Millimeter wave phased-array antenna PCB laminated structure and preparation method thereof
By designing a multi-layered millimeter wave phased array antenna PCB stack structure, integrating array element layer, digital control-power layer and RF power layer, the problems of large module thickness, complex assembly and low reliability in the existing technology are solved, and the effects of thin thickness, simple assembly and strong reliability are achieved.
CN119695481APending Publication Date: 2025-03-25GUANGZHOU HAIGE COMMUNICATION GROUP INCORPORATED COMPANY
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Patent Information
- Application Number
- CN202411893921.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
The existing millimeter wave phased array antenna module has large thickness, complex assembly and low reliability.
Method used
A millimeter wave phased array antenna PCB stack structure is designed, and the integrated array element layer, digital control-power layer and radio frequency power layer are designed through multi-layer superposition to optimize the pressing order and punching order of the electrical layer, and simplify the processing technology.
Benefits of technology
A millimeter wave phased array antenna PCB stack structure with thin thickness, simple assembly and strong reliability is realized, which reduces the overall thickness, optimizes space utilization, simplifies the assembly process, and improves production efficiency and reliability.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of communication equipment, and provides a millimeter wave phased-array antenna PCB laminated structure and a preparation method thereof. The millimeter wave phased array antenna PCB laminated structure comprises an array element layer, a digital control-power supply layer, a radio frequency power layer and a PCB bottom layer, the array element layer comprises a radiation patch layer, a coupling feed layer and a reference ground layer which are arranged in a stacked mode, the digital control-power supply layer comprises a first ground layer, a digital signal wiring layer and a power supply layer which are arranged in a stacked mode, a radio frequency power division network circuit is arranged on the radio frequency power division layer, and the PCB bottom layer, the radio frequency power division layer, the digital control-power supply layer and the array element layer are sequentially arranged in a stacked mode. And a second ground layer is arranged between the radio frequency power layer and the PCB bottom layer. The millimeter wave phased-array antenna PCB laminated structure provided by the invention has the advantages of small thickness, simple assembly, high reliability and the like. Through the multi-layer superposition design, the functional modules are integrated on one PCB, space utilization is optimized, the external connection problem in the traditional design is avoided, the assembly process is simplified, and the production efficiency is improved.
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