Wafer upside-down type die bonding device and wafer upside-down type die bonding method

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer upside-down type die bonding device and method, and the device comprises a workbench which is used for positioning a wafer and enabling a blue film to cover the wafer; the substrate is arranged below the workbench and is used for mounting wafer particles; the rotating mechanism is arranged between the workbench and the substrate, circularly rotates in a reciprocating manner in a vertical plane, and is used for transferring the wafer particles from the workbench to the substrate; the separation module is arranged above the workbench, is arranged opposite to the rotating mechanism and is used for separating the wafer particles on the workbench from the blue film so as to transfer the wafer particles to the rotating mechanism; the visual detection mechanism is used for detecting the wafer particles at the wafer taking position, the detection position and the wafer fixing position in real time; according to the invention, wafer pick-and-place and mounting can be changed from planar layout to three-dimensional layout, the problem of spatial arrangement is effectively solved, a plurality of wafer particles can be processed at the same time, and the mounting speed and precision are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor manufacturing, and in particular relates to an inverted wafer bonding device and a method thereof. Background Art

[0002] When the die bonder is bonding the wafer, the first step is to accurately position the IC material and its wafer plate. Only after the accurate positioning is completed can the welding head ensure the consistent performance of the pad position of the material, and then it can perform accurate bonding.

[0003] In the actual application of traditional crystal bonders, the inventors found that there are at least the following technical problems in the prior art: On the one hand, when the crystal bonder processes large-sized wafers through a horizontally movable welding head, in order to ensure the speed of crystal bonding, the working distance between the loading wafer and the crystal bonder is shortened to the shortest, so as to ensure that the back-and-forth operation process is completed in a short time. Due to structural limitations, the wafer is usually placed under the lead frame of the crystal bonder's conveying track. During the loading process, there is a certain height difference problem, thereby limiting the UPH of the equipment. The UPH of traditional packaging is generally around 18K, and the accuracy is difficult to handle high-precision crystal bonding. On the other hand, due to the limitation of the spatial position of the crystal bonder, the separation of the wafer body and the blue film and the transfer of the wafer body to the substrate are usually completed in the horizontal plane, which occupies a large space in the horizontal plane of the crystal bonder, and the time period for completing each process in sequence becomes longer. Only one wafer can be transported and transferred at a time, which reduces the actual work efficiency.

[0004] In view of this, it is necessary to improve the defects of the prior art to overcome the deficiencies in practical applications. Summary of the invention

[0005] Based on the above-mentioned shortcomings and deficiencies in the prior art, one of the objects of the present invention is to at least solve one or more of the above-mentioned problems in the prior art. In other words, one of the objects of the present invention is to provide a wafer inverted bonding device and method thereof that meets one or more of the above-mentioned needs.

[0006] In order to achieve the above-mentioned object of the invention, the present invention adopts the following technical solutions:

[0007] The present invention provides a wafer inverted hanging type crystal bonding device, which is at least equipped with a crystal taking position, a crystal bonding position and a detection position, and the crystal bonding device comprises:

[0008] A workbench, used to position the wafer and cover the wafer with a blue film;

[0009] A substrate, disposed below the workbench, for mounting with wafer particles;

[0010] A rotating mechanism is disposed between the workbench and the substrate and performs a circular reciprocating rotational motion in a vertical plane, and is used for transferring wafer particles from the workbench to the substrate;

[0011] A separation module is disposed above the workbench and arranged opposite to the rotating mechanism, and is used to separate the wafer particles on the workbench from the blue film so as to transfer the wafer particles to the rotating mechanism; and

[0012] The visual inspection mechanism is used to perform real-time inspection on the wafer particles at the crystal taking position, the inspection position and the crystal fixing position.

[0013] As a preferred embodiment, the rotating mechanism includes a rotating motor, a turntable and multiple bun heads, the rotating motor is connected to the turntable, and multiple bun heads are evenly distributed around the turntable; the rotating motor drives the turntable to move, so as to link the multiple bun heads to move synchronously, so that the multiple bun heads rotate in a circular manner in a vertical plane.

[0014] As a preferred solution, a suction nozzle is provided on the bonding head, and the suction nozzle is used to suck wafer particles.

[0015] As a preferred solution, each of the bonding heads is provided with a voice coil motor for driving the wafer particles to connect to the substrate.

[0016] As a preferred solution, the separation module includes a driving unit, a guide seat, a guide assembly, an elastic member and an ejector assembly, the driving unit is connected to the guide seat, the guide assembly and the elastic member are installed inside the guide seat, the guide assembly and the elastic member are respectively connected to the ejector assembly in a transmission manner; the driving unit is used to drive the ejector assembly to extend, and the elastic member is used to reset the ejector assembly.

[0017] As a preferred embodiment, the ejector pin assembly includes an ejector pin cap and an ejector pin, and the ejector pin and the ejector pin cap are telescopically matched to make the ejector pin cap abut against the blue film. The ejector pin cap vacuum absorbs the blue film so that the ejector pin ejects the wafer particles to separate the wafer particles from the blue film.

[0018] As a preferred solution, the driving unit is configured as a voice coil motor.

[0019] As a preferred embodiment, the visual inspection mechanism includes a first inspection component, a second inspection component and a third inspection component. The first inspection component is arranged opposite to the crystal removal position, the second inspection component is arranged opposite to the inspection position, and the third inspection component is arranged opposite to the crystal fixing position.

[0020] As a preferred solution, a driving motor, a conveyor belt, a rotating part and a film expanding mechanism are provided on the workbench, the driving motor is connected to the conveyor belt, the conveyor belt is connected to the rotating part, and the rotating part is linked to the film expanding mechanism for rotational motion.

[0021] The present invention also provides a wafer inverted hanging type die bonding method, using the die bonding device as described in any of the above schemes, comprising the following steps:

[0022] S1, positioning the wafer through a workbench and covering the wafer with a blue film;

[0023] S2, separating the wafer particles from the blue film through the separation module and transferring them to the rotating mechanism;

[0024] S3. Transferring several wafer particles to the substrate in sequence through a rotating mechanism, and mounting the wafer particles on the substrate, and performing real-time detection of the wafer particles at the crystal taking position, crystal fixing position and detection position through a visual detection mechanism.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The present invention provides an inverted wafer bonding device, which can transform wafer placement and mounting from a planar layout to a three-dimensional layout, effectively solve the spatial arrangement and shielding, and can simultaneously handle the wafer placement, bonding and detection of multiple wafer particles, thereby improving the speed and accuracy of mounting. The device is simple, practical and low-cost, and is easy to promote and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 It is a structural schematic diagram of an inverted wafer bonding device according to an embodiment of the present invention;

[0029] Figure 2 is a schematic structural diagram of a separation module according to an embodiment of the present invention;

[0030] Figure 3 is a partial enlarged schematic diagram of a separation module according to an embodiment of the present invention;

[0031] Figure 4 is a schematic structural diagram of a rotating mechanism according to an embodiment of the present invention;

[0032] Figure 5 is a schematic structural diagram of a die-bonding device according to an embodiment of the present invention from another viewing angle;

[0033] Figure 6 is a schematic diagram of a wafer transfer process in an embodiment of the present invention;

[0034] Figure 7 It is a schematic diagram of the wafer transfer process in the prior art;

[0035] In the figure: 1 workbench, 11 driving motor, 12 conveyor belt, 13 rotating part, 14 film expanding mechanism, 2 substrate, 3 rotating mechanism, 31 rotating motor, 32 turntable, 33 bungee, 331 voice coil motor, 332 nozzle, 4 separation module, 41 voice coil motor, 42 guide seat, 43 guide rod, 44 guide sleeve, 45 elastic part, 46 ejector cap, 47 ejector, 5 visual inspection mechanism, 51 first inspection component, 52 second inspection component, 53 third inspection component. DETAILED DESCRIPTION

[0036] In order to more clearly illustrate the embodiments of the present application, the specific implementation methods of the present application will be described below with reference to the accompanying drawings. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings and other implementation methods can be obtained based on these drawings without creative work.

[0037] In the description of the embodiments of the present application, the terms "upper", "lower", "front", "rear", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present application. In addition, the terms "first", "second", etc. are only used to distinguish in the description and have no special meaning.

[0038] like Figure 7 The schematic diagram of the wafer transfer process in the prior art is shown. First, the wafer particles are lifted upward by the ejector pin to separate the wafer particles from the blue film, and the wafer particles are sucked by the suction nozzle, and then translated to the substrate in the horizontal plane by the suction nozzle, and finally the wafer particles are connected to the substrate. Due to the spatial position limitation of the crystal bonder, the separation of the wafer body and the blue film and the transfer of the wafer to the substrate are usually completed in the horizontal plane, which occupies a large space in the horizontal plane of the crystal bonder, and the time cycle for completing each process in sequence becomes longer. Only one wafer can be transported and transferred at a time, which reduces the actual work efficiency.

[0039] In order to solve the above technical problems existing in the prior art, according to some embodiments of the present application, please refer to Figures 1 to 5As shown, a wafer inverted crystal bonding device is provided, including a workbench 1, a substrate 2, a rotating mechanism 3, a separation module 4 and a visual inspection mechanism 5, wherein the workbench 1 is used to position the wafer and cover the wafer with a blue film; the substrate 2 is arranged below the workbench 1, and is used to be mounted with wafer particles; the rotating mechanism 3 is arranged between the workbench 1 and the substrate 2, and performs a circular reciprocating rotation movement in a vertical plane, and is used to transfer the wafer particles from the workbench 1 to the substrate 2; the separation module 4 is arranged above the workbench 1, and is arranged opposite to the rotating mechanism 3, and is used to separate the wafer particles on the workbench 1 from the blue film, so that the wafer particles are transferred to the rotating mechanism 3; the visual inspection mechanism 5 is used to perform real-time inspection of the wafer particles at the crystal taking position, the inspection position and the crystal bonding position.

[0040] Furthermore, the crystal bonding device of the embodiment of the present application is at least configured with a crystal taking position, a crystal bonding position and a detection position. The crystal taking position is configured as a rotating mechanism 3 to absorb wafer particles from the workbench 1, the crystal bonding position is configured as a rotating mechanism 3 to mount the wafer particles on the substrate 1, and the detection position is configured as a visual detection mechanism 5 to perform real-time detection on the extraction, transfer and crystal bonding of wafer particles.

[0041] According to some embodiments of the present application, the rotating mechanism 3 includes a rotating motor 31, a turntable 32 and a plurality of bungers 33. The rotating motor 31 is connected to the turntable 32, and the plurality of bungers 33 are evenly distributed around the circumference of the turntable 32. The rotating motor 31 drives the turntable 32 to move, so as to link the plurality of bungers 33 to move synchronously, so that the plurality of bungers 33 can rotate in a circular motion in a vertical plane.

[0042] Specifically, the output end of the rotating motor 31 is connected to the turntable 32, and four binding heads 33 are provided on the turntable 32. The four binding heads 33 are arranged coplanarly in the vertical plane. When the rotating motor 31 rotates, it can drive the four binding heads 33 to pass through the crystal taking position, the detection position and the crystal fixing position in sequence, and rotate reciprocatingly, realizing the process of crystal taking, detection and crystal fixing within one rotation cycle, thereby improving work efficiency.

[0043] Furthermore, a suction nozzle 332 is provided on the bunking head 33, and the suction nozzle 332 is connected to a vacuum generating device. The suction nozzle 332 can ensure the adsorption of the wafer through vacuum adsorption, so as to remove the wafer particles from the wafer one by one and accurately place them on the substrate 1. On the one hand, it can fix the wafer particles, and on the other hand, it can prevent the wafer particles from falling off during the rotation of the bunking head.

[0044] Furthermore, each of the bonding heads 33 is provided with a voice coil motor 331 for driving the wafer to connect with the substrate 1. When the bonding head 33 rotates to the bonding position, the voice coil motor 331 drives the suction nozzle 332 to move downward, so that the suction nozzle 332 contacts the wafer particle with the substrate 1 and disconnects the vacuum generating device, thereby mounting the wafer particle with the substrate 1.

[0045] According to some embodiments of the present application, the separation module 4 includes a driving unit 41, a guide seat 42, a guide assembly, an elastic member 4 and a ejector assembly. The driving unit is connected to the guide seat 42, and the guide assembly and the elastic member 45 are installed inside the guide seat 42. The guide assembly and the elastic member 45 are respectively connected to the ejector assembly in transmission. The driving unit is used to drive the ejector assembly to extend, and the elastic member is used to reset the ejector assembly.

[0046] Furthermore, the ejector pin assembly includes an ejector pin cap 46 and an ejector pin 47. The ejector pin 47 and the ejector pin cap 46 are telescopically matched to make the ejector pin cap 46 abut against the blue film. The ejector pin cap 46 vacuum absorbs the blue film so that the ejector pin 47 ejects the wafer particles to separate the wafer particles from the blue film.

[0047] Furthermore, the driving unit 41 is configured as a voice coil motor, and the ejector cap 46 is connected to a vacuum generating device to ensure that the ejector cap 46 absorbs the blue film through vacuum. The voice coil motor accurately controls the ejector pin 47 to extend out of the ejector cap 46 to eject the wafer particles without affecting other wafer particles on the blue film.

[0048] Furthermore, the guide assembly includes a guide rod 43 and a guide sleeve 44, and the guide rod 43 and the guide sleeve 44 cooperate with each other to ensure that the ejector pin can move up and down to separate the wafer particles from the blue film.

[0049] According to some embodiments of the present application, the visual inspection mechanism 5 includes a first inspection component 51, a second inspection component 52 and a third inspection component 53. The first inspection component 51 is arranged opposite to the crystal taking position, and is used for real-time inspection of wafer particles during the crystal taking process to ensure whether there are defects in the wafer particles during crystal taking; the second inspection component 52 is arranged opposite to the inspection position, and is used for real-time inspection of wafer particles during the transfer process; the third inspection component 53 is arranged opposite to the crystal fixing position, and the substrate can be positioned first through the third inspection component to ensure the position where the wafer particles are connected to the substrate, and at the same time, the wafer particles in the fixing process can be inspected in real time to determine whether there are defects in the wafer particles.

[0050] According to some embodiments of the present application, a driving motor 11, a conveyor belt 12, a rotating part 13 and a film expanding mechanism 14 are provided on the workbench 1. The driving motor 11 is connected to the conveyor belt 12, the conveyor belt 12 is connected to the rotating part 13, and the rotating part 13 is linked to the film expanding mechanism 14 for rotational movement.

[0051] Specifically, the driving motor 11 is installed on the workbench 1, the driving motor 11 is connected to the conveyor belt 12, the conveyor belt 12 is connected to the rotating part 13, and the mold expansion mechanism 14 is rotated through the rotating part 13 to realize the mold expansion of the wafer.

[0052] According to some embodiments of the present application, a wafer inverted bonding method is also provided, using the above-mentioned bonding device, such as Figure 6 As shown, the following steps are included:

[0053] S1. A workbench is used to position the wafer and cover the wafer with a blue film.

[0054] S2. Separate the wafer particles from the blue film through a separation module and transfer them to a rotating mechanism.

[0055] Specifically, the separation module is linked with the ejector pin to eject the wafer particles downward, and the separated wafer particles are sucked by the bonding head to separate the wafer particles from the blue film, and the wafer particles are transferred from the workbench to the rotating mechanism.

[0056] S3. Transferring several wafer particles to the substrate in sequence through a rotating mechanism, and mounting the wafer particles on the substrate, and performing real-time detection of the wafer particles at the crystal taking position, crystal fixing position and detection position through a visual detection mechanism.

[0057] Specifically, the rotating mechanism rotates in a vertical plane, and the bonding head that sucks the wafer particles rotates 180° and then mounts the wafer particles on the substrate. Other bonding heads continue to repeat the material taking action. As the rotating mechanism rotates, a cycle operation of wafer taking, testing and bonding is formed.

[0058] Furthermore, visual inspection components are respectively provided at the crystal retrieval position, the inspection position and the crystal bonding position for real-time inspection of wafer particles during the crystal retrieval, crystal bonding and transfer processes so as to detect defective wafers.

[0059] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0060] The above description is only a detailed description of the preferred embodiments and principles of the present application. For ordinary technicians in this field, there will be changes in the specific implementation methods based on the ideas provided by the present invention, and these changes should also be regarded as the scope of protection of the present application.

Claims

1. A wafer inverted bonding device, characterized in that: At least a crystal taking position, a crystal fixing position and a detection position are configured, and the crystal fixing device includes: A workbench, used to position the wafer and cover the wafer with a blue film; A substrate, disposed below the workbench, for mounting with wafer particles; A rotating mechanism is disposed between the workbench and the substrate and performs a circular reciprocating rotational motion in a vertical plane, and is used for transferring wafer particles from the workbench to the substrate; A separation module is disposed above the workbench and arranged opposite to the rotating mechanism, and is used to separate the wafer particles on the workbench from the blue film so as to transfer the wafer particles to the rotating mechanism; and The visual inspection mechanism is used to perform real-time inspection on the wafer particles at the crystal taking position, the inspection position and the crystal fixing position.

2. The wafer inverted bonding device according to claim 1, characterized in that: The rotating mechanism includes a rotating motor, a turntable and a plurality of bungers. The rotating motor is connected to the turntable, and a plurality of bungers are evenly distributed around the turntable. The rotating motor drives the turntable to move, so as to link the plurality of bungers to move synchronously, so that the plurality of bungers can rotate cyclically in a vertical plane.

3. The wafer inverted bonding device according to claim 2, characterized in that: The bunker head is provided with a suction nozzle, and the suction nozzle is used for sucking wafer particles.

4. The wafer inverted bonding device according to claim 2, characterized in that: Each of the bond heads is provided with a voice coil motor for driving the wafer to connect with the substrate.

5. The wafer inverted bonding device according to claim 1, characterized in that: The separation module includes a driving part, a guide seat, a guide assembly, an elastic member and an ejector assembly, the driving part is connected to the guide seat, the guide assembly and the elastic member are installed inside the guide seat, the guide assembly and the elastic member are respectively connected to the ejector assembly in a transmission manner; the driving part is used to drive the ejector assembly to extend, and the elastic member is used to reset the ejector assembly.

6. The wafer inverted bonding device according to claim 5, characterized in that: The ejector pin assembly includes an ejector pin cap and an ejector pin. The ejector pin and the ejector pin cap are telescopically matched to make the ejector pin cap abut against the blue film. The ejector pin cap vacuum absorbs the blue film so that the ejector pin ejects the wafer particles to separate the wafer particles from the blue film.

7. The wafer upside-down bonding device according to claim 5, characterized in that: The driving unit is configured as a voice coil motor.

8. The wafer upside-down bonding device according to claim 1, characterized in that: The visual inspection mechanism includes a first inspection component, a second inspection component and a third inspection component. The first inspection component is arranged opposite to the crystal removal position, the second inspection component is arranged opposite to the inspection position, and the third inspection component is arranged opposite to the crystal bonding position.

9. The wafer inverted bonding device according to claim 1, characterized in that: The workbench is provided with a driving motor, a conveyor belt, a rotating part and a film expanding mechanism, the driving motor is connected to the conveyor belt, the conveyor belt is connected to the rotating part, and the rotating part is linked to the film expanding mechanism for rotational motion.

10. A wafer upside-down bonding method, characterized in that: The application of the die bonding device according to any one of claims 1 to 9 comprises the following steps: S1, positioning the wafer through a workbench and covering the wafer with a blue film; S2, separating the wafer particles from the blue film through the separation module and transferring them to the rotating mechanism; S3. Transferring several wafer particles to the substrate in sequence through a rotating mechanism, and mounting the wafer particles on the substrate, and performing real-time detection of the wafer particles at the crystal taking position, crystal fixing position and detection position through a visual detection mechanism.

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