Three-proofing coating equipment and process based on satellite-borne imaging spectrometer circuit board

Abstract

The invention relates to the technical field of coating equipment, in particular to three-proofing coating equipment and process based on a satellite-borne imaging spectrometer circuit board. In order to solve the problem that the other side of the circuit board is difficult to coat after one side of the circuit board is coated due to the fact that the circuit board is placed in a base provided with a placing groove and is coated by a coating machine, the following technical scheme is provided: the circuit board coating device comprises a bottom frame, the circuit board is arranged on the bottom frame, and the circuit board is mounted in an outer frame; the storage box further comprises two sets of containing frames, the outer frame is placed on the two sets of containing frames, the whole containing frames are arranged in a U shape, and the section of each containing frame is of an L-shaped structure. And the adaptation mechanism is used for adjusting the distance between the two groups of placing frames to support the circuit boards of different models. The device is suitable for clamping and positioning circuit boards of different models, meanwhile, fixation is firm, overturning is convenient, stability is kept after overturning, and safety and reliability in the coating process are guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of coating equipment, and particularly to a three-proof coating equipment and process for the circuit board of a spaceborne imaging spectrometer. Background Art

[0002] The circuit boards of imaging spectrometers operating on satellites or spacecrafts are designed to support the functions of imaging spectrometers, including data acquisition, signal processing, power management, communication interfaces, etc. An imaging spectrometer is an instrument used to obtain spectral information and images of the earth's surface or cosmic objects. Therefore, the circuit board design needs to consider the characteristics of high precision, high reliability, and adaptability to complex environments.

[0003] The three-proof paint is a protective coating material specifically used for electronic products and circuit boards, aiming to provide moisture-proof, salt-spray-proof, and mildew-proof functions. Its main function is to form a protective film to prevent the corrosion and damage of electronic components and circuits by moisture, chemical substances, and pollutants in the environment. When coating the circuit board, the circuit board must be fixed first to ensure that the circuit board does not move during coating. The current method is to place the circuit board in a base with a placement groove, move the base under the coater, and then perform coating through the coater. This results in difficulty in turning over the circuit board to coat the other side after one side of the circuit board is coated. In view of this, the present invention proposes a three-proof coating equipment and process for the circuit board of a spaceborne imaging spectrometer. Summary of the Invention

[0004] The object of the present invention is to address the problem in the background art that when the circuit board is placed in a base with a placement groove and coated through a coater, it is difficult to turn over the circuit board to coat the other side after one side of the circuit board is coated, and to propose a three-proof coating equipment and process for the circuit board of a spaceborne imaging spectrometer.

[0005] On the one hand, the present invention provides a three-proof coating equipment for the circuit board of a spaceborne imaging spectrometer, including a chassis, on which a circuit board is provided. The circuit board is installed in an outer frame, and further includes two placement frames. The outer frame is placed on the two placement frames. The placement frame is integrally set in a "U" shape, and the cross-section of the placement frame is in an L-shaped structure; an adaptation mechanism for adjusting the distance between the two placement frames to support circuit boards of different models; a positioning mechanism installed on the chassis for clamping and fixing the outer frame; a fastening component provided on both sides of the outer frame to press the outer frame downward while the positioning mechanism clamps it; a flipping mechanism installed on the chassis for driving the outer frame to flip so as to coat the other side of the circuit board.

[0006] Optionally, the adaptation mechanism includes mounting blocks, limiting bars, and sliders. Two groups of the mounting blocks are symmetrically arranged on both sides of the placement frame, and the mounting blocks are in a "U" - shaped structure. Two groups of limiting bars are fixedly connected to the inner walls of each group of mounting blocks, and two sliders are slidably connected to the upper and lower two groups of limiting bars. The two sliders are respectively fixedly connected to the sides of the two placement frames.

[0007] Optionally, the adaptation mechanism further includes an adjusting screw, a positioning plate, a knob, a first gear, and a first rack. An adjusting screw is threadedly connected to one of the sliders. One end of the adjusting screw is rotatably connected to a positioning plate installed in the mounting block. The other end of the adjusting screw is fixedly connected to a knob. A first gear rotatably connected in the mounting block is arranged on the side of the positioning plate away from the knob. The upper and lower sides of the first gear are each provided with a first rack meshing with it. The two first racks are respectively fixedly connected to the sides of the two sliders and are slidably matched with the other slider.

[0008] Optionally, the positioning mechanism includes limiting plates, moving blocks, a bidirectional threaded rod, a rotating handle, vertical plates, side plates, and positioning rings. Two groups of limiting plates are installed on the chassis. Two groups of moving blocks are slidably connected between the two groups of limiting plates. A bidirectional threaded rod rotatably connected to the chassis is threadedly connected to the two moving blocks. A rotating handle is installed at one end of the bidirectional threaded rod. Vertical plates are fixedly connected to the tops of the two moving blocks. A side plate is arranged on the side of the vertical plate close to the placement frame. A positioning ring is fixedly connected to the side of the side plate close to the vertical plate. The positioning ring is rotatably connected to the vertical plate, and the cross - section of the positioning ring is in a T - shaped structure.

[0009] Optionally, the positioning mechanism further includes a synchronous rod, a first push plate, a second push plate, a connecting rod, a limiting disc, and a first spring. At least two groups of synchronous rods are fixedly connected to the side of the side plate away from the vertical plate. One end of the synchronous rod penetrates through the mounting block and is fixedly connected to a first push plate. A second push plate is also arranged on the side of the first push plate close to the circuit board. Multiple connecting rods penetrating through the first push plate are fixedly connected to the side of the second push plate close to the first push plate. A limiting disc is fixedly connected to the end of the connecting rod away from the second push plate. Multiple first springs arranged between the first push plate and the second push plate are respectively sleeved on the outer circles of the multiple connecting rods.

[0010] Optionally, the fastening assembly includes a first cross bar, a fixed block, a second rack, a second cross bar, a fixed plate, and a second gear. The first push plate is fixedly connected to multiple groups of first cross bars, both ends of the first cross bar are extended and pass through the placement frame, and the first cross bar is slidably connected to the side of the placement frame. Both ends of the first cross bar are fixedly connected to the fixed blocks, and the second rack is installed on the side of the fixed block away from the placement frame. The second push plate is fixedly connected to multiple groups of second cross bars corresponding to the first cross bar, and the second cross bar is also slidably connected to the placement frame. Both ends of the second cross bar are fixedly connected to the fixed plates, and the fixing plate is rotatably connected to the second gear on the side away from the placement frame. The second gear is arranged under the second rack and meshes with it.

[0011] Optionally, the fastening assembly also includes a mounting plate, a slide rail, a third rack, and a pressure plate. A mounting plate fixedly connected to the second cross bar is provided on the side of the two groups of placement frames away from the circuit board. Both groups of the mounting plates are L-shaped. A slide rail is installed on the mounting plate. A third rack is slidably connected in the slide rail. The slide rail and the third rack are connected in a T-shaped structure. The third rack is provided on the side of the second gear away from the fixed block. The third rack is meshed with the second gear. The third rack is staggered with the second rack. The tops of the two groups of third racks are commonly fixedly connected with a pressure plate.

[0012] Optionally, the flipping mechanism includes a rotating shaft, a rotating plate, a gripping rod, a sliding rod, a fixed frame, and a second spring; the mounting block is fixedly connected to the rotating shaft on a side away from the placement frame; one end of the rotating shaft passes through the vertical plate and the side plate and is fixedly connected to the rotating plate; the rotating plate is also slidably connected to the gripping rod on a side away from the rotating plate; the sliding rod is slidably connected to an end of the gripping rod away from the rotating plate; the sliding rod is fixedly connected to an L-shaped fixed frame on an end away from the gripping rod; the fixed frame is installed on the side of the rotating plate; and a second spring sleeved on the outer ring of the sliding rod is provided on a side of the gripping rod away from the rotating plate.

[0013] Optionally, the flipping mechanism also includes a support plate, a positioning hole, and two groups of support plates symmetrically arranged on both sides of the rotating shaft. The two groups of support plates are installed on the base frame, and the support plate is provided with a positioning hole. One end of the grip rod passes through the rotating plate and is slidably connected in the positioning hole.

[0014] On the other hand, the present invention also provides a three-proof coating process for a circuit board based on a spaceborne imaging spectrometer, comprising the following steps:

[0015] Step 1: First, turn the knob to move the two sets of placement frames closer until the adjusted spacing between the two sets of placement frames is suitable for the circuit boards and outer frames to be placed. For the items where the circuit boards do not need to be coated, the smaller parts can be sealed with cellophane tape, etc. If the parts are larger, they can be wrapped with kraft paper or telephone paper and then tied with silk rope or clamped with wooden clips as appropriate. After the pre-baked and dehumidified circuit boards and outer frames are placed on the two sets of placement frames, turn the knob to make the placement frames fit the outer frames.

[0016] Step 2: At this time, the rotating handle is rotated, and the two groups of the first push plates are moved closer to each other, and the second push plates are also moved closer to each other. When the second push plates contact the side surfaces of the outer frame, the first push plates continue to move and the distance between the first push plates and the second push plates is reduced. The first spring is compressed, and the elastic force of the first spring continues to push the second push plate to push the outer frame to the middle position.

[0017] Step three, at the same time, when the first push plate approaches the second push plate, it drives the pressing plate to move downward and press on the outer frame, so that the bottom of the outer frame is close to the top of the placement frame, and the position of the outer frame is fixed to prevent it from falling after moving or flipping;

[0018] Step 4, moving the chassis to the bottom of the coating machine, and uniformly coating one side of the circuit board until the organic solvent in the coating evaporates to the point where the coating film is no longer sticky;

[0019] Step 5, holding the handle and moving it in a direction away from the rotating plate, and squeezing the second spring at the same time, at this time, one end of the handle moves out of the support plate, and the rotating plate is rotated 180 degrees by the handle, and the rotating shaft is driven to rotate synchronously, and then the mounting block rotates, so as to realize the flipping of the circuit board;

[0020] Step 6: At the same time, the gripping rod is moved to a position corresponding to another group of positioning holes, and the hand is slowly released, so that the second spring releases the elastic force to push one end of the gripping rod into another group of positioning holes for limiting, so that the position of the circuit board is fixed after flipping, which is convenient for coating the other side of the circuit board;

[0021] Step 7. After the first coating, place the whole machine parts with smaller volume at room temperature for 0.5h~1h to allow the organic solvent in the coating to fully volatilize, then place them in a constant temperature blast oven and bake them at 50℃±5℃ for 2h. After cutting off the power supply, cool them to room temperature in the oven, and then apply the second coating in the direction perpendicular to the first coating direction. For products with larger volume that cannot be dried in the oven or some products that are not allowed to be dried in the oven, they should be left to stand for 4h after the first coating before applying the second coating.

[0022] Step 8: Place the coated printed circuit board assembly, the whole machine or parts with smaller volume flat in the oven, heat it to 45℃~50℃ and bake it for 2 hours, remove the protective material, and then place it in the oven at 45℃~50℃ for 2 hours; if the product does not use protective material, place it directly in the oven at 45℃~50℃ for 2 hours. Then cut off the power supply and cool it to room temperature in the oven; for products with larger volume after coating that cannot be put into the oven or some products that are not allowed to be dried in the oven, they can be placed in a dry and well-ventilated room for natural drying, and the protective material can be removed after 24 hours, but the coating that has not been dried will reach the best state after 7 days before it can be used.

[0023] Compared with the prior art, the present invention has the following beneficial technical effects:

[0024] The present invention uses the setting of the adaptation mechanism to drive the two groups of placement frames closer to each other when the knob is turned, so as to adjust the distance between the two groups of placement frames to facilitate the support of circuit boards of different widths. The positioning mechanism is used to drive the two groups of first push plates closer to each other when the bidirectional threaded rod is turned, so as to fix the circuit board at the center position between the placement frames, which is convenient for coating operations. The fastening assembly is used to drive the pressure plate to press downward on the edge position of the outer frame when the first push plate approaches the circuit board, so that the circuit board is stably fixed and prevented from falling.

[0025] Furthermore, by setting the flipping mechanism, after rotating the rotating plate, one end of the gripping rod is inserted into the positioning hole for positioning, thereby realizing a 180-degree flipping of the circuit board, so as to facilitate coating the other surface of the circuit board;

[0026] In summary, the present invention is suitable for clamping and positioning circuit boards of different models, and is firmly fixed and convenient for flipping, and remains stable after flipping, thereby ensuring safety and reliability during the coating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the structure of a three-proof coating device for a spaceborne imaging spectrometer circuit board;

[0028] Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure of;

[0029] Figure 3 It is a schematic diagram of the structure of the adaptation mechanism;

[0030] Figure 4 It is a structural schematic diagram of the positioning mechanism;

[0031] Figure 5 yes Figure 2 The enlarged schematic diagram of point A in the middle;

[0032] Figure 6 yes Figure 4 The enlarged schematic diagram of point B in the middle;

[0033] Figure 7 is a schematic diagram of the structure of the fastening assembly;

[0034] Figure 8 yes Figure 1 The enlarged schematic diagram of the center C;

[0035] Fig. 9 yes Figure 1 Enlarged schematic diagram of point D in the middle.

[0036] Reference numerals:

[0037] 1. Circuit board; 11. Outer frame;

[0038] 2. Place the frame;

[0039] 3. Adaptation mechanism; 31. Mounting block; 32. Limiting strip; 33. Sliding block; 34. Adjusting screw; 35. Positioning plate; 36. Knob; 37. First gear; 38. First rack;

[0040] 4. Positioning mechanism; 401. Limiting plate; 402. Moving block; 403. Bidirectional threaded rod; 404. Turning handle; 405. Vertical plate; 406. Side plate; 407. Positioning ring; 408. Synchronous rod; 409. First push plate; 410. Second push plate; 411. Connecting rod; 412. Limiting plate; 413. First spring;

[0041] 5. Fastening assembly; 501. first crossbar; 502. fixing block; 503. second rack; 504. second crossbar; 505. fixing plate; 506. second gear; 507. mounting plate; 508. slide rail; 509. third rack; 510. pressing plate;

[0042] 6. Flipping mechanism; 61. Rotation axis; 62. Rotation plate; 63. Grip rod; 64. Slide rod; 65. Fixed frame; 66. Second spring; 67. Support plate; 68. Positioning hole;

[0043] 7. Base frame. DETAILED DESCRIPTION

[0044] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0045] The components of the embodiments of the present invention that are usually described and shown in the accompanying drawings herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0046] All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0048] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] Embodiment

[0050] As Figure 1 and Figure 2 shown, a three-proof coating device for a satellite-borne imaging spectrometer circuit board proposed by the present invention includes a chassis 7. A circuit board 1 is arranged on the chassis 7, and the circuit board 1 is installed in an outer frame 11. It also includes two sets of placement frames 2. The outer frame 11 is placed on the two sets of placement frames 2. The placement frame 2 is integrally arranged in a "U" shape, and the cross-section of the placement frame 2 is in an L-shaped structure, which is convenient for supporting the outer frame 11.

[0051] Further, please refer to Figure 3, the above coating device includes an adaptation mechanism 3 for adjusting the distance between two groups of placement frames 2 to support circuit boards of different models. The adaptation mechanism 3 includes mounting blocks 31, limiting bars 32, and sliders 33. The two groups of mounting blocks 31 are symmetrically arranged on both sides of the placement frame 2, and the mounting block 31 has a "U" - shaped structure. Two upper and lower groups of limiting bars 32 are fixedly connected to the inner walls of each group of mounting blocks 31. Two groups of sliders 33 are slidably connected to the upper and lower two groups of limiting bars 32, and the movement of the sliders 33 is stable. The two groups of sliders 33 are respectively fixedly connected to the sides of the two groups of placement frames 2, and the placement frames 2 move synchronously with the sliders 33, and the movement of the placement frames 2 is stable. The adaptation mechanism 3 further includes an adjusting screw 34, a positioning plate 35, a knob 36, a first gear 37, and a first rack 38. An adjusting screw 34 is threadedly connected to one group of sliders 33. One end of the adjusting screw 34 is rotatably connected to a positioning plate 35 installed in the mounting block 31. While the adjusting screw 34 rotates in place, the adjusting screw 34 drives the slider 33 to move when it rotates. The other end of the adjusting screw 34 is fixedly connected to a knob 36, and the setting of the knob 36 facilitates the rotation of the adjusting screw 34. A first gear 37 rotatably connected in the mounting block 31 is arranged on the side of the positioning plate 35 away from the knob 36. A first rack 38 is arranged above and below the first gear 37 and meshes with it. The two groups of first racks 38 are respectively fixedly connected to the sides of the two groups of sliders 33 and are slidably matched with the other group of sliders 33. When one group of sliders 33 moves, it drives the first rack 38 to move synchronously and mesh with the first gear 37. Thus, the first gear 37 drives the other group of first racks 38 to move and drives the other group of sliders 33 to move synchronously, and the moving directions of the two groups of sliders 33 are opposite. Thus, when the sliders 33 move, they can drive the two groups of placement frames 2 to approach or move away from each other, so as to adjust the distance between the two groups of placement frames 2 to facilitate the placement of circuit boards 1 and outer frames 11 of different widths.

[0052] Furthermore, as Figure 4-6As shown, the coating device also includes a positioning mechanism 4 installed on the base frame 7 for clamping and fixing the outer frame 11. The positioning mechanism 4 includes a limit plate 401, a moving block 402, a bidirectional threaded rod 403, a rotating handle 404, a vertical plate 405, a side plate 406, and a positioning ring 407. Two groups of limit plates 401 are installed on the base frame 7. Two groups of moving blocks 402 are slidably connected between the two groups of limit plates 401, and the moving blocks 402 are limited when they move, so that the moving blocks 402 move smoothly. The bidirectional threaded rod 403 rotatably connected in the base frame 7 is threadedly connected with the two groups of moving blocks 402, so that the bidirectional threaded rod 403 drives the two groups of moving blocks 402 to move in opposite directions when rotating, so that the two groups of second push plates 410 move synchronously to the middle position, which is convenient for fixing the outer frame 11 in the middle position. A rotating handle 404 is installed at one end of the bidirectional threaded rod 403 to facilitate the rotation of the bidirectional threaded rod 403. The tops of the two groups of moving blocks 402 are fixedly connected with a vertical plate 405, and the vertical plate 405 moves synchronously with the moving blocks 402. A side plate 406 is provided on the side of the vertical plate 405 close to the placement frame 2, and a positioning ring 407 is fixedly connected to the side of the side plate 406 close to the vertical plate 405. The positioning ring 407 is rotatably connected to the vertical plate 405, and the cross section of the positioning ring 407 is a T-shaped structure, so that the side plate 406 is rotatably connected to the side of the vertical plate 405. The positioning mechanism 4 also includes a synchronization rod 408, a first push plate 409, a second push plate 410, a connecting rod 411, a limit plate 412, and a first spring 413. At least two groups of synchronization rods 408 are fixedly connected to the side of the side plate 406 away from the vertical plate 405. One end of the synchronization rod 408 passes through the mounting block 31 and is fixedly connected to the first push plate 409. The vertical plate 405 drives the first push plate 409 to move synchronously through the synchronization rod 408. A second push plate 410 is also provided on the side of the first push plate 409 close to the circuit board 1. The side of the second push plate 410 close to the first push plate 409 is fixedly connected to multiple groups of connecting rods 411 penetrating the first push plate 409. One end of the connecting rod 411 away from the second push plate 410 is fixedly connected to a limiting plate 412. The limiting plate 412 is used for limiting to prevent the connecting rod 411 from being separated from the first push plate 409 due to the elastic force of the first spring 413. Multiple groups of first springs 413 provided between the first push plate 409 and the second push plate 410 are respectively sleeved on the outer rings of the multiple groups of connecting rods 411. The elastic force of the first springs 413 causes the first springs 413 to be compressed after the first push plate 409 moves and when the second push plate 410 contacts the outer frame 11, thereby releasing the elastic force so that the second push plate 410 presses the outer frame 11 tightly to fix the position of the outer frame 11.

[0053] For details, please refer to Figure 6-Figure 8The coating device includes a fastening assembly 5 arranged on both sides of the outer frame 11 to press the outer frame 11 downward while being clamped by the positioning mechanism 4. The fastening assembly 5 includes a first crossbar 501, a fixed block 502, a second rack 503, a second crossbar 504, a fixed plate 505, and a second gear 506. A plurality of first crossbars 501 are fixedly connected to the first push plate 409. Both ends of the first crossbar 501 extend and penetrate the placement frame 2, and the first crossbar 501 is slidably connected to the side of the placement frame 2. The first crossbar 501 moves synchronously with the first push plate 409. Both ends of the first crossbar 501 are fixedly connected with a fixed block 502. A second rack 503 is installed on the side of the fixed block 502 away from the placement frame 2. The second rack 503 moves synchronously with the first push plate 409. The second push plate 410 is fixedly connected with multiple sets of second cross bars 504 corresponding to the first cross bars 501. The second cross bars 504 are also slidably connected with the placement frame 2. The second cross bars 504 move synchronously with the second push plate 410. Both ends of the second cross bar 504 are fixedly connected with fixed plates 505. The side of the fixed plate 505 away from the placement frame 2 is rotatably connected with the second gear 506, and the second gear 506 rotates in place. The second gear 506 is arranged below the second rack 503 and meshes with it, so that when the second push plate 410 contacts the outer frame 11 but the first push plate 409 continues to move, the first spring 413 is squeezed at this time, and the first push plate 409 approaches the second push plate 410, thereby driving the second rack 503 to move relative to the second gear 506, and driving the second gear 506 to rotate. The fastening assembly 5 also includes a mounting plate 507, a slide rail 508, a third rack 509, and a pressing plate 510. The two sets of placement frames 2 are both provided with a mounting plate 507 fixedly connected to the second crossbar 504 on one side away from the circuit board 1. Both sets of mounting plates 507 are L-shaped. The mounting plate 507 is provided with a slide rail 508. The third rack 509 is slidably connected to the slide rail 508. The slide rail 508 and the third rack 509 are connected in a T-shaped structure, so that the sliding of the third rack 509 is smooth. The third rack 509 is provided on the side of the second gear 506 away from the fixed block 502. The third rack 509 is meshed with the second gear 506, so that the third rack 509 is driven to move while the second gear 506 rotates. The third rack 509 is staggered with the second rack 503 to prevent the second rack 503 from contacting the third rack 509 when moving. The tops of the two sets of third racks 509 are fixedly connected with a pressing plate 510 , and the third racks 509 drive the pressing plate 510 to move synchronously when moving.

[0054] Finally, if Figure 1 , Figure 5 and Fig. 9As shown, the coating device also includes a flipping mechanism 6 installed on the bottom frame 7 for driving the outer frame 11 to flip so as to coat the other side of the circuit board 1. The flipping mechanism 6 includes a rotating shaft 61, a rotating plate 62, a grip 63, a slide bar 64, a fixed frame 65, and a second spring 66. The side of the mounting block 31 away from the placement frame 2 is fixedly connected to the rotating shaft 61. One end of the rotating shaft 61 passes through the vertical plate 405 and the side plate 406 and is fixedly connected to the rotating plate 62. The rotating plate 62 rotates synchronously with the rotating shaft 61. When the vertical plate 405 moves, it can also be limited by the rotating shaft 61 to make the movement more stable. The side of the rotating plate 62 away from the rotating shaft 61 is also slidably connected to the grip 63. The end of the grip 63 away from the rotating plate 62 is slidably connected to the slide bar 64, and the grip 63 slides smoothly. One end of the slide bar 64 away from the grip bar 63 is fixedly connected to an L-shaped fixing frame 65, which is installed on the side of the rotating plate 62. The second spring 66 sleeved and installed on the outer ring of the slide bar 64 is arranged on the side of the grip bar 63 away from the rotating plate 62. When the grip bar 63 is held and moved to the side away from the rotating plate 62, the second spring 66 is squeezed. The flip mechanism 6 also includes a support plate 67 and a positioning hole 68. Two groups of support plates 67 are symmetrically arranged on both sides of the rotating shaft 61. Both groups of support plates 67 are installed on the bottom frame 7. The support plate 67 is provided with a positioning hole 68. One end of the grip bar 63 passes through the rotating plate 62 and is slidably connected to the positioning hole 68, so that the grip bar 63 can enter the positioning hole 68 and get stuck, thereby keeping the circuit board 1 in a horizontal state.

[0055] In this embodiment, the knob 36 is first turned to drive the adjusting screw 34 to rotate synchronously, so that the slider 33 threadedly connected to the adjusting screw 34 starts to move and approaches the other set of sliders 33. At the same time, the slider 33 drives the first rack 38 to move synchronously and mesh with the first gear 37 when moving. At this time, the two sets of first racks 38 move synchronously and in opposite directions. At this time, the two sets of sliders 33 move synchronously and approach each other. At the same time, the two sets of placement frames 2 are driven to approach each other until the spacing between the two sets of placement frames 2 after adjustment is suitable for the circuit board 1 and the outer frame 11 to be placed. After the outer frame 11 is placed on the two sets of placement frames 2, the knob 36 is turned again to make the placement frame 2 fit the outer frame 11.

[0056] At this time, the rotating handle 404 is rotated, and the rotating handle 404 drives the bidirectional threaded rod 403 to rotate synchronously. When the bidirectional threaded rod 403 rotates, it drives the two groups of moving blocks 402 to approach each other under the limiting action of the limiting plate 401, and drives the two groups of vertical plates 405 to approach each other. At this time, when the side plates 406 approach each other, they drive the two groups of first push plates 409 to approach each other through the synchronous rod 408, and the second push plates 410 also approach each other. When the second push plate 410 contacts the side of the outer frame 11, the first push plate 409 continues to move and the distance between the first push plate 409 and the second push plate 410 is reduced, so that the first spring 413 is compressed, and the elastic force of the first spring 413 continues to push the second push plate 410, so that the outer frame 11 can be pushed to the middle position, and the elastic force of the first spring 413 makes the outer frame 11 firmly fixed. At the same time, when the first push plate 409 approaches the second push plate 410, the first cross bar 501 drives the fixing block 502 and the second rack 503 to approach the second gear 506. At this time, the second gear 506 meshes with the second rack 503 and starts to rotate, and at the same time drives the third rack 509 to move downward. At this time, the third rack 509 moves downward under the limiting effect of the slide rail 508. At the same time, the pressing plate 510 is driven to move downward and press on the outer frame 11, so that the bottom of the outer frame 11 is close to the top of the placement frame 2, and the position of the outer frame 11 is fixed to prevent it from moving or falling after flipping.

[0057] At this time, the chassis 7 can be moved to the bottom of the coating machine, and one side of the circuit board 1 can be evenly coated. When the organic solvent in the coating evaporates to the point where the coating film is not sticky, the gripping rod 63 is held and moved away from the rotating plate 62, while squeezing the second spring 66. At this time, one end of the gripping rod 63 is moved out of the support plate 67. At this time, the rotating plate 62 can be rotated 180 degrees by the gripping rod 63, while driving the rotating shaft 61 to rotate synchronously, and then the mounting block 31 rotates, so as to realize the flipping of the circuit board 1. At the same time, the gripping rod 63 moves to the position corresponding to the other group of positioning holes 68, and the gripping rod 63 is slowly released, so that the second spring 66 releases the elastic force to push one end of the gripping rod 63 into the other group of positioning holes 68 for limiting, so that the position of the circuit board 1 is fixed after flipping, which is convenient for coating the other side of the circuit board 1.

[0058] A three-conformal coating process for a circuit board based on a spaceborne imaging spectrometer comprises the following steps:

[0059] Step 1: First, turn the knob 36 to move the two sets of placement frames 2 closer until the adjusted spacing between the two sets of placement frames 2 is suitable for the circuit board 1 and the outer frame 11 to be placed. For the projects where the circuit board 1 does not need to be coated, the smaller parts can be sealed with cellophane tape, etc. If the parts are larger, they can be wrapped with kraft paper or telephone paper and then tied with silk rope or clamped with wooden clips as appropriate. After the pre-baked and dehumidified circuit board 1 and the outer frame 11 are placed on the two sets of placement frames 2, turn the knob 36 to make the placement frames 2 fit the outer frame 11;

[0060] Step 2: At this time, the rotating handle 404 is turned, and the two sets of first push plates 409 approach each other, and at the same time, the second push plates 410 also approach each other. When the second push plates 410 contact the side of the outer frame 11, the first push plates 409 continue to move and the distance between them and the second push plates 410 is reduced, and the first spring 413 is compressed. The elastic force of the first spring 413 continues to push the second push plate 410 to push the outer frame 11 to the middle position;

[0061] Step 3: At the same time, when the first push plate 409 is close to the second push plate 410, it drives the pressing plate 510 to move downward and press on the outer frame 11, so that the bottom of the outer frame 11 is close to the top of the placement frame 2, and the position of the outer frame 11 is fixed to prevent it from falling after moving or turning over;

[0062] Step 4: Move the chassis 7 to the bottom of the coating machine and evenly coat one side of the circuit board 1 until the organic solvent in the coating evaporates to the point where the coating film is no longer sticky;

[0063] Step 5: Hold the handle 63 and move it in a direction away from the rotating plate 62, and squeeze the second spring 66. At this time, one end of the handle 63 moves out of the support plate 67, and the rotating plate 62 is rotated 180 degrees by the handle 63, and the rotating shaft 61 is driven to rotate synchronously, and then the mounting block 31 rotates, so that the circuit board 1 is turned over;

[0064] Step 6: At the same time, the gripping rod 63 is moved to a position corresponding to another group of positioning holes 68, and the gripping rod 63 is slowly released, so that the second spring 66 releases its elastic force to push one end of the gripping rod 63 into another group of positioning holes 68 for limiting, so that the circuit board 1 is fixed in position after being turned over, so as to facilitate coating the other side of the circuit board 1;

[0065] Step 7. After the first coating, place the whole machine parts with smaller volume at room temperature for 0.5h~1h to allow the organic solvent in the coating to fully volatilize, then place them in a constant temperature blast oven and bake them at 50℃±5℃ for 2h. After cutting off the power supply, cool them to room temperature in the oven, and then apply the second coating in the direction perpendicular to the first coating direction. For products with larger volume that cannot be dried in the oven or some products that are not allowed to be dried in the oven, they should be left to stand for 4h after the first coating before applying the second coating.

[0066] Step 8: Place the coated printed circuit board assembly, the whole machine or parts with smaller volume flat in the oven, heat it to 45℃~50℃ and bake it for 2 hours, remove the protective material, and then place it in the oven at 45℃~50℃ for 2 hours; if the product does not use protective material, place it directly in the oven at 45℃~50℃ for 2 hours. Then cut off the power supply and cool it to room temperature in the oven; for products with larger volume after coating that cannot be put into the oven or some products that are not allowed to be dried in the oven, they can be placed in a dry and well-ventilated room for natural drying, and the protective material can be removed after 24 hours, but the coating that has not been dried will reach the best state after 7 days before it can be used.

[0067] The above specific embodiment is only an optional embodiment of the present invention. Based on the technical solution of the present invention and the relevant inspiration of the above embodiment, those skilled in the art can make various alternative improvements and combinations to the above specific embodiment.

Claims

1. A three-proof coating device for a circuit board of a spaceborne imaging spectrometer, comprising a base frame (7), a circuit board (1) being arranged on the base frame (7), and the circuit board (1) being installed in an outer frame (11), characterized in that: Further comprising: Two groups of placement frames (2), the outer frame (11) is placed on the two groups of placement frames (2), the placement frame (2) is integrally arranged in a "U" shape, and the cross section of the placement frame (2) is in an L-shaped structure; An adaptation mechanism (3) for adjusting the distance between the two groups of placement frames (2) to support circuit boards of different models; A positioning mechanism (4) installed on the chassis (7) for clamping and fixing the outer frame (11); A fastening assembly (5) arranged on both sides of the outer frame (11) to press the outer frame (11) downward while being clamped by the positioning mechanism (4); A flipping mechanism (6) installed on the chassis (7) for driving the outer frame (11) to flip so as to coat the other side of the circuit board (1).

2. According to claim 1, a three-proof coating device for circuit board based on space-borne imaging spectrometer is characterized in that: The adaptation mechanism (3) includes mounting blocks (31), limiting strips (32), and sliders (33). The two groups of mounting blocks (31) are symmetrically arranged on both sides of the placement frame (2), and the mounting block (31) is in a "U" shape. Two groups of upper and lower limiting strips (32) are fixedly connected to the inner wall of each group of mounting blocks (31). Two groups of sliders (33) are slidably connected to the upper and lower two groups of limiting strips (32), and the two groups of sliders (33) are respectively fixedly connected to the sides of the two groups of placement frames (2).

3. According to claim 2, a three-proof coating device for circuit board based on a space-borne imaging spectrometer is characterized in that: The adaptation mechanism (3) further includes an adjustment screw (34), a positioning plate (35), a knob (36), a first gear (37), and a first rack (38). The adjustment screw (34) is threadedly connected to one group of sliders (33). One end of the adjustment screw (34) is rotatably connected to a positioning plate (35) installed in the mounting block (31). The other end of the adjustment screw (34) is fixedly connected to the knob (36). A first gear (37) rotatably connected in the mounting block (31) is arranged on the side of the positioning plate (35) away from the knob (36). The upper and lower sides of the first gear (37) are respectively provided with first racks (38) meshing with it. The two groups of first racks (38) are respectively fixedly connected to the sides of the two groups of sliders (33) and are slidably matched with the other group of sliders (33).

4. According to claim 2, a three-proof coating device for circuit board based on space-borne imaging spectrometer is characterized in that: The positioning mechanism (4) comprises a limit plate (401), a moving block (402), a bidirectional threaded rod (403), a rotating handle (404), a vertical plate (405), a side plate (406), and a positioning ring (407); two groups of the limit plates (401) are mounted on the bottom frame (7); two groups of the moving blocks (402) are slidably connected between the two groups of the limit plates (401); the bidirectional threaded rod (403) rotatably connected to the bottom frame (7) is threadedly connected to the two groups of the moving blocks (402); A rotating handle (404) is installed at one end of the bidirectional threaded rod (403), and the tops of the two groups of moving blocks (402) are fixedly connected to a vertical plate (405). A side plate (406) is provided on the side of the vertical plate (405) close to the placement frame (2), and a positioning ring (407) is fixedly connected to the side of the side plate (406) close to the vertical plate (405). The positioning ring (407) is rotatably connected to the vertical plate (405), and the cross-section of the positioning ring (407) is a T-shaped structure.

5. The three-conformal coating equipment for circuit board based on spaceborne imaging spectrometer according to claim 4 is characterized in that: The positioning mechanism (4) further comprises a synchronization rod (408), a first push plate (409), a second push plate (410), a connecting rod (411), a limit plate (412), and a first spring (413); at least two groups of synchronization rods (408) are fixedly connected to a side of the side plate (406) away from the vertical plate (405); one end of the synchronization rod (408) passes through the mounting block (31) and is fixedly connected to the first push plate (409); the first push plate (409) is close to the circuit board (1). A second push plate (410) is also provided on one side, and a side of the second push plate (410) close to the first push plate (409) is fixedly connected to a plurality of connecting rods (411) passing through the first push plate (409), and one end of the connecting rod (411) away from the second push plate (410) is fixedly connected to a limiting disk (412), and a plurality of first springs (413) are respectively sleeved on the outer rings of the plurality of connecting rods (411) arranged between the first push plate (409) and the second push plate (410).

6. The three-conformal coating equipment for circuit board based on spaceborne imaging spectrometer according to claim 5 is characterized in that: The fastening assembly (5) comprises a first cross bar (501), a fixing block (502), a second rack (503), a second cross bar (504), a fixing plate (505), and a second gear (506); a plurality of first cross bars (501) are fixedly connected to the first push plate (409); both ends of the first cross bars (501) extend and penetrate the placement frame (2); and the first cross bars (501) are slidably connected to the side of the placement frame (2); both ends of the first cross bars (501) are fixedly connected to the fixing blocks (502); and the fixing blocks (502) are fixedly connected to the sides of the placement frame (2). ) is installed with a second rack (503) on the side away from the placement frame (2), and multiple groups of second cross bars (504) corresponding to the first cross bars (501) are fixedly connected in the second push plate (410), and the second cross bars (504) are also slidably connected to the placement frame (2). Both ends of the second cross bars (504) are fixedly connected with fixed plates (505), and the fixed plate (505) is rotatably connected with a second gear (506) on the side away from the placement frame (2), and the second gear (506) is arranged below the second rack (503) and meshes with it.

7. The three-conformal coating equipment for circuit board based on spaceborne imaging spectrometer according to claim 6 is characterized in that: The fastening assembly (5) further comprises a mounting plate (507), a slide rail (508), a third rack (509), and a pressure plate (510). The two groups of placement frames (2) are both provided with a mounting plate (507) fixedly connected to the second crossbar (504) on one side away from the circuit board (1). The two groups of mounting plates (507) are both L-shaped. The mounting plate (507) is provided with a slide rail (508), and the slide rail (508) is slidably connected to the third rack (509). Three racks (509), the slide rail (508) and the third rack (509) are connected in a T-shaped structure, the third rack (509) is arranged on the side of the second gear (506) away from the fixed block (502), the third rack (509) is meshed with the second gear (506), the third rack (509) and the second rack (503) are staggered in position, and the tops of the two groups of the third racks (509) are fixedly connected with a pressure plate (510).

8. The three-conformal coating equipment for circuit board based on spaceborne imaging spectrometer according to claim 4 is characterized in that: The flip mechanism (6) comprises a rotating shaft (61), a rotating plate (62), a gripping rod (63), a sliding rod (64), a fixing frame (65), and a second spring (66). The side of the mounting block (31) away from the placement frame (2) is fixedly connected with the rotating shaft (61). One end of the rotating shaft (61) penetrates the vertical plate (405) and the side plate (406) and is fixedly connected with the rotating plate (62). The side of the rotating plate (62) away from the rotating shaft (61) is also slidably connected with the gripping rod (63). The end of the gripping rod (63) away from the rotating plate (62) is slidably connected with the sliding rod (64). The end of the sliding rod (64) away from the gripping rod (63) is fixedly connected with the fixing frame (65) arranged in an L shape. The fixing frame (65) is installed on the side of the rotating plate (62). The second spring (66) sleeved and installed on the outer ring of the sliding rod (64) is arranged on the side of the gripping rod (63) away from the rotating plate (62).

9. The three-conformal coating equipment for circuit board based on spaceborne imaging spectrometer according to claim 8 is characterized in that: The flip mechanism (6) further comprises a support plate (67) and a positioning hole (68), wherein two groups of support plates (67) are symmetrically arranged on both sides of the rotating shaft (61), and both groups of support plates (67) are mounted on the base frame (7). The support plate (67) is provided with a positioning hole (68), and one end of the gripping rod (63) passes through the rotating plate (62) and is slidably connected in the positioning hole (68).

10. A three-conformal coating process for a space-borne imaging spectrometer circuit board, and a three-conformal coating device for a space-borne imaging spectrometer circuit board according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: first, turn the knob (36) to move the two sets of placement frames (2) closer together until the adjusted spacing between the two sets of placement frames (2) is suitable for the circuit board (1) and the outer frame (11) to be placed. For the items where the circuit board (1) does not need to be coated, the smaller parts can be sealed with cellophane tape or the like. If the parts are larger, they can be wrapped with kraft paper or telephone paper and then tied with silk rope or clamped with wooden clips as appropriate. After the pre-baked and dehumidified circuit board (1) and the outer frame (11) are placed on the two sets of placement frames (2), the knob (36) is turned again to make the placement frames (2) fit the outer frame (11). Step 2: At this time, the rotating handle (404) is rotated, and the two groups of the first push plates (409) are moved closer to each other, and at the same time, the second push plates (410) are also moved closer to each other. When the second push plates (410) are in contact with the side of the outer frame (11), the first push plates (409) continue to move and the distance between them and the second push plates (410) is reduced, and the first spring (413) is compressed. The elastic force of the first spring (413) continues to push the second push plate (410) to push the outer frame (11) to the middle position; Step three, at the same time, when the first push plate (409) is close to the second push plate (410), it drives the pressing plate (510) to move downward and press on the outer frame (11), so that the bottom of the outer frame (11) is in close contact with the top of the placement frame (2), and the position of the outer frame (11) is fixed to prevent it from moving or falling after turning over; Step 4, moving the base frame (7) to the bottom of the coating machine, and uniformly coating one side of the circuit board (1) until the organic solvent in the coating evaporates to the point where the coating film is no longer sticky; Step 5: Hold the gripping rod (63) and move it in a direction away from the rotating plate (62), and squeeze the second spring (66) at the same time. At this time, one end of the gripping rod (63) moves out of the supporting plate (67), and the rotating plate (62) is rotated 180 degrees by the gripping rod (63), and the rotating shaft (61) is driven to rotate synchronously, and then the mounting block (31) is rotated to realize the flipping of the circuit board (1); Step six, at the same time, the gripping rod (63) is moved to a position corresponding to another group of positioning holes (68), and the hand is slowly released, so that the second spring (66) releases the elastic force to push one end of the gripping rod (63) into another group of positioning holes (68) for limiting, so that the position of the circuit board (1) is fixed after flipping, which is convenient for coating the other side of the circuit board (1); Step 7. After the first coating, place the whole machine parts with smaller volume at room temperature for 0.5h~1h to allow the organic solvent in the coating to fully volatilize, then place them in a constant temperature blast oven and bake them at 50℃±5℃ for 2h. After cutting off the power supply, cool them to room temperature in the oven, and then apply the second coating in the direction perpendicular to the first coating direction. For products with larger volume that cannot be dried in the oven or some products that are not allowed to be dried in the oven, they should be left to stand for 4h after the first coating before applying the second coating. Step 8: Place the coated printed circuit board assembly, the whole machine or parts with smaller volume flat in the oven, heat it to 45℃~50℃ and bake it for 2 hours, remove the protective material, and then place it in the oven at 45℃~50℃ for 2 hours; if the product does not use protective material, place it directly in the oven at 45℃~50℃ for 2 hours. Then cut off the power supply and cool it to room temperature in the oven; for products with larger volume after coating that cannot be put into the oven or some products that are not allowed to be dried in the oven, they can be placed in a dry and well-ventilated room for natural drying, and the protective material can be removed after 24 hours, but the coating that has not been dried will reach the best state after 7 days before it can be used.

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