Circuit board assembly and manufacturing method thereof

Abstract

The invention provides a circuit board assembly. The circuit board assembly comprises a first circuit board. The first circuit board comprises a first substrate, a first circuit structure, a first magnetic layer and a connecting column. The first circuit structure is connected with the first substrate. The first magnetic layer is connected with the first circuit structure, and the first magnetic layer is not electrically connected with the first circuit structure. The connecting column is connected with the first circuit structure, the connecting column extends from the first circuit structure to the first magnetic layer and penetrates out of the first magnetic layer, and the connecting column is electrically connected with the first circuit structure. Therefore, the circuit board assembly can be connected and positioned with other circuit board assemblies through the absorption effect of the magnetic absorption layer, so that a more flexible configuration mode can be obtained.

Description

Technical Field

[0001] The present application relates to a circuit board assembly and a manufacturing method thereof, and more particularly to a circuit board assembly assembled by magnetic force and a manufacturing method thereof. Background Art

[0002] With the rapid development of technology, printed circuit boards are also constantly developing towards high density and high reliability, so the connection technology between different circuit boards is becoming more and more important. Existing circuit board connection technologies include anisotropic conductive film (ACF) bonding, hot bar welding (HotBar) and board to board (BTB) connection, but in view of the future development needs of high-density integration, the above connection technologies all have certain technical limitations. Furthermore, when using anisotropic conductive film bonding, hot bar welding and board to board connection, a certain space must be reserved on the circuit board for the installation of assembly parts, and the use of assembly parts as connections also brings limitations and defects to the assembly of the circuit board.

[0003] If the above connection technology is used, there will be some exposed conductor layers on the circuit board, which are easily damaged by water or moisture, so additional waterproofing processes (such as coating waterproof glue) are required to make the circuit board waterproof. In addition, the solder paste used in hot press soldering or the assembly parts of board-to-board connection contain toxic substances or pollutants, which are easy to cause harm to the environment. Summary of the invention

[0004] One embodiment of the present application provides a circuit board assembly, which includes a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic attraction layer and a connecting column. The first circuit structure is connected to the first substrate. The first magnetic attraction layer is connected to the first circuit structure and the first circuit structure is located between the first magnetic attraction layer and the first substrate, and the first magnetic attraction layer is not electrically connected to the first circuit structure. The connecting column is connected to the first circuit structure, the connecting column extends from the first circuit structure to the direction of the first magnetic attraction layer and passes through the first magnetic attraction layer, and the connecting column is electrically connected to the first circuit structure.

[0005] In some embodiments, the circuit board assembly further includes a second circuit board. The second circuit board includes a second circuit structure, a second magnetic attraction layer and at least one assembly hole. The second magnetic attraction layer is disposed on the second circuit structure. The assembly hole is formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole. An attractive magnetic force is generated between the first magnetic attraction layer and the second magnetic attraction layer, and the attractive magnetic force connects the first circuit board to the second circuit board. After the first circuit board is connected to the second circuit board using the attractive magnetic force, the connecting column is inserted into the assembly hole, and the connecting column is electrically connected to the second circuit structure.

[0006] In some embodiments, the second circuit board may further include a conductive layer electrically connected to the second circuit structure, and the conductive layer may be electrically connected to at least one of the side surface and the end surface of the connecting column.

[0007] In some embodiments, the material of the first magnetic attraction layer and the second magnetic attraction layer may include ferromagnetic material or ferrite magnetic material.

[0008] In some embodiments, the material of the first magnetic attraction layer and the second magnetic attraction layer may include the ferromagnetic material, the first circuit board may also include a first adhesive layer disposed between the first circuit structure and the first magnetic attraction layer, and the second circuit board may also include a second adhesive layer disposed between the second circuit structure and the second magnetic attraction layer.

[0009] In some embodiments, the second circuit board may further include a second waterproof layer connected to the second magnetic layer and located between the second circuit structure and the second waterproof layer.

[0010] In some embodiments, the first circuit board may further include a first waterproof layer connected to the first magnetic layer and located between the first waterproof layer and the first circuit structure.

[0011] Another embodiment of the present application provides a method for manufacturing a circuit board assembly, which includes the following steps. A first circuit board is provided, the first circuit board includes a first substrate, a first circuit structure, a first magnetic attraction layer and a connecting post. The first circuit structure is connected to the first substrate. The first magnetic attraction layer is connected to the first circuit structure and makes the first circuit structure located between the first magnetic attraction layer and the first substrate, and the first magnetic attraction layer is not electrically connected to the first circuit structure. The connecting post is connected to the first circuit structure, the connecting post extends from the first circuit structure to the direction of the first magnetic attraction layer and passes through the first magnetic attraction layer, and the connecting post is electrically connected to the first circuit structure. A second circuit board is provided, the second circuit board includes a second circuit structure, a second magnetic attraction layer and at least one assembly hole. The second magnetic attraction layer is disposed on the second circuit structure. The assembly hole is formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole. The second circuit board is assembled with the first circuit board by using the mutual attraction magnetic force generated between the first magnetic attraction layer and the second magnetic attraction layer, so that the connecting post is inserted into the assembly hole, and the connecting post is electrically connected to the second circuit structure.

[0012] In some embodiments, the manufacturing step of the first circuit board may include the following steps. Provide the first substrate. Make a circuit on the first substrate to obtain the first circuit structure. Connect the first magnetic layer to one side of the first circuit structure so that the first circuit structure is located between the first magnetic layer and the first substrate. Connect the release layer to the first magnetic layer so that the first magnetic layer is located between the release layer and the first circuit structure. Cut the first magnetic layer and the release layer to form an injection hole. Inject a conductive material into the injection hole to form the connecting column. When the connecting column is set, remove the release layer.

[0013] In some embodiments, the manufacturing step of the second circuit board may include the following steps: providing a second substrate; making a circuit on the second substrate to obtain the second circuit structure; disposing the second magnetic attraction layer on the second circuit structure; and cutting the second magnetic attraction layer and the second circuit structure to form the assembly hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a cross-sectional schematic diagram of a circuit board assembly according to an embodiment of the present application;

[0015] Figure 2 for Figure 1 A cross-sectional exploded schematic diagram of a circuit board assembly;

[0016] FIG. 3A to FIG. 3LThey are cross-sectional schematic diagrams of manufacturing steps of a first circuit board at various process stages in a method for manufacturing a circuit board assembly according to an embodiment of the present application; and

[0017] Figures 4A to 4K They are cross-sectional schematic diagrams of manufacturing steps of a second circuit board at various process stages in a method for manufacturing a circuit board assembly according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] The following application content provides many different embodiments or examples for realizing the different features of the provided subject matter. The following describes specific examples of the like of elements, values, operations, materials, configurations, etc. to simplify the present application. Of course, the examples are merely examples and are not intended to be limiting. Other elements, values, operations, materials, configurations, etc., etc., should also be considered. For example, in the following description, forming a first feature above a second feature may include an embodiment in which the first feature and the second feature are formed in direct contact, and may also include an embodiment in which additional features may be formed between the first feature and the second feature so that the first feature and the second feature are not in direct contact. In addition, the present application may repeat reference numerals and / or text in various examples. This repetition itself does not indicate the relationship between the various embodiments and / or configurations discussed.

[0019] In the following text, in order to clearly present the technical features of the present application, the dimensions (such as length, width, thickness and depth) of the elements (such as layers, films, substrates and regions, etc.) in the drawings will be enlarged in a non-proportional manner, and the number of some elements will be reduced. Therefore, the description and explanation of the embodiments below are not limited to the number of elements in the drawings and the sizes and shapes presented by the elements, but should cover the sizes, shapes and deviations of the two caused by actual manufacturing steps and / or tolerances. For example, the flat surface shown in the drawings may have rough and / or nonlinear features, and the acute angles shown in the drawings may be rounded. Therefore, the elements presented in the drawings of the present application are mainly for illustration, and are not intended to accurately depict the actual shape of the elements, nor are they used to limit the claims of the present application.

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 is a cross-sectional schematic diagram of a circuit board assembly 100 according to an embodiment of the present application. Figure 2 for Figure 1 FIG. 1 is a schematic cross-sectional exploded view of a circuit board assembly 100 . In some embodiments of the present application, the circuit board assembly 100 includes a first circuit board 200 .

[0021] In detail, the first circuit board 200 includes a first substrate (not numbered), a first circuit structure 210, a first magnetic attraction layer 220, and a connecting column 230. The first circuit structure 210 is connected to the first substrate. The first magnetic attraction layer 220 is connected to the first circuit structure 210 and makes the first circuit structure 210 located between the first magnetic attraction layer 220 and the first substrate, and the first magnetic attraction layer 220 is not electrically connected to the first circuit structure 210, thereby preventing the first magnetic attraction layer 220 from affecting the current transfer of the first circuit structure 210.

[0022] The connecting post 230 is connected to the first circuit structure 210. The connecting post 230 extends from the first circuit structure 210 toward the first magnetic attraction layer 220 and passes through the first magnetic attraction layer 220. The connecting post 230 is electrically connected to the first circuit structure 210. Therefore, in addition to being used for positioning and assembling the first circuit board 200 and other components, the connecting post 230 also has the function of conducting the circuit. The connection structure and circuit type between the first circuit board 200 and other components will be introduced in subsequent paragraphs and will not be repeated here.

[0023] In some embodiments, the circuit board assembly 100 further includes a second circuit board 300, and the first circuit board 200 is connected to the second circuit board 300. The second circuit board 300 includes a second circuit structure 310, a second magnetic attraction layer 320, and at least one assembly hole 330. The second magnetic attraction layer 320 is disposed on the second circuit structure 310, and the assembly hole 330 is formed in the second magnetic attraction layer 320 so that the second circuit structure 310 is partially exposed in the assembly hole 330, that is, the assembly hole 330 can be as shown. Figure 2 As shown, the second magnetic layer 320 extends from the surface away from the second circuit structure 310 to the second circuit structure 310 to form a blind hole structure. However, the assembly hole 330 may also have other structures according to assembly requirements, so the present application is not limited thereto.

[0024] When assembling the first circuit board 200 and the second circuit board 300, a magnetic attraction force is generated between the first magnetic attraction layer 220 and the second magnetic attraction layer 320, and the magnetic attraction force connects the first circuit board 200 to the second circuit board 300. In this way, the connection and positioning of the first circuit board 200 and the second circuit board 300 can be achieved by relying on the adsorption effect of the first magnetic attraction layer 220 and the second magnetic attraction layer 320, and the magnetic force between the first magnetic attraction layer 220 and the second magnetic attraction layer 320 can be greater than the weight of the first circuit board 200 and the second circuit board 300, so as to ensure that the first circuit board 200 and the second circuit board 300 will not separate in the absence of external force.

[0025] After the first circuit board 200 is connected to the second circuit board 300 by utilizing the attractive magnetic force, the connecting column 230 is inserted into the assembly hole 330, and the connecting column 230 is electrically connected to the second circuit structure 310. Therefore, the electrical conduction between the first circuit board 200 and the second circuit board 300 can be completed through the connecting column 230. The circuit board assembly 100 does not need to set a covering film opening as a mounted area or a reserved opening for other electrical connections, and the positions of the connecting column 230 and the assembly hole 330 can also be adjusted to obtain different circuit layouts, which helps to improve the flexibility of configuration.

[0026] It should be noted that in Figure 1 and Figure 2 In the figure, a first circuit board 200 and two second circuit boards 300 are used as an example, so the connecting column 230 can pass through the two sides of the first circuit board 200, and fix the two second circuit boards 300 on the two sides of the first circuit board 200, and the first circuit board 200 has two first magnetic absorption layers 220, so that the two second circuit boards 300 are respectively adsorbed on the two sides of the first circuit board 200. In other embodiments, the number of the first circuit board 200 and the second circuit board 300 can be one each, and the second circuit board 300 can be assembled on a single side of the first circuit board 200, or a plurality of second circuit boards 300 can be installed on one side of the first circuit board 200, so the present application is not limited to the number or assembly position of the first circuit board 200 and the second circuit board 300.

[0027] In addition, the second circuit board 300 may further include a conductive layer 340 electrically connected to the second circuit structure 310, and the conductive layer 340 may be electrically connected to at least one of the side surface and the end surface of the connecting column 230. Figure 2 As shown, the conductive layer 340 is located around the assembly hole 330, has a U-shaped cross section, or is only located at the end of the assembly hole 330. When the conductive layer 340 is located around the assembly hole 330, the conductive layer 340 can electrically connect the side surface of the connecting column 230, when the cross section of the conductive layer 340 is U-shaped, the conductive layer 340 can electrically connect the side surface and the end surface of the connecting column 230, and when the conductive layer 340 is located at the end of the assembly hole 330, the conductive layer 340 can electrically connect the end surface of the connecting column 230, thereby reducing the possibility of poor electrical connection between the connecting column 230 and the second circuit structure 310 due to size error.

[0028] Furthermore, the conductive layer 340 may be made of conductive silver paste, and the material of the connecting column 230 may be copper metal. Since the conductivity of the conductive silver paste is greater than that of the copper metal, the contact resistance when the connecting column 230 is electrically connected to the second circuit structure 310 can be reduced. On the other hand, by providing the conductive layer 340, the distance between the second circuit structure 310 and the connecting column 230 can be shortened, and the length of the connecting column 230 can be further shortened, thereby reducing the difficulty of manufacturing.

[0029] The material of the first magnetic attraction layer 220 and the second magnetic attraction layer 320 may include ferromagnetic material or ferrite material, and may also include polymer material. The polymer material may be epoxy resin, phenolic resin or other resin material, and the polymer material and the ferromagnetic material or the ferrite material may have a composite structure, such as a core-shell structure (polymer material is the shell, ferromagnetic material or ferrite material is the core or vice versa), a sandwich structure (ferromagnetic material or ferrite material is located between two layers of polymer material) or a distributed structure (ferromagnetic material or ferrite material is dispersed in the polymer material). In addition, in addition to providing a magnetic attraction effect, the ferromagnetic material or the ferrite material can also be used as a shield for electromagnetic signals to prevent electromagnetic signals from interfering with each other.

[0030] The ferromagnetic material or the ferrite magnetic material may have a relatively large specific surface area and a high surface energy, and may be made of iron, cobalt, nickel or an alloy thereof, so as to obtain sufficient magnetic attraction to combine and fix the first circuit board 200 and the second circuit board 300. It should be particularly noted that the first magnetic attraction layer 220 and the second magnetic attraction layer 320 do not need to be permanent magnets, as long as one of the corresponding two magnetic attraction layers is a permanent magnet, and the other magnetic attraction layer can be magnetized to achieve the purpose of magnetic attraction and combination. In other words, whether the first magnetic attraction layer 220 and the second magnetic attraction layer 320 are both permanent magnets, or only a few of them are permanent magnets, they all fall within the protection scope of the present application.

[0031] When the material of the first magnetic attraction layer 220 and the second magnetic attraction layer 320 includes the ferromagnetic material, the first circuit board 200 may also include a first adhesive layer (not shown) disposed between the first circuit structure 210 and the first magnetic attraction layer 220, and the second circuit board 300 may also include a second adhesive layer 350 disposed between the second circuit structure 310 and the second magnetic attraction layer 320, so as to prevent the ferromagnetic material from interfering with the current transfer between the first circuit structure 210 and the second circuit structure 310.

[0032] The first circuit board 200 may further include a first waterproof layer 240, which is connected to the first magnetic layer 220 and is located between the first waterproof layer 240 and the first circuit structure 210. The second circuit board 300 may further include a second waterproof layer 360, which is connected to the second magnetic layer 320 and is located between the second circuit structure 310 and the second waterproof layer 360. The first waterproof layer 240 and the second waterproof layer 360 may have elasticity and insulation, and may be made of polypropylene (PP) or polyethylene (PE) and may have a thickness less than 50 μm. When the first circuit board 200 and the second circuit board 300 are combined with each other due to magnetic force, the first waterproof layer 240 and the second waterproof layer 360 will be sandwiched between the first magnetic layer 220 and the second magnetic layer 320, and deform due to the force of the sandwiching, reducing the gap between the first circuit board 200 and the second circuit board 300, thereby reducing the possibility of liquid or water vapor entering between the first circuit board 200 and the second circuit board 300, thereby achieving a waterproof function. In addition, the first waterproof layer 240 and the second waterproof layer 360 can also serve as a buffer between the first circuit board 200 and the second circuit board 300, reducing the possibility of damage during assembly.

[0033] It should be noted that other parts may be embedded in the first circuit board 200 and the second circuit board 300, and because the first circuit board 200 and the second circuit board 300 are electrically connected through the connecting column 230, the other parts do not need to be exposed outside the circuit board, and can be well protected and have a longer service life.

[0034] The second circuit board 300 may further include an insulating layer 370, which is connected to the second circuit structure 310, so that the second circuit structure 310 is located between the insulating layer 370 and the second magnetic layer 320. Thus, by magnetically bonding and setting the insulating layer 370, the outermost layer of the circuit board assembly 100 may be designed without openings to ensure that the circuit board assembly 100 has a waterproof effect and improves reliability. The insulating layer 370 may be made of polyimide (PI), which has acid and alkali resistance and heat resistance, and the insulating layer 370 may provide further waterproof function to maintain the stable operation of the circuit board assembly 100, so that the circuit board assembly 100 is suitable for various environments.

[0035] Please refer to Figure 2Another embodiment of the present application provides a method for manufacturing a circuit board assembly, which includes the following steps: First, a first circuit board 200 and a second circuit board 300 are provided, and the structural features of the first circuit board 200 and the second circuit board 300 are as described in the previous paragraphs, and will not be repeated here.

[0036] Next, the second circuit board 300 is assembled with the first circuit board 200 by utilizing the mutual attraction magnetic force generated between the first magnetic attraction layer 220 and the second magnetic attraction layer 320, so that the connecting column 230 is inserted into the assembly hole 330, and the connecting column 230 is electrically connected to the second circuit structure 310. In this way, the connection of multiple circuit boards can be completed by magnetic attraction, without the need to use existing solder paste welding, surface mounting technology (SMT) or anisotropic conductive film bonding processes, which can save manufacturing costs and reduce preparation steps and materials. Furthermore, since the first circuit board 200 and the second circuit board 300 are connected by magnetic attraction, they can still be separated and reconnected after connection, which can improve the freedom of assembly and manufacturing.

[0037] Please refer to Figure 3A , Figure 3B , Figure 3C , Figure 3D , Figure 3E , Figure 3F , Figure 3G , Figure 3H , Fig. 3I , Figure 3J , Figure 3K and Figure 3L , FIG. 3A to FIG. 3L The following are cross-sectional schematic diagrams of the manufacturing steps of the first circuit board 200 at various process stages in the manufacturing method of the circuit board assembly according to one embodiment of the present application. Figure 3A As shown, the first substrate 400 is provided. The first substrate 400 may include an insulating structure (unnumbered) and two copper layers (unnumbered), and the insulating structure is sandwiched between the two copper layers. The first substrate 400 may also have other structures, so the present application is not limited thereto.

[0038] Then, if Figure 3B and Figure 3C As shown, a circuit is fabricated on the first substrate 400 to obtain the first circuit structure 210. For example, holes may be drilled on the insulating structure and one of the copper layers of the first substrate 400, and then copper plating may be performed so that copper metal fills the holes of the first substrate 400 and covers one of the copper layers, thereby forming the circuit structure 210. Figure 3B After the copper plating is completed, the two copper layers of the first substrate 400 are cut to produce Figure 3CThe structure shown.

[0039] Then, if Figures 3D to 3H As shown, the first magnetic attraction layer 220 is connected to one side of the first circuit structure 210, so that the first circuit structure 210 is located between the first magnetic attraction layer 220 and the first substrate 400. For example, if the number of the first magnetic attraction layer 220 is two, Figure 3D As shown, one of the first magnetic absorption layers 220 is first connected to one side of the first circuit structure 210, and a first build-up layer structure 410 is added to the other side of the first circuit structure 210 to form a Figure 3E Next, the first build-up layer structure 410 is subjected to processes such as cutting and copper plating to form a structure such as Figure 3F and Figure 3G The structure shown in FIG. 4 is further configured to connect another first magnetic attraction layer 220 to the first build-up layer structure 410, so that the two first magnetic attraction layers 220 are respectively located on both sides of the first circuit structure 210, so as to manufacture a circuit structure as shown in FIG. Figure 3H The structure shown.

[0040] It should be noted that after the first magnetic layer 220 is provided, a first waterproof layer 240 may be provided on the first magnetic layer 220, so that the first magnetic layer 220 is located between the first waterproof layer 240 and the first circuit structure 210. The number of the first waterproof layer 240 may be the same as that of the first magnetic layer 220. In this embodiment, the number of the first waterproof layer 240 may be two, and may be as follows: Figures 3D to 3H As shown, the first waterproof layer 240 can be set together with the corresponding first magnetic layer 220, or after the two first magnetic layers 220 are set, it is set on the two first magnetic layers 220. Therefore, the present application does not particularly limit the timing of setting the first waterproof layer 240.

[0041] Then, if Fig. 3I and Figure 3J As shown, the release layer L is connected to the first magnetic attraction layer 220, so that the first magnetic attraction layer 220 is located between the release layer L and the first circuit structure 210, and then the first magnetic attraction layer 220 and the release layer L are cut to form an injection hole H, wherein the injection hole H can extend from the release layer L to the first circuit structure 210 or the first build-up layer structure 410 to ensure that the subsequently formed components can be electrically connected to the first circuit structure 210. Similarly, the number of the release layer L can be the same as the first magnetic attraction layer 220, so the present application is not limited to the number of the release layer L.

[0042] Then, if Figure 3K and Figure 3LAs shown, a conductive material is injected into the injection hole H to form the connecting column 230 , and after the connecting column 230 is completely set, the release layer L is removed to obtain the first circuit board 200 .

[0043] Please refer to Figure 4A , Figure 4B , Figure 4C , Figure 4D , Figure 4E , Figure 4F , Figure 4G , Figure 4H , Fig. 4I , Figure 4J and Figure 4K , Figures 4A to 4K The following are cross-sectional schematic diagrams of the manufacturing steps of the second circuit board 300 at various process stages in the manufacturing method of the circuit board assembly according to one embodiment of the present application. Figure 4A As shown, a second substrate 500 is provided. The second substrate 500 may include an insulating layer 370 and a copper layer (not numbered). The copper layer is disposed on the insulating layer 370 .

[0044] Then, if FIG. 4B to FIG. 4H As shown, a circuit is fabricated on the second substrate 500 to obtain the second circuit structure 310. Specifically, Figure 4B As shown, the copper layer of the second substrate 500 is cut, and then the mounting component M is arranged on the copper layer using the surface mounting technology to form a Figure 4C The structure shown.

[0045] Then, if Figure 4D As shown, a conductive silver paste is coated on the copper layer of the second substrate 500 to form a conductive layer 340, and a second build-up layer structure 510 is arranged on the second substrate 500 to manufacture a conductive layer 340. Figure 4E The copper layer of the second substrate 500, the mounting component M and the conductive layer 340 can all be covered in the second build-up layer structure 510 to obtain good protection. Then, the second build-up layer structure 510 is cut and copper-plated to form a structure as shown. FIG. 4F to FIG. 4H The structure shown.

[0046] Then, if Fig. 4I As shown, the second magnetic attraction layer 320 is disposed on the second circuit structure 310. It should be particularly noted that if the material of the second magnetic attraction layer 320 is a non-conductive magnetic material, the second magnetic attraction layer 320 can be directly connected to the second circuit structure 310, but if the material of the second magnetic attraction layer 320 is conductive, Fig. 4IAs shown, the second adhesive layer 350 is first provided, and then the second magnetic layer 320 is provided on the second adhesive layer 350 to prevent the second magnetic layer 320 from interfering with the current transmission of the second circuit structure 310. In addition, before providing the second magnetic layer 320 or the second adhesive layer 350, other components (such as mounting components) may also be provided on the second circuit structure 310 to meet the use requirements.

[0047] Then, if Figure 4J As shown, the second waterproof layer 360 may be firstly provided on the second magnetic attraction layer 320, and then Figure 4K As shown, the second magnetic attraction layer 320 and the second circuit structure 310 are cut to form the assembly hole 330, thereby obtaining the second circuit board 300. The end of the assembly hole 330 can be located on the surface of the conductive layer 340, inside the conductive layer 340, or penetrate the conductive layer 340 and be located on the surface of the copper layer, that is, the depth of the assembly hole 330 can be adjusted according to the length of the connecting column 230 of the first circuit board 200, so this application is not limited.

[0048] To summarize, the circuit board assembly of the present application achieves connection and positioning with other circuit board assemblies through the adsorption effect of the magnetic attraction layer, without relying on existing methods such as solder paste welding or component plug-in for connection, thereby obtaining a more flexible configuration method, and the waterproof effect of the circuit board assembly can also be enhanced by setting a waterproof layer and an insulating layer.

[0049] Although the present application has been disclosed as above with reference to the embodiments, it is not intended to limit the present application. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be determined by the definition of the attached claims.

[0050]

Explanation of symbols

[0051] 100: Circuit board assembly

[0052] 200: First circuit board

[0053] 210: First circuit structure

[0054] 220: The first magnetic layer

[0055] 230: Connecting column

[0056] 240: First waterproof layer

[0057] 300: Second circuit board

[0058] 310: Second circuit structure

[0059] 320: Second magnetic layer

[0060] 330: Assembly hole

[0061] 340: Conductive layer

[0062] 350: Second adhesive layer

[0063] 360: Second waterproof layer

[0064] 370: Insulation layer

[0065] 400: first substrate

[0066] 410: First build-up structure

[0067] 500: Second substrate

[0068] 510: Second build-up structure

[0069] L: Release layer

[0070] H: injection hole

[0071] M: Mounting components.

Claims

1. A circuit board assembly, characterized in that: Include: The first circuit board comprises: a first substrate; a first circuit structure connected to the first substrate; a first magnetic attraction layer, connected to the first circuit structure and allowing the first circuit structure to be located between the first magnetic attraction layer and the first substrate, and the first magnetic attraction layer is not electrically connected to the first circuit structure; and A connecting post is connected to the first circuit structure. The connecting post extends from the first circuit structure toward the first magnetic attraction layer and passes through the first magnetic attraction layer. The connecting post is electrically connected to the first circuit structure.

2. The circuit board assembly according to claim 1, wherein: Also includes: The second circuit board comprises: a second circuit structure; A second magnetic attraction layer is disposed on the second circuit structure; and At least one assembly hole is formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole; Wherein, a mutual attraction magnetic force is generated between the first magnetic attraction layer and the second magnetic attraction layer, and the mutual attraction magnetic force connects the first circuit board to the second circuit board; After the first circuit board is connected to the second circuit board by using the magnetic attraction force, the connecting post is inserted into the assembly hole, and the connecting post is electrically connected to the second circuit structure.

3. The circuit board assembly according to claim 2, wherein: The second circuit board further includes a conductive layer electrically connected to the second circuit structure, and the conductive layer is electrically connected to at least one of the side surface and the end surface of the connecting column.

4. The circuit board assembly according to claim 2, wherein: The materials of the first magnetic attraction layer and the second magnetic attraction layer include ferromagnetic material or ferrite magnetic material.

5. The circuit board assembly according to claim 4, wherein: The material of the first magnetic attraction layer and the second magnetic attraction layer includes the ferromagnetic material, the first circuit board also includes a first glue layer arranged between the first circuit structure and the first magnetic attraction layer, and the second circuit board also includes a second glue layer arranged between the second circuit structure and the second magnetic attraction layer.

6. The circuit board assembly according to claim 2, wherein: The second circuit board further includes a second waterproof layer connected to the second magnetic attraction layer and arranged so that the second magnetic attraction layer is located between the second circuit structure and the second waterproof layer.

7. The circuit board assembly according to claim 1, wherein: The first circuit board further includes a first waterproof layer connected to the first magnetic layer and arranged between the first waterproof layer and the first circuit structure.

8. A method for manufacturing a circuit board assembly, characterized in that: Include: A first circuit board is provided, wherein the first circuit board comprises: a first substrate; a first circuit structure connected to the first substrate; a first magnetic attraction layer, connected to the first circuit structure and allowing the first circuit structure to be located between the first magnetic attraction layer and the first substrate, and the first magnetic attraction layer is not electrically connected to the first circuit structure; and A connecting post connected to the first circuit structure, the connecting post extending from the first circuit structure toward the first magnetic attraction layer and passing through the first magnetic attraction layer, and the connecting post is electrically connected to the first circuit structure; A second circuit board is provided, comprising: a second circuit structure; A second magnetic attraction layer is disposed on the second circuit structure; and At least one assembly hole is formed in the second magnetic attraction layer so that the second circuit structure is partially exposed in the assembly hole; as well as The second circuit board is assembled with the first circuit board by utilizing the mutual attraction magnetic force generated between the first magnetic attraction layer and the second magnetic attraction layer, so that the connecting column is inserted into the assembly hole, and the connecting column is electrically connected to the second circuit structure.

9. The method for manufacturing a circuit board assembly according to claim 8, wherein: The manufacturing steps of the first circuit board include: providing the first substrate; Fabricating a circuit on the first substrate to obtain the first circuit structure; Connecting the first magnetic attraction layer to one side of the first circuit structure so that the first circuit structure is located between the first magnetic attraction layer and the first substrate; Connecting the release layer to the first magnetic attraction layer so that the first magnetic attraction layer is located between the release layer and the first circuit structure; Cutting the first magnetic attraction layer and the release layer to form injection holes; Injecting a conductive material into the injection hole to form the connecting column; as well as After the connection pillars are arranged, the release layer is removed.

10. The method for manufacturing a circuit board assembly according to claim 8, wherein: The manufacturing steps of the second circuit board include: providing a second substrate; Fabricating a circuit on the second substrate to obtain the second circuit structure; Disposing the second magnetic attraction layer on the second circuit structure; as well as The second magnetic attraction layer and the second circuit structure are cut to form the assembly hole.

Images