Operation control method, device and system for printed circuit board etching and tin stripping equipment

Abstract

The present disclosure relates to an operation control method, device and system for a tin stripping device based on a circuit board etching device. The method includes obtaining a processing flow of a target circuit board; wherein the processing flow reflects an indicated tin stripping device; controlling an etching processing device and the indicated tin stripping device to process the target circuit board; receiving image detection data of the target circuit board output by a detection device; determining a first area where the image detection data indicates that the target circuit board is not completely stripped of tin; and controlling a specific tin stripping device to perform a set tin stripping process on the target circuit board according to a first relative position between the first area and the target circuit board; wherein at least two tin stripping devices include the specific tin stripping device.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the technical field of circuit board processing, and more specifically, to an operation control method, device, and system for a circuit board etching and tin stripping device. Background Art

[0002] With the development of automation and intelligent technologies, for the processes of etching and tin stripping of circuit boards, a corresponding etching processing device can be used to etch the circuit board first, and then a tin stripping device can be used to strip the tin from the circuit board. Currently, due to the relatively complex wire arrangements of some circuit boards, there is still residual tin after a single tin stripping process by the tin stripping device, which requires these circuit boards to be redistributed to the tin stripping device for tin stripping, affecting the efficiency of batch processing of circuit boards. Summary of the Invention

[0003] An object of embodiments of the present disclosure is to provide a new technical solution for the operation control of a circuit board etching and tin stripping device.

[0004] According to a first aspect of the present disclosure, there is provided an operation control method for a circuit board etching and tin stripping device. The circuit board etching and tin stripping system includes an etching processing device, at least two tin stripping devices, a detection device, and a control device. The etching processing device, the at least two tin stripping devices, and the detection device are respectively communicatively connected to the control device. The control device is the execution subject of the method. The method includes:

[0005] Obtain the processing flow of the target circuit board; wherein, the processing flow indicates the designated tin stripping device.

[0006] Control the etching processing device and the designated tin stripping device to process the target circuit board.

[0007] Receive the image detection data of the target circuit board output by the detection device.

[0008] Determine a first area of the target circuit board where the tin stripping is not complete in the image detection data.

[0009] According to the first relative position between the first area and the target circuit board, control a specific tin stripping device to perform a set tin stripping process on the target circuit board; wherein, the at least two tin stripping devices include the specific tin stripping device.

[0010] Optionally, the specific desoldering device includes a desoldering operation table, a desoldering knife brush, and a driving component. A desoldering area for placing a circuit board is provided on the desoldering operation table. The desoldering knife brush is arranged on the driving component, and the driving component is used to switch the desoldering knife brush to the indicated desoldering partition and drive the desoldering knife brush to desolder in the indicated desoldering partition. Among them, the indicated desoldering partition is a part of the desoldering area. The controlling the specific desoldering device to perform a set desoldering process on the target circuit board according to the first relative position between the first area and the target circuit board includes:

[0011] Determine the second relative position between the first area and the desoldering area according to a preset mapping relationship and the first relative position between the first area and the target circuit board. Among them, the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area.

[0012] Determine the first desoldering partition of the first area in the desoldering area according to the second relative position.

[0013] Obtain the movement trajectory of the driving component according to the position nodes corresponding to the first desoldering partition respectively.

[0014] Send the movement trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in the set order according to the movement trajectory, and controls the desoldering knife brush to desolder at the corresponding position nodes.

[0015] Optionally, the determining that the image detection data represents the first area where the target circuit board is not completely desoldered includes:

[0016] Determine the second area that meets the set color in the image detection data.

[0017] Determine the shortest interval distance between the second areas.

[0018] Combine the second areas with the shortest interval distance within the set distance into the first area.

[0019] Optionally, the driving component includes a horizontal moving component and a vertical moving component. The horizontal moving component is used to drive the desoldering knife brush to move to the indicated desoldering partition, and the desoldering knife brush is arranged on the telescopic part of the vertical moving component.

[0020] The sending the movement trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in the set order according to the movement trajectory, and controls the desoldering knife brush to desolder at the corresponding position nodes, includes:

[0021] Send the moving trajectory and the pre-stored thickness information of the target circuit board to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position nodes in the set order, and the specific desoldering device controls the telescopic part of the vertical moving component to move according to the thickness information, and controls the desoldering knife brush to desolder at the corresponding position nodes.

[0022] Optionally, the desoldering knife brush reciprocates in the first direction to achieve desoldering; obtaining the moving trajectory of the driving component according to the position nodes respectively corresponding to the first desoldering partitions includes:

[0023] Determine the adjacent first position nodes in the second direction according to the position nodes respectively corresponding to the first desoldering partitions;

[0024] Determine the moving trajectory of the driving component according to the first position nodes and the set direction; wherein, the set direction is related to the first direction.

[0025] Optionally, before sending the moving trajectory to the specific desoldering device, the method further includes:

[0026] Determine the second position nodes with the number of adjacent position nodes in the moving trajectory less than or equal to one and the third position nodes with the number greater than one;

[0027] Determine the first desoldering duration of the desoldering knife brush for the second position nodes and the second desoldering duration for the third position nodes;

[0028] Sending the moving trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in the set order according to the moving trajectory, and controls the desoldering knife brush to desolder at the corresponding position nodes includes:

[0029] Send the moving trajectory, the first desoldering duration and the second desoldering duration to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position nodes in the set order, and the specific desoldering device controls the desoldering knife brush to desolder according to the first desoldering duration and the second desoldering duration at the corresponding position nodes.

[0030] According to the second aspect of the present disclosure, there is also provided an operation control device for a circuit board etching and desoldering device, the device includes:

[0031] An acquisition module, configured to acquire the processing flow of the target circuit board; wherein, the processing flow reflects the indicated desoldering device;

[0032] A control module for controlling the etching processing device and the indicated desoldering device to process the target circuit board;

[0033] A receiving module for receiving image detection data of the target circuit board output by the detection device;

[0034] A determination module for determining a first area where the target circuit board is not completely desoldered from the image detection data;

[0035] A control module for controlling a specific desoldering device to perform a set desoldering process on the target circuit board according to the first relative position of the first area and the target circuit board; wherein, the at least two desoldering devices include the specific desoldering device.

[0036] According to a third aspect of the present disclosure, there is also provided an electronic device, including a memory and a processor, the memory for storing a computer program; the processor for executing the computer program to implement the method according to the first aspect of the present disclosure.

[0037] According to a fourth aspect of the present disclosure, there is also provided a computer-readable storage medium, having a computer program stored thereon, the computer program, when executed by a processor, implementing the method according to the first aspect of the present disclosure.

[0038] According to a fifth aspect of the present disclosure, there is also provided a computer program product, including a computer program, which, when executed by a processor, implements the method according to the first aspect of the present disclosure.

[0039] One beneficial effect of the embodiments of the present disclosure is that the operation control method of the circuit board etching and desoldering equipment provided by the present invention can control the target circuit board to be sent to the etching processing device and the indicated desoldering device for processing according to the processing flow. When it is determined through the detection device that there is a first area on the target circuit board where desoldering is not complete, the specific desoldering device is controlled to perform desoldering processing on the target circuit board again, effectively reducing the occurrence of residual tin in the single desoldering of the target circuit board, and thus improving the efficiency of batch processing of circuit boards.

[0040] Through the following detailed description of the exemplary embodiments of the present disclosure with reference to the accompanying drawings, other features and advantages of the embodiments of the present disclosure will become clear. Description of the Drawings

[0041] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles of the embodiments of the present disclosure.

[0042] Figure 1It is a schematic diagram of the composition structure of an operating control system for a printed circuit board etching and tin removal device that can apply the operating control method of the printed circuit board etching and tin removal device according to an embodiment;

[0043] Figure 2 It is a schematic diagram of the structure of a specific tin removal device according to an embodiment;

[0044] Figure 3 It is a schematic diagram of the structure of a specific tin removal device according to another embodiment;

[0045] Figure 4 It is a schematic flow chart of the operating control method of the printed circuit board etching and tin removal device according to an embodiment;

[0046] Figure 5 It is a schematic block diagram of the operating control device of the printed circuit board etching and tin removal device according to an embodiment;

[0047] Figure 6 It is a schematic diagram of the hardware structure of an electronic device according to an embodiment. Detailed implementation manners

[0048] Now, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0049] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0050] Techniques, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered as part of the specification.

[0051] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0052] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0053] <System embodiment>

[0054] Figure 1 It is a schematic diagram of the composition structure of an operating control system for a printed circuit board etching and tin removal device that can apply the operating control method of the printed circuit board etching and tin removal device according to an embodiment. As Figure 1As shown in the figure, the operation control system of the tin stripping device based on circuit board etching includes an etching processing device 1, at least two tin stripping devices 2, a detection device 3, and a control device 4.

[0055] The above-mentioned etching processing device 1 is a device for etching on the surface of the circuit board. The etching processing device 1 can etch on the surface of the circuit board by wet etching.

[0056] The above at least two tin stripping devices 2 can be divided into a mechanical tin stripping device 2 and a chemical tin stripping device 2. Moreover, at least one of the at least two tin stripping devices 2 is a mechanical tin stripping device 2, and at least one is a chemical tin stripping device 2. And the etching processing device 1 and the at least two tin stripping devices 2 can be connected through a first conveying platform 6. The at least two tin stripping devices 2 can be connected to the output end of the operation control system of the tin stripping device based on circuit board etching through a second conveying platform. The circuit board can be placed on a carrier 5, and the carrier 5 can move through the etching processing device 1 to the first conveying platform 6. A liftable first baffle 61 and a second baffle 62 are arranged above the first conveying platform 6. When the first baffle 61 descends and the second baffle 62 rises, the carrier 5 can move along the first baffle 61 to the tin stripping device 2A. When the second baffle 62 descends and the first baffle 61 rises, the carrier 5 can move along the second baffle 62 to the tin stripping device 2B. Subsequently, after the tin stripping treatment is completed, the carrier 5 can send out the circuit board through the second conveying platform.

[0057] The above detection device 3 is, for example, a camera or a lidar, etc., which is not limited here. A second conveying platform 7 is arranged between the second conveying platform and the tin stripping device 2A. A liftable third baffle 71 is arranged above the second conveying platform 7. When the third baffle 71 descends, the carrier 5 can move along the third baffle 71 through a third conveying platform 8 to the tin stripping device 2A. When the third baffle 71 rises, the carrier 5 can output the circuit board.

[0058] The above control device 4 is, for example, a controller. The controller can be communicatively connected to the etching processing device 1, at least two tin stripping devices 2, and the detection device 3 respectively, so that the control device 4 can control the etching processing device 1, at least two tin stripping devices 2, and the detection device 3.

[0059] In some embodiments, as Figure 2 shown, a specific tin stripping device can be a mechanical tin stripping device, that is, the tin stripping device 2A. The specific tin stripping device can include a tin stripping operation table 21, a tin stripping knife brush 22, and a driving component 23. A tin stripping area for placing the circuit board is arranged on the tin stripping operation table 21. The tin stripping knife brush 22 is arranged on the driving component 23. The driving component 23 is used to switch the tin stripping knife brush 22 to the indicated tin stripping partition and drive the tin stripping knife brush 22 to strip tin in the indicated tin stripping partition; wherein, the indicated tin stripping partition is a part of the tin stripping area.

[0060] In the present application, the tin-removing area includes tin-removing sub-areas (1, 1) to (11, 10). When the circuit board placed on the carrier 5 moves into the specific tin-removing device, the circuit board can correspond to all or part of the tin-removing sub-areas in the tin-removing area to accommodate circuit boards of different specifications.

[0061] In some embodiments, as Figure 3 shown, the driving component 23 includes a horizontal moving component 231 and a vertical moving component 232. The horizontal moving component 231 is used to drive the tin-removing brush 22 to move to the indicated tin-removing sub-area, and the tin-removing brush 22 is arranged on the telescopic part of the vertical moving component 232.

[0062] In the present application, the horizontal moving component 231 may include a first driving motor 2311, a first transmission structure, a second driving motor 2311, and a second transmission structure. When the first driving motor 2311 operates, the first transmission structure can drive the tin-removing brush 22 to move along the X direction. When the second driving motor 2311 operates, the second transmission structure can drive the tin-removing brush 22 to move along the Y direction. The first transmission structure and the second transmission structure are, for example, a lead screw transmission structure or a synchronous belt transmission structure, which is not limited herein.

[0063] In the present application, the vertical moving component 232 may be a telescopic rod whose length is electrically controlled. The telescopic rod is arranged on the second transmission structure, so that the tin-removing brush 22 can move to any tin-removing sub-area. Moreover, when the vertical moving component 232 extends, the tin-removing brush 22 can contact the surface of the circuit board and perform tin-removing treatment on the circuit board.

[0064] In some embodiments, the tin-removing brush 22 reciprocates along a first direction to achieve tin-removing.

[0065] In the present application, when the first direction is the X direction, the second direction may be the Y direction; when the first direction is the Y direction, the second direction may be the X direction.

[0066] Applied to the embodiments of the present disclosure, the memory of the control device 4 is used to store a computer program, and the computer program is used to control the processor of the control device 4 to operate according to the operation control method of the circuit board etching tin-removing device in any embodiment. Those skilled in the art can design a computer program according to the solution of the embodiments of the present disclosure. How the computer program controls the processor to operate is well known in the art, so it will not be described in detail herein.

[0067] <Method Embodiment>

[0068] Figure 4 is a schematic flowchart of an operation control method of a circuit board etching tin-removing device according to an embodiment. The implementation subject is, for example,Figure 1 the control device 4

[0069] As Figure 4 shown, the operation control method of the tin removal device based on the circuit board etching in this embodiment may include the following steps S410 to step S450:

[0070] Step S410, obtain the processing flow of the target circuit board; wherein, the processing flow reflects the indicated tin removal device.

[0071] In this application, the processing flow is, for example, the etching processing device 1 - the tin removal device 2B, wherein the indicated tin removal device is the tin removal device 2B.

[0072] Step S420, control the etching processing device and the indicated tin removal device to process the target circuit board.

[0073] In some examples, as Figure 1 shown, the processing flow is the etching processing device 1 - the tin removal device 2B. The control device 4 can control the carrier 5 to move to the etching processing device 1 and perform etching processing. After the etching processing is completed, the control device 4 controls the second baffle to descend and the first baffle to rise, and then controls the carrier 5 to move to the tin removal device 2B and perform tin removal processing.

[0074] Step S430, receive the image detection data of the target circuit board output by the detection device.

[0075] In this application, as Figure 1 shown, when the carrier 5 moves to the second conveying platform, the detection device 3 can view the image detection data of the target circuit board directly below and feedback the image detection data to the control device.

[0076] Step S440, determine the first area where the image detection data indicates that the target circuit board is not completely de-tinned.

[0077] Step S450, according to the first relative position between the first area and the target circuit board, control the specific tin removal device to perform the set tin removal processing on the target circuit board; wherein, at least two tin removal devices include the specific tin removal device.

[0078] In this application, the set tin removal processing can be the reciprocating motion of the de-tinning knife brush on the first area for a set duration. The set number of times is, for example, 5s, 10s or 20s, etc., which is not limited here.

[0079] In some embodiments, this step S450 may include the following steps S510 to step S540:

[0080] Step S510: Determine the second relative position between the first area and the desoldering area according to the preset mapping relationship and the first relative position between the first area and the target circuit board; wherein, the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area.

[0081] In this application, as Figure 1 shown, the carrier 5 can move into the desoldering device 2A, and by aligning the camera configured on the carrier with the QR code set at the center point set by the desoldering device 2A, the center of the target circuit board can be made to coincide with the center point set by the desoldering device 2A in the vertical direction, which enables different points on the circuit board to correspond to different desoldering partitions on the desoldering area.

[0082] Step S520: Determine the first desoldering partition of the first area in the desoldering area according to the second relative position.

[0083] Step S520: Obtain the movement trajectory of the driving component according to the position nodes corresponding to the first desoldering partition respectively.

[0084] Step S530: Send the movement trajectory to a specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in the set order according to the movement trajectory, and controls the desoldering knife brush to desolder at the corresponding position nodes.

[0085] In some examples, taking Figure 2 as an example, the first desoldering partition of the first area in the desoldering area may include: desoldering partition [1, 1], desoldering partition [1, 2], desoldering partition [1, 3], desoldering partition [2, 3], desoldering partition [5, 3]. Then, the movement trajectory of the driving component is to continuously desolder the desoldering partition [1, 1] - desoldering partition [1, 2] - desoldering partition [1, 3] - desoldering partition [2, 3], and then desolder the desoldering partition [5, 3].

[0086] In other words, when the position nodes are continuous, the vertical moving component of the specific desoldering device does not need to work, and the desoldering knife brush desolders continuously to further improve the desoldering effect of the specific desoldering device.

[0087] In some embodiments, step S440 may include the following steps S610 to S630:

[0088] Step S610: Determine the second area in the image detection data that meets the set color.

[0089] In this application, the set color is, for example, silver.

[0090] Step S620: Determine the shortest interval distance between the second areas.

[0091] In this application, asFigure 2 As shown, any two solder removal partitions can be represented by a single cell. For example, the distance between solder removal partition [1, 1] and solder removal partition [1, 2] is 0 cells, the distance between solder removal partition [1, 1] and solder removal partition [1, 3] is 1 cell, and the distance between solder removal partition [1, 1] and solder removal partition [2, 2] is 0 cells.

[0092] Step S630: Combine the second regions with the shortest interval distance within the set distance into the first region.

[0093] In this application, the set distance is 0 cells.

[0094] In other words, by combining the second regions within the set distance into the first region, when the position nodes are continuous, the vertical moving component of the specific desoldering device does not need to work, and the desoldering knife brush desolders continuously, so as to further improve the desoldering effect of the specific desoldering device.

[0095] In some embodiments, step S530 may include the following step S5301:

[0096] Step S5301: Send the movement trajectory and the pre-stored thickness information of the target circuit board to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position nodes in the set order, and the specific desoldering device controls the telescopic part of the vertical moving component to move according to the thickness information, and controls the desoldering knife brush to desolder at the corresponding position nodes.

[0097] In this application, the control device pre-stores the thickness information of the target circuit board to control the telescopic distance of the telescopic part of the vertical moving component according to the thickness information, so as to reduce the occurrence of abnormal wear of the target circuit board by the desoldering knife brush and improve the desoldering efficiency of the specific desoldering device for the circuit board.

[0098] In some embodiments, step S520 may include the following step S5201 and step S5202:

[0099] Step S5201: Determine the adjacent first position nodes in the second direction according to the position nodes corresponding to the first solder removal partitions respectively.

[0100] In some examples, the first direction is the Y direction, the position nodes corresponding to the first solder removal partitions respectively include solder removal partition [1, 1], solder removal partition [1, 2], and solder removal partition [2, 1], and the second direction is the X direction. Then, the adjacent first position nodes in the second direction are solder removal partition [1, 1] and solder removal partition [1, 2].

[0101] Step S5202: Determine the movement trajectory of the driving component according to the first position node and the set direction, where the set direction is related to the first direction.

[0102] In this application, when the first direction is the Y direction, the set direction is the Y direction.

[0103] In some examples, the first direction is the Y direction, and the position nodes corresponding to the first tin-removing partitions respectively include the tin-removing partition [1, 1], the tin-removing partition [1, 2], and the tin-removing partition [2, 1]. The second direction is the X direction. Then, the movement trajectory is the tin-removing partition [1, 2] - the tin-removing partition [1, 1] - the tin-removing partition [2, 1]. In other words, since the tin-removing tool brush reciprocates in the first direction, by continuously removing tin from adjacent tin-removing partitions in the second direction, the tin-removing effect of a specific tin-removing device on the target circuit board can be further improved.

[0104] In some embodiments, before step S530, the method further includes the following steps S710 and S720:

[0105] Step S710: Determine the second position node with the number of adjacent position nodes in the movement trajectory less than or equal to one and the third position node with the number greater than one.

[0106] In some examples, if the position nodes of the movement trajectory are the tin-removing partition [1, 1], the tin-removing partition [1, 2], and the tin-removing partition [1, 3], then the second position nodes are the tin-removing partition [1, 1] and the tin-removing partition [1, 3], and the third position node is the tin-removing partition [1, 2].

[0107] Step S720: Determine the first tin-removing duration of the tin-removing tool brush for the second position node and the second tin-removing duration for the third position node.

[0108] In some examples, the control device can preset the first tin-removing duration for the second position node and the second tin-removing duration for the third position node in advance, and the first tin-removing duration is longer than the second tin-removing duration. For example, the first tin-removing duration is 8 s and the second tin-removing duration is 5 s, etc.

[0109] Based on this, step S530 may include the following step S5302:

[0110] Step S5302: Send the movement trajectory, the first tin-removing duration, and the second tin-removing duration to the specific tin-removing device, so that the specific tin-removing device controls the horizontal moving component to move to the corresponding position nodes in the set order, and the specific tin-removing device controls the tin-removing tool brush to remove tin according to the first tin-removing duration and the second tin-removing duration at the corresponding position nodes.

[0111] In some examples, when the second position nodes are the desoldering partitions [1, 1] and [1, 3], and the third position node is the desoldering partition [1, 2], the desoldering tool brush lasts for 8 s when moving to the desoldering partition [1, 1] or [1, 3], and lasts for 5 s when moving to the desoldering partition [1, 2].

[0112] In other words, by desoldering the second position nodes for a longer time, the desoldering effect of a specific desoldering device on the target circuit board can be further improved.

[0113] <Device Embodiment 1>

[0114] Figure 5 is a schematic block diagram of an operation control device of a circuit board etching desoldering device according to an embodiment. As Figure 5 shown, the operation control device 500 of the circuit board etching desoldering device may include:

[0115] An acquisition module 510, configured to acquire a processing flow of a target circuit board; wherein, the processing flow reflects the indicated desoldering device;

[0116] A control module 520, configured to control an etching processing device and the indicated desoldering device to process the target circuit board;

[0117] A receiving module 530, configured to receive image detection data about the target circuit board output by a detection device;

[0118] A determination module 540, configured to determine a first area where the target circuit board is not completely desoldered from the image detection data;

[0119] A control module 550, configured to control a specific desoldering device to perform a set desoldering process on the target circuit board according to a first relative position between the first area and the target circuit board; wherein, at least two desoldering devices include the specific desoldering device.

[0120] Optionally, the control module 550 is further configured to determine a second relative position between the first area and the desoldering area according to a preset mapping relationship and the first relative position between the first area and the target circuit board; wherein, the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area; determine a first desoldering partition of the first area in the desoldering area according to the second relative position; obtain a movement trajectory of the driving component according to the position nodes respectively corresponding to the first desoldering partition; send the movement trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in a set order according to the movement trajectory, and controls the desoldering tool brush to desolder at the corresponding position nodes.

[0121] Optionally, the determination module 540 is further configured to determine a second area in the image detection data that conforms to a set color; determine the shortest interval distance between the second areas; and combine the second areas with the shortest interval distance within the set distance into a first area.

[0122] Optionally, the control module 550 is further configured to send a moving trajectory and pre-stored thickness information about the target circuit board to a specific tin removal device, so that the specific tin removal device controls the horizontal moving component to move to corresponding position nodes in a set order, and the specific tin removal device controls the telescopic part of the vertical moving component to move according to the thickness information, and controls the tin removal knife brush to remove tin at the corresponding position nodes.

[0123] Optionally, the control module 550 is further configured to determine adjacent first position nodes in the second direction according to the position nodes corresponding to the first tin removal partitions respectively; determine the moving trajectory of the driving component according to the first position nodes and a set direction; wherein, the set direction is related to the first direction.

[0124] Optionally, the operation control device 500 based on the circuit board etching tin removal device further includes a node determination module, configured to determine second position nodes with the number of adjacent position nodes in the moving trajectory less than or equal to one and third position nodes greater than one; determine the first tin removal duration of the tin removal knife brush for the second position nodes and the second tin removal duration for the third position nodes;

[0125] The control module 550 is further configured to send the moving trajectory, the first tin removal duration, and the second tin removal duration to a specific tin removal device, so that the specific tin removal device controls the horizontal moving component to move to corresponding position nodes in a set order, and the specific tin removal device controls the tin removal knife brush to remove tin according to the first tin removal duration and the second tin removal duration at the corresponding position nodes.

[0126] The operation control device 500 based on the circuit board etching tin removal device may be Figure 1 the control device 4 in

[0127] <Device Embodiment 2>

[0128] Figure 6 It is a schematic hardware structure diagram of an electronic device according to another embodiment.

[0129] As Figure 6 shown, the electronic device 600 includes a processor 610 and a memory 620. The memory 620 is used to store an executable computer program, and the processor 610 is used to execute the method of any of the above method embodiments according to the control of the computer program.

[0130] The electronic device 600 may be Figure 1 the control device 4 in

[0131] Each module of the above operation control device 500 for a circuit board etching and tin removing device can be implemented by a processor 610 in this embodiment executing a computer program stored in a memory 620, or can be implemented by other structures, which is not limited herein.

[0132] The present invention can be a system, a method, and / or a computer program product. The computer program product can include a computer-readable storage medium having thereon computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0133] The computer-readable storage medium can be a tangible device that can hold and store instructions used by an instruction execution device. The computer-readable storage medium can be, for example, but is not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanical encoding device, such as a punched card or raised structures in grooves storing instructions thereon, and any suitable combination of the foregoing. The computer-readable storage medium used herein is not construed as an instantaneous signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0134] The computer-readable program instructions described herein can be downloaded from the computer-readable storage medium to various computing / processing devices, or downloaded to an external computer or external storage device through a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include a copper transmission cable, an optical fiber transmission, a wireless transmission, a router, a firewall, a switch, a gateway computer, and / or an edge server. A network adapter or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0135] The computer program instructions for carrying out the operations of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine - related instructions, microcode, firmware instructions, state - setting data, or source code or object code written in any combination of one or more programming languages, including object - oriented programming languages such as Smalltalk, C++, etc., and conventional procedural programming languages such as the "C" language or similar programming languages. The computer - readable program instructions may be executed entirely on the user's computer, partially on the user's computer, executed as a stand - alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or, alternatively, may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by using the state information of the computer - readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field - programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer - readable program instructions to implement various aspects of the present invention.

[0136] Aspects of the present invention are described herein with reference to the flowcharts and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer - readable program instructions.

[0137] These computer - readable program instructions can be provided to a processor of a general - purpose computer, a special - purpose computer, or other programmable data - processing apparatus to produce a machine, such that the instructions, when executed by the processor of the computer or other programmable data - processing apparatus, create a means for implementing the functions / acts specified in one or more blocks of the flowchart and / or block diagram. These computer - readable program instructions can also be stored in a computer - readable storage medium, which causes a computer, a programmable data - processing apparatus, and / or other devices to operate in a particular manner, so that the computer - readable medium storing the instructions comprises a manufacture, which includes instructions for implementing various aspects of the functions / acts specified in one or more blocks of the flowchart and / or block diagram.

[0138] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device, causing a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process such that the instructions executed on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in one or more boxes of the flowchart and / or block diagram.

[0139] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a segment of code, or a portion of an instruction, which contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified functions or acts, or by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0140] The embodiments of the present invention have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. An operating control method for a tin stripping device based on a circuit board etching machine, characterized in that, The tin removal system based on circuit board etching includes an etching processing device, at least two tin removal devices, a detection device, and a control device. The etching processing device, the at least two tin removal devices, and the detection device are respectively communicatively connected to the control device. The control device is the execution entity of the method, and the method includes: Obtain the processing flow of the target circuit board; wherein, the processing flow reflects the indicated tin removal device; Control the etching processing device and the indicated tin removal device to process the target circuit board; Receive the image detection data of the target circuit board output by the detection device; Determine the first area where the image detection data indicates that the target circuit board is not completely tin-removed; According to the first relative position between the first area and the target circuit board, control the specific tin removal device to perform a set tin removal process on the target circuit board; wherein, the at least two tin removal devices include the specific tin removal device; The specific tin removal device includes a tin removal operation table, a tin removal knife brush, and a driving component. A tin removal area for placing the circuit board is provided on the tin removal operation table. The tin removal knife brush is arranged on the driving component. The driving component is used to switch the tin removal knife brush to the indicated tin removal partition and drive the tin removal knife brush to remove tin in the indicated tin removal partition; wherein, the indicated tin removal partition is a part of the tin removal area. The controlling the specific tin removal device to perform a set tin removal process on the target circuit board according to the first relative position between the first area and the target circuit board includes: According to the preset mapping relationship and the first relative position between the first area and the target circuit board, determine the second relative position between the first area and the tin removal area; wherein, the mapping relationship reflects that different points on the circuit board correspond to different points on the tin removal area; According to the second relative position, determine the first tin removal partition of the first area in the tin removal area; Obtain the movement trajectory of the driving component according to the position nodes respectively corresponding to the first tin removal partition; Send the movement trajectory to the specific tin removal device, so that the specific tin removal device controls the driving component to move to the corresponding position nodes in the set order according to the movement trajectory, and controls the tin removal knife brush to remove tin at the corresponding position nodes.

2. The method according to claim 1, wherein The determining that the image detection data indicates the first area where the target circuit board is not completely tin-removed includes: Determine the second areas in the image detection data that meet the set color; Determine the shortest interval distance between each of the second areas; Combine the second areas with the shortest interval distance within the set distance into the first area.

3. The method according to claim 1, characterized in that, The driving component includes a horizontal movement component and a vertical movement component. The horizontal movement component is used to drive the tin removal knife brush to move to the indicated tin removal partition. The tin removal knife brush is arranged on the telescopic part of the vertical movement component; The sending the movement trajectory to the specific tin removal device, so that the specific tin removal device controls the driving component to move to the corresponding position nodes in the set order according to the movement trajectory, and controls the tin removal knife brush to remove tin at the corresponding position nodes includes: Send the moving trajectory and the pre-stored thickness information of the target circuit board to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position nodes in the set order, and the specific desoldering device controls the telescopic part of the vertical moving component to move according to the thickness information, and controls the desoldering knife brush to desolder at the corresponding position nodes.

4. The method according to claim 1, characterized in that The desoldering knife brush reciprocates in the first direction to achieve desoldering; obtaining the moving trajectory of the driving component according to the position nodes respectively corresponding to the first desoldering zones includes: Determine adjacent first position nodes in the second direction according to the position nodes respectively corresponding to the first desoldering zones; Determine the moving trajectory of the driving component according to the first position nodes and the set direction; wherein, the set direction is related to the first direction.

5. The method according to claim 3, wherein Before sending the moving trajectory to the specific desoldering device, the method further includes: Determine second position nodes with the number of adjacent position nodes in the moving trajectory less than or equal to one and third position nodes with the number greater than one; Determine the first desoldering duration of the desoldering knife brush for the second position nodes and the second desoldering duration for the third position nodes; Sending the moving trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in the set order according to the moving trajectory, and controls the desoldering knife brush to desolder at the corresponding position nodes includes: Send the moving trajectory, the first desoldering duration and the second desoldering duration to the specific desoldering device, so that the specific desoldering device controls the horizontal moving component to move to the corresponding position nodes in the set order, and the specific desoldering device controls the desoldering knife brush to desolder according to the first desoldering duration and the second desoldering duration at the corresponding position nodes.

6. An operation control device for a circuit board etching desoldering device, the device includes: An acquisition module, configured to acquire the processing flow of the target circuit board; wherein, the processing flow reflects the indicated desoldering device; A control module, configured to control the etching processing device and the indicated desoldering device to process the target circuit board; A receiving module, configured to receive the image detection data of the target circuit board output by the detection device; A determination module, configured to determine a first area where the target circuit board is not completely desoldered in the image detection data; A control module, configured to control a specific desoldering device to perform a set desoldering process on the target circuit board according to the first relative position between the first area and the target circuit board; wherein, at least two desoldering devices include the specific desoldering device; the specific desoldering device includes a desoldering operation table, a desoldering knife brush, and a driving component, a desoldering area for placing the circuit board is arranged on the desoldering operation table, the desoldering knife brush is arranged on the driving component, and the driving component is configured to switch the desoldering knife brush to the indicated desoldering partition and drive the desoldering knife brush to desolder in the indicated desoldering partition; wherein, the indicated desoldering partition is a part of the desoldering area. The control module is further configured to determine the second relative position between the first area and the desoldering area according to a preset mapping relationship and the first relative position between the first area and the target circuit board; wherein, the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area; determine the first desoldering partition of the first area in the desoldering area according to the second relative position; obtain the movement trajectory of the driving component according to the position nodes corresponding to the first desoldering partition respectively; send the movement trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in a set order according to the movement trajectory, and controls the desoldering knife brush to desolder at the corresponding position nodes.

7. A control device, characterized in that, It includes a memory and a processor, the memory is configured to store a computer program; the processor is configured to execute the computer program to implement the method according to any one of claims 1 to 5.

8. An operating control system for a tin stripping device based on circuit board etching, characterized in that, The system includes an etching processing device, at least two desoldering devices, a detection device, and a control device, and the etching processing device, the at least two desoldering devices, and the detection device are respectively communicatively connected to the control device; The control device is configured to: obtain the processing flow of the target circuit board; wherein, the processing flow reflects the indicated desoldering device; control the etching processing device and the indicated desoldering device to process the target circuit board; obtain the processing flow of the target circuit board; wherein, the processing flow reflects the indicated desoldering device; control the etching processing device and the indicated desoldering device to process the target circuit board; receive the image detection data about the target circuit board output by the detection device; determine the first area where the target circuit board is not completely desoldered in the image detection data; control a specific desoldering device to perform a set desoldering process on the target circuit board according to the first relative position between the first area and the target circuit board; wherein, at least two desoldering devices include the specific desoldering device. The specific desoldering device includes a desoldering operation table, a desoldering knife brush, and a driving component, a desoldering area for placing the circuit board is arranged on the desoldering operation table, the desoldering knife brush is arranged on the driving component, and the driving component is configured to switch the desoldering knife brush to the indicated desoldering partition and drive the desoldering knife brush to desolder in the indicated desoldering partition; wherein, the indicated desoldering partition is a part of the desoldering area. The control device is further configured to determine a second relative position between the first area and the desoldering area according to a preset mapping relationship and a first relative position between the first area and the target circuit board; wherein, the mapping relationship reflects that different points on the circuit board correspond to different points on the desoldering area; determine a first desoldering sub-area of the first area in the desoldering area according to the second relative position; obtain a movement trajectory of the driving component according to position nodes respectively corresponding to the first desoldering sub-area; send the movement trajectory to the specific desoldering device, so that the specific desoldering device controls the driving component to move to the corresponding position nodes in a set order according to the movement trajectory, and controls the desoldering knife to desolder at the corresponding position nodes.

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