Wafer cooling device on wafer transmission equipment

Abstract

The invention provides a wafer cooling device on wafer transmission equipment, which comprises a bracket assembly, a cooling disc assembly and a lifting assembly, and is characterized in that the bracket assembly is used for bearing a wafer; the cooling disc assembly comprises a cooling disc and a plurality of supporting pieces, the cooling disc is used for cooling wafers, the supporting pieces are arranged on the upper surface of the cooling disc, and the supporting pieces are used for supporting the wafers, so that the wafers are arranged above the cooling disc at intervals; and the lifting assembly is used for driving the bracket assembly to do lifting motion so as to place the wafer on the supporting piece. By arranging the cooling disc assembly, the wafers are arranged above the cooling disc at intervals through the supporting pieces, so that the wafers are cooled through the cooling disc. By arranging the lifting assembly, the lifting assembly drives the bracket assembly to do lifting motion so as to place the wafer on the supporting piece, so that the wafer is automatically placed above the cooling disc for cooling, and the purposes of quickly reducing the temperature of the wafer, shortening the cooling time and improving the production efficiency and the product quality are achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor manufacturing, and more specifically relates to a wafer cooling device on a wafer transmission device. Background Art

[0002] In the semiconductor manufacturing process, cooling of wafers is an important step to ensure production efficiency and product quality. Wafers need to be cooled after processing. The upper limit of the temperature that the general wafer box material can withstand is 80°C. In response to the requirements of high-temperature processes, the material can withstand temperatures as high as 150°C. However, the temperature of the wafer after processing has exceeded the temperature that the wafer box can withstand. At this time, if the wafer is transferred to the wafer box, it will cause damage to the wafer box and affect product quality. Therefore, the wafer cannot be placed in the wafer box quickly. It is necessary to wait for the wafer to drop to a safe temperature and then transfer it back to the wafer box for storage. This not only wastes time, but also reduces production efficiency. Summary of the invention

[0003] Based on the technical problems existing in the prior art, the present invention provides a wafer cooling device on a wafer transmission equipment, aiming to solve the technical problems of long cooling time of processed wafers and low production efficiency in the prior art.

[0004] To achieve the above-mentioned purpose, the present invention provides a wafer cooling device on a wafer transmission equipment, comprising: a bracket assembly, which is used to carry wafers; a cooling plate assembly, which includes a cooling plate and a plurality of supporting members, the cooling plate is used to cool the wafers, and the upper surface of the cooling plate is provided with a plurality of supporting members, the supporting members are used to support the wafers so that the wafers are spaced above the cooling plate; a lifting assembly, which is used to drive the bracket assembly to perform lifting movements to place the wafers on the supporting members.

[0005] Optionally, the support assembly comprises a plurality of support frames distributed along the circumference of the cooling plate, and the support frames have a receiving portion radially extending from the inside.

[0006] Optionally, the lifting assembly includes a fixed seat, a driving motor, a transmission mechanism, a lifting base and multiple lifting rods, the multiple lifting rods are arranged in a one-to-one correspondence with the multiple support frames, and the two ends of the lifting rods are respectively connected to the lifting base and the support frame; the fixed seat is fixedly installed under the cooling plate, the driving motor is installed on the fixed seat, and the driving end of the driving motor is connected to the lifting base through the transmission mechanism to drive the lifting rod to rise or fall through the lifting base.

[0007] Optionally, the transmission mechanism includes a coupling, a lead screw and a nut. The drive motor is connected to the lead screw through the coupling. The lead screw passes through the nut. The nut is threadedly connected to the lead screw. The nut is mounted on the lifting base.

[0008] Optionally, a guide rail is provided on the fixed seat, a slider is provided on the lifting base, the guide rail is provided along the movement direction of the lifting base, and the slider is slidably connected to the guide rail.

[0009] Optionally, a top screw is provided at the bottom of the lifting rod, and the top screw is passed through the lifting base.

[0010] Optionally, the lifting assembly further includes an upper limit block and a lower limit block, and the upper limit block and the lower limit block are respectively arranged on both sides of the lifting base.

[0011] Optionally, the support member includes a support column and an adjustment column, the support column is used to support the wafer, and the adjustment column is connected to the support column and can drive the support column to rise and fall in a vertical direction.

[0012] Optionally, a support groove is provided on the upper surface of the cooling plate, and the adjusting column is threadedly connected in the support groove.

[0013] Optionally, a first through hole and a second through hole connected to the first through hole are provided in the adjusting column, the inner diameter of the first through hole is smaller than the inner diameter of the second through hole, the first through hole is used to insert the installation wrench, and the supporting column is detachably connected to the second through hole.

[0014] Compared with the prior art, the wafer cooling device on the wafer transmission equipment provided by the present invention has the following beneficial effects: The present invention arranges a cooling plate assembly so that the wafer is arranged above the cooling plate through a support member, so as to realize cooling of the wafer through the cooling plate. At the same time, a lifting assembly is arranged so that the lifting assembly drives the support assembly to perform lifting movement to place the wafer on the support member, thereby realizing automatic placement of the wafer above the cooling plate for cooling, thereby achieving rapid reduction of the wafer temperature, shortening the cooling time, and improving production efficiency and product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 A schematic structural diagram of a wafer cooling device on a wafer transport device provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of a wafer cooling device on a wafer transfer device provided by an embodiment of the present invention from another perspective; Figure 3 A schematic cross-sectional structural diagram of a wafer cooling device on a wafer transport device provided by an embodiment of the present invention; Figure 4 A schematic diagram of a temperature drop curve when the height of the support member provided in an embodiment of the present invention from the cooling plate is 0.5 mm; Figure 5 A schematic diagram of a temperature drop curve when the height of the support member provided in an embodiment of the present invention from the cooling plate is 0.1 mm; Figure 6 A schematic diagram of the working principle of a wafer cooling device on a wafer transport device provided by an embodiment of the present invention; Figure 7 A schematic cross-sectional structural diagram of a support member provided in an embodiment of the present invention.

[0017] The reference numerals in the above drawings are as follows: 10. Wafer; 11. cooling plate; 111. supporting groove; 12. Support member; 121. Support column; 122. Adjustment column; 123. First through hole; 13. Water inlet; 14. Water outlet; 15. Manipulator; 16. Support frame; 17. Supporting part; 18. Avoidance groove; 19, fixed seat; 191, upper plate; 192, side plate; 193, lower plate; 20. Driving motor; 21. Lifting base; 22. Lifting rod; 23. Through hole; 24. Coupling; 25. Lead screw; 26. Nut; 27. Motor base; 28. First support bearing; 29. ​​Second support bearing; 30. Guide rail; 31. Slider; 32. Bellows; 33. Top screw; 34. Upper limit block; 35. Lower limit block; 36. Handle. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0019] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0023] Please refer to Figures 1 to 3 As shown, in some embodiments of the present invention, a wafer cooling device on a wafer transfer equipment is provided, including: a bracket assembly, which is used to carry a wafer 10; a cooling plate assembly, which includes a cooling plate 11 and a plurality of supporting members 12, the cooling plate 11 is used to cool the wafer 10, and a plurality of supporting members 12 are arranged on the upper surface of the cooling plate 11, the supporting members 12 are used to support the wafer 10 so that the wafer 10 is spaced above the cooling plate 11; a lifting assembly, which is used to drive the bracket assembly to perform lifting and lowering movements to place the wafer 10 on the supporting members 12. In the present embodiment, the cooling disk 11 is a disc-shaped structure, and the interior of the cooling disk 11 has a cooling cavity, and the cooling cavity is provided with a cooling pipe (not shown in the figure) for passing a cooling medium (such as cooling water or cooling gas), and the upper surface of the cooling disk 11 is a cooling surface, and the lower surface of the cooling disk 11 is provided with a water inlet 13 and a water outlet 14, and the two ends of the cooling pipe are respectively connected to the water inlet 13 and the water outlet 14, so that the cooling medium can flow in the cooling pipe; a plurality of support members 12 are distributed on the cooling surface at intervals, and the support member 12 is columnar, one end of which is connected to the cooling disk 11, and the other end extends out of the cooling surface to support the wafer 10, so as to avoid metal particle contamination caused by contact between the wafer 10 and the cooling surface of the cooling disk 11. Optionally, the top of the support member 12 is 0.1 mm to 0.5 mm higher than the cooling surface. Among them, the closer the distance between the wafer 10 and the cooling disk 11, the faster the temperature drops, such as Figure 4 and Figure 5 shown.

[0024] See also Figure 6As shown, the working principle of a wafer cooling device on a wafer transport device provided in this embodiment is as follows: The support assembly is in the upper position (i.e., the support assembly is above the cooling surface and higher than the top of the support 12), and the robot 15 transfers the wafer 10 to the support assembly, as shown in A; the robot 15 places the wafer 10 on the support assembly, and the robot 15 returns empty-handed, as shown in B; the support assembly descends to the lower position (i.e., the support assembly places the wafer 10 above the support 12), and the wafer 10 begins to cool rapidly, as shown in C; after the wafer 10 is cooled, the support assembly rises and lifts the wafer 10 to the upper position, at which time the robot 15 takes away the wafer 10.

[0025] By applying the above technical scheme of the present invention, a cooling plate assembly is set up, and the wafer 10 is arranged above the cooling plate 11 through the support member 12, so that the wafer 10 can be cooled by the cooling plate 11. At the same time, a lifting assembly is set up, and the lifting assembly drives the support assembly to perform lifting movement to place the wafer 10 on the support member 12, thereby automatically placing the wafer 10 above the cooling plate 11 for cooling, thereby quickly reducing the temperature of the wafer 10, shortening the cooling time, and improving production efficiency and product quality.

[0026] See also Figure 1 As shown, in some embodiments, the support assembly includes a plurality of support frames 16 distributed along the circumference of the cooling plate 11, and the support frames 16 have a supporting portion 17 extending radially from the inside. Specifically, the support assembly may include two arc-shaped support frames 16, as shown in the figure, the two support frames 16 are arranged opposite to each other and arranged along the edge of the cooling plate 11, and the circumference of the cooling plate 11 is correspondingly provided with an avoidance groove 18 adapted to the support frame 16, when the support frame 16 is lowered to the lower position, the support frame 16 is located inside the avoidance groove 18; the inner side of each support frame 16 is provided with a supporting portion 17, and the supporting portion 17 is used to carry the wafer 10, so that the wafer 10 is located above the supporting portion 17, and the wafer 10 is located on the inner side of the two support frames 16.

[0027] See also Figures 1 to 3As shown, in some embodiments, the lifting assembly includes a fixed seat 19, a driving motor 20, a transmission mechanism, a lifting base 21 and a plurality of lifting rods 22. The plurality of lifting rods 22 are arranged in a one-to-one correspondence with the plurality of support frames 16, and the two ends of the lifting rods 22 are respectively connected to the lifting base 21 and the support frame 16; the fixed seat 19 is fixedly installed below the cooling plate 11, the driving motor 20 is installed on the fixed seat 19, and the driving end of the driving motor 20 is connected to the lifting base 21 through the transmission mechanism to drive the lifting rods 22 to rise or fall through the lifting base 21. Specifically, the cooling plate 11 is provided with a plurality of through holes 23 for the lifting rods 22 to pass through, and each lifting rod 22 extends into a through hole 23. One end of the lifting rod 22 is located above the cooling plate 11 and connected to the support frame 16, and the other end is located below the cooling plate 11 and connected to the lifting base 21, wherein the number of the lifting rods 22 is the same as the number of the support frames 16, and each lifting rod 22 is only connected to one support frame 16, and the driving motor 20 drives each lifting rod 22 to rise or fall through the lifting base 21, thereby driving each support frame 16 to rise and fall to receive the wafer 10 or place the wafer 10 on the support 12.

[0028] See also Figure 3 As shown, in some embodiments, the transmission mechanism includes a coupling 24, a lead screw 25 and a nut 26. The driving motor 20 is connected to the lead screw 25 through the coupling 24. The lead screw 25 is inserted into the nut 26. The nut 26 is threadedly connected to the lead screw 25, and the nut 26 is installed on the lifting base 21. Specifically, the lead screw 25 is provided with a nut 26 on the outside, and the nut 26 is threadedly matched with the nut 26. The rotation of the lead screw 25 drives the nut 26 to move along the axial direction of the lead screw 25. The lifting base 21 is provided with a mounting hole, and the nut 26 is fixedly installed in the mounting hole. The lifting base 21 is driven to rise or fall by the movement of the nut 26, and then the lifting rod 22 and the support frame 16 are driven to move up and down through the lifting base 21, so as to receive the wafer 10. In this embodiment, the fixed seat 19 includes an upper plate 191, a side plate 192 and a lower plate 193. The upper plate 191 is installed below the cooling plate 11. The side plate 192 is connected between the upper plate 191 and the lower plate 193, so that the upper plate 191 and the lower plate 193 are arranged at intervals. The lifting base 21 is located between the upper plate 191 and the lower plate 193 and is slidably connected to the side plate 192, so that the lifting base 21 can move between the upper plate 191 and the lower plate 193. The driving motor 20 is fixed below the lower plate 193 through the motor base 27, and the two ends of the lead screw 25 are connected to the upper plate 191 and the lower plate 193 through the first support bearing 28 and the second support bearing 29 respectively. Among them, the driving motor 20 adopts a servo motor, which has a high-precision position control capability and can reach the sub-millimeter level, thereby improving the positioning accuracy of the lifting assembly. In addition, the servo motor also has the characteristics of controllable lifting speed and reliable operation.

[0029] See also Figure 3As shown, in some embodiments, a guide rail 30 is provided on the fixed base 19, and a slider 31 is provided on the lifting base 21. The guide rail 30 is provided along the movement direction of the lifting base 21, and the slider 31 is slidably connected with the guide rail 30. The movement direction of the lifting base 21 is the axial direction of the guide rail 30, and the slider 31 can slide along the axial direction of the guide rail 30. The guide rail 30 is provided to guide and limit the slider 31, so as to prevent the lifting base 21 from deflecting or offsetting when performing lifting movement.

[0030] See also Figure 3 As shown, in some embodiments, the lifting rod 22 is sleeved with a bellows 32, and the two ends of the bellows 32 are respectively connected to the cooling plate 11 and the lifting base 21. The bellows 32 is sleeved on the outer side of the lifting rod 22, the top of the bellows 32 is connected to the upper plate 191, and the bottom of the bellows 32 is connected to the lower plate 193. It can be understood that since the bellows 32 can be compressed or stretched when the lifting base 21 moves up and down, it can play a sealing role and will not affect the lifting movement of the lifting base 21.

[0031] See also Figure 3 As shown, in some embodiments, a top screw 33 is provided at the bottom of the lifting rod 22, and the top screw 33 is passed through the lifting base 21. The top screw 33 is used to level the lifting rod 22 to prevent the support frame 16 from tilting when carrying the wafer 10, thereby preventing the wafer 10 from being damaged when being placed on the support member 12. Specifically, the top screw 33 is passed through a through hole on the lifting base 21, and the upper end of the top screw 33 is used to abut against the bottom of the lifting rod 22.

[0032] See also Figure 3 As shown, in some embodiments, the lifting assembly further includes an upper limit block 34 and a lower limit block 35, which are respectively arranged on both sides of the lifting base 21. The lifting and lowering movement of the lifting base 21 is limited by the upper limit block 34 and the lower limit block 35. Specifically, the upper limit block 34 is arranged on the lifting base 21 and protrudes from the upper surface of the lifting base 21, and the lower limit block 35 is arranged on the lower plate 193 and protrudes from the upper surface of the lower plate 193. When the support frame 16 is in the upper position, the upper limit block 34 abuts against the upper plate 191, and when the support frame 16 is in the lower position, the lower limit block 35 abuts against the lower plate 193.

[0033] See also Figure 7As shown, in some embodiments, the support member 12 includes a support column 121 and an adjustment column 122. The support column 121 is used to support the wafer 10. The adjustment column 122 is connected to the support column 121 and can drive the support column 121 to rise and fall in the vertical direction. In this embodiment, the support column 121 is made of a non-metal head material, for example, quartz material. Since the quartz material does not contain metal particles, the surface is smooth after processing, which can reduce the risk of scratching the wafer 10 and avoid friction to produce particles and contaminate the wafer 10. In addition, the quartz material has strong high temperature resistance and is not prone to chemical reactions, which can ensure the quality of the wafer 10. The adjustment column 122 can be made of metal. The support column 121 is driven to rise and fall by the adjustment column 122 to adjust the gap between the wafer 10 and the cooling plate 11. For example, the gap adjustment range is 0.1mm-0.5mm.

[0034] See also Figure 7 As shown, in some embodiments, a support groove 111 is provided on the upper surface of the cooling plate 11, and an adjusting column 122 is threadedly connected in the support groove 111. Specifically, the adjusting column 122 is embedded in the support groove 111, wherein the inner wall of the support groove 111 is provided with an internal thread, and the outer wall of the adjusting column 122 is provided with an external thread. By rotating the adjusting column 122, the height of the adjusting column 122 in the support groove 111 can be adjusted, thereby adjusting the height of the supporting column 121 protruding from the upper surface of the cooling plate 11. By threading the adjusting column 122 with the support groove 111, the height of the supporting member 12 can be quickly adjusted without replacing the supporting member 12, thereby improving production efficiency.

[0035] See also Figure 7 As shown, in some embodiments, the adjusting column 122 is provided with a first through hole 123 and a second through hole (not shown in the figure) connected to the first through hole 123. The inner diameter of the first through hole 123 is smaller than the inner diameter of the second through hole. The first through hole 123 is used to insert the installation wrench, and the support column 121 is detachably connected to the second through hole. In this embodiment, the top of the support column 121 is spherical, which can not only avoid the risk of scratching the wafer 10, but also reduce the contact area between the support column 121 and the wafer 10, thereby reducing the generation of particles to contaminate the wafer 10; since the support column 121 and the adjusting column 122 are separated and detachably connected, it is convenient to maintain and replace the support column 121. During assembly, first put the adjusting column 122 into the support groove 111, insert the installation wrench into the first through hole 123 and rotate the adjusting column 122 to adjust the height. After the height is determined, insert the support column 121 into the second through hole.

[0036] See also Figure 2 As shown, in some embodiments, a handle 36 for installation operation is provided at the bottom of the cooling plate 11 .

[0037] In summary, the wafer cooling device on the wafer transfer device provided in this embodiment has at least the following beneficial technical effects: (1) By setting a cooling plate assembly, the wafer 10 is arranged above the cooling plate 11 through the support 12, so that the wafer 10 can be cooled by the cooling plate 11. At the same time, by setting a lifting assembly, the lifting assembly drives the support assembly to move up and down to place the wafer 10 on the support 12, so that the wafer 10 is automatically placed above the cooling plate 11 for cooling, so as to quickly reduce the temperature of the wafer 10, shorten the cooling time, and improve the production efficiency and product quality; (2) The positioning accuracy of the lifting assembly is improved by using a servo motor to drive the lead screw 25 and the nut 26 for transmission; (3) The support column 121 and the adjustment column 122 are detachably connected, so that the adjustment column 122 is threadedly connected to the support groove 111 of the cooling plate 11. The height of the support column 121 protruding from the upper surface of the cooling plate 11 can be adjusted by rotating the adjustment column 122. The adjustment method is convenient and there is no need to replace the support member 12. The height of the support member 12 can be quickly adjusted, thereby improving production efficiency. In addition, when the support column 121 is worn or damaged, it is easy to maintain and replace.

[0038] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementations of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A wafer cooling device on a wafer transport device, characterized in that: It includes: A support assembly for carrying a wafer; A cooling plate assembly, comprising a cooling plate and a plurality of supporting members, wherein the cooling plate is used to cool the wafers, and a plurality of supporting members are arranged on the upper surface of the cooling plate, and the supporting members are used to support the wafers so that the wafers are arranged above the cooling plate at intervals; The lifting assembly is used to drive the support assembly to perform lifting motion so as to place the wafer on the support member.

2. The wafer cooling device on the wafer transfer equipment according to claim 1, characterized in that: The support assembly includes a plurality of support frames distributed along the circumference of the cooling plate, and the support frames have a receiving portion radially extending from the inner portion.

3. The wafer cooling device on the wafer transfer equipment according to claim 2, characterized in that: The lifting assembly includes a fixed seat, a driving motor, a transmission mechanism, a lifting base and a plurality of lifting rods, the plurality of lifting rods are arranged in a one-to-one correspondence with the plurality of support frames, and the two ends of the lifting rods are respectively connected to the lifting base and the support frame; The fixing seat is fixedly installed below the cooling plate, the driving motor is installed on the fixing seat, and the driving end of the driving motor is connected to the lifting base through the transmission mechanism to drive the lifting rod to rise or fall through the lifting base.

4. The wafer cooling device on the wafer transport equipment according to claim 3, characterized in that: The transmission mechanism includes a coupling, a lead screw and a nut. The drive motor is connected to the lead screw through the coupling. The lead screw is passed through the nut. The nut is threadedly connected to the lead screw. The nut is installed on the lifting base.

5. The wafer cooling device on the wafer transfer equipment according to claim 4, characterized in that: The fixing seat is provided with a guide rail, the lifting base is provided with a slider, the guide rail is arranged along the moving direction of the lifting base, and the slider is slidably connected with the guide rail.

6. The wafer cooling device on the wafer transport equipment according to claim 4, characterized in that: A top screw is arranged at the bottom of the lifting rod, and the top screw is passed through the lifting base.

7. The wafer cooling device on the wafer transport equipment according to claim 4, characterized in that: The lifting assembly further comprises an upper limit block and a lower limit block, and the upper limit block and the lower limit block are respectively arranged on both sides of the lifting base.

8. The wafer cooling device on the wafer transport equipment according to claim 1, characterized in that: The support member comprises a support column and an adjustment column, wherein the support column is used to support the wafer, and the adjustment column is connected to the support column and can drive the support column to rise and fall in a vertical direction.

9. The wafer cooling device on the wafer transport equipment according to claim 8, characterized in that: A supporting groove is provided on the upper surface of the cooling plate, and the adjusting column is threadedly connected in the supporting groove.

10. The wafer cooling device on the wafer transport equipment according to claim 9, characterized in that: The adjusting column is provided with a first through hole and a second through hole connected to the first through hole, the inner diameter of the first through hole is smaller than the inner diameter of the second through hole, the first through hole is used to insert a mounting wrench, and the supporting column is detachably connected to the second through hole.

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