Die bonder

Abstract

The invention relates to a die bonder. The die bonder comprises a rack, a feeding module, a dispensing module, a die bonding module, a material supply module, a discharging module, a conveying module and a controller. The controller is configured to control the moving assembly and the adsorption head to stop moving when a real-time pressure value obtained by the pressure control piece exceeds a preset pressure threshold value; and when the position of the wafer on the adsorption head obtained by the detection component exceeds a first preset position range, the adjustment component is controlled to drive the adsorption head to rotate so as to adjust the position of the wafer. Due to the arrangement of the adjusting part and the detection part, if the position of the wafer is deviated, the controller controls the adjusting part to adjust the angle position of the wafer so that the wafer can be straightened. Besides, due to the arrangement of the moving assembly and the pressure control piece, the pressure of the adsorption head is controlled through the pressure control piece, when the pressing force of the adsorption head on the wafer exceeds a preset pressure threshold value, the controller can control the moving assembly and the adsorption head to stop moving, and the problem that the surface of the wafer is damaged or broken due to the fact that the pressure is too large is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production equipment, and in particular to a crystal bonding machine. Background Art

[0002] A die bonder is a mechanical device for fixing crystals and semiconductor packaging. It can transfer and bond the wafer on the blue film to the substrate to complete chip mounting. It is widely used in the production of LED direct display screens, semiconductor discrete devices, DIP and SOP and other products.

[0003] Existing crystal bonding machines usually include a frame, a loading device, a wafer feeding device, a glue dispensing device, a crystal bonding device, a transfer device and a unloading device. In the process of grabbing the wafer, the existing transfer device will produce residual vibration due to inertia when the transfer device moves quickly, which may cause the wafer angle to change, or the viscosity of the blue film used is too high, which produces additional resistance when sucking or releasing the wafer, causing the wafer position to deviate. On the other hand, in order to make the wafer and the substrate fit more closely during the crystal bonding process, pressure is usually required to be applied. However, since the wafer is a brittle material, the pressure is not controlled during the pressure application process, resulting in damage or even breakage of the wafer surface. Summary of the invention

[0004] The purpose of the present invention is to provide a crystal bonding machine, which aims to solve the technical problems of the existing crystal bonding machine that the angle position of the wafer is offset during the crystal bonding process, and the surface of the wafer is easily damaged or even broken due to uncontrolled pressure.

[0005] In order to solve the above technical problems, a die bonding machine is provided, comprising: The frame includes a loading position, a dispensing position, a crystal bonding position and a unloading position which are arranged in sequence; A loading module, arranged at the loading position to load the substrate; A glue dispensing module, disposed at the glue dispensing position to dispense glue to the substrate; A crystal bonding module, the crystal bonding module comprises a pickup component, a correction component and a moving component, the moving component is arranged at the crystal bonding position, the pickup component and the correction component are both installed on the moving component, the pickup component comprises an adsorption head and a pressure control component, the correction component comprises a detection component and an adjustment component, the detection component is arranged beside the crystal bonding position, and the adjustment component is transmission-connected with the adsorption head; A feeding module, arranged on the frame to provide wafers; A material unloading module is arranged at the unloading position to unload the finished product; A conveying module is arranged on the frame to sequentially transfer the substrate to a loading position, a glue dispensing position, a crystal bonding position and a unloading position; The controller is electrically connected to the moving component, the pressure control component, the detection component and the adjustment component, respectively, and the controller is configured to: when the real-time pressure value obtained by the pressure control component exceeds a preset pressure threshold, control the moving component and the adsorption head to stop moving; when the wafer position on the adsorption head obtained by the detection component exceeds a first preset position range, control the adjustment component to drive the adsorption head to rotate to adjust the position of the wafer.

[0006] Furthermore, the picking assembly also includes a mounting frame, an upper flexible member, a lower flexible member and a first elastic member, the upper flexible member, the lower flexible member and the pressure control member are all connected to the mounting frame, one end of the adsorption head is connected to the upper flexible member, and the other end is connected to the lower flexible member, the upper flexible member and the lower flexible member are configured to allow the adsorption head to be offset in the Z-axis direction, and the first elastic member is arranged between the upper flexible member and the mounting frame.

[0007] Furthermore, the adjustment component includes a correction motor, a driving wheel, a driven wheel and a first belt, the correction motor is connected to the mounting frame, the correction motor is connected to the driving wheel, the driven wheel is connected to the adsorption head, and the driving wheel and the driven wheel are coupled via a first belt.

[0008] Furthermore, the crystal bonding machine also includes a pin module, which includes a shell, a pin, a driving member and a linear bearing, the driving member is arranged in the shell, the driving member is connected to the pin to drive the pin to reciprocate in a straight line, the shell includes a first channel, a second channel, a vent, a suction port and a puncture port, the first channel is nested in the second channel, the vent and the suction port are both connected to the second channel, the puncture port is connected to the first channel, the linear bearing is arranged in the first channel, and the pin is slidably arranged in the linear bearing.

[0009] Furthermore, the ejector pin module further includes a first sealing ring and a second sealing ring, wherein the first sealing ring is arranged close to the vent, and the second sealing ring is arranged between the ejector pin and the first channel.

[0010] Furthermore, the feeding module includes a rotating component and a tray assembly, the rotating component is coupled to the tray assembly, the crystal bonding machine also includes a detection module, the controller is electrically connected to the detection module and the rotating component, respectively, and the controller is further configured to: when the wafer position on the tray assembly obtained by the detection module exceeds a second preset position range, control the rotating component to drive the tray assembly to rotate to adjust the position of the wafer.

[0011] Furthermore, the feeding module also includes a feeding mobile platform and a locking assembly, the feeding mobile platform is installed on the frame, the material tray assembly includes a wafer material tray and a gear ring nested on the outside of the wafer material tray; the rotating assembly includes a rotating motor, a pulley and a second belt, the rotating motor is installed on the feeding mobile platform, the rotating motor is connected to the pulley, and the pulley and the gear ring are coupled via the second belt; the locking assembly includes a telescopic cylinder, a locking piece and a torsion spring, the locking piece is rotatably connected to the feeding mobile platform via the torsion spring to put the wafer material tray in a locked state, and the telescopic cylinder is used to drive the locking piece to rotate to put the wafer material tray in an unlocked state.

[0012] Furthermore, the detection module includes a fixing frame, and a first visual camera and a second visual camera installed on the fixing frame, the first visual camera is arranged directly above the crystal fixing position, and the second visual camera is arranged directly above the tray assembly.

[0013] Furthermore, the loading module includes a main frame, a bracket, and an X-axis moving assembly, a Y-axis moving assembly and a Z-axis moving assembly all mounted on the main frame, the bracket is connected to the Z-axis moving assembly, the bracket is used to carry a material box, and the unloading module is configured to have the same structure as the loading module.

[0014] Further, the conveying module includes a conveying track, and a pressing assembly and a plurality of transverse moving assemblies all mounted on the conveying track, the pressing assembly is configured to be able to reciprocate along the Z-axis direction to fix or release the substrate, and the plurality of transverse moving assemblies are configured to reciprocate along the X-axis direction within their respective ranges, and the ranges of the transverse moving assemblies do not overlap; and / or, The dispensing module includes a three-axis driving component, a dispensing part and a third visual camera. The dispensing part and the third visual camera are both installed on the three-axis driving component. The three-axis driving component is used to drive the dispensing part and the third visual camera to move along the X-axis direction, the Y-axis direction and the Z-axis direction.

[0015] Implementing the embodiments of the present invention will have the following beneficial effects: The crystal bonding machine in this embodiment is provided with an adjustment component and a detection component. After the adsorption head absorbs the wafer from the feeding module, it is moved to the top of the detection component to check whether the wafer is damaged and whether the position of the wafer is correct. If the position of the wafer is found to be deviated, the controller controls the adjustment component to adjust the angle position of the wafer to make it correct. In addition, due to the provision of a moving component and a pressure control component, when the adsorption head presses the wafer, the pressure of the adsorption head is controlled by the pressure control component. When the pressure of the adsorption head on the wafer exceeds the preset pressure threshold, the controller will control the moving component and the adsorption head to stop moving to ensure that the pressure applied by the adsorption head on the wafer is not too large, so as to avoid the problem of damage or breakage of the wafer surface due to excessive pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the die bonding machine according to an embodiment of the present invention; Figure 2 A top view of a die bonding machine according to an embodiment of the present invention; Figure 3 A schematic diagram of the three-dimensional structure of a die-bonding module according to an embodiment of the present invention; Figure 4 It is a structural schematic diagram of the combination of a pickup component and a correction component according to an embodiment of the present invention; Figure 5 A front view of the combination of a pickup assembly and a correction assembly according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of the pickup assembly according to the first embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the pickup assembly according to the second embodiment of the present invention; Figure 8 It is a structural schematic diagram of the ejector module according to an embodiment of the present invention; Fig. 9 for Figure 8 A local enlarged schematic diagram of the middle A; Fig.10 is a cross-sectional view of an ejector pin module according to an embodiment of the present invention; Fig.11 This is a schematic structural diagram of a feeding module according to an embodiment of the present invention; Fig.12This is a front view of the feeding module according to an embodiment of the present invention; Fig.13 It is a structural schematic diagram of the feeding module according to an embodiment of the present invention; Fig.14 This is a schematic diagram of the structure of the loading module according to an embodiment of the present invention after some parts are removed; Fig.15 This is a schematic diagram of the structure of the conveying module according to an embodiment of the present invention; Fig.16 This is a schematic diagram of the structure of the dispensing module according to an embodiment of the present invention; Fig.17 This is a control principle diagram of the die bonding machine described in an embodiment of the present invention.

[0018] Among them: 100, crystal bonding machine; 110, rack; 111, loading position; 112, glue dispensing position; 113, crystal bonding position; 114, unloading position; 120, loading module; 121, main frame; 122, bracket; 123, X-axis moving component; 124, Y-axis moving component; 125, Z-axis moving component; 130, glue dispensing module; 131, three-axis driving component; 132, glue dispensing parts; 133, third visual camera; 140, crystal bonding module; 141, picking group 1411, suction head; 1412, pressure control member; 1413, mounting frame; 1414, upper flexible member; 1415, lower flexible member; 1416, first elastic member; 1417, first fixed block; 1418, second fixed block; 142, correction assembly; 1421, detection member; 1422, adjustment member; 1422A, correction motor; 1422B, driving wheel; 1422C, driven wheel; 1422D, first belt; 143, moving group 150, feeding module; 151, rotating assembly; 1511, rotating motor; 1512, pulley; 1513, second belt; 152, tray assembly; 1521, wafer tray; 1522, gear ring; 153, feeding mobile platform; 154, locking assembly; 1541, telescopic cylinder; 1542, locking piece; 160, unloading module; 170, conveying module; 171, conveying track; 172, pressing assembly; 173, traverse assembly; 1 80. Controller; 190. Ejector module; 191. Shell; 1911. First channel; 1912. Second channel; 1913. Vent; 1914. Adsorption port; 1915. Puncture port; 1916. First sealing ring; 1917. Second sealing ring; 192. Ejector; 193. Drive element; 194. Linear bearing; 200. Detection module; 201. Fixture; 202. First visual camera; 203. Second visual camera; 300. Fixture. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0022] Please refer to Figure 1-Figure 17The embodiment of the present invention provides a die bonding machine 100, which includes a frame 110, a loading module 120, a glue dispensing module 130, a die bonding module 140, a feeding module 150, a material dispensing module 160, a conveying module 170 and a controller 180. The frame 110 includes a loading position 111, a glue dispensing position 112, a die bonding position 113 and a material dispensing position 114 which are arranged in sequence. The loading module 120 is arranged at the loading position 111 to load the substrate. The glue dispensing module 130 is arranged at the glue dispensing position 112 to dispense glue on the substrate. The crystal bonding module 140 includes a pick-up component 141, a correction component 142 and a moving component 143. The moving component 143 is arranged at the crystal bonding position 113. The pick-up component 141 and the correction component 142 are both installed on the moving component 143. The pick-up component 141 includes an adsorption head 1411 and a pressure control component 1412. The correction component 142 includes a detection component 1421 and an adjustment component 1422. The detection component 1421 is arranged beside the crystal bonding position 113, and the adjustment component 1422 is connected to the adsorption head 1411 in a transmission manner. The feeding module 150 is arranged on the rack 110 to provide wafers. The unloading module 160 is arranged at the unloading position 114 to unload the finished product. The conveying module 170 is arranged on the rack 110 to sequentially transfer the substrate to the loading position 111, the dispensing position 112, the crystal bonding position 113 and the unloading position 114. The controller 180 is electrically connected to the moving component 143, the pressure control component 1412, the detection component 1421 and the adjustment component 1422, respectively. The controller 180 is configured as follows: when the real-time pressure value obtained by the pressure control component 1412 exceeds the preset pressure threshold, the moving component 143 and the adsorption head 1411 are controlled to stop moving; when the wafer position on the adsorption head 1411 obtained by the detection component 1421 exceeds the first preset position range, the adjustment component 1422 is controlled to drive the adsorption head 1411 to rotate to adjust the position of the wafer. Exemplarily, the loading position 111, the glue dispensing position 112, the crystal fixing position 113 and the unloading position 114 are sequentially arranged along the X-axis direction. The first preset position range is also the range of angular deviation allowed for the wafer. The specific numerical ranges of the preset pressure threshold and the first preset position range can be set by the user according to actual needs, and no excessive restrictions are made here. The detection component 1421 uses a CCD visual camera. On the one hand, the detection component 1421 can detect the position and placement angle of the wafer sucked by the adsorption head 1411. When the position of the wafer deviates, the position of the wafer is adjusted by the adjustment component 1422. On the other hand, the detection component 1421 can also check whether the wafer sucked by the adsorption head 1411 is damaged. The finished product mentioned above refers to the product formed after the wafer is fixed on the substrate. The moving component 143 can drive the picking component 141 to move in three directions: the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0023] In this embodiment, the pressure control component 1412 uses a voice coil motor, which can achieve precise position control at the micron level and rapid response at the millisecond level. This rapid response capability enables the voice coil motor to quickly adjust the size of the pressing force to adapt to different solid crystal requirements. The voice coil motor can adjust the size of the output pressure by changing the size of the current. This enables the voice coil motor to provide appropriate pressing force according to different wafer materials and thicknesses to avoid excessive pressure causing wafer damage. The voice coil motor has precise position control capabilities and can achieve precise material placement position control. It helps to ensure the stability of the wafer during the solid crystal process and reduce the risk of breakage. Among them, in another embodiment, the pressure control component 1412 can also use a pressure sensor, which is set at the end of the adsorption head 1411, specifically at the position where the adsorption head 1411 contacts the wafer, and can directly detect the pressure applied by the adsorption head 1411 to the wafer.

[0024] The crystal bonding machine 100 in this embodiment is provided with an adjustment component 1422 and a detection component 1421. After the adsorption head 1411 absorbs the wafer from the feeding module 150, it is transferred to the top of the detection component 1421 to check whether the wafer is damaged and whether the position of the wafer is correct. If it is found that the position of the wafer is deviated, the controller 180 controls the adjustment component 1422 to adjust the angular position of the wafer to make it correct. In addition, since the moving component 143 and the pressure control component 1412 are provided, when the adsorption head 1411 presses the wafer, the pressure of the adsorption head 1411 is controlled by the pressure control component 1412. When the pressing force of the adsorption head 1411 on the wafer exceeds the preset pressure threshold, the controller 180 will control the moving component 143 and the adsorption head 1411 to stop moving, so as to ensure that the pressure applied by the adsorption head 1411 on the wafer is not too large, so as to avoid the problem of damage or breakage of the wafer surface due to excessive pressure.

[0025] Please refer to Figure 4 , Figure 5 and Figure 6In a possible embodiment, the picking component 141 also includes a mounting frame 1413, an upper flexible member 1414, a lower flexible member 1415 and a first elastic member 1416. The upper flexible member 1414, the lower flexible member 1415 and the pressure control member 1412 are all connected to the mounting frame 1413. One end of the adsorption head 1411 is connected to the upper flexible member 1414, and the other end is connected to the lower flexible member 1415. The upper flexible member 1414 and the lower flexible member 1415 are configured to allow the adsorption head 1411 to be offset in the Z-axis direction. The first elastic member 1416 is arranged between the upper flexible member 1414 and the mounting frame 1413. Exemplarily, in this embodiment, the picking component 141 also includes a fixed block, the upper flexible member 1414 and the lower flexible member 1415 are both made of flexible materials and can produce elastic deformation, the fixed block fixes the upper flexible member 1414 and the lower flexible member 1415 on the mounting frame 1413, and at the same time fixes the two flexible members on the upper side of the adsorption head 1411, and sets the lengths of the upper flexible member 1414 and the lower flexible member 1415 to be the same, that is, the distance between the adsorption head 1411 and the fixed block for fixing the upper flexible member 1414 is equal to the distance between the adsorption head 1411 and the fixed block for fixing the lower flexible member 1415. When the adsorption head 1411 presses the wafer downward and the adsorption head 1411 produces a slight deformation, the upper flexible member 1414 and the lower flexible member 1415 of the same length make the deformation of the flexible members the same, so that the adsorption head 1411 can be always in a vertical state, avoiding the adsorption head 1411 from being offset in the horizontal direction, so that the pressure applied by the adsorption head 1411 to the wafer is always uniform, which helps to avoid damage or cracking of the wafer surface. In addition, the first elastic member 1416 is a compression spring. When the adsorption head 1411 applies pressure to the wafer, the upper flexible member 1414, the lower flexible member 1415 and the first elastic member 1416 cooperate to play a buffering role, which helps to reduce the impact force of the adsorption head 1411 on the wafer and avoid damage or cracking of the wafer surface.

[0026] Please refer to Figure 7 In another embodiment, the upper flexible member 1414 and the lower flexible member 1415 can also be made of rigid materials, and at the same time, one end of the upper flexible member 1414 is rotatably connected to the first fixed block 1417, and the other end is rotatably connected to the suction head member, and one end of the lower flexible member 1415 is rotatably connected to the second fixed block 1418, and the other end is rotatably connected to the suction head member. It can be understood that the upper flexible member 1414, the lower flexible member 1415, the fixed block and the suction head member form a deformable parallelogram, wherein the first fixed block 1417 and the second fixed block 1418 are fixed, and the suction head member is kept in a vertical state during the up and down movement, so as to avoid the suction head 1411 from being offset in the horizontal direction, so that the pressure applied by the suction head 1411 to the wafer is always uniform, which is conducive to avoiding damage or cracking of the wafer surface.

[0027] Please refer to Figure 4 , Figure 5 and Figure 6 In a possible implementation, the adjustment component 1422 includes a correction motor 1422A, a driving wheel 1422B, a driven wheel 1422C and a first belt 1422D, the correction motor 1422A is connected to the mounting frame 1413, the correction motor 1422A is connected to the driving wheel 1422B, the driven wheel 1422C is connected to the adsorption head 1411, and the driving wheel 1422B and the driven wheel 1422C are coupled by the first belt 1422D. Exemplarily, in this embodiment, the adjustment component 1422 uses a belt transmission mechanism. From the first aspect, the belt transmission mechanism can provide higher control accuracy, which is conducive to improving the positioning accuracy of the wafer. From the second aspect, the belt transmission mechanism has the characteristics of smooth transmission, which can reduce the wafer position deviation caused by mechanical vibration or impact, which is conducive to further improving the accuracy of adjusting the wafer angle position. From the third aspect, the use of a belt drive mechanism can place the correction motor 1422A next to the adsorption head 1411, and the picking component 141 can produce flexible deformation, which not only ensures that the operation of the adjustment component 1422 will not be affected, but also saves the installation space of the adjustment component 1422.

[0028] Please refer to Figure 8 , Fig. 9 and Fig.10In a possible implementation, the crystal bonding machine 100 further includes a pin module 190, the pin module 190 includes a shell 191, a pin 192, a driving member 193 and a linear bearing 194, the driving member 193 is disposed in the shell 191, the driving member 193 is connected to the pin 192 to drive the pin 192 to reciprocate along a straight line, the shell 191 includes a first channel 1911, a second channel 1912, a vent 1913, a suction port 1914 and a puncture port 1915, the first channel 1911 is nested in the second channel 1912, the vent 1913 and the suction port 1914 are both connected to the second channel 1912, the puncture port 1915 is connected to the first channel 1911, the linear bearing 194 is disposed in the first channel 1911, and the pin 192 is slidably disposed in the linear bearing 194. Exemplarily, the cross section of the first channel 1911 is roughly circular, and the cross section of the second channel 1912 is roughly annular. The vacuum pump (not shown in the figure) is connected to the second channel 1912 through the vent 1913, and the driving member 193 is used to drive the ejector pin 192 to move along the Z-axis direction. The linear bearing 194 has the characteristics of high precision, which can provide accurate positioning and guiding for the ejector pin 192 in the process of sliding up and down, and can reduce the friction between the ejector pin 192 and the linear bearing 194, which is conducive to reducing the wear of the ejector pin 192 and extending the service life of the ejector pin 192. The working principle of the ejector pin module 190: the wafer is pasted on the blue film. When the wafer needs to be taken, the vacuum pump is started, and the suction port 1914 sucks the blue film to fix the blue film. At this time, the driving member 193 drives the ejector pin 192 to rise and allows the ejector pin 192 to pass through the puncture port 1915, thereby ejecting the wafer to separate the wafer from the blue film.

[0029] Please refer to Figure 8 , Fig. 9 and Fig.10 In a possible implementation, the ejector module 190 further includes a first sealing ring 1916 and a second sealing ring 1917, wherein the first sealing ring 1916 is disposed near the vent 1913, and the second sealing ring 1917 is disposed between the ejector 192 and the first channel 1911. Exemplarily, in this embodiment, the first sealing ring 1916 is disposed near the vent 1913 to prevent gas leakage. It ensures that no gas leakage occurs during the sliding process of the ejector 192 by closely contacting the ejector 192 and the housing 191. The second sealing ring 1917 is disposed between the ejector 192 and the first channel 1911 through the upper abutment portion, and plays a further sealing role. Together with the first sealing ring 1916, it ensures good sealing of the ejector 192 during the sliding process.

[0030] Please refer to Fig.11 and Fig.12In a possible implementation, the feeding module 150 includes a rotating assembly 151 and a tray assembly 152, the rotating assembly 151 is coupled to the tray assembly 152, the crystal bonding machine 100 also includes a detection module 200, the controller 180 is electrically connected to the detection module 200 and the rotating assembly 151, respectively, and the controller 180 is also configured to: when the wafer position on the tray assembly 152 obtained by the detection module 200 exceeds the second preset position range, control the rotating assembly 151 to drive the tray assembly 152 to rotate to adjust the position of the wafer. Exemplarily, the second preset position range is the range of angular deviation allowed for the wafer, and the specific numerical range can be set by the user according to actual needs, and no excessive restrictions are made here. In this embodiment, the angular position of the wafer on the tray assembly 152 is corrected for the first time by the detection module 200, and the angular position of the wafer adsorbed on the adsorption head 1411 is corrected for the second time by the detection component 1421. The detection module 200 is used to adjust the angular position of the wafer on the tray assembly 152 in a macroscopic manner, and the detection component 1421 is used to adjust the angular position of the wafer on the adsorption head 1411 in a microscopic manner. Since the detection component 1421 and the detection module 200 are set to correct the position of the wafer twice, the deviation of the wafer position can be effectively reduced, which is conducive to improving the stability and accuracy of the wafer during the solidification process. Through precise positioning and stable process control, it can be ensured that the wafer is subjected to uniform pressure during the solidification process, thereby improving the quality and consistency of the chip.

[0031] Please refer to Fig.11 and Fig.12In a possible implementation manner, the feeding module 150 further includes a feeding mobile platform 153 and a locking assembly 154. The feeding mobile platform 153 is mounted on the frame 110. The tray assembly 152 includes a wafer tray 1521 and a gear ring 1522 nested outside the wafer tray 1521. The rotating assembly 151 includes a rotating motor 1511, a pulley 1512 and a second belt 1513. The rotating motor 1511 is mounted on the feeding mobile platform 153. The machine 1511 is connected to the pulley 1512, and the pulley 1512 and the gear ring 1522 are coupled and connected through the second belt 1513; the locking assembly 154 includes a telescopic cylinder 1541, a locking member 1542 and a torsion spring (not shown in the figure), and the locking member 1542 is rotatably connected to the feeding mobile platform 153 through the torsion spring to put the wafer tray 1521 in a locked state, and the telescopic cylinder 1541 is used to drive the locking member 1542 to rotate so that the wafer tray 1521 is in an unlocked state. Exemplarily, there are two locking members 1542 and torsion springs. Under normal conditions, the locking member 1542 clamps the wafer tray 1521 through the force of the torsion spring. When the wafer tray 1521 needs to be removed, the output shaft of the telescopic cylinder 1541 is extended to push the locking member 1542 to rotate, and the locking member 1542 is separated from the wafer tray 1521. At this time, the user can remove the wafer tray 1521. Subsequently, the output shaft of the telescopic cylinder 1541 retracts, and the pressure exerted by the telescopic cylinder 1541 on the locking member 1542 also disappears. At this time, the locking member 1542 is re-engaged with the wafer tray 1521 under the action of the torsion spring. The feeding mobile platform 153 can drive the wafer tray 1521 to move in the X-axis direction and the Y-axis direction. Since the wafers on the blue film are distributed in an array, the position of the wafer tray 1521 is moved with the help of the feeding mobile platform 153, and the adsorption head 1411 is used to pick up the wafer.

[0032] Please refer to Figure 1 and Figure 2In a possible implementation, the inspection module 200 includes a fixing frame 201, and a first visual camera 202 and a second visual camera 203 mounted on the fixing frame 201. The first visual camera 202 is arranged directly above the die bonding position 113, and the second visual camera 203 is arranged directly above the tray assembly 152. Exemplarily, the first visual camera 202 has three functions. The first function is to determine the coordinate system of the die bonding machine 100. The second function is to check the shape and size of the glue dispensed on the substrate to confirm whether the dispensed glue meets the standard. The third function is to check the quality of the finished product after the wafer is fixed to the substrate, to check whether the wafer on the substrate is damaged or cracked, and whether the angle position of the wafer attached to the substrate is qualified. The second visual camera 203 has three functions. The first function is to determine the coordinate system of the crystal bonding machine 100. The second function is to check whether the wafers on the wafer tray 1521 are damaged or broken. The bad wafer suction head 1411 will not pick up the wafers. The third function is to detect the placement position of the wafer tray 1521. When the position of the wafer tray 1521 is offset, the angle position of the wafer tray 1521 is adjusted by the rotating component 151.

[0033] Please refer to Fig.13 and Fig.14 In a possible embodiment, the loading module 120 includes a main frame 121, a bracket 122, and an X-axis moving assembly 123, a Y-axis moving assembly 124, and a Z-axis moving assembly 125, all of which are mounted on the main frame 121. The bracket 122 is connected to the Z-axis moving assembly 125. The bracket 122 is used to carry the material box. The unloading module 160 is configured to have the same structure as the loading module 120. Exemplarily, the material box is used to carry the fixture 300, and the substrate is placed on the fixture 300. The Y-axis moving assembly 124 moves the material box along the Y-axis direction to the bracket 122, and then the Z-axis moving assembly 125 drives the material box to rise (Z-axis direction) to a specified position, and then the X-axis moving assembly 123 pushes the fixture 300 along the X-axis direction onto the conveying track 171. Specifically, the X-axis moving assembly 123 uses a telescopic cylinder 1541 or a telescopic motor, the Y-axis moving assembly 124 uses a belt transmission mechanism, and the Z-axis moving assembly 125 uses a ball screw structure. In this embodiment, the structure used by the unloading module 160 is the same as the structure of the loading module 120. Of course, as another embodiment, the structure used by the unloading module 160 and the structure of the loading module 120 may also be different.

[0034] Please refer to Figure 1 and Fig.15In a possible implementation, the conveying module 170 includes a conveying track 171, and a pressing assembly 172 and a plurality of transverse assemblies 173, all of which are installed on the conveying track 171. The pressing assembly 172 is configured to be able to reciprocate along the Z-axis direction to fix or release the substrate, and the plurality of transverse assemblies 173 are configured to reciprocate along the X-axis direction within their respective ranges, and the ranges of each transverse assemblies 173 do not overlap. Exemplarily, in this embodiment, three transverse assemblies 173 are provided, the first transverse assemblies 173 reciprocate along the X-axis direction within the range between the material loading position 111 and the glue dispensing position 112, the second transverse assemblies 173 reciprocate along the X-axis direction within the range between the glue dispensing position 112 and the crystal fixing position 113, and the third transverse assemblies 173 reciprocate along the X-axis direction within the range between the crystal fixing position 113 and the material unloading position 114. When dispensing and bonding are required, the pressing assembly 172 can fix the wafer at the dispensing position 112 and the bonding position 113 to facilitate the dispensing and bonding process. The traverse assembly 173 is used to move the wafer on the conveying track 171 in sequence.

[0035] Please refer to Figure 1 and Fig.16 , the dispensing module 130 includes a three-axis driving assembly 131, a dispensing part 132 and a third visual camera 133. The dispensing part 132 and the third visual camera 133 are both installed on the three-axis driving assembly 131. The three-axis driving assembly 131 is used to drive the dispensing part 132 and the third visual camera 133 to move along the X-axis direction, the Y-axis direction, and the Z-axis direction. Exemplarily, it should be noted that in the three-axis driving assembly 131 of the present application, the moving mechanism in the Z-axis direction uses a ball screw structure. When the power is off, the dispensing part 132 and the third visual camera 133 will not fall, so as to avoid the dispensing part 132 from suddenly falling and colliding with the substrate after the power is off, which is beneficial to protect the dispensing part 132 and the third visual camera 133. The third visual camera 133 can capture the current position information of the wafer in the solid crystal process in real time. Through high-precision image processing technology, the third visual camera 133 can accurately determine whether the wafer has been correctly placed. The setting of the third visual camera 133 improves the stability and accuracy of the dispensing process. The ability to continuously monitor and correct the wafer during movement reduces wafer position deviations caused by mechanical vibration or improper operation.

[0036] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A die bonding machine, characterized in that: include: The frame includes a loading position, a glue dispensing position, a crystal bonding position and a unloading position which are arranged in sequence; A loading module, arranged at the loading position to load the substrate; A glue dispensing module, disposed at the glue dispensing position to dispense glue to the substrate; A crystal bonding module, the crystal bonding module comprises a pickup component, a correction component and a moving component, the moving component is arranged at the crystal bonding position, the pickup component and the correction component are both installed on the moving component, the pickup component comprises an adsorption head and a pressure control component, the correction component comprises a detection component and an adjustment component, the detection component is arranged beside the crystal bonding position, and the adjustment component is transmission-connected with the adsorption head; A feeding module, arranged on the frame to provide wafers; A material unloading module is arranged at the unloading position to unload the finished product; A conveying module is arranged on the frame to sequentially transfer the substrate to a loading position, a glue dispensing position, a crystal bonding position and a unloading position; The controller is electrically connected to the moving component, the pressure control component, the detection component and the adjustment component, respectively, and the controller is configured to: when the real-time pressure value obtained by the pressure control component exceeds a preset pressure threshold, control the moving component and the adsorption head to stop moving; when the wafer position on the adsorption head obtained by the detection component exceeds a first preset position range, control the adjustment component to drive the adsorption head to rotate to adjust the position of the wafer.

2. The die bonding machine according to claim 1, characterized in that: The picking assembly also includes a mounting frame, an upper flexible member, a lower flexible member and a first elastic member, the upper flexible member, the lower flexible member and the pressure control member are all connected to the mounting frame, one end of the adsorption head is connected to the upper flexible member, and the other end is connected to the lower flexible member, the upper flexible member and the lower flexible member are configured to allow the adsorption head to be offset in the Z-axis direction, and the first elastic member is arranged between the upper flexible member and the mounting frame.

3. The die bonding machine according to claim 2, characterized in that: The adjustment component includes a correction motor, a driving wheel, a driven wheel and a first belt. The correction motor is connected to the mounting frame, the correction motor is connected to the driving wheel, the driven wheel is connected to the adsorption head, and the driving wheel and the driven wheel are coupled via a first belt.

4. The die bonding machine according to claim 1, characterized in that: The crystal bonding machine also includes an ejector pin module, which includes a shell, an ejector pin, a driving member and a linear bearing. The driving member is arranged in the shell, and the driving member is connected to the ejector pin to drive the ejector pin to reciprocate along a straight line. The shell includes a first channel, a second channel, a vent, a suction port and a puncture port. The first channel is nested in the second channel, the vent and the suction port are both connected to the second channel, and the puncture port is connected to the first channel. The linear bearing is arranged in the first channel, and the ejector pin is slidably arranged in the linear bearing.

5. The die bonding machine according to claim 4, characterized in that: The ejector pin module further includes a first sealing ring and a second sealing ring, wherein the first sealing ring is arranged close to the vent, and the second sealing ring is arranged between the ejector pin and the first channel.

6. The die bonding machine according to claim 1, characterized in that: The feeding module includes a rotating component and a tray assembly, and the rotating component is coupled to the tray assembly. The crystal bonding machine also includes a detection module. The controller is electrically connected to the detection module and the rotating component, respectively. The controller is also configured to: when the wafer position on the tray assembly obtained by the detection module exceeds a second preset position range, control the rotating component to drive the tray assembly to rotate to adjust the position of the wafer.

7. The die bonding machine according to claim 6, characterized in that: The feeding module also includes a feeding mobile platform and a locking assembly, wherein the feeding mobile platform is installed on the frame, and the tray assembly includes a wafer tray and a gear ring nested on the outside of the wafer tray; the rotating assembly includes a rotating motor, a pulley and a second belt, wherein the rotating motor is installed on the feeding mobile platform, the rotating motor is connected to the pulley, and the pulley and the gear ring are coupled via the second belt; the locking assembly includes a telescopic cylinder, a locking piece and a torsion spring, wherein the locking piece is rotatably connected to the feeding mobile platform via the torsion spring to put the wafer tray in a locked state, and the telescopic cylinder is used to drive the locking piece to rotate to put the wafer tray in an unlocked state.

8. The die bonding machine according to claim 6, characterized in that: The detection module includes a fixing frame, and a first visual camera and a second visual camera installed on the fixing frame, wherein the first visual camera is arranged directly above the crystal fixing position, and the second visual camera is arranged directly above the material tray assembly.

9. The die bonding machine according to claim 1, characterized in that: The loading module includes a main frame, a bracket, and an X-axis moving component, a Y-axis moving component and a Z-axis moving component all mounted on the main frame. The bracket is connected to the Z-axis moving component. The bracket is used to carry a material box. The unloading module is configured to have the same structure as the loading module.

10. The die bonding machine according to claim 1, characterized in that: The conveying module comprises a conveying track, and a pressing assembly and a plurality of transverse moving assemblies which are all mounted on the conveying track, wherein the pressing assembly is configured to be able to reciprocate along the Z-axis direction to fix or release the substrate, and the plurality of transverse moving assemblies are configured to reciprocate along the X-axis direction within their respective ranges, and the ranges of the respective transverse moving assemblies do not overlap; and / or, The dispensing module includes a three-axis driving component, a dispensing part and a third visual camera. The dispensing part and the third visual camera are both installed on the three-axis driving component. The three-axis driving component is used to drive the dispensing part and the third visual camera to move along the X-axis direction, the Y-axis direction and the Z-axis direction.

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