclosure, but those skilled in the art or those with ordinary knowledge in the art will understand that various corrections and changes may be made to the present disclosure without departing from the spirit and technical scope of the present disclosure described in the claims. Therefore, the technical scope of the present disclosure should not be limited to the contents described in the detailed description of the specification, but should be determined by the scope of the patent claims.

Claims

1. A display panel, comprising: Base plate, comprising: a first portion having a first thickness, and a second portion adjacent to the first portion in the first direction and having a second thickness less than the first thickness; a circuit layer, disposed on the substrate; and A component layer is arranged on the circuit layer, A plurality of slit grooves extending along a second direction intersecting the first direction and recessed in a thickness direction of the substrate are defined on a bottom surface of the first portion of the substrate. 2 . The display panel according to claim 1 , wherein a width of the substrate in the second direction is equal to a length of each of the plurality of slit grooves in the second direction. 3 . The display panel of claim 1 , wherein a depth of each of the plurality of slit grooves is equal to a difference between the first thickness and the second thickness. 4 . The display panel of claim 1 , wherein a depth of each of the plurality of slit grooves is greater than a difference between the first thickness and the second thickness. 5 . The display panel of claim 1 , wherein a depth of each of the plurality of slit grooves is smaller than a difference between the first thickness and the second thickness. The display panel according to claim 1 , wherein the first thickness is five times or more than the second thickness. 7 . The display panel of claim 1 , wherein each of the plurality of slit grooves has a shape concave from a lower surface of the substrate toward an upper surface of the substrate, and the upper surface of the substrate continuously extends across the first portion and the second portion to define a same plane.

8. A display panel according to claim 7, wherein the lower surface of the substrate includes a first lower surface overlapping with the first part and a second lower surface overlapping with the second part, and a boundary surface connecting the first lower surface and the second lower surface is a flat surface, and the first lower surface is the bottom surface of the first part.

9. A display panel according to claim 7, wherein the lower surface of the substrate includes a first lower surface overlapping with the first part and a second lower surface overlapping with the second part, and a boundary surface connecting the first lower surface and the second lower surface includes a curved surface, and the first lower surface is the bottom surface of the first part.

10. The display panel according to claim 1, further comprising: A plurality of filling members are respectively disposed in the plurality of slit grooves. 11 . The display panel of claim 10 , wherein each of the plurality of slit grooves has a shape concave from a lower surface of the substrate toward an upper surface of the substrate, and each of the plurality of filling members is aligned with the lower surface of the substrate.

12. The display panel according to claim 10, wherein each of the plurality of slit grooves has a shape that is concave from the lower surface of the substrate toward the upper surface of the substrate, and each of the plurality of filling members is aligned with the lower surface of the substrate and has a shape that is concavely concave from the lower surface of the substrate. 13 . The display panel of claim 10 , wherein each of the plurality of slit grooves has a shape concave from a lower surface of the substrate toward an upper surface of the substrate, and each of the plurality of filling members has a shape convexly protruding from the lower surface of the substrate.

14. The display panel according to claim 10, further comprising: A cover layer is provided integrally with the plurality of filling members and covers the bottom surface of the first portion of the substrate. 15 . The display panel of claim 1 , wherein a cross-sectional shape of each of the plurality of slit grooves is defined by a first line, a straight line connected to the first line, and a second line connected to the straight line. 16 . The display panel of claim 1 , wherein a shape of each of the plurality of slit grooves in a cross section is defined by a first line, a curve connected to the first line, and a second line connected to the curve. 17 . The display panel according to claim 1 , wherein the substrate is a glass substrate, and the first portion and the second portion of the substrate are flexible.

18. A display panel, comprising: Base plate, comprising: Part I, and a second portion, adjacent to the first portion in a first direction; a circuit layer, disposed on the substrate; and a component layer, disposed on the circuit layer and overlapping the second portion, The first part includes: a plurality of first subsections having a first thickness, and a plurality of second sub-portions having a second thickness less than the first thickness, The plurality of first sub-portions and the plurality of second sub-portions are repeatedly and alternately arranged one after another in the first direction. The display panel according to claim 18 , wherein a thickness of the second portion is smaller than the first thickness. 20 . The display panel according to claim 19 , wherein the thickness of the second portion is greater than the second thickness, or less than the second thickness.

21. The display panel according to claim 18, further comprising: A filling member is disposed between two adjacent first sub-portions among the plurality of first sub-portions.

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