Power module three-dimensional packaging structure and electronic device with same

Abstract

The invention provides a power module three-dimensional packaging structure and an electronic device with the power module three-dimensional packaging structure. The three-dimensional packaging structure comprises a substrate, and first copper-clad layers are arranged on the two sides of the substrate. The first copper-clad layer is in contact with the ceramic layer, and a power module is arranged on the side, away from the first copper-clad layer, of the ceramic layer. Cooling liquid flow channels are formed between the substrate and the first copper-clad layers on the two sides, and cooling liquid circularly flows through the cooling liquid flow channels so as to take away heat transferred to the ceramic layers on the two sides of the substrate by the power module. A plurality of flow guide pieces are arranged in the cooling liquid flow channel, and a plurality of heat dissipation gaskets are arranged on the side wall of the cooling liquid flow channel. Two cooling liquid flow channels are formed between the substrate and the first copper-clad layers on the two sides, cooling liquid circularly flows through the cooling liquid flow channels, and heat transmitted to the ceramic layer by the power module can be taken away. The ceramic layers and the power modules are arranged on the two sides of the substrate in the middle, that is, the two power modules share one substrate, a packaging structure of a three-dimensional space can be achieved, and miniaturization of the packaging structure of the power modules is achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device packaging, and in particular to a three-dimensional packaging structure of a power module and an electronic device having the same. Background Art

[0002] At present, there are two main packaging structures for power modules. One is a single-sided heat dissipation structure, such as Figure 5 As shown, including package appearance such as ED3 and HPD modules, using chip + solder + liner + solder + substrate structure. The second is a double-sided heat dissipation structure, such as DSC modules, such as Figure 6 As shown, from top to bottom is the structure of substrate + solder + DBC + solder + Spacer + solder + chip + solder + DBC + solder + substrate.

[0003] The first single-sided heat dissipation structure has the disadvantage of limited heat dissipation capacity. With the popularization of SiC chips and the increase in the power of Si-based modules, this structure can no longer meet the increasingly high heat dissipation requirements. The second double-sided heat dissipation structure has the disadvantages of high process technology difficulty and high material cost. The improvement of packaging density faces a bottleneck, and a new packaging structure is needed to further improve the packaging density and promote module integration and miniaturization.

[0004] Therefore, a packaging structure that can take into account both heat dissipation efficiency and packaging integration is needed. Summary of the invention

[0005] In order to overcome the problems existing in the related art, an object of the present invention is to provide a three-dimensional packaging structure of a power module and an electronic device having the same, wherein the three-dimensional packaging structure of the power module can take into account both heat dissipation efficiency and packaging integration.

[0006] A three-dimensional packaging structure for a power module comprises a substrate, wherein a first copper clad layer is arranged on both sides of the substrate; the first copper clad layer is in contact with a ceramic layer, and a power module is arranged on the side of the ceramic layer away from the first copper clad layer; a coolant flow channel is formed between the substrate and the first copper clad layers on both sides, and a coolant circulates through the coolant flow channel to take away the heat transferred from the power module to the ceramic layers on both sides of the substrate; a plurality of guide members are arranged in the coolant flow channel, and a plurality of heat dissipation pads are arranged on the side walls of the coolant flow channel.

[0007] In a preferred technical solution of the present invention, the power module comprises a chip, and a second copper cladding layer is connected to a side of the chip close to the ceramic layer.

[0008] In a preferred technical solution of the present invention, a soldering layer is provided between the chip and the second copper cladding layer.

[0009] In a preferred technical solution of the present invention, the ceramic layer, the first copper-clad layer and the second copper-clad layer are all made by a direct copper-clad process.

[0010] In a preferred technical solution of the present invention, a first channel is opened on a side of the substrate close to the first copper clad layer, and a second channel is opened on a side of the first copper clad layer close to the substrate, and the first channel and the second channel are adapted to form the coolant flow channel.

[0011] In a preferred technical solution of the present invention, a plurality of partition plates are provided between the first channel and the second channel, and the partition plates divide the first channel and the second channel into a plurality of sub-channels.

[0012] In a preferred technical solution of the present invention, a plurality of the sub-channels are connected end to end to allow the coolant to flow through.

[0013] In a preferred technical solution of the present invention, the three-dimensional packaging structure of the power module further includes a bonding wire, a first end of the bonding wire is connected to the chip, and a second end of the bonding wire is connected to the second copper cladding layer.

[0014] In a preferred technical solution of the present invention, a first positioning block is provided on a side of the substrate close to the first copper clad layer, and the first positioning block is connected to a plurality of second positioning blocks on the first copper clad layer.

[0015] In a preferred technical solution of the present invention, the cross-sectional size of the flow guide gradually decreases along the flow direction of the coolant.

[0016] In a preferred technical solution of the present invention, a plurality of heat sink gaskets are arranged at intervals on the side walls of the coolant flow channel, the thermal conductivity of the heat sink gaskets is greater than the thermal conductivity of the side walls of the coolant flow channel, and the heat sink gaskets are used to cool the coolant in the coolant flow channel to reduce the Reynolds coefficient of the coolant.

[0017] The present invention further provides an electronic device, comprising any one of the above-mentioned three-dimensional packaging structures for a power module, and further comprising a cover plate, wherein two sides of the cover plate are respectively connected to the housing, and the cover plate is connected to terminals.

[0018] The beneficial effects of the present invention are:

[0019] The present invention provides a three-dimensional packaging structure of a power module, comprising a substrate, wherein a first copper-clad layer is arranged on both sides of the substrate; the first copper-clad layer is in contact with a ceramic layer, and a power module is arranged on one side of the ceramic layer away from the first copper-clad layer; a cooling liquid flow channel is formed between the substrate and the first copper-clad layers on both sides, and the cooling liquid circulates through the cooling liquid flow channel to take away the heat transferred from the power module to the ceramic layers on both sides of the substrate; a plurality of guide members are arranged in the cooling liquid flow channel, and a plurality of heat dissipation pads are arranged on the side walls of the cooling liquid flow channel. The power module generates heat when working, and the heat accumulates continuously, which may cause the temperature of the power module to be too high. The heat generated by the power modules on both sides of the present invention is transferred to the two ceramic layers, and the substrate is located in the middle of the entire three-dimensional packaging structure of the power module. Two cooling liquid flow channels are formed between the substrate and the first copper-clad layers on both sides, and the cooling liquid circulates through the cooling liquid flow channels. Since the cooling liquid flow channels are close to the ceramic layers, the heat transferred from the power module to the ceramic layers can be taken away. The ceramic layers and the power modules are arranged on both sides of the substrate in the middle, that is, the two power modules share one substrate, which reduces the material cost. In addition, the structural arrangement on both sides of the substrate is symmetrical, so a three-dimensional packaging structure can be realized, the power density is improved, and the miniaturization of the power module packaging structure is realized. The present invention does not need to set up an additional radiator, and a coolant flow channel is opened between the original substrate and the first copper-clad layer. While improving the cooling effect, no additional heat dissipation structure is introduced, and no additional cost is required. The coolant in the coolant flow channel formed between the substrate and the first copper-clad layer can directly contact the ceramic layer, thereby efficiently dissipating heat. Under the action of multiple, the flow rate of the coolant can be accelerated. Multiple heat dissipation pads are used to dissipate heat from the coolant. Since the viscosity coefficient of the liquid is negatively correlated with the temperature, the viscosity coefficient of the coolant is increased while the coolant temperature is reduced. The viscosity coefficient is negatively correlated with the Reynolds coefficient, thereby reducing the Reynolds coefficient of the coolant when it flows in the coolant flow channel, reducing the Reynolds coefficient of the coolant to a smaller value, ensuring that the flow mode of the coolant in the coolant flow channel is laminar, thereby ensuring that the circulation flow of the coolant has a higher heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic diagram of a three-dimensional packaging structure of a power module of the present invention;

[0021] Figure 2 is a schematic structural diagram of a substrate of the present invention;

[0022] Figure 3 is a schematic structural diagram of the first copper clad layer of the present invention;

[0023] Figure 4 is a schematic diagram of the coolant flowing along the coolant flow channel of the present invention;

[0024] Figure 5 is a schematic diagram of a single-sided heat dissipation structure of a power module in the prior art;

[0025] Figure 6 is a schematic diagram of a double-sided heat dissipation structure of a power module in the prior art;

[0026] Figure 7 It is a schematic diagram of a coolant flow channel of the present invention provided with a flow guide and a heat dissipation gasket;

[0027] Figure 8 It is a schematic diagram of the transition zone and non-transition zone of the coolant flow channel of the present invention.

[0028] Figure numerals: 1. substrate; 2. first copper clad layer; 3. ceramic layer; 4. power module; 5. coolant flow channel; 6. chip; 7. second copper clad layer; 8. welding layer; 9. first channel; 10. second channel; 11. partition plate; 12. bonding wire; 13. first positioning block; 14. second positioning block; 15. sub-channel; 16. cover plate; 17. housing; 18. terminal; 19. guide member; 20. heat dissipation gasket; 21. transition zone; 22. non-transition zone; 23. rotating blade. DETAILED DESCRIPTION

[0029] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0030] Example 1

[0031] like Figure 1-Figure 4 As shown, this embodiment provides a three-dimensional packaging structure of a power module, including a substrate 1, wherein a first copper clad layer 2 is arranged on both sides of the substrate 1; the first copper clad layer 2 is in contact with a ceramic layer 3, and a power module 4 is arranged on the side of the ceramic layer 3 away from the first copper clad layer 2; a coolant flow channel 5 is formed between the substrate 1 and the first copper clad layer 2 on both sides, and a coolant circulates through the coolant flow channel 5 to take away the heat transferred from the power module 4 to the ceramic layer 3 on both sides of the substrate 1; a plurality of guide members 19 are arranged in the coolant flow channel 5, and a plurality of heat dissipation gaskets 20 are arranged on the side walls of the coolant flow channel 5.

[0032] A substrate 1 is arranged in the middle of the three-dimensional packaging structure of the power module. A heat dissipation structure is arranged on both sides of the substrate 1. The heat dissipation structure includes a ceramic layer 3 and a first copper cladding layer 2. Both the ceramic layer 3 and the first copper cladding layer 2 are made by direct copper cladding process.

[0033] The power module 4 generates heat when working. If the heat is not dissipated, the temperature of the power module 4 will be too high. The heat generated by the power module 4 is transferred to the ceramic layer 3. The side of the substrate 1 facing the first copper clad layer 2 and the side of the first copper clad layer 2 facing the substrate 1 are both subjected to the back copper clad etching process. In combination with the substrate 1 forging process, the substrate 1 and the first copper clad layers 2 on both sides enclose a coolant flow channel 5.

[0034] A coolant inlet is provided on one side of the coolant flow channel 5, and a coolant outlet is provided on the other side. The coolant flows in from the coolant inlet and flows out from the coolant outlet. The coolant in the coolant flow channel is in full contact with the ceramic layer 3 to take away the heat transferred from the power module 4 to the ceramic layer 3.

[0035] Since the substrate 1 is located in the middle of the three-dimensional packaging structure of the power module, the structures on both sides of the substrate 1 are symmetrical, that is, the substrate 1 is shared by the front heat dissipation module and the back heat dissipation module, and the two heat dissipation modules share one substrate 1, which reduces material costs, realizes a three-dimensional packaging structure, and improves power density, thereby realizing the miniaturization of the power module 4 packaging structure.

[0036] The substrate 1 is made of ceramic material, and a heat dissipation channel is etched out of the copper on the back of the substrate 1. The heat dissipation channel cooperates with the drilling structure of the substrate 1. The substrate 1 and multiple first copper clad layers 2 are welded and sealed to form a coolant flow channel 5 that is in direct contact with the ceramic layer 3. The coolant directly contacts the ceramic layer 3, which can dissipate heat efficiently.

[0037] The ceramic layer 3 corresponding to the chip 6 generates a large amount of heat, and a larger circulation channel is designed for the ceramic layer 3 to increase the flow rate of the coolant, thereby improving the local cooling capacity.

[0038] like Figure 7 As shown, when multiple guide members 19 are provided, the coolant flows through the areas between the multiple guide members 19 and the areas between the guide members 19 and the side walls of the coolant flow channel 5. The multiple guide members 19 guide the coolant to increase the flow velocity of the coolant in the coolant flow channel 5.

[0039] A plurality of heat dissipation pads 20 are arranged on the side wall of the coolant flow channel 5 to improve the heat dissipation efficiency of the coolant at the location where the heat dissipation pads 20 are arranged, thereby reducing the temperature of the coolant. Since the viscosity coefficient of the liquid is negatively correlated with the temperature of the liquid, and the Reynolds coefficient of the liquid is negatively correlated with the viscosity coefficient of the liquid, reducing the temperature of the coolant can increase the viscosity coefficient of the liquid and reduce the Reynolds coefficient of the coolant in the coolant flow channel 5. Reducing the Reynolds coefficient of the coolant to a smaller value ensures that the flow mode of the coolant in the coolant flow channel 5 is laminar flow, thereby ensuring that the circulating flow of the coolant has a higher heat dissipation efficiency.

[0040] The present embodiment provides a three-dimensional packaging structure of a power module, including a substrate 1, a first copper-clad layer 2 is provided on both sides of the substrate 1; the first copper-clad layer 2 is in contact with the ceramic layer 3, and a power module 4 is provided on the side of the ceramic layer 3 away from the first copper-clad layer 2; a cooling liquid flow channel 5 is formed between the substrate 1 and the first copper-clad layers 2 on both sides, and the cooling liquid circulates through the cooling liquid flow channel 5 to take away the heat transferred from the power module 4 to the ceramic layers 3 on both sides of the substrate 1; a plurality of guide members 19 are provided in the cooling liquid flow channel 5, and a plurality of heat dissipation pads 20 are provided on the side wall of the cooling liquid flow channel 5. The power module 4 generates heat when working, and the heat accumulates continuously, which may cause the temperature of the power module 4 to be too high. The heat generated by the power modules 4 on both sides of the present invention is transferred to the two ceramic layers 3, and the substrate 1 is located in the middle of the entire three-dimensional packaging structure of the power module. Two cooling liquid flow channels 5 are formed between the substrate 1 and the first copper-clad layers 2 on both sides, and the cooling liquid circulates through the cooling liquid flow channel 5. Since the cooling liquid flow channel 5 is close to the ceramic layer 3, the heat transferred from the power module 4 to the ceramic layer 3 can be taken away. Ceramic layers 3 and power modules 4 are provided on both sides of the central substrate 1, that is, two power modules 4 share one substrate 1, which reduces material costs. In addition, the structural settings on both sides of the substrate 1 are symmetrical, so a three-dimensional packaging structure can be realized, the power density is improved, and the miniaturization of the power module 4 packaging structure is realized. The present invention does not require an additional radiator, and a coolant channel 5 is opened between the original substrate 1 and the first copper-clad layer 2. While improving the cooling effect, no additional heat dissipation structure is introduced, and no additional cost is required. The coolant in the coolant channel 5 formed between the substrate 1 and the first copper-clad layer 2 can directly contact the ceramic layer 3, thereby efficiently dissipating heat. Under the action of multiple 19, the flow rate of the coolant can be accelerated. Multiple heat dissipation pads 20 are used to dissipate heat from the coolant. Since the viscosity coefficient of the liquid is negatively correlated with the temperature, the viscosity coefficient of the coolant is increased while the temperature of the coolant is reduced. The viscosity coefficient is negatively correlated with the Reynolds coefficient, thereby reducing the Reynolds coefficient of the coolant when it flows in the coolant flow channel 5, reducing the Reynolds coefficient of the coolant to a smaller value, ensuring that the flow mode of the coolant in the coolant flow channel 5 is laminar flow, thereby ensuring that the circulating flow of the coolant has a higher heat dissipation efficiency.

[0041] Example 2

[0042] like Figure 1-Figure 4As shown, this embodiment provides a three-dimensional packaging structure of a power module, including a substrate 1, wherein a first copper clad layer 2 is arranged on both sides of the substrate 1; the first copper clad layer 2 is in contact with a ceramic layer 3, and a power module 4 is arranged on the side of the ceramic layer 3 away from the first copper clad layer 2; a coolant flow channel 5 is formed between the substrate 1 and the first copper clad layer 2 on both sides, and a coolant circulates through the coolant flow channel 5 to take away the heat transferred from the power module 4 to the ceramic layer 3 on both sides of the substrate 1; a plurality of guide members 19 are arranged in the coolant flow channel 5, and a plurality of heat dissipation gaskets 20 are arranged on the side walls of the coolant flow channel 5.

[0043] The power module 4 includes a chip 6 . A second copper clad layer 7 is connected to a side of the chip 6 close to the ceramic layer 3 . A welding layer 8 is provided between the chip 6 and the second copper clad layer 7 .

[0044] The heat dissipation path of the three-dimensional packaging structure of the power module of the present invention is: chip 6-welding layer 8-second copper cladding layer 7-ceramic layer 3-coolant flow channel 5, such as Figure 5-Figure 6 As shown, the existing power module 4 generally adopts two heat dissipation structures. The heat dissipation path of the first heat dissipation structure is: chip 6-welding layer 8-second copper clad layer 7-ceramic layer 3-first copper clad layer 2-welding layer 8-substrate 1-thermal grease-radiator. The heat needs to pass through a total of 8 layers of structure. The heat dissipation path of the second heat dissipation structure is: chip 6-welding layer 8-second copper clad layer 7-ceramic layer 3-first copper clad layer 2-welding layer 8-substrate 1-cooling liquid. The heat needs to pass through a total of 7 layers of structure. Compared with the two existing heat dissipation structures of the power module 4, the heat dissipation channel of the three-dimensional packaging structure of the power module of the present invention is reduced from 8 layers or 7 layers to 4 layers. By reducing the number of layers of the heat dissipation channel structure, the thermal resistance of the module is reduced and the heat dissipation capacity is improved.

[0045] The ceramic layer 3, the first copper clad layer 2 and the second copper clad layer 7 are all made by direct copper cladding process, and the chip 6, the welding layer 8, the second copper clad layer 7, the ceramic layer 3, the first copper clad layer 2 and the substrate 1 are arranged in sequence from the side far away from the substrate 1 to the side close to the substrate 1.

[0046] The chip 6 is welded to the first side of the welding layer 8 , and the second copper clad layer 7 is welded to the second side of the welding layer 8 . The welding layer 8 serves to connect the chip 6 and the second copper clad layer 7 .

[0047] The ceramic layer 3 can be divided into two parts with a gap between the two parts, and two first copper clad layers 2 are arranged on one side of each part away from the substrate 1. One of the first copper clad layers 2 is welded to the welding layer 8, and the other first copper clad layer 2 is welded to the fixed structure.

[0048] The heat generated by the chip 6 when working is first transferred to the welding layer 8, and then transferred to the ceramic layer 3 through the second copper clad layer 7. The substrate 1 and the first copper clad layer 2 are interlocked to form a coolant flow channel 5. The side of the first copper clad layer 2 away from the substrate 1 is welded to the ceramic layer 3, and the coolant in the coolant flow channel 5 is directly in contact with the ceramic layer 3, thereby efficiently dissipating heat on the basis of reducing the number of heat transfer layers, and the outlet of the coolant flow channel 5 is connected to an external circulation device to realize the recycling of the coolant.

[0049] Direct copper coating process is DBC process. Direct copper coating process is a ceramic surface metallization technology developed based on alumina ceramic substrate. There are two main materials of DBC substrate, Al2O3 ceramic substrate and AlN ceramic substrate. The surface metallization technology of Al2O3 ceramic substrate and AlN ceramic substrate is roughly the same. Taking Al2O3 ceramic substrate as an example, the ceramic substrate is heated in an oxygen-containing nitrogen N2 atmosphere to make the copper foil directly welded on the alumina Al2O3 substrate.

[0050] The ceramic plate can be made by direct copper cladding process or active metal brazing copper cladding process, namely AMB process.

[0051] The power module 4 of this embodiment includes a chip 6, and the side of the chip 6 close to the ceramic layer 3 is connected to the second copper clad layer 7. A welding layer 8 is arranged between the chip 6 and the second copper clad layer 7, and the ceramic layer 3, the first copper clad layer 2 and the second copper clad layer 7 are all made by direct copper cladding process. The chip 6 is welded on the first side of the welding layer 8, and the second copper clad layer 7 is welded on the second side. The welding layer 8 plays the role of connecting the chip 6 and the second copper clad layer 7. The heat generated by the chip 6 when working is first transferred to the welding layer 8, and then transferred to the ceramic layer 3 through the second copper clad layer 7. The substrate 1 and the first copper clad layer 2 are interlocked to form a coolant flow channel 5. The side of the first copper clad layer 2 away from the substrate 1 is welded to the ceramic layer 3, and the coolant in the coolant flow channel 5 is directly in contact with the ceramic layer 3, thereby efficiently dissipating heat on the basis of reducing the number of heat transfer layers.

[0052] Example 3

[0053] like Figure 1-Figure 4 As shown, this embodiment provides a three-dimensional packaging structure of a power module, including a substrate 1, wherein a first copper clad layer 2 is arranged on both sides of the substrate 1; the first copper clad layer 2 is in contact with a ceramic layer 3, and a power module 4 is arranged on the side of the ceramic layer 3 away from the first copper clad layer 2; a coolant flow channel 5 is formed between the substrate 1 and the first copper clad layer 2 on both sides, and a coolant circulates through the coolant flow channel 5 to take away the heat transferred from the power module 4 to the ceramic layer 3 on both sides of the substrate 1; a plurality of guide members 19 are arranged in the coolant flow channel 5, and a plurality of heat dissipation gaskets 20 are arranged on the side walls of the coolant flow channel 5.

[0054] A first channel 9 is formed on one side of the substrate 1 close to the first copper clad layer 2 , and a second channel 10 is formed on one side of the first copper clad layer 2 close to the substrate 1 . The first channel 9 and the second channel 10 are adapted to form the coolant flow channel 5 .

[0055] A plurality of partition plates 11 are disposed at intervals between the first channel 9 and the second channel 10 . The partition plates 11 divide the first channel 9 and the second channel 10 into a plurality of sub-channels 15 .

[0056] The plurality of sub-channels 15 are connected end to end to allow the coolant to flow through.

[0057] The size of the first copper clad layer 2 is smaller than that of the substrate 1, and multiple first copper clad layers 2 are buckled on the substrate 1. In this embodiment, two first copper clad layers 2 are buckled on the substrate 1 as an example. One first copper clad layer 2 is buckled on one side of the substrate 1, and the other first copper clad layer 2 is buckled on the other side of the substrate 1.

[0058] A portion of the first channel 9 of the substrate 1 is matched with the second channel 10 of the first first copper clad layer 2 , and another portion of the first channel 9 of the substrate 1 is matched with the second channel 10 of the second first copper clad layer 2 .

[0059] like Figure 2-Figure 3 As shown, a plurality of partition plates 11 are arranged at intervals on the substrate 1, one side of the partition plate 11 is connected to or integrally formed with the frame of the substrate 1, and a gap is provided between the other side of the partition plate 11 and the frame of the substrate 1 for the coolant to flow through. The first channel 9 and the second channel 10 are both in the shape of a "X", and the adjacent sub-channels 15 are connected end to end to extend the length of the coolant flow channel 5, so that the coolant flow channel 5 can accommodate more coolant, extend the flow time of the coolant in the coolant flow channel 5, and ensure that the coolant is fully in contact with the ceramic layer 3 to improve the heat dissipation efficiency.

[0060] The first channel 9 and the two second channels 10 are adapted in shape, and the substrate 1 and the two first copper-clad layers 2 are buckled and welded to form a sealed circulation channel.

[0061] The heat dissipation capacity of the three-dimensional packaging structure of the power module of the present invention has a wide adjustment range. The number of heat dissipation pipes and the size of the cross section can be adjusted by the etching process of the copper coating on the back of the ceramic liner in combination with the forging process of the substrate 1, and the cost is low. Increase the number of partitions 11 and reduce the spacing between adjacent partitions 11 to increase the number of sub-channels 15 of the substrate 1 and the first copper coating layer 2 and reduce the volume of each sub-channel 15. When the number of sub-channels 15 is large and the volume of each sub-channel 15 is small, a capillary heat dissipation pipe effect can be achieved. For the coolant, the smaller the cross-sectional area of ​​the coolant flow channel 5, the larger the specific surface area of ​​the coolant when working, and the higher the heat dissipation efficiency. In addition, the heat dissipation capacity of the three-dimensional packaging structure of the power module can be adjusted by adjusting the flow rate of the coolant. The specific surface area is related to the cross section, and a suitable cross-sectional design is selected according to the processing capacity of the liner and substrate 1 suppliers.

[0062] Preferably, the heat dissipation process is simulated in the form of thermal simulation according to the working power of the chip 6 and the thermal conductivity from the chip 6 to the ceramic layer 3, and the number of sub-channels 15 in the coolant channel 5 and the volume of the sub-channels 15 are designed according to the simulation results of the heat dissipation process, so as to achieve the optimal heat dissipation effect while saving energy.

[0063] In this embodiment, the substrate 1 is provided with a first channel 9 on one side close to the first copper clad layer 2, and the first copper clad layer 2 is provided with a second channel 10 on one side close to the substrate 1, and the first channel 9 and the second channel 10 are adapted to form the coolant flow channel 5. The first channel 9 and the second channel 10 are both provided with a plurality of partition plates 11 at intervals, and the partition plates 11 divide the first channel 9 and the second channel 10 into a plurality of sub-channels 15. The plurality of sub-channels 15 are connected end to end for the coolant to flow through. The number of partition plates 11 is increased, and the spacing between adjacent partition plates 11 is reduced to increase the number of sub-channels 15 of the substrate 1 and the first copper clad layer 2, and reduce the volume of each sub-channel 15. When the number of sub-channels 15 is large and the volume of each sub-channel 15 is small, a capillary heat pipe effect can be achieved. For the coolant, the smaller the cross-sectional area of ​​the coolant flow channel 5, the larger the specific surface area of ​​the coolant when working, and the higher the heat dissipation efficiency. In addition, the heat dissipation capacity of the three-dimensional packaging structure of the power module can be adjusted by adjusting the flow rate of the coolant. The specific surface area is related to the cross section, and the appropriate cross section design is selected based on the processing capabilities of the liner and substrate 1 suppliers.

[0064] Example 4

[0065] like Figure 1-Figure 4As shown, this embodiment provides a three-dimensional packaging structure of a power module, including a substrate 1, wherein a first copper clad layer 2 is arranged on both sides of the substrate 1; the first copper clad layer 2 is in contact with a ceramic layer 3, and a power module 4 is arranged on the side of the ceramic layer 3 away from the first copper clad layer 2; a coolant flow channel 5 is formed between the substrate 1 and the first copper clad layer 2 on both sides, and a coolant circulates through the coolant flow channel 5 to take away the heat transferred from the power module 4 to the ceramic layer 3 on both sides of the substrate 1; a plurality of guide members 19 are arranged in the coolant flow channel 5, and a plurality of heat dissipation gaskets 20 are arranged on the side walls of the coolant flow channel 5.

[0066] The power module 4 includes a chip 6 , and a second copper cladding layer 7 is connected to a side of the chip 6 close to the ceramic layer 3 .

[0067] The three-dimensional packaging structure of the power module further includes a bonding wire 12 , wherein a first end of the bonding wire 12 is connected to the chip 6 , and a second end of the bonding wire 12 is connected to the second copper cladding layer 7 .

[0068] The bonding wire 12 is a wire material used for electronic packaging and connection, and is generally used to connect the chip 6, the circuit board and other electronic components. The bonding wire 12 can connect different electronic components together to form a complete circuit system.

[0069] The two ends of the bonding wire 12 are respectively connected to the chip 6 and the second copper clad layer 7, and the chip 6 and the second copper clad layer 7 are connected through the bonding wire 12. In this embodiment, two bonding wires 12 are led out from each chip 6, one bonding wire 12 is connected to the second copper clad layer 7 of the welding layer 8 where the chip 6 is located, and the other bonding wire 12 is connected to the adjacent second copper clad layer 7 where no chip 6 is installed.

[0070] A first channel 9 is formed on one side of the substrate 1 close to the first copper clad layer 2 , and a second channel 10 is formed on one side of the first copper clad layer 2 close to the substrate 1 . The first channel 9 and the second channel 10 are adapted to form the coolant flow channel 5 .

[0071] A first positioning block 13 is disposed on one side of the substrate 1 close to the first copper clad layer 2 , and the first positioning block 13 is connected to a plurality of second positioning blocks 14 on the first copper clad layer 2 .

[0072] The size of the first copper clad layer 2 is smaller than that of the substrate 1. The substrate 1 and the multiple first copper clad layers 2 are buckled together to form a coolant flow channel 5. This embodiment takes the buckling of the substrate 1 and two first copper clad layers 2 as an example. Both sides of the substrate 1 are provided with first positioning blocks 13, and the first positioning block 13 is located in the middle of the substrate 1. The two second positioning blocks 14 on the same side of the substrate 1 are aligned with the first positioning block 13, and then the two first copper clad layers 2 are buckled on the substrate 1, so as to form a coolant flow channel 5 on one side of the substrate 1. The same installation method as the above steps is also adopted on the other side of the substrate 1, so as to form coolant flow channels 5 on both sides of the substrate 1, so that the three-dimensional packaging structure of the power module of the present invention can dissipate heat for two power modules 4 at the same time.

[0073] Preferably, the weak current control module is integrated on the back of the three-dimensional packaging structure of the power module. Due to the presence of the substrate 1, the electromagnetic interference of the strong current side to the weak current side can be greatly reduced, and the integration of the power module 4 can be realized. Since there is no need to set up a heat sink, the application end of the power module reduces materials such as thermal grease, and reduces process steps such as coating thermal grease, which can reduce process and material costs, thereby reducing the cost of the power module application end.

[0074] Since there is no need to cooperate with the heat sink plane, the three-dimensional packaging structure of the power module of the present invention has lower requirements on the flatness of the finished module, which reduces the requirements for the control of the warpage of the incoming substrate 1 and the control of the process, thereby reducing the production cost of the module.

[0075] In this embodiment, the substrate 1 is provided with a first positioning block 13 on one side close to the first copper clad layer 2, and the first positioning block 13 is connected to the second positioning blocks 14 on the multiple first copper clad layers 2. The size of the first copper clad layer 2 is smaller than that of the substrate 1, and the substrate 1 and the multiple first copper clad layers 2 are buckled to form a coolant flow channel 5. In this embodiment, the buckling of the substrate 1 and the two first copper clad layers 2 is taken as an example. Both sides of the substrate 1 are provided with a first positioning block 13, and the first positioning block 13 is located in the middle of the substrate 1. The two second positioning blocks 14 on the same side of the substrate 1 are aligned with the first positioning block 13, and then the two first copper clad layers 2 are buckled on the substrate 1, so as to form a coolant flow channel 5 on one side of the substrate 1. The same installation method as the above steps is also adopted on the other side of the substrate 1, so as to form a coolant flow channel 5 on both sides of the substrate 1, so that the three-dimensional packaging structure of the power module of the present invention can dissipate heat for two power modules 4 at the same time.

[0076] Example 5

[0077] The present embodiment provides a three-dimensional packaging structure of a power module 4, including a substrate 1, wherein a first copper clad layer 2 is provided on both sides of the substrate 1; the first copper clad layer 2 is in contact with a ceramic layer 3, and a power module 4 is provided on the side of the ceramic layer 3 away from the first copper clad layer 2; a coolant flow channel 5 is formed between the substrate 1 and the first copper clad layer 2 on both sides, and a coolant circulates through the coolant flow channel 5 to take away the heat transferred from the power module 4 to the ceramic layer 3 on both sides of the substrate 1; a plurality of guide members 19 are provided in the coolant flow channel 5, and a plurality of heat dissipation pads 20 are provided on the side walls of the coolant flow channel 5.

[0078] like Figure 7 As shown, the projected shape of the guide member 19 is a triangle, and the cross-sectional size of the guide member 19 gradually decreases along the flow direction of the coolant. In addition to being a triangle, the projected shape of the guide member 19 can also be a teardrop shape and a trapezoidal shape. The ratio of the reduction in the cross-sectional size of the guide member 19 is related to the angle of the guide member 19, and the angle of the guide member 19 is 15-75 degrees. As an example, if the projected shape of the guide member 19 is an equilateral triangle, the three angles of the guide member 19 are all 60 degrees, and the flow direction of the coolant is perpendicular to the bottom side of the guide member 19, then the ratio of the reduction in the height direction and the width direction of the guide member 19 projection is 2. The height direction of the projection of the guide member 19 is parallel to the flow direction of the coolant, and the width direction of the projection of the guide member 19 is perpendicular to the flow direction of the coolant.

[0079] A plurality of heat dissipation gaskets 20 are arranged at intervals on the side wall of the coolant channel 5, and the thermal conductivity of the heat dissipation gaskets 20 is greater than the thermal conductivity of the side wall of the coolant channel 5. The heat dissipation gaskets 20 are used to cool the coolant in the coolant channel 5 to reduce the Reynolds coefficient of the coolant.

[0080] The projection shape of the guide member 19 is designed to be a triangle, and the coolant in the coolant flow channel 5 flows along the inclined surface of the guide member 19. Along the flow direction of the coolant, the cross-sectional size of the guide member 19 gradually decreases, which can guide the flow of the coolant while reducing the resistance encountered by the coolant during the flow, thereby increasing the flow rate of the coolant in the coolant flow channel 5.

[0081] The viscosity of the fluid has a great influence on the stability of the fluid flow. When the fluid viscosity is high, the flow is relatively stable and the fluid flow is laminar; when the fluid viscosity is low, the fluid flow is prone to turbulence. Turbulence will increase the resistance to the fluid flow and increase energy consumption. The calculation formula of the Reynolds coefficient of the fluid is:

[0082]

[0083] Among them, Re is the Reynolds coefficient of the fluid, ρ is the density of the fluid, v is the flow velocity of the fluid, d is the pipe diameter, and u is the viscosity coefficient of the fluid.

[0084] A plurality of heat dissipation pads 20 are used to dissipate heat from the coolant. Since the viscosity coefficient of the liquid is negatively correlated with the temperature, the viscosity coefficient of the coolant is increased while the coolant temperature is reduced. The viscosity coefficient is negatively correlated with the Reynolds coefficient, thereby reducing the Reynolds coefficient of the coolant when it flows in the coolant flow channel 5, reducing the Reynolds coefficient of the coolant to a smaller value, ensuring that the flow mode of the coolant in the coolant flow channel 5 is laminar flow, thereby ensuring that the circulation of the coolant has a higher heat dissipation efficiency.

[0085] like Figure 8 As shown, a transition zone 21 and a non-transition zone 22 are provided in the coolant flow channel 5, and the cross-sectional size of the transition zone 21 is larger than the cross-sectional size of the non-transition zone 22; the transition zone 21 has a certain curvature, and a plurality of rotating blades 23 are provided in the transition zone 21.

[0086] The cross-sectional dimensions of both ends of each sub-channel 15 are small, and the cross-sectional dimensions of the middle portion are large. The transition zone 21 is arranged in the middle portion of each sub-channel 15, and the two sides of the transition zone 21 are non-transition zones 22, and the transition zone 21 and the non-transition zone 22 are connected. The two sides of the transition zone 21 expand outward, so that the transition zone 21 has a certain curvature, and the transition zone 21 conforms to the characteristics of fluid mechanics, and can reduce the resistance to the coolant.

[0087] One or more rotating blades 23 are provided in the transition zone 21. If multiple rotating blades 23 are provided, the number of rotating blades 23 is preferably an even number. Turbulence is an unstable state of fluid motion, which will cause energy loss and pressure fluctuations in the sub-channel 15. Providing multiple rotating blades 23 can change the flow rate and direction of the coolant in the coolant flow channel 5, thereby adjusting the speed of the coolant and reducing the turbulence.

[0088] The rotating motion of the rotating blades 23 can stratify the coolant and reduce the generation and propagation of turbulence, thereby making the distribution of the coolant more uniform and the flow of the coolant more stable.

[0089] The transition area 21 of the coolant flow channel 5 has a streamlined characteristic, while the non-transition area 22 of the coolant flow channel 5 does not have a streamlined characteristic.

[0090] The curvature can reflect the degree of curvature of the curve, and the curvature is equal to the inverse of the radius of curvature of the circle, that is, the larger the radius of curvature of the circle, the flatter the curve and the smaller the curvature, and the smaller the radius of curvature of the circle, the more curved the curve and the larger the curvature. The cross-sectional size of the non-transition zone 22 of the coolant flow channel 5 is less than 1 mm, and mm in the present invention represents millimeter.

[0091] When the cross-sectional dimension of the non-transition zone 22 of the coolant flow channel 5 is less than 1 mm, the cross-sectional dimension of the transition zone 21 of the coolant flow channel 5 is in the range of greater than 0 mm and less than or equal to 1 mm. The curvature radius of the transition zone 21 of the coolant flow channel 5 is in the range of greater than 0 mm and less than or equal to 0.5 mm. The curvature of the transition zone 21 of the coolant flow channel 5 is in the range of greater than or equal to 2 mm. -1 , the upper limit of the curvature range of the transition zone 21 of the coolant flow channel 5 is set to 5 mm -1 , the curvature range of the transition zone 21 of the coolant flow channel 5 is limited to be greater than or equal to 2 mm -1 , and less than or equal to 5mm -1 Within the range of , the curvature of the transition zone 21 is ensured to be greater than the curvature of the non-transition zone 22 , and the transition zone 21 expands outwardly so as to provide a plurality of rotating blades 23 in the transition zone 21 , so that the rotating blades 23 can rotate in the transition zone 21 .

[0092] In this embodiment, the cross-sectional size of the non-transition zone 22 of the coolant flow channel 5 is 0.6 mm, and the cross-sectional size of the transition zone 21 of the coolant flow channel 5 is 0.8 mm. Then, the curvature radius of the transition zone 21 of the coolant flow channel 5 is 0.4 mm, and the curvature of the transition zone 21 is 2.5 mm. -1 .

[0093] This embodiment uses a triangular guide 19 to guide the coolant in the coolant flow channel 5, which can reduce the resistance encountered by the coolant when it flows and increase the flow speed of the coolant. This embodiment also has multiple heat dissipation pads 20 arranged at intervals on the side walls of the coolant flow channel 5 to improve the effect of heat dissipation of the coolant, increase the viscosity coefficient of the coolant, and reduce the Reynolds coefficient of the coolant when it flows in the coolant flow channel 5, so that the flow mode of the coolant in the coolant flow channel 5 is laminar. In combination with the guide 19 and the heat dissipation pad 20, the flow mode and flow speed of the coolant can be taken into account, thereby reducing the energy consumption caused by resistance when the coolant flows while maintaining a high heat dissipation efficiency of the coolant.

[0094] Example 6

[0095] like Figure 1-Figure 4 As shown, this embodiment provides an electronic device, including the three-dimensional packaging structure of the power module described in any one of Embodiments 1 to 5, and also includes a cover plate 16, and the two sides of the cover plate 16 are respectively connected to the shell 17, and the cover plate 16 is connected to the terminal 18.

[0096] The cover plate 16 and the shells 17 on both sides enclose a sealed space, and the three-dimensional packaging structure of the power module of the present invention is arranged in the sealed space. The terminals 18 are used to further fix the cover plate 16 to enhance the stability of the electronic device.

[0097] The electronic device of this embodiment has a three-dimensional packaging structure for power modules, which can dissipate heat for two power modules 4 at the same time. The structure is symmetrical and does not require an additional radiator. A coolant channel 5 is opened on the basis of the original structure, thereby improving the heat dissipation efficiency while ensuring the miniaturization of the three-dimensional structure.

[0098] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps set forth in these embodiments do not limit the scope of the application. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a restriction. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once a certain item is defined in an accompanying drawing, it does not need to be further discussed in the subsequent accompanying drawings.

[0099] It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures would then be positioned "below" or "below" the other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0100] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0101] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A three-dimensional packaging structure of a power module, characterized in that: It includes a substrate, both sides of which are provided with a first copper-clad layer; the first copper-clad layer is in contact with a ceramic layer, and a power module is provided on the side of the ceramic layer away from the first copper-clad layer; a coolant flow channel is formed between the substrate and the first copper-clad layers on both sides, and a coolant circulates through the coolant flow channel to take away the heat transferred from the power module to the ceramic layers on both sides of the substrate; a plurality of guide members are provided in the coolant flow channel, and a plurality of heat dissipation pads are provided on the side walls of the coolant flow channel.

2. The three-dimensional packaging structure of the power module according to claim 1, characterized in that: The power module comprises a chip, and a second copper cladding layer is connected to a side of the chip close to the ceramic layer.

3. The three-dimensional packaging structure of the power module according to claim 2, characterized in that: A soldering layer is arranged between the chip and the second copper cladding layer.

4. The three-dimensional packaging structure of the power module according to claim 2, characterized in that: The ceramic layer, the first copper-clad layer and the second copper-clad layer are all made by a direct copper-clad process.

5. The three-dimensional packaging structure of the power module according to claim 1, characterized in that: A first channel is formed on a side of the substrate close to the first copper-clad layer, and a second channel is formed on a side of the first copper-clad layer close to the substrate. The first channel and the second channel are adapted to form the coolant flow channel.

6. The three-dimensional packaging structure of the power module according to claim 5, characterized in that: The first channel and the second channel are both spaced apart by a plurality of partition plates, and the partition plates divide the first channel and the second channel into a plurality of sub-channels.

7. The three-dimensional packaging structure of the power module according to claim 6, characterized in that: A plurality of the sub-channels are connected end to end to allow the coolant to flow through.

8. The three-dimensional packaging structure of the power module according to claim 2, characterized in that: It also includes a bonding wire, a first end of which is connected to the chip, and a second end of which is connected to the second copper cladding layer.

9. The three-dimensional packaging structure of the power module according to claim 1, characterized in that: A first positioning block is disposed on a side of the substrate close to the first copper clad layer, and the first positioning block is connected to a plurality of second positioning blocks on the first copper clad layer.

10. The three-dimensional packaging structure of the power module according to claim 1, characterized in that: Along the flow direction of the coolant, the cross-sectional size of the flow guide gradually decreases.

11. The three-dimensional packaging structure of the power module according to claim 1, characterized in that: A plurality of heat dissipation gaskets are arranged at intervals on the side wall of the coolant flow channel, the thermal conductivity of the heat dissipation gaskets is greater than the thermal conductivity of the side wall of the coolant flow channel, and the heat dissipation gaskets are used to cool the coolant in the coolant flow channel to reduce the Reynolds coefficient of the coolant.

12. An electronic device, characterized in that: It comprises the three-dimensional packaging structure of the power module according to any one of claims 1 to 11, and also comprises a cover plate, wherein two sides of the cover plate are respectively connected to the shell, and the cover plate is connected to terminals.

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