Wafer cleaning and drying device

Abstract

The invention relates to the technical field of semiconductor processing, and provides a wafer cleaning and drying device. The wafer cleaning device comprises a box body, a placing mechanism which is arranged in the box body and is used for placing a wafer, a cleaning mechanism which is arranged in the box body and is used for cleaning the wafer on the placing mechanism, a drying mechanism which is used for drying two surfaces of the cleaned wafer, and a control mechanism which is electrically connected with the cleaning mechanism and the drying mechanism, at least two placing mechanisms are arranged in the height direction of the box body at intervals; the placing mechanism comprises two placing plates symmetrically arranged in the height direction of the box body, two first driving assemblies for driving the two placing plates to rotate correspondingly, two sets of rotating plates rotationally connected to the surfaces, close to each other, of the two placing plates correspondingly, and a second driving assembly for driving the rotating plates to rotate. The wafer processing method has the beneficial effect of improving the wafer processing efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor processing, and in particular to a wafer cleaning and drying device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon, which is then cut into round sheets. Since micro particles are attached to the surface of the wafer during the production process, it needs to be cleaned and dried.

[0003] Spray-type megasonic cleaning is a common cleaning and drying method during wafer processing. The main principle of the equipment is to clean the wafer by combining the high-energy frequency vibration effect with the chemical reaction of the cleaning agent. When in use, the wafer is first placed on a turntable and fixed. While the turntable rotates, the nozzle sprays the cleaning agent onto the wafer surface. After the megasonic is turned on, the high-speed acoustic microflow formed in the cleaning agent cleans the wafer. Finally, the air pipe sprays nitrogen or air onto the wafer surface to achieve drying.

[0004] In the prior art, after one surface of the wafer is cleaned and dried, the wafer is usually turned over so that the other surface of the wafer faces upward for cleaning and drying. Such work efficiency is relatively low, and therefore further improvement is needed. Summary of the invention

[0005] In order to improve the processing efficiency of wafers, the present application provides a wafer cleaning and drying device.

[0006] The present application provides a wafer cleaning and drying device, which adopts the following technical solution: A wafer cleaning and drying device comprises a box body, a placing mechanism arranged in the box body for placing wafers, a cleaning mechanism arranged in the box body for cleaning the wafers located on the placing mechanism, a drying mechanism for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism and the drying mechanism respectively; at least two of the placing mechanisms are arranged at intervals along the height direction of the box body, and the placing mechanism comprises two placing plates symmetrically arranged along the height direction of the box body, two first driving components respectively driving the two placing plates to rotate, two groups of rotating plates respectively connected to surfaces of the two placing plates close to each other, and a second driving component for driving the rotating plates to rotate, and the two The lower ends of the placement plates are tilted in a direction approaching each other, and the upper ends of the placement plates are rotatably connected to the box body. The second drive assembly and the first drive assembly are both electrically connected to the control mechanism, and a flip assembly for turning the wafer is arranged between the two placement mechanisms; an adsorption port is arranged on the outer surface of the rotating plate, and a chamber connected to the adsorption port is arranged in the rotating plate, and a negative pressure assembly for making the chamber in a negative pressure state is arranged on the rotating plate, and the negative pressure assembly is electrically connected to the control mechanism; the drying mechanism is arranged below the placement mechanism, and the box body is located between the placement mechanism and the drying mechanism and is provided with a blocking assembly for blocking the cleaning agent and water of the cleaning mechanism when cleaning the wafer.

[0007] By adopting the above technical scheme, under normal conditions, the surfaces of the placement plates that are close to each other are arranged at an angle. After the wafer to be cleaned is placed on the rotating plate in the upper placement mechanism, the negative pressure component is started by the control mechanism to fix the wafer on the rotating plate, and then the second drive component and the cleaning mechanism are started respectively to clean the wafer. When the exposed surface of the wafer is cleaned, the first drive component is started to drive the placement plate to rotate to a certain angle, and the negative pressure component is used to release the fixation of the rotating plate on one of the placement plates to the wafer. At this time, the wafer slides toward the placement plate located in the opposite direction of the lower inclination along the inclination direction of the placement plate, and the flipping component flips the wafer over, so that the other side of the wafer that has been cleaned on one side in the upper placement mechanism is set upwards, and after they all fall and turn over to the placement mechanism below, a new batch of wafers that need to be cleaned are placed in the upper placement mechanism, and then they are cleaned by the cleaning mechanism.

[0008] When both surfaces of the wafer are cleaned, the first driving component is used again to rotate the placement plate of the placement mechanism below, and after the wafer is released, it falls into the drying mechanism below to dry both sides of the wafer. Since the drying mechanism is arranged below the placement mechanism, the rotating plate will rotate, and the cleaning mechanism will cause water to fall into the drying mechanism below during the cleaning process. A blocking component is provided to block this so as to reduce the impact on the drying of the cleaned wafer.

[0009] By the above method, compared with the cleaning and drying method in the prior art, one drying process can be reduced to improve the processing efficiency of the wafer. And because a placement plate is provided, the two are arranged at an angle, and after one side of the wafer is cleaned, it falls to the placement mechanism below and is turned over by the flip assembly to clean the other side of the wafer, thereby increasing the number of wafers cleaned to further speed up the processing efficiency of the wafer.

[0010] Preferably, the surfaces of the two placement plates that are close to each other are penetrated with a rotating groove for the rotating plate to be rotatably connected, the second driving component includes a ring gear fixedly connected to the lower surface of the rotating plate, a gear meshing with the ring gear, and a second driving motor that drives the gear to rotate, and the negative pressure component includes a connecting pipe rotatably connected to the middle part of the rotating plate to communicate with the chamber and an air pump connected to the connecting pipe to supply or exhaust air.

[0011] By adopting the above technical solution, when the wafer is placed on the rotating plate, the air pump is started to make the chamber in a negative pressure state to fix the wafer on the rotating plate, and then the second drive motor is started to drive the gear, the ring gear and the rotating plate to rotate in turn, and the cleaning mechanism is started to clean the wafer.

[0012] Preferably, the placing plates in the two placing mechanisms are respectively the first placing plate and the second placing plate from top to bottom along the height direction of the box body, and the flipping assembly includes a transverse plate arranged on the first placing plate and a partition bar arranged between the two second placing plates, and the transverse plates are provided with two and are respectively arranged at the lower ends of the two first placing plates, and the length direction of the transverse plate is parallel to the length direction of the first placing plates, and the two transverse plates are overlapped; the opposite side walls of the partition bar are provided with abutting surfaces for abutting against the wafers sliding down from the first placing plate, and the two ends of the partition bar are respectively connected to the opposite side walls of the box body, and the second placing plate abuts against the lower surface of the partition bar, and the width of the partition bar is smaller than the width of the two transverse plates after overlapping.

[0013] By adopting the above technical scheme, the lower ends of the two first placement plates move in a direction approaching each other, and the angle formed between the cross plate and the first placement plate is an obtuse angle. Since there are two cross plates and they are overlapped, it is necessary to start the two first driving components respectively to drive the two first placement plates to rotate in the direction close to the placement mechanism below. After rotating to a certain angle, the wafer on the first placement plate is first released. At this time, the wafer slides down under the action of gravity and moves along the first placement plate and the cross plate in the direction close to the second placement plate. When the wafer abuts against the second placement plate, the first driving component is started to drive the first placement plate to rotate and reset. At this time, a thrust is applied to the wafer so that the angle formed between the wafer and the second placement plate becomes an acute angle. At this time, the wafer is acted upon by gravity to abut the cleaned side against the second placement plate, that is, the wafer is flipped over.

[0014] The two horizontal plates are overlapped, and the overlapped width is greater than the width of the partition bar, so that the wafer can be tilted toward the second placement plate after the first placement plate is reset, so as to improve the feasibility of the flipping operation.

[0015] Preferably, an air hole is formed on the upper surface of the transverse plate away from the first placement plate, a connecting cavity connected to the air hole is provided in the transverse plate, and a first air supply pipe connected to the connecting cavity for supplying or exhausting air is provided on the transverse plate.

[0016] By adopting the above technical solution and providing the air holes, a certain thrust can be given to the wafer during the resetting process of the first placement plate to push the wafer toward the second placement plate, thereby increasing the success rate of wafer flipping.

[0017] Preferably, the flip assembly further comprises a first airbag disposed on the transverse plate, the first airbag having a first expansion inner cavity, and the air hole is connected to the first expansion inner cavity.

[0018] By adopting the above technical solution, a first airbag is provided to collect the gas blown out from the air hole and then expand it, and after expansion, the wafer is pushed to move toward the rotating plate. As the gas increases, the distance that can be expanded is relatively large, which can reduce the possibility of flipping failure compared to directly releasing gas from the air hole to push the wafer to flip. In addition, the first airbag can seal the air hole to reduce the possibility of cleaning liquid or water entering the air hole later.

[0019] Preferably, the partition bar is elastic, the flip assembly further comprises a lifting member for driving the partition bar to rise and fall along the height direction of the box body, and the inclination angle of the second placement plate is greater than the inclination angle of the first placement plate.

[0020] By adopting the above technical solution, the partition bar is set to have elasticity to reduce the possibility of damage when the wafer falls to the second placement plate below, and it is also convenient to improve the sealing effect between the second placement plate and the partition bar, and reduce the possibility of water overflowing into the drying mechanism below during the wafer cleaning process. In order to facilitate the wafer to fall into the drying mechanism below for drying, the inclination angle of the second placement plate is greater than the inclination angle of the first placement plate, and a lifting member is provided to drive the partition bar to rise and fall along the height direction of the box body to adjust the height position of the partition bar, so as to provide a falling space for the wafer to fall, so that it can fall into the drying mechanism below for drying.

[0021] Preferably, the partition strip is a second airbag having a second expansion cavity therein, and the second airbag is connected to a second air pipe for supplying or exhausting air, and when the second airbag is inflated through the second air pipe, it expands in a direction close to the second placement plate.

[0022] By adopting the above technical solution, the second airbag can also expand itself to abut against the second placement plate to achieve a sealing effect.

[0023] Preferably, the blocking assembly is arranged on the second placement plate, and the blocking assembly includes a blocking plate that can be extended and retracted as the second placement plate rotates, and the blocking plate includes a plurality of folding plates connected to each other, and a plurality of through holes are opened on the surface of the second placement plate along its own length direction, and the through holes are located above the folding plates, and a drain pipe for discharging cleaning water and detergent out of the box body is fixedly penetrated by the side wall of the box body.

[0024] By adopting the above technical solution, the lower drying component blocks water and detergent by means of a blocking plate that can be extended and retracted as the second rotating plate rotates.

[0025] Preferably, the blocking assembly also includes two guide plates both arranged below the blocking plate, the two guide plates are symmetrically arranged along the axis of the box body, the two guide plates are respectively arranged on both sides of the second placement plate and connected to the box body, the length direction of the guide plate is perpendicular to the length direction of the blocking plate, and the guide plate is inclined in the direction away from the second placement plate; the drying mechanism includes a conveying rack arranged below the second placement plate, a placement rack arranged on the conveying rack for inclined placement of wafers, and an exhaust pipe for conveying gas to dry the wafers.

[0026] By adopting the above technical solution, since the blocking plate is a plurality of folding plates connected to each other, the sealing between the blocking plate and the box body may be poor, and there may be a gap between the two blocking plates, water may overflow into the drying mechanism below, and a guide plate is provided to prevent this. Due to the movement of the partition bar or the rotation of the second placement plate, the wafers after cleaning are tilted and fall onto the conveying rack, and a conveying rack is provided on the conveying rack for placing the wafers, and then the wafers are dried through the exhaust pipe.

[0027] Preferably, the placement rack includes a cross bar, two groups of support rods arranged obliquely on both sides of the cross bar, and a connecting rod arranged parallel to the length direction of the cross bar. The length direction of the cross bar is arranged parallel to the width direction of the conveying rack. The placement rack is provided with an adsorption component for absorbing moisture.

[0028] By adopting the above technical solution, since the support rod is set at an angle, the wafer can be placed at an angle after falling so that the two exposed opposite surfaces of the wafer can be dried through the exhaust pipe, and the part in contact with the placement rack is adsorbed by the adsorption member.

[0029] In summary, this application has the following beneficial effects: By the above method, compared with the cleaning and drying method in the prior art, one drying process can be reduced to improve the processing efficiency of the wafer. And because a placement plate is provided, the two are arranged at an angle, and after cleaning one side of the wafer, it can fall to the placement mechanism below and be turned over by the flip assembly to clean the other side of the wafer, thereby increasing the number of wafers cleaned to further speed up the processing efficiency of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application; Figure 2 is a schematic diagram of the internal structure of Example 1 of the present application; Figure 3 It is a schematic diagram of the back structure of the box body in Example 1 of the present application; Figure 4 is a schematic structural diagram of the rotating plate in Example 1 of the present application; Figure 5 is a schematic diagram of the structure of the second drive assembly in Example 1 of the present application; Figure 6 It is a structural schematic diagram of the placement rack in Example 1 of the present application; Figure 7 is a schematic diagram of the structure of the toggle member in Example 2 of the present application; Figure 8 is a schematic cross-sectional structural diagram of the horizontal plate in Example 3 of the present application; Fig. 9 is a schematic diagram of the structure of the lifting member in Example 3 of the present application; Fig.10 It is a schematic diagram of the structure of the first airbag in Example 4 of the present application.

[0031] Explanation of the reference numerals: 1. Box body; 11. Opening; 12. Box door; 13. Drain pipe; 14. Negative pressure assembly; 141. Connecting pipe; 142. Air pump; 143. Dust cover; 15. Through hole; 16. Mounting plate; 2. Placement mechanism; 21. Placement plate; 211. Perforation; 212. Rotating rod; 213. Rotating groove; 214. First placement plate; 215. Second placement plate; 22. First drive assembly; 23. Rotating plate; 231. Adsorption port; 232. Chamber; 24. Second drive assembly; 241. Gear ring; 242. Gear; 243. Second drive motor; 3. Cleaning mechanism; 31. Spray head ; 32. Water supply pipe; 33. Third drive assembly; 4. Drying mechanism; 41. Conveying rack; 42. Placement rack; 421. Cross bar; 422. Support rod; 423. Connecting rod; 424. Adsorbent; 43. Exhaust pipe; 5. Flip assembly; 51. Cross plate; 511. Air hole; 512. Connecting cavity; 513. First air pipe; 52. Spacer; 53. Lifting member; 531. Ring; 532. Screw rod; 533. Fourth drive motor; 54. First air bag; 6. Blocking assembly; 61. Blocking plate; 62. Guide plate; 7. Toggle member; 71. Rotating shaft; 72. Toggle rod; 73. Third drive motor. DETAILED DESCRIPTION

[0032] The following is combined with Figure 1 -Attached Fig.10 , further details of this application are given.

[0033] The embodiment of the present application discloses a wafer cleaning and drying device.

[0034] Embodiment 1: A wafer cleaning and drying device, referring to Figure 1 , Figure 2 , including a box body 1, a placement mechanism 2 arranged in the box body 1 for placing wafers, a cleaning mechanism 3 arranged in the box body 1 for cleaning the wafers on the placement mechanism 2, a drying mechanism 4 for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism 3 and the drying mechanism 4, respectively. A flipping assembly 5 for turning the wafers over is arranged between the two placement mechanisms 2 to turn the wafers over. Among them, the control mechanism is used to control the parameters of the entire cleaning and drying process, such as cleaning time, drying temperature, etc., and usually adopts intelligent control equipment such as PLC or single-chip microcomputer to realize automatic control and precise adjustment. Since this is a prior art, it will not be elaborated here.

[0035] The top of the box 1 is provided with an opening 11 for placing wafers, and the box 1 is provided with a door 12 for opening and closing the opening 11. It should be noted that two symmetrically arranged conveyor belts may also be provided, and correspondingly, the box 1 is provided with a through slot for the conveyor belts to pass through, so as to convey the wafers to the placement mechanism 2, which is specifically provided according to the needs. The side wall of the box 1 is fixedly provided with a drain pipe 13 for discharging the water and detergent used for cleaning from the box 1.

[0036] Reference Figure 2 , Figure 3 In this embodiment, at least two placement mechanisms 2 are arranged at intervals along the height direction of the box body 1, and the two placement mechanisms 2 and the drying mechanism 4 are arranged at intervals along the height direction, wherein the placement mechanism 2 specifically includes two placement plates 21 symmetrically arranged along the height direction of the box body 1, two first driving components 22 that respectively drive the two placement plates 21 to rotate, two groups of rotating plates 23 that are respectively rotatably connected to the surfaces of the two placement plates 21 that are close to each other, and a second driving component 24 for driving the rotating plates 23 to rotate.

[0037] Reference Figure 2 , Figure 3 , Figure 4 In this embodiment, the length direction of the placement plate 21 is parallel to the width direction of the box body 1, the placement plate 21 located at the top is arranged close to the opening 11, the lower ends of the two placement plates 21 are arranged inclined in the direction of approaching each other, and the surface of the placement plate 21 is penetrated with a plurality of through holes 211 along its own length direction, so that water can flow through the placement plate 21 into the box body 1. The upper end of the placement plate 21 is rotatably connected to the box body 1, specifically, a rotating rod 212 is rotatably penetrated at the upper end of the placement plate 21, and the two ends of the rotating rod 212 are rotatably connected to the opposite side walls of the box body 1 respectively. For the rotation of the placement plate 21, the first driving component 22 is specifically a first driving motor fixedly connected to the box body 1, and the output shaft of the first driving motor is rotatably penetrated through the side wall of the box body 1 to be fixedly connected to one end of the rotating rod 212.

[0038] Reference Figure 4 , Figure 5 Among them, a number of rotating plates 23 are arranged at intervals along the length direction of the placement plate 21, and are specifically arranged according to needs. The upper surface of the rotating plate 23 is protruding from the upper surface of the placement plate 21, and an adsorption port 231 is provided on the outer surface of the rotating plate 23, and a chamber 232 connected to the adsorption port 231 is provided inside the rotating plate 23.

[0039] Reference Figure 2 , Figure 5The box body 1 is provided with a negative pressure assembly 14 for making the chamber 232 in a negative pressure state. The negative pressure assembly 14 includes a connecting pipe 141 rotatably connected to the middle of the rotating plate 23 to communicate with the chamber 232, an air pump 142 connected to the connecting pipe 141 to deliver or exhaust air, and a dust cover 143 covered by the air pump 142. In this embodiment, the connecting pipe 141 is a corrugated hose to adapt to the rotation of the placement plate 21. The connecting pipe 141 is rotatably penetrated through the side wall of the box body 1 to extend outside the box body 1. The air pump 142 is fixedly connected to the outside of the box body 1. The dust cover 143 is penetrated with a plurality of filter holes to filter the outside air. The air pump 142 is electrically connected to the control mechanism.

[0040] For the rotation of the rotating plate 23, the surfaces of the two placement plates 21 close to each other are penetrated with a rotating groove 213 for the rotating plate 23 to be rotatably connected. The second driving component 24 includes a ring gear 241 fixedly connected to the lower surface of the rotating plate 23, a gear 242 meshing with the ring gear 241, and a second driving motor 243 driving the gear 242 to rotate. For a placement plate 21 with more than three rotating plates 23, two gears 242 are provided, and the two gears 242 are respectively a driving gear and a driven gear.

[0041] Among them, the cleaning mechanism 3 is used to clean impurities and contaminants on the surface of the wafer. In this embodiment, the cleaning mechanism 3 specifically includes a spray head 31 arranged above the placement plate 21, a water supply pipe 32 connected to the spray head 31 for water supply, and a third driving component 33 for driving the spray head 31 to move. The water supply pipe 32 is penetrated through the box body 1 to be connected to an external water source or a water pipe. Since the spray head 31 and the third driving component 33 are both existing technologies, they are not elaborated here.

[0042] For the convenience of distinction, in this embodiment, the placement plates 21 in the two placement mechanisms 2 are respectively the first placement plate 214 and the second placement plate 215 from top to bottom along the height direction of the box body 1. Among them, the flip assembly 5 specifically includes a horizontal plate 51 arranged on the first placement plate 214 and a partition bar 52 arranged between the two second placement plates 215. Two horizontal plates 51 are provided and are respectively arranged at the lower ends of the two first placement plates 214. The length direction of the horizontal plate 51 is parallel to the length direction of the first placement plate 214, and the two horizontal plates 51 are overlapped. In this embodiment, the opposite side walls of the partition bar 52 are provided with abutment surfaces for abutting against the wafers sliding down from the first placement plate 214. The two ends of the partition bar 52 are respectively fixedly connected to the opposite side walls of the box body 1. The second placement plate 215 abuts against the lower surface of the partition bar 52. The width of the partition bar 52 is less than the width of the two horizontal plates 51 after overlapping.

[0043] Among them, the drying mechanism 4 is arranged below the placing mechanism 2. Before explaining the drying mechanism 4, in order to reduce the possibility that the water and cleaning agent used by the cleaning mechanism 3 in the process of cleaning the wafers placed on the placing mechanism 2 will overflow to the drying mechanism 4, in this embodiment, the box 1 is located between the placing mechanism 2 and the drying mechanism 4 and is provided with a blocking component 6 for blocking the cleaning agent and water of the cleaning mechanism 3 when cleaning the wafers.

[0044] In this embodiment, the blocking assembly 6 is arranged on the second placement plate 215, and the blocking assembly 6 includes a blocking plate 61 that can be extended and retracted when the second placement plate 215 rotates, and two guide plates 62 are arranged below the blocking plate 61, wherein the end of the blocking plate 61 away from the second placement plate 215 is connected to the box body 1, and the blocking plate 61 includes a plurality of folding plates connected to each other, and the plurality of folding plates are connected to form a fold line or a wave shape, which is specifically arranged according to needs. It should be noted that the folding plate is arranged below the second placement plate 215. Among them, the two guide plates 62 are symmetrically arranged along the axis of the box body 1, and the two guide plates 62 are respectively arranged on both sides of the second placement plate 215 and connected to the box body 1, and the length direction of the guide plate 62 is perpendicular to the length direction of the blocking plate 61, and the guide plate 62 is inclined in the direction away from the second placement plate 215.

[0045] The drying mechanism 4 includes a conveyor rack 41 disposed below the second placement plate 215, a placement rack 42 disposed on the conveyor rack 41 for the wafer to be placed at an angle, and an exhaust pipe 43 for conveying gas to the second placement plate 215 to dry the wafer. In this embodiment, the length direction of the conveyor rack 41 is parallel to the length direction of the box body 1, and a through hole 15 for the conveyor rack 41 to pass through is opened on one side wall of the box body 1, so that the cleaned and dried wafers can be transferred to the box body 1 for collection.

[0046] Reference Figure 6 , wherein the placing rack 42 specifically includes a crossbar 421, two groups of support rods 422 arranged obliquely on both sides of the crossbar 421, and a connecting rod 423 arranged parallel to the length direction of the crossbar 421, and the length direction of the crossbar 421 is arranged parallel to the width direction of the conveying rack 41. Further, in order to reduce the possibility of inadequate drying, in this embodiment, an adsorbent 424 for absorbing moisture is provided on the placing rack 42, and the adsorbent 424 is specifically a water-absorbing sponge.

[0047] The implementation principle of a wafer cleaning and drying device in the embodiment of the present application is as follows: through the above method, compared with the cleaning and drying method in the prior art, one drying process can be reduced to improve the processing efficiency of the wafer. And because a placement plate 21 is provided, the two are arranged at an angle, after cleaning one side of the wafer, it can fall to the placement mechanism 2 below and be turned over by the flip assembly 5 to clean the other side of the wafer, thereby increasing the number of wafers cleaned to further speed up the processing efficiency of the wafer.

[0048] Embodiment 2: Reference Figure 7 , which is different from Example 1, is that, in order to improve the drying effect of the wafers, a toggle member 7 for toggling the wafers can be provided in the box body 1. The toggle member 7 specifically includes a rotating shaft 71 rotatably connected to the box body 1, a toggle rod 72 provided on the rotating shaft 71, and a third driving motor 73 for driving the rotating shaft 71 to rotate. The toggle rod 72 can be arranged at intervals along the length direction of the rotating shaft 71. The toggle member 7 can also include two vertical rods and a connecting rod connected between the vertical rods. The connecting rod is used to toggle the wafers. The third driving motor 73 can rotate forward or reverse, so as to be adapted to the placement state of the wafer on the placement rack 42 for toggling.

[0049] Embodiment 3: Reference Figure 8 , which is different from Example 1, is that an air hole 511 is opened on the upper surface of the horizontal plate 51 away from the first placement plate 214, a connecting cavity 512 connected to the air hole 511 is arranged in the horizontal plate 51, and a first air supply pipe 513 connected to the connecting cavity 512 for supplying or exhausting air is arranged on the horizontal plate 51.

[0050] Reference Fig. 9 , wherein the spacer bar 52 is elastic, and the flip assembly 5 also includes a lifting member 53 for driving the spacer bar 52 to rise and fall along the height direction of the box body 1. The lifting member 53 specifically includes a collar 531 fixedly connected to the spacer bar 52, a screw rod 532 coaxially inserted in the collar 531, and a fourth drive motor 533 for driving the screw rod 532 to rotate. The length direction of the screw rod 532 is parallel to the height direction of the box body 1. The box body 1 protrudes with a mounting plate 16 for rotationally connecting the two ends of the screw rod 532. The fourth drive motor 533 is fixedly connected to one of the mounting plates 16. The output shaft of the fourth drive motor 533 is rotationally inserted in the mounting plate 16 to be fixedly connected to the screw rod 532. In order for the wafer to fall onto the lower placement rack 42 along the inclination of the second placement plate 215 after the negative pressure assembly 14 releases the fixation on the wafer, it should be noted that at this time, the inclination angle of the second placement plate 215 needs to be greater than the inclination angle of the first placement plate 214.

[0051] Embodiment 4: Reference Fig.10, which is different from the embodiment 3, is that the flip assembly 5 further includes a first airbag 54 disposed on the horizontal plate 51, the first airbag 54 has a first expansion cavity, the air hole 511 is connected to the first expansion cavity, so as to collect the gas flowing out of the air hole 511, so as to be used to push the wafer during the resetting process of the first placement plate 214, so as to perform the flipping operation. Among them, the partition bar 52 is a second airbag, the second airbag has a second expansion cavity, the second airbag is connected to a second air pipe for gas delivery or gas extraction, the second air pipe is arranged in the box body 1 to connect to the corresponding air pump, and when the second airbag is inflated through the second air pipe, it expands in the direction close to the second placement plate 215.

[0052] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer cleaning and drying device, characterized in that: The invention comprises a box (1), a placement mechanism (2) arranged in the box (1) for placing wafers, a cleaning mechanism (3) arranged in the box (1) for cleaning the wafers on the placement mechanism (2), a drying mechanism (4) for drying both sides of the cleaned wafers, and a control mechanism electrically connected to the cleaning mechanism (3) and the drying mechanism (4); at least two of the placement mechanisms (2) are arranged at intervals along the height direction of the box (1); the placement mechanism (2) comprises two placement plates (21) symmetrically arranged along the height direction of the box (1), two first drive components (22) respectively driving the two placement plates (21) to rotate, two groups of rotating plates (23) respectively connected to surfaces of the two placement plates (21) close to each other, and a second drive component (24) for driving the rotating plates (23) to rotate, and the lower ends of the two placement plates (21) are oriented toward each other. The rotating plate (23) is tilted in the approaching direction, the upper end of the placement plate (21) is rotatably connected to the box body (1), the first drive assembly (22) and the second drive assembly (24) are both electrically connected to the control mechanism, and a flip assembly (5) for turning the wafer is arranged between the two placement mechanisms (2); an adsorption port (231) is provided on the outer surface of the rotating plate (23), a chamber (232) connected to the adsorption port (231) is provided in the rotating plate (23), a negative pressure assembly (14) for making the chamber (232) present a negative pressure state is arranged on the rotating plate (23), and the negative pressure assembly (14) is electrically connected to the control mechanism; the drying mechanism (4) is arranged below the placement mechanism (2), and the box body (1) is provided between the placement mechanism (2) and the drying mechanism (4) with a blocking assembly (6) for blocking the cleaning agent and water used by the cleaning mechanism (3) when cleaning the wafer.

2. The wafer cleaning and drying device according to claim 1, characterized in that: The surfaces of the two placement plates (21) adjacent to each other are penetrated with a rotation groove (213) for rotationally connecting the rotating plate (23); the second driving component (24) includes a gear ring (241) fixedly connected to the lower surface of the rotating plate (23), a gear (242) meshing with the gear ring (241), and a second driving motor (243) driving the gear (242) to rotate; the negative pressure component (14) includes a connecting pipe (141) rotatably connected to the middle of the rotating plate (23) to communicate with the chamber (232) and an air pump (142) connected to the connecting pipe (141) to supply or exhaust air.

3. The wafer cleaning and drying device according to claim 1, characterized in that: The placement plates (21) in the two placement mechanisms (2) are respectively a first placement plate (214) and a second placement plate (215) from top to bottom along the height direction of the box body (1); the flip assembly (5) comprises a transverse plate (51) arranged on the first placement plate (214) and a partition bar (52) arranged between the two second placement plates (215); two transverse plates (51) are provided and are respectively arranged at the lower ends of the two first placement plates (214); the transverse plates (51) are arranged on the first placement plate (214) and the second placement plates (215) are arranged on the second placement plate (215); ) is parallel to the length direction of the first placement plate (214), and the two transverse plates (51) are overlapped; the opposite side walls of the partition bar (52) are provided with abutment surfaces for abutting against the wafers sliding down from the first placement plate (214), the two ends of the partition bar (52) are respectively connected to the opposite side walls of the box body (1), the second placement plate (215) abuts against the lower surface of the partition bar (52), and the width of the partition bar (52) is smaller than the width of the two transverse plates (51) after overlap.

4. The wafer cleaning and drying device according to claim 3, characterized in that: An air hole (511) is provided on the upper surface of the transverse plate (51) away from the first placement plate (214), a connecting cavity (512) connected to the air hole (511) is provided in the transverse plate (51), and a first air supply pipe (513) connected to the connecting cavity (512) for supplying or exhausting air is provided on the transverse plate (51).

5. The wafer cleaning and drying device according to claim 4, characterized in that: The turnover assembly (5) further comprises a first air bag (54) arranged on the transverse plate (51), the first air bag (54) having a first expansion inner cavity, and the air hole (511) being connected to the first expansion inner cavity.

6. The wafer cleaning and drying device according to claim 3, characterized in that: The partition bar (52) is elastic, and the flip assembly (5) further comprises a lifting member (53) for driving the partition bar (52) to move up and down along the height direction of the box body (1), and the inclination angle of the second placement plate (215) is greater than the inclination angle of the first placement plate (214).

7. The wafer cleaning and drying device according to claim 3, characterized in that: The partition strip (52) is a second airbag having a second expansion cavity therein. The second airbag is connected to a second air supply pipe for supplying or exhausting air. When the second airbag is inflated through the second air supply pipe, the second airbag expands in a direction close to the second placement plate (215).

8. The wafer cleaning and drying device according to claim 3, characterized in that: The blocking assembly (6) is arranged on the second placement plate (215), and the blocking assembly (6) comprises a blocking plate (61) that can be extended and retracted as the second placement plate (215) rotates, and one end of the blocking plate (61) away from the second placement plate (215) is connected to the box body (1); a plurality of through holes (211) are formed on the surface of the second placement plate (215) along its own length direction, and the through holes (211) are located above the blocking plate (61); a drainage pipe (13) for discharging cleaning water and cleaning agent from the box body (1) is fixedly formed on the side wall of the box body (1).

9. The wafer cleaning and drying device according to claim 8, characterized in that: The blocking assembly (6) further comprises two guide plates (62) both arranged below the blocking plate (61), the two guide plates (62) being symmetrically arranged along the axis of the box body (1), the two guide plates (62) being respectively arranged on both sides of the second placement plate (215) and connected to the box body (1), the length direction of the guide plates (62) being perpendicular to the length direction of the blocking plate (61), and the guide plates (62) being inclined in a direction away from the second placement plate (215); the drying mechanism (4) comprises a conveying rack (41) arranged below the second placement plate (215), a placement rack (42) arranged on the conveying rack (41) for placing wafers at an angle, and an exhaust pipe (43) for conveying gas to dry the wafers.

10. The wafer cleaning and drying device according to claim 9, characterized in that: The placement rack (42) comprises a crossbar (421), two groups of support rods (422) arranged at an angle on both sides of the crossbar (421), and a connecting rod (423) arranged parallel to the length direction of the crossbar (421); the length direction of the crossbar (421) is arranged parallel to the width direction of the conveying rack (41); and an adsorbent (424) for adsorbing moisture is arranged on the placement rack (42).

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