Novel DRAM high-temperature and low-temperature test method

Abstract

The invention relates to the technical field of DRAM high-temperature and low-temperature testing, and discloses a novel DRAM high-temperature and low-temperature testing method.The novel DRAM high-temperature and low-temperature testing method comprises a pipeline, cooling fins, a novel controller, a waste gas utilization module and an automatic tabletop, the pipeline is a core component, the exterior of the pipeline is connected with an air compressor through an air pipe, and the interior of the pipeline is connected with a testing structure through the cooling fins; the test structure is provided with a temperature sensor which transmits a signal to the novel controller. According to the novel DRAM high-temperature and low-temperature test method, the eddy current principle is applied to the DRAM test machine for the first time. No refrigerant is needed, continuous work can be achieved, no pollution source, no rotating component and no rotation effect are generated, no sliding component is arranged, the device is a solid piece, vibration and noise are avoided in the working process, the service life is long, installation is easy, refrigeration can be achieved only by providing compressed air without power supply, and the compressed air is an input resource necessary for an automatic table top. Therefore, the device can be smoothly installed and used on all table tops.

Description

Technical Field

[0001] The invention relates to the technical field of DRAM high-temperature and low-temperature testing, and in particular to a novel DRAM high-temperature and low-temperature testing method. Background Art

[0002] In addition to testing consumer products with normal functions at room temperature, DRAM testing also includes wide temperature products for industrial and automotive grades. In order to ensure that wide temperature products can work normally at the corresponding temperature, the chip must be placed in an environment with the corresponding temperature for testing. Taking the automotive grade -40℃ to 125℃ as an example, how to cool down and warm up the environment is the key. The existing high-temperature heating method usually uses a heating module for electric heating, uses a temperature sensor to collect the temperature, and controls the power-on time to make the ambient temperature reach the preset value. The low-temperature refrigeration methods are different and can be divided into three categories: one is refrigeration by liquid nitrogen. The disadvantage is that liquid nitrogen is dangerous. In terms of storage, liquid nitrogen requires a high-pressure tank. In terms of use, the temperature of liquid nitrogen is too low, at -200℃, and it is dangerous to contact people. The temperature during use is not easy to control, and the cost of use is very high. The second type is to use the refrigerator principle and use refrigerant and compressor for refrigeration. Although the cost and use danger problems are solved, the refrigeration rate of the refrigerant and compressor is slow, and the chip tested at low temperature will condense water when it returns to room temperature, causing a circuit short circuit. The third type is to use semiconductor refrigerators, but semiconductor refrigerators not only have high power consumption, but also can only cool to around -10 degrees and cannot cool further. Summary of the invention

[0003] 1. Technical issues to be solved

[0004] In view of the deficiencies of the prior art, the present invention provides a novel DRAM high-temperature and low-temperature testing method, which solves the problems raised in the above-mentioned background technology.

[0005] (II) Technical solution

[0006] The present invention provides the following technical solutions: a new DRAM high-temperature and low-temperature testing method, including a pipeline, a cooling fin, a new controller, a waste gas utilization module and an automated table. The pipeline is a core component, which is connected to an air compressor through an air pipe on the outside and connected to a test structure through cooling fins on the inside. A temperature sensor is provided on the test structure to transmit a signal to the new controller.

[0007] Pipes are used as cooling equipment on DRAM test benches. A partitioned test structure is adopted to fully utilize the two output ends of the pipe: output cold air and output hot air. Cold air is mainly used for cooling, but the exhausted hot air can be used for heating at the same time: cold air is directed to the test structure through cooling fins to transfer the low temperature that meets the test requirements to the test structure, and the chip is directly cooled by contacting the structure; hot air is also directed to the test structure through cooling fins in another area to transfer the high temperature that meets the test requirements to the test structure.

[0008] Preferably, the output temperature is precisely controlled by controlling the size of the intake air flow through a solenoid valve.

[0009] Preferably, air flow can be used during testing to prevent condensation that is prone to occur during low-temperature testing.

[0010] Preferably, low-temperature and high-temperature tests can be completed continuously on the same table, and the corresponding temperatures of the cooling zone and the heating zone are maintained during the entire test period without the need for additional temperature increase and decrease processes.

[0011] Preferably, when compressed air is input from the top, a spiral airflow will be formed due to the internal physical spiral structure; the high-speed rotating airflow flows in one direction, and during the movement of this airflow, the air in the outer layer will heat up, and on the contrary, the air in the inner layer will become cold, and the degree of coldness or heat is proportional to the flow rate. When it moves to one end, the cold air will flow back along the center of the vortex to form a cooling source.

[0012] Preferably, the outside of the spiral is hot air flow, and the inside of the spiral is cold air flow. The cold air flow and the hot air flow are respectively guided out through the vents on both sides.

[0013] Preferably, the cooling end of the pipeline is -46°C and the heating end is 127°C; this just covers the -40°C to 125°C required for wide-temperature product testing; there will be no inconvenience caused by too low a temperature, nor will the -40°C requirement not be covered due to substandard temperature.

[0014] Preferably, heating and cooling are mainly based on airflow, which automatically removes water vapor during the test process, just solving the problem of condensed water on the chip when testing the chip at low temperature.

[0015] Compared with the prior art, the present invention provides a novel DRAM high-temperature and low-temperature testing method, which has the following beneficial effects:

[0016] 1. This new DRAM high-temperature and low-temperature test method uses the eddy current principle on the DRAM tester for the first time. It does not require any refrigerant, can work continuously, has no pollution source, has no rotating parts, will not produce a rotation effect, has no sliding parts, is a solid piece, has no vibration or noise when working, has a long life, is easy to install, does not require power supply, only needs to provide compressed air for cooling, and compressed air is a necessary input resource for all automated tables, so it can be successfully installed and used on all tables.

[0017] 2. This new DRAM high-temperature and low-temperature testing method can cool and heat at the same time. The two output ends of the pipeline output hot air and cold air respectively, which can achieve cooling and heating at the same time. On the automated table for wide temperature testing, the chip needs to be tested at high temperature immediately after the low temperature is measured. Cold and hot partition tests can be performed to maximize the use of energy and greatly reduce energy loss. Instead of actively heating to high temperature for testing after measuring the low temperature as before, the temperature coverage range of the pipeline is just right. The cooling end of the pipeline is -46°C and the heating end is 127°C, which just covers the -40°C to 125°C required for wide temperature product testing. There will be no inconvenience caused by too low temperature, nor will the requirement of -40°C be unable to be covered due to substandard temperature. Since it mainly relies on airflow for heating and cooling, it automatically takes away water vapor during the test process, which just solves the problem of condensed water on the chip when testing the chip at low temperature. DETAILED DESCRIPTION

[0018] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] A new DRAM high-temperature and low-temperature test method includes a pipeline, cooling fins, a new controller, an exhaust gas utilization module and an automated table. The pipeline is the core component. The outside is connected to the air compressor through an air pipe, and the inside is connected to the test structure through cooling fins. There is a temperature sensor on the test structure to transmit the signal to the new controller. The pipeline is the core component. When compressed air is input from the top, a spiral airflow will be formed due to the internal physical spiral structure. The high-speed rotating airflow flows in one direction. During the movement of this airflow, the air in the outer layer will heat up. On the contrary, the air in the inner layer will become cold. The degree of coldness and heat is proportional to the flow rate. When it moves to one end, the cold air will flow back along the center of the vortex to form a cooling source. The outside of the spiral is a hot airflow, and the inside of the spiral is a cold airflow. The cold airflow and the hot airflow are respectively discharged through the vents on both sides.

[0020] The cooling fins are used to evenly contact the hot and cold airflows generated by the pipeline with the chip under test. Since the cooling fins use dry and purified compressed air to create a heat difference, they do not require frequent maintenance and care to maintain a healthy working condition.

[0021] The new controller is specially used to detect temperature and control the gas flow rate by controlling the valve, thereby controlling the temperature. The new controller communicates with the host computer, and the host computer provides the new controller with a preset temperature.

[0022] After passing through the cooling fins, the air has transferred all the heat, but due to its dry property, it can be reused. The hot exhaust gas is guided to the periphery of the table through the guide pipe, and the purpose of removing condensed water is achieved by drying and blowing the chips after the test.

[0023] The automated table is an independent table specially used for testing DRAM chips. After adding the module designed in this article, in the test on the same table, low-temperature testing can be carried out first, and then transferred to the high-temperature test area for high-temperature testing. After the test, the chips are placed in the test completion area.

[0024] This test method uses a purely physical structure pipe as a cooling device, which is applied on a DRAM test table. A partitioned test structure is adopted so that the two output ends of the pipe (output cold air and output hot air) are fully utilized. Cold air is mainly used for cooling, but the discharged hot air can be used for heating at the same time. The size of the intake air flow is controlled by a solenoid valve to accurately control the output temperature. The cold air guides the low temperature that meets the test requirements to the test structure through the cooling fins, and directly cools the chip through the structure contact. The hot air also guides the high temperature that meets the test requirements to the test structure through the cooling fins in another area. During the test, the air flow can be used to prevent condensation that is easy to occur during low-temperature testing. Low-temperature and high-temperature tests can be completed continuously on the same table. During the entire test period, the corresponding temperatures of the cooling zone and the heating zone can be maintained without the need for additional heating and cooling processes.

[0025] This method applies the eddy current principle to a DRAM tester for the first time. It does not require any refrigerant, can work continuously, has no pollution source, no rotating parts, no rotation effect, no sliding parts, is a solid piece, has no vibration or noise when working, has a long service life, and is easy to install.

[0026] No electricity is required for cooling, only compressed air is needed. Compressed air is a necessary input resource for all automated countertops, so it can be successfully installed and used on all countertops.

[0027] It can cool and heat at the same time. The two output ends of the pipeline output hot air and cold air respectively, which can realize cooling and heating at the same time. On the automated table for wide temperature testing, the chip needs to be tested at high temperature immediately after the low temperature is measured. Cold and hot partition tests can be performed to maximize the use of energy and greatly reduce energy loss. Instead of actively heating to high temperature for testing after measuring the low temperature as before, the temperature coverage range of the pipeline is just right. The cooling end of the pipeline is -46℃, and the heating end is 127℃. It just covers the -40℃ to 125℃ required for wide temperature product testing. There will be no inconvenience caused by too low temperature, nor will it be unable to cover the -40℃ demand due to substandard temperature. Since it mainly relies on airflow for heating and cooling, it automatically takes away water vapor during the test process, which just solves the problem of condensed water on the chip when testing the chip at low temperature.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel DRAM high-temperature and low-temperature testing method, comprising a pipeline, a cooling fin, a novel controller, an exhaust gas utilization module and an automated table, characterized in that: The pipeline is a core component, which is connected to the air compressor through an air pipe on the outside and to the test structure through cooling fins on the inside. There is a temperature sensor on the test structure to transmit the signal to the new controller. The pipeline is used as a refrigeration device on the DRAM test table. A partitioned test structure is adopted so that the two output ends of the pipeline: the output cold air and the output hot air are fully utilized. The cold air is mainly used for cooling, but the discharged hot air can be used for heating at the same time: the cold air is guided to the test structure through the cooling fins to meet the test requirements. The low temperature is directly cooled by contacting the chip through the structure, and the hot air is also cooled by the cooling fins in another area. The high temperature is led to the test structure. When compressed air is input from the top, a spiral airflow is formed due to the internal physical spiral structure. The high-speed rotating airflow flows in one direction. During the movement of this airflow, the air in the outer layer will heat up. On the contrary, the air in the inner layer will cool down. The degree of coldness or heat is proportional to the flow rate. When it moves to one end, the cold air will flow back along the center of the vortex to form a cooling source. The cooling end of the pipeline is -46℃ and the heating end is 127℃; it just covers the -40℃ to 125℃ required for wide-temperature product testing; there will be no inconvenience caused by too low temperature, nor will it fail to cover the -40℃ requirement due to substandard temperature.

2. A novel DRAM high temperature and low temperature testing method according to claim 1, characterized in that: The solenoid valve controls the intake air flow to precisely control the output temperature.

3. A novel DRAM high temperature and low temperature testing method according to claim 1, characterized in that: During testing, air flow can be used to prevent condensation that is prone to occur during low temperature testing.

4. A novel DRAM high temperature and low temperature testing method according to claim 1, characterized in that: Low-temperature and high-temperature tests can be completed continuously on the same table. During the entire test period, the corresponding temperatures of the cooling and heating areas are maintained without the need for additional heating and cooling processes.

5. A novel DRAM high temperature and low temperature testing method according to claim 1, characterized in that: There is hot air outside the spiral and cold air inside the spiral; the cold air and hot air are respectively discharged through the vents on both sides.

6. A novel DRAM high temperature and low temperature testing method according to claim 1, characterized in that: It mainly relies on airflow for heating and cooling, and automatically removes water vapor during the test process, which is just right for solving the problem of condensation on chips during low-temperature testing.