Single-wafer detection all-in-one machine for solar silicon wafers

Abstract

The invention discloses a single-wafer detection all-in-one machine for solar silicon wafers, which comprises a front-section conveying rail, an AOI detection mechanism and an IV detection mechanism, and is characterized in that the AOI detection mechanism is located between the front-section conveying rail and the IV detection mechanism; a single-piece conveying rail is arranged on the front-section conveying rail; the AOI detection mechanism comprises a four-station rotary table, a back face AOI detection instrument assembly, a front face AOI detection instrument assembly and an AOI detection conveying rail. And the IV detection mechanism comprises a working platform, an index plate assembly and a detection mechanism. According to the single-wafer detection all-in-one machine for the solar silicon wafer, the single silicon wafer is conveyed, AOI detection and IV detection are carried out in sequence, automatic work is carried out, a probe is accurately connected with a grid line on the single silicon wafer, the detection efficiency is improved, the productivity is improved along with the improvement, and the integrated multifunctional structure meets the requirements of production before and after.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer production, and in particular to a single-wafer detection integrated machine for solar silicon wafers. Background Art

[0002] After printing, crystalline silicon photovoltaic solar wafers need to undergo AOI and IV testing. The full name of AOI testing in Chinese is automatic optical inspection, which is a device that detects common defects encountered in printing production based on optical principles; IV testing refers to the current-voltage characteristic curve (IV curve) test of photovoltaic modules. Only silicon wafers that have passed the test and are considered good will enter the next production process equipment. Existing single-chip silicon wafers require multiple devices to cooperate in the above-mentioned AOI and IV testing processes, which affects the front-to-back docking process of testing and processing, and the production capacity is relatively low. Summary of the invention

[0003] One object of the present invention is to provide a single-wafer inspection all-in-one machine for solar silicon wafers, which performs inspection on single silicon wafers, integrates AOI inspection and IV inspection, saves processes and steps, and improves inspection capacity.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A solar silicon wafer single-wafer inspection integrated machine, comprising a front-end conveyor rail, an AOI inspection mechanism and an IV inspection mechanism, wherein the AOI inspection mechanism is located between the front-end conveyor rail and the IV inspection mechanism;

[0006] A single-piece conveyor rail is provided on the front conveyor rail;

[0007] The AOI inspection mechanism includes a four-station turntable, a back AOI inspection instrument assembly, a front AOI inspection instrument assembly and an AOI inspection conveyor rail. The four-station turntable is located at the front end of the AOI inspection conveyor rail, the back AOI inspection instrument assembly is located below the front end of the four-station turntable, and the front AOI inspection is installed above the AOI inspection conveyor rail.

[0008] The IV detection mechanism includes a working platform, a dividing plate assembly and a detection mechanism, the dividing plate assembly is located in the middle of the working platform, the detection mechanism is located in front of the dividing plate assembly, the detection mechanism includes a UVW base, an upper probe rack and a lower probe rack, a UVW deviation correction and alignment assembly is installed at the lower end of the UVW base, the UVW deviation correction and alignment assembly includes two groups of X-axis modules and one group of Y-axis modules, the upper probe rack and the lower probe rack are respectively movable on the UVW base in the vertical direction, and detection probes are installed on the upper probe rack and the lower probe rack.

[0009] As a preferred technical solution, a temporary storage linear module is arranged on the front section conveying rail, a temporary storage frame is arranged at the driving end of the temporary storage linear module, and the temporary storage frame moves laterally on the side of the single-piece conveying rail.

[0010] As a preferred technical solution, a material feeding linear module is arranged on the front section conveying rail, and a material feeding longitudinal module is connected to the driving end of the material feeding linear module, and the material feeding longitudinal module moves laterally on the side of the single-piece conveying rail, and a material feeding frame is connected to the driving end of the material feeding longitudinal module, and the material feeding frame moves up and down along the vertical direction.

[0011] As a preferred technical solution, a splint positioning mechanism is arranged in the middle part of the single-piece conveyor rail, and the splint positioning mechanism includes a splint positioning motor, a splint positioning synchronous belt and a splint positioning rotating wheel. The driving end of the splint positioning motor is connected with the splint positioning wheel, and the splint positioning synchronous belt is transmission-connected with the splint positioning wheel. A splint positioning support is installed on the splint positioning synchronous belt, and the splint positioning rotating wheel rotates at the upper end of the splint positioning support.

[0012] As a preferred technical solution, an air blowing and cooling pipe is provided at the front end of the single-piece conveyor rail, and an ion anti-static air knife is provided at the rear end of the single-piece conveyor rail.

[0013] As a preferred technical solution, an AOI rotating shaft is arranged above the four-station turntable, and four AOI adsorption modules are arranged on the periphery of the four-station turntable.

[0014] As a preferred technical solution, a front single-chip track and a rear single-chip track are respectively provided on both sides of the dividing plate assembly, and the front single-chip track and the rear single-chip track are both driven by track motors to drive track belts to transport silicon wafers.

[0015] As a preferred technical solution, the first walking arm and the second walking arm are respectively installed on both sides of the front single-piece track and the side of the rear single-piece track, and the first walking arm and the second walking arm are both provided with a walking linear module, and a moving plate is connected to the driving end of the walking linear module, and a negative pressure adsorption plate is fixed to the inner end of the moving plate.

[0016] As a preferred technical solution, the X-axis module and the Y-axis module both include a motor mounting seat, a module motor, an adjustment screw and an adjustment slide, the module motor is fixed on the motor mounting seat, the driving end of the module motor is transmission-connected to the adjustment screw, the adjustment screw is threadedly connected to the adjustment nut of the adjustment slide, the adjustment slide slides along the length direction of the adjustment screw, and the adjustment slide has a connecting bearing, the connecting bearing slides on the adjustment slide, the moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide, the edge of the UVW base is locked in the connecting bearing, and the two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.

[0017] As a preferred technical solution, the UVW base is equipped with an upper linear module and a lower linear module, the upper linear module controls the vertical movement of the upper probe frame, and the lower linear module controls the vertical movement of the lower probe frame.

[0018] The beneficial effects of the present invention are: providing a single-wafer inspection integrated machine for solar silicon wafers, which transports single silicon wafers, undergoes AOI inspection and IV inspection in succession, and works automatically, accurately connecting the probe to the gate line on the single silicon wafer, thereby improving the inspection efficiency and increasing the production capacity. The integrated multifunctional structure meets the needs of front-end and back-end production. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0020] Figure 1 This is a schematic diagram of the overall structure of a solar silicon wafer single-wafer detection integrated machine according to an embodiment;

[0021] Figure 2 It is a structural schematic diagram of the front section conveyor rail described in the embodiment;

[0022] Figure 3 It is a structural schematic diagram of the air blowing cooling pipe described in the embodiment;

[0023] Figure 4 It is a structural schematic diagram of the clamping plate positioning mechanism described in the embodiment;

[0024] Figure 5 This is a schematic diagram of the structure of the ion static removal air knife described in the embodiment;

[0025] Figure 6 It is a structural schematic diagram of the AOI detection mechanism described in the embodiment;

[0026] Figure 7 It is a structural schematic diagram of the IV detection mechanism described in the embodiment;

[0027] Figure 8 It is a structural schematic diagram of the X-axis module (or Y-axis module) described in the embodiment;

[0028] Fig. 9 is a schematic structural diagram of the upper probe holder described in the embodiment;

[0029] Fig.10 Schematic diagram of the structure of the lower probe frame described in the embodiment.

[0030] Figures 1 to 10 middle:

[0031] 1. Front conveyor rail; 101. Single-piece conveyor rail; 102. Temporary storage frame; 103. Refilling rack; 104. Clamp positioning mechanism; 105. Clamp positioning motor; 106. Clamp positioning support; 107. Clamp positioning wheel; 108. Air blowing and cooling pipe; 109. Ion anti-static air knife;

[0032] 2. AOI inspection mechanism; 201. Four-station turntable; 202. Back AOI inspection instrument assembly; 203. Front AOI inspection instrument assembly; 204. AOI inspection conveyor rail; 205. AOI rotating shaft; 206. AOI adsorption module;

[0033] 3. IV detection mechanism; 301. Working platform; 302. Indexing plate assembly; 303. Detection mechanism; 304. UVW base; 305. Upper probe rack; 306. Lower probe rack; 307. X-axis module; 308. Front single-piece track; 309. Rear single-piece track; 310. First walking arm; 311. Second walking arm; 312. Moving plate; 313. Motor mounting seat; 314. Module motor; 315. Adjusting screw rod; 316. Adjusting slide; 317. Connecting bearing; 318. Upper linear module; 319. Lower linear module. DETAILED DESCRIPTION

[0034] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0035] like Figures 1 to 10 As shown, in this embodiment, a single-wafer inspection integrated machine for solar silicon wafers includes a front-end conveyor rail 1, an AOI inspection mechanism 2 and an IV inspection mechanism 3, wherein the AOI inspection mechanism 2 is located between the front-end conveyor rail 1 and the IV inspection mechanism 3.

[0036] Specifically, a single-piece conveyor rail 101 is arranged on the front conveyor rail 1; the AOI inspection mechanism 2 includes a four-station turntable 201, a back AOI inspection instrument assembly 202, a front AOI inspection instrument assembly 203 and an AOI inspection conveyor rail 204, the four-station turntable 201 is located at the front end of the AOI inspection conveyor rail 204, the back AOI inspection instrument assembly 202 is located below the front end of the four-station turntable 201, and the front AOI inspection is installed above the AOI inspection conveyor rail 204; the IV inspection mechanism 3 includes a working platform 301, a dividing plate assembly 302 and an inspection machine Structure 303, the dividing plate assembly 302 is located in the middle of the working platform 301, the detection mechanism 303 is located in front of the dividing plate assembly 302, the detection mechanism 303 includes a UVW base 304, an upper probe frame 305 and a lower probe frame 306, a UVW deviation correction and alignment assembly is installed at the lower end of the UVW base 304, the UVW deviation correction and alignment assembly includes two groups of X-axis modules 307 and one group of Y-axis modules, the upper probe frame 305 and the lower probe frame 306 are respectively movable on the UVW base 304 along the vertical direction, and detection probes are installed on the upper probe frame 305 and the lower probe frame 306.

[0037] After the printing is completed, the single silicon wafer comes out of the sintering furnace and enters the single silicon wafer conveying track 101. At the end of the single silicon wafer conveying track 101, the AOI inspection mechanism 2 grabs the single silicon wafer to the back AOI inspection instrument component 202 through the four-station turntable 201 for back side inspection, and then turns to the AOI inspection conveying track 204. The AOI inspection conveying track 204 transports the single silicon wafer to the front AOI inspection instrument component 203 for front side inspection. Then the dividing plate assembly 302 on the IV inspection mechanism 3 controls the single silicon wafer to reach the inspection mechanism 303. Under the joint action of two groups of X-axis modules 307 and one group of Y-axis modules, the lower probe frame 306 and the upper probe frame 305 on the UVW base 304 are controlled to align with the position of the single silicon wafer for IV inspection.

[0038] A temporary storage linear module is arranged on the front conveying rail 1, and a temporary storage frame 102 is arranged at the driving end of the temporary storage linear module. The temporary storage frame 102 moves laterally on the side of the single-piece conveying rail 101. The temporary storage frame 102 moves laterally on the side of the front conveying rail 1. When the temporary storage linear module on one side is fully loaded, the other side is placed, and the fully loaded side can be manually unloaded.

[0039] A feeding linear module is arranged on the front conveying rail 1, and a feeding longitudinal module is connected to the driving end of the feeding linear module. The feeding longitudinal module moves laterally on the side of the single-wafer conveying rail 101, and a feeding rack 103 is connected to the driving end of the feeding longitudinal module. The feeding rack 103 moves up and down along the vertical direction. After the feeding linear module approaches the front conveying rail 1, the upper and lower horizontal modules above the front conveying rail 1 control the upper and lower adsorption modules to suck up the single silicon wafer on the feeding rack 103 and place it in the front conveying rail 1. In order to ensure the height of the top silicon wafer, each time a single silicon wafer is taken out, the feeding longitudinal module controls the feeding rack 103 to raise one silicon wafer position until all the silicon wafers on the feeding rack 103 are taken away, and the feeding linear module leaves the front conveying rail 1 laterally, and after filling the silicon wafers, it repeatedly approaches the front conveying rail 1 for feeding.

[0040] A splint positioning mechanism 104 is provided in the middle of the single-wafer conveying rail 101. The splint positioning mechanism 104 includes a splint positioning motor 105, a splint positioning synchronous belt and a splint positioning rotating wheel 107. The driving end of the splint positioning motor 105 is connected with a splint positioning wheel. The splint positioning synchronous belt is transmission-connected with the splint positioning wheel. A splint positioning support 106 is installed on the splint positioning synchronous belt. The splint positioning rotating wheel 107 rotates at the upper end of the splint positioning support 106. The splint positioning motor 105 controls the rotation of the splint positioning wheel to drive the movement of the splint positioning synchronous belt, thereby making the splint positioning support 106 move closer to the middle of the single-wafer conveying rail 101 to correct the position of the single silicon wafer.

[0041] The front end of the single-piece conveyor rail 101 is provided with an air-blowing cooling pipe 108, and the rear end of the single-piece conveyor rail 101 is provided with an ion anti-static wind knife 109. The air-blowing cooling pipe 108 performs cooling treatment, and the ion anti-static wind knife 109 is responsible for removing static electricity.

[0042] An AOI rotating shaft 205 is disposed above the four-station turntable 201 , and four AOI adsorption modules 206 are disposed on the periphery of the four-station turntable 201 . The rotation of the AOI rotating shaft 205 drives the four AOI adsorption modules 206 to transfer the single wafer counterclockwise.

[0043] A front single-chip track 308 and a rear single-chip track 309 are respectively provided on both sides of the indexing disk assembly 302. The front single-chip track 308 and the rear single-chip track 309 both use track motors to drive track belts to transport silicon wafers. A first walking arm 310 and a second walking arm 311 are respectively installed on both sides of the front single-chip track 308 and the side of the rear single-chip track 309. A walking linear module is provided on the first walking arm 310 and the second walking arm 311. A moving plate 312 is connected to the driving end of the walking linear module. A negative pressure adsorption plate is fixed on the inner side end of the moving plate 312. The front single-chip track 308 is responsible for transferring the single wafer to the indexing disk assembly 302. The first walking arm 310 and the second walking arm 311 control the up and down movement of the double half wafers on the indexing disk assembly 302. The negative pressure adsorption plate sucks up the half wafer. The rear single-chip track 309 is responsible for discharging the single wafer from the indexing disk assembly 302.

[0044] The X-axis module 307 and the Y-axis module both include a motor mounting seat 313, a module motor 314, an adjustment screw 315 and an adjustment slide 316. The module motor 314 is fixed on the motor mounting seat 313. The driving end of the module motor 314 is connected to the adjustment screw 315 in a transmission manner. The adjustment screw 315 is threadedly connected to the adjustment nut of the adjustment slide 316. The adjustment slide 316 slides along the length direction of the adjustment screw 315. The adjustment slide 316 has a connecting bearing 317, which slides on the adjusting screw 315. On the adjustment slide 316, the moving direction of the connecting bearing 317 is perpendicular to the moving direction of the adjustment slide 316, and the edge of the UVW base 304 is locked in the connecting bearing 317. Two groups of X-axis modules 307 plus a group of Y-axis modules jointly control the T-axis steering of the UVW base 304 on one side. In the UVW alignment, the two groups of X-axis modules 307 and a group of Y-axis in the above structure realize the X-axis translation, Y-axis translation and T-axis rotation of the upper probe frame 305 and the lower probe frame 306 to meet the alignment requirements.

[0045] The UVW base 304 is equipped with an upper linear module 318 and a lower linear module 319. The upper linear module 318 controls the vertical movement of the upper probe frame 305, and the lower linear module 319 controls the vertical movement of the lower probe frame 306. The upper linear module 318 enables the upper probe frame 305 to move downward and press on the upper surface of the single silicon wafer, while the lower linear module 319 enables the lower probe frame 306 to push upward and contact the gate line on the single silicon wafer, so that a loop is formed for IV detection.

[0046] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.

Claims

1. A solar silicon wafer single-chip detection integrated machine, characterized in that: It includes a front conveyor rail, an AOI detection mechanism and an IV detection mechanism, wherein the AOI detection mechanism is located between the front conveyor rail and the IV detection mechanism; A single-piece conveyor rail is provided on the front conveyor rail; The AOI inspection mechanism includes a four-station turntable, a back AOI inspection instrument assembly, a front AOI inspection instrument assembly and an AOI inspection conveyor rail. The four-station turntable is located at the front end of the AOI inspection conveyor rail, the back AOI inspection instrument assembly is located below the front end of the four-station turntable, and the front AOI inspection is installed above the AOI inspection conveyor rail. The IV detection mechanism includes a working platform, a dividing plate assembly and a detection mechanism, the dividing plate assembly is located in the middle of the working platform, the detection mechanism is located in front of the dividing plate assembly, the detection mechanism includes a UVW base, an upper probe rack and a lower probe rack, a UVW deviation correction and alignment assembly is installed at the lower end of the UVW base, the UVW deviation correction and alignment assembly includes two groups of X-axis modules and one group of Y-axis modules, the upper probe rack and the lower probe rack are respectively movable on the UVW base in the vertical direction, and detection probes are installed on the upper probe rack and the lower probe rack.

2. The solar silicon wafer single-wafer detection integrated machine according to claim 1, characterized in that: A temporary storage linear module is arranged on the front section conveying rail, a temporary storage frame is arranged at the driving end of the temporary storage linear module, and the temporary storage frame moves laterally on the side of the single-piece conveying rail.

3. The solar silicon wafer single-wafer detection integrated machine according to claim 1, characterized in that: A material feeding linear module is arranged on the front section conveying rail, a material feeding longitudinal module is connected to the driving end of the material feeding linear module, the material feeding longitudinal module moves laterally on the side of the single-piece conveying rail, a material feeding frame is connected to the driving end of the material feeding longitudinal module, and the material feeding frame moves up and down along the vertical direction.

4. The solar silicon wafer single-wafer detection integrated machine according to claim 1, characterized in that: A splint positioning mechanism is arranged in the middle of the single-piece conveyor rail, and the splint positioning mechanism includes a splint positioning motor, a splint positioning synchronous belt and a splint positioning rotating wheel. The driving end of the splint positioning motor is connected with the splint positioning wheel, and the splint positioning synchronous belt is transmission-connected with the splint positioning wheel. A splint positioning support is installed on the splint positioning synchronous belt, and the splint positioning rotating wheel rotates on the upper end of the splint positioning support.

5. The solar silicon wafer single-wafer detection integrated machine according to claim 1, characterized in that: The front end of the single-piece conveying rail is provided with an air blowing and cooling pipe, and the rear end of the single-piece conveying rail is provided with an ion static removal air knife.

6. The solar silicon wafer single-wafer detection integrated machine according to claim 1, characterized in that: An AOI rotating shaft is arranged above the four-station turntable, and four AOI adsorption modules are arranged on the periphery of the four-station turntable.

7. The solar silicon wafer single wafer detection integrated machine according to claim 1, characterized in that: A front single-chip track and a rear single-chip track are respectively arranged on both sides of the indexing plate assembly. The front single-chip track and the rear single-chip track both drive track belts through track motors to transport silicon wafers.

8. The solar silicon wafer single-wafer detection integrated machine according to claim 7, characterized in that: The first walking arm and the second walking arm are respectively installed on both sides of the front single-piece track and the side of the rear single-piece track, and the first walking arm and the second walking arm are both provided with a walking linear module, and a moving plate is connected to the driving end of the walking linear module, and a negative pressure adsorption plate is fixed to the inner end of the moving plate.

9. The solar silicon wafer single-wafer detection integrated machine according to claim 1, characterized in that: The X-axis module and the Y-axis module both include a motor mounting seat, a module motor, an adjustment screw and an adjustment slide. The module motor is fixed on the motor mounting seat. The driving end of the module motor is transmission-connected to the adjustment screw. The adjustment screw is threadedly connected to the adjustment nut of the adjustment slide. The adjustment slide slides along the length direction of the adjustment screw. The adjustment slide is provided with a connecting bearing. The connecting bearing slides on the adjustment slide. The moving direction of the connecting bearing is perpendicular to the moving direction of the adjustment slide. The edge of the UVW base is locked in the connecting bearing. The two groups of X-axis modules plus one group of Y-axis modules jointly control the T-axis steering of the UVW base on one side.

10. The solar silicon wafer single wafer detection integrated machine according to claim 1, characterized in that: The UVW base is equipped with an upper linear module and a lower linear module. The upper linear module controls the vertical movement of the upper probe frame, and the lower linear module controls the vertical movement of the lower probe frame.

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