Circuit board and electronic equipment

Abstract

The invention relates to the field of circuit boards, and discloses a circuit board and a driving board. The circuit board comprises a substrate, a pad structure and a driving chip, the pad structure and the driving chip are arranged on the same layer of the substrate, the pad structure comprises a first pad, a second pad and a pad unit, the first pad comprises a first fixed welding point, a first selected welding point and a first resistance welding area, the first fixed welding point is electrically connected with the first selected welding point and an input pin of the driving chip, and the second welding point is electrically connected with the second selected welding point. The second bonding pad comprises a second fixed welding spot, a second selected welding spot and a second resistance welding area, the second fixed welding spot is electrically connected with the second selected welding spot and an output pin of the driving chip, the bonding pad unit comprises a third selected welding spot and a fourth selected welding spot which are electrically connected, the third selected welding spot is arranged on the side, away from the first fixed welding spot, of the first selected welding spot, and the fourth selected welding spot is arranged on the side, away from the first fixed welding spot, of the second selected welding spot. The fourth selective welding point is arranged on the side, away from the second fixed welding point, of the second selective welding point. Therefore, according to the embodiment of the invention, whether the driving chip is loaded or not can be determined on the same layer of the circuit board by selectively welding each selective welding point.

Description

Technical Field

[0001] The present invention relates to the field of circuit boards, and in particular to a circuit board and electronic equipment. Background Art

[0002] Currently, when signal traces on a circuit board are too long, a driver chip is often added to the high-speed signal path to prevent signal attenuation. The signal from the signal trace is amplified by the driver chip before being output, thereby improving the signal quality of the signal trace.

[0003] To meet actual user needs, the driver chip remains on the circuit board during the R&D phase. If the user requires signal enhancement, the signal traces are soldered to the driver chip during production, and the driver chip is shipped. If the user does not require signal enhancement, the signal traces are not soldered to the driver chip during production, and the driver chip is not shipped.

[0004] During the R&D phase of a design, signal traces are typically reserved for connecting to the driver chip to facilitate chip assembly. However, if the driver chip is not assembled, there is no more space on the same PCB layer for direct signal traces. Therefore, the signal traces must be routed through a via to another layer for direct connection, then exited through another via. This can affect signal quality and reduce performance stability. Summary of the Invention

[0005] An object of the embodiments of the present invention is to provide a circuit board and an electronic device that can solve the defects in the prior art.

[0006] In a first aspect, an embodiment of the present invention provides a circuit board, including:

[0007] a substrate, on which a driver chip is disposed;

[0008] The pad structure is provided on the same layer of the substrate as the driver chip, and the pad structure includes:

[0009] A first solder pad is provided at the input pin of the driver chip; the first solder pad includes a first fixed solder point, a first optional solder point and a first solder resist area; the first solder resist area is provided between the first fixed solder point and the first optional solder point, and the first fixed solder point is electrically connected to the first optional solder point and the input pin of the driver chip respectively;

[0010] a second solder pad, provided at an output pin corresponding to an input pin of the driver chip, the second solder pad comprising a second fixed solder point, a second optional solder point, and a second solder resist area; the second solder resist area being provided between the second fixed solder point and the second optional solder point, the second fixed solder point being used to electrically connect to the second optional solder point and the output pin of the driver chip, respectively;

[0011] The pad unit includes an electrically connected third selective welding point and a fourth selective welding point; the third selective welding point is arranged on a side of the first selective welding point away from the first fixed welding point; the fourth selective welding point is arranged on a side of the second selective welding point away from the second fixed welding point; when the driver chip is mounted, the first selective welding point is disconnected from the third selective welding point, and the second selective welding point is disconnected from the fourth selective welding point; when the driver chip is not mounted, the first selective welding point is electrically connected to the third selective welding point, and the second selective welding point is electrically connected to the fourth selective welding point.

[0012] Optionally, the pad unit includes a third pad and a fourth pad;

[0013] The third selected soldering point is the soldering point of the third soldering pad; the third selected soldering point is the soldering point of the fourth soldering pad, and the first selected soldering point and the second selected soldering point are directly connected by a trace.

[0014] Optionally, the pad unit includes a fifth pad; the fifth pad includes a first solder point and a second solder point that are electrically connected; the first solder point is a third selected solder point, and the second solder point is a fourth selected solder point.

[0015] Optionally, the widths of the first solder resist area and the second solder resist area are greater than or equal to a minimum distance allowed for solder resist filling.

[0016] Optionally, the width of the first solder resist area and the second solder resist area is a first threshold.

[0017] Optionally, a width between the first selected solder point and the third selected solder point and a width between the second selected solder point and the fourth selected solder point are smaller than a minimum distance allowing solder resist filling.

[0018] Optionally, the width between the first selected welding point and the third selected welding point is a second threshold.

[0019] Optionally, the width between the second selected welding point and the fourth selected welding point is a third threshold.

[0020] Optionally, a ground pad is further included, and the ground pad is used to be electrically connected to the driver chip.

[0021] In a second aspect, an embodiment of the present invention provides an electronic device including the circuit board described above.

[0022] In the circuit board provided in the embodiment of the present invention, the circuit board includes a substrate, a pad structure and a driver chip. The pad structure and the driver chip are arranged on the same layer of the substrate. The pad structure includes a first pad, a second pad and a pad unit. The first pad is arranged at the input pin of the driver chip. The first pad includes a first fixed solder point, a first selective solder point and a first solder resist area. The first solder resist area is arranged between the first fixed solder point and the first selective solder point. The first fixed solder point can be electrically connected to the first selective solder point and the input pin of the driver chip respectively. The second pad is arranged at the output pin corresponding to the input pin of the driver chip. The second pad includes a second fixed solder point, a second selective solder point and a second solder resist area. The second solder resist area is arranged between the second fixed solder point and the second optional solder point, the second fixed solder point can be respectively electrically connected to the second optional solder point and the output pin of the driving chip, the pad unit includes an electrically connected third optional solder point and a fourth optional solder point, the third optional solder point is arranged on the side of the first optional solder point away from the first fixed solder point, the fourth optional solder point is arranged on the side of the second optional solder point away from the second fixed solder point, when the driving chip is mounted, the first optional solder point is disconnected from the third optional solder point, and the second optional solder point is disconnected from the fourth optional solder point, when the driving chip is not mounted, the first optional solder point is electrically connected to the third optional solder point, and the second optional solder point is electrically connected to the fourth optional solder point. On the one hand, this embodiment can determine whether the driver chip is mounted or not on the same layer of the circuit board by selectively welding each selective welding point. When the driver chip is not mounted, the signal routing does not need to be changed to other layers for direct connection, thereby improving the signal quality. On the other hand, this embodiment sets a solder resist area between the first fixed welding point and the first selective welding point and between the second fixed welding point and the second selective welding point. When the driver chip is mounted, it can avoid the first fixed welding point and the third selective welding point being mistakenly connected during the welding of the first fixed welding point or the second fixed welding point and the fourth selective welding point being mistakenly connected during the welding of the second fixed welding point, thereby helping to improve the reliability of the driver chip mounting. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] One or more embodiments are illustrated only as examples through the pictures in the corresponding drawings, and these exemplary descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute a scale limitation.

[0024] Figure 1 This is a schematic structural diagram of a circuit board provided by an embodiment of the present invention;

[0025] Figure 2 This is a structural diagram of a circuit board provided by the prior art;

[0026] Figure 3 This is a schematic structural diagram of a circuit board provided by an embodiment of the present invention;

[0027] Figure 4is a structural schematic diagram of a circuit board provided by another embodiment of the present invention;

[0028] Figure 5 This is a structural diagram of a circuit board provided by another embodiment of the present invention;

[0029] Figure 6 This is a structural diagram of a circuit board provided by another embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] It should be noted that, unless there is a conflict, the various features of the embodiments of the present invention may be combined with each other and are all within the scope of protection of the present invention. In addition, although the functional modules are divided in the device schematics and the logical order is shown in the flow charts, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flow charts. Furthermore, the terms "first," "second," "third," etc. used in the present invention do not limit the data or execution order, but only distinguish between identical or similar items with substantially the same functions and effects.

[0032] An embodiment of the present invention provides a circuit board. Figure 1 and Figure 3 The circuit board 100 includes a substrate 11 , a driving chip 12 and a pad structure 13 .

[0033] The substrate 11 is a support carrier that connects electronic components and circuits together, and is used to realize functions such as layout design of complex circuits and electrical signal transmission in electrical and electronic equipment.

[0034] Substrate 11 is the basic material for manufacturing circuit board 100. Typically, substrate 11 is a copper-clad laminate (CCL). During the manufacturing process of circuit board 100, the desired circuit pattern is obtained by selectively performing hole processing, chemical copper plating, electrolytic copper plating, and etching on the substrate material, the CCL.

[0035] Substrate 11 can be a circuit board comprising any number of layers. For example, substrate 11 includes single-layer circuit boards, double-layer circuit boards, multi-layer circuit boards, and the like. In a single-layer circuit board, the components are concentrated on one side, while the conductors are concentrated on the other side. Double-layer circuit boards are typically used when single-layer wiring cannot meet the needs of electronic products. Double-layer circuit boards have copper cladding and wiring on both sides, and vias can be used to connect the circuits between the two layers. A multi-layer circuit board refers to a circuit board having three or more layers of conductive patterns laminated with insulating materials between them, and the conductive patterns therein are interconnected as required.

[0036] During the process of manufacturing the substrate 11 , a protective layer is usually provided to prevent physical disconnection of the conductive circuit, to prevent short circuits caused by bridging during the soldering process, and to protect the formed circuit pattern for a long time.

[0037] A protective layer is formed by applying solder resist to circuit boards and substrates that don't require soldering. Solder resist comes in a variety of colors, including red, blue, green, purple, white, and black. Green solder resist, also known as solder mask oil, is commonly used in PCB manufacturing. Solder mask oil is an acrylic oligomer that acts as a liquid photoresist.

[0038] Signal traces are distributed on the substrate 11. The signal traces are used to transmit any signal such as power signals, analog signals, high-speed signals, clock signals, differential signals, synchronization signals, etc.

[0039] The driver chip 12 is disposed on the substrate 11 and can be connected to the signal lines. When the driver chip 12 is connected to the signal lines, the driver chip 12 can amplify the weak signal input through the signal lines to a sufficiently strong signal, thereby facilitating driving the device to be driven.

[0040] The driver chip 12 includes a plurality of input pins and a plurality of output pins. The input pins correspond to the output pins one by one. For example, Figure 1 As shown, the driver chip 12 includes eight pin units 121 , and each pin unit 121 includes a corresponding input pin 1211 and an output pin 1212 .

[0041] Each pin unit 121 can be connected to a signal line. In the production stage, when each pin unit 121 is welded to a signal line, the driver chip 12 is mounted. Figure 1As shown, each signal trace includes an input portion and an output portion. The input portion of each signal trace is connected to an input pin 1211 of a pin unit 121. The output portion is connected to an output pin 1212 corresponding to the input pin 1211 connected to the input portion. The signal of each signal trace enters the driver chip 12 through the input portion, and the driver chip 12 amplifies the signal and outputs it to the output portion of the corresponding signal trace.

[0042] See also Figure 2 , Figure 2 The present invention provides a schematic diagram of the structure of a circuit board. Figure 2 As shown in the figure, during the R&D stage, the input portion of the signal trace is electrically connected to the overlapping pads of the resistor and capacitor pads, and is electrically connected to the pads corresponding to the input pins of the driver chip through the capacitor. The output portion of the signal trace is connected to the pads corresponding to the output pins of the driver chip, and is connected to the overlapping pads of the resistor and capacitor pads through the capacitor.

[0043] During the production stage, if the driver chip needs to be installed, after the driver chip is soldered, the signal of the input part of the signal trace can enter the driver chip through the input pin of the driver chip. After the driver chip enhances the input signal, it is output to the output part of the signal trace through the output pin of the driver chip.

[0044] If the driver chip does not need to be installed, the input part of the signal trace needs to be connected to the output part of the signal trace through a resistor, so that the signal of the input part of the signal trace does not enter the driver chip. Since this connection can no longer be achieved on the same layer of the circuit board, the connection between the resistors needs to be changed to another layer for connection. In this way, the input part of the signal trace is directly connected to the output part of the signal trace. The input part of the signal trace will be directly connected to the output part of the signal trace through the resistor. After soldering the driver chip, the signal of the input part of the signal trace is directly transmitted to the output part of the signal trace through the resistor.

[0045] When the driver chip is not installed, the input part of the signal line needs to be switched to other layers through resistors for connection and then connected to the output part of the signal line. Therefore, this method not only requires setting resistors, but also requires switching to other layers for connection between resistors. On the one hand, it will increase the cost, and on the other hand, the signal quality of the signal line will be reduced due to the layer change connection.

[0046] In order to solve the above problems, an embodiment of the present invention provides a circuit board, which can realize the installation and non-installation of the driver chip on the same layer of the circuit board. When the driver chip is not installed, the signal routing does not need to be changed to other layers for direct connection, thereby improving the signal quality.

[0047] like Figure 3As shown, the pad structure 13 is disposed on the same layer of the substrate 11. The pad structure 13 includes a first pad 131, a second pad 132 and a pad unit 133.

[0048] The first pad 131 may be disposed on the input pin 1211 of the driver chip 12 . The first pad 131 includes a first fixed solder point 1311 , a first selective solder point 1312 , and a first solder resist area 1313 .

[0049] First fixed soldering point 1311 is a copper-exposed soldering point that requires soldering regardless of whether the driver chip 12 is mounted or not. First optional soldering point 1312 is a copper-exposed soldering point whose need for soldering is determined based on the mounting requirements of the driver chip 12. First fixed soldering point 1311 is electrically connected to first optional soldering point 1312 and input pin 1211 of the driver chip 12.

[0050] The first solder resist 1313 is disposed between the first fixed solder joint 1311 and the first selective solder joint 1312. During the production stage, when the first fixed solder joint 1311 is soldered but the first selective solder joint 1312 is not soldered, the first solder resist 1313 can be used to prevent the soldering material of the first fixed solder joint 1311 from flowing into the first selective solder joint 1312.

[0051] The second pad 132 can be disposed on the output pin 1212 of the driver chip 12 . The second pad 132 includes a second fixed solder point 1321 , a second selective solder point 1322 , and a second solder resist area 1323 .

[0052] Second fixed soldering point 1321 is a copper-exposed soldering point that requires soldering regardless of whether the driver chip 12 is being mounted or not. Second optional soldering point 1322 is a copper-exposed soldering point whose need for soldering is determined based on the mounting requirements of the driver chip 12. Second fixed soldering point 1321 is electrically connected to second optional soldering point 1322 and output pin 1212 of the driver chip 12.

[0053] The second solder resist 1323 is disposed between the second fixed solder point 1321 and the second selective solder point 1322. During the production stage, when the second fixed solder point 1321 is soldered but the first selective solder point 11222 is not soldered, the second solder resist 1323 can be used to prevent the soldering material of the second fixed solder point 1321 from flowing into the second selective solder point 1322.

[0054] The pad unit 133 includes a third selective soldering point 1331 and a fourth selective soldering point 1332 that are electrically connected.

[0055] The third selective soldering point 1331 is a soldering end that determines whether soldering is required based on the mounting requirements of the driver chip 12. The third selective soldering point 1331 is disposed on a side of the first selective soldering point 1312 away from the first fixed soldering point 1311.

[0056] The fourth selected soldering point 1332 is a soldering end for determining whether soldering is required based on the mounting requirements of the driver chip 12 . The fourth selected soldering point 1332 is disposed on a side of the second selected soldering point 1322 away from the second fixed soldering point 1321 .

[0057] When the driver chip 12 is installed, the input portion of the signal trace is soldered to the first fixed solder point 1311, and the output portion of the signal trace is soldered to the second fixed solder point 1321. The first optional solder point 1312, the third optional solder point 1331, the second optional solder point 1322, and the fourth optional solder point 1332 are not soldered. At this point, the signal from the input portion of the signal trace enters the driver chip 12 through the input pin 1211 of the driver chip 12. The driver chip 12 amplifies the input signal and transmits it to the output portion of the signal trace through the output pin 1212 of the driver chip 12.

[0058] Due to the soldering resistance of the first solder resist area 1313, the soldering material of the first fixed solder point 1311 can be prevented from flowing into the first selected solder point 1312 and the third selected solder point 1331, thereby preventing the first selected solder point 1312 from being mistakenly connected to the third selected solder point 1331. Similarly, due to the soldering resistance of the second solder resist area 1323, the soldering material of the second fixed solder point 1321 can be prevented from flowing into the second selected solder point 1322 and the fourth selected solder point 1332, thereby preventing the second selected solder point 1322 from being mistakenly connected to the fourth selected solder point 1332. Therefore, in this way, the first fixed soldering point 1311, the first optional soldering point 1312, the fourth optional soldering point 1332, the second optional soldering point 1322 and the second fixed soldering point 1321 can be prevented from forming an electrical connection path, thereby ensuring that the signal of the input part of the signal line only enters the driver chip 12 through the input pin 1211 of the driver chip 12 and is transmitted to the output part of the signal line through the output pin 1212 of the driver chip 12, which is beneficial to improving the reliability of the driver chip 12.

[0059] When the driver chip 12 is not required to be installed, the input portion of the signal trace is soldered to the first fixed soldering point 1311, the first optional soldering point 1312 is soldered to the third optional soldering point 1331, the fourth optional soldering point 1332 is soldered to the second optional soldering point 1322, and the second fixed soldering point 1321 is soldered to the output portion of the signal trace. At this point, the first fixed soldering point 1311, the first optional soldering point 1312, the third optional soldering point 1331, the fourth optional soldering point 1332, the second optional soldering point 1322, and the second fixed soldering point 1321 form an electrical connection path. The signal from the input portion of the signal trace is transmitted to the output portion of the signal trace through the electrical connection path. At this point, the signal from the signal trace does not enter the driver chip 12.

[0060] Therefore, in this way, when the driver chip 12 is not required to be installed, the signal routing does not need to be switched to other layers through resistors for direct connection. Since the resistors are omitted, the cost can be reduced. At the same time, since there is no need to change layers for connection, it is beneficial to improve the signal quality of the signal routing.

[0061] In some embodiments, the first solder resist area 1313 and the second solder resist area 1323 are used to fill solder resist.

[0062] As mentioned above, when the driver chip 12 needs to be mounted, the first fixed solder joint 1311 and the second fixed solder joint 1321 need to be soldered, while the first optional solder joint 1312 and the second optional solder joint 1322 do not need to be soldered. Therefore, by filling the first solder resist area 1313 between the first fixed solder joint 1311 and the first optional solder joint 1312 with solder resist, and filling the second solder resist area 1323 between the second fixed solder joint 1321 and the second optional solder joint 1322 with solder resist, the insulation between the first fixed solder joint 1311 and the first optional solder joint 1312, and the insulation between the second fixed solder joint 1321 and the second optional solder joint 1322 can be improved, thereby facilitating the reliability of mounting the driver chip 12.

[0063] Since solder resist has a minimum distance allowed for filling, the area between different solder joints can only be filled when the width between different solder joints is greater than or equal to the minimum distance allowed for solder resist filling. When the width between different solder joints is less than the minimum distance allowed for solder resist filling, the area between different solder joints cannot be filled.

[0064] Therefore, in order to ensure that the first solder resist area 1313 and the second solder resist area 1323 can be reliably filled with solder resist, in some embodiments, such as Figure 3 As shown, the width W1 of the first solder resist area 1313 and the second solder resist area 1323 is greater than or equal to the minimum distance allowed for solder resist filling.

[0065] In some embodiments, the width W1 of the first solder resist area 1313 and the second solder resist area 1323 is a first threshold value, wherein the first threshold value can be freely set according to actual needs, as long as the first threshold value is greater than or equal to the minimum distance allowed for solder resist filling.

[0066] For example, in conventional processes, the minimum distance allowed for solder resists such as solder resist green oil to be filled is 2.5 mils. Therefore, the first threshold value needs to be greater than or equal to 2.5 mils.

[0067] In some embodiments, the first threshold is 3 mils.

[0068] Since when the driver chip 12 is not required to be mounted, the first welding point 1312, the third welding point 1331, the second welding point 1322 and the fourth welding point 1332 all need to be welded so that the first welding point 1312 is electrically connected to the third welding point 1331, and the second welding point 1322 is electrically connected to the fourth welding point 1332. Therefore, in order to prevent the first welding point 1312 and the third welding point 1331 from being connected unreliably, and the second welding point 1322 and the fourth welding point 1332 from being connected unreliably after the first welding point 1312 and the third welding point 1331 are welded, and the second welding point 1322 and the fourth welding point 1332 are welded, in some embodiments, the width between the first welding point 1312 and the third welding point 1331, and the width between the second welding point 1322 and the fourth welding point 1332 meet the short-circuit distance requirements, so as to achieve short-circuit between the first welding point 1312 and the third welding point 1331 after welding, and achieve short-circuit between the second welding point 1322 and the fourth welding point 1332 after welding.

[0069] For example, the solder resist has a minimum distance allowed for filling, in order to prevent the area between the first selected solder joint 1312 and the third selected solder joint 1331, and the area between the second selected solder joint 1322 and the fourth selected solder joint 1332 from being filled with solder resist, thereby affecting the short circuit between the first selected solder joint 1312 and the third selected solder joint 1331, and the short circuit between the second selected solder joint 1322 and the fourth selected solder joint 1332. Please continue to refer to Figure 3 , a width W2 between the first selected solder joint 1312 and the third selected solder joint 1331 , and a width W3 between the second selected solder joint 1322 and the fourth selected solder joint 1332 are less than a minimum distance allowing solder resist filling.

[0070] In some embodiments, the width W2 between the first selective soldering point 1312 and the third selective soldering point 1331 is the second threshold. The first threshold can be freely set according to actual needs, as long as the second threshold is greater than or equal to the minimum distance allowed for solder resist filling.

[0071] In some embodiments, the width W3 between the second selected solder joint 1322 and the fourth selected solder joint 1332 is a third threshold value. The third threshold value can be freely set according to actual needs, as long as the second threshold value is greater than or equal to the minimum distance allowed for solder resist filling.

[0072] For example, in conventional processes, the minimum distance allowed for solder resist such as solder resist green oil to be filled is 2.5 mils. Therefore, the second threshold and the third threshold need to be less than or equal to 2.5 mils.

[0073] In some embodiments, the second threshold and the third threshold are 2.5 mils.

[0074] In some embodiments, the pad unit 133 provides a third selected solder point 1331 and a fourth selected solder point 1332 by using different pads. Figure 4 , the pad unit 133 includes a third pad 1333 and a fourth pad 1334 .

[0075] The soldering point of the third soldering pad 1333 is the third selected soldering point 1331 of the soldering pad unit 133 .

[0076] The solder point of the fourth solder pad 1334 is the fourth selected solder point 1332 of the solder pad unit 133 , and the solder point of the fourth solder pad 1334 is directly connected to the solder point of the third solder pad 1333 by a trace.

[0077] When the driver chip 12 is not required to be mounted, the first selected soldering point 1312 is soldered to the soldering point of the third soldering pad 1333, and the soldering point of the fourth soldering pad 1334 is soldered to the second selected soldering point 1322. At this time, the input portion of the signal trace, the first fixed soldering point 1311, the first selected soldering point 1312, the soldering point of the third soldering pad 1333, the direct connection trace, the soldering point of the fourth soldering pad 1334, the second selected soldering point 1322, the second fixed soldering point 1321, and the output portion of the signal trace form an electrical connection path.

[0078] In some embodiments, the pad unit 133 provides the third selected soldering point 1331 and the fourth selected soldering point 1332 through a single pad. Figure 5 , the pad unit 133 includes a fifth pad 1335 .

[0079] The fifth pad 1335 includes a first solder point and a second solder point that are electrically connected. The first solder point is the third selected solder point 1331 of the pad unit 133 , and the second solder point is the fourth selected solder point 1332 of the pad unit 133 .

[0080] When the driver chip 12 is not required to be mounted, the first selected soldering point 1312 is soldered to the first soldering point (third selected soldering point 1331), and the second soldering point (fourth selected soldering point 1332) is soldered to the second selected soldering point 1322. At this point, the input portion of the signal trace, the first fixed soldering point 1311, the first selected soldering point 1312, the first soldering point, the second soldering point, the second selected soldering point 1322, the second fixed soldering point 1321, and the output portion of the signal trace form an electrical connection path.

[0081] Since the driver chip 12 easily generates heat during operation, if the heat of the driver chip 12 cannot be effectively dissipated, the operating stability of the driver chip 12 will be adversely affected.

[0082] In some embodiments, in order to facilitate heat dissipation of the driver chip 12, please refer to Figure 6 The circuit board 100 further includes a ground pad 14 .

[0083] The ground pad 14 can be electrically connected to the driver chip 12. The ground pad 14 is used to conduct heat from the driver chip 12 to the metal plane connected to it. If the metal plane is connected to the housing metal or external metal frame, the heat is further conducted to the outside.

[0084] The ground pad 14 can be one or more, for example, the ground pad 14 can be 2, 4, 6, etc. The number of the ground pad 14 can be set according to actual needs, such as Figure 6 As mentioned above, the number of the ground pads 14 is five.

[0085] As another aspect of an embodiment of the present invention, an electronic device is provided. The electronic device includes the circuit board 100 described above.

[0086] Finally, it should be noted that the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments do not serve as additional limitations on the content of the present invention. The purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of the present invention. In addition, under the concept of the present invention, the above-mentioned technical features can continue to be combined with each other, and there are many other variations of the different aspects of the present invention as described above, all of which are considered to be within the scope of the description of the present invention. Furthermore, it is obvious to those skilled in the art that improvements or modifications can be made based on the above description, and all such improvements and modifications should fall within the scope of protection of the claims appended to the present invention.

Claims

1. A circuit board, characterized in that: include: A substrate, on which a driving chip is arranged; A pad structure is disposed on the same layer of the substrate as the driver chip, and the pad structure includes: A first solder pad is arranged at the input pin of the driving chip; the first solder pad comprises a first fixed solder point, a first selective solder point and a first solder resist area; the first solder resist area is arranged between the first fixed solder point and the first selective solder point, and the first fixed solder point is electrically connected to the first selective solder point and the input pin of the driving chip respectively; A second solder pad is arranged at an output pin corresponding to an input pin of the driver chip; the second solder pad comprises a second fixed solder point, a second selective solder point and a second solder resist area; the second solder resist area is arranged between the second fixed solder point and the second selective solder point, and the second fixed solder point is electrically connected to the second selective solder point and the output pin of the driver chip respectively; The pad unit includes a third selective welding point and a fourth selective welding point which are electrically connected; the third selective welding point is arranged on a side of the first selective welding point away from the first fixed welding point; the fourth selective welding point is arranged on a side of the second selective welding point away from the second fixed welding point; when the driver chip is mounted, the first selective welding point is disconnected from the third selective welding point, and the second selective welding point is disconnected from the fourth selective welding point; when the driver chip is not mounted, the first selective welding point is electrically connected to the third selective welding point, and the second selective welding point is electrically connected to the fourth selective welding point.

2. The circuit board according to claim 1, characterized in that: The pad unit includes a third pad and a fourth pad; The third selected soldering point is a soldering point of the third soldering pad; the third selected soldering point is a soldering point of the fourth soldering pad, and the first selected soldering point is directly connected to the second selected soldering point by a wiring.

3. The circuit board according to claim 1, characterized in that: The pad unit includes a fifth pad; the fifth pad includes a first solder point and a second solder point that are electrically connected; the first solder point is the third selected solder point, and the second solder point is the fourth selected solder point.

4. The circuit board according to claim 1, characterized in that: The widths of the first solder resist area and the second solder resist area are greater than or equal to a minimum distance allowed for solder resist filling.

5. The circuit board according to claim 4, characterized in that: The widths of the first solder resist area and the second solder resist area are a first threshold.

6. The circuit board according to claim 1, characterized in that: A width between the first selective soldering point and the third selective soldering point and a width between the second selective soldering point and the fourth selective soldering point are smaller than a minimum distance allowing solder resist filling.

7. The circuit board according to claim 1, characterized in that: The width between the first selective welding point and the third selective welding point is a second threshold.

8. The circuit board according to claim 1, characterized in that: The width between the second selected welding point and the fourth selected welding point is a third threshold.

9. The circuit board according to any one of claims 1 to 8, characterized in that: It also includes a ground pad, which is used to be electrically connected to the driving chip.

10. An electronic device, characterized in that: Comprising the circuit board as claimed in any one of claims 1 to 9.

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